KR102396404B1 - Organic light emitting diode display and manufacturing method of the same - Google Patents

Abstract

According to an embodiment of the present invention, there is provided an organic light emitting diode display including at least one structure configured to efficiently control an arrangement area of an adhesive layer. A plurality of driving devices and a plurality of organic light emitting devices are disposed on a lower substrate, and a black matrix is disposed on an upper substrate facing the lower substrate. A sealing dam and structure are disposed between the two substrates. The structure can improve the lifetime reliability of the organic light emitting diode by minimizing damage to the sealing dam due to movement of the adhesive layer to the sealing solder when bonding the upper and lower substrates.

Description

Organic light emitting display device and manufacturing method thereof

The present invention relates to an organic light emitting diode display and a method of manufacturing the same, and more particularly, to an organic light emitting display capable of improving reliability of an encapsulation dam that minimizes penetration of oxygen and moisture, and a method of manufacturing the same.

The organic light emitting diode display (OLED) is a self-emission type display device, and unlike a liquid crystal display device (LCD), it does not require a separate light source, so it can be manufactured in a lightweight and thin form. In addition, the organic light emitting diode display is being studied as a next-generation display because it is advantageous in terms of power consumption due to low voltage driving, and has excellent color realization, response speed, viewing angle, and contrast ratio (CR).

In an organic light emitting display device, a light emitting layer including an organic material is disposed between a pixel electrode (Anode) and a common electrode (Cathode), and holes and electrons injected from the pixel electrode and the common electrode combine in the organic light emitting layer to form holes - Forms an exciton, an electron pair, and emits light by the energy generated when the exciton returns to the ground state. As described above, the organic light emitting display device including the self-luminous device does not require a separate light source unlike the liquid crystal display device, and thus can be manufactured as a lightweight and thin display device.

However, the organic light emitting diode display is very vulnerable to oxygen, moisture, etc. because an organic material is used as the emission layer. When oxygen or moisture permeates, electrical resistance required for injection of electrons and holes increases, and the organic light emitting layer is oxidized, and defects such as dark spots may occur.

Accordingly, various techniques for sealing the organic light emitting device are used in order to minimize penetration of oxygen, moisture, etc. into the organic light emitting layer from the outside.

[Related technical literature]

[Patent Literature]

Organic light emitting diode display device (Patent Application No. 10-2012-0151923)

In order to seal the organic light-emitting device, a method of sealing the organic light-emitting device by using an adhesive layer on the lower substrate on which the organic light-emitting device is disposed and bonding to the upper substrate, which is an encapsulation substrate, is mainly used. At this time, a method is used to minimize the penetration of oxygen and moisture, which may permeate from the side of the bonded substrates, by disposing a sealing dam on the side surface of the substrate.

The lower substrate and the upper substrate are bonded after disposing an adhesive layer of a curable material such as resin on the upper substrate. A curable material such as resin may be disposed in a liquid state on the upper substrate using an inkjet printing method or the like.

In the process of bonding the upper substrate and the lower substrate, the adhesive layer disposed on the upper substrate is in an uncured liquid state, so it has fluidity and can be moved on the upper substrate by surface tension.

When the adhesive layer moves, the sealing dam does not sufficiently contact the lower substrate due to the adhesive layer moved in the direction of the sealing dam disposed on the upper substrate in the process of bonding the upper substrate and the lower substrate, or the sealing dam is not in contact with the lower substrate due to pressure. Collapse can happen.

When the sealing dam does not sufficiently contact the two substrates between the upper substrate and the lower substrate, a penetration path of oxygen and moisture is generated, which may result in poor progress of the organic light emitting diode. Accordingly, the inventors of the present invention have invented a new structure and method of an organic light emitting diode display capable of minimizing damage to the sealing dam in the process of bonding the upper substrate and the lower substrate.

An object to be solved according to an embodiment of the present invention is to provide an organic light emitting diode display including a structure capable of minimizing fluidity of an adhesive layer on an upper substrate, and a method of manufacturing the same.

SUMMARY OF THE INVENTION An object of the present invention is to provide an organic light emitting diode display capable of improving the reliability of a sealing dam and a method of manufacturing the same.

The problems to be solved according to an embodiment of the present invention are not limited to the problems mentioned above, and other problems not mentioned will be clearly understood by those skilled in the art from the following description.

According to an embodiment of the present invention, there is provided an organic light emitting diode display including a structure capable of minimizing fluidity of an adhesive layer in a process of bonding an upper substrate and a lower substrate. A plurality of driving devices and a plurality of organic light emitting devices are disposed on a lower substrate, and a sealing dam and a black matrix are disposed on an upper substrate facing the lower substrate. In addition, an adhesive layer made of a material such as resin is disposed between the upper substrate and the lower substrate, and at least one structure configured to minimize the fluidity of the adhesive layer to easily control the arrangement area of the adhesive layer is disposed.

The movement of the adhesive layer to the area where the sealing dam is placed is minimized by the structure arranged to easily control the arrangement area of the adhesive layer, so that the sealing dam collapses in the step of bonding the upper and lower substrates or between the upper and lower substrates. It is possible to minimize defects that are insufficiently located in the

A method of manufacturing an organic light emitting display device according to an embodiment of the present invention is provided. A plurality of driving devices and a plurality of organic light emitting devices are formed on the lower substrate. Meanwhile, a black matrix layer is formed on the upper substrate facing the lower substrate.

A sealing dam that can minimize the penetration of oxygen and moisture is formed on the upper substrate, and the sealing dam is placed in the bezel area. Next, an adhesive layer is disposed on the upper substrate, the upper substrate and the lower substrate are bonded, and then the adhesive layer and the sealing dam are cured using heat or UV.

The step of forming the black matrix on the upper substrate includes forming a structure capable of minimizing the movement of the adhesive layer to the sealing dam in the process of bonding the upper and lower substrates by efficiently controlling the arrangement area of the adhesive layer.

In this way, by forming the structure on the upper substrate, it is possible to minimize damage to the sealing dam due to the spread of the adhesive layer in the process of bonding the upper and lower substrates.

According to an embodiment of the present invention, by providing a structure configured to easily control the arrangement area of the adhesive layer, the reliability of the sealing dam is improved, and the moisture permeability and oxygen permeation rate are minimized, thereby improving the lifespan of the organic light emitting diode display.

In addition, by providing the structure, there is an effect that can reduce the manufacturing cost by improving the stability of the process of bonding the upper substrate and the lower substrate.

The effects of the present invention are not limited to the above-mentioned effects, and other effects not mentioned will be clearly understood by those skilled in the art from the following description.

Since the content of the invention described in the problems to be solved above, the means for solving the problems, and the effects do not specify the essential characteristics of the claims, the scope of the claims is not limited by the matters described in the content of the invention.

1 is a schematic plan view illustrating a configuration of an organic light emitting diode display according to an exemplary embodiment.
FIG. 2 is a schematic cross-sectional view taken along line A-A' of FIG. 1 for explaining an organic light emitting diode display on which a structure is disposed according to an exemplary embodiment.
3A to 3D are schematic cross-sectional enlarged views of region X of FIG. 2 for explaining various configurations of structures according to various embodiments of the present disclosure;
4 is a flowchart illustrating a method of manufacturing an organic light emitting diode display including a structure according to an exemplary embodiment.

Advantages and features of the present invention and methods of achieving them will become apparent with reference to the embodiments described below in detail in conjunction with the accompanying drawings. However, the present invention is not limited to the embodiments disclosed below, but will be implemented in a variety of different forms, and only these embodiments allow the disclosure of the present invention to be complete, and common knowledge in the technical field to which the present invention belongs It is provided to fully inform the possessor of the scope of the invention, and the present invention is only defined by the scope of the claims.

The shapes, sizes, proportions, angles, numbers, etc. disclosed in the drawings for explaining the embodiments of the present invention are illustrative and the present invention is not limited to the illustrated matters. Like reference numerals refer to like elements throughout. In addition, in describing the present invention, if it is determined that a detailed description of a related known technology may unnecessarily obscure the gist of the present invention, the detailed description thereof will be omitted. When 'including', 'having', 'consisting', etc. mentioned in this specification are used, other parts may be added unless 'only' is used. When a component is expressed in the singular, cases including the plural are included unless otherwise explicitly stated.

In interpreting the components, it is construed as including an error range even if there is no separate explicit description.

In the case of a description of the positional relationship, for example, when the positional relationship of two parts is described as 'on', 'on', 'on', 'beside', etc., 'right' Alternatively, one or more other parts may be positioned between two parts unless 'directly' is used.

In the case of a description of a temporal relationship, for example, when the temporal relationship is described as 'after', 'following', 'after', 'before', etc., 'immediately' or 'directly' Unless ' is used, cases that are not continuous may be included.

Although the first, second, etc. are used to describe various elements, these elements are not limited by these terms. These terms are only used to distinguish one component from another. Accordingly, the first component mentioned below may be the second component within the spirit of the present invention.

Each feature of the various embodiments of the present invention can be partially or wholly combined or combined with each other, technically various interlocking and driving are possible, and each of the embodiments may be independently implemented with respect to each other or implemented together in a related relationship. may be

Hereinafter, various configurations of an organic light emitting diode display including a structure capable of efficiently controlling the arrangement of an adhesive layer according to an embodiment of the present invention will be described.

According to the configuration of the organic light emitting diode display, the sealing dam reinforces the adhesion between the lower substrate and the upper substrate in the non-display area of the organic light emitting display and minimizes the penetration of moisture. The sealing dam is composed of a sealant and may include a moisture absorption filler dispersed in the sealant. As the encapsulant, a curable encapsulant that can be cured by heat or ultraviolet light is mainly used. For example, the sealant may be an epoxy-based or acrylic-based material to which a thermal curing accelerator and/or a photoinitiator is added.

The adhesive layer is a filler (filler), and may be made of a resin material that can be cured by heat or UV, and may include a transparent moisture absorption filler in the adhesive layer. Moisture absorbing filler is a material that can absorb moisture is pulverized to a small size, and is uniformly dispersed in the adhesive layer.

Hereinafter, various embodiments of the present invention will be described in detail with reference to the accompanying drawings.

1 is a schematic plan view illustrating a configuration of an organic light emitting display device according to an exemplary embodiment.

Referring to FIG. 1 , the organic light emitting diode display 100 includes a lower substrate 110 and an upper substrate 120 on which a pad region 150 is defined. Although the lower substrate 110 is illustrated for simplicity, it includes a plurality of driving devices and a plurality of organic light emitting devices, and includes a pad region 150 in which a drive IC (D-IC) 152 is disposed. The driving device and the organic light emitting device electrically extend to the pad region 150 through a wiring electrode (not shown) on the lower substrate 110 , and through the pad electrode 151 disposed in the pad region 150 , the circuit board ( not shown) and electrically connected.

A current and a signal for driving the organic light emitting display device 100 are supplied from the circuit board, and the organic light emitting diode is driven by the supplied signal and current to emit light.

Also, in the organic light emitting diode display 100 , a display area 130 for displaying an image and a non-display area 140 are defined. The above-described organic light emitting device (not shown) is disposed to correspond to the display area 130 , and wirings, electrodes, and pad areas 150 for various purposes are disposed in the non-display area 140 .

To describe the driving of the organic light emitting diode display 100 a little further, the display area 140 may be referred to as an active area, and a matrix of pixels composed of a plurality of sub-pixels (sub-pixels) placed in the form

A sub-pixel is configured to emit light of each unique color such as white, blue, green, and red, and an image can be displayed by displaying various colors on a pixel (pixel) with a combination of each unique color of the sub-pixel. .

In addition, in the display area 130 , data lines and scan lines are orthogonal to each other, and subpixels including an organic light emitting device and a driving device are arranged in a matrix form, and each subpixel includes a plurality of driving devices required for switching and driving. It may include and may include a storage capacitor connected to the driving element. In addition, although not shown, a compensation circuit may be further included.

The adhesive layer between the upper substrate 120 and the lower substrate 110 allows the two substrates to maintain adhesion and at the same time contains a desiccant in the adhesive layer to minimize penetration and diffusion of moisture to improve the lifespan reliability of the organic light emitting diode. can Matters related to this will be described in detail later.

Although the upper substrate 120 and the lower substrate 110 are bonded to each other to primarily block external oxygen and moisture, a sealing dam (not shown) is placed in the non-display area 140 to further block the penetration path of the side surfaces of the two bonded substrates. ) to protect the organic light emitting device from external oxygen and moisture. A detailed description of this will be provided later.

The sealing dam and the adhesive layer disposed in the non-display area 140 may move toward the sealing dam during the bonding process, and the moved adhesive layer may damage the sealing dam by applying pressure to the sealing dam during the bonding process. . Due to the spread of the adhesive layer, a sealing dam defect in which the sealing dam cannot completely seal the organic light emitting device from the external environment by including the adhesive layer between the two substrates may occur. Accordingly, a structure (not shown) configured to prevent the sealing dam of the non-display area 140 from being damaged due to the spread of the adhesive layer during the bonding process of the two substrates is disposed in the non-display area 140 to form the sealing dam between the two substrates. To efficiently seal the light emitting device. Details of the structure will be described later.

FIG. 2 is a schematic cross-sectional view taken along line A-A' of FIG. 1 for explaining an organic light emitting diode display on which a structure is disposed according to an exemplary embodiment.

Referring to FIG. 2 , the organic light emitting diode display 100 includes a lower substrate 210 , an upper substrate 220 , a driving device 211 , a pixel electrode 212 , an organic emission layer 213 , a common electrode 214 , and encapsulation. It includes a layer 215 , a black matrix layer 221 , a color filter layer 222 , a dam bank 233 , an adhesive layer 270 , a sealing dam 260 , and a structure 280 , and includes a display area 230 and a non-display area. Region 240 is defined.

Although shown briefly in FIG. 2 , in the organic light emitting display device 100 , a plurality of pixels are disposed in a display area 230 , and a plurality of organic light emitting devices 216 are disposed in the display area 230 , and each organic light emitting device is disposed in the display area 230 . Reference numeral 216 corresponds to a pixel defined by the black matrix 221 and the color filter 222 .

The non-display area 240 is also referred to as a bezel area, and the sealing dam 260 penetrating into the side surfaces of the two substrates and the sealing dam 260 overflowing to the periphery in the step of disposing it A dambank 233 to prevent is disposed.

The adhesive layer 270 filling between the lower substrate 210 and the upper substrate 220 may use a photocurable material and serves as a filler filling the two substrates.

In addition, in the adhesive layer 270 , a material capable of adsorbing moisture is pulverized and mixed to further improve the lifespan reliability of the organic light emitting diode display 100 .

On the other hand, since moisture and oxygen can permeate from the side surfaces of the two substrates, the sealing dam 260 is disposed in the non-display area 240 to seal the adhesive layer 270 from the external environment to further minimize the penetration of oxygen and moisture. there is. That is, the sealing dam 260 surrounds the outer periphery of the adhesive layer 270 made of a filler and serves as an additional encapsulation.

In the sealing dam 260 , a material capable of absorbing moisture may be pulverized to a small size and mixed, and an epoxy-based material, an acrylic-based material, or an olefin-based material may be used. The sealing dam 260 may be disposed using dispenser equipment, and after bonding the two substrates, the adhesive layer 270 disposed between the two substrates is sealed through UV and thermal curing.

In order to efficiently dispose the sealing dam 260 , the dam bank 233 is disposed on the upper substrate 220 . The dam bank 233 is made of the same material as the black matrix layer 221 on the upper substrate 220 . can be deployed using

The adhesive layer 270 may be made of a material selected from among epoxy-based, acryl-based, silicone-based and olefin-based materials, and contains a getter to prevent diffusion of penetrating moisture, and lower substrate 210 . It serves to adhere and fill between the and the upper substrate 220 .

The adhesive layer 270 may be disposed on the upper substrate 220 by a method such as inkjet printing and then bonded to the lower substrate 210 . In the process of bonding the two substrates, the adhesive layer 270 disposed on the upper substrate 220 may be moved from the non-display area 240 on the upper substrate 220 toward the sealing dam 260 by a force such as surface tension. there is.

In particular, when the uncured adhesive layer 270 in the direction of the sealing dam 260 is pushed or thickened by a force such as surface tension, the sealing dam in the process of bonding the upper substrate 220 and the lower substrate 210 together. Excessive stress may be applied to the 260 , or the sealing dam 260 may collapse.

In order to control the fluidity of the adhesive layer 270 in the uncured state, the structure 280 is disposed on the upper substrate 220 to minimize the mobility of the adhesive layer 270 in the uncured state in the direction of the sealing dam 260. can

At least one structure 280 configured to minimize the fluidity of the adhesive layer 270 in an uncured state is disposed in the non-display area 240 of the upper substrate 220, but the viscosity and ratio of the adhesive layer 270 in an uncured state are disposed. The shape, height and number of the display area 240 can be adjusted in consideration of this, and the black matrix layer 221 or the color filter layer 222 can be disposed simultaneously in the process of disposing the black matrix layer 221 or the color filter layer 222 without the need for an additional procedure. there is. The structure 270 is located in the boundary region between the adhesive layer 270 made of a filler and the sealing dam 260, and due to the surface tension of the filler constituting the adhesive layer 270, the upper substrate 220 and the lower substrate 210 are bonded together. It is possible to minimize damage to the sealing dam 260 by moving the filler.

2, the structure 280 is shown to be disposed on the upper substrate 220, but is not limited thereto, and the structure 280 may be disposed on the lower substrate 210, the upper substrate 220 and the lower substrate ( 210) may be placed in all of them.

Various configurations of the structure 280 will be described later.

3A to 3C are schematic cross-sectional enlarged views of region X of FIG. 2 for explaining various configurations of structures according to various embodiments of the present disclosure;

2 and 3A , the structure 380 is disposed on the upper substrate 320 and may be made of the same material as the black matrix layer 221 .

The structure 380 may have various shapes in consideration of the surface tension, viscosity, and material of the adhesive layer 270 , and the plurality of structures 380 may be disposed at the same height. However, the present invention is not limited thereto, and the plurality of structures 380 may be disposed at different heights.

In addition, the structure 380 may have a shape having one side having a low oblique line, and may be configured in various shapes in consideration of the viscosity and material of the adhesive layer 270 as described above.

The structure 380 may have a pattern of a straight line, a zigzag, an oblique line or a semicircle on the upper substrate 320 with respect to the plane, and the †Ÿ tooth and the adhesive layer ( The number of structures 380 and an interval between the structures 380 may be determined in consideration of the material of the 270 .

Referring to FIG. 3B , a black matrix layer 321 may be disposed on the upper substrate 320 , and a structure 380 may be disposed on the black matrix layer 321 . The structure 380 may be made of the same material as the color filter layer 222 , and the structure 380 is constructed using red, blue, and green color filters used for the color filter layer 222 , but each color filter layer 222 . ) by varying the height of the structure 380 can be configured in various forms.

Referring to FIG. 3C , the structure 380 may have at least one engraved pattern 381 .

The engraved pattern 381 may be configured in various patterns depending on the type of material constituting the adhesive layer 270 . As an example, the intaglio pattern 381 may be arranged to have different depths and widths, and the depth and width of the intaglio pattern 381 are appropriately changed according to the type of the adhesive layer 270 and the state of the material in the process of disposing it. can be placed

The structure 380 may be made of the same material as the black matrix layer 221 disposed on the upper substrate 320 . However, the present invention is not limited thereto, and the structure 380 may be made of the same material as the color filter layer 222 .

Referring to FIG. 3D , the structure 380 disposed on the upper substrate 320 may be a structure 380 having a multi-layer structure made of a material constituting the black matrix layer 221 and the color filter layer 222 .

The structure 380 is disposed using the same material as the black matrix layer 221 , and the structure 380 is disposed using red, green, or blue color filters used for disposing the color filter layer 222 thereon. can In this case, if the arrangement and thickness of each color filter are utilized, the structures 380 of various heights may be arranged when the plurality of structures 380 are arranged.

4 is a flowchart illustrating a method of manufacturing an organic light emitting diode display including a structure according to an exemplary embodiment.

Referring to FIG. 4 , a black matrix layer is formed on the upper substrate ( S120 ). Then, a structure is formed on the upper substrate (S121). The structure may be performed simultaneously with the step of forming the black matrix layer using a material forming the black matrix layer.

Next, a color filter layer is formed on the black matrix layer. The color filter layer may be formed using red, blue, and green color filters, and each color is formed to correspond to each sub-pixel (sub-pixel). In some embodiments, the structure may be formed of the same material as the color filter layer at the same time as the color filter layer.

A sealing dam is formed on the upper substrate (S130). The sealing dam is formed in the non-display area (bezel area) of the upper substrate using a dispenser, and is formed using a material that can be cured by thermal curing or photo curing.

Meanwhile, a plurality of driving devices and a plurality of organic light emitting devices are formed on the lower substrate (S110).

The driving device and the organic light emitting device are formed to be electrically connected, and a plurality of wires and electrodes connected to the driving device and the organic light emitting device are disposed on a lower substrate.

An adhesive layer is formed on the upper substrate (S140). The adhesive layer may be formed of a thermosetting material such as resin by an inkjet printing method, and may include a moisture absorbing material. The adhesive layer is formed on the inside of the sealing dam to cover the organic light emitting device in the subsequent bonding step of the upper and lower substrates. At this time, the movement of the adhesive layer in the direction of the sealing dam by the structure formed on the upper substrate can be minimized.

Next, the upper substrate and the lower substrate are bonded together (S150). An organic light emitting display device can be formed by bonding the upper substrate and the lower substrate to curing the adhesive layer by irradiating heat or UV light.

Embodiments of the present invention can be summarized once again as follows.

An organic light emitting diode display according to an embodiment of the present invention includes two substrates facing each other, a fill material filling between the two substrates and sealing the organic light emitting layer of one of the two substrates, between the two substrates. a sealing dam that surrounds the periphery of the filler and serves as an additional encapsulation; and a structure in the boundary region between the filler and the sealing dam, which minimizes damage to the sealing dam by moving the filler when the two substrates are bonded due to the surface tension of the filler.

The structure is on at least one of the two substrates, has a pattern, and may be made of the same material as the black matrix.

The shape of the pattern may be configured according to the characteristics of the surface tension of the filler.

The pattern may be configured to minimize the fluidity of the filler in consideration of the surface tension of the filler.

An organic light emitting display device according to an embodiment of the present invention includes a plurality of driving elements and a lower substrate having a plurality of organic light emitting elements, an upper substrate facing the lower substrate and having a black matrix layer, and a moisture content between the upper substrate and the lower substrate a sealing dam configured to minimize permeation of oxygen and oxygen, an adhesive layer between the upper substrate and the lower substrate, and at least one structure on the upper substrate and configured to facilitate control of a disposition area of the adhesive layer.

The structure may be in the non-display area of the upper substrate.

A plurality of color filter layers may be provided on the upper substrate.

The structure may be made of the same material as that of the color filter layer.

The structure is a multi-layered structure, and may include a layer made of the same material as the black matrix layer and a layer made of the same material as the color filter layer.

A plurality of structures may include at least one structure having a height different from that of a neighboring structure.

The distance between the structures on the upper substrate may be determined in consideration of the fluidity of the adhesive layer in the process of disposing the adhesive layer.

The structure may be made of the same material as the black matrix layer.

The structure may have at least one engraved pattern on the structure.

There are a plurality of structures, and an interval between the plurality of structures may be determined in consideration of fluidity of the adhesive layer in the process of disposing the adhesive layer.

At least two or more structures having different thicknesses may be disposed on the upper substrate.

A method of manufacturing an organic light emitting display device according to an embodiment of the present invention includes forming a plurality of driving devices and a plurality of organic light emitting devices on a lower substrate, forming a black matrix layer on an upper substrate, and on the upper substrate Forming a sealing dam, forming an adhesive layer on the upper substrate, and bonding the upper substrate and the lower substrate; the step of forming the black matrix layer on the upper substrate includes forming a structure on the upper substrate including the steps of

The step of forming the adhesive layer on the upper substrate may include forming the adhesive layer using an inkjet printing method.

The forming of the structure on the upper substrate may include forming the structure using the same material as that of the black matrix layer.

Forming the black matrix layer on the upper substrate may include forming a plurality of color filter layers on the upper substrate.

The step of forming the structure on the upper substrate may include forming the structure of the multi-layer structure using the same material as that of the color filter layer.

Although the embodiments of the present invention have been described in more detail with reference to the accompanying drawings, the present invention is not necessarily limited to these embodiments, and various modifications may be made within the scope without departing from the technical spirit of the present invention. . Therefore, the embodiments disclosed in the present invention are not intended to limit the technical spirit of the present invention, but to explain, and the scope of the technical spirit of the present invention is not limited by these embodiments. Therefore, it should be understood that the embodiments described above are illustrative in all respects and not restrictive. The protection scope of the present invention should be construed by the claims, and all technical ideas within the scope equivalent thereto should be construed as being included in the scope of the present invention.

100: organic light emitting display device
110, 210: lower substrate
211: driving element
212: pixel electrode
213: organic light emitting layer
214: common electrode
215: encapsulation layer
216: organic light emitting device
110, 220, 320: upper substrate
221, 321: Black Matrix
222: color filter
233: dam bank
130, 230: display area
140, 240: non-display area
150: pad area
151: pad electrode
152: D-IC
260: sealing dam
270: adhesive layer
280, 380: structures

Claims (20)

two substrates facing each other;
a fill material filling the space between the two substrates and sealing the organic light emitting layer of one of the two substrates;
a sealing dam located between the two substrates and enclosing the periphery of the filler and serving as an additional encapsulation;
a dam bank on at least one of the two substrates and arranged to contact the sealing dam to prevent the sealing dam from overflowing to the surroundings; and
It is in the boundary region between the filler and the sealing dam, and includes a structure that minimizes damage to the sealing dam by moving the filler when the two substrates are bonded due to the surface tension of the filler,
The structure is located inside the dambank in the non-display area. According to claim 1,
The structure is on at least one of the two substrates, has a pattern, and is made of the same material as a black matrix. 3. The method of claim 2,
The shape of the pattern is configured according to a surface tension characteristic of the filler. 3. The method of claim 2,
The pattern is configured to minimize fluidity of the filler in consideration of the surface tension of the filler. a lower substrate having a plurality of driving devices and a plurality of organic light emitting devices;
an upper substrate facing the lower substrate and having a black matrix layer;
a sealing dam disposed between the upper substrate and the lower substrate and configured to minimize penetration of moisture and oxygen;
a dam bank on the upper substrate and arranged to contact the sealing dam to prevent the sealing dam from overflowing to the surroundings;
an adhesive layer between the upper substrate and the lower substrate; and
at least one structure on the upper substrate and configured to easily control a disposition area of the adhesive layer;
The structure is disposed between the dam bank and the black matrix layer in a non-display area of the upper substrate. delete 6. The method of claim 5,
An organic light emitting diode display having a plurality of color filter layers on the upper substrate. 8. The method of claim 7,
The structure is made of the same material as that of the color filter layer. 9. The method of claim 8,
The structure is a multi-layer structure, and the organic light emitting display device includes a layer made of the same material as the black matrix layer and a layer made of the same material as the color filter layer. 8. The method of claim 7,
The organic light emitting diode display includes a plurality of structures and at least one structure having a height different from that of a neighboring structure. 11. The method of claim 10,
The distance between the structures on the upper substrate is determined in consideration of fluidity of the adhesive layer in the process of disposing the adhesive layer. 6. The method of claim 5,
The structure is made of the same material as the black matrix layer. 13. The method of claim 12,
The structure is an organic light emitting diode display having at least one engraved pattern on the structure. 13. The method of claim 12,
The organic light emitting diode display includes a plurality of structures, and an interval between the plurality of structures is determined in consideration of fluidity of the adhesive layer in a process of disposing the adhesive layer. 6. The method of claim 5,
An organic light emitting diode display in which at least two structures having different thicknesses are disposed on the upper substrate. forming a plurality of driving devices and a plurality of organic light emitting devices on a lower substrate;
forming a black matrix layer in a display area of an upper substrate;
forming a sealing dam in the non-display area of the upper substrate;
forming an adhesive layer on the upper substrate to be located inside the sealing dam; and
Including; bonding the upper substrate and the lower substrate
The forming of the black matrix layer on the upper substrate includes forming a dam bank on the upper substrate so as to be adjacent to an area where the sealing dam is located, and located in a non-display area between the dam bank and the black matrix layer. and forming a structure on the upper substrate to 17. The method of claim 16,
The forming of the adhesive layer on the upper substrate includes forming the adhesive layer using an inkjet printing method. 17. The method of claim 16,
The forming of the structure on the upper substrate includes forming the structure using the same material as that of the black matrix layer. 17. The method of claim 16,
The forming of the black matrix layer on the upper substrate includes forming a plurality of color filter layers on the upper substrate. 20. The method of claim 19,
The forming of the structure on the upper substrate may include forming a structure having a multilayer structure using the same material as that of the color filter layer.

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