KR102324290B1 - Anti-glare glass using silk screen mesh patterns and manufacturing method thereof - Google Patents

Abstract

The present invention relates to a diffuse reflection glass substrate and a method for manufacturing the same, and a fine mesh pattern having holes penetrating the substrate such as a silk screen mask on the glass substrate is used as a mask to make a photosensitive thin film pattern. Thereafter, the present invention relates to a diffusely reflective substrate manufactured by transferring a mask pattern to an arbitrary substrate such as glass, metal, or polymer through an etching process, and a method for manufacturing the same. On the surface of the diffusely reflective substrate developed by the present invention, it is possible to implement a desired diffused reflection function by various regular patterning. This is very creative and progressive as it is clearly distinguished from the technique using the boundary etching process of the material surface that exists in very irregular sizes or the conventional diffuse reflection glass manufacturing technique using fine particles as a mask. Through the present invention, it is determined that in the future, diffuse reflection substrates using more various types of regular patterns can be conveniently made and more environmentally friendly. In addition, it is expected that it will be able to cope with quality control based on large-area automation more efficiently, greatly contributing to the improvement of diffuse reflection substrate manufacturing efficiency.

Description

Diffuse reflection glass substrate using silk screen mesh pattern and manufacturing method thereof {Anti-glare glass using silk screen mesh patterns and manufacturing method thereof}

The present invention relates to a diffusely reflective glass substrate and a method for manufacturing the same, and more specifically, a photosensitive thin film pattern is made on a glass substrate by using a silk screen itself as a mask material, and then the mask pattern is transferred to the glass substrate through an etching process. It relates to a diffusely reflective glass substrate having a regular diffused reflection pattern produced by the technology and a method for manufacturing the same.

The anti-glare glass substrate is a special glass used as a window to reduce the reflection of incident light in products such as electronic blackboards, electronic signage displays, and kiosks. Techniques for manufacturing diffuse reflection glass using irregular pattern wet etching have already been described in detail in US Patents US 4,944,986, US 5,120,605, US 6,929,861, and the like.

To explain the technology, in general, after washing the surface of specially manufactured soda-lime glass, it is immersed in a solution containing a hydrofluoric acid mixture, or by spraying an aqueous hydrofluoric acid mixture solution on the surface of amorphous glass materials in various sizes. The fine interface (boundary) is selectively etched. Then, the interface with dense line defects reacts faster than the amorphous glass surface, resulting in deeper and more etched.

As a result, when an incident ray is incident on an interface, irregular reflection or diffuse reflection of the light at a very irregular interface occurs. Glass made to reduce the reflectivity of incident light using this principle is called sine glass or anti-glare glass. Another diffuse reflection glass manufacturing method is described in detail in US Patent Application Pub.

However, according to the conventional case, _{by using a method of selectively etching only the boundary of the glass by mixing HF, NH 4} F, etc., the diffuse reflection glass properties are largely dependent on the size and shape of the boundary inherent in the glass. do. Accordingly, a lot of wet process time may be required, and the glass is also limited to a specific glass suitable for boundary characteristics, so the price is relatively high and the process is also very sensitive and inconvenient.

In addition, the boundary of the glass etched with the conventional hydrofluoric acid mixture is very irregular, and the density of fine defects is concentrated on the boundary, so if there is insufficient cleaning and even a small amount of contaminants remains, the energy required for the reaction is very low. It has been the main cause of product defects due to the chemical reaction of the surface state of diffuse reflection glass.

In addition, the wet etching technique after application of such fine particles is not easy to apply to large-area glass, and has many technical limitations when the uniformity of substrate etching is important.

US Patent No. 4,944,986

The present invention was developed to solve the above problems, and it is an object of the present invention to provide a diffusely reflective glass substrate through regular pattern etching, which was not possible with techniques using irregular boundary etching or a fine particle mask, and a method for manufacturing the same. .

Another object of the present invention is to provide a diffuse reflection substrate having regular fine patterning having an arbitrary size and shape desired by a manufacturer, and a method for manufacturing the same, rather than an irregularly sized interface etching technique.

By using the present invention as described above, those skilled in the art can easily make any substrate that reflects incident light, such as a polymer substrate or a metal substrate, into a diffuse reflection substrate by simply changing the substrate, as well as the substrate described here as an example.

In addition, the diffuse reflection glass surface developed by the present invention can implement the desired diffuse reflection function by various regular patterning, so it can be clearly distinguished from the conventional diffuse reflection glass manufacturing technique based on the boundary etching process in which the size is very irregular. , through the present invention, it is expected that in the future, not only diffusely reflective glass substrates having more various types of patterns, but also diffusely reflective substrates of various materials can be conveniently made, thereby greatly contributing to the development of the diffuse reflective substrate manufacturing industry.

In order to solve the problems of the above-mentioned irregular boundary etching or the diffuse reflection glass manufacturing method by applying fine particles, the present invention developed a diffuse reflection substrate using a regular fine pattern and a manufacturing method thereof from a very original point of view.

In the present invention, in a glass substrate for diffuse reflection of light incident from the outside, a diffuse reflection pattern in which the shape, size or arrangement is regularly displayed on one or both sides of the substrate by using the silk screen itself on which a fine mesh pattern is formed as a mask. The diffuse reflection pattern is provided by controlling the shape or size of the fine mesh pattern of the mask, characterized in that it has various optical properties.

The diffuse reflection pattern may be embossed or engraved on one or both surfaces of the substrate.

Here, the diffuse reflection pattern is made of a combination of polygons, it is characterized in that a polygon of a certain shape is continuously and repeatedly formed around the central pattern formed in the central part of the unit cell.

In addition, although the substrate is mainly described with respect to a glass substrate capable of reflecting incident light, it may be formed of either a polymer substrate or a metal substrate.

On the other hand, in order to achieve the above object, in the present invention, a mask preparation step of preparing a mask in which a fine mesh pattern through which light partially passes is regularly formed, and a photosensitizer on a substrate to make a diffuse reflection substrate when the mask is prepared A photoresist film forming step of forming a thin film of a photosensitive agent by applying a thin layer, an exposure step of exposing the mask to ultraviolet light after contacting the substrate with a photosensitive agent applied thereto, and selectively removing the photosensitive agent on the substrate using a developer after exposure to the substrate A developing step of forming a regular micropattern of a photoresist film thereon, an etching step of transferring the regular micropattern on the substrate by etching the substrate having the micropattern of the photoresist film, and removing the photoresist film remaining on the substrate to which the micropattern is transferred There is provided a method for manufacturing a diffusely reflective glass substrate comprising: removing the photosensitive film;

Here, the mask may be formed of any one of a glass mask, a quartz mask, a polymer mask, a metal mask, a ceramic screen, and a silk screen.

Here, the fine mesh pattern of the metal or silk screen mask is characterized in that a mesh having a size of 30 to 600 is used.

In addition, in the etching step, dip etching in which the substrate having the photoresist micropattern is immersed in an etchant for a certain period of time, wet etching using chemicals in a spray method, or dry etching using etching gas, plasma, or ion beam Either method can be used.

Meanwhile, in the photosensitive film forming step, a photosensitive agent application method including spin coating, roll coating, bar coating, and dip coating may be used, or a photosensitive agent bonding method of bonding a photosensitive agent thin film to a substrate to form a photosensitive agent thin film may be used.

According to the present invention as described above, there is an effect that can form a regular diffuse reflection pattern on the glass substrate, which was not possible with a technique using an irregular boundary etching or a fine particle mask.

Also, it is possible to manufacture a diffusely reflective glass substrate having regular fine patterning having an arbitrary size and shape desired by a manufacturer, rather than an irregularly sized interface etching technique.

In addition, not only a glass substrate, but also a substrate made of any material that reflects incident light, such as a polymer substrate or a metal substrate, can be easily made into a diffuse reflection substrate.

In addition, the diffuse reflection glass surface developed by the present invention can implement the desired diffuse reflection function by various regular patterning, so it can be clearly distinguished from the conventional diffuse reflection glass manufacturing technique based on the boundary etching process in which the size is very irregular. , it is expected that, through the present invention, it will be possible to conveniently make various diffuse reflective substrates as well as diffuse reflective substrates having more various types of patterns in the future, thereby greatly contributing to the development of the diffuse reflective substrate manufacturing industry.

An aspect of the present invention is to provide a diffuse reflection function to an arbitrary glass substrate: 1) using a silk screen with a fine mesh pattern as a pattern mask, and 2) an optimized combination of depth, shape, and size of the pattern when the pattern is transferred It has the characteristic of imparting a diffuse reflection function by Therefore, it has the characteristic of using a silk screen mask, which is completely different from the glass or quartz mask mainly used for patterning for semiconductor manufacturing in the prior art, which has a completely different material and type of mask used for application. In addition, in that it is used without making any additional patterns on the silk screen itself, its application method is clearly distinguished from the silk screen-based photosensitizer mask used for patterns such as electronic circuit boards.

1 is a process diagram showing an embodiment of a method for manufacturing a diffuse reflection glass substrate according to the present invention.
2 is a flowchart illustrating a method of manufacturing a diffuse reflection substrate according to the present invention.
3 is a photograph of a diffusely reflective glass surface fabricated using a conventional boundary etching technique.
4 is a photograph of the surface of the diffusely reflective glass manufactured using the etching transfer technology of the silk screen mask micro-pattern according to the present invention (using a 250-neck screen mask).

In embodiments, articles of the present invention and methods of making, using, and using the present invention provide one or more desirable characteristics or aspects, including embodiments as discussed below. A feature or aspect recited in any of the claims is generally applicable to all aspects of the invention. A single or multiple feature or aspect recited in any one claim may be modified in any other claim or combination with any other recited feature or aspect in the claims. Specific details for carrying out the invention of a diffuse reflection substrate and a method for manufacturing the same will be described with reference to examples.

The present invention proposes a method for manufacturing a diffusely reflective glass substrate using a regular fine pattern from a very original point of view in order to solve the problems of the above-mentioned irregular boundary etching or the diffuse reflection glass manufacturing method by applying fine particles.

1 is a process diagram showing an embodiment of a method for manufacturing a diffusely reflective glass substrate according to the present invention, and FIG. 2 is a flowchart showing a method for manufacturing a diffusely reflective substrate according to the present invention. The diffuse reflection glass substrate manufacturing method of the present invention is largely, mask preparation Step S110, photoresist film forming step S120, exposure step S130, developing step S140, etching step S150, photoresist film removal step S160, and diffuse reflection pattern forming step S170 are performed.

In order to form a fine pattern for diffuse reflection of the present invention, in the mask preparation step (S110), a mask 10 in which a fine mesh pattern 12 through which light partially passes is regularly formed is prepared (FIG. 1(a)) ).

Here, as the mask 10, a quartz mask, a glass mask, a polymer mask, a metal mask, a ceramic screen, a silk screen, etc. used for semiconductor manufacturing may be used.

Specifically, the fine pattern 12 of the mask 10 may be used by forming a pattern on a quartz mask, a glass mask, or a film mask used in semiconductor manufacturing. However, in the present invention, there is no need for expensive process costs such as a quartz mask, and a silk screen mesh that has already been commercialized and has a fine pattern capable of shielding light is used.

An aspect of the present invention is to use a silk screen having a fine mesh pattern as a pattern mask in providing a diffuse reflection function to an arbitrary glass substrate, and diffuse reflection by an optimized combination of depth, shape, and size of the pattern when the pattern is transferred. It is characterized by giving a function.

Therefore, it has the characteristic of using a silk screen mask that is completely different from the glass or quartz mask mainly used for patterning for semiconductor manufacturing in the prior art, and it does not produce any additional patterns on the silk screen itself. In terms of use, the method of application is clearly distinguished from the silk screen-based photosensitizer mask used for patterns on electronic circuit boards.

Here, for the fine mesh pattern 12 of the mask 10, it is preferable to use a mesh having a size of 30 to 600 necks, and more specifically, a mask using a mesh or a pattern having a size of 100 to 400 necks is used. It is also possible to use

When the mask 10 is prepared, a thin film of photoresist 30 is formed by thinly coating a photosensitive agent on the substrate 20 to be made a diffuse reflection substrate (FIG. 1(c)).

In the present invention, the substrate 20 may be made of any one of a glass substrate, a polymer substrate, or a metal substrate capable of reflecting incident light.

In the step of forming the photosensitive film 30, a photosensitive agent application method including spin coating, roll coating, bar coating, and dip coating is used, or a photosensitive agent bonding method of bonding a photosensitive agent thin film to a substrate to form a photosensitive agent thin film can be used. .

Thereafter, after the mask 10 is brought into contact with the substrate on which the photosensitive agent is applied, an exposure step of irradiating ultraviolet rays is performed (FIG. 1(d)).

When ultraviolet rays are irradiated through the mask 10 , the light passing through the fine screen mesh pattern 12 of the mask 10 hits the photosensitive film 30 and is selectively exposed.

After exposure, the photoresist on the substrate is selectively removed using a developer to form a regular photoresist film fine pattern 32 on the substrate 20 (FIG. 1(e)).

Through such a development step, the exposed or unexposed portion in the exposure step is left behind to manufacture a photosensitizer thin film having a certain fine pattern on the glass substrate.

Thereafter, the substrate 20 having the photoresist micropattern 32 is etched to perform an etching step of transferring the regular micropattern 22 onto the substrate (FIG. 1(f)).

In the etching step, dip etching in which the substrate 20 having the photosensitive film micropattern 32 is immersed in the etchant 40 for a predetermined time, wet etching using chemicals in a spray method, or etching gas, plasma, Any one of dry etching methods using an ion beam may be used.

The etchant 40 may be, for example, a glass etchant such as Buffered Oxide Etching Solution, and is washed with distilled water after being immersed in the glass etchant for a certain period of time. Through the etching step of immersion in the etchant as described above, the fine pattern 22 can be regularly transferred to the surface of the substrate 20 .

After the photosensitive film remaining on the substrate 20 on which the fine pattern is transferred is removed using acetone, the substrate from which the photosensitive film is removed is washed with distilled water.

When each of these processes is passed in order, a certain fine pattern of the screen mesh is finally created through etching on the surface of the glass substrate. At this time, by controlling the size or shape of the pattern to be made, it is possible to conveniently manufacture diffused reflection glass having various optical properties.

The glass etchant used in the process technology developed through the present invention is safer and more environmentally friendly than the mixed etchant used in the conventional diffuse reflection glass manufacturing technology by irregular boundary etching. In addition, the manufactured diffuse reflection glass substrate also has a very regular pattern, so it is possible to automate the diffuse reflection defect inspection equipment and to cope with quality control more efficiently.

As shown in FIG. 4 , the diffuse reflection pattern 22 in which the shape, size, or arrangement is regularly displayed on the surface of the substrate 20 is formed in the diffuse reflection substrate manufactured by this manufacturing method. The pattern 22 may be embossed or engraved on one or both surfaces of the substrate.

Here, the diffuse reflection pattern 22 may be formed of a combination of polygons.

As shown in FIG. 4 , the diffuse reflection pattern 22 on the glass may be formed such that a polygon of a certain shape is continuously repeated around the central pattern formed in the central portion of the unit cell.

The diffuse reflection glass pattern can be adjusted by controlling the shape or size of the fine mesh pattern of the mask. That is, when the shape of the fine mesh pattern of the mask is square, the central pattern of the diffuse reflection pattern is formed in a square shape, and small polygons may be continuously and regularly arranged around it.

Therefore, in the present invention, by controlling the shape and size of the pattern, it is possible to manufacture a diffusely reflective glass substrate having various optical properties.

[Example]

In the diffuse reflection glass manufacturing process by the regular mask pattern according to the present invention, as shown in FIG. 1 , a mask 10 on which a fine mesh pattern 12 is formed is prepared. In this embodiment, a silk screen of 250 or 300 necks was cut to a size of 100x100㎟ to prepare a mask.

Thereafter, a photosensitizer (product name: QX601) was deposited on the soda lime substrate at 3,000 rpm to a thickness of 1 μm through spin coating. After that, the silk screen mask was placed on the substrate coated with the photosensitive agent, and after contacting it, ultraviolet rays were vertically irradiated for 5 minutes. Thereafter, the treated substrate was immersed in a photosensitizer developer (product name: AZ 400) for 15 seconds to remove the exposed photosensitizer thin film portion to prepare a photosensitizer micropattern on the glass.

The substrate was immersed in an etching solution (Buffered Oxide Etching Solution) for about 10 seconds to fabricate a fine pattern through glass surface etching. After the glass was etched and washed with distilled water, the thin film of the photosensitizer remained with acetone was removed.

Finally, the final washing was performed with distilled water to complete the fabrication of the diffuse reflection glass substrate.

<Result analysis>

3 is a photograph of the surface of the diffusely reflective glass manufactured using the conventional boundary etching technique, and FIG. 4 is a photograph of the surface of the diffusely reflective glass manufactured using the etching transfer technology of the silk screen mask fine pattern according to the present invention (250 items) screen mask)

Comparing them, the difference between the two process results can be clearly understood.

An example of the characteristics of the silk screen fine pattern diffuse reflection glass produced through the present invention is summarized in Table 1.

[Table 1] Characteristics of silk screen fine pattern diffused reflection glass produced through the present invention

sample number Screen size (neck) tint transmittance
(400-700 nm) (%) Gloss (at 60 degrees) One 110 89.5 86.68 149.0 2 180 78.8 80.07 91.2 3 250 77.7 72.60 71.7 4 300 93.5 85.69 33.4

The diffuse reflection glass surface developed by the present invention can realize the desired diffuse reflection function by various regular patterning, so it can be clearly distinguished from the conventional diffuse reflection glass manufacturing technique based on the boundary etching process in which the size is very irregular. Through the invention, it is expected that it will be possible to conveniently make various diffuse reflective substrates as well as diffuse reflective substrates having more various types of patterns in the future, thereby greatly contributing to the development of the diffuse reflective substrate manufacturing industry.

10: mask 12: fine mesh pattern
20: substrate 22: diffuse reflection pattern
30: photosensitive thin film 32: photosensitive film fine pattern
40: etchant

Claims (7)

delete delete delete A mask preparation step of preparing a silk screen mask in which a fine mesh pattern through which light partially passes is regularly formed;
When the mask is prepared, a photosensitive film forming step of forming a thin film of a photosensitive agent by thinly coating a photosensitive agent on a substrate to be made a diffuse reflection glass substrate;
an exposure step of exposing the mask to a substrate on which a photosensitive agent is applied and then exposing the mask to ultraviolet light for 5 minutes;
A developing step of forming a regular photoresist film pattern on the substrate by selectively removing the photosensitive agent on the substrate using a developer after exposure;
Dip etching in which the substrate having the photoresist micropattern is immersed in an etchant for a certain period of time, wet etching using chemicals as a spray method, or dry etching using etching gas, plasma, or ion beam. an etching step of transferring the regular fine pattern of the mask onto the substrate by etching the substrate having the photosensitive film fine pattern;
a photoresist film removal step of removing the photoresist film remaining on the glass substrate to which the fine pattern has been transferred; and
forming a regular diffuse reflection pattern on the surface of the substrate by washing the substrate from which the photosensitive film is removed with distilled water;
includes,
The diffuse reflection pattern is made of a combination of polygons, and a central pattern formed in the central part of the unit cell, and a polygon of a certain shape around the central pattern are continuously and repeatedly formed around the central pattern,
The fine mesh pattern of the mask is characterized by using a mesh having a size of 30 to 600 necks,
In the photosensitive film forming step, a photosensitive agent application method including spin coating, roll coating, bar coating, and dip coating is used, or a photosensitive agent bonding method in which a photosensitive agent thin film is formed by bonding a photosensitive agent thin film to a substrate is used.
The central pattern is characterized in that the width and length are 25.89㎛ and 27.68㎛, respectively, and the width and length of the polygon are 14.64㎛ and 5.24㎛, respectively,
The etching solution used in the etching step is characterized in that the etching step is performed for 10 seconds in a glass etching solution containing a Buffered Oxide Etching Solution,
It is characterized in that the photosensitizer is deposited to a thickness of 1 μm at 3,000 rpm by spin coating,
In the photoresist film removal step, the method for manufacturing a diffuse reflection glass substrate, characterized in that the exposed photoresist thin film portion is removed by immersing it in a photosensitive developer solution for 15 seconds. delete delete delete

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