KR102520856B1 - P-n 접합층을 포함하는 빔 스티어링 소자 - Google Patents
P-n 접합층을 포함하는 빔 스티어링 소자 Download PDFInfo
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- 239000000463 material Substances 0.000 claims description 9
- 239000004065 semiconductor Substances 0.000 claims description 5
- AMGQUBHHOARCQH-UHFFFAOYSA-N indium;oxotin Chemical compound [In].[Sn]=O AMGQUBHHOARCQH-UHFFFAOYSA-N 0.000 claims description 4
- ATJFFYVFTNAWJD-UHFFFAOYSA-N Tin Chemical compound [Sn] ATJFFYVFTNAWJD-UHFFFAOYSA-N 0.000 claims description 3
- 239000000956 alloy Substances 0.000 claims description 3
- 229910045601 alloy Inorganic materials 0.000 claims description 3
- 229910052782 aluminium Inorganic materials 0.000 claims description 3
- 229910052737 gold Inorganic materials 0.000 claims description 3
- 229910052710 silicon Inorganic materials 0.000 claims description 3
- 239000010703 silicon Substances 0.000 claims description 3
- 229910052709 silver Inorganic materials 0.000 claims description 3
- YVTHLONGBIQYBO-UHFFFAOYSA-N zinc indium(3+) oxygen(2-) Chemical compound [O--].[Zn++].[In+3] YVTHLONGBIQYBO-UHFFFAOYSA-N 0.000 claims description 3
- XLOMVQKBTHCTTD-UHFFFAOYSA-N zinc oxide Inorganic materials [Zn]=O XLOMVQKBTHCTTD-UHFFFAOYSA-N 0.000 claims description 3
- 239000011787 zinc oxide Substances 0.000 claims description 3
- 229910018565 CuAl Inorganic materials 0.000 claims description 2
- 230000003287 optical effect Effects 0.000 description 10
- 238000004519 manufacturing process Methods 0.000 description 5
- 238000000034 method Methods 0.000 description 5
- 239000012535 impurity Substances 0.000 description 3
- 230000015572 biosynthetic process Effects 0.000 description 2
- 239000003990 capacitor Substances 0.000 description 2
- 238000010586 diagram Methods 0.000 description 2
- 238000012986 modification Methods 0.000 description 2
- 230000004048 modification Effects 0.000 description 2
- 229910052581 Si3N4 Inorganic materials 0.000 description 1
- VYPSYNLAJGMNEJ-UHFFFAOYSA-N Silicium dioxide Chemical compound O=[Si]=O VYPSYNLAJGMNEJ-UHFFFAOYSA-N 0.000 description 1
- 230000015556 catabolic process Effects 0.000 description 1
- 239000002019 doping agent Substances 0.000 description 1
- 229910000449 hafnium oxide Inorganic materials 0.000 description 1
- WIHZLLGSGQNAGK-UHFFFAOYSA-N hafnium(4+);oxygen(2-) Chemical compound [O-2].[O-2].[Hf+4] WIHZLLGSGQNAGK-UHFFFAOYSA-N 0.000 description 1
- TWNQGVIAIRXVLR-UHFFFAOYSA-N oxo(oxoalumanyloxy)alumane Chemical compound O=[Al]O[Al]=O TWNQGVIAIRXVLR-UHFFFAOYSA-N 0.000 description 1
- 238000000059 patterning Methods 0.000 description 1
- HQVNEWCFYHHQES-UHFFFAOYSA-N silicon nitride Chemical compound N12[Si]34N5[Si]62N3[Si]51N64 HQVNEWCFYHHQES-UHFFFAOYSA-N 0.000 description 1
- 229910052814 silicon oxide Inorganic materials 0.000 description 1
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- H01S3/005—Optical devices external to the laser cavity, specially adapted for lasers, e.g. for homogenisation of the beam or for manipulating laser pulses, e.g. pulse shaping
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- H01S5/042—Electrical excitation ; Circuits therefor
- H01S5/0421—Electrical excitation ; Circuits therefor characterised by the semiconducting contacting layers
- H01S5/0422—Electrical excitation ; Circuits therefor characterised by the semiconducting contacting layers with n- and p-contacts on the same side of the active layer
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- H01S5/00—Semiconductor lasers
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- H01S5/00—Semiconductor lasers
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- H01S5/32—Structure or shape of the active region; Materials used for the active region comprising PN junctions, e.g. hetero- or double- heterostructures
- H01S5/3211—Structure or shape of the active region; Materials used for the active region comprising PN junctions, e.g. hetero- or double- heterostructures characterised by special cladding layers, e.g. details on band-discontinuities
- H01S5/3216—Structure or shape of the active region; Materials used for the active region comprising PN junctions, e.g. hetero- or double- heterostructures characterised by special cladding layers, e.g. details on band-discontinuities quantum well or superlattice cladding layers
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- B82Y—SPECIFIC USES OR APPLICATIONS OF NANOSTRUCTURES; MEASUREMENT OR ANALYSIS OF NANOSTRUCTURES; MANUFACTURE OR TREATMENT OF NANOSTRUCTURES
- B82Y20/00—Nanooptics, e.g. quantum optics or photonic crystals
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Abstract
상기 p-n 접합층은 순차적으로 적층된 p 도핑층과 n 도핑층을 포함한다.
Description
도 2는 도 1의 Ⅱ-Ⅱ' 선단면도다.
도 3은 실시예에 따른 스티어링 소자의 동작을 설명하는 그래프다.
도 4는 실시예에 따른 스티어링 소자의 동작을 설명하는 도면이다.
도 5는 실시예에 따른 p-n 접합층을 포함하는 빔 스티어링 소자의 구조를 개략적으로 보여주는 단면도다.
도 6은 실시예에 따른 p-n 접합층을 포함하는 빔 스티어링 소자의 구조를 개략적으로 보여주는 단면도다.
도 7은 실시예에 따른 p-n 접합층을 포함하는 빔 스티어링 소자의 구조를 개략적으로 보여주는 단면도다.
도 8은 실시예에 따른 p-n 접합층을 포함하는 빔 스티어링 소자의 구조를 개략적으로 보여주는 단면도다.
120: 반사전극층 122: 반사전극
130: p-n 접합층 132: p 도핑층
134: n 도핑층 150: 나노안테나
152: 요소 160: 배선
Claims (16)
- 반사전극층;
상기 반사전극층 상에서 상기 반사전극층에 인가된 전압에 의해 굴절률이 변하는 p-n 접합층;
상기 p-n 접합층 상에서 복수의 요소들을 포함하는 나노안테나층; 및
상기 복수의 요소들을 전기적으로 연결하는 공통전극;을 포함하며,
상기 p-n 접합층은 순차적으로 적층된 p 도핑층과 n 도핑층을 포함하고,
상기 p 도핑층은 p형 산화물 반도체 및 실리콘을 포함하는 빔 스티어링 소자. - 삭제
- 제 1 항에 있어서,
상기 p 도핑층은 CuAl2O, NiO, CuO 를 포함하는 빔 스티어링 소자. - 제 1 항에 있어서,
상기 n 도핑층은 ITO(Indium-Tin-Oxide), IZO(Indium-Zinc-Oxide), GIZO(Ga-In-Zn-Oxide), AZO(Al-Zn-Oxide), GZO(Ga-Zn-Oxide), ZnO 를 포함하는 빔 스티어링 소자. - 제 1 항에 있어서,
상기 반사전극층은 서로 이격된 복수의 반사전극을 포함하며, 각 반사전극은 해당 픽셀영역에 대응되게 형성된 빔 스티어링 소자. - 제 5 항에 있어서,
복수의 구동부를 포함하는 구동회로를 더 포함하며,
상기 구동부는 대응되는 반사전극에 구동전압을 인가하는 빔 스티어링 소자. - 제 6 항에 있어서,
상기 반사전극 및 상기 복수의 요소들은 Ag, Au, Al 또는 이들 중 적어도 하나의 물질을 포함하는 합금 및 TiN, TaN 을 포함하는 빔 스티어링 소자. - 제 1 항에 있어서,
상기 공통전극은 상기 복수의 요소들을 연결하는 배선인 빔 스티어링 소자. - 제 1 항에 있어서,
상기 공통전극은 상기 p-n 접합층과 상기 나노안테나 사이의 투명전극층인 빔 스티어링 소자. - 제 1 항에 있어서,
상기 p 도핑층과 상기 n 도핑층 사이의 인트린식층을 더 포함하며, 상기 인트린식층은 상기 p 도핑층 및 상기 n 도핑층의 도핑 농도 보다 낮은 도핑농도를 가지는 빔 스티어링 소자. - 제 1 항에 있어서,
상기 p-n 접합층과 상기 나노안테나 사이의 절연층을 더 포함하는 빔 스티어링 소자. - 제 11 항에 있어서,
상기 절연층은 10 nm ~ 20 nm 두께를 가지는 빔 스티어링 소자. - 제 11 항에 있어서, 상기 공통전극은 상기 p-n 접합층과 상기 절연층 사이 또는 상기 절연층 및 상기 나노안테나 사이의 투명전극층인 빔 스티어링 소자.
- 제 1 항에 있어서,
상기 복수의 요소는 평면도에서 볼 때, 원형, 타원형, 또는 다각형 형상을 가진 빔 스티어링 소자. - 제 1 항에 있어서,
상기 나노안테나층의 상기 요소는 상기 나노안테나층에 조사되는 빔의 파장 보다 작은 직경을 가지며, 상기 요소들 사이의 간격은 상기 파장 보다 작은 빔 스티어링 소자. - 제 1 항에 있어서,
상기 p 도핑층은 상기 반사전극층 바로 위에 배치된 빔 스티어링 소자.
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US15/656,318 US10234743B2 (en) | 2016-07-21 | 2017-07-21 | Beam steering device including P-N junction layer |
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JP7144188B2 (ja) * | 2018-05-15 | 2022-09-29 | 浜松ホトニクス株式会社 | 反射型動的メタサーフェス |
US10831082B2 (en) | 2018-05-30 | 2020-11-10 | Samsung Electronics Co., Ltd. | Apparatus and method for controlling laser light propagation direction by using a plurality of nano-antennas |
RU2680431C1 (ru) * | 2018-05-30 | 2019-02-21 | Самсунг Электроникс Ко., Лтд. | Устройство и способ для управления направлением распространения луча |
US12292380B2 (en) * | 2018-07-25 | 2025-05-06 | Cornell University | Integrated microfluidic device for capture and spectroscopic characterization of live cells under various treatment conditions |
KR102710728B1 (ko) * | 2018-09-11 | 2024-09-27 | 삼성전자주식회사 | 광변조 소자와 그 동작방법 및 광변조 소자를 포함하는 장치 |
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KR102682127B1 (ko) | 2018-11-07 | 2024-07-08 | 삼성전자주식회사 | 광변조 소자와 그 동작방법 및 광변조 소자를 포함하는 장치 |
US11302248B2 (en) | 2019-01-29 | 2022-04-12 | Osram Opto Semiconductors Gmbh | U-led, u-led device, display and method for the same |
US11271143B2 (en) | 2019-01-29 | 2022-03-08 | Osram Opto Semiconductors Gmbh | μ-LED, μ-LED device, display and method for the same |
DE112020000561A5 (de) | 2019-01-29 | 2021-12-02 | Osram Opto Semiconductors Gmbh | Videowand, treiberschaltung, ansteuerungen und verfahren derselben |
CN113646910A (zh) * | 2019-02-11 | 2021-11-12 | 奥斯兰姆奥普托半导体股份有限两合公司 | 光电组件、光电装置和方法 |
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