KR102559856B1 - Glass plate side processing method and processing device using non-contact heating member - Google Patents

Abstract

The present invention relates to a method and apparatus for processing the side of a glass sheet, and more particularly, to a method and apparatus for processing the side of a thin glass.
The glass side surface processing method according to the present invention is characterized by contacting a glass substrate while heating a rotating heating member using light.

Description

Glass plate side processing method and processing device using non-contact heating member

The present invention relates to a method and apparatus for processing a side surface of a glass sheet, and more particularly, to a method and apparatus for processing a side surface of a glass using a heating member.

As displays become larger, demand for large-sized thin glass is increasing. In the case of large glass, laser cutting is suitable, but the cut surface is not smooth, so additional processing is required. When scribing the cut surface, a clean cross section can be obtained, but a large amount of fine glass dust generated during the scribing process causes health, environmental, and process problems.

Korean Patent Publication No. 10-2013-0081541 discloses a method of smoothly cutting a corner of a glass substrate by heat transfer by contacting an electrically heated horseshoe-shaped member to a corner of a cooled glass substrate. Although this method can prevent the generation of fine glass dust, it has a disadvantage in that it is difficult to adjust the contact pressure between the heating member and the glass substrate due to thick wires connected to the heating member.

Korean Patent Publication No. 10-2014-0017855 discloses a method of cutting a corner portion by press-contacting a high-frequency induction-heated needle-type heating member to a corner of a cooled glass. Since the high-frequency induction heating method wraps the heating member with a light coil, it is advantageous in controlling the contact pressure between the heating member and the glass substrate compared to the electric heating method fixed to a thick wire. However, the coil surrounding the heating member still interferes with the precise control of the heating member, and acts as a serious problem in the case of micro-machining requiring precise control in micron units.

In addition, the high-frequency induction heating method is made of a heating member made of ceramic containing a metal component so that induction heating can be performed and can withstand high temperatures. Since the diameter from the central axis to the circumferential surface is different for each part due to non-uniform mixing of the metal component and the ceramic, the contact pressure varies depending on the contact position. Since such non-uniform contact pressure causes dimensional errors during micro-machining, there is a restriction that the glass should be brought into contact with only one point of the heating member.

Moreover, when processing rectangular glass for use in a display by pressing and contacting it with a heating member, the processing ends at the area where the contact starts for processing. Since the glass properties of the area where the contact starts changes due to heat, even if it is reprocessed at the end of the processing, it is difficult to obtain a uniform and smooth surface.

An object to be solved by the present invention is to provide a new processing method capable of solving the problem of a complicated device structure occurring during electric heating.

Another problem to be solved by the present invention is to provide a new processing method capable of solving the problem of non-uniform expansion of a heating member during high-frequency induction heating.

Another problem to be solved by the present invention is to provide a new processing method capable of reducing the non-uniformity of the processing start point that occurs during display type glass processing.

Another problem to be solved by the present invention is to solve the problem of complicated device structure during electric heating, the problem of non-uniform expansion of the heating member during high-frequency induction heating, and the non-uniformity of the processing start point that occurs during processing of display type glass. It is to provide a new glass processing apparatus.

Terms

'Heating member' means a member to be heated.

content of invention

In order to solve the above problems, the present invention

Provided is a glass substrate processing method characterized in that the rotating heating member heated by light is in contact with the side surface of the glass plate material for processing.

Although not limited theoretically, when the rotating heating member is brought into contact with the glass while heating, the physical force due to rotation and the cutting of the glass due to heat transfer are combined to enable smooth and accurate glass processing, and glass of various thicknesses from ultra-thin substrates to thin substrates can be processed without cooling, and non-contact heating by light enables free rotation of the heating member, so that rotation of the heating member prevents cooling and contraction of the heating member due to contact with the glass and resulting processing bias. there will be

In the present invention, the heating member may use a metal or ceramic member, preferably prevent oxidation in the air and use a ceramic member. The ceramic member may be a non-metallic ceramic member that does not contain a metal component so as to have a uniform coefficient of thermal expansion.

In the present invention, the heating member may be a round rod-shaped member, preferably a round rod having a circular cross section of the same diameter extending vertically so that the distance from the center to the outer surface at various contact points can be kept constant.

In the implementation of the present invention, a groove having a predetermined depth may be formed on the surface of the round bar member to increase the glass cutting speed. The depth of the groove may be adjusted as needed, and may preferably have a depth of 10 to 1,000 microns.

In the practice of the present invention, the cross section of the groove may be U-shaped or V-shaped, and may be formed while extending from top to bottom in the form of a thread on the surface of the round rod-shaped member.

In the present invention, the heating member can adjust the rotational speed within a range in which heat transfer and rotational force can be harmonized. When rotating at too low speed, processing by heat transfer is excessive, making accurate dimensional processing difficult. When rotating at too high speed, processing by physical rotation of the heating member may be performed without the effect of heat transfer.

In the practice of the present invention, the heating member may be rotated at a speed of 1 to 1,000 RPM, preferably at a speed of 10 to 100 rpm.

In one embodiment of the present invention, rotation of the heating member may be made by a motor, and the rotational speed may be controlled by a control unit.

In the present invention, the light for heating the heating member may be ultraviolet rays, visible rays, or infrared rays, and preferably, infrared rays that facilitate heating of the member may be used.

In the present invention, the infrared rays refer to long-wavelength light having a wavelength of 720 nm or more, and the infrared rays may be near infrared rays, mid-infrared rays, or far infrared rays, and preferably may be far infrared rays having a wavelength of 800 nm or more.

In the present invention, the infrared rays may be infrared rays emitted from an infrared irradiation device installed at a predetermined distance from the heating member.

In the present invention, the infrared irradiation device may consist of one or more irradiation devices, preferably two or three infrared irradiation devices.

In the present invention, the heating member may be heated up to 800 ° C. or higher by infrared rays emitted from an infrared irradiator, preferably 900 ° C. or higher, more preferably 1,000 ° C. or higher, even more preferably 1,100 ° C., and most preferably 1,200 ° C. or higher, for example, may be heated to 1,200 ~ 2,000 ° C.

In the present invention, the glass substrate may be an ultra-thin or thin glass substrate having a thickness ranging from 10 to 1,000 microns. The ultra-thin glass substrate may be a glass substrate having a thickness of 100 microns or less. The ultra-thin glass substrate may preferably have a thickness of 90 microns or less, more preferably 80 microns or less, even more preferably 70 microns or less, and most preferably 50 microns or less. In a preferred embodiment of the present invention, the thickness of the ultra-thin glass substrate may be 10 microns, 20 microns, 30 microns, 40 microns, or 50 microns.

In the present invention, the side surface of the glass substrate may be processed, and preferably, the glass substrate and the round bar heating member are disposed vertically so that the side surface of the glass substrate may be processed by contacting the rim of the rotating round bar heating member.

In the present invention, the contact means that the glass and the heated member are in physical contact, and are substantially brought into contact by applying weak pressure so as to adjust the width cut from the glass. In a preferred practice of the present invention, the contact between the heating member and the glass is preferably pressurized at a pressure of about 0.05-3.0 Kgf/cm 2 , more preferably about 0.5-1.5 Kgf/cm 2 .

In the present invention, the side of the glass substrate may be a side cut by a cutting device, for example, a cross section cut by a laser.

In the present invention, the glass substrate may be at a low temperature or room temperature, and since it is processed by rotation and contact of a heated heating member, it can be processed in a state maintained at room temperature without additional cooling.

In one aspect, the present invention

heating the cylindrical heating member using light;

rotating the heated cylindrical heating member;

contacting the rotating heated cylindrical heating member to a side surface of a glass substrate; and

It provides a side processing method of a glass substrate comprising the step of relatively moving the glass substrate and the heated cylindrical heating member in a state of contact.

In one aspect, the present invention

rotating heating element

A light irradiation device for heating the rotating heating member;

A glass processing apparatus including a glass moving device for moving a glass substrate is provided.

In the present invention, the heating member may be a round bar heating member, and preferably may be fixed to the movable member so as to be perpendicular to the glass substrate.

In the practice of the present invention, the infrared irradiation device may be spaced apart from the movable member by a predetermined distance, preferably the same distance, with the heating member as the center and fixed.

In the present invention, the heating member is rotated by a motor, the number of revolutions can be adjusted by a control unit, and can be contacted in a non-rotating state as needed.

In the present invention, the heating member rotates in a fixed state, and the glass may be processed by contacting the heating member while moving while being fixed to the moving bed.

In the present invention, the glass substrate may be a rectangular substrate for a display, and the processing may be finished at a point where the processing starts by rotating while moving the moving bed.

According to the present invention, a new glass processing method combining chamfering characteristics by rotational force and heat transfer by rotating a heating member heated by non-contact heating has been proposed.

In the glass processing method according to the present invention, the heating member is heated in a non-contact manner by light, and the heating process is convenient because there is no coil or wire to limit the movement of the heating member around the heating member.

In addition, unlike induction heating, heating using light according to the present invention can heat a heating member made of a non-metallic ceramic, so that non-uniform expansion caused by the use of a ceramic containing a metal component for induction heating is prevented, and a uniform diameter can be secured during rotation.

In addition, machining by rotational force is combined with chamfering by heat transfer during machining, so that a region that has been subjected to primary heat due to contact with a heating member at the start of machining can be smoothly re-machined at the end of machining.

1 is a view showing the outline of a side cutting device for thin glass according to the present invention.
2 is an enlarged side view of a side cutting process of a thin glass according to the present invention.
3 is an enlarged plan view of a side cutting process of a portion where thin film glass cutting starts according to the present invention.
4 is a plan view showing a state in which, after one side surface of a thin glass according to the present invention is cut, another side surface adjacent to the cut one side surface is cut by rotation of a moving bed.
Figure 5a shows a state immediately before the heating member passes the cutting start point of the thin glass according to the present invention, Figure 5b is a plan view showing a state in which the heating member passes the cutting start point of the thin glass.

Hereinafter, the present invention will be described in detail through examples. The following examples are not intended to limit the present invention, but to illustrate the present invention.

As shown in FIG. 1 , a rectangular thin glass plate 10 is placed on a moving bed 20 for glass and moves together with the moving bed 20 . The thin glass plate 10 has fine protrusions formed by laser cutting, and uses glass having a thickness of 30 to 50 microns. As the glass, alkali glass, for example Corning's Gorilla, can be used.

The moving bed 20 for glass has a horizontal surface 21 formed thereon so that the thin glass plate 10 can be placed thereon, and a vacuum hole 22 for fixing the thin glass plate 10 is formed on the horizontal surface 21. This vacuum hole 22 is a through-hole passing through the moving bed 20 for glass from the upper surface to the lower surface, and is connected to a vacuum pump 23 that applies a vacuum. When vacuum is applied to the bottom surface of the thin glass plate 10 through the vacuum hole 22, it is not necessary to install a fixing member on the side of the glass plate in order to fix the thin glass plate 10, and free contact with the heating member 30 for side cutting is possible.

The size of the thin glass plate 10 is formed larger than the horizontal surface 21 so that the heating member 30 for side cutting and the four sides of the rectangular thin glass plate 10 can be freely contacted, and the degree of size can be adjusted according to the implementation environment.

The movable bed 20 for glass may have a fluid circulation passage 24 inside so that the surface temperature can be adjusted if necessary, and by adjusting the temperature of the fluid flowing through the fluid circulation passage 24, the surface temperature of the movable bed 20 and the temperature of the thin glass in contact therewith can be adjusted. When water is used as a fluid, it can be adjusted to a temperature between 0 and 100 ° C, for example, 10 to 30 ° C, and since the glass is etched by the rotation and heat transfer of the heating member 30, separate cooling is not required. It operates at room temperature of about 25 ° C.

As shown in FIG. 1 , the upper portion of the round bar-shaped heating member 30 is coupled to the rotary motor 40 to rotate while being fixed in place, and a spiral groove is formed on the surface of the round bar-shaped heating member 30 .

The round bar-shaped heating member 30 is formed in a cylindrical shape using metal-free ceramics without metal components, and is heated by infrared heating devices 31 disposed at the periphery of the round bar-shaped heating member 30 at a predetermined interval.

The round bar-shaped heating member 30 has a diameter of 10 mm, and fine grooves having a depth and width of 10 to 20 microns are formed on the surface. As a component of the round bar-shaped heating member 30, SiC, Si ₃ N ₄ and the like may be used.

The infrared heating device 50 emits far-infrared rays to irradiate and heat the upper portion of the heating member 30, thereby heating the entire heating member 30 to 1,200°C. 2, 3 or 4 infrared heating devices 50 are equiangularly arranged around the round bar-shaped heating member 30 .

The moving bed 20 for glass can move horizontally in front and rear directions, and the amount of movement is controlled by a controller (not shown).

As shown in FIG. 2, the thin glass plate 10 fixed to the moving bed 20 for glass by vacuum adsorption is horizontally moved, and the round bar-shaped heating member 30 coupled to the motor 40 is vertically coupled to come into contact with the side surface of the thin glass plate 10.

The round bar-shaped heating member 30 and the thin glass plate 10 may come into contact with a pressure of 0.2 Kgf/cm 2 , and the round-bar-shaped heating member 30 rotates at a speed of 60 rpm.

The fine protrusions formed on the side surface 11 of the thin glass plate 10 before cutting are formed by laser cutting, and are cut by contact with the round bar-shaped heating member 30 to form a smooth cutting side surface 12 .

As shown in FIG. 3, the side surface of a rectangular thin glass plate 10 having fine protrusions formed thereon by laser cutting is made of metal-free ceramic, disposed in a direction perpendicular to the glass plate, rotated, and irradiated with three far-infrared ray irradiators 50 to contact the side surface of a round bar-shaped heating member 30 heated to cut the side surface of the rectangular thin glass plate 10.

After the cutting starting point A of the thin glass plate 10 is brought into contact with the rotating round bar heating member 30, cutting proceeds while moving horizontally. Fine protrusions are formed on the side surface 11 before cutting, while the cutting side surface 12 has a smooth side surface as the fine protrusions are cut.

As shown in FIG. 4, when the processing of one side of the rectangular thin glass plate 10 having fine protrusions formed on the side surface by laser cutting is completed, the moving bed for glass is rotated by 90° and then moved horizontally again to cut the fine protrusions on the other side surface.

As shown in FIG. 5A, the rectangular thin glass plate 10 is coupled to the moving bed and rotated and moved so that cutting is performed to the cutting starting point A. Since the cutting start point (A) may be slightly deformed due to heat treatment at the start of cutting, the rotating round bar-shaped heating member 30 moves the thin glass plate 10 so that it passes slightly through the cutting start point (A) and stops. Since the round bar-shaped heating member 30 is being rotated and heated, the cutting starting point A forms a smooth surface despite the change in thermal characteristics.

10: thin glass plate
20: moving bed for glass
30: round bar heating member
40: motor
50: infrared heating device

Claims (16)

The vertical surface of the outer surface of the round bar-shaped heating member rotating along the vertical rotational axis by the motor is irradiated with infrared light in a direction different from the rotational axis and heated while contacting the side surface of the glass substrate,
Here, the glass substrate is an ultra-thin glass substrate of 1 to 100 microns,
The round bar-type heating member is made of a round bar made of metal-free ceramic,
The round bar-shaped heating member is a glass substrate processing method, characterized in that for rotating at a speed of 1 ~ 1000 rpm while pressing the side surface of the glass substrate. According to claim 1,
A glass substrate processing method, characterized in that a groove extending from top to bottom is formed on the surface of the round rod-shaped heating member. According to claim 1 or 2,
The glass substrate is a rectangular glass substrate, characterized in that the processing is terminated after passing through the cutting start point.
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