KR102303262B1 - Purge apparatus and purge method - Google Patents

Abstract

A purge processing apparatus according to an embodiment of the present invention includes a support stage on which a container in which an object is accommodated is mounted; a plurality of gas supply ports installed on the support stage and communicating with the gas inlet hole of the container when the container is mounted on the support stage; a gas discharge port installed on the support stage and communicating with the gas outlet hole of the container when the container is mounted on the support stage; a gas supply unit supplying a purge gas into the vessel through a plurality of gas supply ports; and a gas discharging unit discharging the purge gas in the container through the gas discharging port.

Description

Purge treatment apparatus and purge treatment method {PURGE APPARATUS AND PURGE METHOD}

The present invention relates to a purge treatment apparatus and a purge treatment method for purging a container in which an object is accommodated.

In the manufacturing process of various electronic/electrical devices such as semiconductor devices or display devices, a stocker configured to perform a predetermined process on an object while storing a wafer, a substrate, a semiconductor element, etc. (hereinafter referred to as an object) under a predetermined atmosphere is used

The stocker has a plurality of compartments partitioned by a plurality of shelves, and an object is stored in the compartment in a state stored in a container. A predetermined environment and atmosphere are created inside the container, so that an object can be processed under a predetermined environment and atmosphere.

In this process, a process of purging the inside of the container is performed while supplying a purge gas to the inside of the container and discharging the purge gas from the container, and accordingly, the cleanliness of the inside of the container can be constantly maintained.

In such a purge process, it is important to smoothly circulate the purge gas in the container and then smoothly discharge the purge gas from the container. Therefore, there is a demand for the development of a technology capable of smoothly circulating the purge gas in the container and smoothly discharging the purge gas from the container.

Republic of Korea Patent No. 10-1647923

The present invention is to solve the technical needs in the prior art, and an object of the present invention is to smoothly supply a purge gas to the inside of the container in which the object is accommodated and to smoothly discharge the gas inside the container to the outside. An object of the present invention is to provide a purge treatment device.

A purge processing apparatus according to an embodiment of the present invention for achieving the above object includes: a support stage on which a container in which an object is accommodated; a gas supply port installed on the support stage and communicating with the gas inlet hole of the container when the container is mounted on the support stage; a gas discharge port installed on the support stage and communicating with the gas outlet hole of the container when the container is mounted on the support stage; a gas supply unit supplying a purge gas into the vessel through the gas supply port; and a gas discharge unit for discharging the purge gas in the container through the gas discharge port, wherein the number of gas supply ports and the number of gas discharge ports may be different.

The number of gas supply ports may be greater than the number of gas discharge ports.

The number of gas supply ports may be three, and the number of gas discharge ports may be one.

A flow switch may be connected to the gas supply port, and a flow rate of the purge gas passing through the gas supply port may be adjusted.

The flow rate of the purge gas may be adjusted based on at least one of a time, a pressure inside the vessel, and a current flow rate of the purge gas.

The purge processing apparatus according to an embodiment of the present invention may further include a position detection sensor for detecting the position of the container mounted on the support stage.

The purge processing apparatus according to an embodiment of the present invention may further include a load detection sensor for detecting the load of the container mounted on the support stage and the load of the object.

The gas supply port may include a gas supply pad having a gas supply hole in communication with the gas inlet hole of the vessel and which contacts the bottom of the vessel and serves as a buffer when the vessel is mounted on the support stage.

The gas outlet port may include a gas outlet pad having a gas outlet hole that communicates with the gas outlet hole of the container and which contacts the bottom of the container and serves as a buffer when the container is mounted on the support stage.

A purge treatment method according to an embodiment of the present invention includes: a support stage on which a container in which an object is accommodated is mounted; a gas supply port installed on the support stage and communicating with a gas inlet hole of the container when the container is mounted on the support stage; A purge processing apparatus comprising: a gas discharge port installed on the support stage and communicating with a gas outlet hole of the container when the container is mounted on the support stage; and a gas supply unit connected to the gas supply port to supply a purge gas to the gas supply port A purge treatment method for purging a vessel using: (a) mounting the vessel on a support stage; (b) supplying a purge gas at a first flow rate to the gas supply port by the gas supply unit; and (c) if the condition for changing the flow rate of the purge gas supplied to the gas supply port is satisfied, supplying the purge gas to the gas supply port by the gas supply unit at a second flow rate different from the first flow rate. can

The condition for changing the flow rate of the purge gas supplied to the gas supply port may be a preset time, and step (c) supplies the purge gas to the gas supply port at a first flow rate and then when the preset time elapses, the second A purge gas can be supplied to the gas supply port at a flow rate of two.

The condition for changing the flow rate of the purge gas supplied to the gas supply port may be the internal pressure of the vessel, and in step (c), the purge gas is supplied to the gas supply port at a first flow rate, and then the internal pressure of the vessel is set in advance. Upon reaching or exceeding the pressure, purge gas may be supplied to the gas supply port at a second flow rate.

The condition for changing the flow rate of the purge gas supplied to the gas supply port may be the flow rate of the purge gas passing through the gas supply port, and step (c) is performed during the process of supplying the purge gas to the gas supply port at a first flow rate. When the flow rate of the purge gas passing through the gas supply port changes, the purge gas can be supplied to the gas supply port at the second flow rate.

A purge processing method according to an embodiment of the present invention includes a support stage on which a container in which an object is accommodated, and a plurality of gases installed on the support stage and communicating with a plurality of gas inlet holes of the container when the container is mounted on the support stage. A container is purged using a purge processing device including a supply port, a gas exhaust port installed on the support stage and communicating with a gas outlet hole of the container when the container is mounted on the support stage, and a gas exhaust pipe connected to the gas exhaust port A purge treatment method comprising the steps of: (a) mounting a vessel on a support stage; (b) determining a flow rate of purge gas to be supplied into the vessel; (c) adjusting the flow rate of the purge gas by differently setting the flow rate of the purge gas passing through the plurality of gas supply ports or adjusting the flow rate of the purge gas by opening all or part of the plurality of gas supply ports, (b) step supplying a purge gas into the vessel at a flow rate determined in ; and (d) measuring the pressure of the purge gas in the gas discharge pipe, and when the measured pressure reaches a preset pressure, forcibly discharging the gas in the container through the gas discharge pipe.

The flow rate of the purge gas to be supplied into the container in step (b) may be determined based on at least one of a time, an internal pressure of the container, and a current flow rate of the purge gas.

According to the purge processing apparatus and the purge processing method according to the embodiment of the present invention, the flow rate of the purge gas may be adjusted by differently setting the flow rates of the purge gas passing through the plurality of gas supply ports, or all or part of the plurality of gas supply ports may be turned off. Since the purge gas can be supplied into the container while controlling the flow rate of the purge gas by opening the container, the purge gas can be smoothly circulated inside the container and then discharged.

1 is a diagram schematically illustrating a purge processing apparatus according to an embodiment of the present invention.
2 is a control block diagram of a purge processing apparatus according to an embodiment of the present invention.
3 and 4 are flowcharts illustrating a purge treatment method using a purge treatment apparatus according to an embodiment of the present invention.

Hereinafter, a purge treatment apparatus and a purge treatment method according to an embodiment of the present invention will be described with reference to the accompanying drawings.

The purge processing apparatus according to an embodiment of the present invention serves to purge a container (eg, a front opening unified pod (FOUP)) in which an object such as a wafer, a substrate, or a semiconductor device is accommodated. The container may be stored in the compartment of the stocker in a state in which the object is accommodated in the container, and a purge processing device may be provided in the compartment of the stocker. A predetermined environment and atmosphere may be created inside the container, and accordingly, an object may be processed under a predetermined environment and atmosphere. For example, an inert gas such as nitrogen may be supplied to the inside of the container, and accordingly, an atmosphere with low reactivity is created inside the container, thereby preventing a reaction such as oxidation of an object. In addition, since the object can be stored in the inner space of the container blocked from the outside, it is possible to prevent foreign substances from adhering to the object.

As shown in FIG. 1 , the purge processing apparatus according to an embodiment of the present invention includes a frame 20 having a support stage 21 on which a container 10 in which an object is accommodated is mounted and supported, and the container 10 . ) a gas supply unit 30 for supplying a purge gas into, a gas discharge unit 40 for discharging gas from the container 10 , and a gas supply unit 30 and a gas supply pipe installed on the support stage 21 . It includes a plurality of gas supply ports 50 connected through 31 , and a gas discharge port 60 installed on the support stage 21 and connected through a gas discharge unit 40 and a gas discharge pipe 41 . can do.

As shown in FIG. 2 , the gas supply unit 30 includes a gas supply 39 for supplying a purge gas, a plurality of gas filters 32 respectively connected to a plurality of gas supply ports 50 , and a plurality of gas supply ports 50 . It may include a flow switch 33 . For example, the gas supply 39 may include a compressor, a pump, or a blower that pressurizes and supplies the purge gas. The gas filter 32 serves to filter the gas supplied to the gas supply port 50 . The flow switch 33 serves to measure and adjust the flow rate of the gas supplied to the gas supply port 50 . Since the plurality of flow switches 33 are respectively connected to the plurality of gas supply ports 50 , the flow rate of the purge gas passing through the plurality of gas supply ports 50 is individually adjusted for each of the plurality of gas supply ports 50 . can As an example, the plurality of flow switches 33 may adjust the flow rates of the purge gas supplied into the container 10 by differently setting the flow rates of the purge gas passing through the plurality of gas supply ports 50 . As another example, the plurality of flow switches 33 open all of the plurality of gas supply ports 50 or open some of the plurality of gas supply ports 50 , thereby changing the flow rate of the purge gas supplied into the vessel 10 . can be adjusted

In addition, the gas supply unit 30 may include a main flow switch 34 and a control valve 35 connected to the plurality of flow switches 33 . In addition, in order to more precisely control the flow rate of the purge gas supplied into the container 10 , the gas supply unit 30 includes a pressure sensor 36 , a regulator 37 , and a control valve provided on the gas supply pipe 31 . (38) may be further provided.

The constituent parts of the gas supply unit 30 may be electrically connected to the control unit 90 and controlled by the control unit 90 . Under the control of the control unit 90 , the gas supply unit 30 , through the gas supply pipe 31 , the plurality of gas supply ports 50 , and the plurality of gas inlet holes 15 of the vessel 10 , is configured to be configured as a support stage. A purge gas may be supplied to the inside of the container 10 seated on the 21 . The gas supply unit 30 supplies gas at a first flow rate when detecting that the container 10 is seated, and supplies gas at a second flow rate different from the first flow rate when a condition for changing (adjusting) the flow rate is satisfied. can supply The condition for changing the flow rate may be determined based on at least one of time, pressure inside the vessel 10, or flow rate.

With respect to the time as a condition for changing the flow rate, the gas supply unit 30 initially supplies the purge gas to the vessel 10 at the first flow rate, and then, after a preset time elapses, supplies the purge gas to the second It can be supplied to the container 10 at a flow rate. Here, the first flow rate may be higher than the second flow rate. For example, the gas supply unit 30 initially supplies a purge gas at a relatively high flow rate (eg, 20 liters per minute (LPM)), and then when a preset time (eg, 1800 seconds) elapses, the relative The purge gas can be supplied at a low flow rate (eg 5 LPM).

In addition, with respect to the pressure inside the vessel 10 as a condition for changing the flow rate, the gas supply unit 30 initially supplies a purge gas to the vessel 10 at a first flow rate, and When the internal pressure reaches a preset pressure or exceeds the preset pressure, the purge gas may be supplied to the container 10 at a second flow rate. Here, the first flow rate may be higher than the second flow rate. For example, the gas supply unit 30 initially supplies the purge gas at a relatively high flow rate, and then, when the pressure inside the vessel 10 exceeds a preset pressure (eg, 10 kPa), a relatively low Gas can be supplied at a flow rate.

Further, in relation to the current flow rate of the purge gas as a condition for changing the flow rate, based on the current flow rate of the purge gas measured in real time by the flow switch 43 , the control unit 90 controls the current flow rate of the current flow rate. It is possible to determine whether to maintain and whether to increase or decrease the flow rate and control the gas supply unit 30 so that the gas supply unit 30 supplies the purge gas to the vessel 10 at the current flow rate or at a flow rate increased or decreased from the current flow rate. have.

As such, the condition for changing the flow rate of the purge gas may be determined based on at least one of time, pressure, and current flow rate. Accordingly, compared to a case in which only one gas supply port is used or a case in which gas is continuously supplied at the same flow rate, the supply efficiency of the purge gas may be improved, and thus the operating cost may be reduced.

The gas discharge unit 40 includes a gas discharger 49 for discharging gas in the container 10 to the outside, a pressure sensor 42 connected to the gas discharge port 60 , a flow switch 43 , and a main valve (44) may be included. For example, the gas exhauster 49 may be configured as a vacuum pump or the like. The flow switch 43 serves to measure and adjust the flow rate of the gas discharged from the gas discharge port 60 . In addition, so that the gas in the container 10 can be smoothly discharged to the outside, the gas discharge unit 40 may further include a pressure sensor 46 and a control valve 48 provided on the gas discharge pipe 41 . have. By discharging the gas to the outside of the vessel 10 through the gas discharging unit 40, the gas can be discharged along a predetermined path without being discharged through the gap of the vessel 10, so that the gas is discharged into the clean room interior space or other facilities flow can be prevented.

The constituent parts of the gas discharging unit 40 may be electrically connected to the control unit 90 and controlled by the control unit 90 . Under the control of the control unit 90 , the gas discharge unit 40 transmits the gas in the vessel 10 through the gas outlet hole 16 of the vessel 10 , the gas discharge port 60 and the gas discharge pipe 41 . can be discharged to the outside. In this case, the gas discharge unit 40 may be configured to forcibly discharge the gas of the container 10 when the pressure measured by the pressure sensor 46 reaches a preset pressure. Accordingly, it is possible to forcibly exhaust harmful substances in the container 10 to solve problems related to environment and safety.

The gas supply port 50 may include a gas supply pad 51 in contact with the bottom of the vessel 10 . The gas supply pad 51 may support the load of the container 10 while contacting the bottom of the container 10 when the container 10 is mounted on the support stage 21 . The gas supply pad 51 is made of, for example, a synthetic resin material or includes a spring, and serves to absorb an impact that may occur when the container 10 is mounted on the support stage 21 . can do. According to various embodiments of the present disclosure, the gas supply pad 51 and the portion in contact with the gas supply pad 51 in the vessel 10 are each composed of a pad made of a silicon material, so that the vessel 10 is supported by the support stage 21 . ) while absorbing the shock generated when mounted on the two pads having a certain level of frictional force can be configured so that the position of the container 10 with respect to the support stage 21 is not separated.

A gas supply hole 52 may be formed in the gas supply pad 51 . The gas supply hole 52 may be connected to the gas supply unit 30 through the gas supply pipe 31 . The gas supply hole 52 may communicate with the gas inlet hole 15 of the container 10 when the container 10 is mounted on the gas supply pad 51 .

The outgassing port 60 may include an outgassing pad 61 in contact with the bottom of the vessel 10 . The gas discharge pad 61 may support the load of the container 10 while contacting the bottom of the container 10 when the container 10 is mounted on the support stage 21 . The gas discharge pad 61 is made of, for example, a synthetic resin material or is configured to include a spring, and serves to absorb an impact that may occur when the container 10 is mounted on the support stage 21 . can do. According to various embodiments of the present disclosure, the gas discharging pad 61 and the portion in contact with the gas discharging pad 61 in the vessel 10 are each composed of a pad made of a silicon material, so that the vessel 10 is supported by the support stage 21 . ) while absorbing the shock generated when mounted on the two pads having a certain level of frictional force can be configured so that the position of the container 10 with respect to the support stage 21 is not separated.

One or more gas discharge ports 60 may be provided, and in this case, the container 10 has a gas discharge port 60 and a corresponding number of gas outlet holes 16 at the position of the gas discharge port 60, respectively. It may be provided at a corresponding position.

A gas discharge hole 62 may be formed in the gas discharge pad 61 . The gas discharge hole 62 may be connected to the gas discharge unit 40 through the gas discharge pipe 41 . The gas outlet hole 62 may communicate with the gas outlet hole 16 of the container 10 when the container 10 is mounted on the gas outlet pad 61 .

In addition, the purge processing apparatus according to the embodiment of the present invention may include a position detection sensor 71 that is installed on the support stage 21 and detects the position of the container 10 mounted on the support stage 21 . can The position detection sensor 71 may be used to determine whether the container 10 is mounted at a preset position on the support stage 21 . As an example, the position detection sensor 71 may be configured as a contact sensor in contact with the container 10 . As another example, the position detection sensor 71 is composed of a light emitting unit that emits light and a light receiving unit that receives light that is emitted from the light emitting unit and is reflected by the article, It may be configured as a non-contact sensor that determines the existence of an article or measures a distance from the article.

The position detection sensor 71 may be electrically connected to the control unit 90 . A plurality of position detection sensors 71 may be provided on the support stage 21 at preset intervals. Accordingly, since the position of the container 10 can be detected by the plurality of position detection sensors 71 at a plurality of points around the container 10, the position of the container 10 can be detected more accurately.

The control unit 90 can determine whether the container 10 is mounted at a preset position on the support stage 21 based on the position of the container 10 detected by the position detection sensor 71 . . For example, when the vessel 10 is not mounted at a preset position on the support stage 21 , the control unit 90 does not start the operation of supplying a purge gas into the vessel 10 , and the vessel 10 ) may perform an operation of notifying the operator of a situation in which the support stage 21 is not mounted at a preset position on the support stage 21 . When the vessel 10 is mounted at a preset position on the support stage 21 , the control unit 90 controls the gas supply unit 30 to start the operation of supplying the purge gas to the interior of the vessel 10 . can

In addition, the purge processing apparatus according to the embodiment of the present invention is installed on the support stage 21 , the load of the container 10 mounted on the support stage 21 and the object stored in the container 10 . It may include a load detection sensor 81 for detecting a load. The load detection sensor 81 may be configured as a contact sensor in contact with the bottom of the container 10 . For example, the load detection sensor 81 may include a load cell.

The load detection sensor 81 may be electrically connected to the control unit 90 . A plurality of load detection sensors 81 may be provided on the support stage 21 at preset intervals. Therefore, since the load of the container 10 and the object can be detected at a plurality of points relative to the container 10, the load of the container 10 and the object can be detected more accurately.

The control unit 90 sends the purge gas to the inside of the container 10 based on the load of the container 10 detected by the load detection sensor 81 and the load of the object accommodated in the container 10 . The supply operation can be started. That is, when a load within a predetermined range is detected by the load detection sensor 81 , the control unit 90 determines that the container 10 is mounted on the support stage 21 , and the gas supply unit 30 . may be controlled to start an operation of supplying a purge gas into the container 10 .

The control unit 90 , based on the load of the container 10 detected by the load detection sensor 81 and the load of the object accommodated in the container 10 , the purge supplied to the inside of the container 10 . The flow rate of gas can be controlled. Since the load detected by the load detection sensor 81 is the sum of the load of the container 10 and the load of the object accommodated in the container 10, as the number of objects accommodated in the container 10 increases, the load detection sensor ( 81) increases the load detected. Accordingly, the control unit 90 calculates the number of objects accommodated in the container 10 based on the load detected by the load detection sensor 81 , and based on the calculated number of objects, the container 10 ) can control the flow rate of the purge gas supplied to the inside. For example, when the number of objects is large, the space between the objects occupying the inside of the container 10 , that is, the width of the flow path through which the purge gas passes, is small, so that the control unit 90 moves into the container 10 . By increasing the flow rate of the supplied purge gas, the purge gas can smoothly circulate in the vessel 10 . Conversely, when the number of objects is small, the space between the objects occupying the container 10, that is, the width of the flow path through which the purge gas passes, is large, so the control unit 90 reduces the flow rate of the purge gas and It is possible to prevent the purge gas from being supplied into the vessel 10 at an excessive flow rate.

Hereinafter, a purge treatment method of purging a container using a purge treatment apparatus according to an embodiment of the present invention will be described with reference to FIGS. 3 and 4 .

First, as shown in FIG. 3 , a container 10 in which an object to be subjected to a purge process is accommodated is mounted on the support stage 21 ( S10 ). At this time, the control unit 90 determines whether the load detection sensor 81 detects a preset load of the container 10 , and based on this, whether the container 10 is mounted on the support stage 21 . can be judged

And the position of the container 10 on the support stage 21 is detected using the position detection sensor 71 (S20).

And, based on the position of the container 10 detected by the position detection sensor 71 , the control unit 90 determines whether the container 10 is positioned at a preset position on the support stage 21 . (S30).

At this time, if the container 10 is not mounted at a preset position on the support stage 21 , the control unit 90 does not start the operation of supplying the purge gas into the container 10 , and operates the purge processing device. can be stopped (S40). In this case, the control unit 90 may perform an operation of notifying the operator that the container 10 is not mounted at a preset position on the support stage 21 .

When the container 10 is mounted at a preset position on the support stage 21 , the control unit 90 may determine a flow rate of the purge gas to be supplied into the container 10 ( S50 ).

Here, as shown in FIG. 4 , the step of determining the flow rate of the purge gas to be supplied into the vessel 10 ( S50 ) includes the load of the vessel 10 and the vessel 10 using the load detection sensor 81 . ) of detecting the load of the object accommodated in (S51) and determining the flow rate of the purge gas based on the detected load of the object (S52).

Here, the load of the object can be detected by subtracting the known load of the container 10 from the load detected by the load detection sensor 81 .

Here, in the step of determining the flow rate of the purge gas based on the detected load of the object ( S52 ), the control unit 90 controls the container 10 based on the load of the object detected by the load detection sensor 81 . ) may be calculated, and the flow rate of the purge gas to be supplied into the container 10 may be adjusted based on the calculated number of objects.

Here, the number of objects accommodated in the container 10 can be calculated by dividing the weight of the object detected by the load detection sensor 81 by the unit weight of the object (weight of each object).

As such, when the flow rate of the purge gas to be supplied into the container 10 is determined, the purge gas is supplied into the container 10 at the determined flow rate (S60). In this case, the flow rate of the purge gas supplied into the container 10 may be adjusted by differently setting the flow rates of the purge gas passing through the plurality of gas supply ports 50 . As another example, all of the plurality of gas supply ports 50 are opened, or some of the plurality of gas supply ports 50 are opened, so that the flow rate of the purge gas supplied into the container 10 may be adjusted. For example, after the container 10 is seated on the support stage 21 , the control unit 90 has a low air pressure inside the container 10 for a certain period of time (eg, 60 seconds) so as to quickly supply gas. (eg, 20 LPM), and when a predetermined time elapses or the gas inside the container 10 reaches a predetermined pressure, the gas may be supplied at a relatively low pressure (eg, 5 LPM).

According to the purge processing apparatus and the purge processing method according to the embodiment of the present invention as described above, the flow rate of the purge gas is adjusted by setting different flow rates of the purge gas passing through the plurality of gas supply ports 50 , or the plurality of gases Since the purge gas can be supplied into the container 10 while all or part of the supply port 50 is opened to control the flow rate of the purge gas, the purge gas can be smoothly circulated inside the container 10 and then discharged. can

In addition, according to the purge processing apparatus and the purge processing method according to the embodiment of the present invention, since the purge gas can be supplied to the inside of the container 10 through the plurality of gas supply ports 50 , the supply efficiency of the purge gas can be reduced to the existing one. By improving the contrast, it is possible to reduce operating costs accordingly.

Although preferred embodiments of the present invention have been described by way of example, the scope of the present invention is not limited to such specific embodiments, and may be appropriately modified within the scope described in the claims.

10: courage
20: frame
21: support stage
30: gas supply unit
40: gas exhaust unit
50: gas supply port
60: gas exhaust port
71: position detection sensor
81: load detection sensor

Claims (15)

delete delete delete delete delete delete delete delete delete a support stage on which a container in which an object is accommodated is mounted; a gas supply port installed on the support stage and communicating with a gas inlet hole of the container when the container is mounted on the support stage; A purge processing apparatus including a gas discharge port communicating with the gas outlet hole of the container when is mounted on the support stage, and a gas supply unit connected to the gas supply port to supply a purge gas to the gas supply port In the purge treatment method of purging the container,
(a) mounting the container on the support stage;
(b) supplying the purge gas at a first flow rate to the gas supply port by the gas supply unit; and
(c) when the condition for changing the flow rate of the purge gas supplied to the gas supply port is satisfied, the purge gas is supplied to the gas supply port by the gas supply unit at a second flow rate smaller than the first flow rate comprising the steps of
The condition for changing the flow rate of the purge gas supplied to the gas supply port is a preset time,
In step (c), the purge gas is supplied to the gas supply port at the first flow rate and then, when the preset time elapses, the purge gas is supplied to the gas supply port at the second flow rate. fuzzy treatment method. delete a support stage on which a container in which an object is accommodated is mounted; a gas supply port installed on the support stage and communicating with a gas inlet hole of the container when the container is mounted on the support stage; A purge processing apparatus including a gas discharge port communicating with the gas outlet hole of the container when is mounted on the support stage, and a gas supply unit connected to the gas supply port to supply a purge gas to the gas supply port In the purge treatment method of purging the container,
(a) mounting the container on the support stage;
(b) supplying the purge gas at a first flow rate to the gas supply port by the gas supply unit; and
(c) when the condition for changing the flow rate of the purge gas supplied to the gas supply port is satisfied, the purge gas is supplied to the gas supply port by the gas supply unit at a second flow rate smaller than the first flow rate comprising the steps of
The condition for changing the flow rate of the purge gas supplied to the gas supply port is the internal pressure of the vessel,
In step (c), the purge gas is supplied to the gas supply port at the first flow rate, and then, when the internal pressure of the vessel reaches or exceeds a preset pressure, the purge gas is supplied to the gas supply port at the second flow rate. A purge treatment method, characterized in that the supply to the port. a support stage on which a container in which an object is accommodated is mounted; a gas supply port installed on the support stage and communicating with a gas inlet hole of the container when the container is mounted on the support stage; A purge processing apparatus including a gas discharge port communicating with the gas outlet hole of the container when is mounted on the support stage, and a gas supply unit connected to the gas supply port to supply a purge gas to the gas supply port In the purge treatment method of purging the container,
(a) mounting the container on the support stage;
(b) supplying the purge gas at a first flow rate to the gas supply port by the gas supply unit; and
(c) when the condition for changing the flow rate of the purge gas supplied to the gas supply port is satisfied, the purge gas is supplied to the gas supply port by the gas supply unit at a second flow rate smaller than the first flow rate comprising the steps of
The condition for changing the flow rate of the purge gas supplied to the gas supply port is the flow rate of the purge gas passing through the gas supply port,
In step (c), when the flow rate of the purge gas passing through the gas supply port changes during the process of supplying the purge gas to the gas supply port at the first flow rate, the purge gas is supplied at the second flow rate. A purge treatment method, characterized in that the supply to the gas supply port. a support stage on which a container in which an object is accommodated is mounted; a plurality of gas supply ports installed on the support stage and communicating with a plurality of gas inlet holes of the container when the container is mounted on the support stage; Purge processing of the vessel using a purge treatment device installed and including a gas discharge port communicating with the gas outlet hole of the vessel when the vessel is mounted on the support stage, and a gas discharge pipe connected to the gas discharge port In the purge treatment method,
(a) mounting the container on the support stage;
(b) determining a flow rate of purge gas to be supplied into the vessel;
(c) adjusting the flow rate of the purge gas by differently setting the flow rate of the purge gas passing through the plurality of gas supply ports, or adjusting the flow rate of the purge gas by opening all or part of the plurality of gas supply ports , supplying the purge gas into the vessel at the flow rate determined in step (b); and
(d) measuring the pressure of the purge gas in the gas discharge pipe, and when the measured pressure reaches a preset pressure, forcibly discharging the gas in the container through the gas discharge pipe; . 15. The method of claim 14,
The purge processing method, characterized in that the flow rate of the purge gas to be supplied into the vessel in step (b) is determined based on at least one of a time, an internal pressure of the vessel, and a current flow rate of the purge gas.

Images