KR102203106B1 - Deposition apparatus - Google Patents

Abstract

The present invention discloses a vapor deposition apparatus. The present invention emits a deposition material, the first deposition source and the second deposition source arranged in the moving direction of the substrate so as to approach sequentially when the substrate is moved, and facing the first deposition source and the second deposition source. A patterning slit sheet in which a plurality of patterning slits are disposed along one direction, and a deposition material emitted from the first deposition source and a deposition material emitted from the second deposition source are guided, and in the first deposition source Emitted deposition material passes through the patterning slit sheet and is deposited on the substrate to form a first layer, and the deposition material emitted from the second deposition source passes through the patterning slit sheet and is deposited on the first layer. When forming the second layer, it includes an angle limiting unit that guides the paths of the deposition materials such that the deposition material sprayed from the first deposition source and the deposition material sprayed from the second deposition source are not mixed or mixed with each other.

Description

Deposition apparatus

The present invention relates to a deposition apparatus, and more particularly, to a deposition apparatus capable of reducing the size of the apparatus while being able to form a plurality of deposition layers.

Among the display devices, the organic light emitting display device is attracting attention as a next-generation display device because it has the advantage of having a wide viewing angle, excellent contrast, and fast response speed.

The organic light emitting display device has a configuration in which an intermediate layer including a light emitting layer is interposed between a first electrode and a second electrode opposite to each other. At this time, the first electrode, the second electrode, and the intermediate layer may be formed by several methods, one of which is an independent deposition method. In order to fabricate an organic light emitting display device using a vapor deposition method, a fine metal mask (FMM) having an opening of the same/similar pattern as the pattern of the intermediate layer to be formed on the substrate on which the intermediate layer or the like is to be formed is in close contact with the intermediate layer. A material such as is deposited to form an intermediate layer or the like of a predetermined pattern.

However, in the conventional deposition method using such a fine metal mask, a large-area organic light-emitting display device is manufactured using a large-area substrate or a plurality of organic light-emitting display devices are simultaneously manufactured using a large-area mother-substrate. In this case, a large-area fine metal mask (FMM) has to be used, and in this case, there is a problem in that an intermediate layer of a predetermined accurate pattern cannot be formed because the sagging phenomenon of the mask occurs due to its own weight. Moreover, it takes a considerable amount of time to align and adhere a large-area substrate and a large-area fine metal mask and separate the substrate from the fine metal mask again after deposition, resulting in a longer manufacturing time and reduced production efficiency. There was a problem.

The present invention is to solve a number of problems including the above problems, a deposition apparatus capable of forming a plurality of deposition layers while reducing the size of the apparatus, an organic light emitting display device manufacturing method using the same, and an organic light emitting display device It aims to provide. However, these problems are exemplary, and the scope of the present invention is not limited thereby.

In this embodiment, the first deposition source and the second deposition source arranged in the moving direction of the substrate so as to radiate the deposition material and sequentially approach the substrate when the substrate is moved, and the first deposition source and the second deposition source. A patterning slit sheet disposed opposite to and in which a plurality of patterning slits are disposed along one direction, and a deposition material emitted from the first deposition source and a deposition material emitted from the second deposition source are guided, and the first A deposition material emitted from an evaporation source passes through the patterning slit sheet and is deposited on the substrate to form a first layer, and the deposition material emitted from the second deposition source passes through the patterning slit sheet and is deposited on the first layer. When forming the second layer by depositing on the first deposition source and the deposition material sprayed from the second deposition source, the angle limiting part guides the paths of the deposition materials so as not to mix or mix with each other. It discloses a vapor deposition apparatus comprising.

In this embodiment, the first deposition source and the second deposition source may emit different deposition materials.

In the present embodiment, the angle limiting unit may guide the first layer to be deposited on the substrate and the second layer to be deposited directly on the first layer.

In this embodiment, the angle limiting unit may have a first opening corresponding to a nozzle portion of the first deposition source and a second opening corresponding to a nozzle portion of the second deposition source.

In this embodiment, the angle limiting unit may surround each of the first and second deposition sources.

In this embodiment, the angle limiting unit has a first angle limiting unit having a first opening corresponding to the nozzle unit of the first deposition source, and a second opening corresponding to the nozzle unit of the second deposition source. It may have a second angle limiting part spaced apart from the first angle limiting part.

In this embodiment, the first angle limiting unit and the second angle limiting unit may be movable in the first direction or in a direction opposite to the first direction, respectively.

In this embodiment, the first angle limiting portion may surround the first deposition source, and the second angle limiting portion may surround the second deposition source.

In this embodiment, the nozzle portion of the first deposition source has a plurality of deposition source nozzles arranged along a second direction crossing the first direction and parallel to the substrate fixed to the moving portion, and the second deposition source The nozzle portion of also has a plurality of evaporation source nozzles arranged along the second direction, and in a plane perpendicular to the second direction, the plurality of evaporation source nozzles of the center of the first opening and the nozzle portion of the first evaporation source The first straight line connecting them, the center of the second opening, and the second straight line connecting the plurality of deposition source nozzles of the nozzle portion of the second deposition source may not be parallel.

In this embodiment, the nozzle portion of the first deposition source has a plurality of deposition source nozzles arranged along the first direction, and the nozzle portion of the second deposition source is also a plurality of deposition sources arranged along the first direction. In a plane having nozzles, which crosses the first direction and is perpendicular to a second direction parallel to the substrate fixed to the moving part, a first opening connecting the center of the first opening and the center of the nozzle part of the first deposition source The first straight line and the second straight line connecting the center of the second opening and the center of the nozzle portion of the second deposition source may not be parallel.

In this embodiment, the nozzle portion of the first deposition source and the nozzle portion of the second deposition source may be integral.

According to an embodiment of the present invention made as described above, a deposition apparatus capable of forming a plurality of deposition layers while reducing the size of a device, a method of manufacturing an organic light emitting display device using the same, and an organic light emitting display device can be implemented. . Of course, the scope of the present invention is not limited by these effects.

1 is a plan view schematically showing a deposition apparatus according to an embodiment of the present invention.
FIG. 2 is a schematic side view of a deposition unit of the deposition apparatus of FIG. 1.
FIG. 3 is a perspective cross-sectional view schematically illustrating a part of a deposition part of the deposition apparatus of FIG. 1.
4 is a cross-sectional view schematically showing a part of a deposition unit of the deposition apparatus of FIG.
FIG. 5 is a side conceptual view schematically showing a deposition source and an angle limiter of a deposition assembly among deposition units of the deposition apparatus of FIG.
6 is a side conceptual view schematically showing an evaporation source and an angle limiter of a evaporation assembly among evaporation units of a deposition apparatus according to another embodiment of the present invention.
7 is a side conceptual view schematically showing an evaporation source and an angle limiter of a evaporation assembly among evaporation portions of a deposition apparatus according to another embodiment of the present invention.
8 is a side conceptual view schematically showing an evaporation source and an angle limiter of a evaporation assembly among evaporation units of a deposition apparatus according to another embodiment of the present invention.
9 is a perspective view schematically showing a part of a deposition assembly of a deposition apparatus according to another embodiment of the present invention.
10 is a cross-sectional view schematically showing an organic light emitting display device manufactured by using the vapor deposition apparatus of FIG. 1.

Hereinafter, exemplary embodiments of the present invention will be described in detail with reference to the accompanying drawings. However, the present invention is not limited to the embodiments disclosed below, but may be implemented in various different forms, and the following embodiments make the disclosure of the present invention complete, and the scope of the invention to those of ordinary skill in the art. It is provided to fully inform you. In addition, in the drawings for convenience of description, the size of the components may be exaggerated or reduced. For example, the size and thickness of each component shown in the drawings are arbitrarily shown for convenience of description, and the present invention is not necessarily limited to what is shown.

In the following embodiments, the x-axis, y-axis, and z-axis are not limited to three axes on a Cartesian coordinate system, and may be interpreted in a broad sense including them. For example, the x-axis, y-axis, and z-axis may be orthogonal to each other, but may refer to different directions that are not orthogonal to each other.

On the other hand, when various components such as layers, films, regions, and plates are said to be "on" other components, this is not only when other components are "directly on", but also when other components are interposed between them. Include.

1 is a plan view schematically showing a deposition apparatus according to an embodiment of the present invention, and FIG. 2 is a side view schematically showing a deposition unit of the deposition apparatus of FIG. 1.

1 and 2, the deposition apparatus according to an embodiment of the present invention includes a deposition unit 100, a loading unit 200, an unloading unit 300, a transfer unit 400, and a patterning slit sheet replacement unit ( 500). The transfer unit 400 includes a first transfer unit 410 capable of transferring the moving unit 430 to which the substrate (refer to FIG. 2, Fig. 3, etc.) is fixed to be detachable, and the substrate 2 is moved separately. A second transfer unit 420 capable of transferring the unit 430 in a reverse direction to the first direction may be included.

The loading unit 200 may include a first rack 212, an introduction chamber 214, a first inversion chamber 218, and a buffer chamber 219.

The first rack 212 is loaded with a plurality of substrates 2 before deposition. The introduction robot holds the substrate 2 from the first rack 212, and the second transfer unit 420 transfers the substrate 2 to the moving unit 430 located in the introduction chamber 214. The substrate 2 may be fixed to the moving part 430 with a clamp or the like, and the moving part 430 to which the substrate 2 is fixed is moved to the first inversion chamber 218. Of course, prior to fixing the substrate 2 to the moving unit 430, a process of aligning the substrate 2 with the moving unit 430 may be performed as necessary.

In the first inversion chamber 218 located adjacent to the introduction chamber 214, the first inversion robot reverses the moving part 430. As a result, the introduction robot puts the substrate 2 on the upper surface of the moving part 430, and the moving part 430 is removed with the surface opposite to the surface of the moving part 430 facing upward. It is transferred to the first reversing chamber 218, and as the first reversing robot reverses the first reversing chamber 218, the surface opposite to the surface of the substrate 2 in the direction of the moving part 430 faces downward. In this state, the first transfer unit 410 transfers the moving unit 430 to which the substrate 2 is fixed.

The configuration of the unloading unit 300 is configured opposite to that of the loading unit 200 described above. That is, the substrate 2 and the moving unit 430 that have passed through the deposition unit 100 are inverted in the second reversing chamber 328 and transferred to the carry-out chamber 324, and in the carry-out chamber 324 The substrate 2 is separated from the moving part 430 and the substrate 2 from which the take-out robot is separated is loaded on the second rack 322. The second transfer unit 420 transfers the moving unit 430 separated from the substrate 2 and returns it to the loading unit 200.

Of course, the present invention is not necessarily limited to such a configuration, and the substrate 2 may be fixed to the lower surface of the moving unit 430 and transferred as it is from the first time the substrate 2 is fixed to the moving unit 430. In this case, for example, the first reversing robot in the first reversing chamber 218 and the second reversing robot in the second reversing chamber 328 may be unnecessary. In addition, the first reversing robot in the first reversing chamber 218 and the second reversing robot in the second reversing chamber 328 do not reverse the first reversing chamber 218 or the second reversing chamber 328, Only the moving part 430 to which the substrate 2 is fixed may be inverted in the inversion chamber 218 or the second inversion chamber 328. In this case, it is possible to take a method in which the transfer unit in the reverse chamber rotates 180 degrees while the moving unit 430 is positioned on the transfer unit in the reverse chamber capable of transferring the moving unit 430 to which the substrate 2 is fixed. In this case, it can be understood that the transfer unit in the reversing chamber also serves as the first reversing robot or the second reversing robot. Here, the transfer part in the reverse chamber may be a part of the first transfer part or a part of the second transfer part.

The deposition unit 100 includes a chamber 101 as shown in FIGS. 1 and 2, and a plurality of deposition assemblies 100-1, 100-2 ... 100 -n) can be placed. In FIG. 1, 11 deposition assemblies of the first deposition assembly 100-1 to the 11th deposition assembly 100-11 are disposed in the chamber 101 in the chamber 101, but the number of deposition materials is And may vary depending on the deposition conditions. The chamber 101 may be maintained in a vacuum or close to a vacuum state while deposition is in progress.

The first transfer unit 410 uses the moving unit 430 to which the substrate 2 is fixed to at least the deposition unit 100, preferably the loading unit 200, the deposition unit 100, and the unloading unit 300. Then, the second transfer unit 420 transfers the moving unit 430 separated from the substrate 2 in the unloading unit 300 to the loading unit 200. Accordingly, the moving unit 430 may be cyclically transferred by the first transfer unit 410 and the second transfer unit 420.

The first transfer unit 410 may be disposed to pass through the chamber 101 when passing through the deposition unit 100, and the second transfer unit 420 transfers the moving unit 430 from which the substrate 2 is separated. Can be placed.

In this case, the first transfer unit 410 and the second transfer unit 420 may be arranged vertically. Through this, the moving part 430 which passes through the first transfer part 410 and allows deposition on the substrate 2 is separated from the substrate 2 by the unloading part 300, and then the first transfer part 410 Since it is formed so as to be returned to the loading unit 200 through the second transfer unit 420 disposed below, an effect of improving the efficiency of space utilization may be obtained. Of course, unlike illustrated, the second transfer unit 420 may be located above the first transfer unit 410.

Meanwhile, as shown in FIG. 1, the deposition unit 100 may include a deposition source replacement unit 190 disposed on one side of each deposition assembly 100-1. Although not shown in detail in the drawings, the evaporation source replacement unit 190 may be formed in a cassette format and may be formed to be drawn out from each evaporation assembly 100-1. Through this, it is possible to facilitate replacement of the evaporation source (see 110 in FIG. 3) of the evaporation assembly 100-1.

In addition, in FIG. 1, two deposition apparatuses including a loading unit 200, a deposition unit 100, an unloading unit 300, and a transfer unit 400 are arranged side by side. In this case, the patterning slit sheet replacement unit 500 may be disposed between the two deposition apparatuses. That is, by allowing the two deposition devices to use the patterning slit sheet replacement unit 500 in common, the efficiency of space utilization can be improved compared to the case where each of the deposition devices separately includes the patterning slit sheet replacement unit 500. .

3 is a perspective cross-sectional view schematically showing a part of the evaporation unit of the evaporation apparatus of FIG. 1, and FIG. 4 is a cross-sectional view schematically showing a portion of the evaporation unit of the evaporation apparatus of FIG. 3 and 4, the deposition unit 100 of the deposition apparatus according to the present embodiment includes a chamber 101 and one or more deposition assemblies 100-1.

The chamber 101 is formed in the shape of a hollow box, and accommodates one or more deposition assemblies 100-1 therein. Of course, as shown, the transfer unit 400 may also be accommodated in the chamber 101, and may extend inside and outside the chamber 101 in some cases.

The lower housing 103 and the upper housing 104 may be accommodated in the chamber 101. Specifically, the lower housing 103 may be disposed on a foot 102 that may be fixed to the ground, and the upper housing 104 may be disposed on the lower housing 103. At this time, the connection between the lower housing 103 and the chamber 101 is sealed so that the inside of the chamber 101 is completely blocked from the outside. In this way, the lower housing 103 and the upper housing 104 are arranged on the foot 102 fixed to the ground, so that even if the chamber 101 repeats contraction/expansion, the lower housing 103 and the upper housing 104 May maintain a fixed position, and thus, the lower housing 103 and the upper housing 104 may serve as a kind of reference frame in the deposition unit 100.

The deposition assembly 100-1 and the first transfer unit 410 of the transfer unit 400 are disposed inside the upper housing 104, and the second transfer unit 420 of the transfer unit 400 is disposed inside the lower housing 103. Can be placed. The moving unit 430 may be circulated and transferred by the first transfer unit 410 and the second transfer unit 420 so that deposition is continuously performed on the substrate 2 fixed to the moving unit 430. The moving unit 430 capable of circulating transport as described above may include a carrier 431 and an electrostatic chuck 432 coupled thereto.

The carrier 431 may include a main body 431a, a linear motor system magnet 431b, a contactless power supply module 431c, a power supply 431d, and a guide groove 431e. . Of course, if necessary, the carrier 431 may further include a cam follower or the like.

The body portion 431a forms a base portion of the carrier 431 and may be formed of a magnetic material such as iron. The body part 431a of the carrier 431 is a carrier with respect to the guide part 412 of the first transfer part 410 due to attraction or repulsion with the magnetic levitation bearing (not shown) provided in the first transfer part 410. (431) can be separated by a certain degree. In addition, guide grooves 431e may be formed on both sides of the body portion 431a. The guide protrusion 412d of the guide portion 412 of the first transfer portion 410 or the roller guide 422 of the second transfer portion 420 may be accommodated in the guide groove 431e.

Further, the main body 431a may include a magnetic rail 431b disposed along a center line in the traveling direction (Y-axis direction). The magnetic rail 431b of the main body part 431a may constitute a linear motor together with the coil 411 of the first transfer part 410, and the carrier 431, that is, the moving part 430, by such a linear motor Can be transferred in the A direction. Accordingly, even if there is no separate power to the moving unit 430, the moving unit 430 can be transferred by the current applied to the coil 411 of the first transfer unit 410. To this end, a plurality of coils 411 may be disposed in the chamber 101 at regular intervals (along the Y-axis direction). Since the coil 411 is disposed in an atmosphere box, it may be installed in an atmospheric state.

Meanwhile, the main body 431a may include a CPS module 431c and a power supply 431d disposed on one side and the other side of the magnetic rail 431b. The power supply unit 431d has a type of rechargeable battery for providing power so that the electrostatic chuck 432 can chuck the substrate 2 and maintain it, and the CPS module 431c charges the power supply unit 431d. It is a wireless charging module to charge the battery. A charging track 423 provided in the second transfer unit 420 is connected to an inverter (not shown), and when the second transfer unit 420 transfers the carrier 431, the charging track ( A magnetic field is formed between 423 and the CPS module 431c to supply power to the CPS module 431c, thereby charging the power supply unit 431d.

The electrostatic chuck 432 may include a body formed of ceramic and an electrode buried therein to which power is applied. In the electrostatic chuck 432, a high voltage is applied from the power source 431d in the body portion 431a of the carrier 431 to the electrode embedded in the body, so that the substrate 2 may be attached to the surface of the body.

The first transfer unit 410 has such a configuration and can transfer the moving unit 430 to which the substrate 2 is fixed in the first direction (+Y direction). The first transfer part 410 has the coil 411 and the guide part 412 as described above, and may further include a magnetic levitation bearing or a gap sensor.

The coil 411 and the guide part 412 may be disposed on the inner surface of the upper housing 104, respectively, for example, the coil 411 is disposed on the upper inner surface of the upper housing 104, and the guide part 412 May be disposed on both inner surfaces of the upper housing 104.

As described above, the coil 411 may form a linear motor together with the magnetic rail 431b of the main body 431a of the moving part 430 so that the moving part 430 moves. The guide part 412 may guide the moving part 430 to be transferred in the first direction (Y-axis direction) when the moving part 430 moves. The guide part 412 may be disposed to pass through the deposition part 100.

Specifically, the guide part 412 may accommodate both sides of the carrier 431 of the moving part 430 to guide the carrier 431 to move along the direction A of FIG. 3. To this end, the guide part 412 includes a first receiving part 412a disposed below the carrier 431, a second receiving part 412b disposed above the carrier 431, and a first receiving part 412a. ) And the second receiving part 412b may have a connection part 412c. A receiving groove may be formed by the first receiving part 412a, the second receiving part 412b, and the connecting part 412c, and the guide part 412 may have a guide protrusion 412d in the receiving groove.

Magnetic levitation bearings (not shown) may be disposed in the connection part 412c of the guide part 412 so as to correspond to both sides of the carrier 431. The magnetic levitation bearing generates a gap between the carrier 431 and the guide part 412 so that when the carrier 431 is transferred, it is not in contact with the guide part 412 and is transferred along the guide part 412 in a non-contact manner. can do. The magnetic levitation bearing may also be disposed on the second receiving part 412b of the guide part 412 so as to be located above the carrier 431. In this case, the magnetic levitation bearing has the carrier 431 as the first receiving part 412a. B. It is possible to move along the guide part 412 without contacting the second receiving part 412b and maintaining a certain distance therebetween. In order to check the distance between the carrier 431 and the guide part 412, the guide part 412 is attached to the first receiving part 412a and/or the connection part 412c so as to correspond to the lower part of the carrier 431. A gap sensor (not shown) may be provided. The magnetic force of the magnetic levitation bearing is changed according to the value measured by the gap sensor, so that the distance between the carrier 431 and the guide part 412 can be adjusted in real time. That is, the carrier 431 can be precisely transferred by feedback control using a magnetic levitation bearing and a gap sensor.

The second transfer unit 420 performs a role of returning the moving unit 430 from which the substrate 2 is separated from the unloading unit 300 to the loading unit 200 after deposition is completed while passing through the deposition unit 100 do. The second transfer unit 420 may include a coil 421 disposed on the lower housing 103, a roller guide 422, and a charging track 423 as described above. For example, the coil 421 and the charging track 423 may be disposed on the upper inner surface of the lower housing 103, and the roller guide 422 may be disposed on both inner surfaces of the lower housing 103. Here, although not shown in the drawings, the coil 421 may be disposed in the standby box similar to the coil 411 of the first transfer unit 410.

Like the coil 411, the coil 421 may constitute a linear motor together with the magnetic rail 431b of the carrier 431 of the moving part 430. By such a linear motor, the moving part 430 may be transferred in a direction opposite to the first direction (+Y direction) (-Y direction).

The roller guide 422 serves to guide the carrier 431 in a direction opposite to the first direction. The roller guide 422 may be disposed to penetrate the deposition unit 100. The roller guide 422 supports cam followers (not shown) disposed on both sides of the carrier 431 of the moving part 430, so that the moving part 430 moves in a direction opposite to the first direction (+Y direction) (- Y direction) can play a role of guiding to be transferred.

Since the second transfer unit 420 serves to transfer the moving unit 430 separated from the substrate 2 in the direction of the loading unit 200, the substrate 2 is fixed so that deposition is performed on the substrate 2 Compared to the first transfer unit 410 that transfers the moved unit 430, the positional accuracy of the transfer unit 430 is not significantly required. Therefore, a magnetic levitation function is applied to the first transfer unit 410 that requires high positional accuracy of the transfer unit 430 to secure high positional accuracy of the moving unit 430, and the second transfer unit 420 has a conventional By applying the roller method, it is possible to simplify the configuration of the deposition apparatus and reduce the manufacturing cost. Of course, if necessary, it will be possible to apply the magnetic levitation function to the second transfer unit 420 as well.

The deposition assembly 100-1 is spaced apart from the substrate 2 by a predetermined amount while the first transfer unit 410 transfers the substrate 2 fixed to the moving unit 430 in the first direction (+Y direction). A material is deposited on the substrate 2. Hereinafter, a detailed configuration of the deposition assembly 100-1 will be described.

Each deposition assembly 100-1 is a deposition source (110a, 110b), a deposition source nozzle (120a, 120b), patterning slit sheet 130, an angle limiting part (not shown, see 145 in FIG. 5, etc.), blocking A member 140, a first stage 150, a second stage 160, a camera 170, a sensor 180, and the like may be included. Here, most of the configurations shown in FIGS. 3 and 4 are preferably disposed within the chamber 101 in which an appropriate degree of vacuum is maintained. This is to secure the straightness of the deposition material.

The deposition sources 110a and 110b may emit a deposition material. The deposition assembly 100-1 of the deposition apparatus according to the present embodiment has a first direction (+Y direction) so that the first transfer unit 410 approaches in sequence when transferring the substrate 2 fixed to the moving unit 430. ) And a first deposition source (110a) and a second deposition source (110b) arranged. Of course, unlike shown, more than two evaporation sources may be disposed. These evaporation sources 110a and 110b are disposed below and emit evaporation material in the direction in which the substrate 2 is located (eg, upward in the +Z direction) as the evaporation material 115 stored therein is sublimated/evaporated. can do. Specifically, the evaporation sources 110a and 110b evaporate the crucible 111 filled with the deposition material 115 therein, and the crucible 111 by heating the crucible 111 to evaporate the deposition material 115 filled in the crucible 111 It may include a heater 112 for.

In the direction of the first transfer unit 410 (+Z direction) of the evaporation sources 110a and 110b, that is, the direction of the substrate 2, the evaporation source nozzle portions 120a and 120b in which the evaporation source nozzles 121 are formed are disposed. Specifically, the first deposition source nozzle unit 120a is in the direction of the first transfer unit 410 of the first deposition source 110a, and the second deposition source is in the direction of the first transfer unit 410 of the second deposition source 110b. The nozzle part 120b is disposed. The drawing shows a case where the evaporation source nozzle units 120a and 120b have a plurality of evaporation source nozzles 121.

In the drawings, the first deposition source nozzle unit 120a and the second deposition source nozzle unit 120b are shown to be separated from each other, but the present invention is not limited thereto. For example, the first deposition source (110a) and the second deposition source (110b) are mounted in a container with an open top, and the deposition source nozzle corresponding to the first deposition source (110a) and the second deposition source ( One evaporation source nozzle unit including a evaporation source nozzle corresponding to 110b) may be positioned. That is, the first deposition source nozzle unit 120a and the second deposition source nozzle unit 120b may be integrated. Hereinafter, a separate case will be described for convenience.

The patterning slit sheet 130 may be disposed to face the evaporation source nozzle units 120a and 120b, and may have a structure in which a plurality of patterning slits are formed along one direction (X-axis direction). This patterning slit sheet 130 is positioned between the deposition sources 110a and 110b and the substrate 2. The deposition material 115 vaporized in the deposition sources 110a and 110b may pass through the deposition source nozzle units 120a and 120b and the patterning slit sheet 130 to be deposited on the substrate 2 as a deposition target. Of course, in the case of forming a uniform deposition layer on the entire surface of the substrate 2, the patterning slit sheet 130 may have an opening extending along the X axis rather than a plurality of patterning slits.

The patterning slit sheet 130 may be manufactured through etching, which is used in a method of manufacturing a conventional fine metal mask (FMM), particularly a stripe type mask. The patterning slit sheet 130 may be disposed to be spaced apart from the evaporation sources 110a and 110b (and the evaporation source nozzle portions 120a and 120b coupled thereto) by a certain degree.

In order for the deposition material 115 emitted from the deposition sources 110a and 110b to pass through the deposition source nozzles 120a and 120b and the patterning slit sheet 130 to be deposited in a desired pattern on the substrate 2, basically, the chamber (Not shown) It is necessary to maintain a high vacuum state inside the same/similar to the case of FMM deposition. In addition, the temperature of the patterning slit sheet 130 needs to be sufficiently lower than the temperature of the evaporation sources 110a and 110b (about 100° or less). This is because the problem of thermal expansion of the patterning slit sheet 130 due to the temperature can be minimized only when the temperature of the patterning slit sheet 130 is sufficiently low. That is, when the temperature of the patterning slit sheet 130 increases, the size or position of the patterning slit of the patterning slit sheet 130 is deformed due to thermal expansion, so that it may be deposited in a pattern different from a preset pattern on the substrate 2. Because there is.

In this chamber 101, a substrate 2, which is an evaporation target, is disposed. The substrate 2 may be a substrate for a flat panel display device, and may be a large-area substrate such as mother glass capable of forming a plurality of flat panel display devices.

As described above, in the case of the conventional deposition method using FMM, the area of the FMM must be equal to the area of the substrate. Therefore, as the substrate size increases, the FMM must also be enlarged, which makes it difficult to fabricate the FMM, and there is a problem in that it is not possible to form an intermediate layer of a preset accurate pattern because the mask is sagging due to the self weight of the FMM. .

However, in the case of the deposition apparatus according to the present embodiment, deposition is performed while the deposition assembly 100-1 and the substrate 2 move relative to each other. Specifically, while the first transfer unit 410 transfers the substrate 2 fixed to the moving unit 430 in the first direction (+Y direction), the deposition assembly 100-separated by a predetermined distance from the substrate 2 1) deposits a material on the substrate 2. In other words, while the substrate 2 disposed to face the deposition assembly 100-1 is transferred in the direction of arrow A in FIG. 3, deposition is performed in a scanning method. In the drawing, the substrate 2 is shown to be deposited while moving in the +Y direction in the chamber 101, but the present invention is not limited thereto. For example, the substrate 2 may be modified in various ways, such as the position of the substrate 2 is fixed and the deposition assembly 100-1 may perform deposition while moving in the -Y direction.

Therefore, in the case of the deposition apparatus according to the present embodiment, the size of the patterning slit sheet 130 can be made much smaller than that of the conventional FMM. That is, in the case of the deposition apparatus according to the present embodiment, since the substrate 2 is continuously deposited while moving along the Y-axis direction, that is, in a scanning method, the Y-axis direction of the patterning slit sheet 130 Even if the length of is much smaller than the length of the substrate 2 in the Y-axis direction, deposition can be sufficiently performed over most of the entire surface of the substrate 2.

As described above, since the size of the patterning slit sheet 130 can be made much smaller than the size of the conventional FMM, the manufacture of the patterning slit sheet 130 is very easy. That is, in all processes such as etching when making the patterning slit sheet 130, precision tensioning and welding thereafter, moving and cleaning, the small-sized patterning slit sheet 130 is a process related to a large-area FMM. It is advantageous compared to This advantage increases as the size of the display device to be manufactured increases.

Meanwhile, as described above, while the first transfer unit 410 transfers the substrate 2 fixed to the moving unit 430 in the first direction (+Y direction), the substrate 2 ) And a predetermined distance to deposit a material on the substrate 2. This means that the patterning slit sheet 130 is disposed to be spaced apart from the substrate 2 by a certain degree. In the case of the conventional deposition apparatus using the FMM, there was a problem that defects occur due to contact between the FMM and the substrate, but the deposition apparatus according to this embodiment can effectively prevent such a problem. In addition, in the process, the substrate and the mask are in close contact. Since such time becomes unnecessary, the manufacturing speed can be dramatically increased.

The upper housing 104 may have evaporation sources 110a and 110b and seating portions 104-1 protruding on both sides of the evaporation source nozzle portions 120a and 120b as shown, such a seating portion 104-1 ), the first stage 150 and the second stage 160 may be disposed, and the patterning slit sheet 130 may be disposed on the second stage 160.

The first stage 150 may adjust the position of the patterning slit sheet 130 in the X-axis direction and the Y-axis direction. That is, the first stage 150 may include a plurality of actuators to move the position of the patterning slit sheet 130 with respect to the upper housing 104 in the X-axis and Y-axis directions. The second stage 160 may adjust the position of the patterning slit sheet 130 in the Z-axis direction. For example, the second stage 160 may include an actuator to adjust the position of the patterning slit sheet 130 with respect to the first stage 150, that is, with respect to the upper housing 104 along the Z-axis direction.

In this way, by adjusting the position of the patterning slit sheet 130 with respect to the substrate 2 through the first stage 150 and the second stage 160, alignment between the substrate 2 and the patterning slit sheet 130, In particular, real-time alignment can be achieved.

In addition, the upper housing 104, the first stage 150, and the second stage 160 simultaneously guide the movement path of the deposition material so that the deposition material discharged through the deposition source nozzle 121 is not dispersed. I can. That is, the path of the deposition material is limited by the upper housing 104, the first stage 150, and the second stage 160, so that movement of the deposition material in the X-axis direction may be limited.

Meanwhile, the deposition assembly 100-1 may further include a camera 170 and a sensor 180 for alignment. The sensor 180 may be a confocal sensor. The camera 170 checks the first mark (not shown) formed on the patterning slit sheet 130 and the second mark (not shown) formed on the substrate 2 in real time, so that the patterning slit sheet 130 and the substrate 2 Data for accurately aligning in the XY plane can be generated, and the sensor 180 can generate data on the gap between the patterning slit sheet 130 and the substrate 2 to be maintained at an appropriate gap. .

In this way, using the camera 170 and the sensor 180, it is possible to measure the distance between the substrate 2 and the patterning slit sheet 130 in real time, and thus the substrate 2 and the patterning slit sheet 130 in real time. By making it possible to align the pattern, it is possible to further improve the positional accuracy of the pattern.

Meanwhile, a blocking member 140 may be disposed between the patterning slit sheet 130 and the deposition sources 110a and 110b to prevent material from being deposited in the non-filmed region of the substrate 2. Although not shown in detail in the drawings, the blocking member 140 may be composed of two plates adjacent to each other. Since the non-filmed region of the substrate 2 is covered by the blocking member 140, it is possible to effectively prevent material from being deposited on the non-filming region of the substrate 2 without a separate structure.

FIG. 5 is a side conceptual view schematically showing the evaporation sources 110a and 110b and the angle limiting portion 145 of the evaporation assembly 100-1 among evaporation units of the evaporation apparatus of FIG. 1. As shown in FIG. 5, the angle limiting unit 145 may be disposed in the first transfer unit 410 direction (+Z direction) of the first deposition source 110a and the second deposition source 110b. This angle limiting unit 145 is discharged from the first deposition source 110a through the first deposition source nozzle unit 120a to guide the path of the deposition material toward the patterning slit sheet 130, that is, the substrate 2. I can. Of course, the angle limiting unit 145 is discharged from the second deposition source 110b through the second deposition source nozzle unit 120b to guide the path of the deposition material toward the patterning slit sheet 130, that is, the substrate 2 I can.

On the substrate 2 fixed to the moving part 430 by the guide of the angle limiting part 145, a first layer including a deposition material emitted from the first deposition source 110a, and a first deposition At least one of the second layer including the deposition material emitted from the source 110a, the deposition material emitted from the second deposition source 110b, and the third layer including the deposition material emitted from the second deposition source 110b It is possible to have two layers deposited.

The angle limiting unit 145 guiding the path of the deposition material may be implemented in various ways. For example, as shown, the angle limiting unit 145 includes a first deposition source 110a and a second deposition source 110b. It can have a shape surrounding each. In addition, the angle limiting unit 145 includes an opening 145a' corresponding to the evaporation source nozzle of the first evaporation source nozzle unit 120a and the opening 145b' corresponding to the evaporation source nozzle of the second evaporation source nozzle unit 120b. ), but the positional relationship between the evaporation source nozzle and the opening 145a' of the first evaporation source nozzle unit 120a and the positional relationship between the evaporation source nozzle and the opening 145b' of the second deposition source nozzle unit 120b are By making them different, it is possible to guide the path of the deposition material.

As shown, the plurality of evaporation source nozzles 121 of the first evaporation source nozzle unit 120a cross the first direction (+Y direction) and are parallel to the substrate 2 fixed to the moving unit 430. It is arranged along the second direction (for example, the X-axis direction), and a plurality of deposition source nozzles 121 of the second deposition source nozzle unit 120b may also be arranged along the second direction. In this case, in the plane (YZ plane) perpendicular to the second direction (X-axis direction), the center of the first opening 145a' and the plurality of deposition source nozzles 121 of the first deposition source nozzle portion 120a The center of the first straight line (ℓa) and the second opening (145b') connecting them and the second straight line (ℓb) connecting the plurality of deposition source nozzles 121 of the second deposition source nozzle unit 120b are not parallel. Can be avoided.

Specifically, a first straight line (ℓa) centering on a plane (XY plane) perpendicular to the first direction (+Y direction) is the substrate from the plurality of deposition source nozzles 121 of the first deposition source nozzle unit 120a. (2) It can be tilted in the opposite direction (-Y direction) of the first direction (+Y direction) as the direction goes, and the second direction is centered on a plane (XY plane) perpendicular to the first direction (+Y direction). The straight line ℓb may be inclined in the first direction (+Y direction) toward the substrate 2 from the plurality of deposition source nozzles 121 of the second deposition source nozzle unit 120b.

When the angle limiting unit 145 has such a shape and guides the deposition material emitted from the first deposition source 110a and the deposition material emitted from the second deposition source 110b as shown in FIG. The deposition material emitted from the first deposition source 110a and the deposition material emitted from the second deposition source 110b do not mix with each other until they reach the substrate 2.

In such a situation, when the substrate 20 is fixed to the moving unit 430 and transferred in the first direction (+Y direction) by the first transfer unit 410, the first direction (+Y direction) of the substrate 2 The portion first passes over the first deposition source 110a. As the substrate 2 passes over the first deposition source 110a, a deposition material emitted from the first deposition source 110a is deposited on a portion of the substrate 2 in the first direction (+Y direction).

Then, when the first direction (+Y direction) portion of the substrate 2 passes over the second deposition source 110b, the opposite direction (-Y direction) of the first direction (+Y direction) of the substrate 2 In the portion 2a, the deposition material positioned above the first deposition source 110a and emitted from the first deposition source 110a is deposited, while the first direction (+Y direction) portion 2b of the substrate 2 The deposition material emitted from the second deposition source 110b also starts to be deposited. In this case, in the first direction (+Y direction) portion 2b of the substrate 2, on the layer of the deposition material emitted from the already deposited first deposition source 110a, that is, on the first layer, the second deposition source ( A third layer, which is a layer of the deposition material released in 110b), is formed. As described above, while the substrate 2 passes through one deposition assembly 100-1 including the first deposition source 110a and the second deposition source 110b, the first layer and the third layer are formed on the substrate 2. Layers can be formed. When the first deposition source 110a and the second deposition source 110b emit different deposition materials, a first layer and a third layer formed of different materials may be formed on the substrate 2.

If the angle limiting part 145 does not exist, even if one deposition assembly 100-1 has a plurality of deposition sources 110a and 110b, it is transferred from the top of one deposition assembly 100-1. On the substrate 2, only one layer in which the deposition material emitted from the plurality of deposition sources 110a and 110b is mixed is inevitably formed. Accordingly, in the case of forming a plurality of multilayer films on the substrate 2, the deposition apparatus is provided with a plurality of mutually spaced deposition assemblies corresponding to the number of layers of the multilayer film (see 100-1 to 100-11 in FIG. 2). must do it.

However, in the deposition apparatus according to the present embodiment, since the angle limiting portion 145 is present, a multilayer film may be formed on the substrate 2 in one deposition assembly 100-1. Through this, the number of deposition assemblies that the deposition apparatus must have can be reduced, and this can be a basis for reducing the size of the deposition apparatus and drastically reducing its manufacturing cost.

In FIG. 5, as described above, the angle limiting unit 145 includes the first layer including the deposition material emitted from the first deposition source 110a and not including the deposition material emitted from the second deposition source 110b. The third is deposited on the substrate 2 fixed to the moving part 430 and contains the deposition material emitted from the second deposition source 110b and does not contain the deposition material emitted from the first deposition source 110a. It is shown as guiding the deposition material so that the layer is deposited directly on the first layer. Of course, the present invention is not limited thereto, and the angle limiting unit 145 may control the angle of the deposition material in various ways.

For example, as shown in FIG. 6, which is a schematic side view of an evaporation source and an angle limiting portion of the evaporation assembly among evaporation units of the evaporation apparatus according to another embodiment of the present invention, In the in-plane (YZ plane), a first straight line (ℓa) and a second opening connecting the center of the first opening 145a' and the plurality of evaporation source nozzles 121 of the first evaporation source nozzle unit 120a The center of (145b') and the second straight line (ℓb) connecting the plurality of evaporation source nozzles 121 of the second evaporation source nozzle unit 120b may not be parallel. However, by reducing the angle formed by the first straight line (ℓa) and the second straight line (ℓb) than the case shown in Figure 5, the deposition material emitted from the first deposition source (110a) and the second deposition source (110b) The deposited material may be deposited in a mixed state in the corresponding portion 2c between the first deposition source 110a and the second deposition source 110b on the substrate 2.

That is, when the substrate 2 passes over the first deposition source 110a and the second deposition source 110b in the state shown in FIG. 6, the first deposition source 110a on the substrate 2 A first layer including the released deposition material, and a second layer positioned on the first layer and including the deposition material emitted from the first deposition source 110a and the deposition material emitted from the second deposition source 110b And, a multilayer film including a third layer disposed on the second layer and including the deposition material emitted from the second deposition source 110b may be formed. In this case, the thickness of the first layer, the second layer, and the third layer may be adjusted by adjusting the angle formed by the first straight line ℓa and the second straight line ℓb.

Until now, a case where one deposition assembly 100-1 includes a first deposition source 110a and a second deposition source 110b, that is, a case of having two deposition sources, has been described. It is not limited.

For example, as shown in FIG. 7, which is a schematic side view of a deposition source and an angle limiter of the deposition assembly among the deposition units of the deposition apparatus according to another embodiment of the present invention, one deposition assembly 100-1 In addition to the first deposition source (110a) and the second deposition source (110b) may have a third deposition source (110c). In this case, the angle limiting unit 145 may also have a third opening 145c' corresponding to the third deposition source 110c in addition to the first opening 145a' and the second opening 145b'.

In FIG. 7, while the substrate 2 is transferred in the first direction (+Y direction), the layer having the deposition material emitted from the third deposition source 110c, the deposition material emitted from the third deposition source 110c, and An exemplary case in which a layer in which a deposition material emitted from the first deposition source 110a is mixed and a layer having a deposition material emitted from the second deposition source 110b are sequentially formed is illustrated. In FIG. 7, the first straight line (ℓa) and the second straight line (ℓb) are still not parallel, so that the first deposition source 110a and the second deposition source are disposed adjacent to each other in one deposition assembly 100-1. It is shown that a multi-layered film can be deposited on the substrate 2 by means of the circle 110b.

8 is a side conceptual view schematically showing an evaporation source and an angle limiter of a evaporation assembly among evaporation units of a deposition apparatus according to another embodiment of the present invention.

As shown in Fig. 8, the angle limiting unit includes a first angle limiting unit 145a having a first opening 145a' corresponding to the first deposition source nozzle unit 120a, and a second deposition source nozzle unit ( It may have a second opening 145b' corresponding to 120b) and a second angle limiting part 145b spaced apart from the first angle limiting part 145a. The first angle limiting unit 145a and the second angle limiting unit 145b may be movable in a first direction (+Y direction) or opposite direction (-Y direction), respectively. Through this, the angle formed by the first straight line (ℓa) and the second straight line (ℓb) can be freely adjusted, so that the thickness of the multilayer film deposited on the substrate 2 or the number of multilayer films (e.g., 2 or 3 layers) can be easily adjusted. I can. In this case, the first angle limiting unit 145a may have a structure surrounding the first deposition source 110a, and the second angle limiting unit 145b may have a structure surrounding the second deposition source 110b.

9 is a perspective view schematically showing a part of a deposition assembly of a deposition apparatus according to another embodiment of the present invention. In the evaporation apparatus according to the above-described embodiments, the evaporation source nozzle portions 120a and 120b of the evaporation assembly cross the first direction (+Y direction) and are parallel to the substrate 2 fixed to the moving portion 430. It has been described as having a plurality of evaporation source nozzles 121 arranged in the second direction (eg, the X-axis direction). However, in the case of the evaporation apparatus according to the present embodiment, a plurality of evaporation source nozzles 921 of the evaporation source nozzle unit 920 are arranged along the first direction (+Y direction).

In manufacturing an organic light emitting display device, when forming an intermediate layer including a light emitting layer, a common layer may be formed over the entire display area, or a pattern located only in a predetermined area among the display areas You may need to form a layer.

In the case of forming the common layer, as described above, the evaporation source nozzle portions 120a and 120b of the evaporation assembly cross the first direction (+Y direction) and are parallel to the substrate 2 fixed to the moving portion 430. By having a plurality of evaporation source nozzles 121 arranged in one second direction (eg, the X-axis direction), it is possible to improve the thickness uniformity of the formed common layer. On the other hand, in the case of forming the pattern layer, as shown in FIG. 9, the evaporation source nozzle unit 920 of the evaporation assembly has a plurality of evaporation source nozzles 921 arranged along the first direction (+Y direction), On a plane (ZX plane) perpendicular to the first direction (+Y direction), the second direction (eg, X-axis) crosses the first direction (+Y direction) and parallel to the substrate 2 fixed to the moving part 430 Direction), one evaporation source nozzle 921 may be positioned. Accordingly, when the pattern layer is formed, the occurrence of a shadow can be greatly reduced.

In FIG. 9, only one evaporation source and one evaporation source nozzle part are shown, but the first deposition source and the second deposition source are sequentially arranged in the first direction (+Y direction), and the first deposition source on the first deposition source is The plurality of evaporation source nozzles of the evaporation source nozzle unit are arranged along the first direction (+Y direction), and the plurality of evaporation source nozzles of the second evaporation source nozzle unit may be arranged along the first direction (+Y direction). have. In this case, in a plane (eg, YZ plane) perpendicular to the second direction (eg, the X-axis direction) crossing the first direction (+Y direction) and parallel to the substrate 2 fixed to the moving part 430, The first straight line connecting the center of the first opening of the angle limiting part and the center of the first deposition source nozzle part, and the second straight line connecting the center of the second opening of the angle limiting part and the center of the second deposition source nozzle part are not parallel. By doing so, while the substrate 2 passes through a single deposition assembly, a multilayer film rather than a single film can be deposited on the substrate 2.

Meanwhile, the patterning slit sheet 130 as described above may specifically have a shape as illustrated in FIG. 9. That is, as illustrated in FIG. 9, the patterning slit sheet 130 may have a frame 135 that is substantially the same as a window frame and a sheet 133 coupled thereto by a method such as welding. In the sheet 133, for example, a plurality of patterning slits 131 may be formed along the X-axis direction. The deposition material located in the crucible 911 of the evaporation source 910 is evaporated by the heater 912 and is discharged through the evaporation source nozzle 921 of the evaporation source nozzle unit 920 to pattern the patterning slit sheet 130 It may pass through 131 and be seated on the substrate 2. In this case, the evaporation source 910 and/or the evaporation source nozzle unit 920 and the patterning slit sheet 130 may be coupled by the connection member 137.

Until now, only the deposition apparatus has been mainly described, but the present invention is not limited thereto. For example, a method of manufacturing an organic light-emitting display device using such a vapor deposition device will also fall within the scope of the present invention.

In the case of a method of manufacturing an organic light emitting display device according to another embodiment of the present invention, the substrate 2 is fixed to the moving unit 430 and moved to the first transfer unit 410 installed to penetrate the chamber 101. After the step of transferring the part 430 into the chamber 101, the first transfer part 410 in a state where the deposition assembly 100-1 and the substrate 2 disposed in the chamber 101 are spaced apart by a predetermined degree. While transferring the furnace substrate 2 relative to the deposition assembly 100-1, the deposition material emitted from the deposition assembly 100-1 may be deposited on the substrate 2 to form a layer. . Thereafter, through the step of returning the moving unit 430 separated from the substrate 2 to the second transfer unit 420 installed to pass through the chamber 101, the moving unit 430 is connected to the first transfer unit 410 2 It can be circulated by the transfer unit 420.

In such a method of manufacturing an organic light emitting display device, the deposition assembly may have the configuration of the deposition assembly described in the deposition apparatuses according to the above-described embodiments. In this case, the step of forming the layer includes a deposition material released from the first deposition source 110a on the substrate 2 fixed to the moving part 430 using the angle limiting part 145. The first layer, the second layer including the deposition material emitted from the first deposition source 110a and the deposition material emitted from the second deposition source 110b, and the deposition material emitted from the second deposition source 110b It may be a step of forming a layer such that at least two of the included third layers are deposited. Of course, in this case, the step of forming the layer may be a step of forming a layer while allowing different deposition materials to be emitted from the first deposition source 110a and the second deposition source 110b.

Meanwhile, the step of forming the layer includes, for example, a deposition material released from the first deposition source 110a using the angle limiting unit 145, as shown in FIG. 5, and the second deposition source 110b A first layer that does not contain the deposition material emitted from is deposited on the substrate 2 fixed to the moving part 430, and contains the deposition material emitted from the second deposition source 110b, and includes a first deposition source ( It may be a step of forming a layer such that a third layer not including the deposition material emitted in 110a) is directly deposited on the first layer. Through such a method, a multilayered film can be formed on the substrate 2 while using a small-sized evaporation apparatus, so that an organic light emitting display device can be efficiently manufactured.

10 is a cross-sectional view schematically showing an organic light emitting display device according to another embodiment of the present invention, manufactured using a deposition apparatus such as FIG. 1.

Referring to FIG. 10, various components of the organic light emitting display device are formed on a substrate 50. Here, the substrate 50 may be the substrate 2 itself mentioned in FIG. 3 or the like, or may be a part of the substrate 2 cut. The substrate 50 may be formed of a transparent material, such as a glass material, a plastic material, or a metal material.

On the substrate 50, a common layer such as the buffer layer 51, the gate insulating film 53, and the interlayer insulating film 55 may be formed on the entire surface of the substrate 50, and the channel region 52a and the source contact region The patterned semiconductor layer 52 including the 52b and the drain contact region 52c may be formed, and together with the patterned semiconductor layer, the gate electrode 54, which is a component of the thin film transistor (TFT), An electrode 56 and a drain electrode 57 may be formed.

In addition, a protective layer 58 covering the thin film transistor (TFT) and a planarization layer 59 positioned on the protective layer 58 and having a substantially flat top surface may be formed on the entire surface of the substrate 50. On the planarization layer 59, the patterned pixel electrode 61, the counter electrode 63 substantially corresponding to the front surface of the substrate 50, and the pixel electrode 61 and the counter electrode 63 are interposed between the light emitting layer. The organic light emitting device (OLED) including the intermediate layer 62 having a multi-layered structure may be formed to be positioned. Of course, the intermediate layer 62 may be a common layer substantially corresponding to the entire surface of the substrate 50, and some of the intermediate layer 62 may be a patterned layer patterned to correspond to the pixel electrode 61. The pixel electrode 61 may be electrically connected to the thin film transistor TFT through a via hole. Of course, a pixel definition layer 60 covering an edge of the pixel electrode 61 and having an opening defining each pixel region may be formed on the planarization layer 59 to substantially correspond to the entire surface of the substrate 50.

In the case of such an organic light emitting display device, at least some of the components may be formed using the deposition apparatus or the method of manufacturing the organic light emitting display device according to the above-described embodiments.

For example, the intermediate layer 62 may be formed by using the deposition apparatus according to the above-described embodiments or the manufacturing method of the organic light emitting display apparatus. For example, the intermediate layer 62 may include a hole injection layer (HIL: Hole Injection Layer), a hole transport layer (HTL: Hole Transport Layer), an emission layer (EML: Emission Layer), an electron transport layer (ETL: Electron Transport Layer), An electron injection layer (EIL) or the like may be formed using the deposition apparatus according to the above-described embodiments or the method of manufacturing an organic light emitting display apparatus.

That is, when forming each layer of the intermediate layer 62, a deposition assembly having an evaporation source, a deposition source nozzle portion, a patterning slit sheet, and an angle limiting portion is provided with a substrate for deposition, specifically, a substrate formed up to the pixel electrode 61. In a state disposed to be spaced apart by a predetermined distance, deposition may be performed while one of the deposition assembly and the substrate moves relative to the other.

If the patterning slit sheet is a case in which a plurality of patterning slits 131 are arranged along the X-axis direction as shown in FIG. 9, when one layer of the intermediate layer 62 is formed using this, the layer is a linear pattern. pattern). Such one layer may be, for example, a light emitting layer.

As described above, the deposition apparatus of FIG. 1 can ensure that deposition is accurately performed on a predetermined area when depositing on a large-area substrate. For example, even an organic light emitting display device having a substrate having a size of 40 inches or more By accurately forming the intermediate layer 62, it is possible to implement a high-quality organic light emitting display device.

The present invention has been described with reference to the embodiments shown in the drawings, but these are merely exemplary, and those of ordinary skill in the art will appreciate that various modifications and equivalent other embodiments are possible therefrom. Therefore, the true technical protection scope of the present invention should be determined by the technical spirit of the appended claims.

2: substrate 100-1: deposition assembly
100: evaporation unit 101: chamber
103: lower housing 104: upper housing
110a: first deposition source 110b: second deposition source
111: crucible 112: heater
115: deposition material 120a: first deposition source nozzle portion
120b: second deposition source nozzle unit 121: deposition source nozzle
130: patterning slit sheet 131: patterning slit
140: blocking member 145: angle limiting portion
150: first stage 160: second stage
200: loading unit 214: introduction chamber
218: first half room 219: buffer room
300: unloading unit 324: carrying out room
328: second reversal room 400: transfer unit
410: first transfer unit 420: second transfer unit
430: moving part

Claims (11)

A first deposition source and a second deposition source arranged in a moving direction of the substrate to emit a deposition material and sequentially approach the substrate when the substrate is moved;
A patterning slit sheet disposed to face the first deposition source and the second deposition source, and in which a plurality of patterning slits are disposed along one direction; And
A deposition material emitted from the first deposition source and a deposition material emitted from the second deposition source are guided, and the deposition material emitted from the first deposition source passes through the patterning slit sheet and is deposited on the substrate. When a layer is formed and the deposition material emitted from the second deposition source passes through the patterning slit sheet and deposits on the first layer to form a second layer, the deposition material sprayed from the first deposition source and the Including, an angle limiting unit for guiding the paths of the deposition materials so as not to mix or mix deposition materials sprayed from the second deposition source with each other. The method of claim 1,
The first deposition source and the second deposition source radiate different deposition materials. The method of claim 1,
The angle limiting unit guides, so that the first layer is deposited on the substrate and the second layer is directly deposited on the first layer. The method of claim 1,
The evaporation apparatus, wherein the angle limiting portion has a first opening corresponding to a nozzle portion of the first deposition source and a second opening corresponding to a nozzle portion of the second deposition source. The method of claim 4,
The angle limiting portion surrounds each of the first deposition source and the second deposition source. The method of claim 1,
The angle limiting unit includes a first angle limiting unit having a first opening corresponding to a nozzle unit of the first deposition source, and a second opening corresponding to the nozzle unit of the second deposition source, and the first angle limiting unit A deposition apparatus having a second angle limiting portion spaced apart from and. The method of claim 6,
The first angle limiting unit and the second angle limiting unit are movable in a first direction or in a direction opposite to the first direction, respectively. The method of claim 6,
The first angle limiting part surrounds the first deposition source and the second angle limiting part surrounds the second deposition source. The method according to any one of claims 4 to 8,
The nozzle portion of the first deposition source has a plurality of deposition source nozzles intersecting the first direction and arranged in a second direction parallel to the substrate fixed to the moving portion, and the nozzle portion of the second deposition source is also in the second direction. It has a plurality of evaporation source nozzles arranged along the,
In a plane perpendicular to the second direction, a first straight line connecting a center of the first opening and a plurality of deposition source nozzles of the nozzle portion of the first deposition source, and a center of the second opening and the second deposition source The second straight line connecting the plurality of evaporation source nozzles of the nozzle portion is not parallel, evaporation apparatus. The method according to any one of claims 4 to 8,
The nozzle part of the first deposition source has a plurality of deposition source nozzles arranged along a first direction, and the nozzle part of the second deposition source also has a plurality of deposition source nozzles arranged along the first direction,
In a plane crossing the first direction and perpendicular to a second direction parallel to the substrate fixed to the moving part, the first straight line connecting the center of the first opening and the center of the nozzle part of the first deposition source and the The deposition apparatus, wherein the second straight line connecting the center of the second opening and the center of the nozzle portion of the second deposition source is not parallel. The method according to any one of claims 1 to 8,
A deposition apparatus, wherein the nozzle portion of the first deposition source and the nozzle portion of the second deposition source are integral.

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