KR102598204B1 - Smart card with LED and manufacturing method thereof - Google Patents

Abstract

The present disclosure relates to a smart card device, which includes, in order from top to bottom, a front substrate 10; a first flexible sheet (20) with a card circuit formed thereon; first substrate 30; a second flexible sheet (40) with an inductive circuit formed thereon; and a laminated core comprising a second substrate 50, wherein the front substrate 10 has at least one first opening 11 defining a perforated design and a second substrate 22 through which a contact pad 22 is exposed. Provided is an opening (12), the card circuit comprising a flip chip (21), a first antenna coil (24) conductively coupled to the flip chip (21), a contact pad (22), and a contact pad (22). ) and at least one conductor path (23) that conductively couples the flip chip (21) to the flip chip (21), wherein the inductive circuit comprises at least one LED module ( 46) and a second antenna coil (44) conductively coupled to the at least one LED module (46), wherein the first substrate (30) is arranged below the at least one first opening (11). and at least one light guide 31 configured to direct the illumination generated by at least one LED module 46 through at least one first opening 11 to illuminate the perforated design.

Description

Smart card with LED and manufacturing method thereof

Embodiments of the present invention relate to smart card devices having light emitting diode (LED) module(s), laminated cores for manufacturing such smart card devices, and methods of manufacturing the same.

Dual interface smart cards provide both direct contact and contactless interfaces to conduct transactions with contact and contactless card readers.

When performing a contactless transaction, a user typically brings a smart card close to a contactless card reader that may be integrated into a payment terminal. In many cases, the payment terminal may not be facing the user, so unless the payment terminal provides audible or visual feedback to indicate a card transaction or data communication between the card and the card reader, the user may not be aware of the card transaction or his or her smart phone. It is not immediately apparent that the card has been read.

A smart card that provides visual feedback. Although lighting has been developed, many cards provide insufficient lighting and/or suffer from other problems, such as insufficient power.

To overcome these and other problems, improved smart cards and manufacturing methods are desperately needed.

According to a first aspect of the present invention, a smart card device includes, in order from top to bottom, a front substrate; a first flexible sheet with a card circuit formed thereon; first substrate; a second flexible sheet having an inductive circuit formed thereon; and a laminate core comprising a second substrate, the front substrate providing at least one first opening defining a perforated design and a second opening exposing a contact pad; , the card circuit includes a flip chip, a first antenna coil conductively coupled to the flip chip, the contact pad, and conductively coupling the contact pad to the flip chip. comprising at least one conductive path, the inductive circuit comprising: at least one LED module arranged proximate to the at least one first opening and a second antenna coil conductively coupled to the at least one LED module; wherein the first substrate is arranged below the at least one first opening and is configured to direct illumination generated by the at least one LED module through the at least one first opening to illuminate the perforated design. Contains one light guide.

In one embodiment of the first aspect of the invention, the smart card device is arranged in a position between the second flexible sheet and the second substrate and below at least one LED module, providing illumination with at least one light. It further includes at least one reflector configured to be directed to the guide.

In one embodiment of the first aspect of the invention, the at least one light guide is: a stacked arrangement comprising a plurality of polyethylene terephthalate (PET) and/or polyvinyl chloride (PVC) layers. , a surface of at least one of the plurality of PET and/or PVC layers is roughened and arranged within a third opening formed in the first substrate; and an integral, roughened surface portion of the first substrate.

In one embodiment of the first aspect of the invention, the at least one first opening comprises a plurality of first openings defining a plurality of perforated designs, and the at least one light guide comprises a plurality of first openings. and a plurality of light guides arranged below, wherein the at least one LED module includes a plurality of LED modules arranged proximate to the plurality of first openings, and the at least one light guide includes a plurality of LED modules arranged proximate to the plurality of first openings. at least one light guide arranged below one aperture and configured to direct illumination generated by the plurality of LED modules through the plurality of first apertures to illuminate the plurality of perforated designs; The reflector of includes a plurality of reflectors arranged between the second flexible sheet and the second substrate and below the plurality of LED modules, the plurality of reflectors configured to direct illumination to the plurality of light guides.

In one embodiment of the first aspect of the invention, the at least one light guide includes a light diffusing ink layer applied to the surface of the first substrate, and the at least one LED module is positioned at an edge of the light diffusing ink layer. arranged at the edge.

In one embodiment of the first aspect of the invention, the card circuit comprises an additional LED module conductively coupled to the first antenna coil and arranged proximate to the at least one first aperture so that the at least one light guide is additional. and an additional LED module configured to additionally direct the illumination generated by the at least one first aperture.

In one embodiment of the first aspect of the present invention, in addition to at least one LED module, the smart card includes a second flexible sheet having a label formed thereon, and the second substrate having the label exposed. A fourth opening is provided.

In one embodiment of the first aspect of the invention, the first substrate includes a thermoformed projection arranged below the contact pad.

In one embodiment of the first aspect of the invention, the first substrate comprises a PVC and/or PET layer.

In one embodiment of the first aspect of the invention, at least the first substrate or the second substrate includes at least one edge portion that is at least partially transparent.

In one embodiment of the first aspect of the invention, the flip chip is arranged offset with respect to the contact pad.

In one embodiment of the first aspect of the invention, the at least one LED module is arranged offset relative to the at least one first opening.

In one embodiment of the first aspect of the invention, the front substrate includes a metallic layer.

In one embodiment of the first aspect of the invention, the at least one first opening comprises a plurality of first openings defining a plurality of perforated designs, and the at least one light guide comprises a plurality of first openings. and a plurality of light guides arranged below, wherein the at least one LED module includes a plurality of LED modules arranged proximate to the plurality of first openings, wherein the at least one light guide includes a plurality of first openings. and a plurality of light guides arranged below the aperture and configured to direct illumination generated by the plurality of LED modules through the plurality of first apertures to illuminate a plurality of perforated designs.

In one embodiment of the first aspect of the invention, the shape of the contact pad is irregular.

According to a second aspect of the invention, a method for manufacturing a smart card device includes perforating a front side substrate to form at least one first opening and at least one second opening; Forming thermoformed protrusions on the first substrate by performing thermoforming on the first substrate; From top to bottom, the front substrate, a first flexible sheet with a card circuit formed thereon, a first substrate with at least one light guide, a second flexible sheet with an inductive circuit formed thereon, and a first flexible sheet with an inductive circuit formed thereon. Forming a stacked array using two substrates, wherein the card circuit includes a flip chip, a first antenna coil conductively coupled to the flip chip, the contact pad, and the contact pad conductively coupled to the flip chip. and at least one conductor path that couples electrically to the second antenna coil, wherein the inductive circuit includes at least one LED module that is conductively coupled to the second antenna coil, wherein forming the stacked array comprises at least aligning one first aperture with the at least one light guide; and aligning the at least one second opening, contact pad, and thermoforming protrusion; and stacking the stacked array to create a stacked core.

In one embodiment of the second aspect of the invention, forming the stacked arrangement includes at least one reflector positioned between the second flexible sheet and the second substrate and below the at least one first opening. It includes the step of arranging.

In one embodiment of the second aspect of the invention, the method includes, prior to forming the stacked arrangement, perforating the first substrate to form a third opening and adding a plurality of PET and/or PVC layers to the third opening. arranging at least one light guide comprising another stacked arrangement comprising: wherein the surface of at least one of the plurality of PET and/or PVC layers is roughened; and providing at least one light guide by roughening an integral surface portion of the first substrate.

In one embodiment of the second aspect of the invention, the at least one first opening comprises a plurality of first openings defining a plurality of perforated designs, and the at least one light guide comprises a plurality of first openings. and a plurality of light guides arranged below, wherein the at least one LED module includes a plurality of LED modules arranged proximate to the plurality of first openings, and the at least one light guide includes a plurality of LED modules arranged proximate to the plurality of first openings. at least one light guide arranged below one aperture and configured to direct illumination generated by the plurality of LED modules through the plurality of first apertures to illuminate the plurality of perforated designs; The reflector of includes a plurality of reflectors arranged between the second flexible sheet and the second substrate and below the plurality of LED modules, the plurality of reflectors being configured to direct illumination to the plurality of light guides.

In one embodiment of the second aspect of the invention, prior to forming the stacked arrangement, the method includes: perforating the first substrate to form at least one third opening; and applying a light diffusing ink on the first substrate to a surface portion adjacent the at least one third opening, wherein forming the stacked arrangement includes within the at least one third opening. and receiving at least one LED module.

In one embodiment of the second aspect of the invention, the card circuit includes an additional LED module conductively coupled to the first antenna coil.

In one embodiment of the second aspect of the invention, the second flexible sheet includes a label formed thereon, and further comprising perforating the second substrate to form at least one fourth opening. , arranging the stacked arrangement includes aligning the label with at least one fourth opening.

In one embodiment of the second aspect of the invention, the invention comprises overlaying a PVC layer over a PET layer prior to performing thermoforming on the first substrate to form the thermoforming protrusions on the first substrate. It further includes providing the first substrate by overlaying.

In one embodiment of the second aspect of the invention, at least the first substrate or the second substrate includes at least one edge portion that is at least partially transparent.

In one embodiment of the second aspect of the invention, the flip chip is arranged offset relative to the contact pad.

In one embodiment of the second aspect of the invention, the at least one LED module is arranged offset relative to the at least one first opening.

In one embodiment of the second aspect of the invention, the front substrate includes a metallic layer.

In one embodiment of the second aspect of the invention, the at least one first opening comprises a plurality of first openings defining a plurality of perforated designs, and the at least one light guide comprises a plurality of first openings. and a plurality of light guides arranged below, wherein the at least one LED module includes a plurality of LED modules arranged proximate to the plurality of first openings, and the at least one light guide comprises a plurality of first openings. and a plurality of light guides arranged underneath and configured to direct illumination generated by the plurality of LED modules through the plurality of first apertures to illuminate the plurality of perforated designs.

In one embodiment of the second aspect of the invention, the method further includes dicing the laminated core to provide a plurality of smart card devices.

In one embodiment of the second aspect of the invention, the shape of the contact pad is irregular.

Embodiments of the present invention will be described in detail with reference to the attached drawings as follows.
1 is a flow chart illustrating a method of manufacturing a smart card device with an LED module;
2A-2D show various views of one embodiment;
3A-3D show various views of one embodiment;
4A-4D show various views of one embodiment;
5A-5D show various views of one embodiment;
6A-6D show various views of one embodiment;
7A-7D show various views of one embodiment;
Figures 8a and 8b show an embodiment with a transparent edge portion;
9A to 9C schematically show the arrangement of LED modules.

In the following description, numerous specific details are set forth to provide a thorough understanding of various exemplary embodiments of the invention. However, one skilled in the art will understand that embodiments of the invention may be practiced without some or all of these specific details. It should be understood that the terminology used herein is for the purpose of describing particular embodiments only and is not intended to limit the scope of the invention. In the drawings, reference labels or numbers indicate the same or similar functions or features across multiple views.

Embodiments described in the context of one device or method are similarly valid for other devices or methods. Likewise, embodiments described in relation to devices are similarly valid for methods and vice versa.

Features described in the context of an embodiment can be correspondingly applied to the same or similar features in other embodiments. Features described in the context of an embodiment can be correspondingly applied to other embodiments even if not explicitly described in these other embodiments. Furthermore, additions and/or combinations and/or alternatives as described for features in the context of an embodiment can correspondingly be applied to the same or similar features in other embodiments.

It should be understood that the articles “a,” “an,” and “the” used in connection with a feature or element include reference to one or more features or elements. The term “and/or” includes any combination of one or more related features or elements. As used in the description and claims, the terms “comprising,” “including,” “having,” and related terms are intended to be non-limiting and may include additional features or elements other than those listed. It means there is. Identifiers such as "first", "second", "third", etc. are used simply as labels and are not intended to impose numeric requirements on the entities in question, but rather to indicate the relative position or position between limits. It is not interpreted in a way that imposes temporal order. Also, as used herein, “top”, “bottom”, “side”, “under”, “over”, “front”, “ Terms such as “back” are only for convenience of explanation and refer to the direction of features or components as shown in at least some of the drawings. It should be understood that any orientation of the features described herein is within the scope of the invention. When used in relation to an element, the term "below" refers to immediately below the element, i.e. without any intervening elements or indirectly below the element, e.g. separated by another element. It is divided into different elements. The term "on" when used in relation to an element means in contact with the element, whether above or below the element.

The term “side” when used in connection with an element, for example a flexible sheet, substrate, laminated core, may include reference to the surface of the element having the largest surface area of the surfaces of the element. The term "edge", when used in relation to the same element, may include reference to the surface of the element having the lesser or smallest surface area among the surfaces of the element, such reference including the boundary of the largest surface area. can do. In the context of a smart card, the term "side" can mean the front side exposing a metal contact pad for contact mode and optionally card user details and/or the back side facing the front and possibly providing a magnetic strip. there is. In the context of smart cards, the term “edge” can generally refer to the surface across the front and back and can provide the thickness of the smart card device.

Terms such as “front” and “back” used herein are for ease of description only and when used refer to the general orientation of a feature or element. In the context of a smart card having a reverse side, the term "front" usually refers to the side of the smart card that provides metal contact pads and optionally card user details, while the term "back" usually refers to the side of the smart card that provides a magnetic strip. It means the opposite side or the other side that can be done.

The phrase “conductively coupled” and related phrases include reference to the ability to transfer electrical energy or current between elements by physical contact or an electrically conductive medium. The phrase "inductively coupled" and related phrases include reference to the ability to transfer electrical energy or current between elements by electromagnetic induction or generally changing magnetic fields, i.e., without physical contact between the elements. . The phrase “operably coupled” and related phrases include reference to “conductively coupled” or “inductively coupled.” The phrase "coupled to" in relation to an element applies to, for example, or is arranged, interlocked, or disposed of the element.

The term “reflection” includes reference to specular reflection and/or diffuse reflection.

The phrase "at least partially transparent" when used in relation to an element, for example flexible sheets and substrates, may include a reference to either: the element is homogeneously translucent (or translucent); can do; Elements can be homogeneously transparent; An element may include at least one portion that is transparent while at least another portion is translucent or opaque.

The phrase "smart card" includes transaction cards, key fobs, watches, subscriber identity modules used in mobile phones, USB-based tokens, Secure Digital (SD), mini/micro SD, multimedia cards (MMC), VQFN8, Contains references to electronic devices such as SSOP20, TSSOP20, MemorySticks cards, etc.

According to some aspects of the invention, a method of manufacturing stacked core(s) each having at least one LED module(s) and a method of manufacturing smart card(s) integrated with such stacked core(s) are provided.

According to some embodiments, a method of manufacturing a smart card device is described with reference to flow diagram 100 of FIG. 1.

At block 102, the front surface substrate is perforated to expose at least one first opening (also referred to as “first opening”) providing at least one lighting design and at least one second opening exposing a metal contact pad. or referred to as a “second opening”). The second opening may be drilled in a separate process or in the same process as forming the first opening by drilling the front substrate.

At block 104, the first substrate is thermoformed to create thermoformed protrusions on the first substrate. The thermoformed protrusions are for lifting the metal contact pads during lamination in block 112. Stacking metal templates, with openings tailored to the desired thermoforming design, on a substrate, subjecting this stacked arrangement to elevated temperatures and/or pressures, such as by lamination; and removing the metal template from the thermoformed first substrate.

At block 106, a light guide, which can be implemented in a variety of ways, is provided to the first substrate.

In examples where the light guide is provided by a stacked arrangement of polyethylene terephthalate (PET) and/or polyvinyl chloride (PVC) layers, the first substrate has at least one third opening (or “third opening”) therein. ) is perforated to form. A light guide is arranged within the third opening. For example, the light guide may be arranged to be glued, interlocked, or disposed in the third opening of the first substrate. At least the surface of one of the layers forming the light guide may be processed, for example roughened, to create surface defects or irregularities that diffuse or scatter incident light. In this example, the light guide is a separate element coupled to the first substrate.

In another example, the light guide may be provided by an integral part of the first substrate. In particular, at least one integral surface portion of at least one side of the first substrate is processed, eg, roughened, to provide surface defects or irregularities.

In another example, where the light guide is provided by a light diffusing ink, the first substrate is perforated to form therein at least one third opening that will later receive the LED module therein. Light diffusion ink is applied to the surface portion of the first substrate adjacent to the third opening.

Block 106 may occur separately or may be interchanged with block 104.

At block 108, at least one reflector is coupled to a second substrate, such as a top surface thereof, or to a second flexible sheet, such as a bottom surface thereof. In some examples, block 108 may be configured such that when performing block 110, the second substrate or second flexible sheet may have been pre-attached with a reflector prior to this block or the reflector may be attached to the second substrate or second flexible sheet. Since they can be combined, they can be omitted. In some instances, such as when the light guide is provided by light diffusing ink, the reflector may be omitted.

At block 110, a stacked or side-by-side arrangement is formed. The stacked arrangement includes, in order from top to bottom, a front substrate, a first flexible sheet with card circuitry, a first substrate with at least one light guide, a second flexible sheet with inductive circuitry, and a second substrate. do. Forming the stacked arrangement includes aligning at least one first aperture and at least one light guide; and aligning the at least one second opening, the metal contact pad of the first flexible sheet, and the thermoforming protrusion of the first substrate. Before or at this block, adhesive may be applied to at least some of the components forming the stacked arrangement.

In some examples where reflectors are desired, forming the stacked arrangement includes arranging at least one reflector at a location between the second flexible sheet and the second substrate and below the at least one first opening. do.

In some examples where the light guide is provided by a graphical light diffusing ink layer, forming the stacked arrangement includes receiving at least one LED module into at least one third opening.

At block 112, a stacked arrangement of blocks 110 is stacked to create a stacked core. During lamination, the thermoforming protrusion pushes the contact pad into the second opening of the front substrate; The light diffusion channel is formed by a juxtaposed and aligned arrangement of a reflector, a light guide, and a first aperture.

At block 114, the laminate core may be cut or diced to provide at least one individual section, e.g., an ID 1 size according to International Organization for Standardization (ISO) 7810, each individual section containing a smart card. Devices are included. Each individual section can be processed further. Personalized before issuing to consumers. In some other examples, the individual section(s) may be of different dimensions or form factors suitable for other smart or electronic devices.

It should be understood that the above-described method may be modified or changed as follows.

For example, the order of some tasks may be interchanged, performed separately, or combined. In particular, at least blocks 102, 104, 106, and 108 can be swapped; Block 102 may require a separate drilling step; The first and third openings may be drilled in a single step using a stacked arrangement of the front substrate and the first substrate; Blocks 110 and 112 can be performed without a previous block if the front and first substrates are properly pretreated.

For example, the second flexible substrate may have a label formed on it to be exposed after deposition. In this regard, the second substrate may be perforated to provide at least one fourth opening exposing the label; At block 110, forming a stacked arrangement may include aligning a feature of the second flexible sheet with at least one fourth opening of the second substrate.

For example, the stacked arrangement of blocks 110 may further include a first transparent layer and a second transparent layer arranged at the top and bottom of the stacked arrangement, respectively. In this regard, the method may further include perforating the first transparent layer to form at least one fifth opening exposing the metal contact pad. This perforation step may be performed by stacking the first transparent layer on the front substrate and then perforating this stacked arrangement to form the second and fourth openings in the same perforation step.

For example, a stacked core can provide multiple smart card devices.

Elements common to various embodiments, such as front substrate 10, first flexible sheet 20, first substrate 30, light guide 31, second flexible sheet 40, reflector ( 51), the second substrate 50, the reflector 51, and the LED modules 26, 46 are shown in FIGS. 2A to 2D, 3A to 3D, 4A to 4D, and 5A to 5D. , are explained with reference to FIGS. 6A to 6D and FIGS. 7A to 7D.

The front substrate 10 has opposing sides, e.g., an upper side and a lower side, where the upper side exposes the metal contact pad 22 of the first flexible sheet 20 and optionally includes artwork printing, the upper side The side may be disposed on the transparent layer or overlay while the bottom side may be disposed on the first flexible sheet 20 . The front substrate 10 provides at least one first opening 11 and at least one second opening 12 . Define shapes or custom designs, such as logos, trademarks, signs, symbols, and characters, to provide an illuminated design. The first opening 11 may comprise a single opening or a pattern or a plurality of openings depending on the requirements of the illuminated design. The first opening 11 allows light generated within the smart card devices 60A, 60B, 60C, 60D, 60E, 60F to illuminate therethrough and be observed with the naked eye looking at the upper side of the front substrate 10. . In the laminated core, the second opening (12) is aligned with the contact pad (22) of the first flexible sheet (20) such that the contact pad (22) allows conductive coupling with the contact smart card reader during card operation. Allow contact pad 22 to penetrate. The location of the second opening 12 is specified by the ISO specification, but the location of the first opening 11 on the front substrate 10 is generally less restricted.

In the laminated core, in the front substrate 10, the space provided by the first opening 11 is substantially filled with at least the first flexible sheet 20 and optionally an extruded portion of the first substrate 30 to achieve this extrusion. The raised portion is substantially at the same height as the upper side of the front substrate 10. The protruding portion may be formed during lamination of the stacked arrangement, during which the first flexible sheet 20 and optionally the first substrate 30 are softened and pressed due to the pressure and temperature conditions during lamination to form a front substrate ( It is pressed into the space in the first opening 11 of 10). As any additional protrusions beyond the first opening 11 are limited by the laminator plate applied to the upper side of the front substrate 10, the extruded portion is eventually substantially flush with the upper side of the front substrate 10. do.

The front substrate 10 excluding the opening may generally be opaque, but in some cases, the front substrate 10 may include at least one transparent portion. The front substrate 10 may include polyvinyl chloride (PVC) material. In some examples for manufacturing a metal smart card, the front substrate 10 may include a metallic material or be replaced with a metallic substrate.

The first flexible sheet 20 includes opposing sides, for example an upper side and a lower side, with the upper side juxtaposed to the front substrate 10 and the lower side juxtaposed to the first substrate 30 . The first flexible sheet 20 includes a conductor pattern provided or formed to perform card circuitry, such as card transaction and data communication operations. Providing or forming a circuit, such as a conductor pattern, on the flexible sheet may include dry etching a metallization layer, such as aluminum, plated on the flexible sheet. Plated aluminum on flexible sheet. Each card circuit includes at least one flip chip (21) or electronic chip, a contact pad (22), and a plurality of conductors having at least one conductor path conductively coupling the contact pad (22) to the flip chip (21). Path 23, comprising a metal coil (alternatively referred to as “first antenna coil 24”) conductively coupled to flip needle 21. Contact pad 22 provides contact-based signal transmission to a contact-based card reader, while first antenna coil 24 provides contactless signal transmission to a contactless card reader. Contact pad 22 may be formed on the top side of first flexible sheet 20 . Contact pad 22 may have dimensions and layout according to ISO or other industry standards. The contact pad 22 may be of any regular shape, for example rectangular, square, etc., as long as the pinout location of the contact pad 22 complies with ISO or other industry standards; or modified regular shapes, such as rounded rectangles, rounded squares; or may be provided as irregular or customized shapes, such as logos, trademarks, signs, symbols, characters. The irregular or customized shape may be, but is not limited to, a pattern comprising regular and/or modified regular shapes, a representation of a known object, such as a leaf, an animal. The conductor path containing the first antenna coil 24 may be formed on the top side or the bottom side of the first flexible sheet 20 . The contact pads 22, conductor paths, e.g. 23, and the first antenna coil 24 may be formed using the above-described dry etching of the metallization layer plated on the above-described first flexible sheet 20. You can. Flip chips 21 may be provided on the lower side of the first flexible sheet 20 in some examples or on the upper side in other examples. Flip chip 21 may be arranged offset relative to contact pad 22 in some examples. The offset arrangement of the contact pads 22 relative to the flip chip 21 provides a non-aligned and non-overlapping relationship. That is, the areas on the first flexible sheet 20 each defined by the contact pad 22 and the flip chip 21 are aligned along a direction transverse to the plane defined by either side of the first flexible sheet. It does not overlap and does not overlap. However, in some other examples, the flip chip 21 may be aligned relative to the contact pad 22, for example, the flip chip 21 may be placed directly below the contact pad 22 but in between. Can be separated by a flexible sheet.

The first flexible sheet 20 may be transparent or at least partially transparent. The first flexible sheet 20 may include PET material.

The first substrate 30 includes opposing sides, such as an upper side and a lower side, the upper side being juxtaposed to the first flexible sheet 20 and the lower side being juxtaposed to the second flexible sheet 40. (See FIGS. 2A to 2D, 3A to 3D, 4A to 4D, 5A to 5D, 6A to 6D, and 7A to 7D). The first substrate 30 provides a light guide 31 whose position is aligned with the first opening 11 of the front substrate 10 . Light guide 31 refers to any element configured to diffuse or scatter incident light and direct the diffused or scattered light, for example to at least one first aperture. For example, light guide 31 may include an at least partially transparent material configured to receive light through the back or side thereof, reflect light internally within light guide 31 and direct the reflected light through the front. So that diffused light is emitted through the first opening (11).

Various implementations of light guide 31 may be envisaged. In one example, light guide 31 is provided by a stacked arrangement comprising multiple PET and/or PVC layers that can be stacked together. The front and/or back surfaces of the stacked arrangement may be roughened to create surface defects or irregularities that diffuse or scatter incident light; Alternatively, at least one of the PET and/or PVC layers may be roughened. The stacked arrangement may be arranged to be glued, interlocked or disposed in the third opening of the first substrate 30 . In this example, first substrate 30 may be opaque or at least partially transparent.

In another example, the light guide may be provided by an integral part of the first substrate. In particular, at least one integral surface portion of at least one side of the first substrate is treated, eg, roughened, to provide surface defects or irregularities.

In another example (see FIGS. 7A-7D), the light guide 31 is a light diffusion ink, for example screen printed, applied to the surface area of the first substrate 30 aligned with the first opening 11. Provided by layer. Light diffusing inks may be invisible or transparent under natural or artificial light conditions or without any illumination, but will illuminate when a light source illuminates the edge of the light diffusing ink layer, creating diffuse illumination over the area to which the ink has been applied. The light diffusion ink may be a multi-component solvent-based ink. In this case, the first substrate 30 may be transparent or at least partially transparent.

The first substrate 30 further includes a protrusion 32 from the upper surface of the first substrate 30 . When the protrusion 32 is manufactured by a thermoforming process, it may be referred to as a thermoforming protrusion 32. Protrusions 32 may be manufactured by different processes. Since the protrusions 32 are intended to lift the contact pads 22 of the first flexible sheet 20 during lamination, their position on the first substrate 30 is configured to juxtapose the contact pads 22 in the lamination core. do.

In some examples, first substrate 30 may include PVC or PET material. In some other examples, first substrate 30 may include thermoformed articles of PVC material and PET material.

The second flexible sheet 40 includes opposing sides, such as an upper side and a lower side, with the upper side juxtaposed to the first substrate 30 and the lower side adjacent to the second substrate 50 and/or a reflector ( 51) is juxtaposed. The second flexible sheet 40 may include an inductive circuit, e.g., a conductor pattern, provided or formed thereon, such as by dry etching a metallization layer plated on the second flexible sheet 40. You can. The inductive circuit includes at least one LED module 46 and a second antenna coil 44, which is a metal or inductor coil conductively coupled to the at least one LED module. During operation, when the smart card device (60A, 60B, 60C, 60D, 60E, or 60F) is brought within a defined proximity of a contactless card reader to implement contactless signal transmission, the second antenna coil 44 is connected to the card reader's The oscillating magnetic field is inductively coupled and possibly with the first antenna coil 24 of the first flexible sheet 20 . This inductive coupling creates a current in the inductive circuit to actuate the LED modules 46 of the second flexible sheet 40. At the same time, the first antenna coil 24 inductively couples with the oscillating magnetic field of the card reader to generate a current in the card circuit to operate the flip chip 21 or electronic chip and any LED module 26 included in the card circuit. I order it.

The LED modules 46 and the inductive circuit may be provided on the same side or different sides of the second flexible sheet 40 and thus on the lower side of the first substrate 30 and/or the upper side of the second substrate 50 It can be buried in the side.

The second antenna coil 44 may be shorter in length and/or coil size than the first antenna coil 24. The second antenna coil 44 may be formed in a central or non-central portion of the second flexible sheet 40 and may occupy a smaller surface area compared to the first antenna coil 24 .

In one example, in addition to the LED modules 46, the second flexible sheet 40 may further include at least one reflector 51 to provide a reflective surface on the bottom surface of the second flexible sheet 40. and may include an optional heat sink to dissipate heat generated by the LED module.

The second flexible sheet 40 may be transparent or at least partially transparent. The second flexible sheet 40 may include PET material.

LED modules 26, 46 or devices may be provided as top-emitting or side-emitting. For top-emitting LED modules, the illumination direction follows the module mounting direction. For side-emitting LED modules, the illumination direction is a predefined angle with respect to the module mounting direction. The predefined lighting angle can be approximately 90 degrees, 45 degrees, or other angles as needed.

In some embodiments, one or more LED modules 46 may be provided solely by the second flexible sheet 40 ( FIGS. 2A-2D , FIGS. 3A-3D , FIGS. 5A-5D , FIGS. 6a to 6d, 7a to 7d). In operation, when the smart card device 60A, 60B, 60D, 60E, or 60F is moved into defined proximity to a contactless card reader, the current induced in the first antenna coil 24 powers the card circuitry. or operate; Substantially simultaneously, another current induced in the second antenna coil 44 powers or operates an inductive circuit comprising at least one LED module 46.

In some other embodiments, LED modules 26, 46 may be provided by both first flexible sheet 20 and second flexible sheet 40 (see FIGS. 4A-4D). In this embodiment, one or more LED modules 26 may be provided by a card circuit in the first flexible sheet 20 . The LED module 26 may be conductively coupled to a conductor pattern of the first flexible sheet 20, for example to the first antenna coil 24. During operation, when smart card device 60C is moved into defined proximity of a contactless card reader, the current induced in first antenna coil 24 powers the card circuitry and LED module(s) 26 or During operation, another current induced in the second antenna coil 44 powers or operates the LED module(s) 46. Both induced currents may operate and illuminate the LED modules 26 and 46 substantially simultaneously.

In general, the positioning of the LED modules 46 and the second antenna coil 44 on the second flexible sheet 40 is generally not limited since the card circuit is provided on the first flexible sheet 20. . This translates into generally unrestricted positioning of the illuminated design on the front board.

The second (back) substrate may include opposite sides, e.g., a top side and a bottom side, with the top side being juxtaposed to the second flexible sheet 40, while the bottom side may be juxtaposed to the transparent layer or overlay. there is. The lower side may include a magnetic strip and optional artwork printing.

Second substrate 50 may generally be opaque, but in some examples second substrate 50 may include at least one transparent portion. The second substrate 50 may include PVC material.

In some embodiments (see FIGS. 6A-6D), the second substrate 50 may provide at least one fourth opening 52 for exposing the label 47 formed on the second flexible sheet 40. You can.

The reflector 51 is configured to reflect, including by diffusing, the incident light produced by the LED modules 26, 46. The reflector 51 may comprise a metallic material, for example a metallic foil. Reflector 51 may include a flat and/or uneven reflective surface. The laminated core may include one or more reflectors 51 . In embodiments where a plurality of reflectors 51 are provided (see FIGS. 5A-5D), the reflectors 51 may be arranged in one or more locations within the stacked core depending on the number of LED modules.

The reflector (51) is provided as a separate element that can be disposed on the second substrate (50) or formed by dry etching a metallization layer plated on at least a portion of the carrier or second flexible sheet (40). It can be.

In some examples, reflector 51 may be juxtaposed with LED module 46, for example, may be in direct contact with LED module 46.

In some embodiments of the stacked core, the at least one LED module (26, 46) may be arranged in cooperation with at least one reflector and/or at least one light guide (31) such that the first opening (11) can be illuminated. You can. Directly by the LED modules 26, 46 and/or indirectly by their reflected and/or diffuse illumination. This juxtaposition of the first aperture 11, the light guide 31, and the reflector 51 creates a light diffusion channel for generating diffuse illumination at the first aperture 11 from one or more point light sources (LED modules). provides. In some embodiments where the front substrate 10, first substrate 30, and second substrate 50 are substantially opaque except for the aperture, leakage of light except through the first aperture 11 There won't be any.

In some examples, the reflector may be omitted. An example of this is shown in Figures 7A-7D where the light guide is provided by a layer of diffused ink.

2A, 3A, 4A, 5A, 6A, and 7A are exploded views of a stacked arrangement of blocks 110 according to some embodiments. To avoid obscuring the disclosure, each of these figures shows various layers with components to produce a single smart card device after lamination and optional cutting, but each layer can be used to create multiple smart card devices after lamination and selective cutting. It should be understood that an array of the components shown may be provided to produce a card device. FIGS. 2B, 3B, 4B, 5B, 6B, and 7B illustrate stacked cores of blocks 112 or 114 or smart card devices according to some embodiments. Figures 2C, 3C, 4C, 5C, 6C, and 7C show front views of the smart card device, and Figures 2D, 3D, 4D, 5D, 6D, and 7C respectively show front views of the smart card device. Shows the rear view of .

2A shows a front substrate 10, a first flexible sheet 20 with a card circuit, a first substrate 30 integrated with at least one light guide 31, an inductive circuit and at least one reflector 51. ) shows an exploded view of a stacked arrangement including a second substrate 50 arranged together. In this arrangement, one LED module 46 is provided on the second flexible sheet 40 and has a conductor pattern formed on the second flexible sheet 40, for example conductive to the second antenna coil 44. are combined.

FIG. 2B shows a partially simplified cross-sectional view of smart card device 60A that may result from the arrangement of FIG. 2A. The LED module 46 is embedded in the upper side of the second substrate 50. The LED module 46 and reflector 51 are arranged below and/or near the first opening 11 of the front substrate 10 . The light or illumination generated by the LED module 46 is reflected by the reflector 51. The reflected light passes at least through the light guide 31, the first flexible sheet 20, and the first opening 11 of the front substrate 10. The light guide 31 is configured to generate diffuse reflection from the illumination of the LED modules 46 and direct the diffused and reflected illumination through the upper side towards the first opening 11 of the front substrate 10 . In this way, the illumination seen from the first opening 11 of the front substrate 10 is diffused.

Figures 2C and 2D show top and bottom views, respectively, of smart card device 60A that can be created from Figure 2A. The top view shows the illuminateable design provided by the first opening 11 .

3A shows a front substrate 10, a first flexible sheet 20 with a card circuit, a first substrate 30 integrated with at least one light guide 31, a second flexible sheet with an inductive circuit ( 40 ), and a second substrate 50 arranged with at least one reflector 51 . In this arrangement, two LED modules 46 are provided on the second flexible sheet 40 and conductively coupled to a conductor pattern formed on the second flexible sheet 40, e.g., the second antenna coil 44. do.

FIG. 3B shows a partially simplified cross-sectional view of smart card device 60B that may result from the arrangement of FIG. 3A. The LED module 46 is embedded in the upper surface of the second substrate 50, otherwise the relative arrangement of the LED module 46, reflector 51, and first opening 11 is similar to that in Figure 2b. It will not be repeated. FIGS. 3C and 3D show top and bottom views, respectively, of smart card device 60B that can be created from FIG. 3A. The top view shows the illuminateable design provided by the first opening 11 .

4A shows a front substrate 10, a first flexible sheet 20 with a card circuit, a first substrate 30 integrated with at least one light guide 31, a second flexible sheet with an inductive circuit ( 40 ), and a second substrate 50 arranged with at least one reflector 51 . In this arrangement, at least one LED module 26 is provided on the first flexible sheet 20 and in a conductor pattern formed on the first flexible sheet 20, for example in the first antenna coil 24. are conductively coupled. Additionally, at least one LED module 46 is provided on the second flexible sheet 40 and is conductively coupled to a conductor pattern formed on the second flexible sheet 40, for example a second antenna coil 44. .

FIG. 4B shows a partially simplified cross-sectional view of smart card device 60C that may result from the arrangement of FIG. 4A. One LED module 26 is embedded in the upper side of the first substrate 30 and the other LED module 46 is embedded in the upper side of the second substrate 50, otherwise, the LED module 46, the reflector (51), and the relative rice row of the first opening 11 is similar to the arrangement of Figures 2b and 3b and is not repeated. Figures 4C and 4D show top and bottom views, respectively, of smart card device 60C that can be created from Figure 4S. The top view shows the illuminateable design provided by the first opening 11 .

5A shows a front substrate 10, a first flexible sheet 20 with a card circuit, a first substrate 30 integrated with a plurality of light guides 31, and a second flexible sheet 40 with an inductive circuit. ), and a second substrate 50 on which a plurality of reflectors 51 are arranged. In this arrangement, a number of LED modules 46 are provided on the second flexible sheet 40 and are conductively coupled to a conductor pattern formed on the second flexible sheet 40, for example a second antenna coil 44. .

FIG. 5B shows a partially simplified cross-sectional view of smart card device 60D that may result from the arrangement of FIG. 5A. A plurality of LED modules 46 are embedded in the upper side of the second substrate 50, otherwise the relative arrangement of the LED modules 46, reflectors 51, and first openings 11 is as in the previous figure. It's similar so I won't repeat it. Figures 5C and 5D show top and bottom views, respectively, of smart card device 60D that can be created from Figure 5A. The top view shows a plurality of illuminateable designs provided by a plurality of first openings 11 . In this embodiment, a set of LED modules 46, light guides 31 and reflectors 51 are shown positioned to illuminate each design at a corner of the smart card 1. However, other variations are possible, for example, a set of one LED module 46, light guide 31, and reflector 51 can illuminate more than one design; A set of multiple LED modules 46, at least one light guide 31, and at least one reflector 51 can illuminate a design; A combination of these is possible.

Figure 6a shows an exploded view of a stacked arrangement similar to Figure 2a, but the second flexible sheet 40 additionally includes a label 47 that will be exposed on the bottom or back side of the stacked core after lamination. FIG. 6B shows a partially simplified cross-sectional view of smart card device 60E that may result from the arrangement of FIG. 6A. One LED module 46 is embedded in the upper side of the second substrate 50, otherwise the relative arrangement of the LED module, reflector 51, and first opening 11 is similar to that in FIG. 2B. It will not be repeated. Figures 6C and 6D show top and bottom views, respectively, of smart card device 60E that can be created from Figure 6A. The top view shows the illuminateable design provided by the first opening 11 . The bottom view shows the label 47 formed on the second flexible sheet 40 but exposed or visible through the fourth opening 52 . Examples of such labels 47 include security features, security holograms, logos, or other authentication features.

Figure 7a shows an exploded view of a stacked array largely similar to Figure 3a but with the following modifications. In the arrangement of FIG. 7A, the first substrate 30 has thermoformed protrusions 32, a light guide 31 with light diffusing ink applied on the surface area of the first substrate 30, and an edge of the diffusing ink area. It includes at least two third openings 72 formed in the field. The second flexible sheet 40 includes an inductive circuit with two LED modules 46 aligned with at least two third openings 72 . When the first substrate 30 and the second flexible sheet 40 are stacked, the LED modules 46 are arranged within the at least two third openings 72. Upon deposition of the stack arrangement (see block 110), the first substrate 30 is softened and a portion of it conforms around the two LED modules 46. Accordingly, in the resulting stacked core, two LED modules 46 can be juxtaposed in the light guide 31, i.e. in the area where the diffusion ink is applied. In the arrangement of Figure 7A, no reflector is needed between the second flexible sheet 40 and the second substrate 50.

Diffusion inks can be used as light guides for any of FIGS. 2A-2D, 3A-3D, 4A-4D, 5A-5D, and 6A-6D, examples of which include the second flexible A reflector is disposed between the sheet 40 and the second substrate 50.

In various embodiments, including those illustrated in the figures and/or described herein, first substrate 30 and/or second substrate 50 may be at least partially transparent at at least one edge portion. At least one reflector may optionally be provided to reflect illumination from the LED module towards the at least partially transparent edge portion. The edge portion can be illuminated by an LED module that also illuminates the first opening 11 or by a dedicated LED module. Therefore, in addition to illuminating the custom design through the first opening 11 of the front substrate 10, it is possible to illuminate edge portions of the first substrate 30 and/or the second substrate 50. In some examples, all four edges may be illuminated. In some examples, the opposite edge may be illuminated. In some examples adjacent edges may be illuminated. Figure 8a shows a partially simplified cross-sectional view of a smart card device with a first flexible sheet 20 and LED modules 26 provided by a reflector 51, which are illuminated by a transparent edge portion 39 of the first flexible sheet. ) (see dashed box). Figure 8b shows a partially simplified cross-sectional view of a smart card device as shown in Figures 3b to 3d, with an LED module 46 provided by a reflector 51 and a second flexible sheet 40 arranged to illuminate. and is arranged to illuminate the transparent edge portion 39 (see dashed box) of the first substrate 30.

In various embodiments, including those shown in the figures and/or described herein, multiple LED modules may be provided. 9A-9C are schematic plan views of an arrangement of LED modules 96 for the design to be illuminated. Although not shown, it should be understood that the design may be arranged on the front substrate 10 while the LED modules 96 may be embedded in the first and/or second substrate 50 . In Figure 9A, the triangular design can be illuminated by three LED modules 96 arranged on three sides of the design. In Figure 9b, the square design can be illuminated by four LED modules 96 arranged on four sides of the design. 9C, multiple LED modules 96 may be arranged along the length of the elongated design.

In various embodiments, including those illustrated in the drawings and/or described in this disclosure, multiple LED modules and/or reflective surfaces may be provided and arranged to each provide or enable a plurality of light emission and/or reflection. . and/or the other direction. In particular, the combination of light emission from various LED modules may be multidirectional, including opposite directions. In some examples, top-emitting LED modules may be mounted on the first and second flexible sheets so that the light emission directions are opposite. In some examples, side emitting type LED modules may be directed toward opposite and/or adjacent edges. In combination with these or other examples, the reflectors may also be arranged to face multiple and/or different directions, including opposite directions. In some examples, reflectors may be arranged on the top and bottom sides of the first substrate such that light from at least a portion of the LED module undergoes multiple reflections through the first substrate before traveling through at least one edge of the stacked core. there is. It is a smart card. In some examples, the reflector is positioned on top of the first substrate such that light from at least a portion of the LED module undergoes multiple reflections through the first substrate before the reflected light travels through at least one edge of a stacked core that is a smart card. It may be arranged on the side and lower side of the second substrate. In some other examples, arrangements of LED modules and reflectors as described in the preceding examples may be combined.

In various embodiments, including those illustrated in the figures and/or described in this disclosure, the bottom surface of the second (back) substrate may include a custom design to be illuminated by LED module(s) arranged within the stacked core. You can. Accordingly, the second substrate may provide at least a sixth opening to provide at least one illuminateable design. In some examples, this custom design may be identical to or complement a custom design provided on the upper side of the front board such that the lights of both designs convey an aggregate or combined design.

In various embodiments, including those illustrated in the figures and/or described herein, the LED module may be activated to communicate a state or condition of the smart card device, e.g., operating conditions in contactless mode, performance of a transaction, etc. You can. In some examples, different colors may be used to distinguish states or conditions. In some examples, different portions of the second stacked core, which is a smart card, may be illuminated to distinguish the state or condition being conveyed. For example, a custom design may be illuminated to indicate a normal operating state in contactless mode while at least one edge of the smart card device may alternatively or additionally be illuminated to indicate a successful transaction.

Embodiments of the present invention provide several advantages including, but not limited to:

Using one or more reflectors increases the illuminated area and thus illuminates the design more evenly. In the case of a custom design, for example, the first aperture 11 has an illumination area much larger than the illumination area of the LED module, so if a single LED module (point light source) is used without a reflector, the custom design may not be illuminated evenly. You can. Therefore, using one or more reflectors creates diffused illumination, increasing the illumination area and allowing for more even illumination of the custom design.

Additionally, the use of one or more reflectors increases the reflected propagation distance of light, allowing LED modules placed on non-edge portions of the stacked core to illuminate the edge portions. By arranging multiple reflectors to face each other, the illuminance and the reflection propagation distance of light can be further increased.

Moreover, an arrangement of one or more reflectors adjacent to or juxtaposed to the LED module(s) provides a heat sink(s) for dissipating heat generated by the LED module(s). This prevents overheating and failure of the LED module.

The use of light guides contributes to creating diffuse illumination, increasing the illuminated area to illuminate custom designs more evenly.

In some embodiments, the LED module(s) may be arranged offset, for example for a custom design. That is, the LED module(s) may not be aligned with the first aperture(s) such that the LED module(s) are not visible through the first aperture(s). This offset arrangement, combined with the diffusion effect created by the reflector and light guide, is advantageous for creating uniform, diffuse illumination of custom designs.

The use of an inductive circuit to induce current to operate the LED module(s) 46 allows the current to flow through the card antenna, e.g., first antenna coil 24, to be amplified or boosted in the inductive circuit. . This amplified current allows operation of multiple LED modules instead of a single LED module and/or allows use of LED modules of higher power or lighting ratings.

Additionally, in some embodiments, the card circuitry for operating the flip chip and the inductive circuitry for operating the LED module are provided by different or multiple flexible sheets separated by the first substrate. This is advantageous in providing a more stable operating frequency to enable contactless communication with card readers to meet the technical specifications of the market. Additionally, since the second flexible sheet does not include other circuitry, for example in a card circuit, the positioning of the LED modules and the second antenna coil 44 on the second flexible sheet 40 is generally unrestricted. No. This increases flexibility, space, and LED module location selection and allows additional LED modules to be installed at other locations on the second flexible sheet. This provides greater flexibility when placing lightable designs on the front board.

Side-emitting LED modules tilted at approximately 90 degrees to the mounting direction allow the emitted light to travel to the edge of the substrate or laminated core.

In some embodiments where the contact pads and the flip chip are not aligned and do not overlap, this offset arrangement interfaces the contact pads with a contact reader, reducing the risk of damage to the flip chip even with repeated use.

A thermoformed protrusion is provided on the first substrate to raise the contact pad into the second opening in the front substrate. Thermoformed protrusions are useful for reducing the lamination time as well as the pressure applied to the LED module during the hot lamination process (block 112 in FIG. 1), thereby reducing the potential for damage to the LED module and increasing output yield.

In some embodiments, the first substrate is thermoformed from a PVC layer and a PET layer. If the stacking time is long, the LED module may be damaged due to heat, so it is advantageous to reduce the stacking time.

Security features of the second flexible seat, e.g. In some embodiments, where the security hologram is exposed through the second (back) substrate, a security feature is formed in the second flexible sheet and integrated within the laminated core, i.e. between the first and second substrates, to ensure the authenticity of the smart card device. and effectiveness is improved. This is advantageous in preventing smart card fraud.

In embodiments, the components are formed or fabricated on flexible sheets, such as first flexible sheet 20 and second flexible sheet 40. This makes it advantageous to integrate electrical and electronic components, conductive and radio frequency paths within a single layer or two layers, reducing production costs and increasing reliability as too many individual components can lead to weaknesses in the assembly process and final product form. .

It should be understood that the foregoing embodiments and features are to be regarded as illustrative and not restrictive. Many other embodiments will be apparent to those skilled in the art from consideration of the specification and practice of the invention. Additionally, specific terminology is used for clarity of description and not to limit the disclosed embodiments of the invention.

Claims (48)

As a smart card device (60A, 60B, 60C, 60D, 60E, 60F),
From top to bottom, front board (10); a first flexible sheet 20 with a card circuit formed thereon; first substrate 30; a second flexible sheet (40) with an inductive circuit formed thereon; and a laminated core comprising a second substrate 50,
The front substrate (10) provides at least one first opening (11) defining a perforated design and a second opening (12) through which a contact pad (22) is exposed,
The card circuit includes: a flip chip 21, a first antenna coil 24 conductively coupled to the flip chip 21, the contact pad 22, the contact pad comprising at least one conductor path (23) conductively coupling (22) to the flip chip (21),
The induction circuit includes at least one LED module 46 arranged proximate to the at least one first opening 11 and a second antenna coil conductively coupled to the at least one LED module 46. 44), including
The first substrate 30 is arranged below the at least one first opening 11 and emits the at least one LED module through the at least one first opening 11 to illuminate the perforated design. Comprising at least one light guide (31) configured to direct the illumination generated by 46),
The laminated core further comprises: at least one reflector (51) arranged at a position between the second flexible sheet (40) and the second substrate (50) and below the at least one LED module (46). and wherein the at least one reflector (51) is configured to direct the illumination to the at least one light guide (31). According to claim 1,
The at least one light guide 31:
A stacked arrangement comprising a plurality of polyethylene terephthalate (PET) layers, a plurality of polyvinyl chloride (PVC) layers, or both, wherein at least one of the plurality of PET layers and the plurality of PVC layers a stacked arrangement, the surface of which is roughened and arranged within a third opening (72) formed in the first substrate (30); and
A smart card device (60A, 60B, 60C, 60D, 60E, 60F) comprising any one of the integral, roughened surface portions of the first substrate (30). According to claim 1,
said at least one first opening (11) comprising a plurality of first openings (11) defining a plurality of perforated designs,
The at least one light guide (31) includes a plurality of light guides arranged below the plurality of first openings,
The at least one LED module (46) includes a plurality of LED modules arranged proximate to the plurality of first openings,
The at least one light guide 31 is arranged below the plurality of first openings and directs illumination generated by the plurality of LED modules through the plurality of first openings to illuminate the plurality of perforated designs. Comprising a plurality of light guides configured to direct,
The at least one reflector (51) includes a plurality of reflectors arranged between the second flexible sheet (40) and the second substrate (50) and below the plurality of LED modules, the plurality of reflectors comprising: A smart card device (60A, 60B, 60C, 60D, 60E, 60F), configured to direct the illumination to the plurality of light guides. According to claim 1,
The at least one light guide 31 includes a light diffusion ink layer applied to the surface of the first substrate 30, and the at least one LED module 46 is located at an edge of the light diffusion ink layer. Arranged in smart card devices (60A, 60B, 60C, 60D, 60E, 60F). The method according to any one of claims 1 to 4,
The card circuit is conductively coupled to the first antenna coil 24 and arranged close to the at least one first opening 11 so that the at least one light guide 31 is illuminated by an additional LED module. Smart card device (60A, 60B, 60C, 60D, 60E, 60F), comprising an additional LED module, configured to additionally direct the generated illumination to said at least one first opening (11). The method according to any one of claims 1 to 4,
The second flexible sheet (40) includes a label (47) formed thereon, and the second substrate (50) provides a fourth opening through which the label (47) is exposed. 60A, 60B, 60C, 60D, 60E, 60F). The method according to any one of claims 1 to 4,
The smart card device (60A, 60B, 60C, 60D, 60E, 60F), wherein the first substrate (30) includes a thermoformed projection (32) arranged below the contact pad (22). The method according to any one of claims 1 to 4,
A smart card device (60A, 60B, 60C, 60D, 60E, 60F), wherein the first substrate (30) includes a PVC layer, a PET layer, or both. The method according to any one of claims 1 to 4,
A smart card device (60A, 60B, 60C, 60D, 60E, 60F), wherein at least the first substrate (30) or the second substrate (50) includes at least one edge portion that is at least partially transparent. The method according to any one of claims 1 to 4,
A smart card device (60A, 60B, 60C, 60D, 60E, 60F), wherein the flip chip (21) is arranged offset with respect to the contact pad (22). The method according to any one of claims 1 to 4,
Smart card device (60A, 60B, 60C, 60D, 60E, 60F), wherein the at least one LED module (46) is arranged offset relative to the at least one first opening (11). The method according to any one of claims 1 to 4,
A smart card device (60A, 60B, 60C, 60D, 60E, 60F), wherein the front substrate (10) includes a metallic layer. According to claim 1 or 4,
said at least one first opening (11) comprises a plurality of first openings defining a plurality of perforated designs,
The at least one light guide (31) includes a plurality of light guides arranged below the plurality of first openings,
The at least one LED module (46) includes a plurality of LED modules arranged proximate to the plurality of first openings,
The at least one light guide 31 is arranged below the plurality of first openings and directs illumination generated by the plurality of LED modules through the plurality of first openings to illuminate the plurality of perforated designs. A smart card device (60A, 60B, 60C, 60D, 60E, 60F), comprising a plurality of light guides configured to direct. The method according to any one of claims 1 to 4,
Smart card devices 60A, 60B, 60C, 60D, 60E, 60F, wherein the shape of the contact pad 22 is irregular. A method for manufacturing a smart card device (60A, 60B, 60C, 60D, 60E, 60F), comprising:
The above method is:
perforating the front surface substrate (10) to form at least one first opening (11) and at least one second opening (12);
Forming thermoformed protrusions 32 on the first substrate 30 by performing thermoforming on the first substrate 30;
From top to bottom, the front substrate 10, the first flexible sheet 20 with a card circuit formed thereon, the first substrate 30 with at least one light guide 31, and the first flexible sheet 20 with a card circuit formed thereon. forming a stacked arrangement using a second flexible sheet (40) with inductive circuitry and a second substrate (50), wherein the card circuit comprises: a flip chip (21); a first antenna coil (24) conductively coupled to a first antenna coil (24), a contact pad (22), and at least one conductor path (23) conductively coupling the contact pad (22) to the flip chip, The inductive circuit comprises at least one LED module (46) conductively coupled to the second antenna coil (44),
Forming the stacked arrangement includes: aligning the at least one first opening (11) and the at least one light guide (31); aligning the at least one second opening (12), the contact pad (22) and the thermoforming protrusion (32); and arranging at least one reflector (51) at a position between the second flexible sheet (40) and the second substrate (50) and below the at least one first opening (11). , step; and
A method comprising stacking the stacked array to create a stacked core. 16. The method of claim 15, wherein prior to forming the stacked arrangement, the method further comprises:
Another stacked arrangement wherein the first substrate (30) is perforated to form a third opening (72), the third opening (72) comprising a plurality of PET layers, a plurality of PVC layers, or both. Arranging the at least one light guide (31) comprising: a surface of at least one of the plurality of PET layers and the plurality of PVC layers is roughened; and
The method further comprising providing the at least one light guide (31) by roughening an integral surface portion of the first substrate (30). According to claim 15,
said at least one first opening (11) comprises a plurality of first openings defining a plurality of perforated designs,
The at least one light guide (31) includes a plurality of light guides arranged below the plurality of first openings,
The at least one LED module (46) includes a plurality of LED modules arranged proximate to the plurality of first openings,
The at least one light guide 31 is arranged below the plurality of first openings and directs illumination generated by the plurality of LED modules through the plurality of first openings to illuminate the plurality of perforated designs. Comprising a plurality of light guides configured to direct,
The at least one reflector (51) includes a plurality of reflectors arranged between the second flexible sheet (40) and the second substrate (50) and below the plurality of LED modules, the plurality of reflectors comprising: and directing the illumination to the plurality of light guides. According to claim 15,
Before forming the stacked arrangement, the method includes:
drilling said first substrate (30) to form at least one third opening (72); and
further comprising applying light diffusion ink on the first substrate (30) to a surface portion adjacent to the at least one third opening (72),
The method of claim 1, wherein forming the stacked arrangement includes: receiving the at least one LED module (46) within the at least one third opening (72). The method according to any one of claims 15 to 18,
wherein the card circuit includes an additional LED module conductively coupled to the first antenna coil (24). The method according to any one of claims 15 to 18,
The second flexible sheet (40) includes a label (47) formed thereon,
The above method is:
further comprising perforating the second substrate (50) to form at least one fourth opening,
The method of claim 1, wherein arranging the stacked arrangement comprises: aligning the label (47) with the at least one fourth opening. The method according to any one of claims 15 to 18,
Before performing thermoforming on the first substrate 30 to form the thermoforming protrusion 32 on the first substrate 30,
The above method is:
The method further comprising providing the first substrate (30) by overlaying a PVC layer on a PET layer. The method according to any one of claims 15 to 18,
At least the first substrate (30) or the second substrate (50) includes at least one edge portion that is at least partially transparent. The method according to any one of claims 15 to 18,
The flip chip (21) is arranged offset relative to the contact pad (22). The method according to any one of claims 15 to 18,
The method according to claim 1, wherein the at least one LED module (46) is arranged offset relative to the at least one first opening (11). The method according to any one of claims 15 to 18,
The method of claim 1, wherein the front substrate (10) comprises a metallic layer. The method of claim 15 or 18,
said at least one first opening (11) comprises a plurality of first openings defining a plurality of perforated designs,
The at least one light guide (31) includes a plurality of light guides arranged below the plurality of first openings,
The at least one LED module includes a plurality of LED modules arranged proximate to the plurality of first openings,
The at least one light guide 31 is arranged below the plurality of first openings and directs illumination generated by the plurality of LED modules through the plurality of first openings to illuminate the plurality of perforated designs. A method comprising a plurality of light guides configured to direct. The method according to any one of claims 15 to 18,
The method further comprising dicing the stacked core to provide a plurality of smart card devices (60A, 60B, 60C, 60D, 60E, 60F). The method according to any one of claims 15 to 18,
The shape of the contact pad (22) is irregular. According to claim 5,
Smart card device (60A, 60B, 60C, 60D, 60E, 60F), wherein the flip chip (21) is arranged offset relative to the contact pad (22). According to claim 6,
Smart card device (60A, 60B, 60C, 60D, 60E, 60F), wherein the flip chip (21) is arranged offset relative to the contact pad (22). According to claim 7,
Smart card device (60A, 60B, 60C, 60D, 60E, 60F), wherein the flip chip (21) is arranged offset relative to the contact pad (22). According to claim 8,
Smart card device (60A, 60B, 60C, 60D, 60E, 60F), wherein the flip chip (21) is arranged offset relative to the contact pad (22). According to clause 9,
Smart card device (60A, 60B, 60C, 60D, 60E, 60F), wherein the flip chip (21) is arranged offset relative to the contact pad (22). According to claim 5,
Smart card device (60A, 60B, 60C, 60D, 60E, 60F), wherein the at least one LED module (46) is arranged offset relative to the at least one first opening (11). According to claim 6,
Smart card device (60A, 60B, 60C, 60D, 60E, 60F), wherein the at least one LED module (46) is arranged offset relative to the at least one first opening (11). According to claim 7,
Smart card device (60A, 60B, 60C, 60D, 60E, 60F), wherein the at least one LED module (46) is arranged offset relative to the at least one first opening (11). According to claim 8,
Smart card device (60A, 60B, 60C, 60D, 60E, 60F), wherein the at least one LED module (46) is arranged offset relative to the at least one first opening (11). According to clause 9,
Smart card device (60A, 60B, 60C, 60D, 60E, 60F), wherein the at least one LED module (46) is arranged offset relative to the at least one first opening (11). According to claim 10,
Smart card device (60A, 60B, 60C, 60D, 60E, 60F), wherein the at least one LED module (46) is arranged offset relative to the at least one first opening (11). According to claim 19,
The flip chip (21) is arranged offset relative to the contact pad (22). According to claim 20,
The flip chip (21) is arranged offset relative to the contact pad (22). According to claim 21,
The flip chip (21) is arranged offset relative to the contact pad (22). According to claim 22,
The flip chip (21) is arranged offset relative to the contact pad (22). According to claim 19,
The method according to claim 1, wherein the at least one LED module (46) is arranged offset relative to the at least one first opening (11). According to claim 20,
The method according to claim 1, wherein the at least one LED module (46) is arranged offset relative to the at least one first opening (11). According to claim 21,
The method according to claim 1, wherein the at least one LED module (46) is arranged offset relative to the at least one first opening (11). According to claim 22,
The method according to claim 1, wherein the at least one LED module (46) is arranged offset relative to the at least one first opening (11). According to claim 23,
The method according to claim 1, wherein the at least one LED module (46) is arranged offset relative to the at least one first opening (11).