KR102303464B1 - Manufacturing method of patterned wire substrate and manufacturing method of solar cell module - Google Patents

Abstract

The present invention relates to a method for manufacturing a wiring board and a method for manufacturing a solar cell module.
A method of manufacturing a wiring board according to an example of the present invention includes the steps of applying an adhesive layer to one surface of an insulating member and adhering a metal foil layer; and patterning the metal foil layer.
A method of manufacturing a solar cell module according to an example of the present invention includes: applying a conductive adhesive to the rear surfaces of a plurality of first and second electrodes provided on the rear surface of a semiconductor substrate; a disposing step of disposing the insulating member of the above-described wiring board on rear surfaces of the plurality of first and second electrodes; heat-treating the conductive adhesive to connect the plurality of first and second conductive wirings and the plurality of first and second electrodes; and a peeling step of selectively etching the adhesive layer to peel the insulating member.
In addition, another example of the present invention comprises the steps of applying a conductive adhesive to the plurality of first and second electrodes provided on the semiconductor substrate; disposing and connecting a metal foil layer to the rear surfaces of the plurality of first and second electrodes; and selectively etching the metal foil layer to form a plurality of first and second conductive wirings.

Description

The manufacturing method of a wiring board and the manufacturing method of a solar cell module TECHNICAL FIELD

The present invention relates to a method for manufacturing a wiring board and a method for manufacturing a solar cell module.

A typical solar cell includes a substrate and an emitter made of semiconductors of different conductive types, such as p-type and n-type, and electrodes connected to the substrate and the emitter, respectively. At this time, a p-n junction is formed at the interface between the substrate and the emitter part.

As such, a solar cell using a semiconductor substrate can be divided into various types, such as a conventional type and a rear contact type, depending on the structure.

Here, in the conventional type, the emitter unit is located on the front side of the substrate, the electrode connected to the emitter unit is located on the front side of the substrate, and the electrode connected to the substrate is located on the back side of the substrate, and in the rear contact type, the emitter unit is located on the back side of the substrate. and the electrodes are all located on the back side of the substrate.

Here, since all electrodes of the rear contact type solar cell are formed on the rear surface of the substrate, the electrodes formed on the rear surface of the substrate are connected in series to the electrodes of adjacent solar cells through an interconnector or a separate conductive metal to form a solar cell module. can

An object of the present invention is to provide a method for manufacturing a wiring board and a method for manufacturing a solar cell module in which the manufacturing process is easier.

A method of manufacturing a wiring board according to an exemplary embodiment of the present invention includes an adhesion step of applying an adhesive layer to one surface of an insulating member and adhering a metal foil layer to the adhesive layer; and a patterning step of forming a plurality of first and second conductive wirings by patterning the metal foil layer.

Here, in the patterning step, a plurality of first and second conductive wires may be formed by selectively etching the metal foil layer with a metal etchant, or a plurality of first and second conductive wires may be formed by mechanically etching a portion of the metal foil layer. .

Here, the method of selectively etching the metal foil layer with a metal etching solution includes the steps of forming an etch stop layer on the metal foil layer by patterning; and etching the remaining portions of the metal foil layer except for the portion on which the etch stop layer is formed with a metal etchant.

Here, the metal etchant may etch only the metal, and may not etch the etch stop layer or the adhesive layer.

In this case, the metal foil layer may have a thickness of 5 μm to 300 μm, and the metal foil layer may include at least one of Cu, Al, Ni, or Sn.

In addition, in the method for manufacturing a solar cell module according to an example of the present invention, in a solar cell in which a plurality of first electrodes and a plurality of second electrodes are formed in parallel with each other on a rear surface of a semiconductor substrate, conductive surfaces are provided on the rear surfaces of the plurality of first and second electrodes. applying an adhesive; a disposing step of disposing an insulating member of a wiring board manufactured according to the above-described manufacturing method on rear surfaces of the plurality of first and second electrodes to which a conductive adhesive is applied; heat-treating the conductive adhesive to connect each of the plurality of first and second conductive wires to each of the plurality of first and second electrodes; and a peeling step of peeling the insulating member from the plurality of first and second conductive wirings by selectively etching the adhesive layer after the connection step.

In the peeling step here, the adhesive layer may be etched by an adhesive layer etchant that selectively reacts only with the adhesive layer, and the insulating member may be separated from the plurality of first and second conductive wirings.

In this case, the adhesive layer includes an epoxy resin series or a silicone resin series, and the adhesive layer etching solution may include any one of a KOH aqueous solution, an NaOH aqueous solution, or a TMAH (Tetramethyl ammounium hydroxide) aqueous solution.

In addition, the heat treatment temperature of the connection step may be between 80 ℃ ~ 300 ℃.

The method may further include, before the disposing step, an insulating layer application step of applying an insulating layer to a portion on the rear surface of the semiconductor substrate to which a conductive adhesive is not applied.

In addition, in the insulating member disposing step, the plurality of first and second conductive wirings are arranged so that the longitudinal direction intersects the longitudinal directions of the plurality of first and second electrodes, or the plurality of first and second conductive wirings are arranged in the longitudinal direction and the plurality of The longitudinal directions of the first and second electrodes may be disposed to overlap each other in the same direction.

In addition, the method of manufacturing a solar cell module according to another example of the present invention includes a conductive adhesive application step of applying a conductive adhesive to a plurality of first and second electrodes provided on the rear surface of a semiconductor substrate; A metal foil layer connecting step of disposing a metal foil layer on the rear surfaces of the plurality of first and second electrodes coated with a conductive adhesive and then heat-treating them to connect; and a wiring forming step of selectively etching the metal foil layer to form a plurality of first and second conductive wirings.

Here, in the wiring forming step, a portion of the metal foil layer connected to the plurality of first and second electrodes is selectively etched using a metal etchant to form a plurality of first and second conductive wires, or to the plurality of first and second electrodes. A plurality of first and second conductive wirings may be formed by mechanically etching a portion of the connected metal foil layer.

Here, the method of selectively etching a portion of the metal foil layer using a metal etching solution includes the steps of forming an etch stop layer by patterning on the metal foil layer connected to the plurality of first and second electrodes; and selectively etching the remaining portion of the metal foil layer except for the portion on which the etch stop layer is formed with a metal etchant.

In addition, the method of mechanically etching a portion of the metal foil layer may be performed using laser beam irradiation equipment, drill equipment, or cutting equipment.

As described above, according to the present invention, a method of manufacturing a wiring board or a solar cell module can be more simplified by using a metal foil layer, and a manufacturing time can be further shortened.

1 to 8 are diagrams for explaining a solar cell module according to a first embodiment of the present invention.
9 to 10 are diagrams for explaining a solar cell module according to a second embodiment of the present invention.
11 is a flowchart for explaining an example of a method of manufacturing a solar cell module according to an example of the present invention.
12 to 15 are diagrams for explaining a method of manufacturing the first embodiment of the solar cell module described above according to the manufacturing method described in FIG. 11 .
16 to 19 are diagrams for explaining a method of manufacturing the second embodiment of the solar cell module described above according to the manufacturing method described in FIG. 11 .
20 and 21 are diagrams for explaining an example of a method of manufacturing a wiring board 300 applied to a method of manufacturing a solar cell module.
22 and 23 are diagrams for explaining a method of manufacturing a solar cell module according to another example of the present invention.

Hereinafter, with reference to the accompanying drawings, the embodiments of the present invention will be described in detail so that those of ordinary skill in the art to which the present invention pertains can easily implement them. However, the present invention may be embodied in various various forms and is not limited to the embodiments described herein. And in order to clearly explain the present invention in the drawings, parts irrelevant to the description are omitted, and similar reference numerals are given to similar parts throughout the specification.

Hereinafter, the front surface may be one surface of the semiconductor substrate on which direct light is incident, and the rear surface may be the opposite surface of the semiconductor substrate on which direct light is not incident or reflected light other than direct light is incident.

Hereinafter, an example of a solar cell module manufactured according to the manufacturing method of the present invention will be described with reference to the accompanying drawings.

1 to 8 are diagrams for explaining a solar cell module according to a first embodiment of the present invention.

Here, FIG. 1 is a view from above when a plurality of solar cells included in a solar cell module are connected to an interconnector (IC), and FIG. 2 is a cross-section of area A in the first direction (x) in FIG. 1 . did it

1 and 2 , the solar cell module according to the first embodiment of the present invention includes a plurality of solar cells having first and second electrodes C141 and C142 on the rear surface of the semiconductor substrate 110 ( It may include C1 and C2, first and second conductive wirings EC1 and EC2 connected to the first and second electrodes C141 and C142 through a conductive adhesive CA, and an interconnector IC.

Here, in each of the first and second solar cells C1 and C2 , the first and second conductive wires EC1 and EC2 are connected to the first and second electrodes C141 and C142 provided on the rear surface of the semiconductor substrate 110 with a conductive adhesive. The first and second solar cells C1 and C2 formed of such one integrated individual device may be connected through CA to form one integrated individual device, and the first and second conductive wirings EC1, The interconnector IC may be connected to EC2 and may be serially connected in the first direction (x).

Here, a p-n junction may be formed on the semiconductor substrate 110 to convert incident light into electricity, and a plurality of first electrodes C141 and a plurality of second electrodes C142 may be formed on the rear surface.

In addition, each of the first conductive wiring EC1 and the second conductive wiring EC2 illustrated in FIGS. 1 and 2 may include a conductive material, and for example, the first and second conductive wirings EC1 and EC2 ) may be connected to the first and second electrodes C141 and C142 of the first and second solar cells C1 and C2, respectively.

The first and second conductive wires EC1 and EC2 are formed to have a thickness of 5 μm to 300 μm, and include at least one conductive material of copper (Cu), nickel (Ni), tin (Sn), and silver (Ag). can be formed including.

In addition, the interconnector IC includes a conductive metal material and functions to electrically connect the first solar cell C1 and the second solar cell C2 to each other. As shown, the interconnector IC is connected to the first conductive wire EC1 connected to the first solar cell C1 and the second conductive wire EC2 connected to the second solar cell C2 to form the first solar cell The cell C1 and the second solar cell C2 may be connected in series in the first direction x.

However, unlike this, the interconnector IC is connected to the second conductive wiring EC2 connected to the first solar cell C1 and the first conductive wiring EC1 connected to the second solar cell C2 to It is also possible to connect the first solar cell C1 and the second solar cell C2 in series in the first direction x.

In this case, between the interconnector IC and the first conductive wiring EC1 and between the interconnector IC and the second conductive wiring EC2 may also be connected to each other by the conductive adhesive CA.

Here, the conductive adhesive CA is a solder paste containing tin (Sn) or a conductive adhesive paste in which metal particles such as tin (Sn), silver (Ag), or copper (Cu) are included in an insulating resin. ) or a conductive adhesive film may be used.

Here, one integrated individual device in which the first and second conductive wires EC1 and EC2 are connected to the first and second electrodes C141 and C142 provided on the rear surface of the semiconductor substrate 110 will be described in more detail below. same as

FIG. 3 is a view for explaining an example of a solar cell in which first and second electrodes C141 and C142 are provided on the rear surface of the semiconductor substrate 110 .

3 is an example of a partial perspective view of a solar cell according to an example of the present invention, and FIG. 4 is a pattern of first and second electrodes C141 and C142 and first and second conductive wirings EC1 and EC2 in the solar cell of FIG. 3 . ) as a road for explaining an example, (a) of FIG. 4 is a diagram for explaining an example of a pattern of the first electrode C141 and the second electrode C142 disposed on the rear surface of the semiconductor substrate 110, FIG. 4B is a diagram for explaining an example of a pattern of the first conductive wiring EC1 and the second conductive wiring EC2 to be connected to the first and second electrodes C141 and C142.

As shown in FIG. 3 , the solar cell according to the present invention includes, for example, a semiconductor substrate 110 , an anti-reflection film 130 , an emitter portion 121 , a back surface field (BSF) 172 , and a plurality of It may include a first electrode C141 and a plurality of second electrodes C142.

Here, the anti-reflection film 130 and the rear electric field unit 172 may be omitted, but the case in which the anti-reflection film 130 and the rear electric field unit 172 are included as shown in FIG. 3 will be described as an example.

The semiconductor substrate 110 may be a semiconductor substrate 110 made of silicon of a first conductivity type, for example, an n-type conductivity type. The semiconductor substrate 110 is an n-type impurity of a pentavalent element such as an impurity of the first conductivity type, for example, phosphorus (P), arsenic (As), antimony (Sb), etc. in a semiconductor wafer formed of a crystalline silicon material. It may be formed by doping with an impurity of a conductive type.

A plurality of emitter units 121 may be spaced apart from each other in the rear surface of the semiconductor substrate 110 facing the front surface, and may extend in a first direction (x) parallel to each other. Such a plurality of emitter portions 121 is a second conductivity type opposite to the conductivity type of the semiconductor substrate 110, for example, an impurity of a trivalent element such as boron (B), gallium (Ga), indium (In), etc. A p-type conductivity type impurity may be included.

Accordingly, a p-n junction may be formed by the semiconductor substrate 110 and the emitter unit 121 .

However, unlike the above description, it is also possible that the semiconductor substrate 110 includes p-type conductivity type impurities and the emitter portion 121 includes n-type conductivity type impurities.

A plurality of rear electric field units 172 may be spaced apart from each other inside the rear surface of the semiconductor substrate 110 and may extend in a first direction (x) parallel to the plurality of emitter units 121 . Accordingly, as shown in FIG. 2 , the plurality of emitter units 121 and the plurality of rear electric field units 172 may be alternately positioned on the rear surface of the semiconductor substrate 110 .

The plurality of rear electric field units 172 may be n++ impurity regions containing impurities of the same first conductivity type as that of the semiconductor substrate 110 at a higher concentration than that of the semiconductor substrate 110 .

The first electrode C141 may be physically and electrically connected to the emitter part 121 , respectively, and may be formed to be elongated in the first direction (x) on the rear surface of the semiconductor substrate 110 along the emitter part 121 .

In addition, the second electrode C142 may be formed to be elongated in the first direction (x) on the rear surface of the semiconductor substrate 110 along the plurality of rear electric field units 172 , and pass through the rear electric field unit 172 to the semiconductor substrate. 110 and may be physically and electrically connected to each other.

Here, the first and second electrodes C141 and C142 may be spaced apart from each other, may be electrically isolated, and may be alternately disposed.

The solar cell applied to the solar cell module according to the present invention is not necessarily limited only to FIGS. 2 and 3 , and the first and second electrodes C141 and C142 provided in the solar cell are formed only on the rear surface of the semiconductor substrate 110 . Except for , other components can be changed at will.

For example, in the solar cell module of the present invention, a part of the first electrode C141 and the emitter part 121 are positioned on the front surface of the semiconductor substrate 110 , and a part of the first electrode C141 is positioned on the semiconductor substrate 110 . An MWT-type solar cell connected to the remaining part of the first electrode C141 formed on the rear surface of the semiconductor substrate 110 through the formed hole is also applicable.

In the solar cell according to the present invention manufactured with the above structure, the holes collected through the first electrode C141 and the electrons collected through the second electrode C142 may be used as power of an external device through an external circuit device. can

In such a solar cell, the ratio of the thickness TC to the width WC of each of the first and second electrodes C141 and C142 may be 1:200 to 1500.

That is, as an example, referring to FIG. 4B , the thickness TC of each of the plurality of first and second electrodes C141 and C142 may be formed between 0.2 μm and 1 μm, and the plurality of first, Each of the two electrodes C141 and C142 may have a width WC of 200 μm to 300 μm.

As described above, by making the ratio of the thickness TC to the width WC of each of the first and second electrodes C141 and C142 between 1:200 and 1500, the manufacturing cost of the solar cell can be minimized.

In this case, the respective cross-sectional areas of the first and second electrodes C141 and C142 are excessively reduced, so that resistance of each of the first and second electrodes C141 and C142 may be a problem. It can be solved by the first and second conductive wirings EC1 and EC2 connected to each of (C141, C142) and serving as auxiliary electrodes.

That is, by forming the thickness TC of each of the first and second electrodes C141 and C142 very thin, the manufacturing time and manufacturing cost of the solar cell can be reduced, and the first and second electrodes C141 and C142 relatively increased. ) can be eliminated by connecting the first and second conductive wirings EC1 and EC2 through the conductive adhesive CA.

The plurality of first and second electrodes C141 and C142 may be manufactured by, for example, sputtering.

As shown in FIG. 4B , the first conductive wiring EC1 includes a first connection part EC1-F and a first pad part EC1-B, and the first connection part EC1-F is formed to be elongated in the first direction (x) and connected to the plurality of first electrodes C141 through the conductive adhesive CA, and the first pad parts EC1-B are formed to be elongated in the second direction (y), , one end may be connected to an end of the first connection part EC1-F.

As shown in FIG. 4B , the second conductive wiring EC2 includes a second connection part EC2-F and a second pad part EC2-B, and the second connection part EC2-F. is spaced apart from the first connection part EC1-F, is formed to be elongated in the first direction (x), is connected to the plurality of second electrodes C142 through a conductive adhesive CA, and the second pad part EC2-B ) may be elongated in the second direction y, and one end may be connected to the end of the second connection part EC2-F.

Here, the first connection part EC1-F and the second pad part EC2-B may be spaced apart from each other, and the second connection part EC2-F and the first pad part EC1-B may also be spaced apart from each other.

The first conductive wiring EC1 may be electrically connected to the first electrode C141 through the conductive adhesive CA, and the second conductive wiring EC2 may also be connected to the second electrode C142 through the conductive adhesive CA. ) can be electrically connected to.

In the solar cell according to the present invention, in a state in which the plurality of first electrodes C141 and the plurality of second electrodes C142 are previously formed on the rear surface of the semiconductor substrate 110 , the first conductive wiring EC1 and the second The conductive wiring EC2 may be connected to the plurality of first electrodes C141 and the plurality of second electrodes C142 to form one individual device.

5A is a partial perspective view of the solar cell described in FIGS. 3 and 4 and the first and second conductive wirings EC1 and EC2 are connected to each other, and FIG. 5B is the solar cell described in FIGS. 3 and 4 and FIG. It is a top view of a state in which the first and second conductive wirings EC1 and EC2 are connected to each other. In FIG. 5B , the illustration of the conductive adhesive CA and the insulating layer IL shown in FIG. 5A is omitted for convenience of understanding.

In addition, FIG. 6 shows a cross section of line cy1-cy1 in FIG. 5 , FIG. 7 shows a cross section of line cx1-cx1 in FIG. 5 , and FIG. 8 shows a cross section of line cx2-cx2 in FIG. 5 . did it

In the solar cell according to the present invention, in a state in which the plurality of first electrodes C141 and the plurality of second electrodes C142 are previously formed on the rear surface of the semiconductor substrate 110 , the first conductive wiring EC1 is connected to the first electrode ( C141 may be connected to C141 through a conductive adhesive CA, and the second conductive wiring EC2 may be connected to the second electrode C142 through a conductive adhesive CA to form a single individual device.

Specifically, as described above, as shown in FIGS. 5A and 5B , the plurality of first and second electrodes C141 and C142 on the rear surface of the semiconductor substrate 110 have the same first direction as the series connection direction of the solar cell. (x), the first and second connecting portions EC1-F and EC2-F of the first and second conductive wirings EC1 and EC2 are respectively disposed in the longitudinal direction of the first and second electrodes C141 and C142. It can be arranged and connected in the same direction as the

However, the present invention is not necessarily limited thereto. Alternatively, the first and second connecting portions EC1-F and EC2-F may be disposed and connected in a direction crossing the first and second electrodes C141 and C142.

In this case, the first connecting portions EC1-F may be electrically connected to each other at a portion overlapping the first electrode C141 , and the second connecting portion EC2-F may be electrically connected to the overlapping portion with the second electrode C142 . can be electrically connected to each other. In addition, an insulating layer IL may be formed between the first connection part EC1-F and the second electrode C142 and between the second connection part EC2-F and the first electrode C141.

Hereinafter, as shown in FIGS. 5A and 5B , each of the first and second connection parts EC1-F and EC2-F is disposed in the same direction as the longitudinal direction of the first and second electrodes C141 and C142 and is connected. The case will be described as an example.

In this way, when the first and second connecting portions EC1-F and EC2-F are respectively disposed and connected in the same first direction (x) as the longitudinal direction of the first and second electrodes C141 and C142, FIG. As illustrated, the first electrode C141 formed on the rear surface of the semiconductor substrate 110 and the first connection portions EC1-F formed on the front surface of the insulating member 200 overlap each other and are formed by a conductive adhesive CA. may be electrically connected to each other.

In addition, the second electrode C142 formed on the rear surface of the semiconductor substrate 110 and the second connection portion EC2-F formed on the front surface of the insulating member 200 also overlap each other, and are electrically connected to each other by the conductive adhesive CA. can be connected

In addition, the insulating layer IL may be filled in a space spaced apart from each other between the first electrode C141 and the second electrode C142 , and between the first connection part EC1-F and the second connection part EC2-F The insulating layer IL may also be filled in a space spaced apart from each other.

In addition, as shown in FIG. 7 , the insulating layer IL may also be filled in a space spaced apart between the second connection part EC2-F and the first pad part EC1-B, and as shown in FIG. 8 , Similarly, the insulating layer IL may be filled in a space spaced apart between the first connection part EC1-F and the second pad part EC2-B.

Here, the insulating layer IL may be any insulating material. For example, an epoxy-based or silicone-based insulating resin may be used.

In addition, as shown in FIGS. 5B , 7 and 8 , each of the first pad part EC1-B and the second pad part EC2-B is an exposed area PS1 that does not overlap the semiconductor substrate 110 . , PS2).

In this way, in the exposed area PS1 of the first pad part EC1-B and the exposed area PS2 of the second pad part EC2-B, which are provided to secure a space to be connected to the interconnector IC, An interconnector IC may be connected thereto.

Each of the first pad part EC1-B and the second pad part EC2-B according to the present invention includes the exposed regions PS1 and PS2, so that the interconnector IC can be more easily connected, and also , when connecting the interconnector IC, thermal expansion stress on the semiconductor substrate 110 may be minimized.

Up to now, the first pad part EC1-B and the second pad part EC2-B in which the first and second conductive wires EC1 and EC2 of the solar cell module according to the present invention are connected to a separate interconnector IC ) and a structure in which the solar cells of the solar cell module according to the present invention are connected in series to each other to the interconnectors (ICs) connected to the first and second conductive wirings (EC1, EC2) have been described as an example, but differently, The first and second conductive wires EC1 and EC2 of the solar cell module according to the present invention may be provided in the form of wires or ribbons, and are connected to the first and second conductive wires EC1 and EC2 without a separate interconnector (IC). The solar cells may be connected in series to each other by this, which will be described below.

9 is a plan view for explaining an example of a solar cell module according to a second embodiment of the present invention, and FIG. 10 is a cross-sectional view taken along line CX3-CX3 in FIG. 9 .

9 , the solar cell module according to the second embodiment of the present invention includes a plurality of solar cells C1 to C3, first and second conductive wires EC1 and EC2, and a conductive adhesive CA. do.

Here, the plurality of solar cells C1 to C3 may include, for example, first, second, and third solar cells C1 to C3, as shown in FIG. 9 , and the plurality of solar cells C1 to C3 ) each may include the semiconductor substrate 110 on which the pn junction is formed and a plurality of first and second electrodes C141 and C142 formed to be spaced apart from each other on the rear surface of the semiconductor substrate 110 .

Since the solar cell applied to the solar cell module according to the second embodiment is the same as the solar cell applied to the solar cell module according to the second embodiment, the detailed structure of the solar cell will be omitted, and description will be focused on other parts. do.

In the solar cell module according to the second embodiment, each of the plurality of solar cells (C1 to C3) may be sequentially arranged in the first direction (x), and a plurality of first, The second electrodes C141 and C142 may be formed to be elongated in a second direction y crossing the first direction x differently from the first embodiment described above.

Each of the first and second conductive wires EC1 and EC2 is connected to one cell electrode C141 or C142 among the plurality of first and second electrodes C141 and C142 formed in each of the plurality of solar cells C1 to C3. Thus, the plurality of solar cells C1 to C3 may function to connect each other in series.

As shown in FIG. 9 , the first and second conductive wires EC1 and EC2 may be formed to be elongated in the first direction x crossing the plurality of first and second electrodes C141 and C142. have.

As described above, by disposing the first and second conductive wires EC1 and EC2 in the first direction x intersecting the plurality of first and second electrodes C141 and C142, alignment can be more easily performed. .

Here, the first conductive wire EC1 may connect the first solar cell C1 and the second solar cell C2 in series to each other, and the second conductive wire EC2 is the second solar cell C2 and the second solar cell C2. 3 solar cells C3 may be connected in series with each other.

In a more specific example, as shown in FIGS. 9 and 10 , the first conductive wiring EC1 includes a plurality of first electrodes C141 provided in the second solar cell C2 through a conductive adhesive CA and The plurality of second electrodes C142 provided in the first solar cell C1 may be connected to each other, and the second conductive wiring EC2 may be connected to the plurality of second electrodes C142 provided in the second solar cell C2 through a conductive adhesive CA. may be connected to the second electrode C142 and the plurality of first electrodes C141 provided in the third solar cell C3.

In addition, in each of the first, second, and third solar cells C1 to C3 , the plurality of first and second electrodes C141 and C142 that are not connected to the first and second conductive wires EC1 and EC2 and the first and second conductivity An insulating layer IL may be positioned between the wirings EC1 and EC2 .

In a more specific example, as shown in FIGS. 9 and 10 , in the second solar cell C2 , the insulating layer IL is formed between the first conductive line EC1 and the plurality of second electrodes C142 and between the second electrode C142 and the second solar cell C2 . It may be positioned between the conductive line EC2 and the plurality of first electrodes C141 .

Accordingly, unnecessary short circuits or shunts are more effectively prevented between the first conductive line EC1 and the plurality of second electrodes C142 and between the second conductive line EC2 and the plurality of first electrodes C141 . can do.

The insulating layer IL is formed in advance of the semiconductor substrate 110 prior to connecting the insulating member 200 provided with the first and second conductive wires EC1 and EC2 to each of the plurality of solar cells C1 to C3. It can be applied on the back side of

Here, materials of the conductive adhesive CA and the insulating layer IL may be the same as those described in the first embodiment.

So far, the structure of the solar cell module according to the present invention has been described. Hereinafter, a method for manufacturing such a solar cell module will be described.

11 is a flowchart for explaining a method for manufacturing a solar cell module according to an example of the present invention, and FIGS. 12 to 15 are for manufacturing the first embodiment of the solar cell module described above according to the manufacturing method described in FIG. It is a diagram for explaining a method, and FIGS. 16 to 19 are diagrams for explaining a method of manufacturing the second embodiment of the solar cell module described above according to the manufacturing method described in FIG. 11 .

First, as described in FIG. 11 , the method for manufacturing a solar cell according to the present invention includes a conductive adhesive application step (S1), an insulating layer application step (S2), an arrangement step (S3), a connection step (S4), and a peeling step (S5). ) and a lamination step (S6).

Here, the insulating layer application step (S2) may be omitted in some cases, but will be described on the assumption that it is included.

Hereinafter, a method of manufacturing the first embodiment of the solar cell module described above will be first described with reference to FIGS. 11 and 12 to 15 , and then with reference to FIGS. 11 and 16 to 19 , as described above. A method of manufacturing the second embodiment of the solar cell module will be described.

In order to manufacture the first embodiment of the solar cell module according to the manufacturing method of the present invention, first and second conductive wirings EC1 and EC2 are provided as shown in FIGS. 12A and 12B . The insulating member 200 may be prepared.

Here, since the planar patterns of the first and second conductive wirings EC1 and EC2 are the same as those described with reference to FIG. 4B , a detailed description thereof will be omitted.

The first and second conductive wirings EC1 and EC2 may be provided in a state of being adhered to one surface of the insulating member 200 by the adhesive layer TCA, as shown in FIGS. 12A and 12B . can

Here, in the method of forming the patterns of the first and second conductive wirings EC1 and EC2 on the insulating member 200 , the first and second conductive wirings EC1 are formed in a state in which the adhesive layer TCA is first formed on the insulating member 200 . , EC2) is printed and cured by heat treatment, and then a portion of the first and second conductive wirings EC1 and EC2 is etched to form patterns of the first and second conductive wirings EC1 and EC2. have. Alternatively, in a state in which the adhesive layer TCA is first formed on the insulating member 200 , the pattern of the first and second conductive wirings EC1 and EC2 may be printed and then cured by heat treatment.

Here, the size of the insulating member 200 may be slightly larger than the size of the semiconductor substrate 110 included in the solar cell. For example, a length of the insulating member 200 in the first direction (x) may be longer than a length of the semiconductor substrate 110 in the first direction (x).

Here, the adhesive layer TCA may be formed on almost the entire surface of the insulating member 200 . Therefore, the first and second conductive wirings EC1 and EC2 are not formed on one surface of the insulating member 200 . An adhesive layer (TCA) may be formed even on a portion not provided.

As such, the adhesive layer TCA may be selectively etched and removed in the peeling step S5 . As an example, the adhesive layer (TCA) may include an epoxy resin series or a silicone resin series, for example, may be formed including an epoxy acrylate resin series, and in the peeling step (S5), the epoxy acrylate The adhesive layer (TCA) may be removed by using an adhesive layer etchant containing any one of an aqueous KOH solution, an aqueous NaOH solution, or an aqueous TMAH (Tetramethyl ammounium hydroxide) solution that selectively reacts only with . However, the material of the adhesive layer (TCA) is not necessarily limited thereto, and if there is an etchant that selectively reacts, any other material may be used.

In the present invention, a case in which the adhesive layer (TCA) includes epoxy acrylate as described above will be described as an example.

As such, when the first and second conductive wires EC1 and EC2 are previously provided on the insulating member 200 , the first and second conductive wires EC1 and EC2 are disposed on the first and second electrodes C141 and C142 . In this case, alignment between the first and second electrodes C141 and C142 and the first and second conductive wires EC1 and EC2 may be more easily performed.

In this way, in a state in which the insulating member 200 on which the first and second conductive wirings EC1 and EC2 are formed is provided, as shown in FIG. 13 , the first and second conductive wires EC1 and EC2 are provided on the rear surface of the semiconductor substrate 110 provided in the solar cell. A conductive adhesive application step S1 of applying a conductive adhesive paste CAP on the rear surfaces of the first and second electrodes C141 and C142 is performed, and the conductive adhesive CA is not applied among the rear surfaces of the semiconductor substrate 110 . An insulating layer application step S2 of applying an insulating layer paste ILP to the portion may be performed.

More specifically, in the first embodiment, a conductive adhesive paste CAP is applied on the rear surfaces of each of the plurality of first and second electrodes C141 and C142, and the semiconductor substrate between the first and second electrodes C141 and C142 is An insulating layer paste (ILP) may be applied on the rear surface of 110 .

Here, the structure of the solar cell is the same as that described with reference to FIGS. 3 and 4 (a), and thus is omitted.

In FIG. 11, the case in which the insulating layer application step (S2) is performed after the conductive adhesive application step (S1) is described as an example, but differently, the insulating layer application step (S2) is performed first and the conductive adhesive application step (S1) is performed It is free to perform

In this way, after the conductive adhesive application step S1 and the insulating layer application step S2 are performed, as shown in FIG. 13 , a plurality of first and second conductive wires EC1 and EC2 are attached to the adhesive layer TCA. The insulating member 200 adhered to each other may be disposed on the rear surfaces of the plurality of first and second electrodes C141 and C142 to which the conductive adhesive CA is applied in the direction of the arrow.

At this time, in order to form the solar cell individual device as described in FIG. 5B , the longitudinal direction of the first and second connection parts EC1-F and EC2-F included in the first and second conductive wirings EC1 and EC2 is the first. The insulating member 200 may be disposed on the rear surface of the semiconductor substrate 110 to be positioned in the same length direction as the first and second electrodes C141 and C142 .

However, alternatively, the longitudinal directions of the first and second electrodes C141 and C142 and the longitudinal directions of the first and second connecting portions EC1-F and EC2-F may be arranged to cross each other. However, in this case, the application positions of the conductive adhesive paste CAP and the insulating layer paste ILP may be different. That is, the conductive adhesive paste CAP is formed between the overlapping portion of the first electrode C141 and the first connecting portion EC1-F and the overlapping of the second electrode C142 and the second connecting portion EC2-F. may be applied to a portion of , and the insulating layer paste ILP is a portion between the first electrode C141 and the second electrode C142 and the first electrode C141 and the second connection portion EC2-F overlap It may be applied to a portion between the portions and a portion between the second electrode C142 and the first connection portion EC1-F overlapping each other.

After the insulating member 200 is disposed on the rear surface of the semiconductor substrate 110 as shown in FIG. 13 , in the connection step S4 , the conductive adhesive CA is heat-treated as shown in FIG. 14 to heat-treat the plurality of first and second conductive wirings EC1 . , EC2) may be respectively connected to the plurality of first and second electrodes C141 and C142, respectively.

The heat treatment temperature in this connection step (S4) may be between 80 ℃ ~ 300 ℃.

The conductive adhesive CA and the insulating layer IL in which the conductive adhesive paste CAP and the insulating layer paste ILP are cured may be formed by the connection step S4 as described above. In addition, the epoxy acrylate of the adhesive layer (TCA) may be cured together.

The heat treatment in the connection step S4 may be performed in various ways. For example, it may be divided into a temporary bonding step having a relatively low heat treatment temperature and a main bonding step having a relatively high heat treatment temperature, and processing can be performed in various other ways.

After the connection step S4 is completed, a peeling step S5 of selectively etching the adhesive layer TCA to separate the insulating member 200 from the plurality of first and second conductive wires EC1 and EC2 is performed. can

In this peeling step (S5), the adhesive layer (TCA) is etched by the adhesive layer etchant selectively reacting only to the adhesive layer (TCA), and as shown in FIG. 15 , the insulating member 200 is a plurality of first and second conductive layers. It may be separated from the wirings EC1 and EC2.

At this time, the adhesive layer etchant used in the peeling step (S5) is an adhesive layer etchant containing any one of a KOH aqueous solution, NaOH aqueous solution, or TMAH (Tetramethyl ammounium hydroxide) aqueous solution that selectively reacts only with epoxy acrylate. It can be used.

The adhesive layer etchant as described above may be broken by decomposing the chemical chain of the epoxy acrylate cured by the heat treatment step in the connection step (S4). Accordingly, the adhesive layer etchant in the peeling step S5 selectively reacts only with the adhesive layer TCA to remove the adhesive layer TCA, and accordingly, the insulating member 200 also includes the plurality of first and second conductive wirings EC1, EC2).

After the peeling step S5 is completed, a string in which a plurality of solar cells are connected in series may be completed.

Thereafter, a lamination process for modularizing a plurality of solar cells in an encapsulant (not shown) between the front transparent substrate (not shown) and the back sheet (not shown) may be performed.

The manufacturing method of the solar cell module according to the present invention as described above can reduce the manufacturing cost of the solar cell module by simplifying the manufacturing process.

So far, a method of manufacturing a solar cell module according to the first embodiment of the present invention has been described, but below, with reference to FIGS. 11 and 16 to 19 , a method of manufacturing a solar cell module according to the second embodiment will be described. Explain.

In the description of the method for manufacturing a solar cell module according to the second embodiment, there is no special description except for cases in which it is incompatible or conflicts with the contents described in the method for manufacturing a solar cell module according to the first embodiment. It is assumed that they are applied together.

In the method of manufacturing a solar cell module according to the second embodiment, as shown in FIG. 16 , the longitudinal directions of the first and second electrodes C141 and C142 formed on the rear surface of the semiconductor substrate 110 are in the second direction ( The solar cell can be positioned to face y).

In this way, in the state in which the solar cells are disposed, in the conductive adhesive application step (S1) described in FIG. 11 , as shown in FIG. 16 , a plurality of first , 2 A conductive adhesive paste CAP may be applied on portions to which the conductive wires EC1 and EC2 are to be connected.

That is, the conductive adhesive CA includes a portion where the first conductive wire EC1 and the first electrode C141 overlap among the rear surfaces of the plurality of first electrodes C141 and a second electrode among the rear surfaces of the plurality of second electrodes C142. The second conductive line EC2 and the second electrode C142 may be applied to overlapping portions.

Next, in the insulating layer IL forming step, the first and second conductive wires EC1 and EC2 and the first and second electrodes C141 and C142 among the rear surfaces of the plurality of first and second electrodes C141 and C142 are insulated from each other. An insulating layer paste (ILP) may be applied on the portion to be formed.

That is, the insulating layer paste ILP is formed on a portion of the rear surfaces of the plurality of first electrodes C141 where the second conductive wiring EC2 and the first electrode C141 overlap and among the rear surfaces of the plurality of second electrodes C142 . The first conductive line EC1 and the second electrode C142 may be coated on the overlapping portion.

Thereafter, in the insulating member 200 disposing step ( S3 ), the rear surfaces of the plurality of first and second electrodes C141 and C142 to which the conductive adhesive CA is applied are the plurality of first and second conductive wires EC1 and EC2 . It may be disposed on the bonded insulating member 200 as shown in FIG. 17 .

Here, the plurality of first and second conductive wirings EC1 and EC2 bonded on the insulating member 200 may have a pattern elongated in the first direction (x) as shown in FIG. 17A . .

In addition, the plurality of first and second conductive wirings EC1 and EC2 may be attached to the insulating member 200 by the adhesive layer TCA as shown in FIG. 17B . Here, the adhesive layer TCA may include epoxy acrylate.

Such an adhesive layer (TCA) may be formed on almost the entire surface of the insulating member 200 . Therefore, the first and second conductive wirings EC1 and EC2 are not formed on one surface of the insulating member 200 . An adhesive layer (TCA) may be formed even on a portion not provided.

Here, the size of the insulating member 200 may be elongated in the first direction (x) as shown in FIG. 17A , and may have a size in which a plurality of solar cells can be disposed.

As an example, the semiconductor substrate 110 of the solar cell may be respectively disposed in regions AC1 to AC4 shown in FIG. 17A .

In this case, the plurality of solar cells C1 and C2 may be respectively disposed in regions AC1 to AC4 and connected to the plurality of first and second conductive wirings EC1 and EC2 to form one string.

In this way, when the semiconductor substrate 110 is disposed on the insulating member 200 , the longitudinal directions of the plurality of first and second electrodes C141 and C142 provided on the rear surface of the semiconductor substrate 110 are the plurality of first, The semiconductor substrate 110 may be disposed such that a second direction y intersecting the first direction x, which is a longitudinal direction of the two conductive wirings EC1 and EC2 , is a second direction (y).

Thereafter, by heat-treating the conductive adhesive CA in the connection step S4 , as shown in FIG. 18 , each of the plurality of first and second conductive wires EC1 and EC2 is connected to the plurality of first and second electrodes C141 and C141 , respectively. C142) can be connected to each.

The heat treatment temperature in this connection step (S4) may be between 80 ℃ ~ 300 ℃.

The conductive adhesive CA and the insulating layer IL in which the conductive adhesive paste CAP and the insulating layer paste ILP are cured may be formed by the connection step S4 as described above. In addition, the epoxy acrylate of the adhesive layer (TCA) may be cured together.

After the connection step S4 is completed, a peeling step S5 of selectively etching the adhesive layer TCA to separate the insulating member 200 from the plurality of first and second conductive wires EC1 and EC2 is performed. can

In the peeling step S5 , the adhesive layer TCA is etched by the adhesive layer etchant that selectively reacts only with the adhesive layer TCA, and in FIG. 18 , the insulating member 200 is a plurality of first and second conductive wirings EC1 and EC2 ) can be separated from

As such, the adhesive layer etchant used in the peeling step (S5) may be an adhesive layer etchant containing any one of an aqueous KOH solution, an aqueous NaOH solution, or an aqueous TMAH (Tetramethyl ammounium hydroxide) solution that selectively reacts only with epoxy acrylate.

After the peeling step S5 is completed, a string in which a plurality of solar cells are connected in series may be completed.

Thereafter, as shown in FIG. 19 , a lamination process for modularizing the solar cell in the first and second encapsulants EVA1 and EVA2 of the EVA material between the front transparent substrate FG and the rear sheet BS may be performed. have.

11 to 19, only the method of manufacturing a solar cell module according to an example of the present invention has been described, but in FIGS. 20 and 21 below, a method of manufacturing the wiring board 300 applied to the method of manufacturing a solar cell module is shown. An example will be described.

The wiring board 300 described in FIGS. 20 and 21 below has a structure in which first and second conductive wirings EC1 and EC2 patterned on the insulating member 200 are adhered through an adhesive layer TCA, where The pattern of the first and second conductive wirings EC1 and EC2 may have the same pattern as described with reference to FIG. 12 or FIG. 17 above.

Accordingly, the wiring board 300 manufactured by FIGS. 20 and 21 may be used in the method of manufacturing a solar cell module according to an example of the present invention.

20 is a diagram for explaining an example of a method of manufacturing the wiring board 300 by forming the first and second conductive wirings EC1 and EC2 on the insulating member 200 using a metal etching solution, and FIG. 21 is a mechanical diagram of FIG. It is a diagram for explaining an example of a method of manufacturing the wiring board 300 by forming the first and second conductive wirings EC1 and EC2 on the insulating member 200 using an etching method.

A method of manufacturing the wiring board 300 according to an example of the present invention may include an adhesion step and a patterning step, wherein the patterning step may use a metal etching solution as shown in FIG. 20 or a mechanical etching method as shown in FIG. 21 . have.

As shown in FIG. 20 , in the method of manufacturing the wiring board 300 using a metal etchant, the bonding step is performed by applying an adhesive layer (TCA) on one surface of the insulating member 200 as shown in FIG. After forming, and disposing a metal foil layer (MF) on the adhesive layer (TCA), heat treatment may be performed to adhere the metal foil layer (MF) to one surface of the insulating member (200).

Here, the metal foil layer MF may have a thickness of 5 μm to 300 μm, and the material of the metal foil layer MF may include at least one of Cu, Al, Ni, or Sn. The material of the metal foil layer MF may be substantially the same as that of the first and second conductive wirings EC1 and EC2.

Thereafter, as shown in (b) to (d) of FIG. 20 , the metal foil layer MF is selectively etched using a metal etchant to pattern the metal foil layer MF, thereby forming a plurality of first and second conductive wirings EC1. , a patterning step to form EC2) may be performed.

To this end, as shown in (b) of FIG. 20 , the etch stop layer AEL may be formed on the metal foil layer MF by patterning.

Here, the pattern of the etch stop layer AEL may be the same as the pattern of the first and second conductive wirings EC1 and EC2 described with reference to FIG. 12 or FIG. 17 . However, in consideration of etching by the metal etchant, the width of the etch stop layer AEL pattern may be slightly larger than the width of the first and second conductive wiring patterns EC1 and EC2.

As described above, the material of the etch stop layer AEL may be an epoxy resin or a silicone resin series.

As described above, in the state in which the etch stop layer AEL is patterned on the metal foil layer MF, the remaining portion PMF of the metal foil layer MF except for the portion where the etch stop layer AEL is formed is selectively etched with a metal etchant. to form the first and second conductive wirings EC1 and EC2 in a state in which the metal foil layer MF is patterned, as shown in FIG. As described above, the etch stop layer (AEL) may be removed.

In this case, an etching solution that etches only the metal and does not etch the etch stop layer (AEL) or the adhesive layer (TCA) may be used as the metal etchant.

The patterns of the first and second conductive wirings EC1 and EC2 of FIG. 20D formed in this way may be the same as the patterns of the first and second conductive wirings EC1 and EC2 described with reference to FIG. 12 or FIG. 17 .

In FIG. 20 , a method of selectively etching the metal foil layer MF of the wiring board 300 using a metal etching solution has been described. As shown in (a) of 20, in a state in which the metal foil layer MF is adhered to one surface of the insulating member 200, as shown in FIG. 21, mechanical etching such as laser beam irradiation equipment or drill equipment or cutting equipment It is also possible to form a pattern of the first and second conductive wirings EC1 and EC2 as shown in FIG. 20D by removing a portion PMF of the metal foil layer MF using the equipment ME.

In addition, in the present invention, it is also possible to use a mixture of the selective etching method using the metal etching solution of FIG. 20 and the mechanical etching method of FIG. 21 .

As described above, the method of forming the wiring board 300 using the metal foil layer MF is formed by printing a metal paste for forming the first and second conductive wirings EC1 and EC2 on the insulating member 200 . Compared with the method, the manufacturing time can be reduced.

11 to 21 , the first and second conductive wires EC1 and EC2 formed using the metal foil layer MF are previously formed on one surface of the insulating member 200 and connected to the solar cell. Method of manufacturing a solar cell module has been described, but differently from this, the metal foil layer MF is applied to the first and second electrodes C141 and C142 of the solar cell using a conductive adhesive CA without forming a separate wiring board 300 in advance. After pre-connection, it is also possible to selectively etch the metal foil layer MF to form a solar cell module. This will be described with reference to FIGS. 22 and 23 as follows.

22 and 23 are diagrams for explaining a method of manufacturing a solar cell module according to another example of the present invention.

After pre-connecting the metal foil layer MF to the first and second electrodes C141 and C142 of the solar cell using a conductive adhesive CA without forming a separate wiring board 300 in advance, the metal foil layer In the method of selectively etching (MF) to form a solar cell module, the etching method may use an etching solution or a mechanical etching method may be used.

22 illustrates an example of a method of selectively etching the metal foil layer MF using a metal etching solution after connecting the metal foil layer MF to the first and second electrodes C141 and C142 of the solar cell. 23 is a method of selectively etching the metal foil layer (MF) using a mechanical etching method after connecting the metal foil layer (MF) to the first and second electrodes (C141, C142) of the solar cell It is a figure for demonstrating an example of.

A method of manufacturing a solar cell module according to another example of the present invention may include a conductive adhesive application step, a metal foil layer connection step, and a wiring forming step.

Here, in the conductive adhesive application step, as shown in FIG. 22A , the conductive adhesive paste CP may be applied on each of the first and second electrodes C141 and C142 provided on the rear surface of the semiconductor substrate. .

Here, the solar cell shown in (a) of FIG. 22 may have the same structure as that described in FIGS. 3 and 4 . Accordingly, although only one case is illustrated in FIG. 22A , each of the first and second electrodes C141 and C142 is plural.

After such a conductive adhesive application step, a metal foil layer connection step may be performed.

Here, the metal foil layer may have the same thickness and material as the metal foil layer described with reference to FIG. 20 above.

In the metal foil layer connection step, as shown in (b) of FIG. 22, the metal foil layer MF is disposed on the rear surface of the plurality of first and second electrodes C141 and C142 coated with the conductive adhesive CA. In this state, the conductive adhesive paste (CP) may be cured to form a conductive adhesive (CA) by heat treatment at a temperature of 80°C to 200°C for about 30 seconds to 1200 seconds.

Accordingly, as shown in (c) of FIG. 22 , the conductive adhesive CA in which the conductive adhesive paste CP is cured connects the metal foil layer MF and the first and second electrodes C141 and C142 to each other. can do it

Thereafter, in the wiring forming step, the metal foil layer MF may be selectively etched to form a plurality of first and second conductive wirings EC1 and EC2 .

In the wiring forming step, a portion of the metal foil layer MF connected to the plurality of first and second electrodes C141 and C142 is selectively etched using a metal etchant to selectively etch a portion of the plurality of first and second conductive wirings EC1 and EC2. ) or by mechanically etching a portion of the metal foil layer MF connected to the plurality of first and second electrodes C141 and C142 to form a plurality of first and second conductive wirings EC1 and EC2. have.

Here, the method of selectively etching a portion of the metal foil layer (MF) using a metal etching solution includes the steps of patterning an etch stop layer (AEL) on the metal foil layer (MF) and selectively etching a portion of the metal foil layer (MF) may include steps.

More specifically, in the step of patterning the etch stop layer AEL on the metal foil layer MF, the metal foil layer ( In a state in which the MF) is connected, the etch stop layer AEL may be patterned on the metal foil layer MF to be formed. In this case, the pattern of the etch stop layer AEL may be the same as the pattern of the first and second conductive wirings EC1 and EC2 described with reference to FIG. 12 or FIG. 17 .

Thereafter, in the step of selectively etching a portion of the metal foil layer MF, the remaining portion PMF of the metal foil layer MF except for the portion on which the etch stop layer AEL is formed may be etched by the metal etchant. Accordingly, only a portion of the metal foil layer MF may be selectively etched, and thus, as shown in FIG. 22(e) , a plurality of first and second conductive wirings ( EC1, EC2) may be formed.

Here, the pattern of the plurality of first and second conductive wirings EC1 and EC2 as shown in FIG. 22E is the pattern of the first and second conductive wirings EC1 and EC2 described with reference to FIG. 12 or 17 above. may be the same as

In addition, in the method of mechanically etching a portion of the metal foil layer MF, the metal foil layer MF is formed of a plurality of first and second electrodes C141 and C142 by a conductive adhesive CA as shown in FIG. ), by removing a portion (PMF) of the metal foil layer (MF) using a mechanical etching equipment (ME) such as a laser beam irradiation equipment or a drill equipment or a cutting equipment, as shown in FIG. can be performed.

Accordingly, as shown in (e) of FIG. 22 , a plurality of first and second conductive wirings EC1 and EC2 on which the metal foil layer MF is patterned may be formed.

As such, in the method of manufacturing a solar cell module according to the present invention, the manufacturing method of the solar cell module can be more simplified by using the metal foil layer MF, and the manufacturing time can be further shortened.

The above description is merely illustrative of the technical idea of the present invention, and various modifications, changes, and substitutions are possible within the range that does not depart from the essential characteristics of the present invention by those of ordinary skill in the art to which the present invention pertains. will be.

Accordingly, the embodiments disclosed in the present invention and the accompanying drawings are for explaining, not limiting, the technical spirit of the present invention, and the scope of the technical spirit of the present invention is not limited by these embodiments and the accompanying drawings. . The protection scope of the present invention should be construed by the following claims, and all technical ideas within the equivalent range should be construed as being included in the scope of the present invention.

Claims (15)

delete delete delete delete delete delete applying a conductive adhesive to the rear surfaces of the plurality of first and second electrodes in a solar cell in which a plurality of first electrodes and a plurality of second electrodes are formed in parallel with each other on a rear surface of a semiconductor substrate;
An adhesion step of applying an adhesive layer to one surface of the insulating member and adhering a metal foil layer to the adhesive layer, and a patterning step of patterning the metal foil layer to form a plurality of first and second conductive wires a disposing step of disposing an insulating member of the wiring board manufactured by the method comprising: a rear surface of the plurality of first and second electrodes to which the conductive adhesive is applied;
heat-treating the conductive adhesive to connect each of the plurality of first and second conductive wires to each of the plurality of first and second electrodes; and
after the connecting step, a peeling step of selectively etching the adhesive layer to separate the insulating member from the plurality of first and second conductive wirings. 8. The method of claim 7,
In the peeling step,
The adhesive layer is selectively etched by an adhesive layer etchant that selectively reacts only with the adhesive layer,
The method of manufacturing a solar cell module in which the insulating member is separated from the plurality of first and second conductive wirings by selective etching of the adhesive layer. 9. The method of claim 8,
The adhesive layer is a manufacturing method comprising an epoxy resin series or a silicone resin series. 9. The method of claim 8,
The adhesive layer etchant is a KOH aqueous solution, NaOH aqueous solution, or TMAH (Tetramethyl ammounium hydroxide) manufacturing method comprising any one of the aqueous solution. 8. The method of claim 7,
The heat treatment temperature of the connection step is between 80 ℃ ~ 300 ℃ manufacturing method. A conductive adhesive application step of applying a conductive adhesive to the plurality of first and second electrodes provided on the rear surface of the semiconductor substrate;
a metal foil layer connecting step of disposing a metal foil layer on the rear surfaces of the plurality of first and second electrodes to which the conductive adhesive is applied and then heat-treating them to connect; and
and a wiring forming step of selectively etching the metal foil layer to form a plurality of first and second conductive wirings. 13. The method of claim 12,
The wire forming step is
forming the plurality of first and second conductive wirings by selectively etching a portion of the metal foil layer connected to the plurality of first and second electrodes using a metal etching solution;
A method of manufacturing a solar cell module to form the plurality of first and second conductive wirings by mechanically etching a portion of the metal foil layer connected to the plurality of first and second electrodes. 14. The method of claim 13,
A method of selectively etching a portion of the metal foil layer using a metal etchant
forming an etch stop layer on the metal foil layer connected to the plurality of first and second electrodes by patterning; and
and selectively etching a portion of the metal foil layer except for a portion on which an etch stop layer is formed with the metal etchant. 14. The method of claim 13,
A method of mechanically etching a portion of the metal foil layer is
A method of manufacturing a solar cell module performed using laser beam irradiation equipment or drill equipment or cutting equipment.

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