KR102369036B1 - Transmission line, transmission line manufacturing method and transmission line manufacturing apparatus - Google Patents

Abstract

An object of the present invention is to provide a thin transmission line with reduced crosstalk by shielding over the entire circumference. As a solution, the transmission line 20 includes a base 30 in which a first conductor 31 composed of a transmission line conductor 32 and a ground conductor 33 is formed on the first main surface 34a of the first substrate 34 . ), the first main surface 34a and the coverlay 35 in the first substrate 34, and the surface opposite to the first main surface 34a in the base 30 and the first shield 40 The side of the second main surface 42a, the side opposite to the first main surface 34a of the base 30 and the side of the second main surface 42a of the first shield 40, and the coverlay 35 and the second main surface The sides of the second main surface 42a of the second shield 45 are thermocompression-bonded to each other, and the second conductor 41 and the third conductor 46 are ultrasonically bonded to each other, and the second conductor 41 and the second conductor 41 are The three conductors 46 are arranged so as to surround the transmission line conductors 32, respectively.

Description

Transmission line, transmission line manufacturing method and transmission line manufacturing apparatus

The present invention relates to a transmission line, a method for manufacturing the transmission line, and an apparatus for manufacturing the transmission line.

In recent years, the development of high-density mounting technology in electronic devices is remarkable, and the demand for thin transmission lines using copper clad laminates (CCL) is increasing.

Conventionally, a step of forming signal wirings and ground wirings insulated from each other in a region on one side to a central region of one main surface of an insulator layer made of a liquid crystal polymer, and the other peripheral surface of the insulator layer a step of positioning and laminating conductive foils having conductive projections connectable to the ground wiring, and pressing and integrating the laminated body to ground the conductive projections through which the insulator layer is inserted a step of electrically connecting to the wiring; and bending the non-formed region of the insulator layer along the outside of the forming region of the respective wiring to face the formation region surface and the non-formation region surface of each wiring to be integrated; , a method for manufacturing a flat shielded cable having a step of forming a shield layer on the conductive foil on the other peripheral surface has been proposed (Patent Document 1: Patent No. 3497110).

In addition, a flexible dielectric body (liquid crystal polymer), a linear signal line provided on the dielectric body, a ground conductor provided on the dielectric body and facing the signal line; An auxiliary ground conductor provided on the opposite side of the ground conductor with respect to the signal line in the direction normal to the main surface of the dielectric body. When viewed in a planar view in the normal direction, the signal line An auxiliary ground conductor comprising two main portions extending along the signal line while being sandwiched, and a bridge portion connecting the two main portions and intersecting the signal line, the auxiliary ground conductor and the above-mentioned auxiliary ground conductor A high-frequency signal line having a via hole conductor electrically connecting a ground conductor and having a configuration in which the distance between the signal line and the auxiliary ground conductor in the normal direction is smaller than the distance between the signal line and the ground conductor is proposed (Patent Document 2: Utility Model Registration No. 3173143 Gazette).

Then, on both sides of the signal conductor, ground conductors are arranged on the same plane as the signal conductor, and these signal conductors and ground conductors are covered with an electrically insulating thin film from both top and bottom directions so that the surfaces on which the conductive adhesive layer is provided face each other. Accordingly, a signal transmission cable coated with a metal shielding layer on the outside of an electrically insulating thin film has been proposed (Patent Document 3: Japanese Patent Application Laid-Open No. 2006-202714).

Patent Document 1: Patent No. 3497110 Publication Patent Document 2: Utility Model Registration No. 3173143 Publication Patent Document 3: Japanese Patent Laid-Open No. 2006-202714

A transmission line is required to have a thin structure corresponding to space saving while maintaining shielding performance for suppressing extraneous noise. In particular, reduction of crosstalk between transmission lines is a problem. In addition, it is required for manufacturers of transmission lines to produce transmission lines or intermediates thereof in a short production time that can respond to a rapid increase in demand for portable information terminals and the like.

Here, the intermediate body of the transmission line refers to a semi-finished product in the previous stage of becoming a transmission line, in particular, a semi-finished product in a state in which the structure is shielded over the entire circumference.

In response to the above problem, the transmission line of Patent Document 1 is difficult to reduce in thickness when shielding over the entire circumference in view of the bending structure of the copper clad laminate. In addition, since the transmission line of Patent Document 2 is not shielded on the side, shielding performance is inferior to that of the structure in which shielding is performed over the entire circumference, and crosstalk is increased. In addition, in the transmission line of Patent Document 2 and Patent Document 3, the conductive paste such as cream solder or conductive adhesive is thermally cured to connect the ground conductor and the shield conductor, so the thermal curing time of the conductive paste becomes a neck, and production The time (tact time) cannot be made shorter than the thermosetting time. Moreover, there exists a similar problem also when bonding copper clad laminated boards using an adhesive agent. As a prior art, a method for reducing crosstalk by inserting vias between transmission lines is also considered, but since a large number of vias are required, the manufacturing cost becomes high.

The present invention has been made in view of the above circumstances, and a thin transmission line in which crosstalk is reduced by shielding over the entire perimeter by a configuration in which opposing copper clad laminates are bonded to each other, and a thin transmission line or an intermediate thereof are integrated It is manufactured on one production line, and by bonding copper clad laminates together without using an adhesive or conductive paste, the production time (tact time) can be shortened than that of the conductive paste or the thermosetting time of the adhesive. An object of the present invention is to provide a method for manufacturing a transmission line and an apparatus for manufacturing the transmission line.

As one embodiment, the above problem is solved by means of a solution disclosed below.

In the transmission line of the present invention, a first conductor comprising a transmission line conductor and a ground conductor adjacent to an input end and an output end of the transmission line conductor, respectively, is formed in a sheet form on a first main surface of a first substrate made of a thermoplastic resin. A base, a sheet-like cover lay made of a thermoplastic resin for covering the transmission line conductor, a first shield formed on a second main surface of a second base material in which the second conductor is made of a sheet-like thermoplastic resin, and the third conductor is a sheet and a second shield formed on a third substrate formed of a thermoplastic resin in a shape, the first main surface and the coverlay of the first substrate, and the surface opposite to the first main surface of the base and the first shield the side of the second major surface of the base, the side opposite to the first major surface of the base and the second major surface of the first shield, and the side of the second major surface of the coverlay and the second shield are mutually thermocompressed,

The second conductor and the third conductor are ultrasonically bonded to each other, and the second conductor and the third conductor are arranged to surround the transmission line conductor.

In the transmission line of the present invention, a first conductor comprising a transmission line conductor and a ground conductor adjacent to an input end and an output end of the transmission line conductor, respectively, is formed in a sheet form on the first main surface of a first substrate made of a thermoplastic resin, a base in which at least a plurality of the transmission line conductors among the first conductors are formed at a predetermined pitch; a cover lay made of a thermoplastic resin in the form of a sheet for covering each of the transmission line conductors; and a second substrate in which the second conductor is made of a thermoplastic resin in the form of a sheet a first shield formed on a second main surface of a side of the base opposite to the first major surface and a side of the second major surface of the first shield, a surface of the base opposite the first major surface and a side of the second major surface of the first shield; and Sides of the second main surface of the cover lay and the second shield are thermocompression-bonded to each other;

The second conductor and the third conductor disposed opposite to each other are ultrasonically bonded to each other, and the second conductor and the third conductor are arranged to surround the transmission line conductor, respectively.

According to this configuration, in a state in which the second conductor of the first shield and the third conductor of the second shield disposed to face each other with the base and the coverlay interposed therebetween are ultrasonically joined to surround the transmission line conductor, the entire circumference is shielded and crossed. It becomes a thin transmission line with reduced torque. Further, since the second conductor of the first shield and the third conductor of the second shield are ultrasonically joined without using an adhesive or conductive paste, a thin structure can be made at least equal to the thickness of the adhesive or conductive paste.

As an example, cut surfaces are formed on both sides in the long side direction. According to this structure, since both sides in the longitudinal direction are cut|disconnected, the width dimension becomes constant.

In the method for manufacturing a transmission line of the present invention, a first conductor comprising a transmission line conductor and a ground conductor adjacent to an input end and an output end of the transmission line conductor, respectively, is formed on a first main surface of a sheet-like first substrate at a predetermined pitch. and a sheet-shaped cover lay covering the transmission line conductor, a first shield having a second conductor formed on the second main surface of the sheet-shaped second substrate, and a second conductor having a third conductor formed on the sheet-shaped third substrate A transmission line having a shield, or a first conductor comprising a transmission line conductor and a ground conductor adjacent to an input end and an output end of the transmission line conductor, respectively, is formed in a sheet form on the first main surface of a first substrate made of a thermoplastic resin, a base in which at least one of the first conductors is formed with a plurality of transmission line conductors at a predetermined pitch; A method for manufacturing a transmission line having a first shield formed on a second main surface of a second substrate, and a second shield formed on a third substrate in which a third conductor is formed of a thermoplastic resin in a sheet shape, wherein the coverlay is provided on the first main surface a first thermocompression bonding step of thermocompression bonding, and for the first intermediate body to which the cover lay is thermocompression bonded, an unnecessary region between the transmission line conductor and the transmission line conductor is removed to pass through the first intermediate body an unnecessary region removing step of forming a through hole; and thermocompression bonding the side of the second main surface of the first shield to a surface opposite to the first main surface of the base with respect to the second intermediate body in which the through hole is formed. It is characterized by having a 2nd thermocompression bonding step, and a 1st bonding step of ultrasonically bonding the exposed surface of the said 3rd conductor to the exposed surface of the said 2nd conductor in the state which the said 1st shield was thermocompression-bonded.

According to this configuration, by sending the base, the coverlay, the first shield, and the second shield at a predetermined pitch, the first thermocompression bonding step, the unnecessary region removal step, the second thermocompression bonding step, and the first bonding step are performed. , a thin transmission line with reduced crosstalk by shielding over the entire circumference or an intermediate thereof can be manufactured in a consistent manufacturing line. In addition, since the second conductor of the first shield and the third conductor of the second shield are ultrasonically joined without using an adhesive or conductive paste, the production time (tact time) can be shorter than the thermosetting time of the conductive paste or adhesive. and necessary structural members are also minimized.

The second thermocompression bonding step includes thermocompression bonding the side of the second main surface of the first shield to the surface opposite to the first main surface of the base with respect to the second intermediate body, and to the coverlay. It is preferable to thermocompress the side of the second main surface of the second shield. According to this configuration, with respect to the second intermediate body, the side of the second main surface of the first shield is thermocompression-bonded to the surface opposite to the first main surface in the base, and the side of the second main surface of the second shield is to the coverlay. By thermocompression bonding, it is possible to prevent the occurrence of wrinkles in the first shield or the second shield.

In the transmission line manufacturing apparatus of the present invention, a first conductor comprising a transmission line conductor and a ground conductor adjacent to an input end and an output end of the transmission line conductor, respectively, is formed on a first main surface of a sheet-like first substrate at a predetermined pitch. Alternatively, a first conductor comprising a transmission line conductor and a ground conductor adjacent to an input end and an output end of the transmission line conductor, respectively, is formed in a sheet shape on the first main surface of the first base material made of a thermoplastic resin, and among the first conductors A base feeder for supplying a base in which a plurality of at least the transmission line conductors are formed at a predetermined pitch; a first shield supply unit for supplying a first shield formed on the two main surfaces; a second shield supply unit for supplying a second shield formed on a third substrate having a sheet shape with a third conductor;

The first intermediate body by removing an unnecessary region between the transmission line conductor and the transmission line conductor with respect to a first thermocompression presser for thermocompression bonding the coverlay to a first main surface, and a first intermediate body to which the coverlay is thermocompression bonded. A side of the second main surface of the first shield is opened on a surface opposite to the first main surface in the base with respect to an unnecessary region remover forming a through hole passing through the second intermediate body in which the through hole is formed A second thermocompression bonding machine for crimping, and a first bonding machine for ultrasonically bonding the exposed surface of the third conductor to the exposed surface of the second conductor in a state where the first shield is thermocompressed.

According to this configuration, the first thermocompression bonding machine, the punching machine, the second thermocompression bonding machine, and the first bonding machine operate in conjunction, and the second conductor of the first shield and the second conductor of the second shield disposed oppositely with the base and the coverlay interposed therebetween. 3 The conductor is ultrasonically joined through the through hole. Accordingly, it is possible to manufacture a thin transmission line with reduced crosstalk by shielding over the entire circumference or an intermediate thereof in a consistent production line. In addition, since the second conductor of the first shield and the third conductor of the second shield are ultrasonically joined without using an adhesive or conductive paste, the production time (tact time) can be shorter than the thermosetting time of the conductive paste or adhesive. and can be produced in a short time.

According to the transmission line of the present invention, since the second conductor of the first shield and the third conductor of the second shield are ultrasonically joined without using an adhesive or conductive paste, a thin type with reduced crosstalk by shielding over the entire circumference of transmission line can be realized. In addition, according to the transmission line manufacturing method and transmission line manufacturing apparatus of the present invention, a thin transmission line with reduced crosstalk by shielding over the entire circumference or an intermediate thereof can be manufactured in a consistent manufacturing line.

BRIEF DESCRIPTION OF THE DRAWINGS It is a block diagram which shows typically the arrangement|positioning structure of the manufacturing apparatus of the transmission line of embodiment of this invention.
Fig. 2A is a schematic plan view showing a base according to the present embodiment, Fig. 2B is a schematic plan view showing a first intermediate body in which the coverlay according to the present embodiment is thermocompression-bonded to the base, and Fig. 2C is a plan view according to the present embodiment A schematic plan view showing a second intermediate body in which a through hole is formed.
Fig. 3A is a schematic plan view showing a fourth intermediate body to which the second shield is ultrasonically bonded according to the present embodiment, and Fig. 3B is a schematic plan view showing a sixth intermediate body having a window portion according to the present embodiment.
Fig. 4A is a schematic plan view showing the transmission line according to the present embodiment, and Fig. 4B is a schematic side view showing the transmission line according to the present embodiment.
Fig. 5A is a schematic cross-sectional view showing the base according to the present embodiment, Fig. 5B is a schematic cross-sectional view showing the first intermediate body to which the cover lay according to the present embodiment is thermocompression bonded to the base, and Fig. 5C is the present embodiment A schematic cross-sectional view showing a second intermediate body in which a through hole is formed.
Fig. 6A is a schematic cross-sectional view showing a fourth intermediate body to which a second shield according to the present embodiment is ultrasonically bonded, and Fig. 6B is a schematic cross-sectional view showing a transmission line according to the present embodiment.
Fig. 7A is a schematic cross-sectional view showing another example of the transmission line according to the present embodiment, and Fig. 7B is a schematic cross-sectional view showing another example of the transmission line according to the present embodiment.
Fig. 8A is a diagram schematically showing a first thermocompression bonding machine according to the present embodiment, Fig. 8B is a diagram schematically showing an unnecessary region remover according to the present embodiment, and Fig. 8C is a second row according to the present embodiment A diagram schematically showing a compression press.
Fig. 9A is a diagram schematically showing the ultrasonic bonding machine according to the present embodiment, Fig. 9B is a diagram schematically showing the laser processing machine according to the present embodiment, and Fig. 9C is a diagram schematically showing the inspection machine according to the present embodiment drawing to do.
Fig. 10 is a configuration diagram schematically showing an arrangement configuration of another example of the transmission line manufacturing apparatus according to the embodiment of the present invention;
Fig. 11 is a flowchart showing a manufacturing procedure of a transmission line according to an embodiment of the present invention;

(First embodiment)

EMBODIMENT OF THE INVENTION Hereinafter, embodiment of this invention is described in detail with reference to drawings. 1 is a block diagram schematically showing an example of a transmission line manufacturing apparatus 1 of the present embodiment, wherein the left side in the drawing is an upstream side, and the right side in the drawing is a downstream side. The transmission line manufacturing apparatus 1 has, in order from the upstream side, a first thermocompressor 2, an unnecessary region remover 3, a second thermocompressor 4, a first junction 5, and a second junction 6 ), a laser processing machine 7 , an inspection machine 8 , a split take-out machine 9 , and a transfer machine 17 are disposed, and a controller 10 for controlling these is provided. In addition, in all the drawings for demonstrating embodiment, the same code|symbol is attached|subjected to the member which has the same function, and the repeated description may be abbreviate|omitted.

On the upstream side of the first thermocompressor 2 , a base feeder 11 and a tension adjuster 15 , and a coverlay feeder 12 and a tension adjuster 15 are arranged, respectively. A first shield feeder 13 and a tension adjuster 15, and a second shield feeder 14 and a tension adjuster 15 are disposed upstream of the second thermocompressor 4 . Here, the tension regulator 15 has, as an example, a tension roller, and depending on the position of the tension roller, a sheet-like workpiece (base 30, coverlay 35, first intermediate body 51, first shield ( 40) and the tension of the second shield 45) is maintained within a certain range.

And the pitch feeder 16 is arrange|positioned at the upstream of the 2nd thermocompression bonding machine 4, and the pitch feeder 16 is arrange|positioned at the upstream of the inspection machine 8. As shown in FIG. The pitch feeder 16 has, as an example, a feed roller, and maintains the feed pitch of the sheet-shaped work (the first intermediate body 52 and the sixth intermediate body 56) at a constant value by the feed amount of the feed roller, and there is.

FIG. 8A is a diagram schematically showing the first thermocompressor 2 . The first thermocompressor 2 has, as an example, a press plate with a built-in heater, and the base 30 and the coverlay 35 are pressed by sandwiching the base 30 and the coverlay 35 in the vertical direction by the two press plates arranged opposite to each other. It is a configuration in which the first intermediate body 51 is formed by heating.

Fig. 8B is a diagram schematically showing the unnecessary region remover 3; The unnecessary region remover 3 has, as an example, a punching blade and a receiving stand for receiving the punching blade, and by punching the unnecessary region R1 of the first intermediate body 51 with the punching blade, the It is a structure in which the 2nd intermediate body 52 is formed by removing the unnecessary area|region R1, the through-hole U1 penetrating the 1st intermediate body 51 is formed. As a structure other than the above, the laser processing machine which removes unnecessary area|region R1 by laser irradiation to the unnecessary area|region remover 3 is applicable.

FIG. 8C is a diagram schematically showing the second thermocompressor 4 . The second thermocompressor 4 has, as an example, a press plate having a built-in heater, and the first shield 40 and the second intermediate body 52 are sandwiched and pressed in the vertical direction by the two press plates arranged opposite to each other. It is a configuration in which heating is performed while heating, and a configuration in which the first shield 40 is thermocompression-bonded to the base 30 and the second shield 45 is thermocompression-bonded to the coverlay 35 .

Here, the 1st thermocompression bonding machine 2 and the 2nd thermocompression bonding machine 4 can be set as the same apparatus structure. Thereby, the maintenance of an apparatus becomes easy.

Fig. 9A is a diagram schematically showing the first bonding unit 5 (first ultrasonic bonding unit) or the second bonding unit 6 (second ultrasonic bonding unit). The first bonding unit 5 is, as an example, a main body part in which a vibrating body is incorporated, a head part (horn) that is installed on the main body part and vibrates ultrasonically with vibration transmitted from the vibrating body, and a receiving part which receives the head part. section) has The first bonding unit 5 (first ultrasonic bonding unit) is formed on the coverlay 35 while the first shield 40 is thermocompression bonded to the base 30 by the head portion and the receiving portion disposed opposite to each other. This is a configuration in which the second shield 45 is thermocompression bonded between the workpieces in the vertical direction and is clamped, and the head part is ultrasonically vibrated to form the fourth intermediate body 54 by ultrasonic bonding.

Alternatively, the first bonding unit 5 (first ultrasonic bonding unit) is attached to the third intermediate body 53 in which the first shield 40 is thermocompression-bonded to the base 30 by the head unit and the receiving unit disposed opposite to each other. This is a configuration in which the work in the state where the second shield 45 is overlapped is sandwiched in the vertical direction, and the head portion is ultrasonically vibrated to form the fourth intermediate body 54 by ultrasonic bonding.

Here, the fourth intermediate body 54 is a semi-finished product of the stage before becoming the transmission line 20, and refers to a semi-finished product in a state in which the structure is shielded over the entire circumference.

The second bonding unit 6 (second ultrasonic bonding unit) is, as an example, a main body part having a built-in vibrating body, a head part (horn) installed on the main body part and ultrasonically vibrating with the vibration transmitted from the vibrating body, and a receiver receiving the head part. A configuration in which a fifth intermediate body 55 is formed by ultrasonic bonding by ultrasonically vibrating the head portion while sandwiching the fourth intermediate body 54 from the vertical direction by the head portion and the receiving portion disposed opposite to each other. am. Here, the 1st bonding machine 5 and the 2nd bonding machine 6 can be set as the same apparatus structure. Thereby, the maintenance of an apparatus becomes easy. Alternatively, there is a case where the ultrasonic vibrating head portions are arranged to face each other, so that the function of both the first bonding machine 5 and the second bonding machine 6 is combined.

9B is a diagram schematically showing the laser processing machine 7 . The laser processing machine 7 is configured to form a sixth intermediate body 56 by partially exposing the third conductor 46 by removing a predetermined region by laser irradiation.

9C is a diagram schematically showing the inspection machine 8. As shown in FIG. The inspection machine 8 is configured to inspect whether the transmission line conductor 32 is not disconnected or the continuity level is within a normal range by bringing contact pins protruding downward at predetermined intervals to contact the transmission line conductor 32 to conduct electricity. . As a configuration other than the above, the inspection machine 8 captures an image of the transmission line conductor 32 with a camera and analyzes the image to inspect whether the transmission line conductor 32 is disconnected or whether the conduction level is within a normal range. In some cases, the inspection machine 8 performs both an electrical characteristic inspection by energizing the transmission line conductor 32 and an external appearance characteristic inspection by imaging the transmission line conductor 32 and analyzing an image. In some cases, the configuration is

As shown in FIG. 1 , on the downstream side of the inspection machine 8 , a divided extractor 9 which takes out the transmission line 20 from the sixth intermediate body 56 is disposed. The divided ejector 9 has, as an example, a punching blade and a receiving stand for receiving the punching blade, and by punching the sixth intermediate body 56 in-line inspected by the punching blade along a predetermined cut line. It is a configuration in which the transmission line 20 is separated and the transmission line 20 is taken out. As a configuration other than the above, the division take-out machine 9 separates the transmission line 20 by scribing the in-line-inspected sixth intermediate body 56 along a predetermined cut line to take out the transmission line 20. Alternatively, the divided ejector 9 may separate the transmission line 20 by irradiating the sixth intermediate body 56 subjected to the in-line inspection with a laser along a predetermined cut line, and the transmission line 20 ) is taken out in some cases.

A tray 18 for accommodating the transmission line 20 is disposed on the downstream side of the divided blower 9 . The transmission line 20 manufactured in the above-described consistent manufacturing line and subjected to in-line inspection is conveyed by the transfer device 17 in a vacuum-adsorbed state, for example, and accommodated in the tray 18 .

According to the present embodiment, the thin transmission line 20 with reduced crosstalk by shielding over the entire circumference can be manufactured consistently in one manufacturing line. In addition, since the transmission line 20 is manufactured by thermocompression bonding or ultrasonic bonding without using an adhesive or conductive paste, the production time (tact time) can be shortened than that of the conductive paste or adhesive, and necessary The constituent members are also minimized.

As described above, the second thermocompressor 4 is configured to thermocompress the first shield 40 to the base 30 and thermocompress the second shield 45 . According to this configuration, since the first shield 40 and the second shield 45 are thermocompression-bonded at the same time, wrinkles are prevented from forming in the first shield 40 or the second shield 45 during thermocompression bonding. can be prevented

The above-described manufacturing apparatus is an example. The transmission line manufacturing apparatus 1 is not limited to the above embodiment. As a structure other than the above, for example, a manufacturing facility on the downstream side of the bonding machine 5, an inspection apparatus, etc. may be abbreviate|omitted. In this case, in the state of the fourth intermediate body 54 having a shielding structure over the entire circumference, the production in the transmission line manufacturing apparatus 1 is completed. Then, in a reel state, rectangular state, remodeled state, etc., stored in a conveying container or tray, etc., shipped as the fourth intermediate body 54, or a production line in which the fourth intermediate body 54 is different The fourth intermediate body 54, which is post-processed in , is assembled on an electronic device assembly line, and becomes the transmission line 20 .

As a configuration other than the above, for example, a solder joint is disposed in place of the second ultrasonic joint 6, and the fourth intermediate body 54 is sandwiched in the vertical direction by a head portion and a receiving portion disposed opposite to the solder joint. It may be set as the structure which forms the 5th intermediate body 55 by solder bonding, such as heating and supplying solder from a head part together with a clamping box. Alternatively, there is a case where an adhesive bonding machine is disposed in place of the second ultrasonic bonding machine 6 and the fifth intermediate body 55 is formed by bonding using an adhesive or an electrically conductive paste.

In addition, as a configuration other than the above, for example, an etching processing machine is disposed instead of the laser processing machine 7, a predetermined area is removed by etching to partially expose the third conductor 46, and the sixth intermediate body 56 is formed. It may be set as the structure to form.

Next, another example of the transmission line manufacturing apparatus 1 which concerns on this invention is demonstrated below.

Fig. 10 is a configuration diagram schematically showing an arrangement configuration of another example of the transmission line manufacturing apparatus 1 according to the embodiment. In the example of FIG. 10, the 1st shield feeder 13 and the tension regulator 15 are arrange|positioned on the upstream side of the 2nd thermocompression bonding machine 4. As shown in FIG. Further, on the upstream side of the first bonding unit 5, a second shield feeder 14 and a tension adjuster 15 are arranged. In the case of this configuration, the first shield 40 is thermocompression-bonded to the base 30 by the second thermocompressor 4 to form the third intermediate body 53 . Then, the second shield 45 is ultrasonically welded to the work in which the second shield 45 is superimposed on the third intermediate body 53 by the first bonding machine 5 to form the fourth intermediate body 54 .

According to this configuration, for example, when the size or heat capacity of the first shield 40 is larger than the size or heat capacity of the second shield 45, thermocompression bonding of the first shield 40 to the base 30 is performed. It is easy and reliable, and it is easy and reliable to ultrasonically weld the second shield 45 to the base 30 .

The configuration of FIG. 1 or the configuration of FIG. 10 can be selected in response to standards such as the size or material of the transmission line 20 or the size or material of component parts, and also the manufacturing facility of the configuration of FIGS. 1 or 2 It is possible to add or omit inspection equipment as appropriate.

Subsequently, the transmission line 20 and the method for manufacturing the transmission line 20 according to the present invention will be described below.

11 is a flowchart showing the manufacturing procedure of the transmission line 20. As shown in FIG. The transmission line 20 is an example, 1st thermocompression bonding step S1, unnecessary area|region removal step S2, 2nd thermocompression bonding step S3, 1st bonding step S4, 2nd bonding step S5, laser processing step S6, inspection step S7 , is manufactured in the order of the division step S8.

The above manufacturing sequence is an example. The manufacturing procedure of the transmission line 20 can perform 1st bonding step S4 and 2nd bonding step S5 simultaneously as a structure other than the above, and it is possible to abbreviate|omit 2nd bonding step S5. In addition, it is possible to abbreviate|omit laser processing step S6 other than the above, it is possible to abbreviate|omit inspection step S7, and it is possible to abbreviate|omit division|segmentation step S8. Then, the fourth intermediate body 54 , the fifth intermediate body 55 , the sixth intermediate body 56 , or the transmission line 20 is shipped in a state in which a plurality of pieces are arranged on one sheet at a predetermined pitch in the longitudinal direction, and then There are cases where the sheet is divided in the assembly line of the electronic device in the process, and the transmission line 20 is taken out and used.

FIG. 2A is a schematic plan view showing the base 30 , FIG. 2B is a schematic plan view showing the first intermediate body 51 , and FIG. 2C is a schematic plan view showing the second intermediate body 52 . 3A is a schematic plan view showing the fourth intermediate body 54 , and FIG. 3B is a schematic plan view showing the sixth intermediate body 56 . 4A is a schematic plan view showing the transmission line 20 , and FIG. 4B is a schematic side view showing the transmission line 20 .

Fig. 5A is a schematic cross-sectional view showing the base 30 in the position of the transmission line conductor 32, similarly, Fig. 5B is a schematic cross-sectional view showing the first intermediate body 51, and Fig. 5C is a second intermediate body ( 52) is a schematic cross-sectional view. 6A is a schematic cross-sectional view showing the fourth intermediate body 54 , and FIG. 6B is a schematic cross-sectional view showing the transmission line 20 at the position of the transmission line conductor 32 .

2A and 5A, the base 30 is made of a copper clad laminate (CCL), and the transmission line conductors 32 have a sheet-like first substrate 34 at a predetermined pitch P1 in the longitudinal direction. is formed on the first main surface 34a of The first conductor 31 has a transmission line conductor 32 formed in a straight shape, and is adjacent to an input terminal and an output terminal of the transmission line conductor 32, respectively, and the side adjacent to the input terminal or output terminal is "U-shaped" or " It consists of a ground conductor 33 formed in a U-shape. As an example, a connector is joined to an input terminal and an output terminal of the ground conductor 33 and the transmission line conductor 32 through, for example, solder or conductive paste (not shown). In a configuration other than the above, a plurality of ground conductors ( 33) in some cases.

In the base 30, a plurality of transmission line conductors 32 are arranged at a predetermined pitch in the longitudinal direction on a sheet-like first substrate 34, and in the state of Fig. 2A, the transmission line conductors 32 and the transmission line An unnecessary region R1 exists between the conductors 32 .

The first conductor 31 is made of, for example, copper foil. The first substrate 34 is made of, for example, a thermoplastic resin. The first substrate 34 is made of, for example, a liquid crystal polymer (LCP), polyimide (PI), polyamide (PA), or polyetheretherketone (PEEK). The sheet-shaped base 30 is, for example, mounted on the base feeder 11 in a reel state, and is supplied so that continuous processing is possible.

The first conductor 31 is, as an example, a copper foil having a thickness of 5 [μm] or more and 25 [μm] or less. The first substrate 34 is, for example, a liquid crystal polymer (LCP) having a thickness of 50 [μm] or more and 150 [μm] or less. The first conductor 31 is formed by pattern etching the copper clad laminate CCL as an example.

The base 30 is an example, as a pretreatment of the first thermocompression bonding step S1, and the surface (the first main surface 34a) on the side to which the first conductor 31 is bonded by a plasma irradiation device. )) is irradiated with oxygen-containing plasma to remove organic matter and reform. By irradiating the oxygen-containing plasma, the adhesion is improved during the first thermocompression bonding. In addition to the above, there is a case where a plasma irradiation device is provided on the upstream side of the first thermocompressor 2 to irradiate the first main surface 34a with oxygen-containing plasma (not shown).

The cover lay 35 is made of, for example, a thermoplastic resin. The cover lay 35 is made of, for example, a liquid crystal polymer (LCP), polyimide (PI), polyamide (PA), or polyetheretherketone (PEEK). As an example, the cover lay 35 is mounted on the cover lay feeder 12 in a reel state, and is supplied so that continuous processing is possible.

The coverlay 35 is, as an example, a liquid crystal polymer (LCP) having a thickness of 25 [μm] or more and 125 [μm] or less.

The first shield 40 is made of, for example, a copper clad laminate (CCL), and the second conductor 41 is formed on the second main surface 42a of the sheet-like second base material 42 . The second conductor 41 may be bonded to the entire surface of the second base material 42 or may be bonded together in a mesh shape.

The second conductor 41 is made of, for example, copper foil. The second substrate 42 is made of, for example, a thermoplastic resin. The second substrate 42 is made of, for example, a liquid crystal polymer (LCP), polyimide (PI), polyamide (PA), or polyetheretherketone (PEEK). The first shield 40 is, for example, mounted on the first shield feeder 13 in a reel state, and is supplied so that continuous processing is possible.

The second conductor 41 is, as an example, a copper foil having a thickness of 5 [mu]m or more and 25 [mu]m or less. The second substrate 42 is, as an example, polyimide (PI) having a thickness of 5 [μm] or more and 25 [μm] or less. The first shield 40 is an example, and a copper clad laminate (CCL) is used as it is.

As an example, the first shield 40 is oxygenated to the surface (the second main surface 42a) on the side to which the second conductor 41 is bonded by a plasma irradiation device as a pretreatment of the second thermocompression bonding step S3. By irradiating the containing plasma, organic matter is removed and reformed. By irradiating the oxygen-containing plasma, the adhesion is improved during the second thermocompression bonding. In addition to the above, there is a case where a plasma irradiation device is provided on the upstream side of the second thermocompressor 4 to irradiate the second main surface 42a with oxygen-containing plasma (not shown).

The second shield 45 is made of a copper clad laminate (CCL) as an example, and the third conductor 46 is formed on one side of the sheet-shaped third base material 47 . The third conductor 46 may be bonded to the entire surface of the third base material 47 or may be bonded together in a mesh shape.

The third conductor 46 is made of, for example, copper foil. The third substrate 47 is made of, for example, a thermoplastic resin. The third substrate 47 is made of, for example, a liquid crystal polymer (LCP), polyimide (PI), polyamide (PA), or polyetheretherketone (PEEK). As an example, the second shield 45 is mounted on the second shield feeder 14 in a reel state, and is supplied so that continuous processing is possible.

The third conductor 46 is, as an example, a copper foil having a thickness of 5 [μm] or more and 25 [μm] or less. The third substrate 47 is, for example, a polyimide (PI) having a thickness of 5 [μm] or more and 25 [μm] or less. The second shield 45 is an example, and a copper clad laminate (CCL) is used as it is. The second shield 45 is, for example, made of the same material as the first shield 40 .

The second shield 45 is an example, as a pretreatment of the first bonding step S4, by irradiating the surface on the side to which the third conductor 46 is bonded with an oxygen-containing plasma by means of a plasma irradiation device to remove organic matter. along with, reform By irradiating oxygen-containing plasma, the adhesion degree in 1st bonding step S4 improves. In addition to the above, there is a case where a plasma irradiation device is provided on the upstream side of the first bonding unit 5, and oxygen-containing plasma is irradiated to the surface on which the third conductor 46 is bonded (not shown).

1st thermocompression bonding step S1 thermocompresses the coverlay 35 to the 1st main surface 34a of the 1st base material 34, as shown to FIG. 2B and FIG. 5B. As an example, the 1st base material 34 and the coverlay 35 are made of the same material, and it is a heating temperature below melting|fusing point of the 1st base material 34 and the coverlay 35, and also the load deflection temperature or load deflection. A heating temperature within plus or minus 20 [℃], preferably a heating temperature within plus or minus 5 [℃], more preferably a heating temperature within plus or minus 2 [℃], with a predetermined pressure The first intermediate body (51) is obtained by heating and thermocompression bonding while pressurizing for a period of time.

The first thermocompression bonding step S1 is, as an example, 180 [°C] or more and 280 [°C] or less heating temperature, 10 [MPa] or more and 60 [MPa] or less pressing force, 5 [sec] or more, 240 [sec] It is thermocompression-bonded with the following heating/pressing time. Thermocompression bonding is performed in the atmosphere as an example.

The unnecessary region removal step S2 is performed by punching out the unnecessary region R1 between the transmission line conductor 32 and the transmission line conductor 32 with respect to the first intermediate body 51 as shown in Figs. 2C and 5C. This is removed to form a through hole U1 penetrating the first intermediate body 51 to form a second intermediate body 52 . The through hole U1 is, for example, a rectangular shape or a rectangular shape with rounded corners, and is formed at a predetermined interval P2 in the longitudinal direction. The predetermined interval P2 is preferably 2.5 [mm] or less. Thereby, the crosstalk reduction effect becomes high. As an example, the length of the through hole U1 is set to be 0.2 times or more and less than 1.0 times the total length of the transmission line conductor 32 .

When the total length of the transmission line conductor 32 is more than 500 [mm], as an example, the predetermined distance P2 is set to 1.5 [mm] or more. Thereby, bonding of the 2nd conductor 41 and the 3rd conductor 46 becomes easy. When the total length of the transmission line conductor 32 is 500 [mm] or less, as an example, the predetermined interval P2 is set to be less than 0.5 [mm]. Thereby, the crosstalk reduction effect becomes higher. As an example, the predetermined interval P2 is set to 0.0 [mm]. Thereby, the crosstalk reduction effect becomes the highest.

In the second thermocompression bonding step S3, as shown in Figs. 3A and 6A, with respect to the second intermediate body 52, on the surface opposite to the first main surface 34a of the base 30, the first shield ( The side of the second main surface 42a of 40 is thermocompression-bonded. At the same time, the second shield 46 is thermocompression-bonded to the first main surface 34a of the base 30 . As an example, the first substrate 34 and the second substrate 42 are different materials, the second substrate 42 and the third substrate 47 are the same material, and the first substrate 34 is ) is a heating temperature below the melting point, and further, a heating temperature within plus or minus 20 [° C.] with respect to the deflection temperature under load of the first substrate 34 or the deflection temperature under load of the first substrate 34, preferably Thermocompression bonding is performed by heating at a heating temperature within plus or minus 5 [°C], more preferably within plus and minus 2 [°C], while pressurizing at a predetermined pressure for a predetermined period of time.

Alternatively, in the second thermocompression bonding step S3 , the second main surface 42a of the first shield 40 is on the surface opposite to the first main surface 34a of the base 30 with respect to the second intermediate body 52 . thermocompress the side of As an example, using the first base material 34 and the second base material 42 as dissimilar materials, the heating temperature is equal to or lower than the melting point of the first base material 34 , and the load deflection temperature of the first base material 34 or A heating temperature within plus or minus 20 [° C.] with respect to the bending temperature under load of the first substrate 34, preferably a heating temperature within plus or minus 5 [° C.], more preferably within plus or minus 2 [° C.] At a heating temperature of

The second thermocompression bonding step S3 is an example of 180 [°C] or higher and 280 [°C] or lower heating temperature, 10 [MPa] or higher and 60 [MPa] or lower pressing force, 5 [sec] or higher, 240 [sec] It is thermocompression-bonded with the following heating/pressing time. Thermocompression bonding is performed in the atmosphere as an example.

Following the second thermocompression bonding step S3 , in the first bonding step S4 , the exposed surface of the third conductor 46 is ultrasonically bonded to the exposed surface of the second conductor 41 . As an example, the second conductor 41 and the third conductor 46 are made of the same material, and the frequency is 15 while the pressing force of the horn is 500 [N] or more and 2500 [N] or less. Ultrasonic bonding is carried out by applying an ultrasonic vibration of 200 [kHz] or more and not less than [kHz], and the fourth intermediate body 54 is obtained.

As described above, the fourth intermediate body 54 manufactured on a consistent production line is shipped as the fourth intermediate body 54 having a structure that shields over the entire circumference, or the fourth intermediate body 54 is transferred to another production line. The post-processed or fourth intermediate body 54 is assembled on an electronic device assembly line to become the transmission line 20 .

In the example of FIG. 11, 2nd bonding step S5 is performed following 1st bonding step S4. In the second bonding step S5 , the end of the third conductor 46 is ultrasonically joined to the end of the ground conductor 33 with respect to the fourth intermediate body 54 . Here, the end of the ground conductor 33 is each end on the side of the transmission line conductor 32 . In addition, the ends of the 3rd conductor 46 are both ends. As an example, the second conductor 41 and the third conductor 46 are made of the same material, and the frequency is 15 [kHz] or more while pressing with a pressing force of 500 [N] or more and 2500 [N] or less of the horn. The fifth intermediate body 55 is obtained by ultrasonic bonding by applying ultrasonic vibrations of 200 [kHz] or less.

In the example of FIG. 11, laser processing step S6 is performed following 2nd bonding step S5. In laser processing step S6, as shown in FIG. 3B, with respect to the 5th intermediate body 55, the surface on the opposite side of the bonding surface of the ground conductor 33 in the 3rd conductor 46 is partially exposed by laser irradiation. The window portions V1 are formed at predetermined intervals to form a sixth intermediate body 56 . As an example, the window portion V1 has a quadrangular shape or a quadrangular shape with rounded corners, and is formed in plurality at predetermined intervals. Laser irradiation is irradiated with a predetermined output for a predetermined time. For laser irradiation, known facilities and known construction methods are applicable. In addition, laser processing step S6 may be abbreviate|omitted.

In the example of FIG. 11, inspection step S7 is performed following laser processing step S6. In the inspection step S7, the transmission line conductor 32 is not disconnected by bringing the contact pin of the inspection machine 8 into contact with the transmission line conductor 32 to conduct electricity with respect to the sixth intermediate body 56, and the conduction level is normal. Check that it is within range. For the continuity test, known facilities and known construction methods are applicable. In addition, inspection step S7 is not performed here, but may be performed by another manufacturing line.

In the example of FIG. 11, division|segmentation step S8 is performed following inspection step S7. In division step S8, the transmission line 20 is separated and taken out by the division|segmentation take-out machine 9 punching out the 6th intermediate body 56 which was in-line-inspected with a punching blade along a predetermined cut line. For the divided take-out, known facilities and known construction methods are applicable. In addition, division|segmentation step S8 is not performed here, but may be performed by another manufacturing line.

And, as described above, the transmission line 20 manufactured on a consistent production line and subjected to in-line inspection is conveyed by the transfer device 17 in a vacuum-adsorbed state, for example, and accommodated in the tray 18 . .

As an example, FIGS. 4A and 6B show a transmission line 20 having a two-core structure in which two transmission line conductors 32 are arranged in parallel. As a configuration other than the above, as shown in Fig. 7A, there is a case where the transmission line 20 has a three-core structure in which three transmission line conductors 32 are respectively arranged in parallel. Alternatively, as shown in Fig. 7B, there is a case where the transmission line 20 has a multi-core structure in which four or more transmission line conductors 32 are respectively arranged in parallel.

According to this embodiment, by sending the base 30, the coverlay 35, the 1st shield 40, and the 2nd shield 45 at predetermined pitch P1, 1st thermocompression bonding step S1, unnecessary area|region Via the removal step S2, the 2nd thermocompression bonding step S3, and the 1st bonding step S4, the thin transmission line 20 which shielded over the whole perimeter and reduced crosstalk can be manufactured in a consistent line. In addition, since the second conductor of the first shield 40 and the third conductor of the second shield are ultrasonically bonded without using an adhesive or conductive paste, the production time (tact time) is shortened to that of the conductive paste or the thermal curing time of the adhesive. It can be made shorter, and a necessary structural member is also suppressed to the minimum.

In addition, according to this configuration, in a state in which the second conductor 41 and the third conductor 46 are ultrasonically bonded, the ground conductor 33 disposed adjacent to the input end and the output end of the transmission line conductor 32 is simultaneously connected to the third It can be ultrasonically joined to the conductor 46 . And, since the first shield 40 and the second shield 45 are integrally structured, the occurrence of wrinkles and stress distortion when the ground conductor 33 is simultaneously ultrasonically joined to the third conductor 46 is prevented. can do. And, according to this configuration, since the third conductor 46 and the second shield 45 are integrally structured, the surface opposite to the bonding surface of the ground conductor 33 in the third conductor 46 is laser-cut. It can be easy to form the window portion V1 partially exposed to the predetermined interval.

Transmission line ( 20) can be prepared.

In the transmission line 20 of the present embodiment, the first conductor 31 comprising the transmission line conductor 32 and the ground conductor 33 adjacent to the input and output terminals of the transmission line conductor 32, respectively, is a sheet-like thermoplastic. a base 30 formed on the first main surface 34a of the first base material 34 made of resin, and in which at least transmission line conductors 32 of the first conductors 31 are formed at a predetermined pitch P1; A cover lay 35 made of a thermoplastic resin in the form of a sheet covering the transmission line conductor 32, and the second conductor 41 on the second main surface 42a of the second base material 42 made of a thermoplastic resin in the form of a sheet A first shield (40) formed therein, and a second shield (45) formed on a third substrate (47) in which the third conductor (46) is formed in a sheet shape and made of a thermoplastic resin, is formed on the first substrate (34) In the first main surface 34a and the coverlay 35 , the surface opposite to the first main surface 34a in the base 30 and the second main surface 42a side of the first shield 40 , the base 30 . The side opposite to the first main surface 34a of the side of the second main surface 42a of the first shield 40, and the side of the second main surface 42a of the coverlay 35 and the second shield 45 The second conductor 41 and the third conductor 46 that are thermocompression bonded to each other and disposed to face each other are ultrasonically bonded to each other, and the transmission line conductor 32 is formed by the second conductor 41 and the third conductor 46 . ) are excreted so as to surround each of them.

As shown in Figs. 4A, 4B and 6B, according to this embodiment, the second conductor 41 of the first shield 40 with the base 30 and the coverlay 35 interposed therebetween and disposed opposite to each other; In a state where the third conductor 46 of the second shield 45 is ultrasonically bonded, it is shielded over the entire circumference so as to surround the transmission line conductor 32 to form a thin transmission line 20 with reduced crosstalk. And, since the second conductor 41 of the first shield 40 and the third conductor 46 of the second shield 45 are ultrasonically bonded without using an adhesive or conductive paste, at least the adhesive or conductive paste It can be made into a thin structure as much as the thickness. Further, compared with the conventional method of inserting vias between transmission lines to reduce crosstalk, the manufacturing cost can be significantly reduced.

As an example, the end of the ground conductor 33 and the end of the third conductor 46 are ultrasonically bonded to each other. According to this configuration, extraneous noise can be prevented by the shielding effect on the input end and the output end of the transmission line conductor 32 .

In addition, a plurality of window portions V1 are formed in the third base material 47 at predetermined intervals, and a part of the third conductor 46 is exposed so as to be externally connectable by the window portion V1. According to this configuration, as an example, it is easy to increase the shielding performance by externally connecting a part of the third conductor 46 exposed by the window V1 to the body or the ground wiring of the portable information terminal.

As shown in Fig. 6B, cut surfaces are formed on both sides in the longitudinal direction. According to this structure, the width dimension becomes constant by cut|disconnecting both sides of a long side direction.

As mentioned above, this invention is not limited to embodiment mentioned above. In the above-described example, the sheet-like base 30 is supplied in a reel state, but it is not limited thereto, and it is laminated on a magazine in a leaf shape of a predetermined size, and a supply roller from the magazine. It is also possible to supply it to a manufacturing line by etc. Similarly for the coverlay 35, the first shield 40, and the second shield 45, it is also possible to laminate a leaf shape of a predetermined size on a magazine and supply it to the production line from the magazine by a supply roller or the like. .

Claims (13)

A first conductor comprising a transmission line conductor and a ground conductor adjacent to an input end and an output end of the transmission line conductor, respectively, in a sheet form, a base formed on a first main surface of a first substrate made of a thermoplastic resin, and a sheet covering the transmission line conductor A coverlay made of a thermoplastic resin in the shape of a first shield formed on a second main surface of a second base material having a second conductor formed in a sheet shape and made of a thermoplastic resin, and a third conductor having a sheet shape made of a thermoplastic resin in a third base material. and a second shield formed therein;
of the first main surface and the coverlay in the first substrate, a surface opposite to the first main surface in the base and a side of the second main surface of the first shield, and the coverlay and the second shield Sides of the second main surface are thermocompression bonded to each other,
The second conductor and the third conductor are ultrasonically bonded to each other, and the second conductor and the third conductor are arranged to surround the transmission line conductor,
A transmission line, wherein a plurality of window portions are formed in the third substrate at predetermined intervals, and a part of a surface of the third conductor opposite to the cover lay is exposed so as to be externally connectable by the window portions. A first conductor comprising a transmission line conductor and a ground conductor adjacent to an input end and an output end of the transmission line conductor, respectively, is formed in a sheet shape on the first main surface of the first base material made of a thermoplastic resin, and at least among the first conductors, the transmission line a base formed with a plurality of raw conductors at a predetermined pitch, a cover lay made of a thermoplastic resin in a sheet shape for covering each of the transmission line conductors, and a second conductor formed on a second main surface of a second base material in a sheet shape and made of a thermoplastic resin A first shield and a second shield in which the third conductor is formed in a sheet shape on a third substrate made of a thermoplastic resin,
of the first main surface and the coverlay in the first substrate, a surface opposite to the first main surface in the base and a side of the second main surface of the first shield, and the coverlay and the second shield Sides of the second main surface are thermocompression bonded to each other,
The second conductor and the third conductor disposed to face each other are ultrasonically bonded to each other, and the second conductor and the third conductor are arranged to surround the transmission line conductor, respectively;
A transmission line, wherein a plurality of window portions are formed in the third substrate at predetermined intervals, and a part of a surface of the third conductor opposite to the cover lay is exposed so as to be externally connectable by the window portions. 3. The method of claim 1 or 2,
A transmission line, characterized in that cut surfaces are formed on both sides of the longitudinal direction. 3. The method of claim 1 or 2,
An end of the ground conductor and an end of the third conductor are ultrasonically bonded to each other. delete A first conductor comprising a transmission line conductor and a ground conductor adjacent to an input end and an output end of the transmission line conductor, respectively, at a predetermined pitch, a base formed on the first main surface of a sheet-shaped first substrate, and a sheet covering the transmission line conductor a transmission line having a coverlay of the , a first shield having a second conductor formed on a second main surface of a sheet-shaped second substrate, and a second shield having a third conductor formed on a third sheet-shaped substrate, or a transmission line; A first conductor comprising a raw conductor and a ground conductor adjacent to an input end and an output end of the transmission line conductor, respectively, is formed in a sheet shape on the first main surface of the first base material made of a thermoplastic resin, and at least among the first conductors, the transmission line A first base having a plurality of conductors formed at a predetermined pitch, a coverlay made of a thermoplastic resin in a sheet shape for covering each of the transmission line conductors, and a second conductor formed on a second main surface of a second substrate made of a thermoplastic resin in a sheet shape A method of manufacturing a transmission line having a shield and a second shield formed on a third substrate in which the third conductor is formed of a sheet of a thermoplastic resin, the method comprising:
A first thermocompression bonding step of thermocompression bonding the coverlay to the first main surface;
an unnecessary region removing step of forming a through hole penetrating through the first intermediate body by removing an unnecessary region between the transmission line conductor and the transmission line conductor with respect to the first intermediate body to which the cover lay is thermocompression bonded;
a second thermocompression bonding step of thermocompression bonding a side of the second main surface of the first shield to a surface opposite to the first main surface of the base with respect to the second intermediate body in which the through hole is formed;
and a first bonding step of ultrasonically bonding the exposed surface of the third conductor to the exposed surface of the second conductor while the first shield is thermocompression bonded. 7. The method of claim 6,
The second thermocompression bonding step includes thermocompression bonding the side of the second main surface of the first shield to the surface opposite to the first main surface of the base with respect to the second intermediate body, and to the coverlay. and thermocompression bonding the side of the second main surface of the second shield. 8. The method according to claim 6 or 7,
and a second bonding step of ultrasonically bonding an end of the third conductor to an end of the ground conductor in a state in which the second conductor and the third conductor are ultrasonically joined. 9. The method of claim 8,
and a laser processing step of exposing a part of the third conductor to laser irradiation in a state in which the ground conductor and the third conductor are ultrasonically joined. A base in which a first conductor comprising a transmission line conductor and a ground conductor adjacent to an input end and an output end of the transmission line conductor, respectively, is formed on the first main surface of the sheet-like first substrate at a predetermined pitch, or a transmission line conductor and the transmission line A first conductor made of a ground conductor adjacent to an input end and an output end of the conductor, respectively, is formed in a sheet shape on the first main surface of the first base material made of a thermoplastic resin, and at least the transmission line conductors among the first conductors are plural at a predetermined pitch. A base supplier for supplying the formed base, a cover lay supplier for supplying a sheet-shaped cover lay covering the transmission line conductor, and a second conductor for supplying a first shield formed on a second main surface of a sheet-shaped second substrate a first shield supplier and a second shield supplier for supplying a second shield having a third conductor formed on the third sheet-shaped substrate;
A first thermocompressor for thermocompression bonding the coverlay to the first main surface;
an unnecessary region remover for forming a through hole penetrating through the first intermediate body by removing an unnecessary region between the transmission line conductor and the transmission line conductor with respect to the first intermediate body to which the cover lay is thermocompression bonded;
a second thermocompressor for thermocompression bonding a side of the second main surface of the first shield to a surface opposite to the first main surface of the base with respect to the second intermediate body in which the through hole is formed;
and a first bonding unit for ultrasonically bonding the exposed surface of the third conductor to the exposed surface of the second conductor in a state in which the first shield is thermocompression bonded. 11. The method of claim 10,
The second thermocompressor is configured to thermocompress a side of the second main surface of the first shield to a surface opposite to the first main surface in the base with respect to the second intermediate body, and to the coverlay. An apparatus for manufacturing a transmission line, characterized in that the side of the second main surface of the second shield is thermocompression-bonded. 12. The method of claim 10 or 11,
and a second splicer for ultrasonically joining an end of the third conductor to an end of the ground conductor in a state in which the second conductor and the third conductor are ultrasonically joined. 13. The method of claim 12,
and a laser processing machine exposing a part of the third conductor to laser irradiation in a state in which the ground conductor and the third conductor are ultrasonically bonded.

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