KR102603599B1 - Foldable Display Device - Google Patents

Abstract

The present invention not only increases the reliability of the chip-on-film circuit on which the driving circuits for driving the foldable display device are mounted, but also allows the circuit components for driving the foldable display device to be integrated and mounted in the chip-on film circuit. It is about a foldable display device. A foldable display device according to the present invention includes a foldable display panel provided with a driving pad on the outside of a display surface, including at least one folding part and a non-folding part, and connected to the driving pad part, wherein the foldable display panel is connected to the driving pad part. It includes a COF circuit unit on which a plurality of driving circuits for driving the panel are mounted. At this time, the COF circuit unit includes a first film unit and a second film unit extending from the first film unit in the x-axis direction, and the driving circuit is mounted on the first film unit to form the foldable display panel. It includes a driver IC that supplies a driving signal, and a plurality of RLCs and diodes mounted on the second film portion.

Description

Foldable Display Device

The present invention relates to a foldable display device, and in particular, improves the reliability of a chip-on film circuit on which driving circuits for driving a foldable display device are mounted, and also provides circuit components for driving a foldable display device in a chip-on film. This relates to a foldable display device that can be integrated and mounted on an on-film circuit.

Video display devices, which display various information on a screen, are a core technology of the information and communication era and are developing to be thinner, lighter, more portable, and more high-performance. Accordingly, organic light emitting display devices, which display images by controlling the amount of light emitted from the organic light emitting layer, are receiving attention as flat panel displays that can reduce the weight and volume, which are disadvantages of cathode ray tubes (CRTs).

An organic light emitting display device displays an image by arranging multiple pixels in a matrix form. Here, each pixel includes a light-emitting element and a pixel driving circuit consisting of a plurality of transistors that independently drive the light-emitting element.

Such organic light-emitting display devices use self-emitting organic light-emitting devices, so they do not require a separate light source, and since it is possible to form an ultra-thin display device, in recent years, organic light-emitting devices have been used and touch electrode arrays are placed inside the light-emitting cells. Research on foldable display devices with an in-cell touch structure (In-Cell Touch) is being actively conducted.

Circuit elements such as driver ICs and touch sensing ICs for driving the display panel of a foldable display device are mounted on a film using a chip-on-film (COF) method to form a chip-on-film circuit or a flexible circuit. It can be mounted on a flexible printed circuit board (FPCB). At this time, components such as RLC circuits and diodes required to drive the display panel are mounted on the substrate using a SMT (Surface Mounting Technology) method where they are joined by lead wires, etc. However, COF films have the characteristic of being very flexible. Accordingly, when mounting on a COF film using the SMT method, defects such as lead wires of components may be broken due to stress when the film is bent.

Accordingly, conventionally, circuit elements that can be directly mounted on the COF film, such as driver ICs, were mounted on the COF film, and circuit components mounted using the SMT method were mounted on the FPCB, which has lower flexibility characteristics than COF. At this time, the COF film and the FPCB film were connected to each other in the Y-axis direction and attached to one side of the display panel.

In a foldable display device, the FPCB and COF film are curved toward the back of the display panel and provided near the back of the display panel. A foldable display device has the characteristic that the entire display device, including the display panel, is folded. When the FPCB film bonded to the COF film in the Y-axis direction extends to the area where the display panel is folded when folded, the display panel is folded. As the FPCB was also folded along with folding, folding stress was applied to the components mounted using the SMT method, resulting in defects in the components mounted using the SMT method.

The present invention was developed to solve the above problems, and provides a foldable display device that can improve the reliability of the circuit components for driving the foldable display device by integrating them into a chip-on film circuit and mounting the circuit components. Make it the problem you want to solve.

In order to solve the above problem, a foldable display device according to the present invention includes a foldable display panel having a driving pad portion on the outside of the display surface and including at least one folding portion and a non-folding portion, the driving pad portion, and It is connected and includes a COF circuit unit on which a plurality of driving circuits for driving the foldable display panel are mounted.

At this time, the COF circuit unit includes a first film unit and a second film unit extending from the first film unit in the x-axis direction, and the driving circuit is mounted on the first film unit to form the foldable display panel. It includes a driver IC that supplies a driving signal, and a plurality of RLCs and diodes mounted on the second film portion.

The RLC and diodes are connected to the second film portion using SMT (Surface Mounting Technology), and a back surface of the second film portion is made more rigid than the first and second film portions to reinforce the second film portion. ) further includes additional reinforcing materials.

In the COF circuit of the foldable display device according to the present invention, both the first and second film parts located side by side in the horizontal direction are located on the back of the non-folding part of the display panel, so that when the display panel is folded, the display panel is folded. The first and second film portions are also prevented from being folded together. Accordingly, the bond between the circuits constituting the device mounted using the SMT method and the second film portion is prevented from being damaged due to folding of the second film portion. Accordingly, the foldable display device using the COF film according to the present invention has the effect of improving the reliability of the driving element.

In addition, since the second film portion has flexible characteristics, it further includes a reinforcing material to support the device portion, so that the device portion is stably bonded to a COF substrate having flexible characteristics.

1 is a schematic diagram illustrating a foldable display device according to a first embodiment of the present invention.
FIG. 2 is a schematic diagram illustrating the structure of a display panel to which the COF circuit unit is bonded.
3A to 3C are diagrams for explaining the structure of the COF circuit unit according to the present invention.
FIG. 4 is a schematic diagram illustrating a feature in which the COF circuit unit is located on the back of the display panel.
Figure 5 is for explaining a foldable display device according to a second embodiment of the present invention.
FIG. 6A is a side view for explaining a foldable display device according to a second embodiment of the present invention, and FIG. 6B is for explaining features of the foldable display device when it is folded.

Hereinafter, preferred embodiments of the present invention will be described with reference to the attached drawings. Like reference numerals refer to substantially the same elements throughout the specification. In the following description, if it is determined that a detailed description of technology or configuration related to the present invention may unnecessarily obscure the gist of the present invention, the detailed description will be omitted. Additionally, the component names used in the following description were selected in consideration of the ease of writing specifications and may be different from the component names of the actual product.

In the case of a description of a positional relationship, for example, when the positional relationship between two parts is described as 'on top', 'on the top', 'on the bottom', 'next to', etc., 'right away' or Unless 'directly' is used, there may be one or more other parts placed between the two parts.

Although first, second, etc. are used to describe various elements, these elements are not limited by these terms. These terms are merely used to distinguish one component from another. Accordingly, the first component mentioned below may also be the second component within the technical spirit of the present invention.

The size and thickness of each component shown in the drawings are shown for convenience of explanation, and the present invention is not necessarily limited to the size and thickness of the components shown.

1 is a schematic diagram illustrating a foldable display device according to a first embodiment of the present invention.

The foldable display device according to the first embodiment of the present invention includes a foldable display panel 100 including at least one folding portion (F/A1, F/A2) and a non-folding portion (N/A); It is connected to the outside of the foldable display panel 100 and includes a COF circuit unit 600 on which a plurality of driving circuits for driving the foldable display panel 100 are mounted.

Although not visible in the front view of FIG. 1, a driving pad portion is provided in an area in contact with the COF circuit portion 600 of the foldable display panel 100. Additionally, the COF circuit unit 600 includes a film pad unit 609 to be connected to the driving pad unit. The film pad portion 609 may be connected to the driving pad portion through an anisotropic conductive film (ACF), but is not necessarily limited thereto.

The COF circuit unit 600 may include a COF film formed to have flexible characteristics using polyimide or polyvinyl chloride (PVC), but is not necessarily limited thereto. In this specification, COF film is described as an example, but is not limited to such expression, and includes chip-on-flexible film, COF printed circuit film, COFPC, flexible printed circuit (FPC), TCP (Tape Carrier Package) ) It can be replaced with other terms or expressions, such as film.

The COF circuit unit 600 includes a first film unit 601 and a second film unit 602 made of the COF film. Additionally, a film pad portion 609 is provided in an area where the COF circuit portion 600 is in contact with the display panel 100, and a connector portion 608 is provided on the opposite side of the film pad portion 609. At this time, the first film portion 601 and the second film portion 602 are arranged side by side in the x-axis direction, that is, in the horizontal direction. At this time, the second film portion 602 may extend from the first film portion 601 and be integrally formed. A plurality of driving circuits for driving the foldable display panel 100 are mounted on the first and second film units 601 and 602. In particular, the COF circuit unit 600 has been described as being separated into the first and second film units 601 and 602 for convenience, but in reality, the first and second film units 602 are formed integrally, forming one COF film. It may have the feature of mounting the entire driving circuit for driving the foldable display panel 100 on it. At this time, the driving circuit includes a driver IC 350 that supplies a driving signal to the foldable display panel 100, an RLC circuit including a resistor, inductor, and capacitor necessary for driving the foldable display panel 100, and a plurality of When the foldable display panel 100 includes diodes, a timing controller 611 that controls the driver IC, and a touch sensor, it may include a touch sensing IC 610 for driving the touch sensor. , but is not limited to this. In this specification, the RLC circuit and a plurality of diodes are collectively referred to as the device portion 603.

A driver IC 350 is located on the first film unit 601. The driver IC 350 is mounted on the first film portion 601 in a chip-on-film (COF) form.

Although not shown in FIG. 1, a plurality of wires (not shown) are provided between the driver IC 350 and the film pad portion 609 to supply driving signals to the display panel 100. The driver IC 350 supplies a driving signal to the display panel 100 through these wirings.

The second film portion 602 is formed to extend from the first film portion 601 in the horizontal direction, that is, in the x-axis direction. At this time, the first film unit 601 and the second film unit 602 may be provided as one body. Other driving circuits except the driver IC 350 are mounted on the second film unit 602. That is, a touch sensing IC 601 for driving the touch sensor, an element unit 603 including the RLC circuit and a diode, and a timing controller 611 may be mounted on the second film unit 602.

The RLC circuit and diodes constituting the device portion 603 are mounted on the second film portion 602 using SMT (Surface Mounting technology). That is, the RLC circuit and diodes include a plurality of lead wires, and the lead wires may be mounted by being connected to the second film portion 602 through a method such as soldering, but the present invention is not limited thereto.

The touch sensing IC 610 supplies touch signals to drive the touch sensors of the foldable display panel 100 to the foldable display panel 100 . At this time, although not shown in FIG. 1, a plurality of touch wires for transmitting touch signals are provided between the touch sensing IC 610 and the foldable display panel 100. At this time, the touch wires may also be connected to the driving pad unit through the film pad unit 609, but are not necessarily limited thereto.

The timing controller 611 generates image data, a timing control signal for controlling the display timing of the image, and a driving control signal for driving the driver IC 350, and supplies them to the driver IC 350. The driver IC 350 receives the driving control signal and timing control signal, converts the digital image data into analog, and supplies it to the foldable display panel 100 through the wires.

The timing controller 611 and the touch sensing IC 610 may be mounted on the second film portion 602 using a COF method, but are not necessarily limited thereto.

A connector portion 608 is provided on the opposite side of the film pad portion 609 where the COF circuit portion 600 is in contact with the display panel 100. The connector portion 608 has the characteristic of connecting the COF circuit portion 600 with an external set portion. To this end, the connector portion 608 may be connected to the driving circuits through wiring (not shown) and may have a plurality of pins, but is not necessarily limited thereto.

FIG. 2 is a schematic diagram illustrating the structure of a display panel to which the COF circuit unit 600 is bonded. Referring to FIG. 2, the display panel 100 includes a first substrate 120, a first buffer layer 130 located on the first substrate 120, and a matrix on the first buffer layer 130. A thin film transistor array 140 with defined pixels and a thin film transistor for each pixel, an organic light emitting array 150 connected to the thin film transistor of each pixel, the thin film transistor array 140 excluding the pad portion, and an organic light emitting array. A protective layer 160 covering 150, a touch electrode array 230 bonded with an adhesive layer 400 between the protective layer 160, and sequentially formed on the touch electrode array 230. It may include a second buffer layer 220, a second substrate 210, and a cover window 3000 located on the second substrate 210. The display panel according to the present invention is not necessarily limited to the above embodiment, and can be widely applied to a foldable display device including a thin film transistor array 140 and an organic light emitting array 150.

An active area (A/A) and a dead area (D/A) are defined in the first buffer layer 130 and the second buffer layer 220, respectively, and the touch electrode array 230, the organic light emitting array 150, and the pad Thin film transistors in the thin film transistor array 140, excluding the portion, are formed in the active area (A/A). Additionally, a touch pad portion 2350 and a lower pad portion 1450 of the thin film transistor array 140 are defined in a portion of the dead area D/A.

Here, the first and second substrates 120 and 210 serve to prevent damage to the internal array during the laser irradiation or etching process, and in some cases, the first and second substrates 120 and 210 protect the display device from the outside. It plays a role in protecting against The first and second substrates 120 and 210 may be made of polymer materials such as polyimide and photoacryl.

The first buffer layer 130 and the second buffer layer 220 are each formed by sequentially stacking the same type of inorganic film, such as an oxide film (SiO2) or a nitride film (SiNx), or by alternately stacking different inorganic films. The first and second buffer layers 130 and 210 function as a barrier to prevent moisture or external air from permeating into the organic light emitting array 150 in the subsequent process of bonding the upper substrate to the lower substrate.

The touch electrode array 230 and the touch pad unit 2350 are formed on the same surface of the second buffer layer 220. The touch pad unit 2350 is connected to the lower pad unit 1450 of the thin film transistor array 140 by a seal 450 including a conductive ball 455 during the upper and lower bonding process using the adhesive layer 400. At this time, the adhesive layer 400 has a function of preventing moisture penetration and is in direct contact with the protective layer 160 covering the organic light emitting array 150, thereby preventing outside air from entering the organic light emitting array 150 in addition to the function of the protective layer 160. It plays a role in preventing moisture penetration more reliably.

Here, the thin film transistor array 140 including the pad portion is formed so that one side protrudes beyond the touch electrode array 230, and a driving pad portion 1460 is formed on the protruding portion. Although not shown in FIG. 2, the driving pad portion 1460 is connected to the lower pad portion 1450 of the thin film transistor array 140 by a wire. And the driving pad unit 1460 is bonded and connected to the film pad unit 609 of the COF circuit unit 600, and the display panel 100 is connected to the driver IC 350 provided on the COF circuit unit 600 and the touch sensing unit. It can be controlled by the IC 610 and timing controller 611. At this time, the COF circuit part 600 and the film pad part 609 may be bonded to each other by an anisotropic conductive film (ACF), but are not necessarily limited to this.

In the following drawings, in order to explain the main technical features of the present invention in more detail, the above components are collectively referred to as the display panel 100, and in particular, the first substrate 120 to the protective layer 160 is referred to as the lower panel 105. ), the cover window 3000 to the touch electrode array 230 is defined as the top plate 205, and the detailed structures of the remaining components are omitted.

3A to 3C are diagrams for explaining the structure of the COF circuit unit 600 according to the present invention. As described above, the COF circuit unit 600 includes a first film unit 601, a second film unit 602, a film pad unit 609, and a connector unit 608 made of a COF film or the like. A driver IC 350 is mounted on the first film unit 601. The driver IC 350 is mounted on the COF circuit unit 600 using a chip-on-film (COF) method, and includes a plurality of wires (not shown) in the direction of the film pad unit 609.

An element unit 603, a touch sensing IC 610, and a timing controller 611 may be provided on the second film unit 602. In particular, the RLC circuit and diodes that make up the device portion 603 are generally mounted on the second film portion 602 using the SMT method. In the SMT method, each RLC circuit and diode has a plurality of lead wires, and each lead wire can be soldered to the COF film.

Figure 3b is for explaining the rear side of the COF circuit unit 600. The COF film forming the COF circuit portion 600 is made of a material such as polyimide (PI) or polyvinyl chloride (PVC) and is formed to have highly flexible characteristics. At this time, stress may be applied to the lead wire due to bending of the COF film. there is. This stress acts between the lead wire and the COF film and causes the lead wire to fall off from the COF film, causing device failure. To prevent this problem, a reinforcing material 630 is further attached to the back of the second film portion 602, as shown in FIG. 3B. The reinforcing material 630 may be made of a material having more rigid properties than the COF circuit portion 600, for example, epoxy or cured polyimide (PI), and may be formed in the form of a film. The reinforcing material 630 supports the second film portion 602 so that it does not bend, thereby preventing the circuits forming the device portion 603 mounted using the SMT method from bending when the second film portion 602 made of the COF film bends. Protects against stress.

Here, the second film portion 602 may be positioned to be folded in the direction of the first film portion 601. In other words, the second film portion 602 is folded into the lower side of the first film portion 601 based on the first bending line (bending line 1), so that the second film portion 602 is formed into the first film portion ( 601) can be provided on the back. This is because the first and second film parts 601 and 602 according to the present invention are formed long in the x-axis direction, so that the x-axis length of the COF circuit part 600 is longer than the horizontal length of the display panel 100. , It is particularly advantageous to prevent the COF circuit part 600 from being exposed to the outside of the display panel 100. Accordingly, as shown in FIG. 3C, the COF circuit unit 600 may be provided so that only the first film unit 601 is visible, or in some cases, only the second film unit 602 is visible.

FIG. 4 is a schematic diagram explaining the location of the COF circuit unit 600 on the back of the display panel 100. Here, the display panel 100 is shown as having a structure in which a lower panel 105 and an upper panel 205 are joined to each other, as mentioned above. The entire COF circuit unit 600 is positioned so that the inside of the second bending line (bending line 2) is folded to the back of the display panel 100. Here, everything outside the second bending line (bending line 2) corresponds to the film pad portion 609. Accordingly, only the film pad part 609 is connected to the front of the display panel 100, that is, to the protruding driving pad part 1460 of the lower panel 105, and the remaining area of the COF circuit part 600 is all connected to the display panel ( 100) is folded in the back direction. Accordingly, the first film part 601, the second film part 602, and the connector part 608 excluding the film pad part 609 are all located on the back of the display panel 100. Meanwhile, referring to FIG. 4, the first film portion 601 is located on the back of the non-folding portion (N/A). In addition, the second film portion 602 formed by extending in the horizontal direction from the first film portion 601 is also located on the back of the non-folding portion (N/A). At this time, as previously described, the second film portion 602 may be provided to be folded in the rear direction of the first film portion 601. At this time, the first film unit 601 is located on the upper side so that the driver IC 350 faces the back of the display panel 100, and the second film unit 602 is located below the first film unit 601. may be positioned so that the device portion 603 faces downward, but is not necessarily limited to this.

Since both the first and second film parts 601 and 602 are located on the back of the non-folding part (N/A) of the display panel 100, the display panel 100 as shown in the lower drawing of FIG. 4 When the display panel 100 is folded, the first and second film portions 602 are also prevented from being folded. Accordingly, the bond between the circuits constituting the device unit 603 mounted using the SMT method and the second film unit 602 is prevented from being damaged due to the folding of the second film unit 602. Accordingly, the foldable display device using the COF film according to the present invention has the effect of improving the reliability of the driving element.

Figure 5 is for explaining a foldable display device according to a second embodiment of the present invention. The foldable display device according to the second embodiment of the present invention includes a foldable display panel 100 and a COF circuit unit 600 adjacent to the outer edge of the foldable display panel 100. The COF circuit unit 600 has the same configuration as the COF circuit unit 600 in the previous embodiment. That is, the COF circuit unit 600 includes a first film unit 601 and a second film unit 602 made of a COF film or the like. Additionally, the COF circuit portion 600 includes a film pad portion 609 and a connector 608. The film pad portion 609 is connected to the driving pad portion 1460 of the foldable display panel 100. At this time, a reinforcing material may be further provided on the back of the second film portion 602, as in the first embodiment.

A driver IC 350 is mounted on the first film unit 601 using a COF method, and an element unit 602, a touch sensing circuit 610, and a timing controller 611 are provided on the second film unit 602. It can be done and is not limited to this.

Since the configuration of the COF circuit unit 600 is the same as that of the first embodiment, detailed description is omitted.

The characteristics of the foldable display panel 100 according to the second embodiment are the same as those mentioned in FIG. 2. However, in this embodiment, the foldable display panel 100 includes one folding part (F/A1), a second folding part (F/A2), and the first and second folding parts (F/A1, F/ It includes the non-folding portion (N/A), which is the area excluding A2). At this time, the second folding part (F/A2) is provided adjacent to the COF circuit part 600.

Although not shown in FIG. 5, the second folding portion F/A2 in the second embodiment of the present invention has the characteristic of being folded and fixed toward the rear of the foldable display panel 100. This will be explained in more detail through Figure 6.

FIG. 6A is a side view for explaining a foldable display device according to a second embodiment of the present invention, and FIG. 6B is for explaining features of the foldable display device when it is folded.

In FIGS. 6A and 6B , the foldable display panel 100 is schematically shown with a lower panel 105 and an upper panel 205 joined to each other. At this time, the driving pad portion 1460 is provided in the protruding area of the lower plate 105, and the COF circuit portion 600 is bonded to the driving pad portion 1460 in the same manner as in the first embodiment. And as described above, the second film portion 602 may be provided to be folded in the direction of the first film portion 601.

According to FIG. 6A, in the foldable display device according to the second embodiment, the second folding portion F/A2 of the foldable display panel 100 is folded and fixed toward the back of the foldable display panel 100. . This second folding unit (F/A2) can be driven as a side display that emits light in the side direction.

As the second folding portion (F/A2) is folded and fixed toward the rear side of the foldable display panel 100, the COF circuit portion 600 bonded to the area adjacent to the second folding portion (F/A2) is The second folding portion (F/A2) is located on the back of the foldable display panel 100 in the folded direction. At this time, the COF circuit unit 600 is located in the non-folding part (N/A) between the first folding part (F/A1) and the second folding part (F/A2).

Then, even if the first folding part (F/A1) is folded as shown in FIG. 6b, the COF circuit part 600 is located on the back of the non-folding part (N/A), so that the first folding part (F/A1) Since folding stress due to folding and folding of the second folding portion (F/A2) is not transmitted, circuits bonded to the COF circuit portion 600 are protected from folding stress.

As described above, in the foldable display device according to the present invention, the COF circuit part 600 is formed to be long in the x-axis direction, and one COF film is divided into the first film part 601 and the second film part 602. By defining the driver IC 350 in the first film portion 601 and forming the touch sensing IC 610, timing controller 611, and device portion 602 in the second film portion 602, It has the characteristic of forming all driving circuits for driving the foldable display device on the one COF film.

Accordingly, in the foldable display device according to the present invention, the COF circuit part 600 is located so as not to overlap the folding part (F/A) and is located on the back of the non-folding part (N/A), so that the foldable display panel ( It has a feature that prevents folding stress from being applied to the COF circuit unit 600 when folding 100). Accordingly, the foldable display device according to the present invention has the effect of preventing defects such as disconnection by preventing the driving circuits mounted on the COF circuit unit 600 from being subjected to folding stress and improving the reliability of the driving circuits. have

The above description is merely an exemplary description of the present invention, and various modifications may be made by those skilled in the art without departing from the technical spirit of the present invention. Accordingly, the embodiments disclosed in the specification of the present invention do not limit the present invention. The scope of the present invention should be interpreted in accordance with the scope of the patent claims below, and all technologies within the equivalent scope thereof should be interpreted as being included in the scope of the present invention.

100: foldable display panel 600: COF circuit part
601: first film unit 602: second film unit
608: Connector portion 609: Film pad portion
350: Driver IC 610: Touch sensing IC
611: Timing controller 105: Bottom plate
205: Top plate 1450: Lower pad portion
1460: Driving pad part 603: Element part

Claims (10)

A foldable display panel including a driving pad portion on the outside of the display surface and at least one folding portion and a non-folding portion, and
A COF circuit part connected to the driving pad part and having a plurality of driving circuits for driving the foldable display panel mounted thereon,
The COF circuit part,
It includes a first film portion and a second film portion extending from the first film portion in the x-axis direction,
The plurality of driving circuits are,
A driver IC mounted on the first film unit to supply a driving signal to the foldable display panel, and a plurality of RLCs and diodes mounted on the second film unit;
A foldable display device in which the plurality of RLCs and the diodes are mounted using a surface mounted technology (SMT) method. delete According to claim 1,
The COF circuit part includes a film pad part connected to the driving pad part of the foldable display panel,
The first film portion and the second film portion are fixed to the foldable display panel by the film pad portion and are folded toward the back of the foldable display panel to form a back surface of the non-folding portion provided in the foldable display panel. A foldable display device located in . According to claim 1,
The foldable display panel includes a first folding part and a second folding part positioned adjacent to the COF circuit part,
The second folding unit is folded and fixed toward the rear of the foldable display panel, and the COF circuit unit is located on the rear of a non-folding unit provided between the first folding unit and the second folding unit. . According to claim 1,
A foldable display device further comprising a reinforcing material having more rigid characteristics than the COF circuit portion on the back of the second film portion. According to claim 1,
The second film portion is positioned to bend in the direction of the first film portion. According to claim 1,
The foldable display panel has a built-in touch sensor,
The driving circuit further includes a touch driving unit mounted on the second film unit to drive the touch sensor. According to claim 1,
The driving circuit further includes a timing controller mounted on the second film unit to control the driver IC. According to claim 3,
The driving circuits mounted on the second film portion are positioned to face the back of the foldable display panel,
A foldable display device in which the driving circuits mounted on the first film portion are positioned to face opposite sides from the driving circuits mounted on the second film portion. According to claim 4,
A foldable display device in which the second non-folding unit is driven as a side display that displays an image in a side direction of the foldable display panel.

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