KR102252463B1 - Secondary winding for high voltage transformer and high voltage transformer with the same - Google Patents

Abstract

An embodiment according to the present invention provides a secondary winding for a high voltage boosting apparatus, wherein the secondary winding is included in the high voltage boosting apparatus together with a primary winding, and the secondary winding forms a tapered shape by stacking a plurality of printed circuit boards whose areas gradually decrease. Each of the printed circuit board includes: an insulating layer having a hollow space therein; at least one line pattern formed on at least one surface of the insulating layer; a front side pad unit formed on one surface of the insulating layer and connected to one end of the line pattern; a rear side pad unit formed on the other surface of the insulating layer and connected to the other end of the line pattern; a first cutting unit curved toward the inner side portion from the outer side portion of the insulation layer; a second cutting unit formed at a position different from that of the first cutting unit; a first side pad unit formed on the inner side surface of the first cutting unit; and a second side pad unit formed on the inner side surface of the second cutting unit, wherein the front side pad unit and the first side pad unit are electrically connected to each other, and the rear side pad unit and the second side surface pad unit are electrically connected to each other.

Description

Secondary winding for high voltage transformer and high voltage transformer with the same

The present invention relates to a secondary winding for a high voltage boosting device and a high voltage boosting device including the same.

The broadband high-power pulse generator easily realizes extreme conditions such as ultra-high temperature, super magnetic field, and ultra-high electric field by emitting pulses with a voltage of several hundred kV or more within a very short time, such as a pulse rise time of 1 ns or less. It is used in various fields such as -ray, electron acceleration, nuclear fusion generation, electron beam generation, and explosion.

There is a technique described in Non-Patent Document 1 as a conventional technique for generating such a high voltage. 1 is a diagram showing a schematic appearance of a conventional high-voltage broadband pulse generator described in Non-Patent Document 1;

The pulse generator 10 includes a unipolar pulse generator 1 that generates unipolar pulses of up to 150 kV and 4.5 ns with an AC input of 380 V, a unipolar pulse generator 1 that generates unipolar pulses, and a gap switch. (3) and a transmission line (4) and a unipolar pulse generator (1) including a bipolar pulse generator (5) and an antenna (7) for converting the generated pulse into a bipolar pulse of up to 120 kV, 1.0 ns, The unipolar pulse generator 1 uses a Tesla transformer.

2 is a diagram showing the appearance of a secondary winding used in the Tesla transformer described in Non-Patent Document 2;

Referring to FIG. 2, the secondary winding is made by winding paper on a tapered mockup, applying an adhesive on the paper, winding a single copper wire on the paper, solidifying the adhesive, and separating the paper and the coil.

The secondary winding made in this way may generate bubbles or contain impurities in the adhesive, and insulation may be destroyed by the bubbles or impurities, thereby causing disconnection of the secondary winding.

High-power ultrawideband radiation source, Lager and Particle Beams (2003), 2l, p211-217, Cambridge University Press A multi-functional high voltage experiment apparatus for vacuum surface flashover switch research, REVIEW OF SCIENTIFIC INSTRUMENTS 86, 043302 (2015), 2015 AIP Publishing LLC

An object of the present invention is to provide a secondary winding for a high voltage boosting device capable of preventing insulation breakdown due to bubbles or impurities in the secondary winding, and a high voltage boosting device including the same.

In the secondary winding for a high voltage booster according to an embodiment of the present invention, in the secondary winding included in the high voltage booster together with the primary winding, the secondary winding includes a plurality of printed circuit boards whose area gradually decreases. It is laminated to form a tapered shape, and the printed circuit board includes an insulating layer having a hollow therein, at least one line pattern formed on at least one surface of the insulating layer, and formed on one surface of the insulating layer, and the line A front pad portion connected to one end of the pattern, a rear pad portion formed on the other surface of the insulating layer and connected to the other end of the line pattern, a first cutting portion curved from an outer portion to an inner portion of the insulating layer, A second cutting portion formed at a different position from the first cutting portion, a first side pad portion formed on an inner surface of the first cutting portion, and a second side pad portion formed on an inner surface of the second cutting portion The front pad portion and the first side pad portion may be electrically connected to each other, and the rear pad portion and the second side pad portion may be electrically connected to each other.

In the present invention, the line pattern may be formed such that one end of the insulating layer is continuously circumscribed without disconnection, and one end is connected to the front pad part and the other end is connected to the rear pad part.

In the present invention, the printed circuit boards may be stacked while the front pad portion of the n-th printed circuit board and the rear pad portion of the n+1-th printed circuit board are in contact with each other.

In the present invention, the line pattern may be formed around one surface of the insulating layer and also formed on the other surface of the insulating layer.

In the present invention, a first via hole passing through the insulating layer may be further included so that a line pattern on one surface of the insulating layer and a line pattern on the other surface of the insulating layer are connected.

In the present invention, an insulating member formed between the stacked printed circuit boards may be further included.

In the present invention, the line pattern may surround one surface of the insulating layer and may not be formed on the other surface of the insulating layer.

In the present invention, one end of the line pattern may be connected to the front pad part, and the other end of the line pattern may be connected to the rear pad part.

In the present invention, a second via hole passing through the insulating layer may be further included so that the other end of the line pattern is connected to the rear pad part.

In the present invention, the insulating layer may be stacked as a multilayered insulating film, and a line pattern may be formed at an interface of the insulating film.

In the present invention, the line pattern may not be formed on the rear surface of the insulating layer forming the rear surface of the insulating layer.

In the present invention, the front pad portion may be formed on the entire surface of the insulating layer forming the uppermost portion of the insulating layer, and the rear pad portion may be formed on the rear surface of the insulating layer forming the lowermost portion of the insulating layer.

In the present invention, a third via hole passing through the insulating layer may be included so that the front and rear line patterns of the insulating layer are connected to each other.

In the high voltage boosting device according to an embodiment of the present invention, in a high voltage boosting device including a primary winding and a secondary winding, the secondary winding is located in the hollow of the primary winding, and the secondary winding has an area The plurality of gradually decreasing printed circuit boards are stacked to form a tapered shape, and the printed circuit board includes an insulating layer having a hollow therein, at least one line pattern formed on at least one surface of the insulating layer, and the A front pad portion formed on one surface of the insulating layer and connected to one end of the line pattern, a rear pad portion formed on the other surface of the insulating layer and connected to the other end of the line pattern, and an inner portion from an outer portion of the insulating layer. A first cutting portion curved toward a direction, a second cutting portion formed at a position different from the first cutting portion, a first side pad portion formed on an inner surface of the first cutting portion, and an inside of the second cutting portion A second side pad portion formed on a side surface may be included, and the front pad portion and the first side pad portion may be electrically connected to each other, and the rear pad portion and the second side pad portion may be electrically connected to each other.

According to an embodiment of the present invention, it is possible to prevent insulation breakdown of the secondary winding due to bubbles or impurities by fundamentally blocking the penetration of air bubbles or impurities from the winding process into the secondary winding.

In addition, it is possible to minimize an increase in resistance due to a skin effect by forming multiple line patterns of the printed circuit board constituting the secondary winding.

In addition, by forming the line pattern in multiple paths, some line patterns are disconnected due to insulation breakdown by impurities derived from insulating oil or local overvoltage due to abnormal operation, and the path of the secondary winding using line patterns formed in different paths. Can be maintained.

1 is a diagram showing a schematic appearance of a conventional broadband high-power pulse generator.
FIG. 2 is a view showing the appearance of a secondary winding used in the Tesla transformer of FIG. 1.
3 is a schematic cross-sectional view of a high voltage booster according to an embodiment of the present invention.
4 is a perspective view schematically showing a secondary winding of a high voltage booster according to an embodiment of the present invention.
5 is a plan view schematically showing the printed circuit board of the secondary winding of FIG. 4.
6 is a rear view schematically showing the printed circuit board of the secondary winding of FIG. 4.
7 is a plan view schematically showing a printed circuit board of a secondary winding according to another embodiment of the present invention.
8 is a rear view schematically showing the printed circuit board of the secondary winding shown in FIG. 7.
9 is a plan view schematically showing a printed circuit board of a secondary winding according to another embodiment of the present invention.
10 is a plan view schematically showing a printed circuit board of the secondary winding shown in FIG. 9.
11 is a rear view schematically showing the printed circuit board of the secondary winding shown in FIG. 9.

Since the present invention can be modified in various ways and has various forms, specific embodiments will be illustrated in the drawings and described in detail in the text. However, this is not intended to limit the present invention to a specific form disclosed, it should be understood to include all changes, equivalents, or substitutes included in the spirit and scope of the present invention.

In describing each drawing, similar reference numerals have been used for similar elements. In the accompanying drawings, the dimensions of the structures are shown to be enlarged than actual for clarity of the present invention. Terms such as first and second may be used to describe various elements, but the elements should not be limited by the terms. The above terms are used only for the purpose of distinguishing one component from another component. For example, without departing from the scope of the present invention, a first element may be referred to as a second element, and similarly, a second element may be referred to as a first element. Singular expressions include plural expressions unless the context clearly indicates otherwise.

In the present application, terms such as "comprise" or "have" are intended to designate the presence of features, numbers, steps, actions, components, parts, or combinations thereof described in the specification, but one or more other features. It is to be understood that the presence or addition of elements or numbers, steps, actions, components, parts, or combinations thereof, does not preclude in advance the possibility of the presence or addition. Further, when a part such as a layer, film, region, plate, etc. is said to be "on" another part, this includes not only the case where the other part is "directly above", but also the case where there is another part in the middle. In addition, in the present specification, when a portion of a layer, film, region, plate, etc. is formed on another portion, the formed direction is not limited only to the upper direction, and includes those formed in the side or lower direction. . Conversely, when a part such as a layer, film, region, plate, etc. is said to be "below" another part, this includes not only the case where the other part is "directly below", but also the case where there is another part in the middle.

Hereinafter, exemplary embodiments of the present invention will be described in detail with reference to the accompanying drawings.

3 is a schematic cross-sectional view of a high voltage booster according to an embodiment of the present invention.

The high voltage booster 100 may include a hollow cylindrical magnetic core 120, a solid cylindrical magnetic core 130, a primary winding 140, and a secondary winding 150 accommodated in the housing 110 having an approximately cylindrical shape. have.

The hollow cylindrical magnetic core 120 is made of a magnetic material, has an outer diameter that is approximately the same as the inner diameter of the housing 110, and may be disposed to be concentric with the center line O-O' of the housing 110.

The solid cylindrical magnetic core 130 is made of a magnetic material, and corresponds to the hollow cylindrical magnetic core 120 on the same line as the center line (O-O') of the housing 110 in the hollow cylindrical magnetic core 120. Can be placed in position.

The primary winding 140 has a shape in which a plate-shaped conductor such as a copper plate is wound once or several times in a hollow cylindrical magnetic core 120, and both ends are connected to the power supply device 10 through the main power switch 110. It is connected, and at the same time, the primary capacitor C1 may be connected in parallel at both ends.

The primary winding 140 may function as a primary inductor of a Tesla transformer that generates a high frequency high voltage using LC resonance. This will be described later.

The secondary winding 150 corresponds to the secondary inductor L2 and is formed by winding a coil around the solid cylindrical magnetic core 130 approximately 1,000 times, and may be formed in a cylindrical shape or a conical shape. In FIG. 3, the secondary winding 150 is formed in a conical shape, and in this case, a coil may be wound around the solid cylindrical magnetic core 130 using a bobbin (not shown) having a conical shape, and the secondary winding 150 Considering that the electric field distribution changes over time, the voltage of) is effective in that the secondary winding 150 in a conical shape can have a uniform electric field distribution characteristic. It is advantageous in terms of strengthening the dielectric strength. In addition, one side of the secondary winding 150 is grounded to the housing 110, and the other side may be connected to one end of the switch S1.

Each of the primary winding 140 and the secondary winding 150 may function as a primary inductor and a secondary inductor of a Tesla transformer generating a high frequency high voltage using LC resonance. This will be described later.

In addition, a gap between the hollow cylindrical magnetic core 120 and the solid cylindrical magnetic core 130 functions as a secondary capacitor C2.

In order to maximize the voltage gain (boost ratio) of the high voltage booster 100, it is necessary to improve the geometry of the magnetic core so that the coupling coefficient between the primary resonance circuit and the secondary resonance circuit is as close to 1 as possible. Accordingly, the voltage gain (boost ratio) of the high voltage booster 100 can be improved by improving the geometry of the solid cylindrical magnetic core 130.

The high voltage booster 30 boosts the voltage applied from the power supply 10 to a high voltage as an embodiment, and may use a Tesla transformer that generates a high frequency high voltage using LC resonance.

The high voltage booster 30 constitutes a primary resonance circuit by a primary inductor and a primary capacitor C1, which is a primary winding 140 of a Tesla transformer, and a secondary winding 150, which is a secondary winding 150 of the Tesla transformer. A secondary resonance circuit is formed by an inductor and a secondary capacitor C2, and a switch S1 may be connected to an output side of the secondary resonance circuit.

When the primary capacitor C1 of the primary resonant circuit is charged by the power supply 10, the main power switch 31 of the primary resonant circuit is turned on. A voltage is induced in the primary inductor L1 of the primary resonance circuit by the energy charged in the primary capacitor C1, and this voltage is transferred to the secondary inductor L2 magnetically coupled to the primary inductor L1. In this way, resonance is induced in the secondary resonance circuit, thereby boosting the voltage supplied from the power supply 10 to a very high voltage to charge the secondary capacitor C2.

A switch (not shown) is a switch that operates when the voltage applied between both electrodes separated by a certain distance exceeds the insulation limit between both electrodes, and turns on when the voltage charged in the secondary capacitor C2 exceeds the insulation limit of the switch. The energy charged in the secondary capacitor C2 may be output to a pulse shaping device (not shown).

4 is a perspective view schematically showing a secondary winding of a high voltage booster according to an embodiment of the present invention.

Referring to FIG. 4, the secondary winding 150 of the high voltage booster according to an embodiment of the present invention may have a tapered shape by stacking a plurality of printed circuit boards whose area gradually decreases.

Each of the printed circuit boards 150a1, 150a2, ..., 150an-1, 150an may have a circular disk shape with a hollow 151c formed therein. The present invention is not limited thereto, and each of the printed circuit boards 150a1, 150a2, ..., 150an-1, 150an may have a polygonal shape other than a circular shape.

The sizes of the laminated printed circuit boards 150a1, 150a2, ..., 150an-1, 150an may be reduced or increased according to the stacking order. When the printed circuit boards 150a1, 150a2, ..., 150an-1, 150an have a circular disk shape, the diameter of the printed circuit boards 150a1, 150a2, ..., 150an-1, 150an according to the stacking order This can be larger or smaller. As an example, the printed circuit board 150a1 positioned at the outermost side of FIG. 4 has a diameter larger than that of the stacked printed circuit board 150a2. That is, when the printed circuit board 150an-2, the printed circuit board 150an-1, and the printed circuit board 150an are sequentially stacked, the printed circuit board 150an-1 is higher than the printed circuit board 150an-2. The diameter is small, and the diameter may be larger than that of the printed circuit board 150an.

The difference between the radii of the two stacked printed circuit boards 150an-1 and 150an may be smaller than the sum of the depth t1 of the cutting portions 1531 and 1532 and the height t2 of the pad portions 1551 and 1552. . In this case, when the two printed circuit boards 150an-1 and 150an are stacked, at least a part of the cutting portions 1531 and 1532 of the printed circuit board 150an having a small diameter is the printed circuit board 150an-1 having a large diameter. It may overlap with the pad portions 1551 and 1552 of the. Accordingly, after laminating the printed circuit boards 150an-1 and 150an, soldering is applied to the cutting parts 1531 and 1532 of the printed circuit board 150an with a small diameter, and the cutting part of the printed circuit board 150an with a small diameter Two printed circuit boards 150an stacked by connecting side pads 1541 and 1542 formed at 1531 and 1532 and pads 1551 and 1552 of a printed circuit board 150an-1 having a large diameter by soldering , 150an-1) can be energized with each other. This will be described later.

FIG. 5 is a plan view schematically illustrating the printed circuit board of the secondary winding of FIG. 4, and FIG. 6 is a plan view schematically illustrating the printed circuit board of the secondary winding of FIG. 4.

5 and 6, each of the printed circuit boards 150a1, 150a2, ..., 150an-1, 150an includes an insulating layer 151, a line pattern 152, a pad portion 1551, 1552, and a cutting portion. (1531, 1532), may include side pads (1541, 1542).

The insulating layer 151 is a base substrate on which a line pattern 152 formed on each of the front surface 151a and the rear surface 151b is formed. In addition, a front pad portion 1551 and a rear pad portion 1552 may be formed on each of the front surface 151a and the rear surface 151b of the insulating layer 151. First and second cutting portions 1531 and 1532 and first and second side pad portions 1541 and 1541 may be formed on the side surfaces of the insulating layer 151. This will be described later.

The insulating layer 151 may include, for example, a thermosetting resin, an epoxy resin, or a prepreg.

The insulating layer 151 may have a circular disk shape with a hollow 1513 formed therein, as shown in FIGS. 5 and 6. The present invention is not limited thereto, and the insulating layer 151 may have a polygonal shape other than a circular shape.

The line pattern 152 may be formed on the front surface 151a and the rear surface 151b of the insulating layer 151. The line pattern 152 may be continuously formed on the front surface 151a and the rear surface 151b of the insulating layer 151 without disconnection. The line pattern 152 may be formed while circling the circular insulating layer 151.

On the insulating layer 151, as shown in FIG. 5, two line patterns 1521 and 1522 may be formed at predetermined intervals from each other. The present invention is not limited thereto, and the number of line patterns 152 may be at least one or more.

One end of the line pattern 152 may be connected to the front pad part 1551 and the other end may be connected to the first via hole 155. 5, when two line patterns 1521 and 1522 are formed on the insulating layer 151, one end of the line pattern 1521 is connected to the front pad part 1551, and the other end thereof is a first via hole. Can be connected with (1561). In addition, one end of the line pattern 1522 may be connected to the front pad portion 1551 and the other end of the line pattern 1522 may be connected to the first via hole 1562.

The first via hole 156 may penetrate through the insulating layer 151. That is, the first via hole 156 may penetrate from the front surface 151a of the insulating layer 151 toward the rear surface 151b.

The line pattern 152 formed on the front surface 151a of the insulating layer 151 and the line pattern 152 formed on the rear surface 151b of the insulating layer 151 through the first via hole 156 may be electrically connected to each other. 5 and 6, the line pattern 1521 formed on the entire surface of the insulating layer 151 has one end connected to the front pad part 1551 and the other end connected to the first via hole 1561. The first via hole 1561 may penetrate through the rear surface 151b of the insulating layer 151 and may be connected to the line pattern 1521 formed on the rear surface 151b. Likewise, the line pattern 1522 formed on the front surface of the insulating layer 151 may also be connected to the line pattern 1522 formed on the rear surface 151b through the first via hole 1562.

The line pattern 152 formed on the rear surface 151b of the insulating layer 151 may have one end connected to the first via hole 156 and the other end connected to the rear pad part 1552 as described above.

As described above, according to an embodiment of the present invention, a plurality of line patterns 152 are formed on the insulating layer 151, and a plurality of line patterns 152 are formed on the front surface 151a and the rear surface 151b of the insulating layer 151. A secondary winding 150 is formed by laminating the printed circuit boards 150a1, 150a2, ..., 150an-1, 150an on which the line pattern 152 is formed, by winding paper on a conventional tapered mock-up and using an adhesive. Thus, compared to the method of winding the wire by hand, it is possible to prevent the secondary winding from being damaged by air bubbles or the like by fundamentally eliminating the inclusion of bubbles or foreign substances that are vulnerable to insulation in the secondary winding.

In addition, by reducing the width of the plurality of line patterns 152 formed on the front surface 151a and the rear surface 151b of the insulating layer 151, it is possible to minimize an increase in resistance due to the skin effect.

First and second cutting portions 1531 and 1532 may be formed on the side of the insulating layer 151. The first and second cutting portions 1531 and 1532 may have a formation curved from an outer surface to an inner surface of the insulating layer 151. The first and second cutting portions 1531 and 1532 may be circularly curved inward from the side of the insulating layer 151 as shown in FIGS. 5 and 6. The present invention is not limited thereto, and the first and second cutting portions 1531 and 1532 may be formed in various shapes, such as a triangle and a square, in addition to a circular shape.

The first cutting part 1531 may be formed at the 12 o'clock direction, and the second cutting part 1532 may be formed at the 6 o'clock direction. The first and second cutting portions 1531 and 1532 may be formed in various directions as well as 12 o'clock and 6 o'clock.

First and second side pad portions 1541 and 1542 may be formed on inner surfaces of the first and second cutting portions 1531 and 1532, respectively. That is, the first side pad portion 1541 may be formed on the inner surface of the first cutting portion 1531, and the second side pad portion 1542 may be formed on the inner surface of the second cutting portion 1532.

The first and second side pad portions 1541 and 1542 may be made of a conductive material. Depending on the embodiment, it may be made of the same material as the front and rear pad portions 1551 and 1552.

The first and second side pad portions 1541 and 1542 may be electrically connected to the front and rear pad portions 1551 and 1552. Specifically, the first side pad portion 1541 is in contact with one side of the front pad portion 1551 and is electrically connected, and the second side pad portion 1542 is in contact with one side of the rear pad portion 1551 to be electrically connected. Can be connected to.

The front and rear pad portions 1551 and 1552 and the first and second side pad portions 1541 and 1542 may be connected to each other by soldering. Specifically, when the n-th printed circuit board 150an having a small size is stacked on the n-1th printed circuit board 150an-1, the rear pad portion 1552 of the n-th printed circuit board 150an is n- It may be stacked to correspond to the front pad portion 1551 of the first printed circuit board 150an-1. The difference between the radii of the two printed circuit boards 150an-1 and 150an stacked as described above is the sum of the depth t1 of the cutting portions 1531 and 1532 and the height t2 of the pad portions 1551 and 1552 Smaller, the front pad portion 1551 of the n-1th printed circuit board 150an-1 and the rear pad portion 1552 of the n-th printed circuit board 150an may partially overlap each other.

By soldering the first cutting portion 1531 of the n-1th printed circuit board 150an-1 and the second cutting portion 1532 of the nth printed circuit board 150an, the n-1th printed circuit board 150an A first side pad portion 1541 formed on the inner surface of the first cutting portion 1531 of -1), a second side pad formed on the inner surface of the second cutting portion 1531 of the n-th printed circuit board 150an Solder is formed on the portion 1542 and the front pad portion 1551 of the n-1th printed circuit board 150an-1 to be electrically connected to each other, and accordingly, the n-1th printed circuit board 150an-1 ) Of the line pattern 152 and the line pattern 152 of the n-th printed circuit board 150an may be electrically connected.

An insulating member (not shown) may be disposed between the stacked printed circuit boards 150a1, 150a2, ..., 150an-1, 150an. The insulating member may prevent the line patterns formed on different printed circuit boards from being short-circuited between the stacked printed circuit boards 150a1, 150a2, ..., 150an-1, 150an.

The insulating member is not formed on the front pad portion 1551 and the rear pad portion 1552 to which the printed circuit boards 150an-1 and 150an are directly stacked and electrically connected.

7 is a plan view schematically showing a printed circuit board of a secondary winding according to another embodiment of the present invention, and FIG. 8 is a rear view schematically showing a printed circuit board of a secondary winding shown in FIG. 7.

7 and 8, the printed circuit board of the secondary winding according to another embodiment of the present invention is different from the printed circuit board shown in FIGS. 5 and 6 in that a line pattern is formed only on the front surface.

In detail, in the printed circuit board shown in FIGS. 7 and 8, a line pattern 152 is formed on the front surface 151a of the insulating layer 151. The line pattern 152 has one end connected to the front pad part 1551 and the other end connected to the second via hole 256.

The second via hole 256 is a hole that penetrates the insulating layer 151 from the front surface 151a to the rear surface 151b, and corresponds to the rear pad portion 1552 formed on the rear surface 151a of the insulating layer 151. Can be formed in position.

As an example, as shown in FIGS. 7 and 8, the front pad portion 1551 may be formed at 12 o'clock and the rear pad portion 1552 may be formed at 6 o'clock. In this case, the second via hole 256 ) May be formed in the 6 o'clock direction so as to correspond to the rear pad part 1552.

The line pattern 152 connected to the second via hole 256 may be connected to the rear pad portion 1552 of the rear surface 151b of the rear surface through the second via hole 256.

The line pattern 152 is not formed on the rear surface 151b of the insulating layer 151, and the rear pad portion 1552 may be formed as described above.

A first cutting part 1531 and a second cutting part 1532 may be formed corresponding to each of the front pad part 1551 and the rear pad part 1552. That is, the first cutting portion 1531 may be formed corresponding to the front pad portion 1551 and the second cutting portion 1532 may be formed corresponding to the rear pad portion 1552.

A first side pad portion 1541 and a second side pad portion 1541 may be formed on an inner surface of each of the first cutting portion 1531 and the second cutting portion 1532, respectively. The first side pad portion 1541 may be electrically connected to the front pad portion 1551, and the second side pad portion 1542 may be electrically connected to the rear pad portion 1552.

The printed circuit board shown in FIGS. 7 and 8 has no line pattern formed on the rear surface 151b of the insulating layer 151, and the printed circuit board is stacked differently from the printed circuit board shown in FIGS. 5 and 6. Insulation members may not be published.

9 is a plan view schematically showing a printed circuit board of a secondary winding according to another embodiment of the present invention, and FIG. 10 is a rear view schematically showing a printed circuit board of a secondary winding shown in FIG. 9, and FIG. 11 is a plan view schematically showing the printed circuit board of the secondary winding shown in FIG. 9.

In detail, FIGS. 9 to 11 are views showing an insulating film forming an insulating layer included in one printed circuit board, and FIG. 9 is a plan view showing an insulating film 1511 positioned at the top of the insulating layer, and FIG. 10 is FIG. 11 is a plan view illustrating an insulating layer 1512 stacked under the insulating layer of FIG. 9, and FIG. 11 is a rear view illustrating an insulating layer 151n positioned at the lowermost portion of the insulating layers constituting the insulating layer of FIG. 9.

9 to 11, in another embodiment of the present invention, an insulating layer 151 of one printed circuit board may be formed by stacking a plurality of insulating layers 1511, 1512, ..., 151n. Since a plurality of insulating layers 1511, 1512, ..., 151n are stacked to form the insulating layer 151, the plurality of insulating layers 1511, 1512, ..., 151n may have the same size.

Front pad portions 1551 and line patterns 152 and 252 may be formed on the front surfaces 1511a, 1512a, ... of each of the plurality of insulating layers 1511, 1512, ..., 151n. The line patterns 152 and 252 formed on the front surfaces 1511a and 1512a of each of the stacked insulating layers 1511 and 1512 may be electrically connected by a third via hole 356 penetrating the insulating layer 1511.

In detail, the line pattern 152 formed on the front surface 1511a of the insulating layer 1511 may have one end connected to the front pad portion 1551 and the other end connected to the third via hole 356. The third via hole 356 is formed up to the rear surface of the insulating film 1511, and one end of the line pattern 252 formed on the front surface 1512a of the insulating film 1512 stacked under the insulating film 1511 is formed at one end of the insulating film 1511. By directly contacting the third via hole 356 exposed on the rear surface, it may be electrically connected to the line pattern 152 of the insulating layer 1511.

The other end of the line pattern 252 formed on the front surface 1512a of the insulating layer 1512 may be connected to a fourth via hole 456 formed on the front surface 1512a of the insulating layer 1512.

The fourth via hole 456 passes through the front and rear surfaces of the insulating layer 1512, and, like the third via hole 356 of the insulating layer 1511, a line pattern and an insulating layer formed on the entire surface of the insulating layer stacked under the insulating layer 1512. The line pattern 152 on the front surface 1512a of the 1512 may be connected.

11 shows the rear surface of the lowermost insulating layer 151n among insulating layers forming the insulating layer 151 of the printed circuit board.

Although the entire surface of the insulating layer 151n is not shown, a line pattern may be formed like the other insulating layers 1511 and 1512.

A rear pad portion 1552 may be formed on the rear surface 151nb of the insulating layer 151n. The rear pad portion 1552 may be electrically connected to a line pattern formed on the entire surface of the insulating layer 151n through a via hole (not shown) formed in the insulating layer 151n.

The line pattern formed on the entire surface of the insulating layer 151n has one end in contact with a via hole exposed to the rear surface of the insulating layer on the insulating layer 151n, and the other end is connected to a via hole formed in the insulating layer 151n, and the via hole is an insulating layer. The line patterns of each of the insulating layers may be electrically connected to each other by being connected to the rear pad portion 1552 formed on the rear surface 151nb of 151n.

As described above, the line pattern is formed on a multi-layered insulating film to form multiple paths, and some line patterns are disconnected due to local overvoltage due to insulation breakdown by impurities derived from insulating oil or abnormal operation, and line patterns formed through different paths. By using, the path of the secondary winding can be maintained.

Although the above has been described with reference to the preferred embodiments of the present invention, those skilled in the art or those of ordinary skill in the art will not depart from the spirit and scope of the present invention described in the claims to be described later. It will be appreciated that various modifications and changes can be made to the present invention within the scope of the invention.

Accordingly, the technical scope of the present invention should not be limited to the contents described in the detailed description of the specification, but should be determined by the claims.

100: high voltage booster
110: housing
120: hollow cylindrical magnetic core
130: solid cylindrical magnetic core
140: primary winding
150: secondary winding

Claims (15)

In the secondary winding included in the high voltage booster together with the primary winding,
The secondary winding has a tapered shape by stacking a plurality of printed circuit boards whose area gradually decreases,
The printed circuit board,
An insulating layer having a hollow inside;
At least one line pattern formed on at least one surface of the insulating layer;
A front pad portion formed on one surface of the insulating layer and connected to one end of the line pattern;
A rear pad portion formed on the other surface of the insulating layer and connected to the other end of the line pattern:
A first cutting portion curved from an outer portion of the insulating layer toward an inner portion;
A second cutting part formed at a different position from the first cutting part;
A first side pad portion formed on an inner surface of the first cutting portion;
A second side pad portion formed on an inner surface of the second cutting portion; Including,
The front pad portion and the first side pad portion are electrically connected to each other, and the rear pad portion and the second side pad portion are electrically connected to each other. The method of claim 1,
The line pattern is a secondary winding for a high voltage boosting device, characterized in that the line pattern is formed to be continuously circumferentially without disconnection on one surface of the insulating layer, one end is connected to the front pad portion, and the other end is connected to the rear pad portion. The method of claim 2,
The secondary winding for a high voltage booster, characterized in that the printed circuit boards are stacked while the front pad portion of the n-th printed circuit board and the rear pad portion of the n+1-th printed circuit board are in contact with each other. The method of claim 1,
Secondary winding for a high voltage booster, characterized in that the difference between the radii of the two stacked printed circuit boards is smaller than the sum of the depth of the first cutting part or the second cutting part and the height of the front pad part or the rear pad part . The method of claim 1,
The secondary winding for a high voltage booster device, wherein the line pattern is formed around one surface of the insulating layer and is also formed on the other surface of the insulating layer. The method of claim 5,
And a first via hole penetrating the insulating layer so that a line pattern on one surface of the insulating layer and a line pattern on the other surface of the insulating layer are connected. The method of claim 5,
Secondary winding for a high voltage boosting device, characterized in that it further comprises an insulating member formed between the stacked printed circuit boards. The method of claim 1,
The secondary winding for a high voltage booster, characterized in that the line pattern circumferences one surface of the insulating layer and is not formed on the other surface of the insulating layer. The method of claim 8,
The second winding of the high voltage booster, characterized in that one end of the line pattern is connected to a front pad part, and the other end of the line pattern is connected to the rear pad part. The method of claim 8,
And a second via hole penetrating the insulating layer so that the other end of the line pattern is connected to the rear pad portion. The method of claim 1,
The insulating layer is laminated with a multilayered insulating film,
Secondary winding for a high voltage booster, characterized in that the line pattern is formed at the interface of the insulating film. The method of claim 11,
Secondary winding for a high voltage booster, characterized in that the line pattern is not formed on the rear surface of the insulating film forming the rear surface of the insulating layer. The method of claim 11,
The front pad portion is formed on the entire surface of the insulating film forming the uppermost portion of the insulating layer,
Secondary winding for a high voltage booster, characterized in that the rear pad portion is formed on the rear surface of the insulating film forming the lowermost portion of the insulating layer. The method of claim 11,
And a third via hole penetrating the insulating layer so that the line patterns on the front surface and the rear surface of the insulating layer are connected to each other. In the high voltage boosting device comprising a primary winding and a secondary winding,
The secondary winding is located in the hollow of the primary winding,
The secondary winding,
The secondary winding has a tapered shape by stacking a plurality of printed circuit boards whose area gradually decreases,
The printed circuit board,
An insulating layer having a hollow inside;
At least one line pattern formed on at least one surface of the insulating layer;
A front pad portion formed on one surface of the insulating layer and connected to one end of the line pattern;
A rear pad portion formed on the other surface of the insulating layer and connected to the other end of the line pattern:
A first cutting portion curved from an outer portion of the insulating layer toward an inner portion;
A second cutting part formed at a different position from the first cutting part;
A first side pad portion formed on an inner surface of the first cutting portion;
A second side pad portion formed on an inner surface of the second cutting portion; Including,
The front pad portion and the first side pad portion are electrically connected to each other, and the rear pad portion and the second side pad portion are electrically connected to each other.

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