KR102236704B1 - Organic light emitting display device - Google Patents

Abstract

The organic light emitting diode display according to the exemplary embodiment of the present invention includes a lower substrate having a first sub-pixel region, a second sub-pixel region, and a bank region between the first sub-pixel region and the second sub-pixel region, and on the lower substrate. , A cathode commonly disposed in the first sub-pixel area, the second sub-pixel area, and the bank area, a first color filter layer disposed in the first sub-pixel area, on the cathode, and a first color filter layer disposed in the second sub-pixel area 2 a color filter layer, a color mixing prevention metal disposed in the bank region to prevent color mixing between the first sub-pixel region and the second sub-pixel region, and an upper substrate disposed on the first color filter layer and the second color filter layer, , In the bank region, the color mixing prevention metal is characterized in that it is electrically connected to the cathode. The organic light emitting diode display according to the exemplary embodiment of the present invention may minimize a voltage drop at the cathode.

Description

Organic light emitting display device and manufacturing method thereof {ORGANIC LIGHT EMITTING DISPLAY DEVICE}

The present invention relates to an organic light emitting display device and a method of manufacturing the same, and more particularly, to an organic light emitting display device capable of minimizing a voltage drop at a transparent cathode, and a method of manufacturing the same.

The organic light emitting display (OLED) is a self-emission type display device, and unlike a liquid crystal display (LCD), it does not require a separate light source, and thus can be manufactured in a lightweight and thin form. In addition, the organic light emitting display device is not only advantageous in terms of power consumption by low voltage driving, but also has excellent color realization, response speed, viewing angle, and contrast ratio (CR), and thus is being studied as a next-generation display.

In the case of a top emission type organic light-emitting display device among organic light-emitting display devices, a transparent electrode or a transflective electrode is used as a cathode to emit light emitted from the organic light-emitting layer upward. In both the case of using the transparent electrode as the cathode and the case of using the transflective electrode, the thickness of the cathode is made thin in order to improve the transmittance, and the decrease in the thickness of the cathode increases the electrical resistance of the cathode electrode. For this reason, in the case of a large-area organic light-emitting display device, a voltage drop occurs more severely as the distance from the voltage supply pad portion increases, thereby causing a problem of non-uniform luminance of the organic light-emitting display device.

In order to minimize the voltage drop phenomenon, a method of forming an auxiliary electrode using a partition wall is used. Specifically, a method of electrically connecting a cathode and an auxiliary electrode is used after disposing a partition wall for separating the organic emission layers between the sub-pixel regions, and after the auxiliary electrode is disposed under the partition wall.

However, the method of electrically connecting the cathode and the auxiliary electrode using the partition wall has a problem in that the contact area between the auxiliary electrode and the cathode is very small. When the contact area between the auxiliary electrode and the cathode is reduced, the contact resistance between the auxiliary electrode and the cathode increases significantly, and thus the voltage drop at the cathode cannot be sufficiently compensated.

[Related technical literature]

1. Organic EL device and its manufacturing method (Patent Application No. 10-2009-0061834)

The inventors of the present invention recognize the problems that occur when manufacturing the conventional organic light emitting display device including the auxiliary electrode as described above, and the organic light emitting display of a new structure capable of increasing the contact area between the cathode and the auxiliary electrode. The device was invented.

An object to be solved by the present invention is to provide an organic light emitting display device capable of minimizing a voltage drop phenomenon due to resistance of a cathode, which affects the luminance uniformity of the entire display, and a method of manufacturing the same.

Another problem to be solved by the present invention is to provide an organic light emitting display device and a method of manufacturing the same, in which contact resistance is significantly lowered due to a large contact area between a cathode and a color mixture preventing metal serving as an auxiliary electrode.

The problems of the present invention are not limited to the problems mentioned above, and other problems that are not mentioned will be clearly understood by those skilled in the art from the following description.

An organic light emitting diode display according to an embodiment of the present invention for achieving the above-described object includes a first sub-pixel region, a second sub-pixel region, and a bank between the first sub-pixel region and the second sub-pixel region. A lower substrate having a region, on the lower substrate, a cathode commonly disposed in the first sub-pixel region, the second sub-pixel region, and the bank region, on the cathode, on the first color filter layer and the cathode disposed in the first sub-pixel region, A second color filter layer disposed in the second sub-pixel region, a color mixing prevention metal disposed in the bank region to prevent color mixing between the first sub-pixel region and the second sub-pixel region, and a first color filter layer and a second color filter layer And an upper substrate disposed thereon, wherein in the bank region, the color mixing prevention metal is electrically connected to the cathode. The organic light emitting diode display according to the exemplary embodiment of the present invention may minimize a voltage drop at the cathode.

According to another feature of the present invention, at least one of the first color filter layer and the second color filter layer may be disposed in the bank area.

According to another feature of the present invention, both the first color filter layer and the second color filter layer are disposed in the bank area, and the sum of the height of the first color filter layer and the second color filter layer disposed in the bank area is 2 μm or more. I can.

According to another feature of the present invention, the color mixing prevention metal may be composed of a low-reflective metal.

According to another feature of the present invention, the lower surface of the color mixing prevention metal may have hydrophobicity.

According to another feature of the present invention, the lower surface of the color mixing prevention metal may be plasma-treated to have hydrophobicity.

According to another feature of the present invention, the lower surface of the color mixing prevention metal may be doped with hydrophobic ions to have hydrophobicity.

According to another feature of the present invention, the color mixing prevention metal may be formed in the form of a mesh.

According to another feature of the present invention, the minimum contact width between the color mixing prevention metal and the cathode may be 50 μm or more.

According to another feature of the present invention, a spacer disposed between the upper substrate and the color mixing prevention metal in the bank region may be further included.

According to another feature of the present invention, the height of the spacer may be 0.1 to 1 μm.

According to another feature of the present invention, the upper substrate includes a non-display area, an alignment metal for alignment between the upper substrate and the lower substrate is disposed in the non-display area of the upper substrate, and the spacer and the alignment metal are the same. It can be of any kind of metal.

According to another feature of the present invention, a bank layer disposed in the bank area may be further included, and the height of the bank layer may be 1 μm or more.

A method of manufacturing an organic light emitting diode display according to an exemplary embodiment of the present invention for achieving the above-described object includes a first sub-pixel region, a second sub-pixel region, and a first sub-pixel region and a second sub-pixel region of a lower substrate. Disposing a cathode in common in a bank region between sub-pixel regions, disposing a first color filter layer in a first sub-pixel region of an upper substrate, and disposing a second color filter layer in a second sub-pixel region of an upper substrate A step, disposing a color mixing prevention metal in the bank region of the upper substrate, and bonding the lower substrate and the upper substrate with an adhesive resin so that the color mixing prevention metal and the cathode are electrically connected to each other. In the method of manufacturing an organic light emitting diode display according to an exemplary embodiment of the present invention, a contact area between a color mixing prevention metal serving as an auxiliary electrode and a cathode may be increased.

According to another feature of the present invention, prior to the step of adhering the lower substrate and the upper substrate with an adhesive resin, a step of treating one surface of the color mixing prevention metal to have hydrophobicity may be further included.

According to still another feature of the present invention, the step of treating one surface of the color mixture preventing metal to have hydrophobicity may include plasma treating one surface of the color mixing prevention metal.

According to another feature of the present invention, the step of treating the color mixture preventing metal to have hydrophobicity may include performing a hydrophobic ion doping treatment on the color mixing prevention metal.

According to another feature of the present invention, before the step of disposing the first color filter layer in the first sub-pixel area of the upper substrate, the step of simultaneously forming a spacer and an alignment metal on the upper substrate may be further included.

Details of other embodiments are included in the detailed description and drawings.

The present invention has an effect of minimizing a voltage drop phenomenon at the cathode and improving luminance uniformity of an organic light emitting diode display by electrically connecting a color mixture preventing metal to a cathode between an upper substrate and a bank layer.

The present invention has the effect of sufficiently supplementing the voltage drop phenomenon at the cathode by increasing the contact area between the color mixing prevention metal and the cathode.

According to the present invention, the spacer and the alignment metal are formed in the same process, thereby reducing process steps for manufacturing an organic light emitting display device.

The effects of the present invention are not limited to the above-mentioned effects, and other effects that are not mentioned will be clearly understood by those skilled in the art from the following description.

1 is a schematic plan view of a top emission type organic light emitting diode display according to an exemplary embodiment.
2 is a schematic plan view of a top emission type organic light emitting diode display according to another exemplary embodiment of the present invention.
3 is a flowchart illustrating a method of manufacturing an organic light emitting diode display according to another exemplary embodiment of the present invention.
4A to 4G are cross-sectional views illustrating a method of manufacturing the organic light-emitting display device of FIG. 3 according to steps.

Advantages and features of the present invention, and a method of achieving them will become apparent with reference to the embodiments described below in detail together with the accompanying drawings. However, the present invention is not limited to the embodiments disclosed below, but will be implemented in various forms different from each other, and only these embodiments make the disclosure of the present invention complete, and common knowledge in the technical field to which the present invention pertains. It is provided to completely inform the scope of the invention to the possessor, and the invention is only defined by the scope of the claims.

The shapes, sizes, ratios, angles, numbers, etc. disclosed in the drawings for explaining the embodiments of the present invention are exemplary, and thus the present invention is not limited to the illustrated matters. The same reference numerals refer to the same elements throughout the specification. In addition, in describing the present invention, when it is determined that a detailed description of related known technologies may unnecessarily obscure the subject matter of the present invention, the detailed description thereof will be omitted. When'include','have','consists of' and the like mentioned in the present specification are used, other parts may be added unless'only' is used. In the case of expressing the constituent elements in the singular, it includes the case of including the plural unless specifically stated otherwise.

In interpreting the constituent elements, it is interpreted as including an error range even if there is no explicit description.

In the case of a description of the positional relationship, for example, if the positional relationship of two parts is described as'upper','upper of','lower of','next to','right' Or, unless'direct' is used, one or more other parts may be located between the two parts.

When an element or layer is referred to as “on” another element or layer, it includes all cases in which another layer or other element is interposed directly on or in the middle of another element.

Although the first, second, etc. are used to describe various components, these components are not limited by these terms. These terms are only used to distinguish one component from another component. Accordingly, the first component mentioned below may be a second component within the technical idea of the present invention.

The same reference numerals refer to the same elements throughout the specification.

The size and thickness of each component shown in the drawings are illustrated for convenience of description, and the present invention is not necessarily limited to the size and thickness of the illustrated component.

Each of the features of the various embodiments of the present invention can be partially or entirely combined or combined with each other, technically various interlocking and driving are possible, and each of the embodiments may be independently implemented with respect to each other or can be implemented together in an association relationship. May be.

Hereinafter, various embodiments of the present invention will be described in detail with reference to the accompanying drawings.

1 is a schematic plan view of a top emission type organic light emitting diode display according to an exemplary embodiment.

Referring to FIG. 1, an organic light emitting display device 100 according to an embodiment of the present invention includes a lower substrate 110, a buffer layer 120, a thin film transistor 130, a gate insulating layer 132, and an interlayer insulating layer ( 134), overcoat layer 140, first anode 150a, second anode 150b, bank layer 152, organic emission layer 154, cathode 156, adhesive resin layer 160, first color It includes a filter layer 170a, a second color filter layer 170b, an upper substrate 180, and a color mixing prevention metal 190'.

The lower substrate 110 is a substrate for supporting various components of the organic light emitting display device 100. The lower substrate 110 may be made of a material having transparency and flexibility.

The lower substrate 110 further includes a first sub-pixel area 1PA, a second sub-pixel area 2PA, and a bank area BA between the first sub-pixel area 1PA and the second sub-pixel area 2PA. Includes. Each of the first sub-pixel area 1PA and the second sub-pixel area 2PA is an area for displaying one color. Different colors of light are emitted from each of the first sub-pixel area 1PA and the second sub-pixel area 2PA, and specifically, any one of red, green, and blue light is emitted. The bank area BA is an area that divides a plurality of sub-pixel areas, and light is not emitted from the bank area BA.

The buffer layer 120 is formed on the lower substrate 110. The buffer layer 120 prevents penetration of moisture or impurities through the lower substrate 110 and flattens the upper portion of the lower substrate 110. However, the buffer layer 120 is not necessarily a necessary configuration. Whether to form the buffer layer 120 is determined based on the type of the lower substrate 110 or the type of the thin film transistor 130 used in the organic light emitting display device 100. In addition, the buffer layer 120 may be formed of a transparent material.

The thin film transistor 130 is connected to the first anode 150a and the second anode 150b to drive the organic light emitting display device 100. The thin film transistor 130 includes an active layer formed on the buffer layer 120, a gate electrode formed on the gate insulating layer 132, and a source electrode and a drain electrode formed on the interlayer insulating layer 134.

An overcoat layer 140 is disposed on the thin film transistor 130. The overcoat layer 140 is a layer that flattens the upper portion of the substrate and functions as a planarization film. The overcoat layer 140 includes a contact hole for electrically connecting the source electrode of the thin film transistor 130 to the first anode 150a and the second anode 150b.

A first anode 150a and a second anode 150b are disposed on the overcoat layer 140. Each of the first anode 150a and the second anode 150b serves to apply a voltage to each of the first organic emission layer 154 and the second organic emission layer 154. As shown in FIG. 1, the first anode 150a and the second anode 150b are formed separately for each sub-pixel area. Specifically, the first anode 150a is disposed in the first sub-pixel area 1PA, and the second anode 150b is disposed in the second sub-pixel area 2PA.

Each of the first anode 150a and the second anode 150b may be formed of a transparent conductive material having a high work function and a reflecting plate. Here, the transparent conductive material may include Indium Tin Oxide (ITO), Indium Zinc Oxide (IZO), and Indium Tin Zinc Oxide (ITZO).

The bank layer 152 is disposed to cover the edge of the first anode 150a and the edge of the second anode 150b. The bank layer 152 is disposed in the bank area BA and serves to divide the adjacent sub-pixel areas 1PA and 2PA. The bank layer 152 is made of any one of a transparent organic insulating material, for example, polyimide, photo acryl, benzocyclobutene (BCB), or a material representing black, for example, a black resin. Can be done.

The bank layer 152 may have a height equal to or greater than a certain value so that the color mixture preventing metal 190 can easily contact the cathode 156. For example, the bank layer 152 may have a height of 1 μm or more.

The organic emission layer 154 is commonly disposed on the first anode 150a, the second anode 150b, and the bank layer 152. The organic emission layer 154 serves to emit light by receiving voltage from the first anode 150a, the second anode 150b, and the cathode 156. The organic emission layer 154 may be configured to emit white light. In FIG. 1, the organic emission layer 154 is shown to be commonly disposed on the first sub-pixel area 1PA, the second sub-pixel area 2PA, and the bank area BA, but one of red, green, and blue colors. Each of the two organic emission layers 154 emitting the color of may be disposed on the first sub-pixel area 1PA and the second sub-pixel area 2PA, respectively.

A cathode 156 is disposed on the organic emission layer 154. 1, the cathode 156 is commonly disposed in the first sub-pixel area 1PA, the second sub-pixel area 2PA, and the bank area BA. The cathode 156 is disposed to face the first anode 150a and the second anode 150b and serves to apply a voltage to the organic emission layer 154. The cathode 156 may be connected to a separate power supply voltage line to apply the same voltage to all sub-pixel regions, and may be formed to have a very thin thickness to be substantially transparent. The cathode 156 may be made of a metallic material having a low work function, such as silver (Ag), titanium (Ti), aluminum (Al), molybdenum (Mo), or an alloy of silver (Ag) and magnesium (Mg). have. In addition, the cathode 156 may be formed as a transparent cathode using a material such as ITO or IZO.

An adhesive resin layer 160 is disposed on the cathode 156. The adhesive resin layer 160 serves to bond the lower substrate 110 and the upper substrate 180. In a state where the adhesive resin is disposed between the lower substrate 110 and the upper substrate 180, the adhesive resin is cured by heat or ultraviolet rays to become the adhesive resin layer 160, and the lower substrate 110 and the upper substrate 180 Bonding between them can be made. The adhesive resin layer 160 has hydrophilicity and may be formed of a curable resin that is cured by heat or ultraviolet rays.

A first color filter layer 170a and a second color filter layer 170b are disposed on the adhesive resin layer 160. Specifically, the first color filter layer 170a is disposed in the first sub-pixel area 1PA, and the second color filter layer 170b is disposed in the second sub-pixel area 2PA. Each of the first color filter layer 170a and the second color filter layer 170b may serve to transmit only light of a specific color. Each of the first color filter layer 170a and the second color filter layer 170b may have a thickness of 1 to 3 μm, but is not limited thereto.

At least one of the first color filter layer 170a and the second color filter layer 170b may be disposed in the bank area BA. For example, as shown in FIG. 1, both the first color filter layer 170a and the second color filter layer 170b may be stacked on each other and disposed in the bank area BA. The first color filter layer 170a and the second color filter layer 170b disposed in the bank area BA prevent color mixing with the upper substrate 180 so that the color mixing prevention metal 190 can easily contact the cathode 156 It serves to fill the space between the metal 190. The sum of the height of the first color filter layer 170a disposed in the bank area BA and the height of the second color filter layer 170b to sufficiently fill the space between the upper substrate 180 and the color mixing prevention metal 190 May be 2 μm or more.

Meanwhile, in FIG. 1, both the first color filter layer 170a and the second color filter layer 170b are shown to be disposed in the bank area BA, but the first color filter layer 170a and the second color filter layer 170b Only one of them may be disposed in the bank area BA. In addition, when the organic light emitting diode display 100 includes a third color filter layer in addition to the first color filter layer 170a and the second color filter layer 170b, the first color filter layer 170a and the second color filter layer 170b And all of the third color filter layers may be stacked on each other to be disposed in the bank area BA.

The color mixing prevention metal 190 is disposed on the cathode 156 in the bank area BA. The color mixing prevention metal 190 basically serves to prevent color mixing between the first sub-pixel area 1PA and the second sub-pixel area 2PA. For example, the color mixing prevention metal 190 is made of a predetermined metal having reflective properties, reflects light leaking from the first sub-pixel area 1PA to the second sub-pixel area 2PA, and reflects the second sub-pixel area. It serves to reflect light emerging from the area 2PA to the first sub-pixel area 1PA. In terms of preventing color mixing between sub-pixel regions, the color mixing prevention metal 190 can be considered to play a role of a black matrix BM in a conventional organic light emitting display device.

In addition to preventing the color mixture between the sub-pixel regions, the color mixing prevention metal 190 is electrically connected to the cathode 156 to compensate for a voltage drop at the cathode 156. That is, the color mixing prevention metal 190 may also serve as an auxiliary electrode in a conventional organic light emitting display device.

As shown in FIG. 1, the color mixing prevention metal 190 is electrically connected to the cathode 156 disposed on the bank layer 152 of the bank area BA. Since the bank layer 152 is formed in a mesh shape to divide the rectangular sub-pixel regions, the color mixing prevention metal 190 may also be formed in a mesh shape.

The color mixing prevention metal 190 may be formed of a general metal having reflective properties, for example, aluminum (Al), copper (Cu), and molybdenum (Mo). However, in order to minimize reflection of external light, the anti-mixture metal 190 may be formed of a low-reflective metal having a reflectance of 20 to 40%.

The color mixing prevention metal 190 is electrically connected to the cathode 156 disposed on the bank layer 152 to function as an auxiliary electrode. In order to secure a process margin, the bank layer 152 is generally formed to have a minimum width, for example 50 μm. Accordingly, the color mixing prevention metal 190 may be electrically connected to the cathode 156 disposed on the bank layer 152 while having a contact width of at least 50 μm.

In a conventional OLED display, a partition wall structure is used to electrically connect the auxiliary electrode to the cathode. More specifically, a structure in which an auxiliary electrode is disposed under the partition wall formed between the bank layers and a cathode commonly formed on the entire surface of the substrate is connected to the auxiliary electrode is used. However, when the cathode and the auxiliary electrode are connected using the partition wall structure, the minimum contact width between the cathode and the auxiliary electrode is only about 1 µm, and accordingly, the contact area between the cathode and the auxiliary electrode is reduced, thereby increasing the contact resistance. There was a problem.

In the organic light emitting display device 100 according to the exemplary embodiment of the present invention, since the minimum contact width between the color mixing prevention metal 190 and the cathode 156 can be very long, for example, 50 μm or more, The contact area between the cathode 156 and the color mixing prevention metal 190 may be increased. Accordingly, the contact resistance between the cathode 156 and the color mixing prevention metal 190 is significantly reduced, so that the voltage drop at the cathode 156 can be minimized.

Meanwhile, the color mixing prevention metal 190 is first formed on the upper substrate 180 and is subsequently electrically connected to the cathode 156 formed on the lower substrate 110. In general, since adhesion between the lower substrate 110 and the upper substrate 180 is made after the adhesive resin is applied to the upper substrate 180, the color mixing prevention metal 190 is electrically stabilized with the cathode 156. In order to connect, one surface of the color mixing prevention metal 190 needs to be exposed when the adhesive resin is applied to the upper substrate 180.

In order to expose one surface of the color mixing prevention metal 190 when applying the adhesive resin to the upper substrate 180, the surface of the color mixing prevention metal 190 may be treated to have hydrophobicity. Since the adhesive resin is a liquid substance, when the lower surface of the color mixing prevention metal 190 has hydrophobicity, the adhesive resin may not be applied to the surface of the color mixing prevention metal 190 when the adhesive resin is applied to the upper substrate 180. have.

The lower surface of the color mixing prevention metal 190 may be plasma-treated so that the surface of the color mixing prevention metal 190 has hydrophobicity. For example, after disposing the color mixing prevention metal 190 in the plasma chamber so that the surface of the color mixing prevention metal 190 has hydrophobicity, carbon tetrafluoride (CF ₄ ) gas is introduced, and the chamber pressure and applied voltage Can be adjusted. In addition, the lower surface of the color mixing prevention metal 190 may be doped with a hydrophobic ion so that the surface of the color mixing prevention metal 190 has hydrophobicity.

The upper substrate 180 is disposed on the first color filter layer 170a and the second color filter layer 170b. The upper substrate 180 also includes a first sub-pixel area 1PA, a second sub-pixel area 2PA, and a bank area BA so as to correspond to the lower substrate 110. The upper substrate 180 supports and protects various components of the organic light emitting display device 100. The upper substrate 180 may have a high level of transparency to transmit light, and may be configured as a flexible substrate to enable bending. The upper substrate 180 may be formed of transparent polyimide (PI), but is not limited thereto.

2 is a schematic plan view of a top emission type organic light emitting diode display according to another exemplary embodiment of the present invention.

FIG. 2 illustrates an organic light emitting display device 200 further including a spacer 292 and alignment metals 294 and 296 as compared to the organic light emitting display device 100 of FIG. 1, and a lower substrate 110. ) And the upper substrate 180 differ only in configurations including the non-display area NDA, and the rest of the configurations are substantially the same, so a redundant description will be omitted.

Referring to FIG. 2, the lower substrate 110 and the upper substrate 180 include a non-display area NDA. The non-display area NDA is an area in which an image is not displayed and is an area in which the alignment metals 294 and 296 are disposed.

Referring further to FIG. 2, the OLED display 200 further includes spacers 292 and alignment metals 292 and 296.

A spacer 292 is disposed on the color mixing prevention metal 190 in the bank area BA. As shown in FIG. 2, the spacers 292 may be disposed on the first color filter layer 170a and the second color filter layer 170b. The spacer 292 serves to fill the space between the upper substrate 180 and the color mixing prevention metal 190 so that the color mixing prevention metal 190 can easily contact the cathode 156. The height of the spacer 292 may be 0.1 to 1 μm to sufficiently fill the space between the upper substrate 180 and the color mixing prevention metal 190. The spacer 292 may be formed of a low-reflective metal, but is not limited thereto.

Alignment metals 294 and 296 are disposed under the non-display area NDA of the lower substrate 110 and the upper substrate 180. The alignment metals 294 and 296 serve as marks that enable a process performer to check whether the lower substrate 110 and the upper substrate 180 are correctly aligned. The alignment metals 294 and 296 may be formed of a low-reflective metal, but are not limited thereto.

The spacer 292 and the alignment metal 294 of the upper substrate 180 may be formed of the same type of metal, and may be formed in the same process.

In the organic light emitting diode display 200 according to another exemplary embodiment of the present invention, the color mixing prevention metal 190 may be easily contacted with the cathode 156 by the spacers 292, and the spacer 292 and the upper substrate ( By forming the metal 294 for alignment of 180) together, process steps for manufacturing the organic light emitting display device 200 may be reduced.

3 is a flowchart illustrating a method of manufacturing an organic light emitting diode display according to another exemplary embodiment of the present invention. In addition, FIGS. 4A to 4G are cross-sectional views illustrating a method of manufacturing the organic light-emitting display device of FIG. 3 according to steps. For convenience of illustration, non-display areas of the lower substrate and the upper substrate are not illustrated in FIGS. 4A to 4G.

Referring to FIG. 4A, between the first sub-pixel area 1PA, the second sub-pixel area 2PA, and the first sub-pixel area 1PA and the second sub-pixel area 2PA of the lower substrate 110 The cathode 156 is commonly disposed in the bank area BA (S310).

As shown in FIG. 4A, before the cathode 156 is commonly disposed on the lower substrate 110, the buffer layer 120, the thin film transistor 130, and the gate insulating layer 132 are formed on the lower substrate 110. ), an interlayer insulating layer 134, an overcoat layer 140, a first anode 150a, a second anode 150b, a bank layer 152, and an organic emission layer 154 may be further formed.

Referring to FIG. 4B, spacers 292 may be disposed in the bank area BA of the upper substrate 180.

A patterned mask may be used to place the spacers 292 in the bank area BA of the upper substrate 180.

Although not shown in FIG. 4B, while disposing the spacers 292 in the bank area BA of the upper substrate 180, the metal for alignment is applied to the non-display area NDA of the upper substrate 180 using the same mask. Can be placed.

Referring to FIG. 4C, a first color filter layer 170a is disposed in a first sub-pixel area 1PA (S320), and a second color filter layer 170b is disposed in a second sub-pixel area 2PA of the upper substrate 180. ) Is placed (S330).

The first color filter layer 170a and the second color filter layer 170b may also be disposed on the bank area BA of the upper substrate 180. Specifically, as shown in FIG. 4C, the first color filter layer 170a and the second color filter layer 170b are disposed on the spacer 292 disposed in the bank area BA of the upper substrate 180. I can.

Referring to FIG. 4D, a color mixing prevention metal 190 is disposed in the bank area BA of the upper substrate 180 (S540).

A patterned mask may be used to arrange the color mixture prevention metal 190 in the bank area BA of the upper substrate 180.

Referring to FIG. 4E, an adhesive resin 460 may be applied on the upper substrate 180.

When the lower substrate 110 and the upper substrate 180 are later bonded, the color mixing prevention metal 190 must be electrically connected to the cathode 156 of the lower substrate 110, so the upper surface of the color mixing prevention metal 190 It is necessary that the adhesive resin 460 is not applied.

When bonding the lower substrate 110 and the upper substrate 180 with the adhesive resin 460, the surface of the color mixing prevention metal 190 has hydrophobicity, so that the surface of the color mixing prevention metal 190 is not covered by the adhesive resin 460, so that the color mixing prevention metal 190 A predetermined treatment may be applied to the surface of the. Specifically, the upper surface of the color mixing prevention metal 190 may be plasma-treated, or the surface of the color mixing prevention metal 190 may be hydrophobic ion doping treatment. Accordingly, as illustrated in FIG. 4E, even when the adhesive resin 460 is applied to the entire surface of the upper substrate 180, the surface of the color mixing prevention metal 190 may be exposed to the outside.

Referring to FIG. 4F, the lower substrate 110 and the upper substrate 180 may be aligned.

The process operator may accurately align the lower substrate 110 and the upper substrate 180 using the alignment metal.

Referring to FIG. 4G, the lower substrate 110 and the upper substrate 180 are bonded with an adhesive resin 460 so that the color mixture preventing metal 190 and the cathode 156 are electrically connected (S550).

Specifically, the lower substrate 110 and the upper substrate 180 may be bonded to each other by curing the adhesive resin 460 while pressing the lower substrate 110 on the upper substrate 180.

Although the embodiments of the present invention have been described in more detail with reference to the accompanying drawings, the present invention is not necessarily limited to these embodiments, and various modifications may be made without departing from the spirit of the present invention. . Accordingly, the embodiments disclosed in the present invention are not intended to limit the technical idea of the present invention, but to explain the technical idea, and the scope of the technical idea of the present invention is not limited by these embodiments. Therefore, it should be understood that the embodiments described above are illustrative and non-limiting in all respects. The scope of protection of the present invention should be interpreted by the following claims, and all technical ideas within the scope equivalent thereto should be construed as being included in the scope of the present invention.

100, 200: organic light emitting display device
1PA: first sub-pixel area
2PA: second sub-pixel area
BA: bank area
110: lower substrate
120: buffer layer
130: thin film transistor
132: gate insulating layer
134: interlayer insulating layer
140: overcoat layer
150a: first anode
150b: second anode
152: bank layer
154: organic emission layer
156: cathode
160: adhesive resin layer
170a: first color filter layer
170b: second color filter layer
180: upper substrate
190: color mixing prevention metal
292: spacer
294, 296: alignment metal
460: adhesive resin

Claims (18)

A lower substrate having a first sub-pixel region, a second sub-pixel region, and a bank region between the first sub-pixel region and the second sub-pixel region;
A cathode commonly disposed in the first sub-pixel area, the second sub-pixel area, and the bank area on the lower substrate;
A first color filter layer disposed in the first sub-pixel area on the cathode;
A second color filter layer disposed in the second sub-pixel area on the cathode;
A color mixing prevention metal disposed in the bank area to prevent color mixing between the first sub-pixel area and the second sub-pixel area; And
And an upper substrate disposed on the first color filter layer and the second color filter layer,
In the bank area, the color mixing prevention metal is electrically connected to the cathode,
The organic light-emitting display device, wherein the surface of the color mixing prevention metal has hydrophobicity. The method of claim 1,
At least one of the first color filter layer and the second color filter layer is disposed in the bank area. The method of claim 1,
Both the first color filter layer and the second color filter layer are disposed in the bank area,
The organic light-emitting display device, wherein a sum of the height of the first color filter layer and the height of the second color filter layer disposed in the bank area is 2 μm or more. The method of claim 1,
The organic light-emitting display device, wherein the color mixing prevention metal is formed of a metal material having a reflectance of 20% to 40% of light. delete The method of claim 1,
The organic light emitting display device according to claim 1, wherein the surface of the color mixing prevention metal is plasma-treated to have hydrophobicity. The method of claim 1,
The organic light emitting display device according to claim 1, wherein the surface of the color mixing prevention metal is doped with hydrophobic ions to have hydrophobicity. The method of claim 1,
The organic light-emitting display device, wherein the color mixing prevention metal is formed in a mesh shape. The method of claim 1,
The organic light-emitting display device according to claim 1, wherein a minimum contact width between the color mixing prevention metal and the cathode is 50 μm or more. The method of claim 1,
And a spacer disposed between the upper substrate and the color mixing prevention metal in the bank area. The method of claim 10,
The height of the spacer is 0.1 to 1 ㎛, the organic light emitting display device. A lower substrate having a first sub-pixel region, a second sub-pixel region, and a bank region between the first sub-pixel region and the second sub-pixel region;
A cathode commonly disposed in the first sub-pixel area, the second sub-pixel area, and the bank area on the lower substrate;
A first color filter layer disposed in the first sub-pixel area on the cathode;
A second color filter layer disposed in the second sub-pixel area on the cathode;
A color mixing prevention metal disposed in the bank area to prevent color mixing between the first sub-pixel area and the second sub-pixel area;
An upper substrate disposed on the first color filter layer and the second color filter layer;
And a spacer disposed between the upper substrate and the color mixing prevention metal in the bank area,
In the bank area, the color mixing prevention metal is electrically connected to the cathode,
The upper substrate includes a non-display area,
An alignment metal for alignment between the upper substrate and the lower substrate is disposed in a non-display area of the upper substrate,
The organic light emitting display device, wherein the spacer and the alignment metal are of the same type of metal. The method of claim 1,
The organic light emitting diode display device further comprising a bank layer disposed in the bank area, wherein the bank layer has a height of 1 μm or more. Disposing a cathode in common in a first sub-pixel region, a second sub-pixel region, and a bank region between the first sub-pixel region and the second sub-pixel region of a lower substrate;
Disposing a first color filter layer in the first sub-pixel area of the upper substrate;
Disposing a second color filter layer in a second sub-pixel area of the upper substrate;
Disposing a color mixing prevention metal in the bank area of the upper substrate;
Treating the surface of the color mixing prevention metal to have hydrophobicity; And
And bonding the lower substrate and the upper substrate with an adhesive resin so that the color mixture preventing metal and the cathode are electrically connected to each other. delete The method of claim 14,
The step of treating the surface of the color mixing prevention metal to have hydrophobicity comprises plasma treating the surface of the color mixing prevention metal. The method of claim 14,
The step of treating the surface of the color mixing prevention metal to have hydrophobicity comprises performing a hydrophobic ion doping treatment on the color mixing prevention metal. Disposing a cathode in common in a first sub-pixel region, a second sub-pixel region, and a bank region between the first sub-pixel region and the second sub-pixel region of a lower substrate;
Disposing a first color filter layer in the first sub-pixel area of the upper substrate;
Disposing a second color filter layer in a second sub-pixel area of the upper substrate;
Disposing a color mixing prevention metal in the bank area of the upper substrate;
Treating the surface of the color mixing prevention metal to have hydrophobicity; And
Adhering the lower substrate and the upper substrate with an adhesive resin so that the color mixing prevention metal and the cathode are electrically connected,
Prior to the step of disposing the first color filter layer in the first sub-pixel area of the upper substrate, a spacer disposed to correspond to the color mixing prevention metal and a non-display of the upper substrate for alignment between the upper substrate and the lower substrate The method of manufacturing an organic light-emitting display device, further comprising simultaneously forming an alignment metal disposed in an area on the upper substrate.

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