KR102393237B1 - Conductive ball inspection and repair device - Google Patents

Abstract

The present invention can obtain a plurality of lighting functions. The present invention includes an inspection device (2) and a repair device (3). The inspection device 2 includes a main inspection unit 20 . The main inspection unit 20 includes a camera 200 , a lens 201 , and lighting devices 41 , 42 , and 43 . The lighting devices 41 , 42 , and 43 are arranged in three stages in the vertical Z direction between the camera 200 and the lens 201 of the main inspection unit 20 and the work W has been The three-stage lighting devices 41 , 42 , and 43 illuminate the inspection point P of the work W and its surroundings, respectively. As a result, the present invention can obtain a plurality of lighting functions.

Description

Conductive ball inspection repair device TECHNICAL FIELD

The present invention relates to a conductive ball inspection and repair device.

As an electroconductive ball test|inspection repair apparatus, there exists the following patent document 1. The ball test|inspection repair apparatus of patent document 1 is equipped with an inspection apparatus and a repair apparatus. The inspection device has a camera and a lighting device, and inspects whether or not the conductive ball is properly mounted on the electrode of the work piece. A repair apparatus corrects (repairs) so that an electrically conductive ball may be normally mounted in that location, when the location where an electroconductive ball is not mounted normally is detected by an inspection apparatus.

Japanese Patent Laid-Open No. 2017-34175

However, since the ball test|inspection repair apparatus of patent document 1 has arrange|positioned an illumination device one end below a camera, only one illumination function can be acquired.

The problem which this invention is going to solve is providing the electroconductive ball test|inspection repair apparatus from which a some illumination function is acquired.

The conductive ball inspection and repair device of the present invention is a main for inspecting whether the conductive ball is normally mounted on the electrode of a work piece. An inspection device having an inspection unit, and a repair device having a repair unit that corrects the conductive ball so that the conductive ball is normally mounted in the position when a location where the conductive ball is not normally mounted is detected by the main inspection unit; The inspection unit includes a plurality of plurality steps arranged in a vertical direction between the camera and the lens and the camera and the lens and the work, and a lighting device for illuminating the work, the plurality of stages of the lighting device, It is characterized by having an annular frame member in which a space is provided in the central portion, respectively, and a group of light emitting elements provided in plurality in the frame member.

In the conductive ball inspection and repair apparatus of the present invention, it is preferable that the light emitting element group is arranged in an annular shape along the annular shape of the frame member, and the center of the lens and the center of the frame member are positioned on the same line.

In the conductive ball inspection and repair apparatus of the present invention, among the plurality of stages of lighting devices, the light emitting element group of the lighting device disposed at the position closest to the work is composed of a plurality of sets, and the plurality of sets of light emission It is preferable that the wavelength of the light emitted by each element group differs for every group.

In the conductive ball inspection and repair device of the present invention, among the plurality of stages of lighting devices, the lighting device disposed at the position closest to the work enters the light emitted from the light emitting element group, and exits as diffused light to the work side. It is preferable to have a light diffusing member that

In the conductive ball inspection and repair apparatus of the present invention, it is preferable that, among the plurality of stages of lighting devices, the lighting device disposed at the position closest to the work is mainly a lighting device for illuminating the conductive ball.

In the conductive ball inspection and repair device of the present invention, among the plurality of stages of lighting devices, the lighting device disposed at the position closest to the work enters the light emitted from the light emitting element group, and exits as diffused light to the work side. It is preferable that it is a lighting device which has a light-diffusion member which makes it light, and mainly illuminates an electroconductive ball.

In the conductive ball inspection and repair device of the present invention, among the plurality of stages of lighting devices, the light-emitting element group of the lighting device disposed at the position closest to the work is composed of a plurality of sets, and the light-emitting element groups of the plurality of sets are each The wavelength of the emitted light is different for each set, and the wavelength of the light emitted by the light emitting element group of the lighting device other than the lighting device disposed at the position closest to the work among the plurality of stages of the lighting device is the light emission of the plurality of sets. It is preferable to have a longer wavelength than the shortest wavelength of light emitted by the element group.

In the conductive ball inspection and repair apparatus of the present invention, the workpiece is a substrate on which wiring is formed, and among the plurality of lighting devices, a lighting device other than the lighting device disposed closest to the workpiece is mainly used for fixing the workpiece. It is preferable that it is a lighting device which illuminates wiring.

ADVANTAGE OF THE INVENTION According to the electroconductive ball test|inspection repair apparatus of this invention, some illumination function can be acquired.

BRIEF DESCRIPTION OF THE DRAWINGS It is a general schematic plan view which showed embodiment of the electroconductive ball test|inspection repair apparatus which concerns on this invention.
Fig. 2 is a schematic front view showing a part (a view taken along the schematic line II-II in Fig. 1).
Fig. 3 is a schematic longitudinal sectional view showing a part (a schematic cross-sectional view taken along the line III-III in Fig. 1 ).
Fig. 4 is an enlarged schematic longitudinal sectional view showing a three-stage lighting device.
5 is a conceptual explanatory diagram showing an optical path at the time of inspection.
6 is a schematic bottom view showing an arrangement state of a group of light emitting elements. Fig. 6A is a schematic bottom view showing a state in which blue LEDs and red LEDs are alternately arranged in the circumferential direction. Fig. 6B is a schematic bottom view showing a state in which the blue LED and the red LED are arranged concentrically.
7 : is explanatory drawing (graph) which shows the spectral reflectance of copper (Cu). The vertical axis in FIG. 7 is reflectance (%). The horizontal axis in the figure is the wavelength (nm).
It is explanatory drawing (graph) which shows the spectral reflectance of a tin alloy (Sn alloy). The vertical axis in FIG. 8 is reflectance (%). The horizontal axis in the figure is the wavelength (nm).
Fig. 9 is a schematic explanatory view showing a work and an electroconductive ball. Fig. 9A is a schematic explanatory view showing a state in which the conductive ball is normally mounted on the electrode of the work piece. 9B is a schematic view showing a state in which the conductive ball is not normally mounted on the electrode of the work, that is, the state in which the conductive ball is not mounted on the electrode of the work, that is, there is no conductive ball (mixing bowl state). It is an explanatory diagram. Fig. 9C is a schematic explanatory view showing a state in which the conductive ball is not normally mounted on the electrode of the work, and the electrically conductive ball is positioned at a position away from the electrode of the work (shifted ball state). Fig. 9(D) is a schematic explanatory diagram showing a state in which the conductive balls are not normally mounted on the electrode of the work, and the extra conductive balls are mounted on the work (excess ball state).
Fig. 10 is a flow explanatory diagram showing the steps.

EMBODIMENT OF THE INVENTION Hereinafter, an example of embodiment (Example) of the electroconductive ball test|inspection repair apparatus which concerns on this invention is demonstrated in detail with reference to drawings. In this specification, left, right, front, rear, upper, lower, left, right, front, rear, upper, lower when the operator sees the conductive ball inspection repair apparatus according to the present invention. In addition, in the drawing, since it is a schematic diagram, a main component is shown and illustration of components other than a main component is abbreviate|omitted.

[Description of the configuration of the embodiment]

Hereinafter, the structure of the electroconductive ball test|inspection repair apparatus which concerns on this embodiment is demonstrated. In addition, you may refer patent document 1 about the electroconductive ball test|inspection repair apparatus which concerns on this embodiment.

1 to 3, reference numeral "1" denotes a conductive ball inspection and repair device according to this embodiment. 1 to 4, reference numeral “X1” denotes “left”, “X2” denotes “right”, “Y1” denotes “front (front) side”, and “Y2” denotes “rear (inward, direction)” ) side", "Z1" is "upper side", and "Z2" is "lower side".

Here, the horizontal "X direction" is "X1-X2 direction, left-right direction", the same horizontal "Y direction" is "Y1-Y2 direction, front-rear direction", and the vertical "Z direction" is "Z1" -Z2 direction, up-down direction". The X direction, the Y direction, and the Z direction are respectively orthogonal to each other.

[Description of the work piece (W)]

1 to 3 , the work W is a substrate in this example. In this substrate, conductive wiring is formed on an insulating plate. The insulating plate is composed of a synthetic resin containing glass fibers. The conductive wiring is mainly composed of copper.

Here, in the manufacturing process of a board|substrate, an insulation board thermally expands and contracts by the heat processing at the time of forming wiring in an insulation board. As a result, a dimensional error occurs between the designed wiring pattern and the manufactured wiring pattern. Therefore, in the case where the work W is a substrate, it is necessary to actually check and register the pattern of the manufactured wiring in the previous step of the inspection.

This process is performed by recognizing a target mark, an alignment mark, etc. (not shown) provided on the board|substrate in the main inspection part 20 mentioned later. This step is “inspection pattern registration of the work W” shown in step S3 in FIG. 10 .

The work W in this example forms a disk shape. Incidentally, the work W has a rectangular shape other than the disk shape in this example. Then, a plurality of rectangular integrated circuit chips (not shown) are formed on one surface of the work W, and are arranged vertically and horizontally. The number of integrated circuit chips is determined based on the diameter (diameter) of the workpiece W. The diameter of the work W is, for example, 50 mm to 300 mm. In addition, the thickness of the work W is, for example, from 0.5 mm to 1 mm. On the other hand, the length of one side of the integrated circuit chip is, for example, 30 mm.

The work W forming the disk shape needs to be oriented before the work process. Accordingly, at the circumferential edge of the work W, a straight line portion (not shown) or a cut-out portion (not shown) that is a target for alignment is formed. In addition, in the work W, the configuration and number of integrated circuit chips are different for each circuit design. Accordingly, a recognition mark (not shown) for recognizing the work W is formed on the work W for each circuit design.

As shown in FIG. 9 , the conductive balls B are mounted on the work W (a plurality of integrated circuit chips) by a conductive ball mounting device (not shown). That is, on one surface of the work W, the electrode E in a pad state or a land state is provided. A conductive ball B is mounted on the electrode E through adhesion of the flux F.

The diameter of the conductive ball B is, for example, 30 µm to 70 µm. The conductive ball B is made of a conductive member. For example, solder, metal balls such as gold or silver, or balls in which conductive plating is applied to the surface of a resin ball or a ceramic ball, or the like.

[Explanation of the mounting state of the conductive ball (B)]

9 shows a state in which the conductive ball mounting device mounts the conductive ball B on the work W. As shown in FIG. That is, FIG. 9(A) shows a state in which the conductive ball B is normally mounted on the electrode E of the work W (normal ball state). 9(B) is a state in which the conductive ball B is not normally mounted on the electrode E of the work W, and the conductive ball B is mounted on the electrode E of the work W. It indicates a state in which there is no conductive ball B (mixing bowl state). 9(C) is a state in which the conductive ball B is not normally mounted on the electrode E of the work W, and the conductive ball B is displaced from the electrode E of the work W. It indicates the state (shift ball state) located at the position. 9(D) is a state in which the conductive ball B is not normally mounted on the electrode E of the work W, and the extra conductive ball B1 is mounted on the work W. (surplus ball state)

In this way, when the conductive ball mounting device mounts the conductive ball B on the work W, as shown in FIG. 9A, all the conductive balls B are connected to the electrode E of the work W. It is not necessarily limited that it is normally mounted on the . That is, as shown in (B), (C) and (D) of FIG. 9 , the conductive ball B is not normally mounted on the electrode E of the work W in some cases. Therefore, after the conductive ball mounting device mounts the conductive ball B on the work W, it is necessary to check whether the conductive ball B is normally mounted on the electrode E of the work W. there is In addition, if the conductive ball B is not normally mounted on the electrode E of the workpiece W, it is not necessary to modify the conductive ball B to be mounted on the electrode E of the workpiece W normally. there is.

Here, as shown in FIG. 9(A), the location where the conductive ball B is normally mounted on the electrode E of the work W is hereinafter referred to as a "normal location". In addition, as shown in FIGS. 9(B), (C), and (D), a location where the conductive ball B is not normally mounted on the electrode E of the work W is hereinafter referred to as "defective". It's called 'open'. In addition, a normal location and a defective location are collectively called "a location" hereafter. A location shows one electrode (E), one electroconductive ball (B), and its surroundings.

[Description of the conductive ball inspection and repair device (1)]

In the conductive ball inspection and repair device 1, after the conductive ball mounting device mounts the conductive ball B on the work W, the conductive ball B is normally mounted on the electrode E of the work W, check whether there is In addition, in the conductive ball inspection and repair device 1, when the conductive ball B is not normally mounted on the electrode E of the work W, the conductive ball B is installed on the electrode ( E) is modified so that it is mounted normally.

1 to 3 , the conductive ball inspection and repair device 1 includes an inspection device 2 , a repair device 3 , an imaging device (not shown), and a display device 5 . ) is provided. In addition, as shown in FIGS. 1-3, the electroconductive ball test|inspection repair apparatus 1 has the calibration part 6, the stage conveyance part 7, and the inspection part conveyance part 20Z. ), (21Z), repair unit transfer units (30Z), (31Z), (32Z), and a control unit (not shown) is provided. In addition, as shown in FIGS. 1 to 3 , the conductive ball inspection and repair apparatus 1 includes a mount 10 , a support member 11 , a load port 12 , and a free It includes a pre-aligner 13 , a stage 14 , a transfer robot 15 as a work transfer unit, and a work recognition information acquisition unit 16 .

And the operator (not shown) is located in the position near the front side Y1 of the mount 10 and the right side X2 in FIG. 1 . In addition, the operator faces the display device 5 .

The mount 10 is installed on a floor surface or an installation surface (not shown). Although not shown in the figure, the mount 10 is provided with a wall or a ceiling which forms a work space. Here, the working space is a space surrounded by four sides of the mount 10 in FIG. 1 . Inside the work space, an inspection device 2 , a repair device 3 , an imaging device, a display device 5 , a calibration unit 6 , a stage transport unit 7 , an inspection unit transport unit 20Z, 21Z, Repair unit transfer units 30Z, 31Z, 32Z, detection unit, drive unit, support member 11, pre-aligner 13, stage 14, transfer robot 15 and workpiece recognition information acquisition unit ( 16) is placed. In addition, outside the work space, an operation unit and a load port 12 are arranged.

1 to 3 , the support member 11 is disposed on the right and rear sides of the upper surface of the mount 10 . The support member 11 includes two columns 110 , two arms 111 , and one beam 112 . The lower ends of the two posts 110 are respectively fixed on the left and right to the upper surface of the mount 10 , and the two posts 110 are provided in the Z direction. The rear ends of the two arms 111 are fixed to the upper ends of the posts 110 , and the two arms 111 are provided in the Y direction. The left and right ends of one beam 112 are being fixed to the front ends of the two arms 111, and one beam 112 is provided in the X direction.

As shown in FIG. 1 , the load port 12 is disposed outside the left side of the mount 10 . On the table surface (upper surface) of the load port 12, the conveyance container 17 (so-called FOUP) is mounted. The transport container 17 is transported to or from the load port 12 by a ceiling monorail or a floor traveling robot (not shown). The transfer container 17 stores the work W in a sealed state. The transfer container 17 is provided with a door for allowing the work W to enter and exit. The door of the conveyance container 17 is opened and closed by the drive part which is controlled based on the control signal from the control part.

As shown in FIG. 1 , the pre-aligner 13 is disposed on the left and rear sides of the upper surface of the mount 10 . The pre-aligner 13 aligns the center and direction of the work W before the inspection by the inspection device 2 based on the marks of the straight lines or cutouts of the work W. The pre-aligner 13 is driven based on a control signal from the control unit. In addition, the pre-aligner 13 does not need to be provided when the work W is a rectangular-shaped substrate.

1 to 4 , the stage 14 is conveyed in the X direction and the Y direction by the stage conveying unit 7 . A work W is mounted on the upper surface of the stage 14 . In addition, let the position of the stage 14 shown in FIG. 1, FIG. 2 be an initial position.

As shown in FIG. 1 , the transfer robot 15 is disposed on the left side of the upper surface of the mount 10 and on the front side of the pre-aligner 13 . The transfer robot 15 transfers the work W between the transfer container 17 and the pre-aligner 13 and between the pre-aligner 13 and the stage 14 . A door for allowing the work W in and out is provided on a wall between the transfer container 17 on the outside of the working space and the pre-aligner 13 on the inside of the working space. The transport robot 15 is driven based on a control signal from the control unit. The door of the wall is opened and closed by the driving unit which is controlled based on the control signal from the control unit.

1 and 2 , the work recognition information acquisition unit 16 includes, in this example, a camera 160 , a lens 161 , and a lighting fixture 162 . The work recognition information acquisition unit 16 is provided in the flux transfer unit 30 of the repair device 3 . Incidentally, the work recognition information acquisition unit 16 may be provided at a location other than the flux transfer unit 30 .

Here, the positional information acquired by the work recognition information acquisition unit 16 is positional information of the center (optical axis of the lens 161) of the lower end (tip) of the lens 161 .

After aligning the center and orientation of the work W by the pre-aligner 13 , the work recognition information acquisition unit 16 recognizes the work W from the recognition mark of the work W on the stage 14 . get information Then, the work recognition information acquisition unit 16 outputs the obtained work recognition information as a detection signal to the control unit. Thereby, the work W of which circuit design is recognized through the control unit. Then, the work recognition information acquisition unit 16 may recognize the above-described target mark, alignment mark, or the like.

[Explanation of the stage transport unit 7]

1 to 3 , the stage transport unit 7 is disposed on the upper surface of the mount 10 , on the front side of the support member 11 and on the right side of the transport robot 15 . The stage conveyance part 7 conveys the stage 14 in the X direction and Y direction which mutually orthogonally cross as a horizontal direction, respectively. The stage conveyance part 7 includes an X-direction fixed part (X-direction guide part) 70X, an X-direction moving part 71X, an X-direction drive part, and a Y-direction fixed part (Y-direction guide part) 70Y. and a Y-direction moving unit 71Y and a Y-direction driving unit.

The X-direction fixing part 70X is being fixed to the upper surface of the mount 10 in the X-direction. The X-direction moving part 71X is attached to the X-direction fixed part 70X so that movement in the X direction is possible. The X-direction drive part is a servo motor, for example, and moves the X-direction moving part 71X in the X direction of the longitudinal direction of the X-direction fixing part 70X. The X-direction driving unit is driven based on a control signal from the control unit.

The Y-direction fixing part 70Y is being fixed to the upper surface of the X-direction moving part 71X in the Y direction. The Y-direction moving part 71 is attached to the Y-direction fixing part 70 so as to be movable in the Y-direction. The Y-direction driving unit is, for example, a servo motor, and moves the Y-direction moving unit 71Y in the Y direction of the longitudinal direction of the Y-direction fixed unit 70Y. The Y-direction drive unit drives based on a control signal from the control unit. In addition, in FIGS. 1-3, the X-direction moving part 71X and the Y-direction fixing part 70Y are shown integrally.

[Explanation of inspection unit transfer units 20Z and 21Z]

As shown in FIG. 2, the inspection part conveyance parts 20Z, 21Z are the main inspection part 20 as an inspection part of the inspection apparatus 2, the inspection part 21 for verifying (hereinafter referred to as "each part 20 of an inspection part). ) and (21)") are conveyed in the Z direction, which is a vertical direction orthogonal to the X direction and the Y direction, respectively.

The inspection unit transfer unit 20Z of the main inspection unit 20 includes a Z-direction fixing unit (Z-direction guide unit), a Z-direction moving unit, and a Z-direction driving unit 200Z. The Z-direction fixing part is being fixed to the left side of the front surface of the beam 112. The Z-direction moving part is attached to the Z-direction fixing part so as to be movable in the Z-direction. The Z-direction driving unit 200Z is, for example, a servo motor, and moves the Z-direction moving unit in the Z-direction of the longitudinal direction of the Z-direction fixing unit. The Z-direction driving unit 200Z is driven based on a control signal from the control unit.

Similarly, the inspection part conveyance part 21Z of the inspection part 21 for verify consists of a Z-direction fixing part (Z-direction guide part), a Z-direction moving part, and the Z-direction drive part 210Z. The Z-direction fixed part is being fixed to the left side of the Z-direction fixed part of the test|inspection part conveyance part 20Z of the main test|inspection part 20 as the front surface of the beam 112. As shown in FIG. The Z-direction moving part is attached to the Z-direction fixing part so as to be movable in the Z-direction. The Z-direction driving unit 210Z is, for example, a servo motor, and moves the Z-direction moving unit in the Z direction of the longitudinal direction of the Z-direction fixing unit. The Z-direction driving unit 210Z is driven based on a control signal from the control unit.

[Explanation of repair part transfer parts 30Z, 31Z, and 32Z]

As shown in Figs. 2 and 3, the repair unit transfer units 30Z, 31Z, and 32Z are made of a flux transfer unit 30 serving as a repair unit of the repair device 3, a conductive ball mounting unit 31, and surplus conductive balls. The rejection 32 (hereinafter referred to as "each part 30, 31, and 32 of the repair part") is conveyed in the Z direction which is a perpendicular direction orthogonal to an X direction and a Y direction, respectively.

The repair unit conveying unit 30Z of the flux transfer unit 30 includes a Z-direction fixing unit (Z-direction guide unit), a Z-direction moving unit, and a Z-direction driving unit 300Z. The Z-direction fixing part is being fixed in the middle of the front surface of the beam 112 . The Z-direction moving part is attached to the Z-direction fixing part so as to be movable in the Z-direction. The Z-direction driving unit 300Z is, for example, a servo motor, and moves the Z-direction moving unit in the Z-direction of the longitudinal direction of the Z-direction fixing unit. The Z-direction driving unit 300Z is driven based on a control signal from the control unit.

Similarly, the repair part conveyance part 31Z of the conductive ball mounting part 31 consists of a Z-direction fixing part (Z-direction guide part), a Z-direction moving part, and a Z-direction drive part 310Z. The Z-direction fixing part is being fixed to the right side of the Z-direction fixing part of the repair part conveyance part 30Z of the flux transfer part 30 as the front surface of the beam 112. As shown in FIG. The Z-direction moving part is attached to the Z-direction fixing part so as to be movable in the Z-direction. The Z-direction driving unit 310Z is, for example, a servo motor, and moves the Z-direction moving unit in the Z-direction of the longitudinal direction of the Z-direction fixing unit. The Z-direction driving unit 310Z is driven based on a control signal from the control unit.

Similarly, the repair part conveyance part 32Z of the surplus conductive ball removal part 32 consists of a Z-direction fixing part (Z-direction guide part), a Z-direction moving part, and a Z-direction drive part 320Z. The Z-direction fixing part is fixed to the right side of the Z-direction fixing part of the repair part conveyance part 31Z of the conductive ball mounting part 31 as the front surface of the beam 112 . The Z-direction moving part is attached to the Z-direction fixing part so as to be movable in the Z-direction. The Z-direction driving unit 320Z is, for example, a servo motor, and moves the Z-direction moving unit in the Z-direction of the longitudinal direction of the Z-direction fixing unit. The Z-direction driving unit 320Z is driven based on a control signal from the control unit.

[Explanation of the calibration unit 6]

The calibration unit 6 includes the X-direction positional information, Y-direction positional information, and Z-direction positional information (hereinafter referred to as “X, Y, Z direction location information") is acquired. The positional information in the X, Y, and Z directions of the respective parts 30, 31, and 32 of the repair unit includes the tip (lower end) of the flux transfer pin 300 of the flux transfer unit 30; The tip (lower end) of the conductive ball mounting nozzle 310 of the conductive ball mounting unit 31, and the tip (lower end) of the surplus conductive ball removal nozzle 320 of the surplus conductive ball removal unit 32 in the X, Y, Z directions location information. Then, the position of the work W is corrected by the position information acquired by the calibration unit 6 .

As shown in FIG. 1 , the calibration unit 6 is fixed to the stage 14 . The calibration unit 6 includes an X-Y position information acquisition unit (not shown) and a Z position information acquisition unit (not shown).

The X-Y positional information acquisition unit acquires the X-direction positional information and Y-direction positional information of the respective units 30, 31, and 32 of the repair unit, and outputs them to the control unit as a detection signal. The X-Y positional information acquisition unit is, in this example, a camera.

The Z position information acquisition unit acquires the position information in the Z direction of the respective units 30, 31, and 32 of the repair unit, and outputs it as a detection signal to the control unit. The Z position information acquisition unit is, in this example, a contact sensor or a contact displacement sensor.

Similarly, the calibration unit 6 includes position information in the X, Y, and Z directions of the respective units 20 and 21 of the inspection unit, and X, Y, and Z directions of the work recognition information acquisition unit 16 . Position information is acquired and output to the control unit as a detection signal.

[Description of the inspection device (2)]

The inspection device 2 inspects whether the conductive ball B is normally mounted on the electrode E of the work W or not. 1, 2, the inspection apparatus 2 is equipped with the main inspection part 20 as an inspection part, and the inspection part 21 for verifying.

The main inspection part 20 is provided in the Z-direction moving part of the inspection part conveyance part 20Z. The inspection unit 21 for verify is provided in the Z-direction moving unit of the inspection unit transport unit 21Z. As a result, the main inspection unit 20 and the verification unit 21 for verify are arranged on the left and right in the X direction.

The main inspection unit 20 inspects whether the conductive ball B is normally mounted on the electrode E of the work W. The main inspection unit 20 includes a camera 200 , a lens 201 , and lighting devices 41 , 42 , and 43 in this example. The field of view (angle of view) of the camera 200 of the main inspection unit 20 is a range in which one or a plurality of integrated circuit chips on the work W can be imaged. Moreover, by making the lens 201 of the main inspection part 20 into having a zoom function, the magnification of the camera 200 of the main inspection part 20 can be varied, and an imaging range can be varied arbitrarily.

Here, the position information in the X, Y, and Z directions acquired by the main inspection unit 20 is position information of the center (optical axis of the lens 201 ) of the lower end (tip) of the lens 201 .

The main inspection unit 20 captures a plurality of integrated circuit chips on the work W one by one with the camera 200, and checks whether the conductive ball B is normally mounted on the electrode E of the work W. to obtain information on whether The main inspection unit 20 outputs the acquired information as a detection signal to the control unit. Then, based on the information acquired by the main inspection unit 20 , the control unit inspects whether the conductive ball B is normally mounted on the electrode E of the work W or not.

The inspection unit 21 for verifying confirms the defective portion when the defective portion is detected by the main inspection unit 20 . The verification unit 21 for verifying, in this example, includes a camera 210 , a lens 211 , and a lighting device 212 . Even if the field of view (angle of view) of the camera 210 of the inspection part 21 for verification is narrow, it is a range which can image one location. Accordingly, the magnification of the lens 211 of the verifying unit 21 is greater than the magnification of the lens 201 of the main inspection unit 20 .

Here, the positional information in the X, Y, and Z directions acquired by the calibration unit 6 of the verification inspection unit 21 is the center of the lower end (tip) of the lens 211 (optical axis of the lens 211). location information.

The inspection unit 21 for verification captures an image of the defective portion detected by the main inspection unit 20 by the camera 210 , and acquires information on whether or not correction by the repair device 3 is necessary. The verification unit 21 for verification outputs the acquired information as a detection signal to the control unit. And the information acquired by the inspection part 21 for verification is displayed on the display apparatus 5 as an image. By visually observing the image displayed on the display apparatus 5 by an operator, it is confirmed whether correction by the repair apparatus 3 is required.

[Explanation of lighting devices (41), (42), (43)]

As shown in FIG. 3 , the lighting devices 41 , 42 , and 43 are in the vertical direction between the camera 200 and the lens 201 of the main inspection unit 20 and the work W. In the Z direction, a plurality of stages are arranged, in this example, three stages. The three-stage lighting devices 41 , 42 , and 43 illuminate the inspection point P of the work W and its surroundings, respectively.

Then, the work W is mounted on the upper surface of the stage 14 . This stage 14 is conveyed by the stage conveyance part 7 in an X direction and a Y direction. As a result, the work W is located at a predetermined position below the main inspection unit 20 via the stage transfer unit 7 and the stage 14 . That is, the inspection point P of the work W is located on the optical axis C of the lens 201 of the main inspection unit 20 .

Then, among the three stages of lighting devices 41 , 42 , and 43 , the lighting device 41 disposed at the position closest to the work W is set to a first lighting device (lowest lighting device) 41 . ) is called In addition, among the three-stage lighting devices 41 , 42 , and 43 , the lighting device 42 disposed above the first lighting device 41 Z1 is set to a second lighting device (middle). ) lighting device] (42). In addition, among the three stages of lighting devices 41, 42, and 43, the lighting device 43 disposed at the position most distant from the work W is set to a third lighting device (topmost lighting device) ( 43) is said.

As shown in Fig. 4, the three-stage lighting devices 41, 42, and 43 are, respectively, the frame members 410, 420, and 430, and the light-emitting element group 411B, ( 411R), (421), and (431). The frame members 410 , 420 , and 430 have an annular planar shape (a shape viewed from the upper Z1 to the lower Z2 ) of the frame members 410 , 420 , and 430 to form a circular annular shape (or polygonal annular shape) in this example. Spaces 412 , 422 , 432 are provided in the central portions of the circular annular frame members 410 , 420 , and 430 .

The light emitting element groups 411B, 411R, 421 and 431 are arranged in a circular annular shape along the circular annular shape of the frame members 410 , 420 , and 430 . The center of the lens 201 and the center of the frame members 410 , 420 , and 430 are located on the same line C that is the optical axis C of the lens 201 .

[Description of the first lighting device 41]

Hereinafter, the first lighting device 41 will be described. The frame member 410 is being fixed to the lower end of the fixing member 40 . The upper end of the fixing member 40 is fixed to the beam 112 of the supporting member 11 . On the lower surface of the frame member 410, light-emitting element groups 411B and 411R are arranged in a double circular annular shape.

The light emitting element groups 411B and 411R are constituted by a plurality of sets, in this example, two sets. The wavelength of the light L1 emitted by the two sets of light-emitting element groups 411B and 411R, respectively, is different for each set. In this example, the wavelength of the light L1 emitted by the light emitting element group 411B of the first set is about 470 nm of the wavelength of the blue light. The wavelength of the light L1 emitted by the light emitting element group 411R of the second set is about 630 nm of the wavelength of the red light.

That is, the light-emitting element group 411B of the first set consists of a light-emitting element emitting blue light, in this example, a blue LED group. The light emitting element group 411R of the second set consists of a light emitting element emitting red light, in this example, a red LED.

As shown in FIG. 6 , the first set of light-emitting element groups 411B including the group of blue LEDs and the second group of light-emitting element groups 411R including the group of red LEDs are arranged in a double circular annular shape. And, in Fig. 6, the light emitting element group (blue LED group) 411B of the first set is shown by a small white circular figure, and the second light emitting element group (red LED group) 411R is , is represented by a figure with + inserted in a small white circle.

Then, as shown in Fig. 6A, the blue LED and the red LED are alternately arranged in the circumferential direction, respectively. Further, as shown in FIG. 6B , the blue LED and the red LED are arranged in an inner circular annular shape and an outer circular annular shape, respectively. In addition, the arrangement|positioning of the blue LED and the red LED may be arrangement|positioning other than the example shown in figure.

The first lighting device 41 includes a light diffusion member 413 . The light diffusion member 413 is provided on the lower side Z2 of the frame member 410 and the light emitting element groups 411B and 411R. The light diffusion member 413 has an incident surface facing the light emitting element groups 411B and 411R, and an exit surface facing the inspection point P. The light diffusion member 413 enters the light L1 emitted from the light emitting element groups 411B and 411R from the incident surface, and as the diffused light L10 from the emission surface to the work W side, that is, the inspection point P side. to be ejected to

As shown in FIG. 5 , the first illuminating device 41 mainly illuminates the conductive ball B. That is, the diffused light L10 emitted from the light diffusion member 413 of the first lighting device 41 has a large incident angle θ with respect to one surface of the work W (the surface on which the conductive ball B is mounted). Therefore, when the diffused light L10 is incident on the spherical surface of the conductive ball B (when it hits), it is reflected as reflected light L11 at a small reflection angle. The reflected light L11 from the conductive ball B is incident on the lens 201 of the main inspection unit 20 .

On the other hand, when the diffused light L10 is incident on one surface of the work W (when it hits), it is reflected as reflected light L12 at a large reflection angle. The reflected light L12 from the work W does not enter the lens 201 of the main inspection unit 20 and travels out of the field of view of the lens 201 . Accordingly, the first lighting device 41 mainly illuminates the conductive ball B.

[Explanation of division between blue light and red light of the first lighting device 41]

Hereinafter, the distinction between the blue light and the red light of the first lighting device 41 will be described with reference to FIGS. 7 and 8 . 7 is an explanatory drawing (graph) which shows the spectral reflectance of copper (Cu). As is clear from FIG. 7 , copper (Cu) has a higher reflectance as the wavelength is longer.

It is explanatory drawing (graph) which shows the spectral reflectance of a tin alloy (Sn alloy). As is evident from FIG. 8 , the tin alloy (Sn alloy), like copper (Cu), has a higher reflectance as the wavelength is longer. Incidentally, in Fig. 8 , the initial tin alloy is represented by a small black diamond shape. In addition, a surface oxide product, ie, a tin alloy with a rusted surface, is indicated by a small black square.

The work W, that is, the wiring and the electrode E of the substrate, are mainly composed of copper (Cu). Accordingly, in the main inspection unit 20 , in order to inspect (measure) the wiring pattern of the work W and the electrodes E with high precision, it is preferable to use red light with a long wavelength.

In addition, the electroconductive ball B is comprised by soldering in this example. Brazing mainly consists of an alloy of tin and lead, ie, a tin alloy (Sn alloy). Accordingly, in the main inspection unit 20 , in order to inspect (measure) the conductive ball B with high precision, it is preferable to use red light with a long wavelength. In particular, in the case of the conductive ball (B) whose surface is oxidized, it is preferable to use red light with a long wavelength.

Here, the optical resolution is smaller (higher) as the wavelength of light is shorter, and high-precision inspection (measurement) can be performed. Accordingly, in the main inspection unit 20 , in order to inspect (measure) the conductive ball B with high precision, it is preferable to use blue light having a short wavelength. In particular, in the case of an initial (new) conductive ball (B) whose surface is not oxidized, it is preferable to use blue light with a short wavelength.

As described above, the first lighting device 41 can be divided into blue light and red light according to an object to be illuminated.

[Description of the second lighting device 42]

Hereinafter, the second lighting device 42 will be described. The frame member 420 is a lower end of the fixing member 40 , and is fixed to the upper side Z1 of the frame member 410 of the first lighting device 41 . On the inclined surface of the inner side of the frame member 420 , the light emitting element group 421 is arranged in a triple circular annular shape. The center line of the light emitting element group 421 faces the inspection point P.

The wavelength of the light L2 emitted by the light-emitting element group 421 of the second lighting device 42 is the shortest wavelength among the light L1 emitted by the two sets of the light-emitting element group 411B and 411R of the first lighting device 41 . (in this example, about 470 nm of the wavelength of blue light). That is, the wavelength of the light L2 emitted by the light-emitting element group 421 of the second lighting device 42 is the wavelength of the light L1 emitted by the first set of light-emitting element group 411B of the first lighting device 41, that is, the wavelength ( about 470 nm). In this example, the wavelength of the light L2 emitted by the light emitting element group 421 is about 630 nm of the wavelength of the red light.

The second illuminating device 42 mainly illuminates the wiring and the electrode E of the work W. That is, as shown in Fig. 7, the second illuminating device 42 is suitable for illuminating the wiring and the electrode E of the work W mainly composed of copper (Cu) with the red light L2. Do.

[Description of the third lighting device 43]

Hereinafter, the third lighting device 43 will be described. The frame member 430 is fixed to the lower end of the lens 201 of the main inspection unit 20 . On the lower surface of the frame member 430 , the light emitting element group 431 is arranged in a triple circular annular shape. The center line of the light-emitting element group 431 faces the inspection point P.

The wavelength of the light L3 emitted by the light emitting element group 431 of the third lighting device 43 is the shortest wavelength among the light L1 emitted by the two sets of the light emitting element groups 411B and 411R of the first lighting device 41 . (in this example, about 470 nm of the wavelength of blue light). That is, the wavelength of the light L3 emitted by the light-emitting element group 431 of the third lighting device 43 is the wavelength of the light L1, that is, the blue light emitted by the first light-emitting element group 411B of the first lighting device 41 ( about 470 nm). In this example, the wavelength of the light L3 emitted by the light emitting element group 431 is about 630 nm of the wavelength of the red light.

The third illuminating device 43 mainly illuminates the wiring of the work W and the electrode E. As shown in FIG. That is, as shown in Fig. 7, the third illuminating device 43 is suitable for illuminating the wiring and the electrode E of the work W mainly composed of copper (Cu) with the red light L2. .

[Description of the repair device (3)]

As for the repair apparatus 3, when a defective location is detected by the main inspection part 20, and it is determined by the inspection part 21 for verification that correction is necessary in a defective location, the conductive ball B is normal. Modify it to be mounted as . 1 and 2 , the repair apparatus 3 includes a flux transfer unit 30 , a conductive ball mounting unit 31 , and an excess conductive ball removal unit 32 .

The flux transfer part 30 is provided in the Z-direction moving part of the repair part conveyance part 30Z. The conductive ball mounting part 31 is provided in the Z-direction moving part of the repair part carrying part 31Z. The surplus conductive ball removal part 32 is provided in the Z-direction moving part of the repair part conveyance part 32Z. As a result, the flux transfer part 30, the conductive ball mounting part 31, and the surplus conductive ball removal part 32 are arrange|positioned on the left and right in the X direction.

The flux transfer unit 30 transfers the flux F to the electrode E on which the conductive ball B is not mounted. A flux transfer pin 300 is attached to the flux transfer unit 30 via a pin holder, a lock mechanism, and a position measuring sensor. Here, the position information acquired by the calibration unit 6 of the flux transfer unit 30 is position information of the center of the lower end (tip) of the flux transfer pin 300 as described above.

Below the flux transfer pin 300 , a flux supply tray 301 is disposed via a Y-direction moving mechanism 302 . The Y-direction moving mechanism 302 includes a fixed part (guide part), a moving part, and a driving part 303 . The driving unit 303 is, for example, a servo motor, and moves the moving unit in the Y-direction of the longitudinal direction of the fixed unit. Accordingly, the flux supply tray 301 moves in the Y direction, and is retracted from below the flux transfer pin 300 , which is located under the flux transfer pin 300 . The driving unit 303 drives based on a control signal from the control unit.

An appropriate amount of flux F is attached to the flux transfer pin 300 from the flux supply tray 301 positioned below. In addition, the flux transfer pin 300 descends in the Z direction after the flux supply tray 301 is retracted from below, and transfers the flux F to the electrode E in the mixing bowl state.

The conductive ball mounting unit 31 mounts the conductive ball B on the electrode E via the flux F transferred by the flux transfer unit 30 . A conductive ball mounting nozzle 310 is attached to the conductive ball mounting portion 31 via a nozzle holder, a lock mechanism, and a position measuring sensor. Here, the positional information acquired by the calibration unit 6 of the conductive ball mounting unit 31 is positional information of the center of the lower end (tip) of the conductive ball mounting nozzle 310 as described above.

Below the conductive ball mounting nozzle 310 , a conductive ball supply tray 311 is disposed via a Y-direction moving mechanism 312 . The Y-direction moving mechanism 312 includes a fixed part (guide part), a moving part, and a driving part 313 . The driving unit 313 is, for example, a servo motor, and moves the moving unit in the Y-direction of the longitudinal direction of the fixed unit. Thereby, the conductive ball supply tray 311 moves in the Y-direction, and is retracted from below the conductive ball mounting nozzle 310 , which is located below the conductive ball mounting nozzle 310 . The driving unit 313 drives based on a control signal from the control unit.

The conductive ball mounting nozzle 310 adsorbs one conductive ball B from the conductive ball supply tray 311 located below. In addition, the conductive ball mounting nozzle 310 descends in the Z-direction after the conductive ball supply tray 311 is retracted from the bottom, and absorbs the adsorbed conductive ball B with the flux of the electrode E in the mixing bowl state. F) is mounted.

The surplus electroconductive ball removal part 32 removes the surplus electroconductive ball B1 mounted on the work W in excess. The excess conductive ball removal nozzle 320 is attached to the excess conductive ball removal unit 32 via a nozzle holder, a lock mechanism, and a position measurement sensor. Here, the positional information acquired by the calibration unit 6 of the surplus conductive ball removal unit 32 is positional information of the center of the lower end (tip) of the surplus conductive ball removal nozzle 320, as described above.

A surplus conductive ball receiving tray 321 is disposed below the surplus conductive ball removal nozzle 320 via a Y-direction movement mechanism 322 . The Y-direction moving mechanism 322 includes a fixed part (guide part), a moving part, and a driving part 323 . The driving unit 323 is, for example, a servo motor, and moves the moving unit in the Y-direction of the longitudinal direction of the fixed unit. As a result, the surplus conductive ball receiving tray 321 moves in the Y-direction, and is retracted from below the surplus conductive ball removal nozzle 320 located below the surplus conductive ball removal nozzle 320 . The driving unit 323 drives based on a control signal from the control unit.

When the surplus conductive ball receiving tray 321 is retracted from the bottom, the surplus conductive ball removal nozzle 320 descends in the Z direction to adsorb the surplus conductive balls B1. In addition, the surplus conductive ball removal nozzle 320 ascends in the Z-direction, and receives and delivers the adsorbed surplus conductive balls B1 to the surplus conductive ball receiving tray 321 located below.

The surplus conductive ball removal nozzle 320 also removes the shifting conductive balls B shown in Fig. 9C.

[Description of the imaging device]

The imaging device captures images at least at a location corrected by the respective units 30 , 31 , and 32 of the repair unit. The imaging device is disposed on the side where the operator is positioned, ie, on the front side Y1 with respect to the repair device 3 . The imaging device outputs the captured image as a signal to the control unit. The image picked up by the imaging device is enlarged and displayed on the display device 5 via the control unit.

The imaging device automatically moves between the respective units 30, 31, and 32 of the repair unit by stopping the driving of the control of the control unit, and further, the respective units 30 and (31) of the repair unit. , automatically stops at the position of (32). In addition, the imaging device is adjusted in the Y-direction, Z-direction, and X-axis rotation direction by manual adjustment by an operator.

[Description of the display device 5]

The display device 5 enlarges and displays the target imaged by the imaging device as an image for the operator to observe. 1 and 2 , the display device 5 is disposed on the repair device 3 side. That is, the display device 5 is disposed on the right side X2 of the repair device 3 . The height and direction of the display device 5 can be aligned with the position of the operator's eyes, ie, the line-of-sight direction of the operator with respect to the display device 5 .

[Description of the control unit]

The electroconductive ball test|inspection repair apparatus 1 is provided with a control part. The control unit controls, based on the instruction signal and the detection signal, a process inspected by the respective units 20 and 21 of the inspection unit and a process corrected by each unit 30, 31, and 32 of the repair unit . The control unit is an information processing device, and is configured of, for example, an electronic control unit (ECU). The control unit includes a microcontroller and other electronic circuits. A microcontroller includes a processor and a memory. The processor is at least one of a CPU, an MPU, and a GPU. The memory includes ROM and RAM. The processor executes a program stored in the ROM or a program loaded in the RAM.

[Description of operation of the embodiment]

The electroconductive ball test|inspection repair apparatus 1 which concerns on this embodiment consists of the structure as mentioned above, and the action is demonstrated below with reference to the flow explanatory drawing which showed the process of FIG.

First, the operator manually starts the operation of the conductive ball inspection and repair device 1 . Alternatively, under the control of the control unit, the operation of the conductive ball inspection and repair device 1 is automatically started (started).

The door of the conveying container 17 and the door of the wall are opened. The transfer robot 15 takes out the work W from the transfer container 17 and carries it into the conductive ball inspection and repair apparatus 1 (carry-in S1 of the work W). At the same time, the door of the conveying container 17 and the door of the wall are closed. The transfer robot 15 sets the workpiece W on the pre-aligner 13 . The prealigner 13 aligns the center and orientation of the workpiece W. In the case where the work W is a rectangular substrate, the step of aligning the center and the direction of the work W with the pre-aligner 13 is omitted.

The transfer robot 15 sets the workpiece W on the stage 14 in the initial position from the prealigner 13 . The work W is located in the work recognition information obtaining unit 16 via the stage transfer unit 7 and the calibration unit 6, and recognized by the work recognition information obtaining unit 16 (of the work W). recognition S2].

In addition, the work W of this example consists of a board|substrate. Therefore, in the main inspection unit 20, the pattern of the manufactured wiring is actually checked, and the recognized pattern is registered as an inspection pattern of the work W (inspection pattern registration S3 of the work W). That is, the work W is located in the main inspection unit 20 via the stage transfer unit 7 and the calibration unit 6 , and an inspection pattern is registered in the main inspection unit 20 .

Next, the plurality of integrated circuit chips of the work W are respectively transferred to the main inspection unit 20 through the stage transfer unit 7 and the calibration unit 6 in the above-described stage (step) S3 . It is located and inspected by the main inspection unit 20 (inspection S4 of the main inspection unit 20 ).

The control unit determines, based on the inspection of the main inspection unit 20 , whether or not there are defective portions in the plurality of integrated circuit chips of the work W (defective portions present? S5 ). Here, if there is no defective part, it progresses to the following stage (process) S11. On the other hand, if there is a defective part, it progresses to the next stage (process) S6.

The defective portion is located in the verification unit 21 through the stage transfer unit 7 and the calibration unit 6, and is inspected for confirmation by the verification unit 21 for verification (verify inspection unit ( 21) Inspection S6]. That is, a defective location is imaged by the camera 210 of the inspection unit 21 for verification, and the captured image is enlarged and displayed on the display device 5 .

The operator visually observes the image of the defective part enlarged and displayed on the display device 5, and determines whether correction is necessary (correction required? S7). Then, if the operator determines that "there is no need for correction", the flow advances to the following stage (process) S11. On the other hand, if the operator judges that "correction is necessary", it progresses to the next stage (process) S8.

The defective part is located in each of the parts 30 , 31 , and 32 of the repair unit via the stage transfer unit 7 and the calibration unit 6 . And the defective part is corrected by each part 30, 31, 32 of the repair part (repair apparatus 3 corrects a defective part S8). The working state in which each part 30, 31, 32 of a repair part corrects a defect location is as follows.

That is, when the defective location is in the mixing bowl state shown in Fig. 9B. In this case, first, the flux transfer pin 300 of the flux transfer unit 30 transfers the flux F to the electrode E on which the conductive ball B is not mounted. Next, the conductive ball mounting nozzle 310 of the conductive ball mounting unit 31 mounts the conductive ball B on the flux F transferred to the electrode E.

In the case of the shift ball state shown in FIG.9(C), the defective part. In this case, first, the surplus conductive ball removal nozzle 320 of the surplus conductive ball removal unit 32 removes the conductive balls B that are out of the electrode E. Next, the flux transfer pin 300 of the flux transfer unit 30 transfers the flux F to the electrode E from which the conductive ball B has moved. Then, the conductive ball mounting nozzle 310 of the conductive ball mounting unit 31 mounts the conductive ball B on the flux F transferred to the electrode E.

In the case where the defective portion is in a state of excess balls shown in Fig. 9D. In this case, the surplus electroconductive ball removal nozzle 320 of the surplus electroconductive ball removal part 32 removes the excess electroconductive ball B. As described above, each of the parts 30 , 31 , and 32 of the repair unit corrects the defective portion.

In this stage (process) S8, the imaging device takes as a target the defective location corrected by each part 30, 31, 32 of the repair part, and images. The imaged object is enlarged and displayed on the display device 5 . The operator can visually observe the object enlarged and displayed on the display device 5, and can confirm the state in which the defective part is corrected by each part 30, 31, 32 of the repair part.

When the defective portion is corrected, the flow advances to the next stage (process) S9. The corrected defective location is located in the verification unit 21 through the stage transfer unit 7 and the calibration unit 6, and is reconfirmed by the verification unit 21 (verify inspection unit 21). ) retest S9]. That is, the corrected defective location is imaged by the camera 210 of the verification unit 21 for verification, and the captured image is enlarged and displayed on the display device 5 .

In the defective location enlarged and displayed on the display device 5, the operator visually reconfirms the image of the corrected defective location, and re-determines whether re-correction is necessary (re-correction required? S10). Then, if the operator determines that "re-correction is not necessary", the flow advances to the following stage (process) S11. On the other hand, if the operator judges that "re-correction is necessary", it progresses to the front stage (process) S8 again.

When there is no defective part, and there is no need of correction, and there is no need of re-correction. In this case, the stage 14 is returned to the initial position. At the same time, the door of the conveying container 17 and the door of the wall are opened. The transfer robot 15 takes out the work W on the stage 14 from the inside of the conductive ball inspection and repair apparatus 1 and stores it in the transfer container 17 (Exporting the work W S11) . At the same time, the door of the conveying container 17 and the door of the wall are closed.

In the above, the operation|work of the electroconductive ball test|inspection repair apparatus 1 is complete|finished (finished).

[Description of Effects of Embodiments]

The electroconductive ball test|inspection repair apparatus 1 which concerns on this embodiment consists of the structure and operation|action as mentioned above, and the effect is demonstrated below.

The conductive ball inspection and repair apparatus 1 according to the present embodiment includes lighting devices 41 and 42 between the camera 200 and the lens 201 of the main inspection unit 20 and the work W. , (43) are arranged in three steps in the Z direction, which is the vertical direction. In addition, in the conductive ball inspection and repair device 1 according to this embodiment, the three-stage lighting devices 41 , 42 , and 43 , respectively, the inspection point P of the work W and its surroundings. to illuminate As a result, according to the electroconductive ball test|inspection repair apparatus 1 which concerns on this embodiment, several illumination functions can be acquired.

Since the electroconductive ball test|inspection repair apparatus 1 which concerns on this embodiment can acquire a some illumination function, it can use the illumination function suitable for the object to be illuminated, from among the multiple illumination functions properly. As a result, the electroconductive ball test|inspection repair apparatus 1 which concerns on this embodiment can test|inspect (measure) the electroconductive ball B with high precision.

In the conductive ball inspection and repair apparatus 1 according to this embodiment, the light emitting element groups 411B, 411R, 421 and 431 are frame members 410, 420 and 430 in a circular annular shape. It is arranged in a circular annular shape along the , and the center of the lens 201 and the center of the frame members 410, 420, 430 are located on the same line (C). Accordingly, the conductive ball inspection and repair device 1 according to the present embodiment transmits the light L1 (L10), L2, and L3 from the light emitting element groups 411B, 411R, 421, and 431 to the work piece ( The inspection point P of W) and its surroundings can be illuminated efficiently. As a result, the electroconductive ball test|inspection repair apparatus 1 which concerns on this embodiment can test|inspect (measure) the electroconductive ball B with high precision.

In the conductive ball inspection and repair apparatus 1 according to this embodiment, the light-emitting element groups 411B and 411R of the first lighting device 41 are configured in two sets, and the two sets of light-emitting element groups 411B, ( 411R) each emits a different wavelength for each set of light L1. That is, in the conductive ball inspection and repair apparatus 1 according to this embodiment, the light emitting element group 411B of the first set emits light L1 of blue light having a wavelength of about 470 nm, and the light emitting element group 411R of the second set emits light L1 of a wavelength of about 470 nm. Light L1 of red light having a wavelength of about 630 nm is emitted. Thereby, the electroconductive ball test|inspection repair apparatus 1 which concerns on this embodiment can select and use the light L1 of a blue light, and the light L1 of a red light separately. For example, in the case of an initial (new) conductive ball (B) whose surface is not oxidized, the blue light L1 is used, and in the case of the conductive ball (B) whose surface is oxidized, the red light L1 is used. use. As a result, the electroconductive ball test|inspection repair apparatus 1 which concerns on this embodiment can test|inspect (measure) the electroconductive ball B with high precision.

In the conductive ball inspection and repair apparatus 1 according to this embodiment, since the first illumination device 41 has the light diffusion member 413 , the work W of the diffused light L10 emitted from the light diffusion member 413 . The angle of incidence θ with respect to is large. Therefore, according to the conductive ball inspection and repair apparatus 1 according to this embodiment, the diffused light L10 is reflected as the reflected light L11 on the spherical surface of the conductive ball B, and is efficiently applied to the lens 201 of the main inspection unit 20 . enter into On the other hand, the diffused light L10 is reflected as the reflected light L12 on the work W and travels out of the field of view of the lens 201 without entering the lens 201 of the main inspection unit 20 . As a result, in the conductive ball inspection and repair apparatus 1 according to this embodiment, the diffused light L10 from the light diffusion member 413 of the first lighting apparatus 41 can efficiently illuminate the conductive ball B, , the conductive ball (B) can be inspected (measured) with high precision.

In the conductive ball inspection and repair device 1 according to this embodiment, the first illuminating device 41 disposed at the position closest to the work W illuminates the conductive ball B. Therefore, in the conductive ball inspection and repair apparatus 1 according to this embodiment, the diffused light L10 emitted from the light diffusing member 413 as the light from the first illuminating device 41 at an incident angle θ on the work W this is big As a result, in the conductive ball inspection and repair device 1 according to the present embodiment, as described above, the diffused light L10 from the light diffusion member 413 of the first lighting device 41 efficiently strikes the conductive ball B. can be illuminated, and the conductive ball (B) can be inspected (measured) with high precision.

In the conductive ball inspection and repair apparatus 1 according to this embodiment, the light-emitting element group 421 of the second lighting device 42 and the light-emitting element group 431 of the third lighting device 43 are red light L2, It emits L3. The wavelength of the red light is longer than the wavelength (about 470 nm) of the light L1 of the blue light emitted by the light emitting element group 411B of the first set of the first lighting device 41 . According to this, the conductive ball inspection and repair device 1 according to this embodiment is mainly made of copper (Cu) by the red lights L2 and L3 from the second lighting device 42 and the third lighting device 43 . It is suitable for illuminating the wiring or electrode E of the constituted work W. As a result, the conductive ball inspection and repair apparatus 1 according to this embodiment can inspect (measure) the wiring of the work W, the electrode E, and the conductive ball B with high precision, and Inspection patterns can be registered.

In the conductive ball inspection and repair apparatus 1 according to this embodiment, since the second lighting device 42 and the third lighting device 43 are disposed at positions separated from the work W, the second lighting device 42 ) and the lights L2 and L3 from the third illuminating device 43 can efficiently illuminate the wiring and the electrode E of the work W. As a result, the conductive ball inspection and repair apparatus 1 according to this embodiment can inspect (measure) the wiring of the work W, the electrode E, and the conductive ball B with high precision, and Inspection patterns can be registered.

The conductive ball inspection and repair apparatus 1 according to the present embodiment includes lights L1 and L2 of red light from three directions of the first lighting device 41 , the second lighting device 42 , and the third lighting device 43 ; L3 is to illuminate the wiring of the workpiece (W) or the electrode (E). As a result, the conductive ball inspection and repair apparatus 1 according to this embodiment can inspect (measure) the wiring of the work W, the electrode E, and the conductive ball B with high precision, and Inspection patterns can be registered.

[Explanation of examples other than the embodiment]

In addition, in the above-mentioned embodiment, the board|substrate which makes|forms the disk shape as the work W is demonstrated. However, in the present invention, the workpiece may be a substrate having a rectangular shape other than the disk shape, or a wafer made of silicon or the like other than the substrate.

In addition, in the above-described embodiment, three stages of lighting devices 41 , 42 , and 43 are arranged. However, in the present invention, two or four or more illuminating devices may be arranged.

Further, in the above-described embodiment, the planar shape of the frame members 410, 420, and 430 of the three-stage lighting devices 41, 42, and 43 forms a circular annular or polygonal annular shape. will be. However, in the present invention, the planar shape of the frame members 410, 420, and 430 may be a shape other than a circular annular shape or a polygonal annular shape, for example, an annular shape such as an elliptical annular shape, a triangular annular shape, or a quadrangular annular shape. .

In addition, in the above-described embodiment, the center of the lens 201 and the center of the frame members 410, 420, 430 are located on the same line (C). However, in the present invention, the center of the lens 201 and the center of the frame members 410 , 420 , and 430 may not be located on the same line C and may be shifted.

In addition, in the above-mentioned embodiment, the light emitting element group 411B, 411R of the 1st illumination device 41 is comprised in two sets. However, in the present invention, the light emitting element group of the first lighting device 41 may be constituted by one set or three sets or more.

And in the above-described embodiment, the two sets of light-emitting element groups 411B and 411R of the first lighting device 41 emit blue light and red light. However, in the present invention, a plurality of light emitting element groups of the first lighting device 41 may emit blue light, green light, red light, or the like. In addition, in the case where the light emitting element group of the 1st lighting device 41 is one set, a single light-emitting element group of a set may emit single light, such as blue light, green light, and red light.

In addition, in the above-mentioned embodiment, the 1st illumination device 41 has the light-diffusion member 413. FIG. However, in the present invention, it is not necessary to form the light diffusion member 413 in the first lighting device 41 .

In addition, in the above-mentioned embodiment, the light-emitting element group 421 of the 2nd lighting apparatus 42 and the light-emitting element group 431 of the 3rd lighting apparatus 43 emit red light. However, in the present invention, the light-emitting element group 421 of the second lighting device 42 and the light-emitting element group 431 of the third lighting device 43 may emit green light or the like. That is, the color (wavelength of light) emitted from the light emitting element group 421 of the second lighting device 42 is the same as the color (wavelength of light) emitted from the light emitting element group 431 of the third lighting device 43 . . However, in the present invention, the color (wavelength of light) emitted by the light-emitting element group 421 of the second lighting device 42 and the color of the light emitted by the light-emitting element group 431 of the third lighting device 43 ( wavelength of light) may be different.

In addition, this invention is not limited by embodiment mentioned above.

1: Conductive ball inspection and repair device
10: trestle
11: support member
110: holding
111: cancer
112: beam
12: load port
13: Pre-Aligner
14: Stage
15: transfer robot (workpiece transfer unit)
16: workpiece recognition information acquisition unit
160: camera
161: lens
162: lighting sphere
17: conveyance container (FOUP)
2: Inspection device
20: main inspection unit (inspection unit)
200: camera
201: lens
20Z: inspection unit transfer unit of the main inspection unit 20
200Z: Z-direction drive unit
21: Verification inspection unit (inspection unit)
210: camera
211: lens
212: lighting sphere
21Z: inspection unit transfer unit of the verification unit 21 for verify
210Z: Z-direction drive unit
3: Repair device
30: flux transfer unit (repair unit)
300: flux transfer pin
301: flux tray
302: Y direction movement mechanism
303: driving unit
30Z: repair part transfer part of the flux transfer part 30
300Z: Z-direction drive unit
31: conductive ball mounting part (repair part)
310: conductive ball mounted nozzle
311: conductive ball supply tray
312: Y-direction movement mechanism
313: driving unit
31Z: the repair part carrying part of the conductive ball mounting part 31
310Z: Z-direction drive unit
32: excess conductive ball removal part (repair part)
320: excess conductive ball removal nozzle
321: surplus conductive ball receiving tray
322: Y direction movement mechanism
323: driving unit
32Z: Repair part conveyance part of the excess conductive ball removal part 32
320Z: Z-direction drive unit
40: fixed plate
41: first lighting device (lowest lighting device)
410: frame member
411B: blue light emitting element group (blue LED)
411R: Red light emitting element group (red LED)
412: space
413: light diffusion member
42: second lighting device (intermediate lighting device)
420: frame member
421: red light emitting element group (red LED)
422: space
43: third lighting device (top lighting device)
430: frame member
431: red light emitting element group (red LED)
432: space
5: display device
6: Calibration unit
7: Stage transfer unit
70X: X-direction fixed part (X-direction guide part)
71X: X-direction moving part
70Y: Y-direction fixed part (Y-direction guide part)
71Y: Y-direction moving part
B: conductive ball
B1: Extra conductive ball
C: Optical axis of lens 201 (collinear)
E: electrode
F: flux
L1: light (blue light or red light)
L2: light (red light)
L3: light (red light)
L10: diffused light
L11: reflected light
L12: reflected light
P: inspection point
W: Workpiece
X1: Left
X2: Right
Y1: front (immediately in front) side
Y2: Back (inward, direction) side
Z1: upper
Z2: lower
θ: angle of incidence

Claims (7)

an inspection device including a main inspection unit that inspects whether a conductive ball is properly mounted on an electrode of a work; and
A repair device having a repair unit that corrects the conductive ball so that the conductive ball is normally mounted at the location when the main inspection unit detects a location where the conductive ball is not normally mounted ;
including,
The main inspection unit,
cameras and lenses; and
A plurality of plurality steps are arranged in a vertical direction between the camera and the lens and the work piece, and a lighting device for illuminating the work piece;
Each of the plurality of stages of the lighting device,
An annular frame member with a space provided in the central portion; and
A group of light emitting elements provided in plurality on the frame member; and
The work is a substrate on which wiring is formed,
Among the plurality of stages of the lighting devices, the lighting device disposed at a position closest to the work piece is a lighting device for illuminating the conductive ball, and among the plurality of levels of the lighting devices, the lighting device is disposed at a position closest to the work piece the lighting device other than the lighting device is a lighting device for illuminating the wiring of the work;
Among the plurality of stages of the lighting device, the light emitting element group of the lighting device disposed at a position closest to the work is composed of a plurality of sets,
The wavelength of the light emitted by each of the light-emitting element groups of a plurality of sets is different for every set of the plurality of sets,
Among the plurality of stages of the lighting devices, the wavelength of light emitted by the light-emitting element group of the lighting devices other than the lighting device disposed at the position closest to the work piece is the shortest among the lights emitted by the plurality of sets of the light-emitting element groups. longer than the wavelength,
Conductive ball inspection and repair device. According to claim 1,
The light emitting element group is arranged in an annular shape along the annular shape of the frame member,
The center of the lens and the center of the frame member are located on the same line, a conductive ball inspection and repair device. 3. The method of claim 1 or 2,
Among the plurality of stages of the lighting device, the light emitting element group of the lighting device disposed at a position closest to the work is constituted by a plurality of sets,
The electroconductive ball test|inspection repair apparatus with which the wavelength of the light each emitted by the said light emitting element group of several sets is different for every set. 4. The method of claim 3,
Among the plurality of stages of the lighting device, the lighting device disposed at a position closest to the work is provided with a light diffusing member that enters the light emitted by the light emitting element group and emits it to the work side as diffused light. which is a conductive ball inspection and repair device. delete delete delete

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