KR102321378B1 - Mask for deposition, mask frame assembly for deposition, manufacturing method of the same - Google Patents

Abstract

The present invention discloses a mask, a mask frame assembly, and a method of manufacturing the same. The present invention provides a deposition mask for depositing a deposition material on a substrate for manufacturing a display device, wherein a deposition pattern portion through which the deposition material passes and a rib portion connected to the deposition pattern portion to support the deposition pattern portion and a concave portion concavely formed to face the substrate on the outer side of the deposition pattern portion and the rib portion.

Description

Mask for deposition, mask frame assembly for deposition, and method for manufacturing the same

Embodiments of the present invention relate to a deposition mask, a deposition mask frame assembly, and a method of manufacturing the same.

In general, an organic light emitting diode display, which is one of flat disk plays, is an active light emitting display device that has a wide viewing angle and excellent contrast, can be driven at a low voltage, and has the advantages of being lightweight, thin, and fast in response. It is attracting attention as a small child.

These light emitting devices are divided into inorganic light emitting devices and organic light emitting devices according to the material forming the light emitting layer. The organic light emitting devices have superior characteristics such as luminance and response speed compared to inorganic light emitting devices and have the advantage of enabling color display. Its development has been actively carried out recently.

In an organic light emitting display device, an organic layer and/or an electrode is formed by a vacuum deposition method. However, as the organic light emitting diode display gradually increases in resolution, the width of the open slit of the mask used in the deposition process becomes narrower and the dispersion thereof is also required to be further reduced.

In addition, in order to manufacture a high-resolution organic light emitting diode display, it is necessary to reduce or eliminate a shadow effect. Accordingly, the deposition process is performed in a state in which the substrate and the mask are in close contact, and the development of a technique for improving the adhesion between the substrate and the mask is emerging.

The above-mentioned background art is technical information possessed by the inventor for derivation of the present invention or acquired in the process of derivation of the present invention, and cannot necessarily be said to be a known technique disclosed to the general public prior to the filing of the present invention.

SUMMARY Embodiments of the present invention provide a deposition mask, a deposition mask frame assembly, and a method of manufacturing the same.

According to an aspect of the present invention, in a deposition mask for depositing a deposition material on a substrate for manufacturing a display device, a deposition pattern portion through which the deposition material passes, and a deposition pattern portion connected to the deposition pattern portion to support the deposition pattern portion and a rib portion, the deposition pattern portion, and a concave portion formed concavely to face the substrate, on the outside of the rib portion.

Another aspect of the present invention includes a frame and a deposition mask installed so that one surface is in contact with the frame and the other surface faces a substrate, wherein the deposition mask includes a deposition pattern portion through which the deposition material passes, and the deposition pattern Provided is a mask frame assembly for deposition, comprising: a rib part connected to the part to support the deposition pattern part; and a concave part concavely formed to face the substrate on the outside of the deposition pattern part and the rib part.

Also, by cutting the concave portion, an edge portion of the deposition mask may be removed.

In addition, a protrusion protruding from the bottom surface of the concave portion on the outside of the concave portion; may further include.

Also, a height of the protrusion may be smaller than a depth of the concave portion.

In addition, the frame may include a base portion and a support portion protruding from the base portion and having one surface in contact with the deposition mask.

In addition, the concave portion may be vertically aligned with the outer end of the support portion.

In addition, a welding part disposed between the concave part and the deposition pattern part to fix the frame and the deposition mask may be further included.

Another aspect of the present invention includes the steps of preparing a frame, and a deposition pattern part through which a deposition material passes; a rib part connected to the deposition pattern part to support the deposition pattern part; and a concave portion formed concavely so as to face the substrate outside the deposition pattern portion and the rib portion; There is provided a method of manufacturing a mask frame assembly for deposition, comprising the step of removing the edge portion of the deposition mask by cutting.

In addition, the step of removing the edge portion may be irradiated with a laser to the concave portion or cut the concave portion with a rotary cutter.

In addition, in the step of removing the edge portion, a protrusion protruding from a bottom surface of the concave portion may be formed while the concave portion is cut.

Also, a height of the protrusion may be smaller than a depth of the concave portion.

Also, a width of the concave portion may be smaller than a diameter of the laser spot.

The method may further include fixing the frame and the deposition mask by forming a welding part between the concave part and the deposition pattern part.

Other aspects, features and advantages other than those described above will become apparent from the following drawings, claims, and detailed description of the invention.

According to embodiments of the present invention, a deposition mask, a deposition mask frame assembly, and a method for manufacturing the same can precisely deposit a deposition material on a substrate by improving adhesion between the deposition mask and the substrate.

1 is an exploded perspective view illustrating a deposition mask frame assembly according to an embodiment of the present invention.
2 to 5 are cross-sectional views illustrating a method of manufacturing a deposition mask frame assembly according to an embodiment of the present invention.
FIG. 6 is a diagram illustrating an organic light emitting diode display manufactured using the deposition mask frame assembly shown in FIG. 1 .

Since the present invention can apply various transformations and can have various embodiments, specific embodiments are illustrated in the drawings and described in detail in the detailed description. Effects and features of the present invention, and a method of achieving them, will become apparent with reference to the embodiments described below in detail in conjunction with the drawings. However, the present invention is not limited to the embodiments disclosed below and may be implemented in various forms. In the following embodiments, terms such as first, second, etc. are used for the purpose of distinguishing one component from another, not in a limiting sense. Also, the singular expression includes the plural expression unless the context clearly dictates otherwise. In addition, terms such as include or have means that the features or components described in the specification are present, and do not preclude the possibility that one or more other features or components will be added.

In addition, in the drawings, the size of the components may be exaggerated or reduced for convenience of description. For example, since the size and thickness of each component shown in the drawings are arbitrarily indicated for convenience of description, the present invention is not necessarily limited to the illustrated bar. In addition, when certain embodiments are otherwise practicable, a specific process sequence may be performed differently from the described sequence. For example, two processes described in succession may be performed substantially simultaneously, or may be performed in an order opposite to the order described.

Hereinafter, embodiments of the present invention will be described in detail with reference to the accompanying drawings, and when described with reference to the drawings, the same or corresponding components are given the same reference numerals, and the overlapping description thereof will be omitted. .

1 is an exploded perspective view illustrating a deposition mask frame assembly according to an embodiment of the present invention.

Referring to FIG. 1 , a deposition mask frame assembly 10 may include a deposition mask 100 and a frame 200 . In addition, the deposition mask frame assembly 10 includes a welding part 140 so that one surface of the deposition mask 100 faces the frame 200 to fix the deposition mask 100 to the frame 200 . have. The welding part 140 may be formed between the deposition pattern part 110 and the concave part 130 . (See Fig. 4)

The deposition mask 100 may include a rib part 111 connecting the plurality of deposition pattern parts 110 and the deposition pattern part 110 and a concave part 130 formed outside the deposition pattern part 110 . can

The deposition pattern unit 110 is disposed to correspond to the opening 210 of the frame 200 , and forms a deposition pattern penetrating the deposition mask 100 . The deposition material passing through the deposition pattern may be deposited on the substrate. That is, in the deposition pattern unit 110 , the deposition material passes through the deposition mask 100 and is deposited on the substrate to define a deposition area on the substrate.

The deposition pattern unit 110 is illustrated as having a masking pattern in the form of a plurality of dots. However, the present invention is not limited thereto, and those skilled in the art will understand that various modifications are possible. That is, the deposition pattern unit 110 may be provided with a masking pattern that maintains the front open state or may be provided with a dot-shaped masking pattern. The number, arrangement position, and shape of the deposition pattern units 110 shown in FIG. 1 are merely examples, and the present invention is not limited thereto.

The deposition mask 100 may be formed as a single large member and coupled to the frame 200 . In addition, in order to divide the weight of the deposition mask 100 , a plurality of stick-type masks may be formed. However, hereinafter, for convenience of explanation, the mask 100 for deposition in the shape of a ledger will be mainly described.

The rib part 111 may be connected to the deposition pattern part 110 to support the deposition pattern part 110 . The rib part 111 is disposed between one deposition pattern part and another deposition pattern part adjacent thereto to connect the deposition pattern part 110 . In addition, the rib portion 111 is supported by a supporter (not shown) connected to each support portion of the frame 200 to effectively distribute the weight of the deposition mask 100 .

The concave portion 130 may be concavely formed on the outer side of the deposition pattern portion 110 and the rib portion 111 , on the other surface that is disposed to face the substrate outward. The concave portion 130 is formed on the outside of the deposition mask 100 to partition a deposition region fixed to the frame 200 and a surplus region that is cut and removed from the deposition mask 100 . can After the deposition mask 100 is fixed to the frame 200 , it is necessary to remove an excess region that is an edge of the deposition mask 100 so that the deposition mask 100 fits the frame 200 . In this case, the operator may cut the deposition mask 100 along the concave portion 130 .

A protrusion 131 may be formed on the outside of the concave portion 130 along the concave portion 130 . The height T1 of the protrusion 131 may be formed to be smaller than the depth T0 of the concave portion 130 . When the deposition mask 100 is cut along the concave portion 130 , protrusions 131 may be formed along the concave portion 130 . That is, when the concave portion 130 is cut, a burr is generated along the cut surface, and a protrusion formed to protrude from the bottom surface of the concave portion 130 may be formed (see FIG. 5 ).

The width of the concave portion 130 may be formed to be larger than the diameter of the spot of the laser irradiated to the deposition mask 100 . The laser spot is aligned on the bottom surface of the concave portion 130 to prevent deformation in areas other than the concave portion 130 when the deposition mask 100 is cut. In addition, the width of the concave portion 130 may be formed to be larger than the size of the rotary cutter in contact with the deposition mask 100 . The rotary cutter is aligned with the bottom surface of the concave portion 130 to prevent deformation in areas other than the concave portion 130 when the deposition mask 100 is cut.

The frame 200 may be coupled to the deposition mask 100 to support the deposition mask 100 . The frame 200 may include an opening 210 through which a deposition material may pass and a support portion formed outside the opening 210 . The frame 200 may be made of metal or synthetic resin, and is formed to have one or more openings 210 in a rectangular shape, but the idea of one embodiment is not limited thereto, and may be formed in various shapes such as a circle or a hexagon. can

The plurality of support parts face each other along the X direction, the first support part 201 and the second support part 202 are arranged in parallel along the Y direction, face each other along the Y direction, and are arranged in parallel along the X direction and a third support portion 203 and a fourth support portion 204 . The first support part 201 , the second support part 202 , the third support part 203 , and the fourth support part 204 are rectangular frames connected to each other.

The plurality of support parts may be connected to the base part 211 . The opening 210 may be formed inside the base portion 211 and the outside may be formed to be larger than the plurality of support portions to protrude outward. That is, the plurality of support portions are formed to protrude from the base portion 211 so that the plurality of support portions and the base portion 211 form a step on the outside. The stepped surface is not limited to a specific shape and shape, but hereinafter, for convenience of description, a case having an inclination will be mainly described.

The plurality of support portions are coupled to be in contact with the deposition mask 100 . The inner portion of the concave portion 130 of the deposition mask 100 is aligned to be in contact with the first support portion 201 to the fourth support portion 204 . The concave portion 130 may be vertically aligned with the outer end of the first support portion 201 to the fourth support portion 204 . When the deposition mask 100 is cut, the frame 200 may be deformed by over-cutting the concave portion 130 . The first support part 201 and the fourth support part 204 form a space between the base part and the deposition mask 100 to form an extra space for a laser or a rotary cutter when cutting the deposition mask 100 . Deformation of the frame 200 can be minimized.

2 to 5 are cross-sectional views illustrating a method of manufacturing the deposition mask frame assembly 10 according to an embodiment of the present invention.

2 to 5 , the method of manufacturing the deposition mask frame assembly 10 includes the steps of preparing the frame 200 , preparing the deposition mask 100 , and forming the deposition mask 100 into the frame 200 . ) and removing the edge portion 120 of the deposition mask 100 . Since the step of preparing the frame and the step of preparing the mask for deposition are steps of manufacturing the frame and the mask for deposition described above, descriptions thereof will be omitted or abbreviated.

Referring to FIG. 2 , the deposition mask 100 may be installed to be in contact with a plurality of support portions of the frame 200 . The concave portion 130 may be vertically aligned with the ends of the plurality of support portions. The concave portion 130 may be installed outside the first support portion 201 to the fourth support portion 204 , and then the concave portion 130 may be cut to remove an excess region of the deposition mask 100 .

Referring to FIG. 3 , the deposition mask 100 may be fixed to the frame 200 by a welding process. After aligning the deposition mask 100 to the frame 200 , the deposition mask 100 may be fixed to the frame 200 by welding between the concave portion 130 and the deposition pattern portion 110 .

The step of removing the edge portion 120 of the deposition mask 100 will be reviewed with reference to FIGS. 4 and 5 . The edge portion 120 that is the excess area may be removed by cutting the concave portion 130 . In order to compactly manufacture the deposition mask frame assembly 10 , it is necessary to reduce the size by removing the edge portion 120 of the deposition mask 100 .

After the deposition mask 100 is fixed to the frame 200 , the laser 5 may be irradiated to the concave portion 130 or the concave portion 130 may be cut with a rotary cutter. When the concave portion 130 is cut, a burr is generated along the cut surface to form a protrusion 131 formed to protrude from the bottom surface of the concave portion 130 . That is, the protrusion 131 is formed along the concave portion 130 on the outside of the concave portion 130 , and protrudes from the bottom surface of the concave portion 130 . The height T1 of the protrusion 131 may be formed to be smaller than the depth T0 of the concave portion 130 . The concave portion 130 has a depth of T0 on the surface of the deposition mask 100 , and the protrusion 131 has a length of T1 on the bottom surface of the concave portion 130 .

The width of the concave portion 130 may be greater than a diameter of a spot of the laser 5 irradiated to the deposition mask 100 . The spot of the laser 5 is aligned on the bottom of the concave portion 130 to prevent deformation in areas other than the concave portion 130 when the deposition mask 100 is cut. In addition, the width of the concave portion 130 may be formed to be larger than the size of the rotary cutter in contact with the deposition mask 100 . The rotary cutter is aligned with the bottom surface of the concave portion 130 to prevent deformation in areas other than the concave portion 130 when the deposition mask 100 is cut.

The width of the concave portion 130 may be greater than a diameter of a spot of the laser 5 irradiated to the deposition mask 100 . The spot of the laser 5 is aligned on the bottom of the concave portion 130 to prevent deformation in areas other than the concave portion 130 when the deposition mask 100 is cut. In addition, the width of the concave portion 130 may be formed to be larger than the size of the rotary cutter in contact with the deposition mask 100 . The rotary cutter is aligned with the bottom surface of the concave portion 130 to prevent deformation in areas other than the concave portion 130 when the deposition mask 100 is cut.

The concave portion 130 is vertically aligned with the outer end of the first support portion 201 to the fourth support portion 204 . A space is formed between the deposition mask 100 and the frame 200 by the step formed in the frame 200 . When the deposition mask 100 is cut, a free space is formed in which the laser 5 or the rotary cutter can operate, thereby causing deformation in the frame 200 . That is, the first support part 201 and the fourth support part 204 form a space between the base part and the deposition mask 100 , and when cutting the deposition mask 100 , the laser 5 or the rotary cutter Deformation of the frame 200 can be minimized by forming a free space.

As the size of the display device increases, the size of the deposition mask 100 is also increased. Accordingly, it is important to downsize the deposition mask frame assembly 10 to improve space utilization of the deposition process and to increase deposition efficiency. In order to manufacture a compact deposition mask frame assembly, an excess region of the deposition mask may be removed, and in this case, a bur may be formed on the cut surface.

Since the bur is formed to protrude from the surface of the deposition mask, adhesion between the deposition mask and the substrate is deteriorated. In detail, one surface of the deposition mask frame assembly is in close contact with the substrate, and the deposition material passing through the deposition mask is deposited on the substrate. When a gap is formed between the substrate and the deposition mask, a shadow effect in which dense deposition is formed may be induced. Due to such a shadow phenomenon, the productivity of display products and the accuracy of pixels may be deteriorated.

In order to overcome this, a process of removing burs formed on the deposition mask is required, and this additional process may result in a decrease in production efficiency and an increase in production cost.

When manufacturing the mask frame assembly 10 for deposition according to an embodiment of the present invention, the edge portion 120 that is an excess region is removed along the concave portion 130 . A protrusion protruding along the bottom surface of the concave portion 130 may be formed on the cut surface of the deposition mask 100 . Since the height T1 of the protrusion 131 is smaller than the depth T0 of the concave portion 130 , it does not protrude from the surface of the deposition mask 100 . That is, a precise deposition process can be performed by minimizing the gap between the deposition mask frame assembly 10 and the substrate to improve adhesion.

In addition, it is possible to improve the efficiency of the deposition process by minimizing scratches or deformation of the substrate that may occur due to the contact between the deposition mask frame assembly 10 and the substrate.

In addition, the frame 200 is formed to be stepped, and the concave portion 130 is formed at the outer end of the step, so that the cutting process of the rim portion 120, which is an excess area, can be efficiently performed without deformation of the frame.

FIG. 6 is a diagram illustrating an organic light emitting diode display 300 manufactured using the deposition mask frame assembly shown in FIG. 1 .

Referring to FIG. 6 , a substrate 311 is provided in the organic light emitting display device 300 . The substrate 311 includes an insulating material having flexibility. For example, the substrate 311 may be a glass substrate. In addition, the substrate 311 is made of polyimide (PI), polycarbonate (PC), polyethersulphone (PES), polyethylene terephthalate (PET), or polyethylene naphthalate (PES). It may be made of a polymer material such as polyethylenenaphthalate, PEN), polyarylate (PAR), or fiber glass reinforced plastic (FRP). The substrate 311 may be transparent, translucent, or opaque.

A barrier layer 312 may be formed on the substrate 311 . The barrier layer 312 may be formed to entirely cover the upper surface of the substrate 311 . The barrier layer 312 may include an inorganic layer or an organic layer. The barrier layer 312 may be formed as a single layer or may be stacked as a multilayer layer. For example, the barrier film 312 is an inorganic material such as silicon oxide (SiOx), silicon nitride (SiNx), silicon oxynitride (SiON), aluminum oxide (AlO), aluminum nitride (AlON), acrylic, It may be made of at least one selected from organic materials such as polyimide and polyester.

The barrier layer 312 blocks oxygen and moisture, prevents diffusion of moisture or impurities through the substrate 311 , and provides a flat surface on the substrate 311 . A thin film transistor (TFT) may be formed on the barrier layer 312 . Although the thin film transistor according to an embodiment of the present invention is exemplified by a top gate type thin film transistor, it goes without saying that a thin film transistor having a different structure such as a bottom gate type may be provided.

A semiconductor active layer 313 may be formed on the barrier layer 312 . A source region 314 and a drain region 315 may be formed in the semiconductor active layer 313 by doping with N-type or P-type impurity ions. A region between the source region 314 and the drain region 315 is a channel region 316 that is not doped with impurities.

When the semiconductor active layer 313 is formed of polysilicon, amorphous silicon may be formed, and the semiconductor active layer 313 may be changed to polysilicon by crystallizing it. Also, the semiconductor active layer 313 may be formed of an oxide semiconductor. For example, the oxide semiconductor is a group 4, 12, 13, 14 metal such as zinc (Zn), indium (In), gallium (Ga), tin (Sn), cadmium (Cd), germanium (Ge), hafnium (Hf) oxides of materials selected from elements and combinations thereof.

A gate insulating layer 317 may be deposited on the semiconductor active layer 313 . The gate insulating film 317 includes an inorganic film such as silicon oxide, silicon nitride, or metal oxide. The gate insulating layer 317 may have a single layer or a multilayer structure.

A gate electrode 318 may be formed in a predetermined region on the gate insulating layer 317 . The gate electrode 318 may include a single layer such as Au, Ag, Cu, Ni, Pt, Pd, Al, Mo, Cr, or a multilayer layer, or an alloy such as Al:Nd or Mo:W.

An interlayer insulating layer 319 may be formed on the gate electrode 318 . The interlayer insulating layer 319 may be formed of an insulating material such as silicon oxide or silicon nitride. Also, the interlayer insulating layer 319 may be formed of an insulating organic layer.

A source electrode 320 and a drain electrode 321 may be formed on the interlayer insulating layer 319 . Specifically, a contact hole is formed in the gate insulating layer 317 and the interlayer insulating layer 319 by removing some of them, and the source electrode 320 is electrically connected to the source region 314 through the contact hole. , the drain electrode 321 may be electrically connected to the drain region 315 .

A passivation layer 322 may be formed on the source electrode 320 and the drain electrode 321 . The passivation layer 322 may be formed of an inorganic layer such as silicon oxide or silicon nitride, or an organic layer.

A planarization layer 323 may be formed on the passivation layer 322 . The planarization layer 323 includes an organic layer such as acryl, polyimide, or benzocyclobutene (BCB).

An organic light emitting diode (OLED) may be formed on the thin film transistor. The organic light emitting diode OLED includes a first electrode 325 , a second electrode 327 , and an intermediate layer 326 interposed between the first electrode 325 and the second electrode 327 .

The first electrode 325 is electrically connected to one of the source electrode 320 and the drain electrode 321 through a contact hole. The first electrode 325 corresponds to the pixel electrode.

The first electrode 325 functions as an anode and may be formed of various conductive materials. The first electrode 325 may be formed of a transparent electrode or a reflective electrode.

For example, when the first electrode 325 is used as a transparent electrode, the first electrode 325 includes ITO, IZO, ZnO, In ₂ O ₃ , and the like. When the first electrode 325 is used as a reflective electrode, the first electrode 325 forms a reflective film with Ag, Mg, Al, Pt, Pd, Au, Ni, Nd, Ir, Cr, and a compound thereof. Thereafter, ITO, IZO, ZnO, In ₂ O ₃ and the like may be formed on the reflective layer.

A pixel defining layer (PDL) 324 may be formed on the planarization layer 323 to cover the edge of the first electrode 325 of the organic light emitting device. The pixel defining layer 324 surrounds the edge of the first electrode 325 to define a light emitting area of each sub-pixel.

The pixel defining layer 324 is formed of an organic material or an inorganic material. For example, the pixel defining layer 324 may be formed of an organic material such as polyimide, polyamide, benzocyclobutene, an acrylic resin, or a phenol resin, or an inorganic material such as SiNx. The pixel defining layer 324 may be formed as a single layer or as a multilayer.

An intermediate layer 326 may be formed on the first electrode 325 in a region exposed by etching a portion of the pixel defining layer 324 . The intermediate layer 326 may be formed by a deposition process.

The intermediate layer 326 may be formed of a low molecular weight organic material or a high molecular weight organic material. The intermediate layer 326 may include an organic emission layer (EML). As another optional example, the intermediate layer 326 includes an organic light emitting layer, and, in addition, a hole injection layer (HIL), a hole transport layer (HTL), and an electron transport layer (ETL). , may further include at least one of an electron injection layer (EIL). In one embodiment of the present invention, the present invention is not limited thereto, and the intermediate layer 326 includes an organic light emitting layer and may further include various other functional layers.

A second electrode 327 may be formed on the intermediate layer 326 . The second electrode 327 corresponds to the common electrode. Like the first electrode 325 , the second electrode 327 may be formed of a transparent electrode or a reflective electrode.

The first electrode 325 may be a transparent electrode or a shape corresponding to the opening of each sub-pixel when formed as a reflective electrode. On the other hand, the second electrode 327 may be a transparent electrode or a reflective electrode may be deposited over the entire surface of the display unit. Alternatively, of course, the second electrode 327 may be formed in a specific pattern instead of the entire surface deposition. It goes without saying that the first electrode 325 and the second electrode 327 may be stacked with positions opposite to each other.

Meanwhile, the first electrode 325 and the second electrode 327 are insulated from each other by the intermediate layer 326 . When a voltage is applied to the first electrode 325 and the second electrode 327 , visible light is emitted from the intermediate layer 326 to form an image recognizable by a user.

An encapsulation portion 340 may be formed on an upper portion of the organic light emitting diode. The sealing part 340 is formed to protect the intermediate layer 326 and other thin films from external moisture or oxygen.

The sealing part 340 may have a structure in which at least one organic layer or an inorganic layer is stacked, respectively. For example, the sealing part 340 includes at least one organic layer 341 and 342 such as epoxy, polyimide, polyethylene terephthalate, polycarbonate, polyethylene, polyacrylate, etc., and silicon oxide (SiO ₂ ), silicon nitride ( SiNx), aluminum oxide (Al ₂ O ₃ ), titanium oxide (TiO ₂ ), zirconium oxide (ZrOx), zinc oxide (ZnO), such as at least one inorganic layer (343, 344, 345), such as a stacked structure have.

The sealing unit 340 may have at least one organic layer 341 and 342 and at least two inorganic layers 343 , 344 and 345 . The uppermost layer 345 exposed to the outside of the sealing part 340 may be formed of an inorganic layer to prevent moisture permeation to the organic light emitting diode.

As described above, the present invention has been described with reference to one embodiment shown in the drawings, but this is merely exemplary, and those skilled in the art will understand that various modifications and variations of the embodiments are possible therefrom. Accordingly, the true technical protection scope of the present invention should be determined by the technical spirit of the appended claims.

10: mask frame assembly for deposition
100: mask for deposition
110: deposition pattern unit
111: rib part
120: border
130: concave
131: turn
140: weld
200: frame
201: first support
202: second support
203: third support part
204: support
210: opening
211: base part

Claims (14)

delete frame; and
a deposition mask disposed such that one surface is in contact with the frame and the other surface faces outward;
Including, the deposition mask,
a deposition pattern part through which the deposition material can pass;
a rib part connected to the deposition pattern part to support the deposition pattern part;
a concave portion positioned outside the deposition pattern portion and the rib portion and positioned on the other surface; and
a protrusion protruding from the bottom surface of the concave portion;
A mask frame assembly for deposition comprising a. 3. The method of claim 2,
and an edge portion of the deposition mask is removed by cutting the concave portion. delete 3. The method of claim 2,
The height of the protrusion is smaller than the depth of the concave portion, the deposition mask frame assembly. 3. The method of claim 2,
The frame is
base part; and
a support part protruding from the base part and having one surface in contact with the deposition mask;
A mask frame assembly for deposition comprising a. 7. The method of claim 6,
The concave portion is vertically aligned with the outer end of the support portion, the deposition mask frame assembly. 3. The method of claim 2,
and a welding part disposed between the concave part and the deposition pattern part to fix the frame and the deposition mask. preparing the frame;
A deposition pattern portion having one surface and the other surface, through which a deposition material can pass, a rib portion connected to the deposition pattern portion to support the deposition pattern portion, and the deposition pattern portion and located outside the rib portion and on the other surface preparing a deposition mask having a recessed portion positioned thereon;
arranging and arranging one side of the deposition mask on the frame to face; and
removing the edge of the deposition mask by cutting the recess, and removing the edge while the recess is cut and a protrusion protruding from the bottom of the recess is formed;
A method of manufacturing a mask frame assembly for deposition, comprising: 10. The method of claim 9,
The step of removing the edge portion,
A method of manufacturing a mask frame assembly for deposition, wherein the edge is removed by irradiating a laser to the recess or cutting the recess with a rotary cutter. delete 10. The method of claim 9,
The height of the protrusion is smaller than the depth of the concave portion, the method of manufacturing a mask frame assembly for deposition. 11. The method of claim 10,
A width of the concave portion is smaller than a diameter of a spot of the laser, a method of manufacturing a mask frame assembly for deposition. 10. The method of claim 9,
Forming a welding portion between the concave portion and the deposition pattern portion to fix the frame and the deposition mask; further comprising a method of manufacturing a mask frame assembly for deposition.

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