KR102380838B1 - Coil component and manufacturing method for the same - Google Patents

Abstract

The present disclosure provides a body including a metal powder, a binder resin, and an additive component crosslinked to the binder resin; a coil part disposed in the body part and including a support member and a coil pattern formed on at least one surface of the support member; and an electrode part disposed on the body part and including an external electrode electrically connected to the coil pattern; It relates to a coil component comprising a, and a method for manufacturing the same.

Description

Coil component and its manufacturing method

The present disclosure relates to a coil component and a method of manufacturing the same.

With the miniaturization and thinning of electronic devices such as digital TVs, mobile phones, and notebook computers, miniaturization and high capacity are also required for coil parts applied to these electronic devices. The current situation is moving from the stacked type to the thin film type and the winding type.

Patent Document 1: Registered Patent Publication No. 10-1565703 Patent Document 2: Unexamined Patent Publication No. 10-2014-0029656 Patent Document 3: Laid-Open Patent Publication No. 10-2003-0051387 Patent Document 4: Unexamined Patent Publication No. 10-2013-0021695

On the other hand, in the case of a thin film type power inductor, in order to meet the above requirements, it may be considered to mix a metal powder and a binder resin to prepare a slurry, to form a sheet, and to press and harden the slurry to form a magnetic body. However, in this case, problems may occur in terms of various physical properties.

One of several purposes of the present disclosure is to improve various physical properties that are problematic in a sheet made of metal powder and binder resin.

One of the various solutions proposed through the present disclosure is to introduce an additive component that is crosslinked with the binder resin into the magnetic material constituting the body.

For example, the coil component according to the present disclosure may include a body including a metal powder, a binder resin, and an additive component crosslinked to the binder resin; a coil part disposed in the body part and including a support member and a coil pattern formed on at least one surface of the support member; and an electrode part disposed on the body part and including an external electrode electrically connected to the coil pattern; may include.

In addition, the method for manufacturing a coil component according to the present disclosure includes forming a plurality of coil units by forming a coil pattern on at least one surface of a support member; forming a plurality of body parts by pressing and curing a magnetic sheet on upper and lower portions of the plurality of coil parts; forming individual body parts by cutting the plurality of body parts; and forming an electrode part on the body part by forming an external electrode electrically connected to the coil pattern; Including, the magnetic sheet may be formed of a composition including a metal powder, a binder resin, and an additive.

As one effect among the various effects of the present disclosure, various physical properties that are problematic in the sheet made of the metal powder and the binder resin can be improved.

1 schematically shows an example of a coil component applied to an electronic device.
2 is a schematic perspective view showing an example of a coil component.
Fig. 3 shows an example of a schematic II' section of the coil component of Fig. 2;
Figure 4 shows the film density and RFI change of the sheet according to the addition of plasticizer.
5 shows the film density and RFI change of the sheet according to the addition of plasticizer.
6 shows the bubble removal effect according to the addition of the antifoaming agent.
7 shows the effect of viscosity change according to the addition of an antifoaming agent.
8 shows the degree of oxidation of the body according to the addition of antioxidants.
9 is a schematic process diagram showing an example of manufacturing a coil component.

Hereinafter, the present disclosure will be described in more detail with reference to the accompanying drawings. The shapes and sizes of elements in the drawings may be exaggerated for clearer description.

Electronics

1 schematically shows an example of a coil component applied to an electronic device. Referring to the drawings, it can be seen that various types of electronic components are used in electronic devices, for example, DC/DC, Comm. Processor, WLAN BT / WiFi FM GPS NFC, PMIC, Battery, SMBC, LCD AMOLED, Audio Codec, USB 2.0 / 3.0 HDMI, CAM, etc. can be used. At this time, among these electronic components, various types of coil components for the purpose of noise removal, etc. may be appropriately applied according to their purpose, for example, a power inductor (Power, Inductor, 1), a high-frequency inductor (HF Inductor, 2). ), a general bead (General Bead, 3), a high frequency bead (GHz Bead, 4), a common mode filter (Common Mode Filter, 5), and the like.

Specifically, the power inductor 1 may be used for stabilizing power by storing electricity in the form of a magnetic field to maintain an output voltage. Also, the high frequency inductor 2 may be used for purposes such as securing a required frequency by matching impedance, or blocking noise and AC components. In addition, the general bead (General Bead, 3) may be used for the purpose of removing noise of power and signal lines, or removing a high-frequency ripple. In addition, the high-frequency bead (GHz Bead, 4) may be used for purposes such as removing high-frequency noise from signal lines and power lines related to audio. In addition, the common mode filter (Common Mode Filter, 5) may be used for purposes such as passing a current in the differential mode and removing only common mode noise.

The electronic device may typically be a smart phone, but is not limited thereto. For example, a personal digital assistant, a digital video camera, and a digital still camera. ), a network system, a computer, a monitor, a television, a video game, or a smart watch. In addition to these, of course, it may be other various electronic devices well known to those skilled in the art.

coil parts

As described above, in the case of a thin-film power inductor, in order to meet the above requirements, it may be considered to prepare a slurry by mixing a metal powder and a binder resin, to form a sheet, and to press and harden the slurry to form a magnetic body.

On the other hand, in the case of a slurry, compared to applying a heavy metal powder with a large particle size, the applied binder resin has a small molecular weight and a short chain resin is often applied. In the slurry, layer separation of the binder resin and the powder may proceed. When the layer separation occurs excessively, a decrease in dispersion of the powder and the binder resin occurs. In addition, the slurry is made into a slurry and then subjected to a defoaming process. Since the total volume occupied by the powder is large and the solid content is high, trapped residual bubbles exist in the slurry, and as they aggregate during the slurry aging process, the binder in the slurry overall It can also cause agglomeration of resin and powder.

In addition, in the case of the sheet, due to the high solids content as already mentioned in the slurry, even a slight overdrying results in a very brittle state with little or no stretchability. When a sheet is laminated and pressed to a substrate, the flow depression and adhesion of the sheet are important factors in controlling electrode exposure or dilemma. Since the degradation also proceeds, it cannot be free from chip thickness defects, electrode exposure, and dilemmas. In addition, air bubbles that are not removed from the slurry may come out in the form of pinholes in the sheet during molding, or powder or epoxy resin aggregates resulting from the air bubbles may come out as it is.

In addition, metal powder may cause problems in dicing. If there is no chromium (Cr) component in the metal powder, oxidation may occur due to heat and water generated during dicing. Therefore, it is necessary to find a way to solve the problems found in each of these processes.

On the other hand, the coil component 100 according to an example is a material constituting the body portion 10, and in addition to the metal powder 11 and 12 and the binder resin 13, an additive component (not shown) that is crosslinked with the binder resin 13 is used. Including, it is possible to solve these various physical property problems.

Hereinafter, a coil component according to an example will be described in detail. For convenience, the structure of the power inductor will be described as an example, but as described above, it goes without saying that the coil component of the present disclosure can also be applied to coil components for various other uses.

2 is a schematic perspective view showing an example of a coil component.

FIG. 3 shows an example of a schematic II′ cross-section of the coil component of FIG. 2 .

Referring to the drawings, the coil component 100 according to an example includes a body portion 10 , a coil portion 20 disposed in the body portion 10 , and an electrode portion 30 disposed on the body portion 10 . include

The body part 10 forms the exterior of the coil component 100A. The body portion 10 includes a first surface and a second surface facing in the first direction, a third surface and a fourth surface facing in the second direction, and a fifth surface and a sixth surface facing in the third direction. It may have a hexahedral shape including, but is not limited thereto.

The body portion 10 includes metal powders 11 and 12 , a binder resin 13 , and an additive component (not shown) crosslinked to the binder resin 13 . The metal powders 11 and 12 may include iron (Fe), chromium (Cr), or silicon (Si) as a main component, for example, iron (Fe)-nickel (Ni), iron (Fe), It may include iron (Fe)-chromium (Cr)-silicon (Si), but is not limited thereto. The binder resin 13 may include, but is not limited to, epoxy, polyimide, liquid crystal polymer, or the like. The additive component (not shown) may include, but is not limited to, a plasticizer component, an antifoaming component, an antioxidant component, and the like.

The metal powders 11 and 12 may be a combination of the metal powders 11 and 12 having an average particle diameter (D ₁ , D ₂ ) of 2 or more. In this case, by compressing using bimodal metal powders 11 and 12 of different sizes, the filling rate can be increased.

The binder resin 13 may be combined with a bisphenol A-based epoxy resin by adding a small amount of an acrylic resin or an alkali-based acid to impart sheet stretchability. For example, the binder resin 13 may be an epoxy resin represented by the following chemical formula or a derivative thereof, but is not limited thereto.

The additive component (not shown) means that the additive is introduced into the slurry for sheet molding and then crosslinked to the binder resin 13 by curing. That is, most of the additives do not remain as intrinsic materials, but remain crosslinked in the binder resin 13 .

Among the additive components (not shown), the plasticizer component is combined with the binder resin 13 to suppress temporary hardening of the sheet and to impart extensibility to improve the flow depression properties of the sheet, for example, DOP (dioctyl phthalates) and It may include a derivative thereof and a component derived from at least one plasticizer selected from the group consisting of triethylene glycol diethylhexanoate (G260) and derivatives thereof.

Among the additive components (not shown), the antifoaming agent component is to remove the bubbles generated inside the slurry, and the antifoaming agent is distributed and adsorbed around the membrane, and quickly moves to the surface with low surface tension to allow the bubbles to escape. The anti-foaming agent component may include, for example, a component derived from a silicone-based anti-foaming agent, a polymer-based anti-foaming agent, or a combination thereof.

The antioxidant component among the additive components (not shown) is for improving the oxidation reaction of the metal surface inside the cured body caused by high heat during the dicing process, for example, gum rosin (Gum Rosin) flex-based compound and its It may include a component derived from at least one of the derivatives. Alternatively, when the binder resin 13 is a phenolic resin, in order to ensure compatibility, it may include a component derived from at least one of a compound represented by the following formula and its derivatives.

The coil unit 20 serves to perform various functions in the electronic device through characteristics expressed from the coil of the coil component 100 . For example, the coil component 100 may be a power inductor, and in this case, the coil unit 20 may store electricity in the form of a magnetic field to maintain an output voltage to stabilize power.

The coil unit 20 passes through the support member 21 , first and second coil patterns 22 and 23 respectively formed on one surface and the other surface of the support member 21 , and the support member 21 , and includes the first and second coil patterns. and vias 24 electrically connecting the two coil patterns 22 and 23 .

The support member 21 is for forming the coil unit 20 to be thinner and easier, and the material or type thereof is not particularly limited as long as it can support the coil patterns 22 and 23 . For example, it may be a copper clad laminate (CCL), a polypropylene glycol (PPG) substrate, a ferrite substrate, a metal-based soft magnetic substrate, an insulating substrate made of an insulating resin, or the like. Examples of the insulating resin include a thermosetting resin such as an epoxy resin, a thermoplastic resin such as polyimide, or a resin impregnated with a reinforcing material such as glass fiber or inorganic filler therein, for example, prepreg, Ajinomoto build-up (ABF). Film), FR-4, BT (Bismaleimide Triazine) resin, PID (Photo Imagable Dielectric) resin, etc. may be used. In view of maintaining rigidity, an insulating substrate including glass fibers and an epoxy resin may be used, but the present invention is not limited thereto.

The coil patterns 22 and 23 each have a planar coil shape. The planar coil-shaped coil patterns 22 and 23 may be a plating pattern formed by an isotropic plating method, but is not limited thereto, and may be a plating pattern formed by an anisotropic plating method. In the case of a planar coil shape, it may have a minimum number of turns of 2 or more, which is advantageous for implementing a thin and high inductance. The coil patterns 22 and 23 may be protected by being covered with well-known insulating layers 22a and 23a.

The coil patterns 22 and 23 may include a seed layer and a plating layer. The seed layer is a first layer including at least one of titanium (Ti), titanium-tungsten (Ti-W), molybdenum (Mo), chromium (Cr), nickel (Ni), and nickel (Ni)-chromium (Cr). The second layer may be formed of the same material as the layer and the plating layer, for example, copper (Cu). The plating layer may include copper (Cu), aluminum (Al), silver (Ag), tin (Sn), gold (Au), nickel (Ni), lead (Pd), or an alloy thereof, and the like. It may include copper (Cu), but is not limited thereto.

The via 24 passes through the support member 21 and thus has a thickness corresponding to the support member 21 . The via 24 electrically connects the coil patterns 22 and 23 . A current path continues, and as a result, one coil rotating in the same direction is formed.

The via 24 may also include a seed layer and a plating layer, and specific examples thereof are as described above. That is, the via 24 may be formed simultaneously with the coil patterns 22 and 23 . The horizontal cross-sectional shape of the via 24 may be, for example, a circle, an ellipse, a polygon, or the like. The vertical cross-sectional shape of the via 24 may be, for example, a tapered shape, a reverse tapered shape, an hourglass shape, a column shape, or the like.

The electrode unit 30 serves to electrically connect the coil component 100 to the electronic device when the coil component 100 is mounted on the electronic device. The electrode part 30 includes a first external electrode 31 and a second external electrode 32 disposed on the body part 10 to be spaced apart from each other. If necessary, the electrode part 30 may include a pre-plating layer (not shown) in order to improve electrical reliability between the coil part 20 and the electrode part 30 .

The first external electrode 31 covers the first surface of the body portion 10 and may partially extend to the third surface, the fourth surface, the fifth surface, and the sixth surface. The second external electrode 32 covers the second surface of the body portion 10 and may partially extend to the third surface, the fourth surface, the fifth surface, and the sixth surface. The first external electrode 31 is connected to the lead-out terminal of the first coil pattern 22 drawn out to the first surface of the body portion 10 . The second external electrode 32 is connected to the lead-out terminal of the second coil pattern 23 drawn out to the second surface of the body portion 10 .

The first and second external electrodes 31 and 32 may include, for example, a conductive resin layer and a conductor layer formed on the conductive resin layer. The conductive resin layer may be formed by paste printing or the like, and may include at least one conductive metal selected from the group consisting of copper (Cu), nickel (Ni), and silver (Ag) and a thermosetting resin. The conductor layer may include at least one selected from the group consisting of nickel (Ni), copper (Cu), and tin (Sn), for example, a nickel (Ni) layer and a tin (Sn) layer are sequentially plated can be formed by

Figure 4 shows the film density and RFI change of the sheet according to the addition of plasticizer.

5 shows the film density and RFI change of the sheet according to the addition of plasticizer.

Referring to the drawings, when 1 to 10 wt% of plasticizers DOP (FIG. 4) and G260 (FIG. 5) are added, respectively, and the content of the epoxy resin is reduced to make the total polymer content to be added equal, depending on the plasticizer content RFI rose. RFI, an abbreviation for Resin Flow Index, is a measure of sheet flow depression when the sheet is pressed.

It can be seen that the RFI increased as the content of the plasticizer increased, indicating that the sheet had stretchability added to it, and flow-dense property was improved.

The sheet film density, which indicates the filling properties of the powder, was generally slightly higher than that of Ref, but it was evaluated that it moved within the error range, so it can be expected that the significant difference in the filling properties will not be large.

6 shows the bubble removal effect according to the addition of the antifoaming agent.

7 shows the effect of viscosity change according to the addition of an antifoaming agent.

Referring to the drawings, it was confirmed that a foam film was formed in the slurry to which the antifoaming agent was not added in a state where the defoaming was not performed, but in the slurry to which the antifoaming agent was added, the bubbles moved to the surface of the slurry were immediately burst and removed.

Antifoaming agent can be applied to both polymer and silicone-based, and the results of FIGS. 6 and 7 are results of applying a silicone-based antifoaming agent. The content of the antifoaming agent was added in the range of 0.05% to 1% compared to the slurry, and as the amount of the antifoaming agent added increased, the characteristics of the antifoaming agent decreased the surface tension, so the slurry viscosity showed a tendency to decrease slightly.

8 shows the degree of oxidation of the body according to the addition of antioxidants.

Referring to the drawings, it can be seen that the degree of oxidation is improved according to the amount of the antioxidant added. Specifically, when added at a level of 0.05 to 1% by weight relative to the metal powder, the oxidation degree after dicing was improved depending on the amount added.

The antioxidant is a gum rosin flex series, and the specific chemical formula is C ₁₉ H ₂₉ COOH. However, in addition to this, as described above, antioxidants including fragrances to which phenol or hydrophobic phenol and phosphorus ginseng salts are bound are also effective while ensuring compatibility with the resin.

Method of manufacturing coil parts

Hereinafter, a method of manufacturing the coil component of the present disclosure will be described, but content overlapping with the above will be omitted.

9 is a schematic process diagram showing an example of manufacturing a coil component.

Referring to the drawings, the support member 21 is prepared first. A plurality of metal layers (not shown) may be disposed on both surfaces of the support member 21 , unlike in the drawings, and these metal layers (not shown) may be used as a seed layer when forming a coil or the like. The support member 21 may have a mass size for forming the plurality of coil units 20 . A via hole 24H for forming the via 24 is previously formed in the support member 21 . The via hole 24H may be formed using a mechanical drill, a laser drill, or the like.

Next, a seed layer 22c is formed on the support member 21 . At this time, the seed layer 22c is also formed on the wall surface of the via hole 24H. The seed layer 22c is formed by plating the entire surface on the support member 21 by a known method, attaching a dry film, and forming a planar coil-shaped opening pattern by exposure and development, and then plating the opening pattern by plating. It can be formed by a method of filling and peeling a dry film. As the plating method, electrolytic copper plating or electroless copper plating may be used. For example, CVD (chemical vapor deposition), PVD (Physical Vapor Deposition), sputtering (sputtering), subtractive (Subtractive), additive (Additive), SAP (Semi-Additive Process), MSAP (Modified Semi-Additive) process) can be used.

Next, a plating layer 22d is formed on the seed layer 22c. As a result, the first and second coil patterns 21 and 22 having a planar coil shape are formed. That is, only one surface of the support member 21 is shown in the drawings, but the other surface is formed in the same way. As for the plating, as described above, electrolytic copper plating, electroless copper plating, or the like may be used.

Next, the insulating film 22d is coated. The surfaces of the first and second coil patterns 21 and 22 are protected by the insulating layer 22d. That is, only one surface of the support member 21 is shown in the drawings, but the other surface is coated in the same manner. As coating of the insulating film 22d, CVD (chemical vapor deposition) or the like can be used, for example.

Next, a through hole 15 penetrating through the central portions of the first and second coil patterns 21 and 22 of the support member 21 is formed. The through hole 15 is later filled with a magnetic material to form a magnetic core. In this case, characteristics such as inductance may be improved.

Next, a plurality of body parts 10 are formed by pressing and curing a magnetic sheet on the upper and lower portions of the plurality of coil parts 20 , and the individual body parts 10 are obtained by dicing them. The magnetic sheet may be formed by molding a slurry including the metal powder, the binder resin, and the additive, that is, the composition. Additives may include plasticizers, defoamers, antioxidants, and the like.

Next, by forming the electrode part 30 on the body part 10 , the individual coil component 100 is manufactured.

On the other hand, in the present disclosure, the meaning of electrically connected is a concept that includes both a physically connected case and a non-connected case. In addition, expressions such as first, second, etc. are used to distinguish one component from another, and do not limit the order and/or importance of the corresponding components. In some cases, without departing from the scope of rights, the first component may be referred to as the second component, and similarly, the second component may be referred to as the first component.

In addition, the expression "an example" used in the present disclosure does not mean the same embodiment as each other, and is provided to emphasize and explain different unique features. However, the examples presented above are not excluded from being implemented in combination with features of other examples. For example, even if a matter described in one specific example is not described in another example, it may be understood as a description related to another example unless a description contradicts or contradicts the matter in another example.

In addition, the terminology used in the present disclosure is used to describe an example only, and is not intended to limit the present disclosure. In this case, the singular expression includes the plural expression unless the context clearly indicates otherwise.

1: Power inductor
2: high frequency inductor
3: Normal bead
4: Bead for high frequency
5: Common mode filter
100: coil part
10: body part
11, 12: metal powder
13: binder resin
20: coil unit
21: support member
22, 23: first and second coil patterns
24: via
30: electrode part
31, 32: first and second external electrodes

Claims (10)

a body part including a metal powder, a binder resin, and an additive component crosslinked to the binder resin;
a coil part disposed in the body part and including a support member and a coil pattern formed on at least one surface of the support member; and
an electrode part disposed on the body part and including an external electrode electrically connected to the coil pattern; includes,
wherein the additive component comprises an anti-foam component and an antioxidant component;
coil parts.
The method of claim 1,
The additive component further comprises a plasticizer component,
coil parts.
3. The method of claim 2,
The plasticizer component comprises a component derived from at least one of DOP (dioctyl phthalates) and G260 (Triethylene glycol diethylhexanoate),
coil parts.
The method of claim 1,
The anti-foaming agent comprises a component derived from at least one of a silicone-based anti-foaming agent and a polymer-based anti-foaming agent,
coil parts.
a body part including a metal powder, a binder resin, and an additive component crosslinked to the binder resin;
a coil part disposed in the body part and including a support member and a coil pattern formed on at least one surface of the support member; and
an electrode part disposed on the body part and including an external electrode electrically connected to the coil pattern; includes,
The additive component includes an antioxidant component,
The antioxidant component includes a component derived from a component derived from a Gum Rosin flex-based compound, or a component derived from at least one of the compounds represented by the following formula,
coil parts.

6. The method of claim 5,
wherein the additive component further comprises at least one of a plasticizer component and an antifoam component;
coil parts.
The method of claim 1,
The metal powder is a combination of two or more metal powders having different average particle diameters,
coil parts.
The method of claim 1,
The binder resin comprises an epoxy resin,
coil parts.
forming a plurality of coil units by forming a coil pattern on at least one surface of the support member;
forming a plurality of body parts by pressing and curing a magnetic sheet on upper and lower portions of the plurality of coil parts;
forming individual body parts by cutting the plurality of body parts; and
forming an electrode part on the body part by forming an external electrode electrically connected to the coil pattern; includes,
The magnetic sheet is formed of a composition including a metal powder, a binder resin, and an additive,
wherein the additive comprises an anti-foaming agent and an antioxidant;
A method of manufacturing a coil component.
10. The method of claim 9,
The additive further comprises a plasticizer,
A method of manufacturing a coil component.

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