KR102483645B1 - Communication device to perform wireless communcation and wireless power transfer, and electrode device to transmit and receive electrical signal from target - Google Patents

Abstract

A wireless device comprising a communication device and an electrode device is provided. In the communication device, individual elements may be arranged in a region on the coil, and in the electrode device, a plurality of electrodes may be arranged along the length direction of the substrate.

Description

Electrode device for transmitting and receiving electrical signals from communication devices and targets that perform wireless communication and wireless power transmission

Hereinafter, a communication device and an electrode device are provided.

As communication technologies such as short-distance wireless communication or Bluetooth and wireless power transmission technology develop, electronic devices, for example, mobile communication terminals, require antenna devices that operate in a variety of different frequency bands.

When a plurality of antenna modules are mounted, wireless signals and wireless power of various frequency bands can be transmitted and received, and data transmission speed and wireless power transmission speed can be increased during transmission and reception. Therefore, the size of the mounted antenna module is limited.

According to one embodiment, a communication device includes a processor disposed in a core region of a coil and establishing communication with an external device through the coil; and at least one discrete element disposed on the coil and connected to the processor through a via.

The processor may be disposed in a layer distinct from the coil.

The individual device may include a passive device configured to isolate a voltage between a plurality of circuits within a chip in which the processor is implemented.

The individual device may include at least one of a capacitor, an inductor, and a resistor connected to a chip on which the processor is implemented through a via, and a circuit different from the coil within an outer edge ring region on the coil. Can be placed in layers.

The communication device includes a first transceiver circuit for transmitting and receiving signals of a first bandwidth through the coil; and a second transceiver circuit for transmitting and receiving signals of a second bandwidth distinct from the first bandwidth through the coil, wherein the first transceiver circuit and the second transceiver circuit are implemented on the same chip as the processor. It can be.

The first transceiver circuit may operate below a first threshold voltage, and the second transceiver circuit may operate above a second threshold voltage greater than the first threshold voltage.

The communication device may further include an electrode router circuit connected to a plurality of electrodes, and the electrode router circuit may be implemented on the same chip as the processor.

The electrode router circuit connects a first electrode of the plurality of electrodes to a sensing circuit, and connects a second electrode of the plurality of electrodes to a driving circuit, wherein the sensing circuit , An electrical signal corresponding to a point to which the first electrode is attached may be detected through the first electrode, and the driving circuit may apply an electrical signal to a point where the second electrode is attached through the second electrode. there is.

The sensing circuit may operate below the first threshold voltage, and the driving circuit may operate above a second threshold voltage higher than the first threshold voltage.

The coil may include a first partial coil configured to resonate at a first bandwidth; and a second partial coil configured to resonate in a second bandwidth distinct from the first bandwidth, wherein the first partial coil and the second partial coil may share at least a partial loop.

The first partial coil may include a loop configured to generate a magnetic field in a first direction, and the second partial coil may include a loop configured to generate an electric field in the first direction.

The communication device includes at least one embedded element disposed on a layer distinct from the layer where the coil is disposed and the layer where the processor is disposed, and connected to the processor through a via, and sensing motion of the communication device. A motion sensor may be further included.

A chip in which the processor is implemented may be spaced apart from the coil by a critical distance or more.

The processor may be connected to a plurality of electrodes disposed in a shape surrounding an object, and may receive electrical signals from at least some of the plurality of electrodes or provide electrical signals to at least some of the plurality of electrodes.

The processor may allocate a sensing channel to at least some of the plurality of electrodes and allocate a stimulation channel to at least some of the remaining electrodes, based on the received electrical signal.

An electrode device according to an embodiment includes a substrate made of a flexible material and covering a target; a plurality of electrodes arranged along a longitudinal direction of the substrate on a surface of the substrate that contacts the object; and an electrode router connecting the plurality of electrodes and the processor.

The substrate may be arranged to surround the object in a helical shape.

The electrode router transmits an electrical signal sensed through a first electrode of the plurality of electrodes to the processor, and to a point of the object where the first electrode and a second electrode of the plurality of electrodes contact each other. An electrical signal can be applied.

The processor may allocate at least some of the plurality of electrodes to a sensing channel of the electrode router, and allocate at least some of the remaining electrodes to a stimulating channel of the electrode router.

The plurality of electrodes may be classified into a plurality of channels, and may be arranged on the substrate so that electrodes belonging to each channel among the plurality of channels are adjacent to each other.

The plurality of electrodes may be classified into a plurality of channels, and may be arranged on the substrate so that electrodes belonging to each channel among the plurality of channels are not adjacent to each other.

The processor allocates at least some of the plurality of electrodes to the sensing channel of the electrode router based on the electrical signal detected from the target, and allocates another part of the plurality of electrodes to the stimulation channel of the electrode router. can be assigned

The processor allocates a channel to the plurality of electrodes so that the electrodes belonging to each channel are adjacent to each other on the substrate in response to a case where the electrical signal detected from the target includes common noise above a threshold. can do.

The processor, in response to a case in which an electrical signal detected from the object includes less than a threshold common noise, channel the plurality of electrodes so that the electrodes belonging to each channel are not adjacent to each other on the substrate. can be assigned.

1 and 2 are diagrams illustrating the configuration of a wireless system according to an embodiment.
3 is a diagram showing the configuration of a relay device according to an embodiment.
4 is a diagram illustrating a configuration of a wireless device according to an embodiment.
5 is a diagram illustrating elements constituting a wireless device according to an embodiment.
6 to 8 are diagrams for explaining the structure of a communication device according to an embodiment.
9 to 11 are diagrams explaining the structure of a communication device according to another embodiment.
12 to 14 are diagrams for explaining the configuration of a communication device according to an embodiment.
15 is a diagram illustrating a separation distance between a coil and a chip in a communication device according to an exemplary embodiment.
16 and 17 are diagrams for explaining the structure of a coil of a communication device according to an exemplary embodiment.
18 and 19 are views illustrating a communication device and an electrode device according to an exemplary embodiment.
20 is a diagram explaining the arrangement of an electrode device according to an embodiment.
21 and 22 are diagrams illustrating an electrode channel of an electrode device according to an exemplary embodiment.
23 is a diagram illustrating dynamic allocation of electrode channels of an electrode device according to an exemplary embodiment.
24 and 25 are diagrams illustrating differential signals according to allocation of electrode channels according to an exemplary embodiment.
26 and 27 are diagrams for explaining the configuration of a communication device according to another embodiment.

Hereinafter, embodiments will be described in detail with reference to the accompanying drawings. However, the scope of the patent application is not limited or limited by these examples. Like reference numerals in each figure indicate like elements.

Various changes may be made to the embodiments described below. The embodiments described below are not intended to be limiting on the embodiments, and should be understood to include all modifications, equivalents or substitutes thereto.

Terms used in the examples are used only to describe specific examples, and are not intended to limit the examples. Expressions in the singular number include plural expressions unless the context clearly dictates otherwise. In this specification, terms such as "include" or "have" are intended to designate that there is a feature, number, step, operation, component, part, or combination thereof described in the specification, but one or more other features It should be understood that the presence or addition of numbers, steps, operations, components, parts, or combinations thereof is not precluded.

Unless defined otherwise, all terms used herein, including technical or scientific terms, have the same meaning as commonly understood by a person of ordinary skill in the art to which the embodiment belongs. Terms such as those defined in commonly used dictionaries should be interpreted as having a meaning consistent with the meaning in the context of the related art, and unless explicitly defined in the present application, they should not be interpreted in an ideal or excessively formal meaning. don't

In addition, in the description with reference to the accompanying drawings, the same reference numerals are given to the same components regardless of reference numerals, and overlapping descriptions thereof will be omitted. In describing the embodiment, if it is determined that a detailed description of a related known technology may unnecessarily obscure the gist of the embodiment, the detailed description will be omitted.

1 and 2 are diagrams illustrating the configuration of a wireless system according to an embodiment.

As shown in FIG. 1 , the wireless system 100 includes a wireless device 110 and an external device 120 . In addition, the wireless system 200 may further include a relay device 230 as shown in FIG. 2 .

The wireless device 110 may wirelessly communicate with the external device 120 . The wireless device 110 may establish communication with the external device 120 either directly or via a relay station. The wireless device 110 may be configured to cover the object 190 and may apply an electrical signal to the object 190 or detect an electrical signal from the object 190 . The wireless device 110 may transmit a signal detected from the target 190 to the external device 120 . In addition, the wireless device 110 may periodically apply an electrical signal to the target 190 . The wireless device 110 may change the cycle of applying the electric signal, the arrangement of the electrodes, and the intensity based on the control signal received from the external device 120 .

Furthermore, the wireless device 110 may wirelessly receive power from at least one of the external device 120 and the relay device 230 . According to an embodiment, the wireless device 110 may charge a built-in battery based on power received from at least one of the external device 120 and the relay device 230 . For example, the wireless device 110 may request wireless power transmission from at least one of the relay device 230 and the external device 120 when the power charged in the built-in battery is discharged below the threshold power. The wireless device 110 according to an embodiment may be attached to the target 190 and may be arranged to transmit and receive power through the same magnetic field direction as the relay device 230 . The wireless device 110 may perform wireless power transmission by forming mutual resonance between the relay device 230 and a coil.

The relay device 230 may relay communication between the wireless device 110 and the external device 120 . According to an embodiment, the relay device 230 may exchange information between the wireless device 110 and the external device 120 . For example, the relay device 230 may receive an electrical signal detected by the wireless device 110 from the wireless device 110 and transmit it to the external device 120 . For another example, the relay device 230 may transfer information or commands received from the external device 120 to the relay device 230 .

The relay device 230 according to an embodiment may be worn on an object related to the target 190 . The relay device 230 may be attached to a portion of an object adjacent to the target 190 . For example, the object may be a human or animal, the object 190 may be a nerve, and a site adjacent to the object 190 may be a skin site adjacent to the vagus nerve. The nerve may be the vagus nerve. In this case, the wireless device 110 may stimulate the vagus nerve by applying an electrical signal to the vagus nerve within a range of voltage, current, and power that does not cause injury to the human body.

Also, the relay device 230 may provide the wireless device 110 with power charged in a built-in battery. The size of the wireless device 110 may be relatively small compared to the relay device 230, and the battery capacity may also be small. The relay device 230 may charge the battery of the wireless device 110 by providing power to the wireless device 110 in response to receiving a wireless power transmission request from the wireless device 110 . The relay device 230 may extend the operation time of the relay device 230 by charging the battery of the wireless device 110 . The structure of the relay device 230 will be described in detail in FIG. 3 below.

The external device 120 may be a device that collects information received from the wireless device 110 or transmits a command to control the operation of the wireless device 110 to the wireless device 110 . In addition, the external device 120 may wirelessly provide power to at least one of the wireless device 110 and the relay device 230 . For example, the external device 120 may process information received from the wireless device 110 and output the processed result as visual information and auditory information.

The wireless device 110 and the relay device 230 according to an embodiment may be miniaturized based on the arrangement of coils, individual elements, and built-in elements. Also, based on alignment directions of coils included in the wireless device 110 and the relay device 230, the wireless device 110 and the relay device 230 can perform efficient wireless communication and wireless charging.

For example, the wireless device 110 inserted into an object and attached to the object 190 and the relay device 230 attached to the object have high transmission efficiency even in a small size through a structure in which resonance directions of coils are mutually aligned. can represent If the object is a human body, the wireless device 110 may be inserted into the object's surface, and the relay device 230 may be attached to the outside of the surface.

The wireless device 110 according to an embodiment may treat patients with neurological disorders such as epilepsy by continuously applying electrical signals to the target 190 (eg, nerves of the human body). In addition, the wireless device 110 can suppress chronic pain such as rheumatoid arthritis by applying an electrical signal to the subject 190 . In addition, the relay device 230 may exhibit high power transfer efficiency to the wireless device 110 without the need for the relay device 230 to wrap around an object (eg, a person's neck).

3 is a diagram showing the configuration of a relay device according to an embodiment.

The relay device 230 includes a coil 310 , a processor 320 , and a flexible battery 330 . According to an embodiment, the relay device 230 is made of flexible materials, so that it can be closely attached to the surface of a curved object in a bandage form.

A resonance direction of the coil 310 may be designed to match a resonance direction of a wireless device inserted into an object. The coil 310 may form a mutual resonance with the coil of the wireless device. For example, the resonant frequency of the coil 310 can be designed to match the resonant frequency of the coil of the wireless device.

The processor 320 may be disposed on a flexible substrate and may control the operation of the relay device 230 . For example, the processor 320 may charge the flexible battery 330 by receiving power from an external device through the coil 310 . The processor 320 may transfer the electric power charged in the flexible battery 330 to the wireless device through the coil 310 .

The flexible battery 330 may be made of a flexible material and may supply power to each module of the relay device 230 . For example, when the power of the battery 330 is consumed, the relay device 230 may be replaced with a new relay device 230 by a user. Accordingly, the user can conveniently exchange the relay device 230 attached to the external surface of the object without having to replace the battery 330 of the wireless device inserted inside the object.

4 is a diagram illustrating a configuration of a wireless device according to an embodiment.

The wireless device 110 may include an electrode device 410 and a communication device 420 .

The electrode device 410 may include a plurality of electrodes disposed to surround the target 190 . A plurality of channels may be assigned to a plurality of electrodes. The plurality of channels may include, for example, a sensing channel for sensing an electrical signal and a stimulating channel for applying an electrical signal. Therefore, the electrode device 410 may simultaneously perform an operation of sensing an electrical signal from the object 190 and an operation of applying an electrical signal to the object 190 through separate channels.

The communication device 420 may include a coil capable of resonating with a repeater existing outside the object. For example, a coil included in the relay device and a coil included in the communication device 420 may be designed to have the same or similar resonance frequencies. In addition, the communication device 420 may include a coil forming the same resonance direction 409 as the relay device. Components of the communication device 420 may be arranged within a limited form factor based on a space above and below the coil.

A housing of the wireless device 110 may have a water-repellent coating or a water-proof coating. In addition, the housing of the wireless device 110 is made of a bio-compatible material, and the wireless device 110 can be packaged. An interface (eg, a neural interface) of the electrode device 410 may be disposed in a form surrounding the object 190 (eg, a nerve) through a straight electrode arrangement. Electrodes of the neural interface of the electrode device 410 may be disposed to contact the target 190 .

5 is a diagram illustrating components constituting a wireless device according to an embodiment.

Elements constituting the wireless device may be classified according to the function and size of each element.

The discrete element 510 may represent an element disposed on a coil and connected to a chip through a via. According to an embodiment, the individual element 510 may be a passive element configured to isolate a voltage between a plurality of circuits in a processor-implemented chip. For example, the individual element 510 may be a capacitor, an inductor, and a resistor connected to a chip in which a processor is implemented through vias. Individual elements 510 may have dimensions within, for example, 0.6 x 0.3 mm.

The embedded element 520 may represent an element disposed on a layer distinct from a layer in which a coil is disposed and a layer in which a processor is disposed, and connected to the processor through a via. Embedded element 520 may have a size between 2 x 1.6 mm and 1 x 0.5 mm, for example.

An electrode contact 530 may represent a contact connected to an electrode. For example, the electrode contact 530 may be implemented with a conductive metal material. The electrode contact 530 may have a size of, for example, 1 x 1 mm or less.

A battery contact 540 may represent a contact connected to a battery. For example, the battery contact 540 may be implemented with a conductive metal material. The battery contact 540 may have a size of, for example, 2 x 2 mm or less.

The chip package 550 may represent a chip on which various functions are implemented. For example, a chip may include a processor, a communication-related circuit, an electrode-related circuit, and a battery-related circuit. Circuits included in the chip will be described with reference to FIGS. 13 and 14 below. The chip package 550 may have a size of, for example, 3 x 3 mm or less.

The substrate 560 may represent an element on which a coil, an individual device 510, an embedded device 520, an electrode contact 530, a battery contact 540, and a chip package 550 are disposed. For example, the substrate 560 may be implemented with a bio-compatible and flexible material. For example, the substrate 560 may have a size of 5 x 5 mm in a communication device, and may have a size of 2 x 30 mm to 2 x 50 mm in an electrode device.

According to an embodiment, a wireless device may be miniaturized through a structure in which the above elements are stacked. For example, a mounting space may be secured by disposing the individual elements 510 on a coil and transferring a signal received through the coil to a processor through a via. In addition, by disposing the chip package 550 and the embedded element 520 in the core region inside the coil spaced apart from the core by a critical distance, the mounting space may be configured as a three-dimensional space. The chip package 550 may be referred to as a chip below.

6 to 8 are diagrams for explaining the structure of a communication device according to an embodiment.

6 is a top view of the communication device 600, FIG. 7 is a perspective view of the communication device 600, and FIG. 8 is a front view of the communication device 600.

In the communication device 600, the individual element 610, the chip 650, and the embedded element 620 may be disposed on an upper layer based on the layer in which the coil 670 is disposed. The electrode contact 630 , the battery contact 640 , and the substrate 660 may be disposed on a lower layer based on the layer on which the coil 670 is disposed. For example, a processor included in the chip 650 may be disposed on a layer distinct from the coil 670 .

According to an embodiment, the individual element 610 may be disposed on the coil 670 in a layer distinct from the layer on which the coil 670 is disposed (eg, an upper layer). For example, the individual element 610 may be disposed on a different layer from the coil 670 within an outer edge ring area of the coil 670 excluding the core area 601 . Accordingly, the individual element 610 may be less affected by a magnetic field or an electric field formed by the coil 670 in the core region 601 of the coil 670 . For example, the individual elements 610 may be disposed on the coil 670 to be spaced apart from other individual elements by a predetermined distance or more. Also, the individual elements 610 may be arranged at regular intervals along the coil 670 (eg, an interval obtained by dividing the circumferential length of the coil 670 by the number of individual elements 610).

A chip 650 in which a processor is implemented may be disposed in the core region 601 of the coil 670 .

The embedded element 620 may be disposed on a layer distinct from a layer on which the coil 670 is disposed and a layer on which the processor is disposed. For example, the embedded element 620, which is large to be disposed on the coil 670 or has a large area, may be disposed on a layer below the layer on which the chip 650 is disposed within the core region 601 .

According to one embodiment, the embedded element 620 may be an isolation network circuit for separating the signal of the first bandwidth and the signal of the second bandwidth. In addition, the built-in element 620 is connected to a first capacitor connected to the first partial coil for receiving a signal of the first bandwidth and a second partial coil for receiving a signal of the second bandwidth in the coil 670 It may be a second capacitor or the like. Here, the first partial coil and the second partial coil may be configured to share at least some loops.

For example, the isolation network circuit may block a signal of a second bandwidth from flowing into a first transceiver circuit that transmits and receives a signal of a first bandwidth through a first partial coil. In addition, the isolation network circuit may block a signal of the first bandwidth from flowing into a second transceiver circuit that transmits and receives a signal of the second bandwidth through the second partial coil. For example, the isolation network circuitry may include a band-stop filter that blocks signals of a second bandwidth for the front end of the first transceiver circuit, and a band that blocks signals of the first bandwidth for the front end of the second transceiver circuit. A blocking filter may be included.

In this specification, the second bandwidth may be a bandwidth allocated for wireless power transmission, and the first bandwidth may be a bandwidth allocated for wireless communication. For example, the second bandwidth may represent a frequency band lower than the first bandwidth. However, it is not limited thereto, and the second bandwidth and the first bandwidth may be changed according to design.

The electrode contact 630, the battery contact 640, and the substrate 660 disposed on a lower layer based on the layer on which the coil 670 is disposed may be connected to the chip 650 through vias. . The electrode contact 630 , the battery contact 640 , and the substrate 660 may transmit and receive signals to and from the chip 650 through vias.

9 to 11 are diagrams explaining the structure of a communication device according to another embodiment.

FIG. 9 is a plan view of the communication device 900 , FIG. 10 is a perspective view of the communication device 900 , and FIG. 11 is a front view of the communication device 900 .

In the communication device 900 shown in FIG. 9, elements disposed on the upper layer of the coil, for example, individual elements 910, built-in elements 920, electrode contacts 930, and chips 950 are shown in FIG. Individual elements 810, embedded elements 820, electrode contacts 830, and chips 850 shown in may be arranged similarly.

The coil may include a first partial coil 970 configured to resonate in a first bandwidth and a second partial coil 980 configured to resonate in a second bandwidth distinct from the first bandwidth.

The first partial coil 970 and the second partial coil 980 may have different resonance directions. For example, the resonance direction of the first partial coil 970 and the resonance direction of the second partial coil 980 may be orthogonal to each other. According to an embodiment, the first partial coil 970 includes a loop configured to generate a magnetic field (E-field) in a first direction, and the second partial coil 980 includes a magnetic field (H) in a second direction. -field). The first direction and the second direction may be directions orthogonal to each other. In addition, the second partial coil 980 includes a loop configured to generate an electric field (E-field) in a first direction orthogonal to the second direction while generating a magnetic field (H-field) in a second direction. can do. Therefore, the first partial coil 970 and the second partial coil 980 perform wireless power transmission and wireless communication in the same direction without interfering with each other's magnetic field (H-field) and electric field (E-field). can be arranged so that

For example, as shown in FIG. 9 , the first partial coil 970 may be composed of planar loops. The second partial coil 980 may be composed of loops having a double helix structure. As shown in FIGS. 10 and 11 , the second partial coil 980 may be disposed to occupy a three-dimensional space under the layer on which the first partial coil 970 is disposed.

The battery contact 940 and the substrate 960 may be disposed on a layer below the second partial coil 980 .

12 to 14 are diagrams for explaining the configuration of a communication device according to an embodiment.

12 shows a general configuration of a communication device.

The communication device 1200 includes a discrete element 1210 , a processor 1250 , and a coil 1270 .

The coil 1270 may wirelessly establish communication with at least one of a relay device and an external device existing outside the object or receive wireless power.

The processor 1250 is disposed within the core region of the coil 1270 and may establish communication with an external device through the coil 1270 . In addition, the processor 1250 may be connected to a plurality of electrodes disposed in a form surrounding an object, receive electrical signals from at least some of the plurality of electrodes, or provide electrical signals to at least some of the plurality of electrodes. .

The individual element 1210 may be disposed on the coil 1270 and connected to the processor 1250 through a via. As described above, the individual element 1210 is arranged on a layer different from that of the coil 1270 in the area on the coil 1270, so that a mounting area inside the communication device 1200 can be secured. As shown in FIG. 12 , the individual element 1210 may be disposed on a different layer from the coil within an area where the coil is disposed (eg, a planar area). For example, the area where the coil 1270 is disposed may be in the form of an outer edge ring, and the individual elements 1210 may be disposed on a layer different from that of the coil 1270 within the outer ring area.

FIG. 13 describes a circuit of the communication device shown in FIGS. 6 to 8 .

The communication device 1300 may include an individual element 1310, a built-in element 1320, a chip 1350, a coil 1370, an electrode interface 1380, and a battery 1390.

은 비아를 통한 연결을 나타낼 수 있다. 이는 도 14에서도 동일하다.The individual device 1310 may separate voltages between a plurality of circuits within the chip 1350 in which the processor 1351 is implemented. For example, discrete components 1310 can de-couple noise from a power source (eg, power management circuit 1357, etc.) from the circuit. As described above, the individual element 1310 may be disposed on the coil 1370 and connected to the chip 1350 through vias. For example, in FIG. 13

may represent a connection through a via. This is the same in FIG. 14 as well.

Embedded device 1320 may be an inductor coupled to power management circuitry 1357 in chip 1350 . In addition, the built-in element 1320 may be a feeder 1371 for injecting power into the coil 1370 and a capacitor for setting a resonant frequency of the coil 1370.

The chip 1350 includes a processor 1351, a first transceiver circuit 1352, a second transceiver circuit 1353, a sensing circuit 1354, a driving circuit 1355, an electrode router circuit 1356 , power management circuitry 1357 , and battery management circuitry 1358 .

The first transceiver circuit 1352 may transmit and receive signals of the first bandwidth through the coil 1370 . For example, the first transceiver circuit 1352 may transmit and receive signals of a first bandwidth through a first partial coil of the coil 1370 . The second transceiver circuit 1353 may transmit and receive signals of a second bandwidth distinct from the first bandwidth through the coil 1370 . For example, the second transceiver circuit 1353 may transmit and receive signals of the second bandwidth through the second partial coil of the coil 1370 . Here, the first partial coil and the second partial coil may share at least a portion of the loop. As shown in FIG. 13 , the first transceiver circuit 1352 and the second transceiver circuit 1353 may be implemented with the same chip 1350 as the processor 1351 . For example, the first transceiver circuit 1352 may perform wireless communication through a signal of the first bandwidth. The second transceiver circuit 1353 may wirelessly receive power through the second bandwidth. Wireless communication may be far field communication, and wireless power transmission may be near field communication.

The sensing circuit 1354 may detect an electrical signal corresponding to a point where the first electrode is attached through the first electrode. The first electrode may represent an electrode connected to the sensing circuit 1354 through an electrode router among a plurality of electrodes included in the electrode interface 1380 . The first electrode may be an electrode to which a sensing channel is assigned. The sensing circuit 1354 may detect an electrical signal from a subject (eg, a nerve in the body).

The driving circuit 1355 may apply an electrical signal to a point where the second electrode is attached through the second electrode. The second electrode may indicate an electrode connected to the driving circuit 1355 through an electrode router among a plurality of electrodes included in the electrode interface 1380 . The second electrode may be an electrode to which a stimulation channel is assigned. The driving circuit 1355 may apply an electrical signal of a magnitude that does not cause injury to a target (eg, a human nerve).

The above-described sensing circuit 1354 and driving circuit 1355 may be analog front end (AFE).

The electrode router circuit 1356 may be connected to a plurality of electrodes. The electrode router circuit 1356 may be implemented with the same chip 1350 as the processor 1351 . The electrode router circuit 1356 connects a first electrode of the plurality of electrodes to a sensing circuit 1354 and connects a second electrode of the plurality of electrodes to a driving circuit 1355. can

The power management circuit 1357 may be a circuit for supplying power to each circuit in the communication device 1300 . For example, the power management circuit 1357 may manage and distribute the power received through the coil 1370 and the power obtained from the battery 1390 to each circuit.

Battery management circuitry 1358 can charge or discharge battery 1390 . For example, the battery management circuit 1358 may charge the battery 1390 with power obtained through the power management circuit 1357 . In addition, the battery management circuit 1358 may provide power obtained from the battery 1390 to the power management circuit 1357 .

FIG. 14 describes a circuit of the communication device shown in FIGS. 9 to 11 .

In FIG. 14, the individual elements 1410, the chip 1450, the electrode interface 1480, and the battery 1490 included in the communication device 1400 are individual elements 1310 included in the communication device 1300 of FIG. , the chip 1350, the electrode interface 1380, and the battery 1390 may be similar. The processor 1451, the sensing circuit 1454, the driving circuit 1455, the electrode router circuit 1456, the power management circuit 1457, and the battery management circuit 1458 included in the chip 1450 are also shown in FIG. It may be similar to processor 1351, sensing circuit 1354, drive circuit 1355, electrode router circuit 1356, power management circuit 1357, and battery management circuit 1358 included in 1350.

The communication device 1400 of FIG. 14 may include a first partial coil 1472 and a second partial coil 1473 . The first partial coil 1472 and the second partial coil 1473 may be connected to the first transceiver circuit 1452 and the second transceiver circuit 1453, respectively. The first transceiver circuit 1452 may transmit and receive signals of a first bandwidth, and the second transceiver circuit 1453 may transmit and receive signals of a second bandwidth.

Some of the plurality of embedded elements 1420 may be first capacitors that are connected to the first partial coil 1472 to set a resonant frequency of the first partial coil 1472 . Also, some other embedded elements among the plurality of embedded elements 1420 may include a second capacitor connected to the second partial coil 1473 to set a resonant frequency of the second partial coil 1473 . Another built-in device may be an inductor connected to the power management circuit 1457.

15 is a diagram illustrating a separation distance between a coil and a chip in a communication device according to an exemplary embodiment.

According to an embodiment, the processor-implemented chip 1550 may be spaced apart from the coil 1570 by a critical distance or more. As the separation distance 1501 between the coil 1570 and the chip 1550 increases, radiation efficiency of the coil 1570 may be improved.

For example, when the distance 1501 between the coil 1570 and the chip 1550 is secured by 1 mm, the radiation efficiency may deteriorate by about 2 dB compared to a structure in which only the coil 1570 is disposed. When the separation distance 1501 between the coil 1570 and the chip 1550 is less than 1 mm, radiation efficiency may deteriorate by about 5 dB compared to a structure in which only the coil 1570 is disposed.

In addition, even if a plurality of individual elements are disposed on the coil 1570, the degree of deterioration in radiation efficiency of the coil 1570 may be small. For example, even if 8 individual elements having a size of 1 mm in length and 0.05 mm in width are disposed in the region on the coil 1570 as shown in FIG. 15, the radiation efficiency may only deteriorate by about -0.4 dB. .

Therefore, the communication device minimizes the deterioration of radiation efficiency of the coil 1570 and maximizes space utilization by disposing individual elements on a different layer from the coil 1570 in the same planar area as the coil 1570. can have a structure.

16 and 17 are diagrams for explaining the structure of a coil of a communication device according to an exemplary embodiment.

In the communication device 1600 shown in FIG. 16 , the coil 1670 may include a first partial coil and a second partial coil, and the first partial coil and the second partial coil may share at least a portion of a loop.

According to an embodiment, the first partial coil and the second partial coil may be designed to have the same resonance axis, and the direction of the magnetic field generated by coil 1670 (second direction 1602 in FIG. 16) is along the resonance axis. can For example, the first partial coil may transmit/receive a signal used for wireless communication, and may establish wireless communication by generating an E-field in a first direction 1601 . The second partial coil may receive power wirelessly, and may receive power wirelessly by generating a magnetic field direction (H-field) in the second direction 1602 .

As shown in FIG. 16 , the first partial coil and the second partial coil can have the same magnetic field direction (eg, second direction 1602 ). Since the electric field direction and the magnetic field direction are orthogonal to each other, the first partial coil establishes wireless communication through the electric field (E-field) in the first direction (1601), and the second partial coil establishes wireless communication in the second direction (1602). ) can receive wireless power through a magnetic field (H-field). The first direction 1601 and the second direction 1602 may be orthogonal to each other.

Therefore, since the structure in which the first partial coil and the second partial coil share at least one loop in FIG. 16 is designed as a flat structure, space can be minimized, and the first direction 1601 of wireless communication and wireless power The second direction 1602 of transmission can be binary.

17 , the resonance direction of the first partial coil and the resonance direction of the second partial coil may be orthogonal to each other.

According to an embodiment, the first partial coil 1771 may have a planar loop structure, and the second partial coil 1772 may have a three-dimensional double helix loop structure.

For example, the magnetic field direction of the first partial coil 1771 and the magnetic field direction of the second partial coil 1772 may be designed to be orthogonal to each other. Since the electric field direction and the magnetic field direction are orthogonal to each other, the first partial coil 1771 includes a loop configured to generate a magnetic field (E-field) in the first direction 1701, and the second partial coil 1772 can include a loop configured to generate an electric field in a first direction 1702 . The first partial coil 1771 may establish wireless communication in the first direction 1701 , and the second partial coil 1772 may receive wireless power from the first direction 1702 . Accordingly, the communication device 1700 may perform wireless communication and wireless power transmission in the same first directions 1701 and 1702 .

When the communication device 1700 is inserted into an object (eg, a human body) by aligning the direction of the magnetic field and the electric field as described above, communication distance and power transmission efficiency can be improved.

18 and 19 are views illustrating a communication device and an electrode device according to an exemplary embodiment.

18 illustrates a structure in which a communication device 1810 including a coil having a planar structure and an electrode device 1820 are coupled in a wireless device 1800.

The communication device 1810 illustrated in FIG. 18 may be configured similarly to the communication device 600 described in FIGS. 6 to 8 .

The electrode device 1820 may include a substrate 1850 on which a plurality of electrodes are disposed, a battery 1822, and the like.

A battery contact 1821 may be disposed on the battery 1822 . Power of the battery 1822 may be transferred to the communication device 1810 through the battery contact 1821 . The battery contact 1821 may include a negative contact and a positive contact.

A plurality of electrodes may be disposed on the substrate 1850 . A plurality of electrodes may be classified into a plurality of channels 1831, 1832, and 1833. For example, the plurality of channels 1831, 1832, and 1833 may include a sensing channel and a stimulation channel.

The sensing channels 1831 and 1832 may represent channels for detecting an electrical signal from a target. In FIG. 18 , sensing channels 1831 and 1832 may include a first sensing channel 1831 and a second sensing channel 1832 . Each of the sensing channels 1831 and 1832 may include a positive electrode, a negative electrode, and a reference electrode. Accordingly, each of the sensing channels 1831 and 1832 may obtain a differential signal. However, the number of sensing channels 1831 and 1832 is not limited thereto and may be changed according to design.

The stimulation channel 1833 may include a working electrode, a counter electrode, and a reference electrode.

The communication device shown in FIG. 19 may be configured similarly to the communication device 900 described in FIGS. 9 to 11 .

In a communication device according to an embodiment, a circuit 1910 corresponding to a first partial coil and a circuit 1920 corresponding to a second partial coil may be stacked in order. For example, a circuit 1910 corresponding to a first partial coil including a planar loop is disposed on an upper layer, and a second portion including a loop of a double helix structure having a resonance direction orthogonal to the first partial coil. A circuit 1920 corresponding to the coil may be three-dimensionally disposed in the middle layer. An electrode device 1930 may be disposed on a lower layer. Here, the electrode device 1930 may be configured similarly to the electrode device 1820 shown in FIG. 18 .

A communication device according to an embodiment can minimize deterioration in radiation performance of a circuit 1910 corresponding to a first partial coil and a circuit 1920 corresponding to a second partial coil, while maximizing stacking efficiency within a 3D structure. can

20 is a diagram explaining the arrangement of an electrode device according to an embodiment.

Electrodes 2010 The device may include a plurality of electrodes 2010 as shown in FIG. 20 .

The plurality of electrodes 2010 may be arranged along the length direction of the substrate 2050 on a surface of the substrate 2050 that contacts the object 2090 . For example, the plurality of electrodes 2010 may be lined up at regular intervals along the substrate 2050. Each of the plurality of electrodes 2010 may be assigned one of a sensing channel and a stimulation channel. . The electrode 2010 may be made of a bio-compatible metal material.

The substrate 2050 is made of a flexible material and may cover the target 2090 . For example, the substrate 2050 may have a thin width and a long length, and may be disposed to surround the object 2090 in a helical shape. The substrate 2050 may be configured in the form of a helical thread. The substrate 2050 may be made of a material suitable for a living body. One side of the substrate 2050 may be connected to the substrate 1850 of the electrode device 1800 shown in FIG. 18 .

An electrode router (not shown) may connect the plurality of electrodes 2010 and the processor. An electrode router (not shown) may also be referred to as an electrode router circuit, as described above in FIGS. 13 and 14 . For example, an electrode router (not shown) may transfer an electrical signal sensed through a first electrode among a plurality of electrodes to a processor. An electrode router (not shown) may apply an electrical signal to a target point where a first electrode and a second electrode, among a plurality of electrodes, contact each other. The first electrode may indicate an electrode to which a sensing channel is assigned, and the second electrode may indicate an electrode to which a stimulation channel is assigned.

21 and 22 are diagrams illustrating an electrode channel of an electrode device according to an exemplary embodiment.

FIG. 21 is a diagram explaining the arrangement of electrodes on a substrate connected to the electrode device 1820 of FIG. 18 .

According to an embodiment, the plurality of electrodes are classified into a plurality of channels, and may be arranged on the substrate so that electrodes belonging to each channel among the plurality of channels are not adjacent to each other. For example, an anode and a cathode corresponding to one differential signal within the same channel may be spaced as far apart as possible within the substrate.

As shown in FIG. 21 , the counter electrode (CE) 2111 and the working electrode (WE) 2112 of the stimulation channel may be spaced apart from each other as far as possible from the substrate. The cathode (SE1−) 2121 and the anode (SE1+) 2122 of the first sensing channel may also be disposed not adjacent to each other. The cathode (SE2−) 2131 and the anode (SE2+) 2132 of the second sensing channel may also be disposed not adjacent to each other. The reference electrode RE of each channel may be disposed at the center of the substrate. The reference electrode RE may serve as a ground.

When electrodes corresponding to each other are disposed as far apart as possible in the same channel, a signal amplification effect may appear as shown in FIG. 25 below.

FIG. 22 is a diagram for explaining another example of electrode arrangement on a substrate connected to the electrode device 1820 of FIG. 18 .

According to an embodiment, the plurality of electrodes may be classified into a plurality of channels, and electrodes belonging to each channel among the plurality of channels may be arranged on the substrate so as to be adjacent to each other. For example, an anode and a cathode corresponding to one differential signal in the same channel may be disposed adjacent to each other within the substrate.

As shown in FIG. 22 , the cathode (SE1−) 2211 and the anode (SE1+) 2212 of the first sensing channel of the stimulation channel may be disposed adjacent to each other along with the reference electrode. The cathode (SE2−) 2231 and the anode (SE2+) 2232 of the second sensing channel may also be disposed adjacent to each other along with the reference electrode RE. The counter electrode (CE) 2221 and the working electrode (WE) 2222 of the stimulation channel may be placed adjacently together with the reference channel.

23 is a diagram illustrating dynamic allocation of electrode channels of an electrode device according to an exemplary embodiment.

The electrode device 2300 may include an electrode interface 2310 , an electrode router 2320 , a sensing circuit 2330 and a driving circuit 2340 .

The electrode interface 2310 may include a plurality of electrodes and a substrate on which the electrodes are disposed.

The electrode router 2320 may be connected to a plurality of electrodes on the substrate. The electrode router 2320 may transmit an electrical signal received from each electrode to the processor through the sensing circuit 2330 based on a channel allocated to the plurality of electrodes. Also, the electrode router 2320 may transfer an electrical signal received from the processor to the electrode interface 2310 through the driving circuit 2340 .

The sensing circuit 2330 may detect an electrical signal from electrodes connected through the electrode router 2320 .

The driving circuit 2340 may apply electrical signals to electrodes connected through the electrode router 2320 .

According to an embodiment, the electrode router 2320 may change mapping of a channel allocated to each electrode in response to a control command of a processor. For example, the electrode router 2320 may allocate at least some of the plurality of electrodes to a sensing channel of the electrode router 2320 by connecting them to the sensing circuit 2330 in response to a control command of the processor. . The electrode router 2320 may allocate at least some of the remaining electrodes to a stimulating channel of the electrode router 2320 by connecting them to the driving circuit 2340 in response to a control command of the processor. As shown in FIG. 23, the plurality of electrodes may include electrodes such as A1, A2, A3, B1, B2, B3, C1, C2, and C3, and the electrode router 2320 is the first sensing channel. The anode (SE1+), cathode (SE1-), anode (SE2+) and cathode (SE2-) of the second sensing channel, working electrode (WE) and counter electrode (CE) of the stimulation channel can be assigned to each electrode. there is.

A processor (not shown) may control the connection between the sensing circuit 2330, the driving circuit 2340, and the electrode interface 2310 by controlling the electrode router 2320 as described above. For example, the processor allocates at least some of the plurality of electrodes to a sensing channel of the electrode router 2320 and assigns at least some of the remaining electrodes to a stimulating channel of the electrode router 2320. can be assigned to For another example, the processor allocates at least some of the plurality of electrodes to the sensing channel of the electrode router 2320 based on the electrical signal detected from the target, and allocates other parts of the plurality of electrodes to the electrode router 2320. ) can be assigned to the stimulation channel. Dynamic channel allocation based on electrical signals detected from a subject will be described in detail with reference to FIGS. 24 and 25 below.

24 and 25 are diagrams illustrating differential signals according to allocation of electrode channels according to an exemplary embodiment.

As described above, the processor may allocate a sensing channel to at least some of the plurality of electrodes and allocate a stimulation channel to at least some of the remaining electrodes, based on the received electrical signal.

For example, as shown in FIG. 24 , the processor responds to a case where an electrical signal detected from an object 2490 includes common noise above a threshold, so that electrodes belonging to each channel are adjacent to each other on a substrate. Channels may be allocated to a plurality of electrodes to do so.

As shown in FIG. 24 , when electrodes assigned to the same channel are disposed adjacent to each other, a first signal 2420 detected in the anode channel 2411 and a second signal detected in the cathode channel 2412 of the sensing channel are disposed adjacent to each other. Common noise can be removed in differential signal 2440 for signal 2430. Accordingly, when the common noise is detected above a threshold, the processor may obtain a signal robust to common noise by arranging the electrodes of each channel adjacently.

As another example, as shown in FIG. 24 , the processor determines that electrodes belonging to each channel are not adjacent to each other on the substrate in response to a case in which the electrical signal detected from the target includes common noise less than a threshold. channels may be allocated to a plurality of electrodes.

As shown in FIG. 25 , when electrodes assigned to the same channel are disposed not adjacent to each other, the first signal 2520 detected in the anode channel 2511 and the second signal 2520 detected in the cathode channel 2512 of the sensing channel are disposed not adjacent to each other. The magnitude of the detected electrical signal of the differential signal 2540 to the signal 2530 may be amplified. Accordingly, the processor may obtain a more amplified electrical signal by disposing the electrodes of each channel farther apart when the common noise is small.

As described above, the wireless device, the communication device, and the processor of the electrode device may dynamically map channels allocated to the electrodes arranged in a straight line based on the period and signal amplitude of the electric signal to be observed. Thus, even after the wireless device is inserted into the object, the wireless device can determine an optimized electrode placement ex post facto without having to be separated from the object.

In addition to detection, the wireless device, the communication device, and the electrode device may apply an electrical signal applied to the target through a current path having a higher signal to ratio (SNR) in terms of stimulation. there is. Accordingly, power efficiency required for electrical stimulation of a target may be improved.

26 and 27 are diagrams for explaining the configuration of a communication device according to another embodiment.

The communication device 2600 shown in FIG. 26 includes, for example, a first chip package 2601, a second chip package 2602, a motion sensor 2660, a coil 2670, and a battery 2690. can do. The first chip package 2601 and the second chip package 2602 may be implemented as a single chip. However, it is not limited thereto, and the first chip package 2601 and the second chip package 2602 may be implemented in the form of a plurality of chips separated from each other.

The first chip package 2601 may be a chip implemented to operate below a first threshold voltage. In this specification, a voltage that is less than or equal to the first threshold voltage may be referred to as a low voltage. According to an embodiment, the first transceiver circuit 2652 , the processor 2651 , and the sensing circuit 2654 implemented in the first chip package 2601 may operate at low voltage. For example, when the first threshold voltage is designed to be 2V, the first chip package 2601 may apply a low voltage of 1.8V to the first transceiver circuit 2652, the processor 2651, and the sensing circuit 2654. there is.

However, it is not limited thereto, and for example, the first chip package 2601 may be implemented to operate within a first voltage range. The first voltage range may be a partial range of a low voltage that is less than or equal to the first threshold voltage. For example, when the first voltage range is designed as a voltage between 1.6V and 2V, the first chip package 2601 transmits a low voltage such as 1.7V or 1.9V to the first transceiver circuit 2652, the processor 2651, and to the sensing circuit 2654. The first chip package 2601 operating at a low voltage may mainly operate to transmit signals.

The second chip package 2602 may be a chip implemented to operate at a second threshold voltage or higher. In this specification, a voltage higher than the second threshold voltage may be referred to as a high voltage. The second threshold voltage may be greater than the aforementioned first threshold voltage. According to an embodiment, the second transceiver circuit 2653, the driving circuit 2655, and the power management circuit 2657 implemented in the second chip package 2602 may operate at a high voltage. For example, when the second threshold voltage is designed to be 11V, the second chip package 2602 applies a high voltage of 12V to the second transceiver circuit 2653, the driving circuit 2655, and the power management circuit 2657. can

However, it is not limited thereto, and for example, the second chip package 2602 may be implemented to operate within the second voltage range. The second voltage range may be a partial range of a high voltage equal to or higher than the second threshold voltage. For example, when the second voltage range is designed as a voltage between 11V and 13V, the second chip package 2602 transmits a high voltage such as 11.5V or 12.5V to the second transceiver circuit 2653, the driving circuit 2655, and power management circuitry 2657. The second chip package 2602 operating at a high voltage may operate primarily to manage voltage.

In FIG. 26 , a solid line arrow may indicate power transfer, and a dotted line arrow may indicate signal transfer. Power received through the coil 2670 may be transferred to the battery 2690 through the second transceiver circuit 2653 . The power management circuit 2657 may provide power supplied from the battery 2690 to the remaining circuits. A signal received through the coil 2670 may be transferred to the processor 2651 through the first transceiver circuit 2652 . The processor 2651 may process signals and transfer them to other circuits or process signals transferred from other circuits.

According to an embodiment, the communication device 2600 may reduce power consumption by applying a voltage lower than that of the second chip package 2602 to the first chip package 2601 .

The motion sensor 2660 is a sensor that detects movement of the communication device 2600 . For example, the motion sensor 2660 may be implemented as an acceleration sensor and a geomagnetic sensor. The motion sensor 2660 may measure acceleration or the like applied to the communication device 2600 .

Processor 2651, first transceiver circuit 2652, second transceiver circuit 2653, sensing circuit 2654, driving circuit 2655, power management circuit 2657, coil 2670, and battery 2690 may operate or be configured as described above in FIGS. 13 and 14 .

FIG. 27 shows a stacked structure in which the communication device shown in FIG. 26 is implemented.

According to an embodiment, the communication device 2700 may have a structure in which a substrate 2709, a coil 2770, a first chip package 2701, a second chip package 2702, and a battery 2790 are stacked. can For example, each component of the communication device 2700 may be stacked in the order of a first chip package 2701, a second chip package 2702, and a battery 2790 from the first surface of the substrate 2709. there is. Also, a motion sensor may be stacked on the same layer as battery 2790 or over battery 2790 .

The individual device 2710 is the opposite surface of the substrate 2709 on which the first chip package 2701, the second chip package 2702, and the battery 2790 are stacked (eg, the first surface). (eg, the second side). The individual device 2710 may be, for example, a decoupling capacitor.

The coil 2770 , the first chip package 2701 , the second chip package 2702 , and the battery 2790 may operate or be configured as described above in FIG. 26 . The substrate 2709 is as described above in FIG. 5 .

The devices described above may be implemented as hardware components, software components, and/or a combination of hardware components and software components. For example, devices and components described in the embodiments may include, for example, a processor, a controller, an arithmetic logic unit (ALU), a digital signal processor, a microcomputer, a field programmable array (FPA), It may be implemented using one or more general purpose or special purpose computers, such as a programmable logic unit (PLU), microprocessor, or any other device capable of executing and responding to instructions. The processing device may run an operating system (OS) and one or more software applications running on the operating system. A processing device may also access, store, manipulate, process, and generate data in response to execution of software. For convenience of understanding, there are cases in which one processing device is used, but those skilled in the art will understand that the processing device includes a plurality of processing elements and/or a plurality of types of processing elements. It can be seen that it can include. For example, a processing device may include a plurality of processors or a processor and a controller. Other processing configurations are also possible, such as parallel processors.

Software may include a computer program, code, instructions, or a combination of one or more of the foregoing, which configures a processing device to operate as desired or processes independently or collectively. You can command the device. Software and/or data may be any tangible machine, component, physical device, virtual equipment, computer storage medium or device, intended to be interpreted by or provide instructions or data to a processing device. , or may be permanently or temporarily embodied in a transmitted signal wave. Software may be distributed on networked computer systems and stored or executed in a distributed manner. Software and data may be stored on one or more computer readable media.

The method according to the embodiment may be implemented in the form of program instructions that can be executed through various computer means and recorded on a computer readable medium. Computer readable media may include program instructions, data files, data structures, etc. alone or in combination. Program commands recorded on the medium may be specially designed and configured for the embodiment or may be known and usable to those skilled in computer software. Examples of computer-readable recording media include magnetic media such as hard disks, floppy disks and magnetic tapes, optical media such as CD-ROMs and DVDs, and magnetic media such as floptical disks. - includes hardware devices specially configured to store and execute program instructions, such as magneto-optical media, and ROM, RAM, flash memory, and the like. Examples of program instructions include high-level language codes that can be executed by a computer using an interpreter, as well as machine language codes such as those produced by a compiler. The hardware devices described above may be configured to operate as one or more software modules to perform the operations of the embodiments, and vice versa.

As described above, although the embodiments have been described with limited drawings, those skilled in the art can apply various technical modifications and variations based on the above. For example, the described techniques may be performed in an order different from the method described, and/or components of the described system, structure, device, circuit, etc. may be combined or combined in a different form than the method described, or other components may be used. Or even if it is replaced or substituted by equivalents, appropriate results can be achieved.

Therefore, other implementations, other embodiments, and equivalents of the claims are within the scope of the following claims.

200: wireless system
110: wireless device
120: external device
230: relay device
190: object

Claims (24)

In the communication device,
a processor disposed only within the core region of the coil and establishing communication with an external device through the coil;
at least one discrete element disposed on a different layer from the coil in an outer edge ring region excluding the core region on the coil and connected to the processor through a via; and
Electrode router circuit connected to a plurality of electrodes
including,
The electrode router circuit,
connecting a first electrode of the plurality of electrodes to a sensing circuit and connecting a second electrode of the plurality of electrodes to a driving circuit;
The sensing circuit,
Detecting an electrical signal corresponding to a point where the first electrode is attached through the first electrode;
The drive circuit,
Applying an electrical signal to a point where the second electrode is attached through the second electrode,
communication device. According to claim 1,
the processor,
Arranged in a layer distinct from the coil,
communication device. According to claim 1,
The individual element,
A passive element configured to isolate a voltage between a plurality of circuits within a chip in which the processor is implemented.
A communication device comprising a. According to claim 1,
The individual element,
Including at least one of a capacitor, an inductor, and a resistor connected to a chip in which the processor is implemented through a via,
communication device. According to claim 1,
a first transceiver circuit for transmitting and receiving signals of a first bandwidth through the coil; and
A second transceiver circuit for transmitting and receiving signals of a second bandwidth distinct from the first bandwidth through the coil
Including more,
The first transceiver circuit and the second transceiver circuit are implemented on the same chip as the processor.
communication device. According to claim 5,
The first transceiver circuit,
operating below a first threshold voltage;
The second transceiver circuit,
Operating above a second threshold voltage greater than the first threshold voltage,
communication device. According to claim 1,
The electrode router circuit is implemented on the same chip as the processor,
communication device. delete According to claim 1,
The sensing circuit,
operating below a first threshold voltage;
The drive circuit,
Operating above a second threshold voltage greater than the first threshold voltage,
communication device. According to claim 1,
The coil is
a first partial coil configured to resonate at a first bandwidth; and
a second partial coil configured to resonate at a second bandwidth distinct from the first bandwidth;
including,
wherein the first partial coil and the second partial coil share at least some loops;
communication device. According to claim 10,
The first partial coil,
a loop configured to generate a magnetic field in a first direction;
The second partial coil,
a loop configured to generate an electric field in the first direction;
communication device. According to claim 1,
at least one embedded element disposed on a layer distinct from the layer on which the coil is disposed and the layer on which the processor is disposed, and connected to the processor through a via; and
Motion sensor for detecting movement of the communication device
A communication device further comprising a. According to claim 1,
The chip in which the processor is implemented is disposed spaced apart from the coil by a critical distance or more.
communication device. According to claim 1,
the processor,
Connected to a plurality of electrodes disposed in a form surrounding an object, receiving an electrical signal from at least some of the plurality of electrodes, or providing an electrical signal to at least some of the plurality of electrodes,
communication device. According to claim 14,
the processor,
Allocating a sensing channel to at least some of the plurality of electrodes and allocating a stimulation channel to at least some of the remaining electrodes based on the received electrical signal.
communication device. delete delete delete delete delete delete delete delete delete

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