KR102427974B1 - 웨이퍼 유지대 - Google Patents
웨이퍼 유지대 Download PDFInfo
- Publication number
- KR102427974B1 KR102427974B1 KR1020207025647A KR20207025647A KR102427974B1 KR 102427974 B1 KR102427974 B1 KR 102427974B1 KR 1020207025647 A KR1020207025647 A KR 1020207025647A KR 20207025647 A KR20207025647 A KR 20207025647A KR 102427974 B1 KR102427974 B1 KR 102427974B1
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- South Korea
- Prior art keywords
- resin layer
- resin
- layer
- electrostatic chuck
- sheets
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/683—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping
- H01L21/6831—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using electrostatic chucks
- H01L21/6833—Details of electrostatic chucks
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/683—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping
- H01L21/687—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches
- H01L21/68714—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches the wafers being placed on a susceptor, stage or support
- H01L21/68757—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches the wafers being placed on a susceptor, stage or support characterised by a coating or a hardness or a material
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23Q—DETAILS, COMPONENTS, OR ACCESSORIES FOR MACHINE TOOLS, e.g. ARRANGEMENTS FOR COPYING OR CONTROLLING; MACHINE TOOLS IN GENERAL CHARACTERISED BY THE CONSTRUCTION OF PARTICULAR DETAILS OR COMPONENTS; COMBINATIONS OR ASSOCIATIONS OF METAL-WORKING MACHINES, NOT DIRECTED TO A PARTICULAR RESULT
- B23Q3/00—Devices holding, supporting, or positioning work or tools, of a kind normally removable from the machine
- B23Q3/15—Devices for holding work using magnetic or electric force acting directly on the work
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/67005—Apparatus not specifically provided for elsewhere
- H01L21/67011—Apparatus for manufacture or treatment
- H01L21/67098—Apparatus for thermal treatment
- H01L21/67103—Apparatus for thermal treatment mainly by conduction
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/67005—Apparatus not specifically provided for elsewhere
- H01L21/67011—Apparatus for manufacture or treatment
- H01L21/67098—Apparatus for thermal treatment
- H01L21/67109—Apparatus for thermal treatment mainly by convection
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/683—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping
- H01L21/6831—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using electrostatic chucks
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/683—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping
- H01L21/687—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches
- H01L21/68714—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches the wafers being placed on a susceptor, stage or support
- H01L21/68785—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches the wafers being placed on a susceptor, stage or support characterised by the mechanical construction of the susceptor, stage or support
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- H—ELECTRICITY
- H02—GENERATION; CONVERSION OR DISTRIBUTION OF ELECTRIC POWER
- H02N—ELECTRIC MACHINES NOT OTHERWISE PROVIDED FOR
- H02N13/00—Clutches or holding devices using electrostatic attraction, e.g. using Johnson-Rahbek effect
Landscapes
- Engineering & Computer Science (AREA)
- Physics & Mathematics (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- General Physics & Mathematics (AREA)
- Manufacturing & Machinery (AREA)
- Computer Hardware Design (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Power Engineering (AREA)
- Mechanical Engineering (AREA)
- Container, Conveyance, Adherence, Positioning, Of Wafer (AREA)
Abstract
Description
도 2는 수지층(15)과 제1 수지 샘플(S1)을 대비한 설명도.
도 3은 수지 시트의 매수와 열저항의 관계를 도시하는 그래프.
도 4는 수지층(15)과 제2 수지 샘플(S2)을 대비한 설명도.
도 5는 웨이퍼 유지대(10)의 제조 공정도.
도 6은 웨이퍼 유지대(10)의 제조 공정도.
도 7은 웨이퍼 유지대(10)의 제조 공정도.
도 8은 웨이퍼 유지대(110)의 단면도.
도 9는 응력 분포 측정의 결과를 도시하는 설명도.
도 10은 별예의 수지층(115)의 단면도.
12a : 정전 전극 12b : 히터 전극
12c : 웨이퍼 배치면 13a : 급전 부재
13b : 급전 부재 14 : 냉각판
14a : 냉매 통로 15, 115 : 수지층
15a, 115a : 수지 시트 16 : 응력 완화층
S1 : 제1 수지 샘플 S2 : 제2 수지 샘플
Claims (4)
- 세라믹제의 정전척과 금속제의 냉각판 사이에, 미리 정해진 열저항을 갖는 수지층과 상기 수지층보다 영률이 낮은 응력 완화층을 구비하고, 상기 수지층이 상기 정전척측에, 상기 응력 완화층이 상기 냉각판측에 설치된 웨이퍼 유지대로서,
상기 수지층은, 수지 시트가 복수 매 적층된 다층 구조이며, 상기 수지층의 측면을 두께 방향에서 보았을 때에 두께 방향의 중앙이 움푹 팬 형상으로 되어 있거나 두께 방향으로 계단형으로 되어 있으며,
상기 수지층의 두께는, 상기 수지 시트와 동일한 재료로 제작되며 상기 수지층과 동일한 열저항을 갖는 단층 구조의 비교 대상 샘플의 두께보다 얇은 것인 웨이퍼 유지대. - 제1항에 있어서, 상기 수지층은 상기 수지 시트가 3장 이상 적층되어 있는 것인 웨이퍼 유지대.
- 제2항에 있어서, 상기 수지층은 상기 수지 시트가 5장 이상 적층되어 있는 것인 웨이퍼 유지대.
- 삭제
Applications Claiming Priority (3)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JPJP-P-2018-045172 | 2018-03-13 | ||
JP2018045172 | 2018-03-13 | ||
PCT/JP2019/007617 WO2019176544A1 (ja) | 2018-03-13 | 2019-02-27 | ウエハー保持台 |
Publications (2)
Publication Number | Publication Date |
---|---|
KR20200116506A KR20200116506A (ko) | 2020-10-12 |
KR102427974B1 true KR102427974B1 (ko) | 2022-08-02 |
Family
ID=67906588
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
KR1020207025647A Active KR102427974B1 (ko) | 2018-03-13 | 2019-02-27 | 웨이퍼 유지대 |
Country Status (6)
Country | Link |
---|---|
US (1) | US11476147B2 (ko) |
JP (1) | JP6999795B2 (ko) |
KR (1) | KR102427974B1 (ko) |
CN (1) | CN111684579B (ko) |
TW (1) | TWI800615B (ko) |
WO (1) | WO2019176544A1 (ko) |
Families Citing this family (4)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP6804053B2 (ja) * | 2019-03-28 | 2020-12-23 | Toto株式会社 | 静電チャック |
JP2020167405A (ja) * | 2019-03-28 | 2020-10-08 | Toto株式会社 | 静電チャック |
JP7551670B2 (ja) | 2022-01-12 | 2024-09-17 | 日本特殊陶業株式会社 | 保持装置 |
JP7620593B2 (ja) * | 2022-04-26 | 2025-01-23 | 日本碍子株式会社 | ウエハ載置台 |
Citations (3)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP2005277074A (ja) | 2004-03-24 | 2005-10-06 | Kyocera Corp | ウェハ支持部材とその製造方法 |
JP2013120835A (ja) * | 2011-12-07 | 2013-06-17 | Shinko Electric Ind Co Ltd | 基板温調固定装置及びその製造方法 |
JP5507198B2 (ja) * | 2009-10-26 | 2014-05-28 | 新光電気工業株式会社 | 静電チャック |
Family Cites Families (13)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
NL7808579A (nl) | 1978-08-18 | 1980-02-20 | Du Pont | Eindconnector voor flexibele schakelingen. |
US6256187B1 (en) * | 1998-08-03 | 2001-07-03 | Tomoegawa Paper Co., Ltd. | Electrostatic chuck device |
JP2000114358A (ja) * | 1998-10-05 | 2000-04-21 | Tomoegawa Paper Co Ltd | 静電チャック装置 |
JP2007110023A (ja) * | 2005-10-17 | 2007-04-26 | Shinko Electric Ind Co Ltd | 基板保持装置 |
TWI478275B (zh) * | 2008-02-26 | 2015-03-21 | Kyocera Corp | A wafer support portion and a method of manufacturing the same, and an electrostatic chuck using the same |
JP5287976B2 (ja) * | 2009-03-09 | 2013-09-11 | 株式会社村田製作所 | 樹脂配線基板 |
JP5172983B2 (ja) * | 2011-02-25 | 2013-03-27 | 富士重工業株式会社 | 繊維強化樹脂と金属との接合構造、及び繊維強化樹脂と金属との接合方法 |
US9330953B2 (en) * | 2011-03-23 | 2016-05-03 | Sumitomo Osaka Cement Co., Ltd. | Electrostatic chuck device |
JP5466254B2 (ja) * | 2012-03-06 | 2014-04-09 | 富士重工業株式会社 | 繊維強化樹脂と金属との接合構造及び繊維強化樹脂と金属との接合方法 |
JP5890795B2 (ja) | 2013-03-18 | 2016-03-22 | 日本碍子株式会社 | 半導体製造装置用部材 |
CN104752301B (zh) * | 2013-12-31 | 2018-05-25 | 北京北方华创微电子装备有限公司 | 一种静电卡盘以及腔室 |
JP5948513B1 (ja) | 2014-09-04 | 2016-07-06 | 日本碍子株式会社 | ウエハー保持台及びその製法 |
JP6321522B2 (ja) * | 2014-11-05 | 2018-05-09 | 日本特殊陶業株式会社 | 加熱装置 |
-
2019
- 2019-02-27 JP JP2020505749A patent/JP6999795B2/ja active Active
- 2019-02-27 CN CN201980011405.6A patent/CN111684579B/zh active Active
- 2019-02-27 WO PCT/JP2019/007617 patent/WO2019176544A1/ja active Application Filing
- 2019-02-27 KR KR1020207025647A patent/KR102427974B1/ko active Active
- 2019-03-12 TW TW108108176A patent/TWI800615B/zh active
-
2020
- 2020-09-09 US US17/015,371 patent/US11476147B2/en active Active
Patent Citations (3)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP2005277074A (ja) | 2004-03-24 | 2005-10-06 | Kyocera Corp | ウェハ支持部材とその製造方法 |
JP5507198B2 (ja) * | 2009-10-26 | 2014-05-28 | 新光電気工業株式会社 | 静電チャック |
JP2013120835A (ja) * | 2011-12-07 | 2013-06-17 | Shinko Electric Ind Co Ltd | 基板温調固定装置及びその製造方法 |
Also Published As
Publication number | Publication date |
---|---|
KR20200116506A (ko) | 2020-10-12 |
CN111684579A (zh) | 2020-09-18 |
CN111684579B (zh) | 2023-07-25 |
US20210043491A1 (en) | 2021-02-11 |
WO2019176544A1 (ja) | 2019-09-19 |
JP6999795B2 (ja) | 2022-01-19 |
TW201946202A (zh) | 2019-12-01 |
US11476147B2 (en) | 2022-10-18 |
JPWO2019176544A1 (ja) | 2021-02-25 |
TWI800615B (zh) | 2023-05-01 |
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