KR102252114B1 - Light emitting device package - Google Patents

Abstract

The embodiment relates to a light emitting device package.
A light-emitting device package according to an embodiment includes: a light-emitting device; A lead frame in which the light emitting element is disposed; A reflector layer disposed on the lead frame and reflecting light emitted from the light emitting device; And a resin package surrounding the lead frame and the reflector layer, wherein the reflector layer includes an inclined surface for specularly reflecting light emitted from the light emitting device, and an angle between the inclined surface and a lower surface of the reflector layer is, It is 25 degrees or more and 35 degrees or less.

Description

Light emitting device package {LIGHT EMITTING DEVICE PACKAGE}

The embodiment relates to a light emitting device package.

Light Emitting Diodes (LEDs) are highly efficient and eco-friendly light sources, and are in the spotlight in various fields. Light-emitting diodes (LEDs) are used in various fields, for example, to displays (display devices), optical communications, automobiles, and general lighting. In particular, white light emitting diodes that implement white light are increasingly in demand.

In general, such light-emitting devices are packaged and used after individual devices are manufactured. In the light emitting device package, a light emitting chip is mounted on a resin package body including a radiator. The light emitting chip is electrically connected to the lead through a wire, and the upper side of the light emitting chip is filled with an encapsulant such as resin and silicone, and a lens is provided on the upper side thereof. The light emitting device package having such a structure has low heat dissipation effect due to slow transfer of heat generated when the light emitting device is driven. Accordingly, the optical characteristics of the light emitting device may be deteriorated, and it is difficult to expect a fast process speed in a package process of inserting a heat sink between the resin package bodies.

When a light emitting device is mounted on a lead frame without a radiator, since heat is radiated through the lead frame, the heat dissipation performance is low, and thus it is difficult to apply to a high output light emitting device. In addition, when exposed to light for a long period of time, the resin package used in the lead frame for a light emitting device is discolored or deteriorated, thereby deteriorating optical characteristics.

The embodiment provides a light emitting device package capable of improving adhesion between a lead frame and a resin package.

The embodiment provides a light emitting device package capable of preventing penetration of moisture or foreign matter from the bottom.

The embodiment provides a light emitting device package capable of preventing penetration of foreign substances generated during mounting of the light emitting device.

The embodiment provides a light emitting device package capable of stably fixing a reflector on a lead frame.

The embodiment provides a light emitting device package capable of selectively mounting a lens or a plate on a reflector.

The embodiment provides a light emitting device package that is stably combined with a lead frame prototype and is easily separated.

The embodiment provides a light emitting device package that is stably coupled without an adhesive material by increasing friction with the original lead frame.

The embodiment provides a light emitting device package capable of improving light output.

The embodiment provides a light emitting device package capable of improving light extraction speed.

The embodiment provides a light emitting device package in which light distribution irregularities do not occur in a reflector layer.

The embodiment provides a light emitting device package capable of improving light directivity.

A light-emitting device package according to an embodiment includes: a light-emitting device; A lead frame in which the light emitting element is disposed; A reflector layer disposed on the lead frame and reflecting light emitted from the light emitting device; And a resin package surrounding the lead frame and the reflector layer, wherein the reflector layer includes an inclined surface for specularly reflecting light emitted from the light emitting device, and an angle between the inclined surface and a lower surface of the reflector layer is, It is 25 degrees or more and 35 degrees or less, and the lead frame includes a first frame in which the light emitting element is disposed; And a second frame electrically insulated from the first frame, wherein the resin package includes: a first resin package disposed between the first frame and the second frame; And a second resin package surrounding the light emitting device and the reflector layer and having a concave portion at a central portion, wherein the second resin package is perpendicular to an outer side of the first lead frame, the second lead frame, and the reflector layer. A wall portion formed of; And a protrusion formed horizontally protruding from the wall portion toward the inside thereof, and including a lens guide part formed on a part of an upper surface of the reflector layer and a side surface of the protruding part to arrange a lens; And a plate guide portion formed on an upper surface of the protrusion and an inner surface of the wall portion and on which a plate is disposed.

The light emitting device package according to the embodiment may increase adhesion between the frame and the resin package by increasing an adhesive surface between the frame and the resin package.

In the embodiment, the adhesion surface between the frame and the package may be increased to prevent penetration of moisture or foreign matter from the lower portion

According to the embodiment, the resin part may bury a part of the lead frame to prevent the penetration of foreign substances generated during mounting of the light emitting device.

The embodiment can stably fix the reflector on the lead frame.

Embodiments may selectively mount a lens or plate on the reflector.

The embodiment is stably coupled to the original lead frame and is easy to separate.

The embodiment is stably coupled without an adhesive material by increasing the frictional force with the original lead frame.

The embodiment can improve light output.

The embodiment can improve the light extraction speed.

In the embodiment, light distribution irregularities may not occur in the reflector layer.

The embodiment can improve light directivity.

1 is a perspective view of a light emitting device package according to an embodiment.
2 is a cross-sectional perspective view of a light emitting device package according to an embodiment.
3 is a cross-sectional view of a light emitting device package according to an embodiment.
4 is a plan view of a light emitting device package according to an embodiment.
5 is a perspective view of a lead frame.
6 is a bottom perspective view of the light emitting device package 1 according to the embodiment.
7 is a perspective view of an original lead frame from which the lead frame according to the embodiment has been removed.
8 is a perspective view illustrating a state in which a light emitting device package in which a light emitting device is not mounted is coupled to a circular lead frame.
9 is a perspective view showing a structure of a light emitting device package capable of mass production.
10 is a design diagram including numerical values of the light emitting device package shown in FIG. 3.
11 is a cross-sectional view of a light emitting device package according to another embodiment.
12 is a design diagram including actual dimensions of the light emitting device package shown in FIG. 11.
13 are actual photographs of the light emitting device package illustrated in FIGS. 1 to 5, and FIGS. 14 to 17 are data showing a simulation effect when light is emitted from the light emitting device package illustrated in FIG. 13.
18 is an actual photograph of the light emitting device package illustrated in FIG. 11, and FIGS. 19 to 22 are data showing a simulation effect when light is emitted from the light emitting device package illustrated in FIG. 18.
FIG. 23 is a view showing light directivity when light is emitted from the light emitting device package illustrated in FIG. 13, and FIG. 24 is a view showing light directivity when light is emitted from the light emitting device package illustrated in FIG. 18.

In the drawings, the thickness or size of each layer is exaggerated, omitted, or schematically illustrated for convenience and clarity of description. In addition, the size of each component does not fully reflect the actual size.

In the description of the embodiment according to the present invention, in the case where one element is described as being formed "on or under" of another element, the upper (upper) or lower (Bottom) (on or under) includes both elements in direct contact with each other or in which one or more other elements are indirectly formed between the two elements. In addition, when expressed as “on or under”, it may include not only an upward direction but also a downward direction based on one element.

First, a light emitting device package according to an embodiment of the present invention will be described.

1 is a perspective view of a light emitting device package according to an embodiment.

Referring to FIG. 1, a light emitting device package 1 according to an embodiment includes a light emitting device 100 including a light emitting chip 110 and a sub mount 120 on which the light emitting chip 110 is mounted, A lead frame 200 on which the light-emitting element 100 is mounted, a wire 130 electrically connecting the light-emitting element 100 and the lead frame 200, and the light-emitting element 100 surrounding the light-emitting element 100 ), and a resin package 300 forming a main body of the light emitting device package 1, and a reflector layer 140 that reflects light emitted from it.

The light emitting device 100 may be a light emitting diode (LED), but is not limited thereto. The light emitting diode may be a DUV LED that emits deep ultraviolet (DUV), but is not limited thereto, and a red, green, blue, or white light emitting diode that emits red, green, blue, or white light, respectively. Can be A light-emitting diode is a type of solid-state device that converts electrical energy into light, and generally includes an active layer of a semiconductor material interposed between two opposing doping layers. When a bias is applied to both ends of the two doping layers, holes and electrons are injected into the active layer and then recombined there to generate light. Will be released outside.

The light emitting chip 110 may be a flip chip, but is not limited thereto, and may be a vertical chip or a lateral chip. In the drawings, for convenience, it will be described as a horizontal chip. The size of the light emitting chip 110 may be formed to be 600 μm in width and 700 μm in height, but is not limited thereto. The light emitting chip 110 may emit deep ultraviolet rays having a wavelength of 190 to 400 nm. More specifically, the light emitting chip 110 may emit deep ultraviolet rays having a wavelength of 250 to 280 nm, and at this time, deep ultraviolet rays emitted from the light emitting chip 110 have the best sterilizing power. Although not shown in FIG. 1, the light emitting chip 110 may include a substrate and a light emitting structure in which a first conductivity type semiconductor layer, an active layer, and a second conductivity type semiconductor layer are sequentially disposed on the substrate. The substrate of the light emitting chip 110 may have a light transmission property through which light can be transmitted. The substrate may be at least one of an insulating substrate such as sapphire (Al2O3) and spinel (MgAl2O4), and semiconductor substrates such as SiC, Si, GaAs, GaN, InP, and Ge.

The light emitting chip 110 is disposed on the sub-mount 120. The sub-mount 120 radiates heat generated from the light emitting chip 110 and transfers the heat to the lower lead frame 200. In addition, one end of the wire 130 electrically connecting the light emitting device 100 and the lead frame 200 is connected to the sub-mount 120. The sub-mount 120 may be made of aluminum nitride (AlN) or silicon carbide (SiC) having high thermal conductivity, but is not limited thereto. The light emitting chip 110 and the sub-mount 120 may be coupled by a solder bumper.

2 is a cross-sectional perspective view of a light emitting device package according to the embodiment, and FIG. 3 is a cross-sectional view of the light emitting device package according to the embodiment.

2 and 3, the reflector layer 140 of the light emitting device package 1 according to the embodiment reflects light emitted from the light emitting device 100. The reflector layer 140 surrounds the light emitting device 100 and is disposed on the lead frame 200. The reflector layer 140 may be made of metal. Specifically, the reflector layer 140 of the light emitting device package 1 according to the embodiment may be made of pure aluminum. Accordingly, the reflectivity of light is high, thermal diffusion is good, and corrosion resistance to oxygen and hydrogen sulfide gas can be obtained. The reflector layer 140 may be formed in a circular shape with a concave inside, but the shape of the reflector layer 140 is not necessarily limited to a circular shape.

A lens guide unit 150 on which an optical lens (not shown) may be disposed may be formed on the reflector layer 140. In addition, a plate guide unit 160 on which a plate (not shown) may be disposed may be disposed on the reflector layer 140. The lens guide unit 150 may be formed by a wall portion 321 formed by an upper surface of the reflector layer 140 and one end of the second resin package 320 to be described later. In addition, the plate guide unit 160 may be formed by a flat portion formed on an upper surface of the second resin package 320 and a side surface of a wall portion protruding upward from the upper surface of the second resin package 320. This will be described later. A sealing resin material may be filled between the lens (not shown) or plate (not shown) and the reflector layer 140. Silicone resin may be used as the sealing resin material. Meanwhile, the lens (not shown) or plate (not shown) according to the embodiment may be a glass lens or glass plate containing a phosphor. Therefore, since the phosphor is dispersed in the lens (not shown) or the plate (not shown) or the encapsulant containing the phosphor is not used, the lens (not shown) or the plate (not shown) contains the phosphor, so that the luminous flux maintenance rate can be improved. I can. That is, the reliability of the light emitting device package 1 may be improved.

The lead frame 200 is positioned under the light emitting element 100, and the light emitting element 100 is mounted on the lead frame 200. The lead frame 200 may include a first frame 210 on which the light emitting device 100 is directly mounted, and a second frame 220 electrically connected to the light emitting device 100 through a wire 130. . An opening for inserting the first resin package 310 of the resin package 300 to be described later may be formed between the first frame 210 and the second frame 220. Meanwhile, the lead frame 200 may be made of a copper alloy containing a copper (Cu) component. Therefore, the sub-mount 120 may have a thermal conductivity of 2 to 3 times that of aluminum nitride (AlN), and thus may serve as a radiator. Therefore, the light emitting device package 1 according to the embodiment does not require a separate heat sink and is advantageous in terms of cost because copper is used.

When the thickness of the lead frame 200 is increased, the lead frame 200 may serve as a large-capacity radiator. If the thickness of the lead frame 200 increases, the cost of the lead frame 200 may increase, but the cost may be reduced compared to adding a separate heat sink. In addition, the thicker the lead frame 200 made of copper, the better the heat diffusion and the less affected by the thermal expansion. When the thickness of the lead frame 200 increases, the frictional force with the resin package 300 increases, and penetration of foreign matter or moisture into the light emitting device package 1 from the lower portion thereof becomes difficult. In addition, as the thickness increases, the resistance to deformation to external stress also increases.

Specifically, the thickness of the copper-based lead frame 200 may be 0.5 mm to 1.5 mm. If the thickness of the lead frame 200 is less than 0.5 mm, the heat diffusion and heat dissipation performance is not good, and if the thickness of the lead frame 200 is greater than 1.5 mm, the increase in manufacturing cost due to the increase in the thickness of the lead frame 200 is increased compared to the increase in heat diffusion and heat dissipation performance. It can be a problem. In addition, when the thickness of the copper-based lead frame 200 is less than 0.5 mm, the resistance to deformation of the light emitting device package 1 against external stress is lower than the allowable value, and when it is greater than 1.5 mm, an increase in manufacturing cost is a problem. Can be.

In summary, if the thickness of the copper-based lead frame 200 is less than 0.5 mm, any one of heat diffusion, heat dissipation, resistance to deformation, and moisture penetration prevention performance is lower than the allowable value. Characteristics are improved. However, when the thickness of the copper-based lead frame 200 is 1.5 mm or more, in manufacturing the light emitting device package 1, an increase in manufacturing cost may be a bigger problem compared to the improvement of the above-described features.

The light emitting device 100 may be directly mounted on the first frame 210. Although not shown in the drawing, a die bonding paste (not shown) to which the light emitting device 100 can be bonded may be formed on the upper surface of the first frame 210. The light emitting device 100 may be mounted on the first frame 210 using a die bonding paste. The die bonding paste may include an epoxy resin or a silicone resin having light resistance.

The second frame 220 may be electrically connected to the light emitting device 100 through a wire 130.

The resin package 300 of the light emitting device package 1 according to the embodiment includes a first resin package 310 and a light emitting device inserted into the first frame 210 and the second frame 220 of the lead frame 200. 100) and a second resin package 320 surrounding the reflector layer 140 and having a concave portion at the center thereof.

The first resin package 310 may be filled between the first frame 210 and the second frame 220. The second resin package 320 may be formed to surround the outside of the lead frame 200 and a portion of the outside and upper sides of the reflector layer 140. The first resin package 310 and the second resin package 320 may be formed by injection molding or transfer molding a thermoplastic resin or a thermosetting resin on the lead frame 200. The shapes of the first resin package 310 and the second resin package 320 may be variously formed by design of a mold.

The thermoplastic resin or thermosetting resin used in the first resin package 310 and the second resin package 320 may be a black resin having strong weather resistance. For example, black aromatic nylon can be used. However, it is not necessarily limited thereto. Since the resin package 300 is exposed to heat and light from the light emitting device 100 for a long time, discoloration or deterioration may occur. Since the light-emitting device package 1 according to the embodiment uses a black resin having good weather resistance, it is possible to prevent deterioration of short-wavelength ultraviolet rays and prevent discoloration of the light-emitting device package. Therefore, when the light emitting device 100 is a white light emitting diode, it is not necessary to use a black resin, and a white resin may be used. White resin is advantageous in terms of light efficiency because light transmittance is higher than that of black resin.

As shown in FIGS. 1 to 3, the second resin package 320 includes a groove portion 320a in which a part of the reflector layer 140 may be inserted and fixed, and a lead frame prototype to be described later in FIGS. 7 to 8. ) It may include a concave portion (320b) that can be coupled to the outer frame 410 of (400).

Specifically, the second resin package 320 may include a lead frame 200 and a wall portion 321 formed perpendicular to the outside of the reflector layer 140. A protrusion 322 protruding horizontally from the wall 321 toward the light emitting device 100 may be formed, and the protrusion 322 may be formed to cover at least a part of the upper surface of the reflector layer 140. The groove part 320a may be formed to be surrounded by the wall part 321, the protrusion part 322, and the upper surface of the lead frame 200 of the second resin package 320. Meanwhile, a part of the second resin package 320 may be inserted between the reflector layer 140 and the lead frame 200. Specifically, the insertion portion 323 of the second resin package 320 may be disposed between the lower surface of the reflector layer 140 and the upper surface of the lead frame 200, and the thickness of the insertion portion 323 is the reflector layer ( It may be formed relatively thinner than the thickness of 140) and the lead frame 320.

The reflector layer 140 is disposed on the lead frame 200, and conventionally, the reflector layer 140 is adhered to the lead frame 200 using an adhesive. If an adhesive is used, adhesive residue may contaminate electrodes or wires. However, in the light emitting device package 1 according to the embodiment, the groove portion 320a is formed in the second resin package 320, and a part of the reflector layer 140, for example, the outermost portion, is the second resin package 320. It is fitted and fixed in the groove portion (320a) of. Therefore, since the reflector layer 140 is fixed on the upper portion of the lead frame 200 without an adhesive, contamination due to the use of the adhesive can be prevented and cost can be reduced.

In addition, the reflector layer 140 may include a lens guide unit 150 and a plate guide unit 160.

On the upper surface of the reflector layer 140, there is a portion open toward the top without being covered by the protrusion 322 protruding from the wall portion 321. The lens guide unit 150 to which the lens can be mounted may be formed by the open portion and the end of the protrusion 322. In addition, the upper surface of the wall portion 321 and the upper surface of the protruding portion 322 may be formed to have a step on the top of the reflector layer 140, and a plate guide portion to which a plate (not shown) can be mounted by the step ( 160) may be formed.

Meanwhile, the reflector layer 140 may be made of a high-strength metal. Therefore, it is difficult to transform. When the reflector layer 140 is stably fixed on the lead frame 200, reflection with high precision is possible. A description of the concave portion 320b will be described later.

4 is a plan view of a light emitting device package according to an embodiment, and FIG. 5 is a perspective view of a lead frame.

1 to 5, the reflector layer 140 may be formed on the first frame 210 and the second frame 220, and an opening may be formed inside. The light emitting device 100 is disposed in the opening of the reflector layer 140 and may be filled with resin.

4 and 5, the first frame 210 and the second frame 220 are partially curved. Specifically, the first frame 210 has a concave portion 210a that is concave toward the second frame 220, and the second frame 220 corresponds to the concave portion 210a of the first frame 210 Thus, it may have a convex portion 220a that is convex toward the first frame 210. When the first frame 210 and the second frame 220 have a curved shape, the first resin package 310 and the lead frame 200 disposed between the first frame 210 and the second frame 220 The contact surface between them is increased. Accordingly, since the contact surface between the lead frame 200 and the first resin package 310 increases, there is an effect of increasing the adhesion between the lead frame 200 and the resin package 300.

In addition, as shown in FIGS. 2 and 3, since the lead frame 200 of the light emitting device package 1 is a thick copper frame, the degree of freedom in shape is high. Accordingly, a step can be formed in the lead frame 200, and the opening has a step. Therefore, since the first resin package 310 is filled according to the shape of the opening between the first frame 210 and the second frame 220, the first frame 210 and the second frame 220 and the first resin The contact area with the package 310 is increased. Accordingly, adhesion between the lead frame 200 and the first resin package 310 may be increased. In addition, since the lead frame 200 and the first resin package 310 are coupled to each other in a form having a step difference, the ability to prevent penetration of moisture or foreign substances from the lower portion of the lead frame 200 is increased.

6 is a bottom perspective view of a light emitting device package according to the embodiment.

1 to 6, a first resin package 310 is disposed between the first frame 210 and the second frame 220 of the lead frame 200. Both ends 310a in the longitudinal direction of the first resin package 310 are formed to extend in the width direction toward the first frame 210, so that a part of both ends in the longitudinal direction of the first frame 210 is formed of the first resin package 310. ) Can be buried. Accordingly, the gap between the terminal protruding to the outside of the first frame 210 and the first resin package 310 is removed, such as foreign substances that may occur when the light emitting device 100 is mounted on the first frame 210. It is possible to prevent contamination of wires or electrodes by penetrating into the light emitting device package 1.

Meanwhile, a portion of the first frame 210 and the second frame 220 exposed to the outside of the light emitting device package 1 may function as a terminal of the light emitting device package 1. In addition, this part can also function as a TC (Thermal Calculator).

7 is a perspective view of a lead frame prototype from which the lead frame according to the embodiment has been removed.

5 to 7, the lead frame prototype 400 may include a first frame 210 and a second frame 220, and may include an outer frame 410. An opening may be formed between the first frame 210, the second frame 220, and the outer frame 410, respectively, and each opening may be filled with resin.

As shown in FIGS. 1 to 7, a concave portion 320b may be formed on the outside of the second resin package 320. The lead frame prototype 400 may include a convex portion 410a formed in the outer frame 410 to correspond to the concave portion 320b. Therefore, when the light emitting device package 1 is coupled to the lead frame prototype 400, the convex portion 410a is fitted into the concave portion 320b, and is caught by the locking protrusion of the upper portion of the concave portion 320b. Accordingly, the light emitting device package 1 is motion-constrained downward from the lead frame prototype 400. The light emitting device package 1 can be separated only above the lead frame prototype 400. Therefore, it is easy to store and transport the foot and device package 1.

In addition, since the lead frame prototype 400 is thick, the frictional force with the second resin package 320 outside the light emitting device package 1 is high. Accordingly, the light emitting device package 1 may be fixed to the lead frame prototype 400 without using an adhesive. Therefore, since the light emitting device package 1 according to the embodiment is fixed to the lead frame prototype 400 without using an adhesive, foreign matter is not generated.

8 is a perspective view illustrating a state in which a light emitting device package in which a light emitting device is not mounted is coupled to a circular lead frame.

1 and 8, the light emitting device package 1 is disposed on the lead frame 200 of the lead frame prototype 400. When the resin is molded on the lead frame 200 to form the resin package 300, the light emitting device 1 is mounted on the lead frame 200.

In this case, the lead frame prototype 400 may include two lead frames 200 so that the two light emitting device packages 1 are mounted.

9 is a perspective view showing the structure of a light emitting device package capable of mass production.

Referring to FIG. 9, the light emitting device package 1 according to the embodiment may be mass-produced by a mold in a form extending in two rows. Therefore, since the light emitting device package 1 can be mass-produced through a mold, cost can be reduced.

In the case where the light emitting device package according to the embodiment of the present invention is an LED emitting visible light, the light emitting device package according to the embodiment of the present invention includes various indoor and outdoor liquid crystal displays, electric signs, street lights, etc. Can be used in devices. Meanwhile, when the light emitting chip of the light emitting device package is a DUV LED emitting deep ultraviolet rays, the light emitting device package according to the embodiment of the present invention may be used in a humidifier or water purifier for sterilization or purification.

10 is a design diagram including numerical values of the light emitting device package shown in FIG. 3.

Meanwhile, the light emitting device package shown in FIGS. 1 to 5 includes a reflector layer 140, which is made of a metal such as aluminum. When the reflector layer 140 is made of a metal such as aluminum, it is possible to easily reflect deep ultraviolet rays emitted from the light emitting device 100. However, certain problems may occur due to the reflector layer 140. It will be described in detail below.

When the reflector layer 140 reflects light from the light emitting device 100, multiple reflections (so-called “diffuse reflection” or “diffuse reflection”) while diffusing the light are performed. Since the reflector layer 140 reflects incident light multiple times, light loss may occur due to multiple reflections. In particular, when the light-emitting device 100 emits more light in a lateral direction than in an upward direction, the light output Po of the entire light-emitting device package may be reduced due to the loss.

In addition, since the reflector 140 having multiple reflections does not immediately reflect incident light but reflects it after condensing, there is a problem in that the light extraction speed is lowered.

In addition, when the light emitting device 100 emits more light in a lateral direction than in an upward direction, light distribution irregularities may occur in the reflector layer 140.

In addition, when the reflector layer 140 having multiple reflections is used, there is a problem in that it is difficult to control the distribution of light incident on a secondary optical member such as a lens used on the reflector layer 140.

Hereinafter, a light emitting device package according to another embodiment capable of solving these problems will be described with reference to FIG. 11.

11 is a cross-sectional view of a light emitting device package according to another embodiment, and FIG. 12 is a design diagram including actual dimensions of the light emitting device package shown in FIG. 11. Among the values shown in FIG. 12, values different from those shown in FIG. 10 are expressed in a darker form than the same values as those shown in FIG. 10.

In the light-emitting device package illustrated in FIG. 11, other components except for the reflector layer 140 ′ are the same as the light-emitting device packages illustrated in FIGS. 1 to 5, so a detailed description thereof will be omitted, and the reflector 140 ′. It will be described in detail.

The reflector layer 140 ′ reflects light emitted from the light emitting device 100. The reflector layer 140 ′ surrounds the light emitting device 100 and is disposed on the lead frame 200. The reflector layer 140 may be made of metal.

The reflector layer 140 ′ may be formed in a circular shape with a concave inside, but the shape of the reflector layer 140 ′ is not necessarily limited to a circular shape.

The reflector layer 140 ′ may be disposed on the insertion part 323 of the second resin package 320. The protrusion 322 of the second resin package 320 may be disposed on the reflector layer 140 ′. Accordingly, the reflector layer 140 ′ may be disposed between the protruding portion 322 and the insertion portion 323 of the second resin package 320.

The material of the reflector layer 140' may be a metal or a non-metal. The reflector layer 140' may be made of any material.

The reflector layer 140' includes an inclined surface 141'.

The inclined surface 141 ′ of the reflector layer 140 ′ is a mirror surface that regularly reflects incident light. Regular reflection is distinguished from diffuse reflection (or diffuse reflection), and regular reflection reflects incident light as it is, whereas diffuse reflection multiplely reflects incident light in various directions. If the inclined surface 141 ′ of the reflector layer 140 ′ is a mirror surface, the light output Po of the light emitting device package can be improved, the light extraction speed can be improved, and light distribution in the lateral direction of the light emitting device 100 When the intensity is stronger than the light distribution intensity in the upward direction, light distribution irregularities that may appear on the inclined surface 141 ′ may be reduced. Therefore, it is possible to easily adjust the distribution of light incident on the secondary optical member such as a lens usable on the reflector layer 140 ′.

The inclined surface 141 ′ of the reflector layer 140 ′ may be a surface inclined with a lower surface of the reflector layer 140 ′ at a predetermined angle (a). Here, the predetermined angle (a) may be 25 degrees (°) or more and 35 degrees (°) or less. When the predetermined angle (a) is 25 degrees or more and 35 degrees or less, the light output Po can be improved, and the occurrence of light distribution irregularities of a specific shape on the inclined surface 141' can be prevented or alleviated. Hereinafter, the technical effect of the predetermined angle a will be described in detail with reference to FIGS. 13 to 24.

13 are actual photographs of the light emitting device package illustrated in FIGS. 1 to 5, and FIGS. 14 to 17 are data showing a simulation effect when light is emitted from the light emitting device package illustrated in FIG. 13.

18 is an actual photograph of the light emitting device package illustrated in FIG. 11, and FIGS. 19 to 22 are data showing a simulation effect when light is emitted from the light emitting device package illustrated in FIG. 18.

14 and 19, the number of rays was set to 100,000. 14 and 19, it can be seen that the density of light rays in the central portion of the light emitting device package illustrated in FIG. 19 is smaller than the density of light rays in the central portion of the light emitting device package illustrated in FIG. 14. This means that in the light emitting device package illustrated in FIG. 19, light distribution is not concentrated in the central portion, and it can be seen that the overall light distribution is uniform.

Table 1 below shows the light output (Po), the operating voltage (Vf), and the peak wavelength (Wp) of the light emitting device package shown in FIG. 13.

Po (@100mA) VF (@100mA) WP (@100mA) Max. 11.618 Max. 6.624 Max. 275.08 Avg. 11.166 Avg. 6.485 Avg. 274.42

Table 2 below shows light output (Po), operating voltage (Vf), and peak wavelength (Wp) of the light emitting device package shown in FIG. 18.

Po (@100mA) VF (@100mA) WP (@100mA) Max. 11.549 Max. 6.760 Max. 275.70 Avg. 11.220
(+0.48%) Avg. 6.519 Avg. 274.64

Referring to Tables 1 and 2, it can be seen that the light output (Po) of the light emitting device package shown in FIG. 18 is improved by an average (Avg) of 0.48 more than the light output (Po) of the light emitting device package shown in FIG. 13. .

When comparing FIGS. 15 to 17 with FIGS. 20 to 22, it can be seen that in the case of the light emitting device package shown in FIG. 13, a ring-shaped light distribution irregularity occurs in the center portion, and in the case of the light emitting device package shown in FIG. 18 It can be seen that the light distribution irregularity is not completely absent, but there is no specific shape of the light distribution irregularity.

FIG. 23 is a view showing light directivity when light is emitted from the light emitting device package illustrated in FIG. 13, and FIG. 24 is a view showing light directivity when light is emitted from the light emitting device package illustrated in FIG. 18.

Comparing FIGS. 23 and 24, it can be seen that the light-emitting device package illustrated in FIG. 18 has improved light directivity compared to the light-emitting device package illustrated in FIG. 13. Specifically, it can be seen that the light emitting device package shown in FIG. 18 has a uniform light distribution compared to the light emitting device package shown in FIG. 13.

Further, although not shown in the drawings, if the predetermined angle a is less than 25 degrees, it is difficult to perform the reflective function, and the size of the light emitting device package may be negatively affected. If the predetermined angle (a) is less than 25 degrees, the size of the reflector layer 140 ′ increases in the horizontal direction, and when the size increases, the size of the resin package 320 is fixed to a specific size. There is a problem in that the space in which the light emitting device 100 can be mounted is narrowed. On the other hand, when a specific number of light emitting devices 100 must be mounted on the resin package 320, there is a problem that the size of the package body must be increased.

In consideration of the above-described various points, it is preferable that the predetermined angle (a) of the inclined surface 141' of the reflector layer 140' is 25 degrees or more and 35 degrees or less.

The embodiments have been described above, but these are only examples and do not limit the present invention, and those of ordinary skill in the field to which the present invention pertains will not be exemplified above without departing from the essential characteristics of the present embodiment. It will be seen that various modifications and applications are possible. For example, each constituent element specifically shown in the embodiment can be modified and implemented. And differences related to these modifications and applications should be construed as being included in the scope of the present invention defined in the appended claims.

1: light emitting device package
100: light-emitting element
110: light-emitting chip
120: sub mount
130: wire
140: reflector
150: lens guide part
160: plate guide part
200: lead frame
210: first frame
210a: recess
220: second frame
220a: convex portion
300: resin package
310: first resin package
310a: both ends
320: second resin package
320a: groove
320b: recess
321: wall part
322: protrusion
323: insert
400: lead frame prototype
410: outer frame
410a: convex portion
420: opening
140': reflector layer

Claims (6)

Light-emitting elements;
A lead frame in which the light emitting element is disposed;
A reflector layer disposed on the lead frame and reflecting light emitted from the light emitting device; And
Including; a resin package surrounding the lead frame and the reflector layer,
The reflector layer includes an inclined surface for specularly reflecting the light emitted from the light emitting device,
The angle between the inclined surface and the lower surface of the reflector layer is 25 degrees or more and 35 degrees or less,
The lead frame includes: a first frame in which the light emitting device is disposed; And a second frame electrically insulated from the first frame;
The resin package may include: a first resin package disposed between the first frame and the second frame; And a second resin package surrounding the light emitting device and the reflector layer and having a concave portion at a central portion,
The second resin package may include: a wall portion vertically formed outside the first lead frame, the second lead frame, and the reflector layer; And a protrusion formed horizontally protruding from the wall portion toward the inside,
A lens guide part formed on a part of an upper surface of the reflector layer and a side surface of the protruding part to arrange a lens; And a plate guide part formed as an upper surface of the protrusion and an inner surface of the wall part to arrange a plate. The method of claim 1,
The inclined surface is a mirror surface, the light emitting device package. The method of claim 1,
The light-emitting device includes a sub-mount and a light-emitting chip disposed on the sub-mount,
The light emitting chip is a light emitting device package that emits ultraviolet rays. The method of claim 1,
The reflector layer is aluminum, the light emitting device package. delete The method of claim 1,
The second resin package, a light emitting device package having a groove portion to which a portion of the reflector layer is inserted and fixed.

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