KR102534805B1 - Antenna apparatus - Google Patents

Abstract

The present invention relates to an antenna device, and relates to an antenna mounting unit having at least one radiating element disposed on the front side, and a heat dissipating unit formed between the adjacent antenna mounting units and exposed to the outside air to transfer heat generated from the rear to the front. A front housing including a front housing and a rear housing combined with the front housing and provided with a main board on which a filter for filtering RF signals and an RF element are mounted, and the heat generated from the filter is transferred to the front by using the filter as a heat transfer medium. It is transmitted to the front of the front housing through contact with the rear surface of the housing.

Description

Antenna device {ANTENNA APPARATUS}

The present invention relates to an antenna device, and more particularly, by removing a radome of a conventional antenna device and arranging a radiating element in a front housing of the antenna device, it is possible to improve heat dissipation performance, make it slimmer, and reduce product manufacturing costs. It is about an antenna device that has.

Base station antennas, including repeaters used in mobile communication systems, have various shapes and structures, and generally have a structure in which a plurality of radiating elements are properly disposed on at least one reflector erected in the longitudinal direction.

Recently, studies are being actively conducted to achieve a compact, lightweight, and low-cost structure while satisfying high-performance requirements for a multiple-input-output (MIMO)-based antenna. In particular, in the case of an antenna device to which a patch-type radiating element for implementing linear polarization or circular polarization is applied, a radiating element made of a dielectric substrate of plastic or ceramic material is usually plated and coupled to a PCB (printed circuit board) through soldering. method is widely used.

1 is an exploded perspective view showing an example of an antenna device according to the prior art.

As shown in FIG. 1, in the antenna device 1 according to the prior art, a plurality of radiating elements 35 are output in a desired direction to facilitate beam forming toward the front side of the antenna housing body 10, which is the beam output direction. Arranged to be exposed, for protection from the external environment, a radome (radome, 50) is mounted on the front end of the antenna housing body (10) with a plurality of radiating elements (35) interposed therebetween.

More specifically, an antenna housing body 10 provided in the shape of a thin rectangular parallelepiped housing with an open front surface and a plurality of heat dissipation fins 11 integrally formed on the rear surface, and stacked on the rear surface of the inside of the antenna housing body 10 The main board 20 and the antenna board 30 stacked on the front surface of the inside of the antenna housing body 10 are included.

On the main board 20, a plurality of power supply-related component elements for calibration power supply control are mounted, and the heat of the elements generated during the power supply process is rearward heat dissipation through a plurality of heat dissipation fins 11 at the rear of the antenna housing body 10 do.

In addition, on the lower side of the main board 20 or the lower side of the antenna housing body 10, a PSU board 40 on which PSU (Power Supply Unit) elements are mounted is stacked or disposed at the same height, and heat generated from the PSU elements In addition, the plurality of heat dissipation fins 11 integrally provided at the rear of the antenna housing body 10 or the PSU housing 15 formed separately from the antenna housing body 10 and attached to the rear surface of the antenna housing body 10 The rear heat is dissipated through the PSU heat dissipation fins 16. A plurality of RF filters 25 provided in a cavity filter type are disposed on the front surface of the main board 10, and a rear surface of the antenna board 30 is disposed so as to be stacked on the front surface of the plurality of RF filters 25.

On the front of the antenna board 30, patch-type radiating elements or dipole-type radiating elements 35 are mounted, and on the front of the antenna housing body 10, while protecting each part inside from the outside, the radiating elements 35 ) A radome 50 that allows smooth radiation from can be installed.

However, in one example (1) of the antenna device according to the prior art, the front portion of the antenna housing body 10 is shielded by the radome 50, so that the heat dissipation area is inevitably limited as much as the area of the radome 50, and radiation The elements 35 are also designed to transmit and receive only RF signals, so that the heat generated from the radiating elements 35 is not radiated forward, so that the heat generated inside the antenna housing body 10 is uniformly distributed over the antenna housing. There is a problem that the heat dissipation efficiency is greatly reduced because it cannot but be discharged to the rear of the main body 10, and a demand for a new heat dissipation structure design to solve this problem is increasing.

In addition, according to the example (1) of the antenna device according to the prior art, due to the volume of the radome 50 and the volume occupied by the arrangement structure in which the radiating element 35 is spaced from the front of the antenna board 30, the in-building ( There is a problem in that it is very difficult to implement a slim size base station required for in-building or 5G shadow areas.

The present invention has been made to solve the above technical problem, by removing the radome and disposing the radiating element in the front housing of the antenna device, by using both the front and rear housings of the antenna device for front and rear heat dissipation, the heat dissipation performance is greatly improved. It aims to provide an antenna device.

Another object of the present invention is to provide an antenna device capable of efficiently transferring heat inside the antenna housing to the front of the antenna device by using a filter as a heat transfer medium.

In addition, another object of the present invention is to provide an antenna device that can be easily implemented in a slim size base station required for in-building installation or 5G shaded areas, since the front and back volume of the conventional radome can be reduced by deleting the radome. to be

The technical problems of the present invention are not limited to the problems mentioned above, and other technical problems not mentioned will be clearly understood by those skilled in the art from the description below.

The antenna device according to the present invention is integrally formed between an antenna disposing unit in which at least one radiating element is disposed on the front side and adjacent antenna disposing units among the at least one antenna disposing unit, and is exposed to outside air to generate A front heat dissipation housing including a heat dissipation unit for transferring heat to the front, and a rear heat dissipation housing combined with the front heat dissipation housing and having a main board on which a filter and an RF element are mounted therein to filter an RF signal, Heat generated by the filter is transferred to the front surface of the front heat dissipation housing through contact with the rear surface of the front heat dissipation housing using the filter itself as a heat transfer medium.

In addition, the antenna device according to the present invention, a plurality of radiating elements for generating one polarization of the dual polarization; The plurality of radiating elements are integrally formed between a plurality of antenna placing parts arranged to be spaced apart from each other so as to be disposed on the front side and mutually adjacent antenna placing parts among the plurality of antenna placing parts, and heat generated from the rear by being exposed to the outside air. It includes a front heat dissipation housing including a heat dissipation unit forwardly, and a rear heat dissipation housing coupled to the front heat dissipation housing and accommodating a filter for filtering an RF signal and a main board on which an RF element is mounted.

In addition, the radiating element, the antenna patch circuit printed on the printed circuit board for the radiating element disposed on the antenna mounting unit; and a radiation director formed of a conductive metal material and electrically connected to the antenna patch circuit unit.

In addition, the radiation director may induce the direction of the radiation beam in the forward direction and transfer heat generated from the rear of the printed circuit board for the radiation element to the front through thermal conduction.

In addition, a PSU unit including a PSU substrate stacked and arranged at the same height as the main board in the inner space of the rear heat dissipation housing and having a plurality of electronic devices including PSU devices mounted on either the front or the rear side is further provided. Including, the heat generated from the rear of the printed circuit board for the radiating element may be defined as heat generated from the filter and the plurality of electronic devices.

In addition, the radiation director may be made of a thermally conductive material capable of conducting the heat.

In addition, a power supply line for supplying a power supply signal to the antenna patch circuit unit may be formed on the upper surface of the printed circuit board for the radiating element.

In addition, the at least two antenna patch circuit units and the radiation director form one antenna module, and the antenna module is an antenna module cover that is sealed to protect the antenna patch circuit unit except for the radiation director exposed to the outside air. may further include.

In addition, a through hole is formed on one surface of the antenna module cover, and the radiation director is coupled to be exposed to the outside air on the front surface of the antenna module cover, and may be electrically connected to the patch circuit unit through the through hole.

In addition, the antenna module cover is injection molded, and a director fixing part that is molded to the rear surface of the radiation director is provided on one surface of the antenna module cover, and at least one director fixable to the director fixing part is coupled to the radiation director. A protrusion is formed to protrude forward, and the radiation director may be press-fitted into and fixed to at least one director fixing groove formed to be recessed at a position corresponding to the at least one director fixing protrusion on the rear surface.

In addition, the antenna module cover may be injection molded, and a filter fixing hole for coupling with the filter may be formed through the antenna module cover.

In addition, the antenna module cover is injection-molded, and at least one substrate fixing hole for screw fastening by a fixing screw with the printed circuit board for the radiating element may be formed through the antenna module cover.

In addition, at least one fixing boss exposed to the rear surface of the antenna module cover through the substrate fixing hole is formed on the rear surface of the radiation director, and the printed circuit board for the radiating element is fixed by the fixing screw. The operation of fastening to the boss may be fixed to the rear surface of the antenna module cover.

In addition, the fixing screw may be provided as a flat head screw fastened so that its rear end surface matches the rear surface of the filter.

In addition, the antenna module cover may be injection molded, and at least one reinforcing rib may be integrally formed on one surface of the antenna module cover.

In addition, at least four positioning holes are formed on the printed circuit board for the radiating element, and at least two positioning projections formed on the rear surface of the antenna module cover provided to cover the front surface of the printed circuit board for the radiating element At least two positioning protrusions formed on the front surface of the front heat dissipation housing are press-fitted and inserted into two positioning holes among the four positioning holes, and the rear surface is in close contact with two positioning projections among the four positioning holes. It can be inserted by press fitting into the hole.

In addition, a thermal pad may be interposed between the filter and the rear surface of the front heat dissipation housing.

In addition, a Field Programmable Gate Array (FPGA) may be disposed on the upper surface of the main board, and heat generated in the FPGA may be transferred to a heat dissipation unit on the front surface of the front heat dissipation housing through a rear surface of the front heat dissipation housing.

In addition, heat generated in the FPGA may be transferred through any one of a heat pipe or a vapor chamber connecting the FPGA and the rear surface of the front heat dissipation housing.

In addition, the filter is integrally formed with a clamshell that performs a signal blocking function at the rear end, and the heat generated inside the filter shielded by the clamshell is dissipated to the rear through the rear heat dissipation housing. can

In addition, the filter is fixed to the main board via a fixing pipe protruding backward from the end of the clem shell and having a hollow inside, and a heat dissipation via hole communicating with the fixing pipe on the main board. can be formed.

In addition, the heat dissipation via hole may be plated with a thermally conductive material.

In addition, the front heat dissipation housing is made of a metal material, and the at least one antenna dissipation portion is disposed to be exposed to the outside air, and some of the heat generated toward the front of the main board as the rear of the front heat dissipation housing is part of the at least one antenna. Front heat is dissipated via the radiating element, the rest is front heat dissipated via the front heat dissipation housing, and the heat generated to the rear of the main board is dissipated to the rear via the rear heat dissipation housing.

According to an embodiment of the antenna device according to the present invention, the following various effects can be achieved.

First, by removing the radome, which is a hindrance to the front heat dissipation of the antenna, and placing the radiating element exposed to the outside air in the front heat dissipation housing of the antenna device, front and rear heat dissipation of the antenna device is possible, thereby greatly improving heat dissipation performance.

Second, since the radome, which was an essential component of the conventional antenna device, can be removed, it has the effect of significantly reducing the manufacturing cost of the product.

Third, since system heat inside the antenna housing body can be dissipated forward as much as the area of the heat dissipation cover increased due to the deletion of the radome, the heat dissipation performance is greatly improved.

Fourth, since full heat dissipation is possible in the front, it is possible to reduce the length of the heat dissipation fin of the rear heat dissipation housing, so that the slim design of the product as a whole has an effect that is easy.

Fifth, as heat dissipation is possible through a radiation director performing an electromagnetic wave radiation function among antenna modules, it has an effect of maximizing the heat dissipation area of the front heat dissipation housing.

The effects of the present invention are not limited to the effects mentioned above, and other effects not mentioned will be clearly understood by those skilled in the art from the description of the claims.

1 is an exploded perspective view showing an example of an antenna device according to the prior art;
2 is a front perspective view of an antenna device according to an embodiment of the present invention;
3a and 3b are front and rear views of an antenna device according to an embodiment of the present invention;
4 is an exploded perspective view showing an internal space of the antenna device shown in FIG. 2;
5 is a cross-sectional view taken along line AA of FIG. 3A and a partially enlarged view thereof;
6A and 6B are front and rear exploded perspective views showing a main board and a filter stacked in the inner space of the rear heat dissipation housing in the configuration of FIG. 2;
7 is an exploded perspective view showing a direct rear heat dissipation structure through a rear heat dissipation housing among the configurations of FIG. 2;
8a and 8b are front and rear exploded perspective views showing installation of a sub-board and a shielding panel on a main board among the components of FIG. 2;
9 is an exploded perspective view for explaining the electrical connection of the PSU unit to the main board among the configurations of FIG. 2;
10 is an exploded perspective view for explaining how a filter is coupled to a main board among the configurations of FIG. 2;
11 is a partially cut away perspective view for explaining heat dissipation through a rear heat dissipation housing of heat generated from a filter among the configurations of FIG. 2;
12a and 12b are front side and rear side exploded perspective views showing the assembly process of internal components for the rear heat dissipation housing of the configuration of FIG. 2,
Figure 13 is an exploded perspective view for explaining the assembly process of the outer members to the rear heat dissipation housing of the configuration of Figure 2,
14 is an exploded perspective view of the front side for explaining the installation of the antenna module to the front heat dissipation housing of the configuration of FIG. 2;
15 is an exploded perspective view of the front side and the rear side showing installation of the front surface of the front heat dissipation housing of the antenna module among the configurations of FIG. 14;
16 is a perspective view showing an antenna module among the configurations of FIG. 14;
17a and 17b are front side exploded perspective views and rear side exploded perspective views of FIG. 14,
FIG. 18 is a front view of the antenna module in the configuration of FIG. 14 and a sectional view and cut-away perspective view taken along line BB.

Hereinafter, an antenna device according to an embodiment of the present invention will be described in detail with reference to the accompanying drawings.

In adding reference numerals to components of each drawing, it should be noted that the same components have the same numerals as much as possible even if they are displayed on different drawings. In addition, in describing an embodiment of the present invention, if it is determined that a detailed description of a related known configuration or function hinders understanding of the embodiment of the present invention, the detailed description will be omitted.

In describing the components of the embodiment of the present invention, terms such as first, second, A, B, (a), and (b) may be used. These terms are only used to distinguish the component from other components, and the nature, sequence, or order of the corresponding component is not limited by the term. In addition, unless defined otherwise, all terms used herein, including technical or scientific terms, have the same meaning as commonly understood by a person of ordinary skill in the art to which the present invention belongs. Terms such as those defined in commonly used dictionaries should be interpreted as having a meaning consistent with the meaning in the context of the related art, and unless explicitly defined in this application, they should not be interpreted in an ideal or excessively formal meaning. don't

2 is a front perspective view of an antenna device according to an embodiment of the present invention, FIGS. 3A and 3B are front and rear views of an antenna device according to an embodiment of the present invention, and FIG. 4 is shown in FIG. FIG. 5 is a cross-sectional view taken along line A-A of FIG. 3A and a partially enlarged view thereof.

As shown in FIG. 2, the antenna device 1 according to an embodiment of the present invention includes a front heat dissipation housing 100 forming a front exterior of the antenna device 1 and a rear exterior of the antenna device 1. It includes a rear heat dissipation housing 200 to form. Here, the front heat dissipation housing 100 is exposed to the outside air and the antenna mounting portion (refer to reference numeral '170' in FIG. 14 to be described later) in which at least one radiating element 116 or 117 is disposed on the front side, and the heat generated from the rear is transferred to the front side. It includes a heat dissipation unit 105 that transmits to. In particular, at least one antenna placement unit 170 is integrally formed on the front surface of the front heat dissipation housing 100 and is arranged to be spaced apart from each other, and the heat dissipation unit 105 fills the space between adjacent antenna placement units 170. It may be formed with respect to the entire area of the front surface of the front heat dissipation housing 100 .

2 to 5, the front heat dissipation housing 100 is provided with a metal material having excellent thermal conductivity so that heat generated between it and the rear heat dissipation housing 200 to be described later can be directly radiated forward. As described above, the front surface of the front heat dissipation housing 100 can be largely divided into an antenna placement unit 170 and a heat dissipation unit 105 in appearance.

Here, the rest of the space except for the antenna placement unit 170 mainly functions as a heat dissipation unit 105, and the heat dissipation unit 105 is in the form of a plurality of heat dissipation fins and is connected to the front heat dissipation housing 100 to have a predetermined pattern shape. It is integrally formed, and the heat generated in the inner space between the front heat dissipation housing 100 and the rear heat dissipation housing 200 can be quickly dissipated forward through the heat dissipation part 150 provided in the form of the plurality of heat dissipation fins. .

That is, one embodiment (1) of the antenna device according to the present invention, compared to the prior art having a radome, improves the structure in which heat dissipation to the front of the antenna device 1 is limited, and the antenna device ( 1) We propose a new concept heat dissipation structure that dissipates heat through all directions.

More specifically, in the embodiment (1) of the antenna device according to the present invention, by introducing the front heat dissipation housing 100, the area occupied by the existing radome can be converted into a heat dissipation area.

In the front heat dissipation housing 100, at least the entire area of the heat dissipation unit 105 excluding the area occupied by the antenna module 110 described later is converted into a usable area capable of dissipating heat. In addition, since the radiation detector 117 of the configuration of the antenna module 110 is made of a metal material capable of conducting heat, a larger area available for heat dissipation can be secured.

As referenced in FIG. 3A , the front heat dissipation housing 100 covers the front end of the rectangular parallelepiped enclosure of the rear heat dissipation housing 200 to be described later, and may be provided as a substantially rectangular plate body.

On the front surface of the front heat dissipation housing 100, an antenna placement unit 170 to which a plurality of antenna modules 110 to be described later are coupled may be formed flat.

The plurality of antenna placement units 170 are formed to match the outer shape of the plurality of antenna modules 110, and each of the plurality of antenna modules 110 is provided as a rectangular plate body formed long in the vertical direction, and each antenna Since the modules 110 are arranged in rows at a predetermined distance apart in the left and right directions and in the vertical direction, a plurality of antenna arranging units 170 may also be disposed on the front surface of the front heat dissipating housing 100 in the same shape.

Here, in the lower part of the inner space of the rear heat dissipation housing 200 described later, heat generated from the plurality of PSU elements 417 of the PSU unit 400 can be easily radiated directly from the front through the heat dissipation unit 105 described later. A plurality of antenna placement units 170 may not be formed to do so.

The above-described heat dissipation part 105 may be filled in the form of a plurality of heat dissipation fins in a portion corresponding to the remaining area of the front surface of the front heat dissipation housing 100, which is not occupied by the plurality of antenna placing parts 170. The heat dissipation unit 105 here is different from the shape design for dissipation or rapid discharge of the upward airflow of the rear heat dissipated by the plurality of rear heat dissipation fins 201 integrally formed in the rear heat dissipation housing 200 to be described later. If the heat dissipation area through the heat dissipation housing 100 is increased, it may be formed in a sufficient shape. That is, the heat dissipation unit 105 does not necessarily have a shape for dispersing or rapidly dissipating the upward airflow of the dissipated front heat (however, it is natural that such a shape increases the heat dissipation performance), and the front heat dissipation housing ( 100) may be adopted in any shape to the extent of increasing the surface area.

On the other hand, the rear heat dissipation housing 200 is combined with the front heat dissipation housing 100 to form the rear appearance of the entire antenna device 1, and the rear heat dissipation housing 200 includes a plurality of filters 350 for filtering RF signals and , a main board 310 on which a plurality of related RF elements (reference numerals not indicated) are mounted. The rear heat dissipation housing 200 is made of a metal material having excellent thermal conductivity so that heat dissipation according to heat conduction is advantageous as a whole, and is formed in the shape of a rectangular parallelepiped body having a thin thickness in the front and rear directions, and is formed so that the front surface is open, and a plurality of RFs are formed inside. An internal space 200S may be formed in which a main board 310 in which a filter 350, various RF elements, and a Field Programmable Gate Array (FPGA) 317 are mounted is installed.

Referring to FIG. 3B, on the rear surface of the rear heat dissipation housing 200, a plurality of rear heat dissipation fins 201 are integrally formed with the rear heat dissipation housing 200 to have a predetermined pattern shape, and the inner space of the rear heat dissipation housing 200 Heat generated at the rear side of (200S) may be directly radiated to the rear through the plurality of rear heat dissipation fins 201.

A plurality of rear heat dissipation fins 201 are disposed inclined upward toward the left end and the right end based on the middle of the left and right widths (refer to reference numerals 201a and 201b in FIG. 3B) to dissipate heat to the rear of the rear heat dissipation housing 200. Although heat may be designed to more quickly dissipate heat by forming rising airflows in which heat is dispersed in the left and right directions of the rear heat dissipation housing 200, the shape of the heat dissipation fin 201 is not limited thereto. For example, although not shown in the drawing, when a blowing fan module (not shown) is provided on the rear side of the rear heat dissipating housing 200, the rear heat dissipating fin is placed in the middle so that the heat dissipated by the blowing fan module is more quickly discharged. It may be preferable to form parallel to the left end and the right end, respectively, in the blowing fan module disposed therein.

In addition, although not shown, a bracket mounting portion 205 to which a clamping device (not shown) for coupling the antenna device 1 to a holding pole (not shown) is coupled to some of the plurality of rear heat dissipation fins 201 is integrated. can be formed as Here, the clamping device rotates and rotates the antenna device 1 according to an embodiment of the present invention installed at the front end in the left and right directions or tilts and rotates in the vertical direction to adjust the directionality of the antenna device 1 can be config.

Meanwhile, in the space between the rear surface of the front heat dissipation housing 100 and the rear heat dissipation housing 200, the heat generated around the plurality of filters 350 directly uses the front heat dissipation housing 100 as a heat transfer medium, or the filter 170 ) as a heat transfer medium and is transferred to the front surface of the front heat dissipation housing 100 through contact with the rear surface of the front heat dissipation housing 100 . In addition, some of the heat generated inside the plurality of filters 350 may be directly dissipated to the rear through the rear heat dissipation housing 200 . A detailed description of this will be described later in detail.

On the front surface of the rear heat dissipation housing 200, a clamshell in which a plurality of RF filters 350 block and interfere with external electromagnetic waves is integrally formed and mounted at a predetermined position on the main board 310. It can be.

In the antenna device 1 according to an embodiment of the present invention, a total of 8 RF filters 350 are arranged adjacently in the left and right directions, and the plurality of RF filters 350 are arranged in the vertical direction, respectively. Although a total of four rows are employed, it is not necessarily limited thereto, and it will be taken for granted that the arrangement position and the number of RF filters 170 can be variously modified.

Although not shown in the figure, the plurality of RF filters 3500 are provided with a plurality of cavities inside and filter the frequency band of the output signal compared to the input signal through frequency adjustment using the resonator of each cavity. can be recruited and placed. However, the RF filter 170 is not necessarily limited to a cavity filter, and does not exclude a ceramic waveguide filter.

For the RF filter 350, having a small thickness in the front-back direction is advantageous in the design of slimming the entire product. In terms of slimming design of such a product, adoption of a ceramic waveguide filter, which is advantageous in miniaturization design, may be considered as the RF filter 350 rather than a cavity filter, which has a limited design for reducing the thickness in the front and rear directions. However, in order to satisfy the high-output performance of the base station antenna required in the 5G frequency environment, the accompanying antenna heat dissipation problem must be solved, and the RF filter 350 is used as a heat transfer medium to effectively dissipate the heat generated inside the antenna Adoption of a cavity filter may be preferred in that heat generated in the filter 350 can be transferred to the front of the front heat dissipating housing 100.

Heat generated from such an RF filter 350 may be transferred to the front of the front heat dissipation housing 100 through contact with the rear surface of the front heat dissipation housing 100, and between the filter 350 and the rear surface of the front heat dissipation housing 100 A thermal pad 109 may be interposed. The thermal pad 109 not only performs a function of smoothly transferring heat generated from the filter 350 through surface contact with the front heat dissipation housing 100, but also when assembling between the filter 350 and the front heat dissipation housing 100. It also performs the function of relieving tolerance.

Meanwhile, as referred to in FIG. 4 , the inner surface forming the inner space 200S of the rear heat dissipation housing 200 is formed in a shape in which the main board 310 and the rear surface of the sub-board 320 to be described later are matched. It can be. That is, heat dissipation performance may be improved by increasing the thermal contact area between the rear surfaces of the main board 310 and the sub board 320 .

On the left and right sides of the rear heat dissipation housing 200, the handle portion ( 160) may be further installed.

In addition, outside the lower end of the rear heat dissipation housing 200, various external mounting members 500 for cable connection with a base station device (not shown) and tuning of internal parts may be assembled through.

6A and 6B are exploded perspective views of the front side and the rear side showing a main board and a filter stacked in the inner space of the rear heat dissipation housing in the configuration of FIG. 2, and FIG. 7 is a direct rear through the rear heat dissipation housing in the configuration of FIG. 8A and 8B are exploded perspective views showing a heat dissipation structure, and FIGS. 8A and 8B are front and rear exploded perspective views showing installation of a sub-board and a shielding panel on a main board in the configuration of FIG. 2 , and FIG. 9 is an exploded perspective view of the configuration in FIG. 2 This is an exploded perspective view to explain the electrical connection of the PSU unit to the main board.

As shown in FIGS. 6A and 6B , the antenna device 1 according to an embodiment of the present invention includes the antenna stack assembly 300 stacked in the inner space 200S of the rear heat dissipation housing 200. can do.

As shown in FIGS. 6A and 6B , the antenna stacking assembly 300 includes a plurality of filters 350 as RF filters stacked on the front surface with respect to the main board 310 and the main board 310 as reference. A sub board 320 stacked on the rear surface may be included.

Although not shown, the main board 310 is provided with a plurality of layers stacked, and a power supply circuit for supplying power to the plurality of filters 350 may be pattern-printed on the inside or surface. In particular, on the front surface of the main board 310, the LNA element 312 among a plurality of power supply parts may be mounted, and a plurality of power supply connectors 360 for power supply connection to the plurality of filters 350 may be inserted and mounted. can

On the other hand, on the front side of the sub board 320, like the main board 310, a power supply circuit 321 for supplying power to a plurality of filters 350 is pattern-printed as a transmission path and a reception path, respectively, and a number of Of the power supply parts of the PA element 322 may be mounted.

Here, the main board 310 has a plurality of penetrations so that the power supply circuit 321 and the PA element 322 on the front side of the sub board 320 stacked on the rear surface are exposed to the rear side of the plurality of filters 350. Portion 312 may be machined.

In addition, as described above, clamshells (reference numerals not shown) are integrally formed on the rear end side of the plurality of filters 350, and the rear end side of the plurality of filters 350 and the main board 310 and the sub board A predetermined air layer is formed between the 320, and heat generated from the LNA element 312 and the PA element 322, which are representative heating elements, is discharged through a heat dissipation via hole (reference numeral 357a in FIG. 11) formed in the main board 310. ') through the rear heat dissipation housing 200 side can be dissipated.

As shown in FIG. 7 , a plurality of FPGA elements 317a and RFIC elements 317b, which are representative of heating elements, may be mounted on the rear surface of the main board 310. The plurality of FPGA elements 317a and the plurality of RFIC elements 317b are semiconductor elements that emit a large amount of heat when driven, and are in direct thermal surface contact with the inner surface of the inner space 200S of the rear heat dissipation housing 200. It is adopted as a structure that dissipates heat to the rear through the rear heat dissipation housing 200.

More specifically, on the inner surface of the rear heat dissipation housing 200, as shown in FIG. 7, a thermal contact receiving surface 203a in which the surfaces of the plurality of FPGAs 317a and RFIC elements 317b are in direct thermal contact In addition to being formed to protrude forward, a thermal contact groove 203b accommodating a plurality of protruding parts printed in embossed patterns or mounted on the rear side of the sub board 320 may be formed to be recessed backward. Therefore, since all of the rear surfaces of the main board 310 and the sub board 320 are in thermal contact with the inner surface of the rear heat dissipation housing 200, heat dissipation performance is greatly improved.

Meanwhile, as shown in FIGS. 8A and 8B , shielding pads 330 may be stacked and coupled to the remaining portion of the front surface of the main board 310 except for the portion occupied by the plurality of filters 350 . The shielding pad 330 is disposed between the main board 310 and the front heat dissipation housing 100 to prevent signal influence by external electromagnetic waves or electric components of the rest of the area except for the electrical signal lines through the plurality of filters 350. It is a shielding member that secures more stable signal performance by blocking.

As shown in FIGS. 6A and 6B and FIG. 7 , the antenna device 1 according to an embodiment of the present invention includes a PSU unit 400 for supplying power to the plurality of filters 350 and the antenna module 110. ) may be further included.

As shown in FIGS. 6A, 6B, and 7 , the PSU unit 400 is located on the lower side of the main board 310 at the same height as the main board 310 in the inner space 200S of the rear heat dissipation housing 200. can be stacked on

Such a PSU unit 400 includes a PSU substrate 410 and a plurality of electronic devices 419 including a plurality of PSU elements 417 disposed on either the front or rear surface of the PSU substrate 410. can do.

The PSU unit 400 may be provided to distribute and supply power to the main board 310 via a plurality of bus bars 340 . More specifically, the plurality of bus bars 340, as shown in FIGS. 6A and 6B and FIG. 9 , connect the left and right ends of the PSU substrate 410 and the main board 310 to each other. In particular, the plurality of bus bars 340 may be connected by being inserted into connection holes 319 previously formed in the main board 310 .

In particular, the PSU element 417 and the electrical element 419 of the PSU unit 400 emit a large amount of heat when driven, and as referenced in FIG. 7, the inner space 200S of the rear heat dissipation housing 200 In a portion occupied by the PSU board 410, the thermal contact receiving portion 217 may be formed to be recessed backward to correspond to the shapes of the PSU element 417 and the electrical element 419. Accordingly, heat generated from the PSU element 417 and the electrical element 419 of the PSU unit 400 may be dissipated backward using the rear heat dissipation housing 200 as a heat transfer medium.

However, it is not necessarily provided that the heat generated in the PSU unit 400 is dissipated to the rear through the rear heat dissipation housing 200, and although not shown, the front via a vapor chamber or heat pipe structure separately provided as a heat transfer medium. It will be taken for granted that it is also possible to be provided to dissipate front heat toward the heat dissipating housing 100 side. This is because the antenna device 1 according to an embodiment of the present invention has a structure in which front heat dissipation is advantageous through the front heat dissipation housing 100, unlike the case where a conventional radome is provided.

10 is an exploded perspective view for explaining how a filter is coupled to a main board in the configuration of FIG. 2 , and FIG. 11 is an exploded perspective view for explaining heat dissipation through a rear heat dissipation housing of heat generated from a filter in the configuration of FIG. 2 . It is a partial cutaway perspective view.

As described above with respect to the front and rear surfaces of the main board 310, if the shielding pad 330 and the sub-board 320 are stacked and arranged, as shown in FIGS. 10 and 11, a plurality of filters as an RF filter 350 is mounted and disposed on the front surface of the main board 310 .

At this time, the plurality of filters 350 are cavity filters integrally equipped with clamshells at their rear ends, and are inserted into the filter assembly holes 317 formed in the main board 310 at the portions where the clamshells are formed to assemble. At least one filter assembling protrusion 357 is formed, and the filter assembling protrusion 357 may be formed in a tube shape with an empty inside.

Therefore, heat generated and collected from the LNA element 312 and the PA element 322 in the air layer between the rear end of each of the plurality of filters 350 and the main board 310 is generated by the tube-shaped filter assembly protrusion 357 And heat can be easily dissipated toward the rear heat dissipation housing 200 through the heat dissipation via hole 357a formed in the main board 310 .

On the other hand, at the rear end of the plurality of filters 350, a pair of main board-side coaxial connectors 353a electrically connected to the power supply connector 360 mounted on the main board 310 is provided, and the plurality of filters 350 A pair of antenna-side coaxial connectors 353b electrically connected to the antenna module 110 disposed on the front surface of the front heat dissipation housing 100 may be provided at the front end of the front end.

In addition, a thermal pad 109 is disposed at the front end of the plurality of filters 350 to mediate heat transfer to the rear surface of the front heat dissipation housing 100, so that heat generated from each of the plurality of filters 350 is transferred to the front heat dissipation housing. (100) as a heat transfer medium so that the front heat can be dissipated more quickly.

In addition, at the front end of the plurality of filters 350, a screw fastening hole 359 for screw coupling using a fixing screw 351 to the front heat dissipation housing 100 is formed, and the fixing screw 351 is attached to the front heat dissipation housing 100. The front heat dissipation housing 100 may be stacked and coupled to the front surface of the plurality of filters 350 by passing through the screw through hole 119 formed in the housing 100 and fastened to the screw fastening hole 359 .

According to the above configuration, the heat generated from the filter 350 directly contacts the rear surface of the front heat dissipation housing 100 or the radiation director 117 of the antenna module 110, so that the heat of the filter 3500 It was confirmed that the effect of about 14 ~ 16 ℃ lower than before. This is not only the effect of the removal of the radome, which was a conventional heat dissipation factor, but also direct heat transfer (heat conduction) to the rear surface of the front heat dissipation housing 100 made of a material suitable for heat dissipation and the radiation director 117 of the filter 350. It is understood that the effect of improving the heat transfer performance through

12a and 12b are front and rear exploded perspective views showing the assembly process of internal components for the rear heat dissipation housing of the configuration of FIG. 2, and FIG. 13 is the assembly process of the outer members for the rear heat dissipation housing of the configuration of FIG. It is an exploded perspective view to explain.

2 to 11 , when the assembly of components to the main board 310 and the assembly of the laminated assembly 300 to the rear heat dissipation housing 200 are completed, the outer member 500 is placed in the rear heat dissipation housing. Move from the lower end of 200 to complete assembly.

In the rear heat dissipation housing 200, the internal space 200S is completely shielded and sealed by assembling the front heat dissipation housing 100 and the antenna module 110, which will be described later, and a separate protective member such as a radome. will not require

14 is an exploded perspective view of the front side for explaining the installation of the antenna module to the front heat dissipation housing of the configuration of FIG. 2, and FIG. 16 is an exploded perspective view of the front side and the rear side, and FIG. 16 is a perspective view showing the antenna module in the configuration of FIG. 14, FIGS. 17A and 17B are an exploded perspective view of the front side and a rear side of FIG. It is a front view of the antenna module during construction, a sectional view taken along B-B line, and a cutaway perspective view.

In order to implement beamforming, as referenced to FIGS. 14 to 18, a plurality of radiating elements are required as an array antenna, and the plurality of radiating elements emit a narrow directional beam. can be created to increase the concentration of radio waves in a specified direction. Recently, a plurality of radiating elements, a dipole-type dipole antenna or a patch-type patch antenna are used with the highest frequency, and are designed and arranged to be spaced apart so that mutual signal interference is minimized. Conventionally, in general, a radome for protecting a plurality of radiating elements from the outside was an essential component in order to prevent the arrangement design of such a plurality of radiating elements from being changed by external environmental factors. Therefore, only for the area covered by the radome, the plurality of radiating elements and the antenna board on which the plurality of radiating elements 130 are installed are not exposed to the outside air, so that system heat generated due to the operation of the antenna device 1 is released to the outside. It was very limited in heat dissipation.

The radiating element 117 of the antenna device 1 according to an embodiment of the present invention includes an antenna patch circuit 116 printed on a printed circuit board 115 for a radiating element disposed on the antenna mounting unit 170, and A radiation director 117 formed of a conductive metal material and electrically connected to the antenna patch circuit 116 is included. An antenna patch circuit unit 116 is printed on the printed circuit board 115 for the radiating element, and is provided as a dual polarization patch element that generates either orthogonal ±45 polarization or vertical/horizontal polarization. On the upper surface of the printed circuit board 115 for the radiating element, a power supply line (not shown) for supplying a power supply signal to the antenna patch circuit unit 116 is formed in a pattern so as to connect each of the antenna patch circuit units 116 to each other.

In the conventional antenna device, since the power supply line must form a power supply line at the bottom of the printed circuit board on which the antenna patch circuit unit is mounted, the power supply structure is complicated, such as having a plurality of through holes for this purpose, and the power supply structure is printed for radiating elements It occupies the lower space of the circuit board 115, and there is a problem of acting as an element that hinders direct surface thermal contact between the filter 350 and the printed circuit board 115 for the radiating element, but in the embodiment of the present invention The power supply line according to the pattern is formed on the same front surface as the printed circuit board 115 for the radiating element on which the antenna patch circuit unit 116 is pattern-printed, so that the power supply structure is very simple, and the filter 350 and the radiating element are printed. There is an advantage in securing a coupling space that is directly in thermal contact with the surface of the circuit board 115 .

Meanwhile, the radiation director 117 is formed of a thermally conductive or conductive metal material and is electrically connected to the antenna patch circuit unit 116 . The radiation director 117 may also perform a function of inducing the direction of the radiation beam in the forward direction and simultaneously transferring heat generated from the rear of the printed circuit board 115 for the radiation element to the front through heat conduction. The radiation director 117 may be made of a metal of a conductive material through which radio waves flow well, and is installed spaced apart from the top of each antenna patch circuit unit 116 .

Here, the height of the heat dissipation part 105 (radiation fin) of the front heat dissipation housing 100 may be set by the height of the radiation director 117 coupled to the antenna module cover 111 to be described later. It is natural that the amount of heat dissipation can be adjusted by varying the height of the heat dissipation unit 105 (radiation fin) by designing the height of the radiation director 117 to be variable.

In the embodiment of the present invention, the radiation element using the antenna patch circuit 116 and the radiation director 117 has been described, but when a dipole antenna is applied, the configuration of the radiation director can be omitted, and the height of the dipole antenna is relatively high. As high as , it is possible to increase the heat dissipation amount by setting the height of the heat dissipation unit 105 (radiation fin) high.

14 to 18, the projection 117a formed on the rear surface of the radiation director 117 is electrically connected to the antenna patch circuit unit 116 through the through hole 114a of the antenna module cover 111. The overall size, shape, and installation position of the radiation director 117 may be appropriately designed by measuring the characteristics of a radiation beam emitted from the corresponding antenna patch circuit unit 116 experimentally or by simulating the corresponding characteristics. The radiation director 117 serves to guide the direction of the radiation beam generated from the antenna patch circuit unit 116 in all directions, further reducing the beam width of the overall antenna and improving the characteristics of the side lobe. In addition, it compensates for loss due to the patch-type antenna and can perform a heat dissipation function as well as being made of conductive metal. The shape of the radiation director 117 is preferably formed in an appropriate shape for guiding the direction of the radiation beam in all directions, for example, a non-directional circular shape, but is not limited thereto.

Meanwhile, at least two antenna patch circuit units 116 and radiation directors 117 may form one antenna module 110 . 14 to 18 show an example in which three antenna patch circuit units 116 and a radiation director 117 form one unit antenna module 110, and an optimal design of an antenna module for increasing gain. Depending on the antenna patch circuit unit 116 and the number of radiation directors 117 can be varied.

The antenna module 110 may further include an antenna module cover 111 for sealing at least one surface of the printed circuit board 115 for a radiating element of the antenna module 110.

The antenna module cover 111 and the printed circuit board 115 for the radiating element are formed with a cover through-hole 113 and a substrate through-hole 115b penetrating in the front-back direction, respectively, and the fixing screw 351 is a front heat dissipation housing ( 100) sequentially through the cover through-hole 113 and the substrate through-hole 115b from the outside, and then through the screw through-hole 119 of the front heat dissipation housing 100 to the front end of the plurality of filters 350 Each of the antenna modules 110 may be fixed to the front surface of the antenna mounting unit 170 by being fastened to the formed screw fastening holes 359 .

Here, as referred to in (a) of FIG. 15, an accommodating rib 178 accommodating at least the rim end of the antenna module cover 111 is formed on the rim of the antenna mounting unit 170, and the antenna module cover (111) is preferably formed to a size capable of being airtight or waterproof by forcibly fitting into the accommodating rib 178 of the antenna placement unit 170.

On the other hand, as referenced in Figure 15, the printed circuit board 115 for the radiating element is formed with positioning holes 115-1 to 115-4 penetrating in the front-back direction at four places on the corner side forming a square, , Two position setting holes 115-1 and 115-2 in the diagonal direction among the four position setting holes 115-1 to 115-4 formed on the printed circuit board 115 for the radiating element on the front of the antenna placement unit 170. ), two positioning projections 173a and 173b are formed, and four positioning holes 115-1 to 115- formed in the printed circuit board 115 for the radiating element are formed on the back of the antenna module cover 111. 4) Two positioning protrusions 173a and 173b formed on the front surface of the antenna mounting unit 170 are press-fitted into the remaining two positioning holes 115-3 and 115-4 not occupied by the two positioning protrusions ( 111-3, 111-4) may be formed.

Therefore, as shown in FIG. 15, when the antenna module 110 is installed in the antenna mounting unit 170, the printed circuit board 115 for the radiating element is moved to the rear side of the antenna module cover 111 so that the two The positioning projections 111-3 and 111-4 press-fit the two positioning projections 111-3 and 111-4 formed on the rear side of the antenna module cover 111 into the two positioning holes 115-3 and 115-4. After fixing by the insertion operation (see (b) of FIG. 15), the antenna module cover 111 to which the printed circuit board 115 for the radiating element is coupled is formed on the front surface of the front heat dissipation housing 110 ( 170) can be temporarily fixed by the operation of pressing and inserting the two positioning projections (173a, 173b) into the two positioning holes (115-1, 115-2) of the printed circuit board 115 for the radiating element by moving to the side. .

That is, the printed circuit board 115 for the radiating element is on the front surface of the antenna mounting unit 170 of the front heat dissipation housing 100 provided so that the rear surface and the rear surface of the antenna module cover 111 provided to cover the front surface are in close contact. The positioning protrusions 111-3, 111-4, 173a, and 173b are press-fitted and inserted into the positioning holes 115-1 to 115-4, respectively, so that they can be stably placed between them.

On the other hand, as shown in Figure 15, the front surface of the printed circuit board 115 for the radiating element, the above-described antenna patch circuit unit 116 is formed by printing, and the rear surface of the printed circuit board 115 for the radiating element has a conductive contact. The pattern 115c is printed and fed to the antenna patch circuit unit 116 by a contact between the antenna-side coaxial connector 353b provided at the front end of the filter 350 and the contact pattern 115c.

Here, the antenna module cover 111 is injection molded from a plastic material, and on one surface of the antenna module cover 111, as shown in FIG. 17A, a director fixing part 114 molded to the rear surface of the radiation director 117. ) Is provided, but the director fixing part 114 may be formed so that the director fixing protrusion 114b coupled to the radiation director 117 protrudes forward.

In addition, as shown in FIG. 17B, the radiation director 117 is press-fitted and fixed into at least one director fixing groove 117b formed to be recessed at a position corresponding to the at least one director fixing protrusion 114b on the rear surface thereof. It can be.

In addition, a filter fixing hole 113 for coupling with the filter 350 may be formed through the antenna module cover 111 . After the filter fixing screw (not shown) passes through the antenna module cover 111 through the filter fixing hole 113, the filter 350 passes through the through hole 115b formed in the printed circuit board 115 for the radiating element. When fastened to the screw fastening hole 359 formed in, the front heat dissipation housing 100 can be firmly stacked and coupled to the front surface of the filter 350 . As shown in FIG. 16, the filter fixing hole 113 is preferably sealed through the hole shielding cap 119.

Here, in the antenna module cover 111, at least one board fixing hole 114a for screw fastening by the fixing screw 180 with the printed circuit board 115 for the radiating element may be formed, and At least one fixing boss 117a exposed to the rear surface of the antenna module cover 111 through the substrate fixing hole 114a may be formed on the rear surface of the director 117 . After the printed circuit board 115 for the radiating element passes through the director fixing hole 178 formed so that the fixing screw 180 penetrates the antenna placing portion 170 of the front heat dissipation housing 110 in the front and rear directions, the fixing boss ( 117a), it can be fixed to the rear surface of the antenna module cover 111.

Meanwhile, the fixing screw 180 is preferably provided as a countersunk screw fastened so that the rear end thereof matches the front surface of the filter 350 located at the rear. This is to ensure that the rear end surface of the fixing screw 180 provided as a countersunk head screw is in surface thermal contact with the front surface of the filter 350 in the largest possible area. The fixing screw 180 and the radiation director 117 are made of a thermally conductive material, and the inner space between the front heat dissipation housing 100 equipped with the filter 350, the main board 310, and the PSU unit 400 The heat emitted to (200S) may be radiated to the front side through heat conduction of the front heat dissipation housing 100 itself or heat conduction through the fixing screw 180 and the radiation director 117.

In addition, at least one reinforcing rib 111a is formed on one surface of the antenna module cover 111 to form the exterior of the antenna module cover 111 and to reinforce the strength of the antenna module cover 111 made of plastic.

A brief description of the heat dissipation of the antenna device 1 according to an embodiment of the present invention configured as described above is as follows.

The heat generated between the front heat dissipation housing 100 based on the main board 310 and the heat generated from the filter 350 corresponding to the space therebetween are in direct surface thermal contact with the rear surface of the front heat dissipation housing 100 or Heat may be radiated forward of the front heat dissipation housing 100 through the filter 350 and the radiation director 117 .

At this time, in the case of the antenna device 1 according to an embodiment of the present invention, better heat dissipation performance can be achieved by converting an area occupied by the radome into a heat dissipation area instead of deleting the conventional radome.

Based on the main board 310, the heat generated on the rear side of the main board 310 and the heat generated on the rear side of the PSU unit 400 are in direct surface thermal contact with the rear heat dissipation housing 200, Heat can be quickly dissipated backward by using a plurality of heat dissipation fins 201 integrally formed in the heat dissipation housing 200 .

At this time, as a space between the filter 350 and the main board 310, the heat collected by the clam shell is transferred to the filter assembly protrusion 357 of the filter 350 and the heat dissipating via hole 357a of the main board 310. Through the rear heat dissipation housing 200 as a heat transfer medium, heat can be dissipated to the rear.

In this way, the antenna device 1 according to an embodiment of the present invention includes not only the rear but also the front of the system heat inside the antenna device 1 as much as the area of the front heat dissipation housing 100, which is increased due to the deletion of the radome. Since the antenna module 110 is disposed in the front heat dissipation housing 100 of the antenna device 1 and exposed to the outside air, front and rear heat dissipation of the antenna device 1 is possible, and the heat dissipation performance is greatly improved. have an enhancing effect.

In the above, the antenna device according to an embodiment of the present invention has been described in detail with reference to the accompanying drawings. However, it should be taken for granted that the embodiments of the present invention are not necessarily limited by the above-described embodiment, and various modifications and implementation within the equivalent range are possible by those skilled in the art to which the present invention belongs. will be. Therefore, it will be said that the true scope of the present invention is determined by the claims described later.

1: antenna device 100: front heat dissipation housing
110: antenna module cover 120: printed circuit board
121: director 122: antenna patch unit
124: feed line 125: director fixing hole
140: antenna placement unit 150: heat dissipation unit
170: filter 180: fixing screw
200: rear heat dissipation housing 210: rear heat dissipation fin
220: main board

Claims (23)

At least one antenna arranging unit in which at least one radiating element is disposed on the front side;
a front heat dissipation housing including a heat dissipation unit that is integrally formed between adjacent antenna disposition units among the at least one antenna disposition unit and transfers heat generated from the rear side to the front when exposed to the outside air; and
a rear heat dissipation housing coupled to the front heat dissipation housing and having a main board on which a filter for filtering an RF signal and an RF element are mounted therein; including,
The heat generated by the filter is transferred to the front surface of the front heat dissipation housing through contact with the rear surface of the front heat dissipation housing using the filter itself as a heat transfer medium,
The radiating element may include: an antenna patch circuit part printed on a printed circuit board for a radiating element disposed on the antenna arranging part, and a radiation director electrically connected to the antenna patch circuit part; Including,
The at least two antenna patch circuit units and the radiating director form one antenna module,
The antenna module further includes an antenna module cover that seals the antenna patch circuit unit except for the radiation director exposed to the outside air to protect it. A plurality of radiating elements generating one of the double polarized waves;
The plurality of radiating elements are integrally formed between a plurality of antenna placing parts arranged to be spaced apart from each other so as to be disposed on the front side and mutually adjacent antenna placing parts among the plurality of antenna placing parts, and heat generated from the rear by being exposed to the outside air. A front heat dissipation housing including a heat dissipation unit that transmits a front heat dissipation unit; and
a rear heat dissipation housing coupled to the front heat dissipation housing and accommodating a main board on which a filter for filtering an RF signal and an RF element are mounted; including,
The radiating element may include: an antenna patch circuit part printed on a printed circuit board for a radiating element disposed on the antenna arranging part, and a radiation director electrically connected to the antenna patch circuit part; Including,
The at least two antenna patch circuit units and the radiation director form one antenna module,
The antenna module further includes an antenna module cover that seals the antenna patch circuit unit except for the radiation director exposed to the outside air to protect it. According to claim 1 or claim 2,
The radiation director is formed of a conductive metal material, the antenna device. According to claim 1 or claim 2,
The radiation director induces the direction of the radiation beam in the forward direction and at the same time transfers the heat generated from the rear of the printed circuit board for the radiating element forward through thermal conduction. The method of claim 4,
a PSU unit including a PSU substrate stacked and arranged at the same height as the main board in an inner space of the rear heat dissipation housing and having a plurality of electronic devices including PSU devices mounted on either a front or rear surface; Including more,
The heat generated from the rear of the printed circuit board for the radiating element is heat generated from the filter and the plurality of electrical elements, the antenna device. The method of claim 4,
The radiation director is made of a thermally conductive material capable of conducting the heat, the antenna device. According to claim 1 or claim 2,
The upper surface of the printed circuit board for the radiating element is formed with a power supply line for supplying a power signal to the antenna patch circuit unit. delete According to claim 1 or claim 2,
A through hole is formed on one surface of the antenna module cover,
The radiation director is coupled to be exposed to the outside air on the front surface of the antenna module cover, and is electrically connected to the patch circuit unit through the through hole. According to claim 1 or claim 2,
The antenna module cover is injection molded,
A director fixing part conforming to the rear surface of the radiation director is provided on one surface of the antenna module cover, and at least one director fixing protrusion connectable to the radiation director protrudes forward from the director fixing part,
The radiation director is press-fitted and fixed into at least one director fixing groove formed to be recessed at a position corresponding to the at least one director fixing protrusion on the rear surface. According to claim 1 or claim 2,
The antenna module cover is injection molded,
A filter fixing hole for coupling with the filter is formed through the antenna module cover. According to claim 1 or claim 2,
The antenna module cover is injection molded,
In the antenna module cover, at least one substrate fixing hole for screw fastening by a fixing screw with the printed circuit board for the radiating element is formed through, the antenna device. The method of claim 12,
At least one fixing boss exposed to the rear surface of the antenna module cover through the substrate fixing hole is formed on the rear surface of the radiation director;
The antenna device for the printed circuit board for the radiating element is fixed to the rear surface of the antenna module cover by an operation in which the fixing screw is fastened to the fixing boss. The method of claim 13,
The fixing screw is provided with a flat head screw fastened so that the rear end surface matches the front surface of the filter, the antenna device. According to claim 1 or claim 2,
The antenna device, wherein the antenna module cover is injection molded, and at least one reinforcing rib is integrally formed on one surface of the antenna module cover. According to claim 1 or claim 2,
At least four positioning holes are formed on the printed circuit board for the radiating element,
In the printed circuit board for the radiating element, at least two positioning protrusions formed on the rear surface of the antenna module cover provided to cover the front surface are press-fitted and inserted into two position setting holes among the four position setting holes, and the rear surface is At least two positioning protrusions formed on the front surface of the front heat dissipation housing provided to be in close contact with each other are press-fitted and inserted into two positioning holes among the four positioning holes. According to claim 1 or claim 2,
An antenna device in which a thermal pad is interposed between the filter and the rear surface of the front heat dissipation housing. According to claim 1 or claim 2,
An FPGA (Field Programmable Gate Array) is disposed on the upper surface of the main board,
The antenna device, wherein the heat generated in the FPGA is transferred to the heat dissipation part on the front side of the front heat dissipation housing through the rear surface of the front heat dissipation housing. The method of claim 18
Heat generated in the FPGA is transmitted through any one of a heat pipe or a vapor chamber connecting the FPGA and the rear surface of the front heat dissipation housing. According to claim 1 or claim 2,
The filter is integrally formed with a clamshell that performs a signal blocking function at the rear end,
Heat generated inside the filter shielded by the clamshell is dissipated to the rear through the rear heat dissipation housing. The method of claim 20
The filter is fixed to the main board via a fixing pipe protruding rearward from the end of the clem shell and having a hollow inside,
An antenna device, wherein a heat dissipation via hole communicating with the fixing pipe is formed on the main board. The method of claim 21,
The heat dissipation via hole is plated with a thermally conductive material, the antenna device. The method of claim 1,
The front heat dissipation housing is made of a metal material, and the at least one antenna mounting portion is disposed to be exposed to the outside air,
Of the heat generated in the front of the main board as the rear of the front heat dissipation housing, some of the heat is dissipated forward through the at least one radiating element, and the rest is dissipated forward through the front heat dissipation housing,
Heat generated to the rear of the main board is dissipated to the rear via the rear heat dissipation housing.

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