KR102613544B1 - Radio friquency filter assembly for antenna - Google Patents

Abstract

The present invention relates to an RF filter assembly for an antenna, and in particular, to a main board on which a plurality of electrical components are mounted, a plurality of RF filters installed on one side of the main board, and a plurality of RF filters disposed between the main board and the plurality of RF filters. It is made of a metal material and includes a filter support member that separates each of the plurality of RF filters in the direction of one side of the main board, thereby preventing cracks in the solder cream due to differences in thermal expansion coefficients between the main board and the RF filter. In addition, it provides the advantage of enabling more precise RF filter arrangement and improving product reliability.

Description

RF filter assembly for antenna {RADIO FRIQUENCY FILTER ASSEMBLY FOR ANTENNA}

The present invention relates to an RF filter assembly for an antenna, and more specifically, to an RF filter assembly for an antenna that can minimize the solder joint area and prevent the occurrence of an electrical short phenomenon.

In order to meet the increasing demand for wireless data traffic following the commercialization of the 4G (4th generation) communication system, efforts are being made to develop an improved 5G (5th generation) communication system or pre-5G communication system. For this reason, the 5G communication system or pre-5G communication system is called a Beyond 4G Network communication system or a Post LTE (Long Term Evolution) system.

In order to achieve a high data transmission rate, communication using the ultra-high frequency (mmWave) band is being considered in the 5G communication system. In order to alleviate the path loss of radio waves in the ultra-high frequency band and increase the transmission distance of radio waves, beamforming is used in the 5G communication system. (beamforming), massive array multiple input/output (massive MIMO), full dimensional multiple input/output (FD-MIMO), array antenna, analog beamforming, and large scale antenna technology. are being discussed.

In particular, array antenna technology requires intensive mounting of a large number of filters and antenna elements, which are one of the antenna elements, on the front of the main board in the form of a single board, while also requiring physical equipment to design impedance matching between multiple receiving and transmitting channels. It is an element array technology that requires high precision. Recently, in the 5G communication system market, the demand for ceramic waveguide filters, which are easy to design and manufacture frequency filtering among array antennas, is increasing, and mass production technology to supply ceramic waveguide filters to meet the demand is being developed. It is being demanded.

Figure 1 is a schematic cross-sectional view showing an example of a filter mounted on a main board among the configurations of an RF filter assembly for an antenna according to the prior art.

As shown in FIG. 1, the RF filter assembly 1 for an antenna according to the prior art is in the form of a circular board and is coupled to one side of the main board 10 made of a predetermined material through a fixing board 5. . Here, the fixing board 5 is made of FR4 material, and is attached to the main board (10) to prevent short-circuiting of electrical signals when the main board 10 and the RF filter 20 are directly contacted. 10) It performs the role of separating a certain distance from one side.

Solder cream 30 is applied to one side of the fixing board 5 in advance to a predetermined thickness, and then a plurality of RF filters 20 made of ceramic are arranged in precision elements, and then a predetermined amount of heat is applied to form solder cream. A plurality of RF filters 20 are mounted in batches by dissolving (30) (i.e., SMT method), and in order to prevent short circuits under the components when mounting the RF filters 20, It is common to form the solder cream 30 thickly.

However, the solder cream 30 disposed between the fixing board 5 and the RF filter 20 has a difference in thermal expansion coefficient between the fixing board 5 made of FR4 material and the RF filter made of ceramic material (e.g., fixing Since the thermal expansion coefficient of the board 5 is 17ppm/ㅀC, and the thermal expansion coefficient of the RF filter made of ceramic is 8.2ppm/ㅀC), the antenna housing in which the RF filter assembly 1 for the antenna according to the prior art is installed Cracks occur in certain areas due to system heat inside the main body (not shown), which is a major cause of antenna failure.

That is, when a crack occurs between the fixing board 5 and the RF filter 20, the RF filter 20 is physically separated and falls off, and the silver plating layer metalized around the RF filter 20 There is a problem in that this peeling phenomenon occurs and leads to deterioration in the performance of the antenna.

In addition, the occurrence of the above-mentioned cracks affects the performance deterioration of the input/output port (not shown) of the RF filter 20, and also causes signal leakage in the part performing the GND role in terms of isolation between the RF filters 20. It may cause performance deterioration.

The present invention was conceived to solve the above-mentioned technical problem, and its purpose is to provide an RF filter assembly for an antenna that can minimize the solder area connecting the main board and a plurality of RF filters and reduce the amount of solder. do.

In addition, another object of the present invention is to provide an RF filter assembly for an antenna that can prevent electrical short circuits from occurring by spacing a plurality of RF filters a predetermined distance from one side of the main board.

Another object of the present invention is to provide an RF filter assembly for an antenna that can secure reliability by enabling uniform and precise arrangement of a plurality of RF filters on one side of the main board.

The object of the present invention is not limited to the problems mentioned above, and other problems not mentioned will be clearly understood by those skilled in the art from the description below.

The RF filter assembly for an antenna according to an embodiment of the present invention is disposed between a plurality of RF filters installed on one side of a main board on which a plurality of electrical components are mounted and between the main board and the plurality of RF filters, and is made of metal. and includes a filter support member that separates each of the plurality of RF filters from one surface of the main board.

Here, the filter support member, except for some, may include a filter body support portion formed to correspond to the shape of an end portion close to the main board among the external shapes of each of the plurality of RF filters.

In addition, the filter support member is provided inside the filter main support part to be spaced apart from the filter main support part, and supports the input/output port portions of the feeding signals for the plurality of RF filters at a distance from the main board. It may further include a port support.

Additionally, the filter port support portion may be provided inside the filter main support portion corresponding to the excluded portion of the filter main support portion.

Additionally, the filter body support portion and the filter port support portion may space each of the plurality of RF filters by the same height.

In addition, the filter main body support may include a cut groove on one side and a cut groove on the other side that are cut from one edge end and the other edge end to the area where the filter port support part is disposed.

In addition, the filter body support portion includes a support plate portion adhered to one surface of the main board, an edge support portion bent from an edge end of the support plate toward each of the plurality of RF filters, and the inner portion of the edge support portion. A portion of the support plate may be bent to include at least one inner support end supporting opposing surfaces of each of the plurality of RF filters.

Additionally, the outer shape of the support plate portion may be formed to be the same as the outer shape of the opposing surface of the RF filter minus the shapes of the one side cut groove portion and the other side cut groove portion.

Additionally, the edge support end may be formed in a shape in which recessed portions and convex portions are repeated along the edges of the edge.

In addition, the at least one inner support end includes a first bent portion in which a portion of the support plate portion is cut into a 'L' shape and a portion connected to the support plate portion is bent in the direction in which the plurality of RF filters are provided. It may include a second bent part bent parallel to the opposing surface of the plurality of RF filters from an end of the first bent part.

In addition, the plurality of RF filters are provided as ceramic waveguide filters, and the filter port support portion is connected to the input port hole to which the input port of the ceramic waveguide filter is connected and to the output port hole to which the output port of the ceramic waveguide filter is connected. It may be provided at a corresponding location.

Additionally, the plurality of RF filters may be provided as ceramic waveguide filters and may be soldered together at contact points between the filter body support portion and the filter port support portion.

In addition, the filter support member is made of a metal material that is different from the material of the plurality of RF filters and the material of the main board, and includes any one of steel, stainless steel (SUS), and pure copper (Cu). can do.

According to one embodiment of the RF filter assembly for an antenna according to the present invention, the following various effects can be achieved.

First, by minimizing the solder area and amount of solder connecting the main board and multiple RF filters, the solder cream can be formed to a thin thickness, which has the effect of minimizing the occurrence of cracks in the solder cream due to system heat generation. have

Additionally, during thermal expansion, the filter support member made of metal expands, which has the effect of relieving stress caused by thermal expansion between the RF filter and the main board.

In addition, the present invention has the effect of preventing electrical shorts from occurring and ensuring stable signal flow by spacing a plurality of RF filters a predetermined distance from one side of the main board.

In addition, the present invention has the effect of improving product reliability by enabling multiple RF filters to be arranged uniformly and precisely on one side of the main board.

1 is a schematic cross-sectional view showing an example of a filter mounted on a main board among the configurations of an RF filter assembly for an antenna according to the prior art;
2A and 2B are downward and upward perspective views of an RF filter assembly for an antenna according to an embodiment of the present invention;
3 is an exploded perspective view of an RF filter assembly for an antenna according to an embodiment of the present invention;
Figure 4 is a perspective view showing the RF filter in the configuration of Figure 3,
Figure 5 is a perspective view showing the filter support member in the structure of Figure 3;
FIG. 6 is a cross-sectional view taken along line AA of FIG. 2A.

Hereinafter, an embodiment of an RF filter assembly for an antenna according to the present invention will be described in detail with reference to the attached drawings.

When adding reference numerals to components in each drawing, it should be noted that identical components are given the same reference numerals as much as possible even if they are shown in different drawings. Additionally, when describing embodiments of the present invention, if detailed descriptions of related known configurations or functions are judged to impede understanding of the embodiments of the present invention, the detailed descriptions will be omitted.

In describing the components of the embodiment of the present invention, terms such as first, second, A, B, (a), and (b) may be used. These terms are only used to distinguish the component from other components, and the nature, order, or order of the component is not limited by the term. Additionally, unless otherwise defined, all terms used herein, including technical or scientific terms, have the same meaning as generally understood by those skilled in the art to which the present invention pertains. Terms defined in commonly used dictionaries should be interpreted as having a meaning consistent with the meaning in the context of the related technology, and unless clearly defined in the present application, should not be interpreted in an ideal or excessively formal sense. No.

2A and 2B are a downward perspective view and an upward perspective view of an RF filter assembly for an antenna according to an embodiment of the present invention, FIG. 3 is an exploded perspective view of an RF filter assembly for an antenna according to an embodiment of the present invention, and FIG. 4 is a perspective view showing the RF filter in the configuration of FIG. 3.

The RF filter assembly 100 for an antenna according to an embodiment of the present invention, as shown in FIGS. 2A to 4, includes a main board 110, a plurality of RF filters 120, and a filter support member 140. ) includes.

The main board 110 is a printed circuit board (PCB) in the form of a single board, on one side of which a plurality of RF filters 120 or some of a number of electrical components to synchronize can be mounted, and on the other side A plurality of electrical components equipped with a plurality of power supply-related components capable of calibration and control of power supply to a plurality of RF filters 120 may be mounted.

In one embodiment of the present invention, for convenience of understanding, a single RF signal is applied to a single filter support member 140 on the other side (top surface in Figure 2a) of the main board 110 provided as a PCB in the form of a single board. Although the filter 120 is shown and described as being provided, the filter support member 140 is formed in a unique shape according to the position where all or part of the plurality of RF filters 120 are disposed, and is formed in a unique shape according to the position of the main board 110. It is not excluded that it is formed in a stacked arrangement at multiple locations on the entire surface.

Here, the RF filter 120 is provided as a ceramic waveguide filter, and a plurality of them are mounted and arranged at predetermined intervals on one side of the main board 110 via at least one filter support member 140 described above. It can be.

As shown in FIGS. 3 and 4, the RF filter 120 employed as a ceramic waveguide filter includes a filter body 121 made of ceramic material and at least four resonance blocks provided in the filter body 121. Includes. A corresponding resonator post 122 is installed in each resonant block, and each resonator post 122 receives a frequency signal through adjacent coupling with the adjacent resonator post 122 or cross-coupling coupled across at least one. can be filtered.

Here, the resonance blocks 11 to 16 formed in the filter body 121 do not need to be completely physically separated, but are separated by changing the width of the signal transmission path by a partition provided in the filter body 121. That's enough.

For example, as referred to in FIG. 4, the filter body 121 is provided with six resonator posts 122a to 122f, and when an electrical signal is input through the input port hole 129a, which will be described later, the input port hole 129a is provided. It is applied through the first resonator post (122a) closest to (129a), and is sequentially: second resonator post (122b) - third resonator post (122c) - fourth resonator post (122d) - fifth resonator post ( 122e) - Frequency filtering is performed via the sixth resonator post (122f) and then output through the output port hole (129b).

Here, a first partition 127a is provided between the first resonator post 122a and the second resonator post 122b to partition the first resonator block 11 and the second resonator block 12, and the second resonator post 122b A second partition wall 127b is provided between the post 122b and the third resonator post 122c to partition the second resonance block 12 and the third resonance block 13, and the third resonator post 122c and A portion of the third partition 127c is provided between the fourth resonator post 122d to partition the third resonator block 13 and the fourth resonator block 14, and the fourth resonator post 122d and the fifth resonator post 122d are provided between the fourth resonator post 122d and the fifth resonator post 122d. A fourth partition wall 127d is provided between the posts 122e to partition the fourth resonance block 14 and the fifth resonance block 15, and between the fifth resonator post 122e and the sixth resonator post 122f. The remaining part of the third partition 127c is provided to partition the fifth resonance block 15 and the sixth resonance block 16. In particular, the third partition 127c is provided between the first resonator post 122a, the third resonator post 122c, and the sixth resonator post 122f to physically form three resonance blocks (first resonance block 11). , it can serve to simultaneously partition the third resonance block 13 and the sixth resonance block 16).

The above-described first to fourth partition walls 127a to 127d may all be formed to have a predetermined size that penetrates the filter body 121 in the vertical direction.

The outer shell of the filter body 121 is plated with a metallic film, and the flow of electrical signals can be blocked internally and externally except for the input port hole 129a or output port hole 129b, which will be described later.

As described above, at least four resonance blocks provided in the filter body 121 are provided to perform filtering by adjacent coupling or cross-coupling of electrical signals flowing through an input port or output port (not shown). This is preferable, and in one embodiment of the present invention, it is explained by taking as an example that it is composed of six resonance blocks (11 to 16).

That is, in the RF filter assembly 100 for an antenna according to an embodiment of the present invention, the ceramic waveguide filter is provided with six resonance blocks 11 to 16 in one filter body 121, and each resonance block The resonator posts (122a to 122f) of (11 to 16) may be installed in a manner in which a dielectric material with a predetermined dielectric constant is filled and fixed. Here, air is also one of the dielectric materials, so when air is selected and filled as the dielectric material constituting the resonator posts (122a to 122f), a separate filling and fixing process is not required, and the six resonator posts (122a to 122f) are used. ) Each may be formed in the form of an empty space in which a portion of the dielectric material is removed from the filter body 121.

Here, as shown in FIG. 4, a portion of one surface of the filter body 121 corresponding to the inner surface of the resonator posts 122a to 122f and the upper edge of the resonator posts 122a to 122f is provided with a coating portion of a conductive material ( 126a to 126f) may be formed by plating. Some of the coating portions 126a to 126f are formed to extend closer to the relevant resonator post 126d so that cross-coupling can be easily implemented between some of the resonator posts 122a to 122f. ) may further be included.

In one embodiment of the present invention, cross-coupling is provided so that cross-coupling can be implemented between the fourth resonator post 122d and the sixth resonator post 122f, which skips the fifth resonator post 122e by one, and the cross-coupling In order to make the implementation easier, a film extension end ( 126f-1) can be extended closely.

In addition, referring to FIG. 4, a ground portion 128 that does not form any film plating layer may be provided around each of the film portions 126a to 126f. The ground portion 128 may serve as a ground to insulate between the portion plated with a film on the outer surface of the filter body 121 and the film portions 126a to 126f of each of the above-described resonator posts 122a to 122f. .

Meanwhile, although not shown in the drawing, on the other side of the ceramic waveguide filter, there is an input port hole 129a for connecting an input port (not shown) that inputs an electrical signal to any one of the six resonator posts 122 described above. And an output port hole 129b may be formed for connection of an output port (not shown) that outputs an electrical signal from any one of the six resonator posts 122 described above. In the input port hole 129a and the output port hole 129b, an input port and an output port connected to the main board 110 through the filter port support 143 of the filter support member 140, which will be described later, will be installed. You can.

In addition, as shown in FIG. 3, the ceramic waveguide filter is installed on one side of the opening of each resonator post 122 and has a tuning cover 123 provided to perform frequency tuning using a steering angle method or a tuning screw. ) and a filter cover 125 coupled to cover one surface of the filter body 121 including the tuning cover 123.

When the frequency tuning method is a striking angle method, a striking angle pad 124 may be formed integrally with the tuning cover 123. The stamp pad 124 is spaced apart from the position corresponding to the resonator post 122, and is stamped using a stamp tool (not shown) to finely adjust the separation distance between it and the bottom surface of the resonator post 122. Frequency tuning can be performed.

Meanwhile, as shown in FIGS. 2A to 3, the filter support member 140 is disposed between the main board 110 and the plurality of RF filters 120 to support the plurality of RF filters in the direction of one side of the main board 110. (120) It plays the role of separating each. In addition, the filter support member 140 is fixed to one side of the main board 110 through various coupling methods other than soldering coupling method, and is coupled to a plurality of RF filters 120 through soldering coupling method, It serves to mediate the coupling of the RF filter 120 to the main board 110.

This filter support member 140 is made entirely of a metal material different from the material of the plurality of RF filters 120 and the material of the main board 110, and is made of steel, SUS (Stainless steel), and pure copper (Cu). ) may include any one of the materials. As the filter support member 140 is made of a metal material, it can have the advantage of minimizing the difference in thermal expansion coefficient between the solder cream that mediates the connection of the filter body 121.

FIG. 5 is a perspective view showing a filter support member in the structure of FIG. 3, and FIG. 6 is a cross-sectional view taken along line A-A of FIG. 2A.

Referring to FIGS. 3 and 5, the filter support member 140 is a filter formed to correspond to the shape of an end close to the main board 110 among the external shapes of each of the plurality of RF filters 120, except for some. The main body support part 142 is provided inside the filter main support part 142 to be spaced apart from the filter main support part 142, and the input/output port portion of the feeding signal for the plurality of RF filters 120 is provided on the main board 110, respectively. It may include a filter port support portion 143 that supports and is spaced apart from. Here, the filter port support portion 143 may be provided as a pair to correspond to the input port hole 129a and output port hole 129b formed in each of the RF filters 120.

The filter body support portion 142 and the filter port support portion 143 may space each of the plurality of RF filters 120 by the same height. This will be explained in more detail later.

As shown in FIGS. 3 and 5, the filter body support portion 142 is provided with a filter port support portion 143 from one edge end and the other edge end, respectively, in order to install the pair of filter port supports 143 apart from each other. An incision may be made up to the placed area.

More specifically, as shown in FIGS. 3 and 5, the filter body support portion 142 is a panel corresponding to one side or the other side of the ceramic waveguide filter when the ceramic waveguide filter is formed as a rectangular parallelepiped that is substantially elongated in the longitudinal direction. It can be formed into a shape.

Here, as shown in FIG. 3, the pair of filter port supports 143 are not electrically connected to the filter body support 142 and are disposed inside the filter body support 142 so as not to interfere with each other. The filter body support portion 142 has one side cut groove portion 146a formed by cutting from one edge end, which is the longitudinal end, to the part where one filter port support portion 143 is located, and another from the other edge end, which is the other longitudinal end. It may include a cut groove portion 146b on the other side that is cut up to the portion where the filter port support portion 143 is located.

One side cut groove portion 146a and the other side cut groove portion 146b form a straight slot portion 147 having the same width up to the area where the pair of filter port supports 143 are located, and each pair of filter ports 143 has a same width. The portion where the support portion 143 is located may form a circular slot portion 148 with a diameter larger than the width of the end of the straight slot portion 147.

Although not shown, the straight slot portion 147 is a signal line pattern already printed on the main board 110, and serves to shield electrical signals flowing through the input port and output port from external noise, respectively. You can.

The circular slot portion 148 may serve to stabilize the flow of electrical signals connected to the ceramic waveguide filter through the input port and output port, respectively.

Meanwhile, as shown in FIGS. 3 and 5, the filter body support portion 142 includes a support plate portion 142a that is adhered to one surface of the main board 110, and a plurality of RF channels at the edge of the support plate portion 142a. The edge support end 144 bent toward each of the filters 120 (i.e., ceramic waveguide filters), and a portion of the support plate portion 142a corresponding to the inside of the edge support end 144 are bent to face each of the ceramic waveguide filters. It may include at least one inner support end 145 that supports the surface.

Here, the outer shape of the support plate portion 142a may be formed to be substantially the same as the outer shape of the opposing surface of the ceramic waveguide filter minus the shapes of the one side cut groove portion 146 and the other side cut groove portion 146, as described above. there is.

Additionally, the edge support end 144 is formed along the outer edge end of the support plate portion 142a, and may be formed by bending at a right angle from the outer edge end of the support plate portion 142a toward the ceramic waveguide filter.

The edge support end 144 may be formed in a concave-convex shape in which concave portions 144a and convex portions 144b are repeated along the outer edge edge of the support plate portion 142a. This minimizes the solder bonding area to the opposing surface of the ceramic waveguide filter by the cut portion of the concave portion 144a of the edge support end 144, while minimizing the solder connection area of the ceramic waveguide filter by the protruding portion of the convex portion 144b of the edge support end 144. This is to ensure that the opposing surfaces are stably supported and spaced apart.

Meanwhile, at least one inner support end 145 has a portion of the support plate portion 142a cut into a 'ㄷ' shape, and a portion connected to the support plate portion 142a includes a plurality of RF filters 120 (i.e., ceramic The first bent portion 145a is bent in the direction in which the waveguide filter is provided, and the end of the first bent portion 145a is bent parallel to the opposing surface of the plurality of RF filters 120 (i.e., ceramic waveguide filters). may include a second bent portion 145b.

The first bent portion 145a serves to space the ceramic waveguide filter a predetermined distance from one side of the support plate portion 142a (or one side of the main board 110), and the second bent portion 145b, It may serve to support the opposing surfaces of the ceramic waveguide filters spaced apart by the first bent portion 145a.

In this way, using the edge support end 144 of the filter main support part 142, the edge portion of the opposing surface of the ceramic waveguide filter is uniformly supported, and the inner support end 145 of the filter main support part 142 is also supported. By using , the interior of the opposing surface of the ceramic waveguide filter that is not supported by the edge support end 144 can be uniformly supported at multiple locations.

Meanwhile, the filter port support portion 143, like the edge support end 144 of the filter body support portion 142, may be formed in a shape in which the recessed portion 144a and the convex portion 144b are repeated.

Here, the end of the edge support end 144 and the inner support end 145 of the filter body support part 142 and the end of the filter port support part 143 are the same from one side of the main board 110 (or one side of the support plate). It is preferable that it is formed at a height. This is to ensure that the height of the ceramic waveguide filter supported and spaced apart by the filter body support part 142 and the filter port support part 143 is uniform.

Solder cream (not shown) may be applied to a certain thickness on the ends of the filter body support portion 142 and the filter port support portion 143, and may be soldered together at a contact point in contact with the opposing surface of the ceramic waveguide filter.

In other words, the solder cream is a composition for joining the filter support member 140 and the ceramic waveguide filter through mutual soldering, and is not applied to the entire area of the filter body support part 142 and the filter port support part 143. , As described above, it can be applied only to the ends of the edge support end 144 and the inner support end 145 of the filter body support part 142 and the end of the filter port support part 143, respectively.

This has the advantage of minimizing the solder area compared to applying solder cream to the entire area of the filter support member 140. In addition, by minimizing the amount of solder, solder cream can be formed to a thin thickness. In this way, by minimizing the solder area where the solder cream is applied and forming the solder cream to a thin thickness, even if the difference in thermal expansion coefficient between the filter support member 140 and the ceramic waveguide filter is large, the possibility of cracking and cracking of the solder cream is reduced. There is an advantage in that the amount generated can be significantly reduced.

More specifically, the solder cream is in a form that is not applied to the support plate portion 142a of the filter main body support portion 142 among the components of the filter support member 140, and is used on the edge support end 144 of the filter main support portion 142. ) may be applied to the end of the filter body support portion 142, and may be applied to only one surface of the end of the inner support end 145 (i.e., the second bent portion 145b) of the filter body support portion 142. In addition, solder cream may be point-applied to the end of the filter port support portion 143 of the filter support member 140.

In this way, the solder area where the solder cream is applied can be minimized compared to the solder area of the RF filter 120 on one side of the conventional main board 110, thereby preventing problems caused by cracks in the solder cream in advance. When thermal expansion occurs, the filter support member 140 made of metal expands, which has the effect of relieving the stress caused by thermal expansion between the RF filter 120 and the main board 110.

Above, the RF filter assembly for an antenna according to an embodiment of the present invention has been described in detail with reference to the attached drawings. However, the embodiments of the present invention are not necessarily limited to the above-described embodiment, and it is natural that various modifications and equivalent implementations can be made by those skilled in the art. will be. Therefore, the true scope of rights of the present invention will be determined by the claims described later.

100: RF filter assembly for antenna 110: Main board
120: RF filter (ceramic waveguide filter) 121: Filter body
122: Resonator post 123: Cover for tuning
124: Marking pad 125: Filter cover
140: Filter support member 142: Filter body support portion
143: filter port support 144: border support
144a: waist 144b: iron part
145: inner support end 145a: first bent portion
145b: second bent portion 146a: one side cut groove portion
146b: Other side cut groove 147: Straight slot portion
148: Circular slot portion

Claims (13)

Multiple RF filters installed on one side of the main board on which multiple electrical components are mounted; and
a filter support member disposed between the main board and the plurality of RF filters and made of a metal material to space each of the plurality of RF filters from one surface of the main board; Including,
The filter support member is,
Except for some, a filter body support portion formed to correspond to the shape of an end portion of each of the plurality of RF filters that is close to the main board; and
a filter port support part provided inside the filter main support part to be spaced apart from the filter main support part and supporting input/output port portions of feeding signals for the plurality of RF filters at a distance from the main board; Includes,
The RF filter assembly for an antenna, wherein the filter body support portion and the filter port support portion space each of the plurality of RF filters by the same height. delete delete In claim 1,
The filter port support part is an RF filter assembly for an antenna, wherein the filter port support part is provided inside the filter main support part corresponding to the excluded part of the filter main support part. delete In claim 1,
The filter main support portion includes a cut groove portion on one side and a cut groove portion on the other side cut from one edge end and the other edge end to the area where the filter port support portion is disposed. In claim 6,
The filter body support part,
a support plate portion adhered to one surface of the main board;
an edge support end bent from an edge end of the support plate portion toward each of the plurality of RF filters; and
at least one inner support end in which a portion of the support plate portion corresponding to the inner side of the edge support end is bent to support opposing surfaces of each of the plurality of RF filters; RF filter assembly for an antenna, including a. In claim 7,
An RF filter assembly for an antenna, wherein the support plate portion has the same shape as the outer shape of the opposing surface of the RF filter minus the shapes of the one side cut groove portion and the other side cut groove portion. In claim 7,
The edge support end is an RF filter assembly for an antenna in which recessed portions and convex portions are formed in a shape that is repeated along the edge edge. In claim 7,
In the at least one inner support end, a portion of the support plate portion is cut into a 'L' shape,
a first bent portion connected to the support plate portion bent in a direction in which the plurality of RF filters are provided; and
a second bent portion bent parallel to the opposing surface of the plurality of RF filters from an end of the first bent portion; RF filter assembly for an antenna, including a. In claim 1,
The plurality of RF filters are provided as ceramic waveguide filters,
The filter port support portion is provided at a position corresponding to an input port hole to which an input port of the ceramic waveguide filter is connected and an output port hole to which an output port of the ceramic waveguide filter is connected. In claim 1,
The plurality of RF filters are,
Equipped with a ceramic waveguide filter,
An RF filter assembly for an antenna, wherein the filter body support portion and the filter port support portion are joined by solder at contact points. In claim 1,
The filter support member is made of a metal material different from the material of the plurality of RF filters and the material of the main board, and includes any one of steel, stainless steel (SUS), and pure copper (Cu). RF filter assembly for antenna.

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