KR102295094B1 - Apparatus and method for controlling test temperature of electronic component, pushing apparatus of test chamber, and test handler for testing electronic component - Google Patents

Abstract

The present invention relates to an electronic component device test temperature control apparatus and method, a pushing apparatus for a test chamber, and an electronic component test apparatus. According to one embodiment of the present invention, there is provided a test temperature controller for controlling a test element to a test temperature in an electronic component test chamber, comprising: a thermoelectric element module formed in each distal end of a pusher for pushing a test element to be tested; and a pattern board for transmitting power to each thermoelectric module connected through a connection cable, wherein each distal end of the pusher is made of a thermally conductive material. In addition, a pushing apparatus and an electronic component test apparatus in a test chamber including a method for controlling an electronic component test temperature and an electronic component test temperature adjusting apparatus are proposed.

Description

Electronic component device test temperature control device and method, pushing device in a test chamber, and electronic component testing device

The present invention relates to an electronic component device test temperature control apparatus and method, a pushing apparatus for a test chamber, and an electronic component test apparatus. Specifically, it relates to an electronic component device test temperature control device and method for adjusting the temperature of a test device to a test temperature using a thermoelectric module, and a pushing device and an electronic component testing device for a test chamber having such a test temperature control device will be.

BACKGROUND ART In general, electronic components or electronic devices such as semiconductor devices such as integrated circuits are manufactured through various testing processes to determine good or defective products.

In this case, an equipment called a test handler is used in the process of testing electronic components or electronic devices. A test handler or handler system is a device that connects electronic components to separate test equipment for testing electronic components, and classifies tested components according to test results. Such a handler system is divided into a transfer area to which the tray containing the device under test is transferred, a test area for testing the device, and a distribution area for distributing the tested devices by good and defective categories, Test and deploy devices in a sequential process. Alternatively, in other words, the handler system largely performs a loading process, a test process, and an unloading process, and performs the above processes by mounting the electronic component elements on a tray provided with a plurality of modules capable of mounting electronic components.

In the test process, tests are performed on the electronic components to be inspected under the set test temperature conditions. In general, in a test process, the temperature of the air in the test chamber is used as a method of adjusting the temperature of the electronic components to be inspected to the test temperature.

Republic of Korea Patent Publication No. 10-2009-0067846 (published on June 25, 2009) Republic of Korea Patent Publication No. 10-2016-0138818 (published on December 6, 2016) Republic of Korea Patent Publication No. 10-2007-0020626 (published on February 22, 2007)

It is difficult to precisely control the test temperature of the electronic component to be inspected in the conventional method of controlling the temperature of the electronic component to be inspected using the air temperature in the test chamber. In addition, heat transfer efficiency or transfer speed is low because air is used as a medium to transfer heat to the electronic component to be inspected.

The present invention is to solve the above-described problem, an electronic component device test temperature control device and method capable of more precisely controlling the temperature of an electronic component device under test to a set test temperature using a thermoelectric module, and pushing of a test chamber An apparatus and an electronic component test apparatus are to be proposed.

In order to achieve the above object, according to one aspect of the present invention, there is provided a test temperature controller for controlling a test element to a test temperature in an electronic component test chamber, and a thermoelectric device formed in each distal end of a pusher for pushing a test element to be tested. element module; and a pattern board for transmitting power to each thermoelectric module connected through a connection cable, wherein each distal end of the pusher is made of a thermally conductive material.
At this time, the test chamber may further include an air inlet for introducing air for primary temperature control. For example, the temperature of the test device may be firstly controlled by the air introduced into the test chamber through the air inflow, and the temperature of the test device may be secondarily adjusted to the test temperature by the thermoelectric module. In this case, the secondary control may be performed to control the temperature of the test device more precisely than the primary control.

In one example, the test element is adjusted to the test temperature by controlling the power supply to the thermoelectric element module by receiving feedback of the sensing temperature of the test element.
In this case, the feedback of the sensed temperature may include feedback of the firstly adjusted temperature.
At this time, in another example, the sensed temperature is sensed by a temperature sensor provided in the test element.

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Alternatively, in another example, the sensing temperature is sensed by a sensing sensor provided at a socket in contact with the test element, a test board in the test chamber, or a distal end of the pusher.

In another example, the pattern board part includes a PCB board provided on a support plate for supporting a pusher unit including a pusher.
In one example, the thermoelectric module is inserted into the inner space of the distal end of the pusher having a hole for adsorbing the test element or inserted into a groove formed at the end of the pusher having a hole for adsorbing the test element directly to the test element. A surface may be exposed for contact.

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Next, in order to achieve the above object, according to another aspect of the present invention, in the pushing device of the test chamber for seating the test element in the socket in the electronic component test chamber and pushing the test element so as to be in contact with the test pin , A plurality of pushers each having a hole for adsorbing the test element at the distal end and having a ventilation passage communicating with the hole at the distal end therein; a body having support holes into which a plurality of pushers are respectively inserted and supported to support the plurality of pushers and move forward according to the driving; and an electronic component device test temperature control device according to an example of the invention as described above as a test temperature control device for adjusting the temperature of the test device in contact with the distal end of the pusher as the body advances to a set test temperature. A pushing device for a test chamber with a test temperature control device is proposed.

At this time, in one example, the body is elastically supported on the support plate, the pusher is inserted into the support hole and elastically supported, and the pattern board part of the test temperature control device is provided on the support plate and formed at the distal end of each pusher. It is made to include a PCB board for transmitting power to each thermoelectric module, and the temperature of the test device can be adjusted to the test temperature by the thermoelectric module.
For example, the thermoelectric module may be inserted into the inner space of the distal end of the pusher or inserted into a groove formed at the distal end of the pusher so that the surface thereof may be exposed to directly contact the test element.

Next, in order to achieve the above object, according to another aspect of the present invention, a plurality of sockets that are provided in the test chamber, supporting the test elements to be seated; a pusher unit having a plurality of pushers for pushing each test element to make an electrical connection for testing; a test board having a plurality of test pins in electrical connection with a test element supported on the socket; and an electronic component device test temperature control device according to an example of the present invention as a test temperature control device supported on the socket and configured to control the pushed test device to a test temperature. At this time, the temperature of the test element may be primarily controlled by the air introduced into the test chamber, and the temperature of the test element may be secondarily adjusted to the test temperature by the thermoelectric module. In this case, the secondary control may be performed to control the temperature of the test device more precisely than the primary control.

In this case, in one example, the pattern board portion of the test temperature controller may include a PCB board that is provided on a support plate for supporting the pusher unit and transmits power to each thermoelectric module formed at the distal end of each pusher.
For example, the pusher unit is provided with support holes into which a plurality of pushers are respectively inserted and supported to support the plurality of pushers and further includes a body that moves forward according to the drive, the body is elastically supported on the support plate and the pusher is supported by the support hole It can be inserted into the elastically supported.
For example, the thermoelectric module is inserted into the inner space of the distal end of the pusher having a hole for adsorbing the test element or inserted into a groove formed at the end of the pusher having a hole for adsorbing the test element so that the surface is in direct contact with the test element. can be exposed.

Next, in order to achieve the above object, according to another aspect of the present invention, as a test temperature control method for controlling the temperature of a test element in an electronic component test chamber to a test temperature, the temperature of the air introduced into the test chamber a first control step of first controlling the temperature of the test device in the test chamber by and in a state in which the end of the pusher made of a thermally conductive material in which the thermoelectric module is provided is in contact with the surface of the test element, the thermoelectric module receives power according to the control and conducts heat transfer to the test element, in parallel with the first adjustment step A second control step of secondarily adjusting the temperature of the test device to the test temperature by doing or sequentially adjusting the temperature of the test device to the test temperature is proposed. In this case, the secondary control may be performed to control the temperature of the test device more precisely than the primary control.
In one example, the first adjustment step is performed by adsorbing the test element into the test chamber at the end of the pusher into the test chamber in which the air of the set temperature is maintained, or introducing air of the set temperature into the test chamber in which the test element is located. performed, and the secondary adjustment step may be performed in a state in which the test element is adsorbed to the pusher distal end, or in a state in which the test element is pushed to the pusher distal end, or both.

In one example, the above-described electronic component device test temperature control method further includes a feedback step of sensing the temperature of the test device to be firstly adjusted and feeding back the sensed temperature to generate a control signal for the second regulation.
In this case, the feedback of the sensed temperature may include feedback of the firstly adjusted temperature.

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According to one embodiment of the present invention, by using the thermoelectric module, the temperature of the electronic component to be inspected can be more precisely adjusted to the set test temperature.

In addition, according to an example of the present invention, heat transfer efficiency or heat transfer speed can be improved by transferring heat to the electronic component under test by using a thermoelectric module instead of an air medium.

According to various embodiments of the present invention, it is apparent that various effects not directly mentioned may be derived by those of ordinary skill in the art from various configurations according to the embodiments of the present invention.

1A and 1B are diagrams schematically showing an electronic component testing apparatus including a pushing device and an electronic component testing temperature control device of a test chamber having an electronic component device test temperature control device according to an embodiment of the present invention, respectively; am.
2 is a diagram schematically illustrating an electronic component device test temperature control device and a test chamber pushing device having the same according to another embodiment of the present invention.
3 is a flowchart schematically illustrating a method for controlling an electronic component device test temperature according to an exemplary embodiment of the present invention.
4 is a flowchart schematically illustrating a method for controlling an electronic component device test temperature according to another embodiment of the present invention.

DETAILED DESCRIPTION OF THE PREFERRED EMBODIMENTS Embodiments of the present invention for achieving the above object will be described with reference to the accompanying drawings. In this description, the same reference numerals mean the same components, and in order to facilitate the understanding of the present invention to those of ordinary skill in the art, the secondary description may be omitted.

In the present specification, unless there is a limitation of 'directly' in connection, coupling, or arrangement relationship of one component with another component, not only the form of 'directly connected, coupled or arranged', but also another component is interposed between them. It may also exist in a form in which it is connected, combined, or arranged.

It should be noted that, although a singular expression is described in this specification, it may be used as a concept representing the whole of a plurality of components unless it is contrary to the concept of the invention or is clearly different or contradictory. In the present specification, descriptions such as 'comprising', 'having', 'comprising', 'comprising' and the like should be understood as the possibility of the presence or addition of one or more other elements or combinations thereof.

The drawings referenced in this specification are examples for explaining an embodiment of the present invention, and shapes, sizes, thicknesses, etc. may be exaggerated for effective description of technical features.

Hereinafter, an electronic component device test temperature control device according to one aspect of the present invention is first examined, an electronic component device test temperature control method according to another aspect of the present invention will be examined, and a test according to another aspect Let's take a look at the chamber's pushing device, and finally, the electronic component test device. In this case, the detailed descriptions of the electronic component device test temperature control device according to the embodiment of the present invention may be applied to the electronic component device test temperature control method, the pushing device of the test chamber, and the electronic component test device according to the embodiment of the present invention. , Also, the descriptions of the electronic component device test temperature control method may be applied to embodiments of the electronic component device test temperature control device, the pushing device of the test chamber, and the electronic component testing device. In addition, descriptions of the pushing device of the test chamber having the electronic component device test temperature control may be applied to the electronic component device test temperature control device, the electronic component device test temperature control method, and the electronic component test device.

[Electronic component device test temperature control device]

First, an electronic component device test temperature control device according to an aspect of the present invention will be described with reference to the drawings. In this case, the electronic component device test temperature control device according to an example of the present invention is a test temperature control device for controlling the test device to the test temperature in the electronic component test chamber.

1A and 1B are diagrams schematically showing an electronic component testing apparatus including a pushing device and an electronic component testing temperature control device of a test chamber having an electronic component device test temperature control device according to an embodiment of the present invention, respectively; am. FIG. 1A shows a state in which the pusher 21 is separated from the test element 1 , and FIG. 1B shows a state in which the pusher distal end 21a is in contact with the surface of the test element 1 . In the state of FIG. 1B , heat is transferred to the test device 1 through the thermoelectric module 11 . 2 is a diagram schematically illustrating an electronic component device test temperature control device and a test chamber pushing device having the same according to another embodiment of the present invention. Note that although not shown in FIG. 2 , a connection cable for connecting the thermoelectric module 11 and the pattern board unit 13 may be provided.

Referring to FIGS. 1A , 1B and/or 2 , an electronic component device test temperature control device 10 according to an example of the present invention includes a thermoelectric device module 11 and a pattern board unit 13 . The thermoelectric module 11 is formed in the distal end 21a of the pusher 21 . Each pusher 21 pushes the test element 1 to be tested. Each pusher distal end 21a is made of a thermally conductive material. The pattern board unit 13 transmits power to the thermoelectric module 11 connected through a connection cable (not shown).

With reference to FIGS. 1A, 1B and/or 2 , the configurations of the electronic component device test temperature control device 10 will be described in detail.

The thermoelectric module 11 is used to precisely control the temperature of the test element (electronic component element under test) 1 in the example of the present invention. Referring to FIGS. 1A, 1B and/or 2 , the thermoelectric module 11 is formed in the distal end 21a of each of the pushers 21 . For example, a plurality of pushers 21 are provided in the electronic component test device using the electronic component device test temperature control device 10 according to an example of the present invention to push the plurality of test devices. At this time, each of the plurality of pushers 21 is provided with a thermoelectric module 11 , and each thermoelectric module 11 may be connected to one pattern board unit 13 through a connection cable (not shown). . On the other hand, the thermoelectric module 11 formed in each pusher distal end portion 21a is inserted into the inner space of the pusher distal end portion 21a, or is inserted into a groove formed at the end of the pusher 21, although not shown, so that the surface may be exposed. . As in the prior art, the temperature of the test element 1 is not entirely controlled by the air temperature in the test chamber, but the test element 1 uses a thermoelectric element module 11 that is in direct contact with the test element 1 through a thermally conductive medium. 1) temperature can be controlled more precisely.

In the example of the present invention, the thermoelectric module 11 serves to convert electrical energy into thermal energy. Examples of the thermoelectric element include a semiconductor thermoelectric element, but the embodiment is not limited thereto. In the case of a semiconductor thermoelectric device using the Peltier effect, heating and cooling are possible. That is, in the case of a semiconductor thermoelectric element, not only heating but also cooling of the test element 1 is possible. For example, by using this, not only the precise test temperature of the test element 1 is implemented, but also the rapid temperature arrival and recovery (or conversion to another temperature) becomes possible.

Each thermoelectric module 11 is connected to the pattern board unit 13 by a connecting cable, receives power transmitted from the pattern board unit 13, converts it into thermal energy, and emits thermal energy. For example, when the Peltier device is used, the emitted thermal energy may be not only heating energy but also cooling energy.

For example, the temperature control of the test device 1 by the thermoelectric module 11 may be a secondary temperature control performed after the first temperature control is performed by the air introduced into the test chamber. At this time, the test chamber may further include an air inlet for introducing air for primary temperature control. For example, the air inlet may be a vent 21b provided in the pusher 21 or a separate inlet (not shown) of the test chamber.
For example, the primary temperature control and the secondary temperature control may be performed sequentially or simultaneously or sequentially overlapping each other. For a detailed description, reference will be made to a temperature control method to be described later. In one example, the test element 1 may be firstly heated by the heated air in the test chamber and secondly precisely heated by the thermoelectric element module 11 secondarily. Alternatively, in the case of cooling, it may be precisely secondarily cooled by the firstly cooled air and secondly by the thermoelectric module 11 .

In one example, when the primary temperature control of the test element 1 is performed by air in the test chamber and the secondary temperature control is performed by the thermoelectric element module 11 , the thermoelectric element module 11 is the test element (1) can be precisely controlled to reach the desired test temperature. In addition, the air in the test chamber used for the primary temperature control may be introduced through a ventilation passage 21b provided in the pusher 21 or a separate inlet (not shown) of the test chamber. For example, referring to FIG. 2 , the vent passage 21b penetrates to the inside of the pusher distal end 21a.

For example, when the thermoelectric module 11 is provided in the inner space of the pusher end portion 21a, the vent passage 21b bypasses or penetrates the thermoelectric module 11 from the rear of the thermoelectric module 11 to the pusher 21 ) can form an open hole at the end. The ventilation passage 21b may be a passage providing pressure for adsorption and desorption of the test element 1 to the pusher distal end portion 21a. For example, by making the pressure in the vent passage 21b lower or close to vacuum, the test element 1 is adsorbed to the pusher distal end 21a, and the pusher 21 is pushed to place the test element 1 on the socket 50. can be mounted on Also, in one example, the ventilation passage 21b may be used as a passage for introducing air into the test chamber. In this case, the temperature of the test element 1 may be first adjusted within a set range of the set test temperature by the air introduced into the test chamber through the vent passage 21b.

In addition, for example, after temperature control of the test element 1 by the thermoelectric element module 11, the thermoelectric element module 11 is used even though it is restored to the original temperature or converted to a different temperature condition for testing under different temperature conditions. can be

For example, in one example, the thermoelectric module 11 may adjust the temperature of the test element 1 according to the control by feedback of the sensed temperature for the test element 1 . That is, the test element 1 can be adjusted to the test temperature by controlling the power supply to the thermoelectric element module 11 by receiving feedback of the sensing temperature of the test element 1 supported by the socket 50 . For example, the power supply to the thermoelectric module 11 may be controlled by receiving feedback on the detection result of the temperature firstly adjusted by the air in the test chamber. For example, the feedback temperature control may be performed by the control unit of the electronic component test apparatus in which the test temperature control apparatus 10 according to an example of the present invention is used.

In this case, the sensed temperature may be sensed by a temperature sensor (not shown) provided in the test element 1 . When the test element 1 includes a temperature sensor, the temperature of the test element 1 supported by the socket 50 in the test chamber is sensed, and the sensed result can be fed back to control the thermoelectric element module 11 . have. For example, the temperature sensor (not shown) provided in the test element 1 may feedback the sensing result through the socket 50 in contact with the test element 1 or the test board 70 in the test chamber.

Alternatively, in another example, the sensing temperature is to be sensed by a sensing sensor (not shown) provided in the socket 50 in contact with the test element 1 , the test board 70 in the test chamber, or the pusher distal end 21a. can For example, a detection sensor (not shown) may be provided on the socket 50 on which the test element 1 is seated and supported so that the detection sensor and the test element 1 may be in contact. Alternatively, when a detection sensor (not shown) is provided on the test board 70 , the detection sensor may be provided on the test board 70 separately from the test pin 71 electrically connected to the test element 1 . The test board 70 includes a plurality of test pins 71 for performing a test through electrical connection with the test element 1 . Alternatively, although not shown, when a detection sensor is provided at the pusher distal end 21a, the distal end 21a region provided with a detection sensor (not shown) is in contact with the thermoelectric module 11 and the distal end 21a and other regions It may be formed to be thermally insulated by an insulator.

Meanwhile, the test element to be tested (the electronic component element to be inspected) 1 is seated and supported in the socket 50 in the test chamber. The test element 1 may be seated on the socket 50 by the pusher 21 . For example, each pusher 21 may adsorb the test element 1 to seat the test element 1 on the socket 50 . For example, the adsorption pressure of the pusher 21 with respect to the test element 1 is adjusted through the vent passage 21b penetrating to the inside of the pusher distal end 21a, and the test element 1 can be adsorbed and desorbed. The test element 1 may be seated on the socket 50 by adsorption and desorption of the test element 1 .

In addition, referring to FIG. 1B , each pusher 21 pushes the test element 1 supported on the socket 50 , and the test element 1 and the test pin 71 provided on the test board 70 . Make an electrical connection between them. For example, if the test element 1 pushed by the pusher 21 comes into contact with the test board 70 shown in FIG. 1B or continues to be pushed after contacting, a hole or groove (not shown) of the test board 70 . The test pin 71 elastically supported therein may be in contact with the back surface of the test element 1 . In order for the heat by the thermoelectric module 11 to be transferred to the test element 1, the pusher end 21a must be in contact with the surface of the test element 1 by pushing by the pusher 21, so the thermoelectric module 11 ), the pushing of the pusher 21 for heat transfer may be performed in the process of pushing the test element 1 to perform the test. That is, referring to FIG. 1B , the front surface of the test element 1 and the pusher distal end 21a are pushed by the pusher 21 until the back surface of the test element 1 and the test pin 71 come into contact or after contact. is in contact, and heat transfer by the thermoelectric module 11 may be achieved.

The seating support of the test element 1 on the socket 50 by the pushing of the pusher 21, heat transfer by the contact between the surface of the test element 1 and the pushing end part 21a, and the test element 1 The test or test preparation by the contact between the back surface and the test pin 71 may be performed in one pushing process. Alternatively, as shown in FIG. 1A , after the test element 1 is seated on the socket 50 , the pusher distal end 21a spaced apart from the test element 1 is the pusher 21 as shown in FIG. 1B . While re-contacting the surface of the test element 1 by pushing, heat transfer and A test or test preparation may be performed by the contact between the back surface of the test element 1 and the test pin 71 .

Next, look at the pattern board unit 13 . The pattern board unit 13 transmits power to the thermoelectric module 11 connected by a connecting cable (not shown). For example, referring to FIGS. 1A, 1B and/or 2 , the pattern board unit 13 may include a PCB board on which pattern lines for transmitting power are formed. By transmitting power to each of a plurality of thermoelectric modules 13 through a plurality of pattern lines on one pattern board unit 13, it is possible to solve problems of complexity and/or space efficiency compared to a method using a cable.

For example, although not shown, the pattern board unit 13 receives power from a power supply provided in the electronic component test device through a connection such as a flexible cable, and transmits power to the thermoelectric module 11 connected by a supply connection cable. have. In this case, the pattern board part 13 may be provided on the support plate 30 supporting the pusher unit 20 . At this time, the pusher unit 20 includes pushers 21 for pushing the test element 1 and is supported on the support plate 30 . 1A and 1B, the pusher unit 20 is shown to be disposed on the pattern board unit 13, but since it is only a schematic illustration, the pusher unit 20 in actual implementation avoids the pattern board unit 13 area. Or it may be installed directly on the support plate 30 through or installed on the pattern board part 13 as shown.

For example, referring to FIG. 2 , the pusher unit 20 including the pushers 21 may be elastically supported on the support plate 30 . The pusher unit 20 is elastically supported by the support plate 30, and as the pusher 21 provided in the pusher unit 20 pushes the test element 1, the pusher distal end that comes into contact with the surface of the test element 1 Heat transfer by the thermoelectric module 11 may be performed through (21a).

The pusher distal end 21a may be made of a thermally conductive material. For example, a portion in contact with the surface of the test element 1 may be made of a thermally conductive material as a medium for heat transfer between the thermoelectric element module 11 and the test element 1 . For example, the thermally conductive material may be a copper material, but is not limited thereto.

[How to control the temperature of electronic component test]

Next, an electronic component device test temperature control method according to another aspect of the present invention will be described with reference to the drawings. In this case, reference may be made to FIGS. 1A, 1B and 2 and embodiments of the electronic component device test temperature control device according to one aspect described above, and overlapping descriptions may be omitted.

3 is a flowchart schematically illustrating a method for controlling an electronic component device test temperature according to an embodiment of the present invention, and FIG. 4 is a flowchart schematically illustrating a method for controlling an electronic component device test temperature according to another exemplary embodiment of the present invention. It is a flow chart.

The electronic component device test temperature control method according to the present invention is a test temperature control method for adjusting the temperature of the test device 1 to the test temperature in the electronic component test chamber. Referring to FIGS. 3 and/or 4 , a method for controlling an electronic component device test temperature according to an example includes a first adjusting step ( S100 ) and a second adjusting step ( S300 ). In parallel or sequentially with the first adjustment step

Also, referring to FIG. 4 , the method for controlling the test temperature of an electronic component device according to an example may further include a feedback step ( S200 ). Each step will be described in detail with reference to FIGS. 3 and/or 4 .

The first adjustment step (S100) will be described with reference to FIGS. 3 and/or 4 . In the first adjustment step ( S100 ), the temperature of the test element 1 in the test chamber is primarily adjusted by the temperature of the air introduced into the test chamber. In this case, the primary temperature control may be heating or cooling of the temperature of the test element 1 . For example, in one example, the primary temperature control may be to heat the temperature of the test element 1 . The primary temperature control may be adjusted within a set range of a desired test temperature. Alternatively, the primary temperature control may be temperature control through exposure for a set time under a set air temperature.

For example, the first adjustment step ( S100 ) is performed while the time elapses for a predetermined time by seating the test element 1 on the socket 50 in the test chamber containing air of a set temperature, or the socket ( 50), while the test element 1 is supported on the test chamber, air of a set temperature may be injected into the test chamber. Alternatively, the first adjustment step ( S100 ) may be performed in the process of seating the test element 1 on the socket 50 in the test chamber filled with air of a set temperature. In addition, temperature control may be performed in the first adjusting step ( S100 ) through a combination of two or more of the above-described methods.

For example, in the first adjustment step ( S100 ), air of a set temperature may be injected into the test chamber to maintain the air in the test chamber at a set temperature. For example, the injection of air at a set temperature may be performed through a vent passage 21b penetrating to the inside of the pusher distal end portion 21a or through a separate inlet (not shown) provided in the test chamber.

For example, in one example, the first adjustment step (S100) is performed by adsorbing the test element 1 to the pusher distal end 21a into the test chamber in which air of a set temperature is maintained and introducing the test element 1 into the test chamber, or the test element ( 1) can be performed by introducing air at a set temperature into the test chamber. The state in which the test element 1 is adsorbed and introduced into the test chamber is a state in which the test element 1 is moved to be seated on the socket 50 in the test chamber.

Next, with reference to FIGS. 3 and/or 4, the secondary adjustment step (S300) will be described. In the second adjustment step ( S300 ), for example, as shown in FIG. 1B , the pusher distal end 21a made of a thermally conductive material in which the thermoelectric module 11 is provided is in contact with the surface of the test element 1 . , the thermoelectric module 11 receives power according to the control and transfers heat to the test device 1 . At this time, in the second adjusting step (S300), the temperature of the test element 1 is secondarily adjusted to the test temperature in parallel with the first adjusting step (S100) or sequentially after the first adjusting step (S100). For example, the heat transfer to the test device 1 by the thermoelectric module 11 in the second adjustment step S300 may be heating or cooling. In this case, the secondary control may be performed to control the temperature of the test device more precisely than the primary control.
In one example, the heat transfer to the test device 1 by the thermoelectric module 11 in the second adjusting step (S300) is performed in parallel with the first adjusting step (S100) or sequentially after the first adjusting step (S100) It can be performed by precisely heating the test element 1 secondarily. 3 and 4, the first adjustment step (S100) and the second adjustment step (S300) are sequentially illustrated, but may be performed in parallel as described above, or even if performed sequentially, the progress of each step is partially This may result in temporal overlap.

For example, in one example, the second adjusting step S300 is performed in a state in which the test element 1 is adsorbed to the pusher distal end 21a or in a state in which the test element 1 is pushed to the pusher distal end 21a. It may be performed or performed in both conditions. The state in which the test element 1 is adsorbed to the pusher distal end 21a means a state in which the test element 1 is moved to seat the test element 1 on the socket 50 and/or the state in which the test element 1 is moved onto the socket 50 states that it is anchored in In addition, the state of pushing the test element 1 to the pusher distal end 21a refers to a state in which the back surface of the test element 1 moves to contact the test pin 71 and/or pushing to maintain such contact. state to say

Referring to FIG. 4 , a method of controlling an electronic component device test temperature according to another example will be described. Referring to FIG. 4 , the electronic component device test temperature control method according to an example further includes a feedback step ( S200 ). In the feedback step (S200), the detection result is fed back to detect the temperature of the test element (1) firstly adjusted in the first adjustment step (S100) and to generate a control signal for the second adjustment. At this time, when the temperature of the test element 1 is secondarily adjusted according to the feedback in the feedback step S200, the second temperature adjustment may be a one-time adjustment, and in a preferred example, through a continuous feedback process It may be temperature control.

[test of the chamber pushing device]

Next, a pushing device of a test chamber having a test temperature control device according to another aspect of the present invention will be described with reference to the drawings. In this case, reference may be made to the embodiments of the electronic component device test temperature control device according to one aspect described above, and overlapping descriptions may be omitted.

1A and 1B are views schematically showing a pushing device of a test chamber having an electronic component device test temperature control device according to an embodiment of the present invention, respectively, and FIG. 2 is another embodiment of the present invention. It is a diagram schematically showing an electronic component device test temperature control device and a pushing device of a test chamber having the same.

Referring to FIGS. 1A, 1B and/or 2 , the pushing device of a test chamber having an electronic component device test temperature control device according to an example seats the test device 1 in the socket 50 in the electronic component test chamber. It is a pushing device of the test chamber that pushes the test element (1) to be in contact with the test pin (71). At this time, the pushing device of the test chamber having the electronic component device test temperature control device according to an example includes a plurality of pushers 21 , the body 22 and the electronic component device test temperature control device according to an example of the above-described invention. device 10 .

Each of the plurality of pushers 21 is provided with a hole for adsorbing the test element 1 at the distal end 21a, and a ventilation path 21b communicated to the hole of the distal end 21a therein. For example, a groove is formed around the hole formed in the end face of the pusher end portion 21a to prevent damage to the test element 1 by, for example, substantial vacuum adsorption when the test element 1 is adsorbed.

The pusher distal end portion 21a is made of a thermally conductive material. For example, the thermally conductive material may be a copper material, but is not limited thereto.

In addition, a thermoelectric module 11 to be described later may be placed inside the pusher distal end 21a or in a groove formed in the pusher distal end 21a.

The body 22 is provided with support holes 22a into which the plurality of pushers 21 are respectively inserted and supported to support the plurality of pushers 21 and move forward according to the driving. As the body 22 advances, the pusher 21 may advance to push the test element 1 . For example, the pusher 21 may be elastically supported by being inserted into the support hole 22a of the body 22 . When the pusher 21 is elastically supported in the support hole 22a of the body 22, the body 22 is also elastically supported on the support plate 30 to be described later so that the pusher 21 is doubled. It can be elastically supported. For example, the elastic support force of the pusher 21 with respect to the body 22 may have a smaller elastic force than the elastic support force of the body 22 with respect to the support plate 30 . Accordingly, when the pusher distal end portion 21a pushes and presses the test element 1 , the impact force applied to the test element 1 can be more relaxed.

For example, the body 22 may be driven by the support plate 30 by a separate driving source to drive the body 22 supported on the support plate 30 . Alternatively, the body 22 may be implemented to be directly driven by a separate driving source (not shown).

In one example, the body 22 may be elastically supported on the support plate 30 . For example, in this case, when the support plate 30 is driven by a separate driving source and causes the body 22 to be driven, the support plate 30 may be a part of the pushing device of the test chamber. Although the body 22 is shown as being supported on the pattern board part 13 in FIGS. 1A and 1B , in actual implementation, the body 22 avoids or penetrates the pattern board part 13 area and is on the support plate 30 . It may be directly supported on or supported on the support plate 30 via the pattern board part 13 as shown.

The plurality of pushers 21 and the body 22 form a pusher unit 20 in an electronic component test device to be described later.

Next, the electronic component device test temperature control device 10 adjusts the temperature of the test device 1 in contact with the distal end 21a of the pusher 21 as the body 22 advances to a set test temperature. The electronic component device test temperature control device 10 includes a thermoelectric module 11 and a pattern board unit 13 . For a detailed description of the electronic component device test temperature control device 10, reference will be made to one example of the above-described invention.

For example, the pattern board part 13 of the electronic component device test temperature control device 10 may include a PCB board. At this time, the PCB board forming the pattern board part 13 is provided on the support plate 30 to transmit power to each thermoelectric element module 11 formed in each pusher end part 21a. For example, each of a plurality of thermoelectric module 11 and a connection cable is connected in one pattern board unit 13 , and power is supplied to each thermoelectric module 11 . Accordingly, the temperature of the test element 1 may be adjusted to the test temperature by the thermoelectric element module 11 .

[Electronic component test device]

Next, an electronic component test apparatus according to another aspect of the present invention will be described with reference to the drawings. In this case, reference may be made to the embodiments of the electronic component device test temperature control device according to the one aspect described above, the embodiments of the pushing device of the test chamber, and FIG. 2 , and overlapping descriptions may be omitted.

1A and 1B are diagrams schematically illustrating an electronic component test apparatus including an electronic component device test temperature control apparatus according to an exemplary embodiment of the present invention, respectively.

1A and/or 1B, an electronic component test apparatus according to an example includes a plurality of sockets 50, a pusher unit 20, a test board 70, and an electronic component device test temperature controller 10. made including The electronic component device test temperature control device 10 may be each device for controlling the temperature of each test device 1 , or may be a single device as an integral part thereof.

A plurality of sockets 50 are provided in the test chamber. The test chamber is a space in which tests of the test elements 1 are performed. In Figures 1a, 1b and 2, reference numeral S denotes a test chamber space. A plurality of sockets 50 support the test elements 1 on which they are respectively seated. Although not directly shown, in FIGS. 1A, 1B and/or 2, the socket 50 is formed to be supported in the test chamber. The socket 50 may serve to support the test element 1 at an accurate position so that the test element 1 makes accurate contact with the test pin 71 during the test process. For example, according to the pushing of the pusher unit 20 , the socket 50 on which the test element 1 is seated and supported is coupled to the test board 70 , and a groove is formed on the lower side of the socket 50 to be attached to the test board 70 . By matching the formed guide pin 72 to be seated in the lower groove, the test element 1 can be placed at an accurate position to be tested.

The pusher unit 20 includes a plurality of pushers 21 . Each pusher 21 pushes each test element 1 so that an electrical connection for testing is made. For example, the pusher unit 20 includes a body 22 and a plurality of pushers 21 formed on the body 22 . The body 22 supports a plurality of pushers 21 . The body 22 of the pusher unit 20 is advanced toward the test element 1 , and a plurality of pushers 21 provided on the body 22 pushes each test element 1 .

Referring to FIGS. 1A , 1B and/or 2 , the pusher unit 20 may be supported by a support plate 30 . At this time, the body 22 of the pusher unit 20 may be elastically supported by the support plate 30 by the spring 23 . For example, the support plate 30 is supported in the test chamber, and the pusher unit may be pushed toward the test element 1 according to the forward driving of the support plate 30 . In this case, the support plate 30 together with the pusher unit 20 may constitute the pushing device of the test chamber described above. For example, at this time, the support plate 30 may have a through hole to introduce gas into the vent passage 21b to be described later provided in the pusher unit 20 . Alternatively, in another embodiment, the support plate 30 may be a wall forming the inner space of the test chamber. In this case, the support plate 30 has a through hole, and the support portion of the pusher unit 20 passes through the through hole. And the pusher unit 20 may be supported on the support plate (30). At this time, the pusher unit 20 may be pushed toward the test element 1 by the driving of the support portion of the pushing unit passing through the through hole on the back side of the support plate 30 .

For example, referring to FIGS. 1A, 1B and/or 2 , the pattern board unit 13 may be provided on the support plate 30 . In this case, the pattern board unit 13 is connected to the plurality of thermoelectric module 11 by connecting cables and may include the PCB board itself on which the pattern line is formed or such a PCB board.

For example, referring to FIG. 2 , the pusher 21 may include a vent passage 21b that penetrates to the inside of the distal end 21a. At this time, the vent passage 21b is a passage through which a pressure for adsorbing and desorbing the test element 1 is provided on the pusher end portion 21a. For example, in one example, the ventilation passage 21b may be a passage through which air having a set temperature is introduced into the test chamber. At this time, the temperature of the test element 1 in the test chamber may be primarily adjusted by the air of the set temperature introduced into the test chamber through the vent passage 21b. In another example, the temperature of the test element 1 in the test chamber may be primarily adjusted by air of a set temperature introduced through an inlet (not shown) separately provided in the test chamber.

Next, the test board 70 is provided in the test chamber and includes a plurality of test pins 71 . The test pins 71 of the test board 70 are electrically connected to each of the test elements 1 supported on the socket 50 and pushed to perform a test. Although not shown, the plurality of test pins 71 may be elastically supported in grooves or holes (not shown) of the test board 70 . Referring to FIG. 1B , in a state in which the pusher distal end 21a is in contact with the surface of the test element 1 supported on the socket 50 according to the pushing of the pusher 21 , the back surface of the test element 1 is a test board 70 or the test pin 71 of the test board 70 may be in contact. At this time, the pushing of the pusher 21 may be continued so that all the test elements 1 on the plurality of sockets 50 come into contact with the test pins 71 . That is, continuous pushing of the pusher 21 may be allowed by the test pins 71 elastically supported in the hole or groove of the test board 70 .

Also, for example, the test board 70 may further include guide pins 72 in addition to the test pins 71 , and the guide pins 72 are formed below the socket 50 in which the test element 1 is seated. It is inserted into the lower groove and the socket 50 and the test board 70 can be matched and coupled at the correct position.

Next, the electronic component device test temperature control device 10 will be described. The electronic component device test temperature control device 10 is supported on the socket 50 and controls the temperature of the pushed test device 1 to a set test temperature. As described above in the description of the embodiments of the inventions described above, the electronic component device test temperature control device 10 may adjust the temperature of the test device 1 by the thermoelectric module 11 to be a set test temperature. . For specific descriptions, reference is made to the above.

For example, in one example, the pattern board part 13 of the test temperature controller 10 is provided on the support plate 30 supporting the pusher unit 20 . At this time, the pattern board unit 13 is connected to each thermoelectric element module 11 formed on each pusher end portion 21a by a connection cable (not shown), and power can be transmitted to each thermoelectric element module 11 . .

For example, the temperature of the test element 1 supported by the socket 50 is first adjusted by the air flowing into the test chamber, and the temperature of the test element 1 is set to the set test temperature by the thermoelectric module 11 . Secondary adjustments can be made. The primary temperature control of the test element 1 is performed by air in the test chamber. For example, the first temperature control may be performed by introducing air of a set temperature into a chamber in which the test element 1 is provided or by introducing the test element 1 into a chamber in which air of a set temperature is maintained. At this time, the air in the test chamber may be introduced through an inlet (not shown) separately formed in the test chamber or may be introduced through a vent passage 21b penetrating to the inside of the pusher distal end 21a.
In this case, the secondary control may be performed to control the temperature of the test device more precisely than the primary control.

For example, the primary temperature control and the secondary temperature control may be performed in parallel or sequentially, and the temperature control process may be partially overlapped in time.

In the above, the above-described embodiments and the accompanying drawings are illustratively described to help those of ordinary skill in the art for the present invention, rather than limiting the scope of the present invention. In addition, embodiments according to various combinations of the above-described configurations may be apparent to those skilled in the art from the above detailed descriptions. Accordingly, various embodiments of the present invention can be implemented in modified forms without departing from the essential characteristics of the present invention, and the scope of the present invention should be interpreted according to the invention described in the claims, and it is common in the art Various modifications, alternatives, and equivalents are included by those with knowledge of

1: test element 10: test thermostat
11: thermoelectric element module 13: pattern board part
20: pusher unit 21: pusher
21a: pusher distal end 21b: vent passage
22: body 22a: support hole
23: spring 30: support plate
50: socket 70: test board
71: test pin 72: guide pin

Claims (13)

A test temperature controller for controlling a test element to a test temperature in an electronic component test chamber, comprising:
a thermoelectric element module formed in the distal end of each pusher for pushing the test element to be tested; and
Includes; pattern board unit for transmitting power to each of the thermoelectric module connected through a connection cable;
Further comprising an air inlet for introducing air for primary temperature control into the test chamber,
The distal end of each pusher is made of a thermally conductive material,
The temperature of the test element is primarily controlled by the air introduced into the test chamber through the air inlet,
The temperature of the test element is secondarily adjusted to the test temperature by the thermoelectric module, and the second adjustment is performed to control the temperature of the test element more precisely than the first adjustment,
Controlling the power supply to the thermoelectric module by receiving feedback of the sensing temperature of the test element to adjust the test element to the test temperature,
The electronic component device test temperature control device, characterized in that the feedback of the sensed temperature includes the feedback of the firstly adjusted temperature.
delete In claim 1,
The sensing temperature is an electronic component device test temperature control device, characterized in that detected by a temperature sensor provided in the test device.
In claim 1,
The sensing temperature is detected by a socket in contact with the test element, a test board in the test chamber, or a sensing sensor provided at the distal end.
In any one of claims 1, 3, 4,
The electronic component device test temperature control device, characterized in that the pattern board portion comprises a PCB board provided on a support plate for supporting the pusher unit including the pusher.
In any one of claims 1, 3, 4,
The thermoelectric element module is inserted into the inner space of the distal end of the pusher having a hole for adsorbing the test element or inserted into a groove formed at the end of the pusher having a hole for adsorbing the test element to the test element. Electronic component device test temperature control device, characterized in that the surface is exposed to be in direct contact.
In the electronic component test chamber, the pushing device of the test chamber for seating the test element in a socket and pushing the test element so as to be in contact with the test pin,
a plurality of pushers each having a hole at the distal end for adsorbing the test element and having a ventilation passage communicating therein to the hole at the distal end;
a body having support holes into which the plurality of pushers are respectively inserted and supported to support the plurality of pushers and move forward according to the driving; and
The electronic component device test temperature control device according to any one of claims 1, 3, and 4 as a test temperature control device for adjusting the temperature of the test device in contact with the distal end of the pusher as the body advances to a set test temperature; A pushing device for a test chamber having a test temperature control device comprising:
In claim 7,
The body is elastically supported on the support plate,
The pusher is elastically supported by being inserted into the support hole,
The pattern board part of the test temperature control device is provided on the support plate and comprises a PCB board configured to transmit power to each of the thermoelectric element modules formed at the distal end of each pusher,
The thermoelectric module is inserted into the inner space of the distal end of the pusher or inserted into a groove formed at the distal end of the pusher so that the surface is exposed to directly contact the test element,
A pushing device for a test chamber having a test temperature control device, characterized in that the temperature of the test device is adjusted to the test temperature by the thermoelectric module.
a plurality of sockets provided in the test chamber to support the test elements to be seated;
a pusher unit having a plurality of pushers for pushing each test element to make an electrical connection for testing;
a test board supported on the socket and having a plurality of test pins in electrical connection with the pushed test element; and
A test temperature control device for controlling the test device to a test temperature, the electronic component device test temperature control device according to any one of claims 1, 3, and 4;
The temperature of the test element is primarily controlled by the air introduced into the test chamber,
Secondary control of the temperature of the test element to the test temperature by the thermoelectric module, and the second adjustment is performed to control the temperature of the test element more precisely than the first adjustment Device.
In claim 9,
The pusher unit further includes a body that supports the plurality of pushers by having support holes into which the plurality of pushers are respectively inserted and supported and moves forward according to the driving,
The body is elastically supported on the support plate and the pusher is inserted into the support hole and elastically supported,
The pattern board part of the test temperature control device is provided on a support plate for supporting the pusher unit and comprises a PCB board for transmitting power to each of the thermoelectric module modules formed at the distal end of each pusher,
The thermoelectric element module is inserted into the inner space of the distal end of the pusher having a hole for adsorbing the test element or inserted into a groove formed at the end of the pusher having a hole for adsorbing the test element to the test element. Electronic component test device, characterized in that the surface is exposed to be in direct contact.
A test temperature control method for controlling a temperature of a test device to a test temperature in an electronic component test chamber, comprising:
a first adjusting step of first controlling the temperature of the test device in the test chamber by the temperature of the air introduced into the test chamber; and
In a state in which the end of the pusher made of a thermally conductive material in which the thermoelectric module is provided is in contact with the surface of the test element, the thermoelectric module receives power according to the control and transfers heat to the test element, and the primary control A secondary control step of secondarily adjusting the temperature of the test element to the test temperature in parallel or sequentially with the step;
The second control is performed to control the temperature of the test element more precisely than the first control,
The first adjusting step is performed by adsorbing the test element into the test chamber at the end of the pusher into the test chamber in which air of a set temperature is maintained, and introducing the test element into the test chamber, or air of a set temperature into the test chamber in which the test element is located. introduced and carried out,
The second adjusting step is performed in a state in which the test element is adsorbed to the pusher distal end, or in a state in which the test element is pushed to the pusher distal end, or in both states,
The test temperature control method further comprises a feedback step of sensing the temperature of the test element to be firstly adjusted and feeding back the sensed temperature to generate a control signal for the second adjustment,
The electronic component device test temperature control method, characterized in that the feedback of the sensed temperature includes the feedback of the firstly adjusted temperature.
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