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KR102224971B1 - 경화성 수지막 형성층이 형성된 시트 및 그 시트를 사용한 반도체 장치의 제조 방법 - Google Patents

경화성 수지막 형성층이 형성된 시트 및 그 시트를 사용한 반도체 장치의 제조 방법 Download PDF

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Publication number
KR102224971B1
KR102224971B1 KR1020157013915A KR20157013915A KR102224971B1 KR 102224971 B1 KR102224971 B1 KR 102224971B1 KR 1020157013915 A KR1020157013915 A KR 1020157013915A KR 20157013915 A KR20157013915 A KR 20157013915A KR 102224971 B1 KR102224971 B1 KR 102224971B1
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KR
South Korea
Prior art keywords
resin film
forming layer
film forming
curable resin
sheet
Prior art date
Application number
KR1020157013915A
Other languages
English (en)
Korean (ko)
Other versions
KR20150090080A (ko
Inventor
유이치 고조네
마사아키 후루다테
이사오 이치카와
Original Assignee
린텍 가부시키가이샤
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Filing date
Publication date
Application filed by 린텍 가부시키가이샤 filed Critical 린텍 가부시키가이샤
Publication of KR20150090080A publication Critical patent/KR20150090080A/ko
Application granted granted Critical
Publication of KR102224971B1 publication Critical patent/KR102224971B1/ko

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Classifications

    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B27/00—Layered products comprising a layer of synthetic resin
    • B32B27/18—Layered products comprising a layer of synthetic resin characterised by the use of special additives
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B27/00—Layered products comprising a layer of synthetic resin
    • B32B27/06—Layered products comprising a layer of synthetic resin as the main or only constituent of a layer, which is next to another layer of the same or of a different material
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B27/00—Layered products comprising a layer of synthetic resin
    • B32B27/16—Layered products comprising a layer of synthetic resin specially treated, e.g. irradiated
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B5/00—Layered products characterised by the non- homogeneity or physical structure, i.e. comprising a fibrous, filamentary, particulate or foam layer; Layered products characterised by having a layer differing constitutionally or physically in different parts
    • B32B5/14—Layered products characterised by the non- homogeneity or physical structure, i.e. comprising a fibrous, filamentary, particulate or foam layer; Layered products characterised by having a layer differing constitutionally or physically in different parts characterised by a layer differing constitutionally or physically in different parts, e.g. denser near its faces
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B7/00—Layered products characterised by the relation between layers; Layered products characterised by the relative orientation of features between layers, or by the relative values of a measurable parameter between layers, i.e. products comprising layers having different physical, chemical or physicochemical properties; Layered products characterised by the interconnection of layers
    • B32B7/04—Interconnection of layers
    • B32B7/06—Interconnection of layers permitting easy separation
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B7/00—Layered products characterised by the relation between layers; Layered products characterised by the relative orientation of features between layers, or by the relative values of a measurable parameter between layers, i.e. products comprising layers having different physical, chemical or physicochemical properties; Layered products characterised by the interconnection of layers
    • B32B7/04—Interconnection of layers
    • B32B7/12—Interconnection of layers using interposed adhesives or interposed materials with bonding properties
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J201/00—Adhesives based on unspecified macromolecular compounds
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J7/00—Adhesives in the form of films or foils
    • C09J7/20—Adhesives in the form of films or foils characterised by their carriers
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
    • H01L21/04—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer
    • H01L21/50—Assembly of semiconductor devices using processes or apparatus not provided for in a single one of the subgroups H01L21/06 - H01L21/326, e.g. sealing of a cap to a base of a container
    • H01L21/52—Mounting semiconductor bodies in containers
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/28—Encapsulations, e.g. encapsulating layers, coatings, e.g. for protection
    • H01L23/29—Encapsulations, e.g. encapsulating layers, coatings, e.g. for protection characterised by the material, e.g. carbon
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/28—Encapsulations, e.g. encapsulating layers, coatings, e.g. for protection
    • H01L23/29—Encapsulations, e.g. encapsulating layers, coatings, e.g. for protection characterised by the material, e.g. carbon
    • H01L23/293—Organic, e.g. plastic
    • H01L23/296—Organo-silicon compounds
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/28—Encapsulations, e.g. encapsulating layers, coatings, e.g. for protection
    • H01L23/31—Encapsulations, e.g. encapsulating layers, coatings, e.g. for protection characterised by the arrangement or shape
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B2457/00—Electrical equipment
    • B32B2457/14—Semiconductor wafers
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
    • C08K5/00—Use of organic ingredients
    • C08K5/54—Silicon-containing compounds
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J2203/00—Applications of adhesives in processes or use of adhesives in the form of films or foils
    • C09J2203/326—Applications of adhesives in processes or use of adhesives in the form of films or foils for bonding electronic components such as wafers, chips or semiconductors
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J2301/00—Additional features of adhesives in the form of films or foils
    • C09J2301/40—Additional features of adhesives in the form of films or foils characterized by the presence of essential components
    • C09J2301/408—Additional features of adhesives in the form of films or foils characterized by the presence of essential components additives as essential feature of the adhesive layer
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/0001—Technical content checked by a classifier
    • H01L2924/0002—Not covered by any one of groups H01L24/00, H01L24/00 and H01L2224/00

Landscapes

  • Engineering & Computer Science (AREA)
  • Power Engineering (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Physics & Mathematics (AREA)
  • Chemical & Material Sciences (AREA)
  • Organic Chemistry (AREA)
  • Adhesive Tapes (AREA)
  • Laminated Bodies (AREA)
  • Adhesives Or Adhesive Processes (AREA)
  • Dicing (AREA)
  • Manufacturing & Machinery (AREA)
  • Health & Medical Sciences (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Medicinal Chemistry (AREA)
  • Polymers & Plastics (AREA)
KR1020157013915A 2012-11-30 2013-11-29 경화성 수지막 형성층이 형성된 시트 및 그 시트를 사용한 반도체 장치의 제조 방법 KR102224971B1 (ko)

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
JPJP-P-2012-263034 2012-11-30
JP2012263034 2012-11-30
PCT/JP2013/082187 WO2014084357A1 (ja) 2012-11-30 2013-11-29 硬化性樹脂膜形成層付シートおよび該シートを用いた半導体装置の製造方法

Publications (2)

Publication Number Publication Date
KR20150090080A KR20150090080A (ko) 2015-08-05
KR102224971B1 true KR102224971B1 (ko) 2021-03-08

Family

ID=50827985

Family Applications (1)

Application Number Title Priority Date Filing Date
KR1020157013915A KR102224971B1 (ko) 2012-11-30 2013-11-29 경화성 수지막 형성층이 형성된 시트 및 그 시트를 사용한 반도체 장치의 제조 방법

Country Status (5)

Country Link
JP (1) JP6298409B2 (ja)
KR (1) KR102224971B1 (ja)
CN (1) CN104797423B (ja)
TW (1) TWI600740B (ja)
WO (1) WO2014084357A1 (ja)

Families Citing this family (10)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
WO2016175612A1 (ko) 2015-04-29 2016-11-03 주식회사 엘지화학 반도체용 접착 필름
JP6521823B2 (ja) * 2015-10-01 2019-05-29 リンテック株式会社 ダイシングダイボンディングシート
SG11201902955QA (en) * 2016-10-05 2019-05-30 Lintec Corp First protective film forming sheet
JP7248572B2 (ja) * 2017-05-31 2023-03-29 リンテック株式会社 接着剤組成物、接着シート、及び封止体
WO2019054225A1 (ja) * 2017-09-15 2019-03-21 リンテック株式会社 フィルム状焼成材料、及び支持シート付フィルム状焼成材料
JP7137575B2 (ja) * 2017-10-27 2022-09-14 リンテック株式会社 保護膜形成用フィルム、保護膜形成用複合シート、及び半導体チップの製造方法
CN111344850A (zh) * 2017-11-17 2020-06-26 琳得科株式会社 带第一保护膜的半导体芯片及其制造方法、及半导体芯片-第一保护膜层叠体的评价方法
JP7146931B2 (ja) * 2018-09-20 2022-10-04 三井化学東セロ株式会社 電子装置の製造方法
JP6497477B1 (ja) * 2018-10-03 2019-04-10 東洋インキＳｃホールディングス株式会社 電磁波シールドシート、および電子部品搭載基板
CN110003822A (zh) * 2019-04-30 2019-07-12 浙江华硕科技股份有限公司 一种墙纸用环保胶水及其制备方法

Citations (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2009138026A (ja) * 2007-12-03 2009-06-25 Furukawa Electric Co Ltd:The エネルギー線硬化型チップ保護用フィルム
JP2011162603A (ja) * 2010-02-05 2011-08-25 Lintec Corp 接着剤組成物および接着シート

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JPH04145119A (ja) * 1990-10-05 1992-05-19 Toshiba Silicone Co Ltd エポキシ樹脂組成物
JP4275221B2 (ja) * 1998-07-06 2009-06-10 リンテック株式会社 粘接着剤組成物および粘接着シート
CN100473704C (zh) * 2001-08-27 2009-04-01 日立化成工业株式会社 粘合薄片和半导体装置及其制造方法
JP4064403B2 (ja) * 2005-01-18 2008-03-19 シャープ株式会社 半導体装置、表示モジュール、半導体チップ実装用フィルム基板の製造方法、及び半導体装置の製造方法
KR100909169B1 (ko) * 2006-09-11 2009-07-23 제일모직주식회사 선 경화형 반도체 조립용 접착 필름 조성물
KR101023841B1 (ko) * 2006-12-08 2011-03-22 주식회사 엘지화학 접착제 수지 조성물 및 이를 이용한 다이싱 다이 본딩 필름
JP5234594B2 (ja) * 2008-03-11 2013-07-10 リンテック株式会社 粘接着剤組成物、粘接着シートおよび半導体装置の製造方法
US20120270381A1 (en) * 2009-10-16 2012-10-25 Lg Chem, Ltd. Die attach film

Patent Citations (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2009138026A (ja) * 2007-12-03 2009-06-25 Furukawa Electric Co Ltd:The エネルギー線硬化型チップ保護用フィルム
JP2011162603A (ja) * 2010-02-05 2011-08-25 Lintec Corp 接着剤組成物および接着シート

Also Published As

Publication number Publication date
CN104797423B (zh) 2017-06-13
TWI600740B (zh) 2017-10-01
JP6298409B2 (ja) 2018-03-20
KR20150090080A (ko) 2015-08-05
WO2014084357A1 (ja) 2014-06-05
CN104797423A (zh) 2015-07-22
JPWO2014084357A1 (ja) 2017-01-05
TW201435036A (zh) 2014-09-16

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