KR102204539B1 - Apparatus for processing cutting part of glass substrate - Google Patents

Abstract

The present invention is a heating member; The heating member support; And a glass substrate support, wherein at least one of the heating member support and the glass substrate support is a glass substrate that is movably provided so that the heating member and the cut portion of the glass substrate fixed to the glass substrate support sequentially contact each other. In the cutting part processing device,
The heating member includes a contact portion in two directions or a contact portion in three directions in contact with the cut portion of the glass substrate,
The contact portions in the two directions are connected so that the contact surfaces in each direction form an inner angle greater than 10 degrees and less than 180 degrees, and the contact portions in the three directions are one vertical contact surface and two edge contact surfaces in contact with the vertical surface of the glass substrate cutting portion. It includes, and the edge contact surface relates to a cutting portion processing apparatus for a glass substrate, characterized in that connected to each of the opposite ends of the vertical contact surface to form an inner angle greater than 90 degrees and less than 180 degrees.

Description

Apparatus for processing cutting part of glass substrate}

The present invention relates to an apparatus for processing a cut portion of a glass substrate.

Processing of a glass substrate used in a flat panel display device generally involves a process of removing sharp corners by grinding and/or polishing the edge of the cut glass substrate after cutting the glass substrate into a desired shape.

According to the general processing method as described above, since particles generated during processing of the edges of the glass substrate contaminate the surface of the glass substrate, cleaning and drying processes are required to clean them, thereby increasing the manufacturing cost of the glass substrate. do. In addition, particles and chips caught between the belt and the glass substrate during processing seriously damage the surface of the glass substrate, which often causes a cause of interrupting a series of processing steps.

In Korean Patent Application No. 2001-0085114, while chamfering a glass substrate using a diamond wheel, a nozzle is installed adjacent to the chamfer processing area, and blown through the nozzle to blow off the powder, and fine glass particles generated during chamfering Disclosed is a method of inhaling contained compressed air.

However, when corners are processed using grinding or chamfering, the generation of glass powder cannot be avoided, defects in the corners during the grinding process, surface scratches caused by glass powder dust, and problems in which workers are exposed to glass dust. Cannot be avoided.

In Korean Patent Application No. 2012-0002573, as shown in FIG. 1, a method of cutting the edge into a strip shape by moving a heated member in contact with the edge of a cooled glass substrate is disclosed. This method is expected to be useful in this field as it can fundamentally prevent glass dust generated when polishing the edge of a glass substrate.

However, the method, as shown in FIG. 2, has a disadvantage in that a large number of steps are required for processing of the cutting portion of the glass substrate, and thus a large amount of time is required. In addition, as shown in FIG. 3, there is a disadvantage in that the cut strip is cut in contact with the heating member and the induction coil provided in the heating member, thereby causing chipping and a non-uniform cutout surface.

Korean Patent Application No. 2012-0002573

The present invention was devised to solve the above problems of the prior art,

A glass substrate that can significantly reduce the damage of the glass substrate during cutting part processing by significantly improving the efficiency of cutting part processing by drastically reducing the process required for processing the cut part of the glass substrate, and minimizing the movement of the glass substrate required during cutting part processing. It is an object of the present invention to provide a cutting device processing device.

The present invention

And a heating member, the heating member support, and a glass substrate support,

In the cutting part processing apparatus of a glass substrate provided so that at least one of the heating member support and the glass substrate support can be moved to sequentially contact the cutting part of the glass substrate fixed to the heating member and the glass substrate support,

The heating member includes a contact portion in two directions or a contact portion in three directions in contact with the cut portion of the glass substrate,

The contact portions in the two directions are connected so that the contact surfaces in each direction form an inner angle greater than 10 degrees and less than 180 degrees, and the contact portions in the three directions are one vertical contact surface and two edge contact surfaces in contact with the vertical surface of the glass substrate cutting portion. It includes, wherein the edge contact surface provides a cutting portion processing apparatus for a glass substrate, characterized in that connected to each of the opposite ends of the vertical contact surface to form an inner angle greater than 105 degrees and less than 165 degrees.

The processing apparatus of the cutting part of the glass substrate of the present invention includes a heating member including a contact part of the cutting part that can finish the processing of the cut part of the glass substrate at one time, thereby significantly reducing the process required for the processing of the cutting part of the glass substrate, thereby increasing the efficiency of the cutting part processing. It improves, and minimizes the movement of the glass substrate required during cutting part processing, thereby providing the effect of greatly reducing the damage of the glass substrate during cutting part processing.

1 shows a method of cutting a corner of a glass substrate of the prior art,
2 is a chart showing a processing procedure flow of a glass substrate cutting portion of the prior art,
3 is a view showing a problem caused by a strip when cutting the edge of a glass substrate of the prior art,
FIG. 4 is a view showing a contact relationship between a heating member including a two-way cut contact part and a glass substrate cut part of the cutting part processing apparatus for a glass substrate of the present invention,
5 is a view showing a contact relationship between a heating member including a three-way cut contact portion and a glass substrate cut portion of the apparatus for processing a cut portion of a glass substrate of the present invention;
6 is a diagram schematically showing a separation form of a strip when processing a cut part by the cut part processing apparatus of a glass substrate of the present invention,
7 is a plan view schematically showing a method of processing a cut portion by the cut portion processing apparatus of a glass substrate of the present invention.
8 is a photograph taken of an apparatus for processing a cut portion of a glass substrate as an embodiment of the present invention.

Hereinafter, a preferred embodiment of the present invention will be described in detail. Prior to describing the present invention, when it is determined that a detailed description of related known functions and configurations may unnecessarily obscure the subject matter of the present invention, a description thereof will be omitted.

The description and drawings below illustrate specific embodiments so that those skilled in the art may readily implement the described apparatus and methods. Other embodiments may include structurally and logically different variations. Individual components and functions can generally be selected unless explicitly required, and the sequence of processes can vary. Parts and features of some embodiments may be included in or replaced by other embodiments.

The present invention includes a heating member, the heating member support, and a glass substrate support,

In the cutting part processing apparatus of a glass substrate provided so that at least one of the heating member support and the glass substrate support can be moved to sequentially contact the cutting part of the glass substrate fixed to the heating member and the glass substrate support,

The heating member, as shown in Figs. 4 and 5, includes a contact portion in two directions or a contact portion in three directions in contact with the cut portion of the glass substrate,

The two-way contact portions (FIG. 4) are connected so that the contact surfaces in each direction form an inner angle greater than 10 degrees and less than 180 degrees each other, more preferably more than 30 degrees and less than 150 degrees,

The three-way contact portion (FIG. 5) includes one vertical contact surface and two edge contact surfaces that are in contact with the vertical surface of the glass substrate cutting portion, and the corner contact surfaces are greater than 90 degrees and less than 180 degrees at both ends of the vertical contact surface. It relates to an apparatus for processing a cut portion of a glass substrate, characterized in that it is connected to form a cabinet, more preferably a cabinet greater than 105 degrees and less than 165 degrees.

The vertical contact surface in the three-way contact portion should have the same or narrower upper and lower width than the thickness of the cut portion of the organic substrate. In the same case, the edge contact surface does not directly contact, but the edge portion may be cut off by the heat energy transmitted therefrom. However, when it is large, the contact surface of the heating member does not come into contact with the edge of the glass substrate, so that the desired shape cannot be obtained.

The method of processing the cut portion of the glass substrate uses the principle that when the heated heating member is brought into contact with the processing portion of the glass substrate, the strip is cut out from the contact portion due to a temperature difference inside the glass.

Since the processing apparatus of the present invention processes the cut portion of the glass substrate by sequentially heating the entire vertical surface (cutting surface) of the cut portion of the glass substrate by a heating member and generating a strip for the entire vertical surface, the processing process is greatly simplified, and chipping and A glass substrate with strong durability can be provided by removing cracks well.

In particular, as shown in Fig. 6, since the strip is removed in the transverse direction (which is slightly inclined toward the bottom by gravity), the strip is separated from the heating member (eg, induction heating wire included in the heating member) and There is no collision and breakage and no interference with the induction heating wire. In addition, since chipping due to the above causes does not occur, a uniform cut surface can be obtained.

In addition, as in a conventional apparatus, a glass substrate flipping process required when processing one corner and processing the other corner is unnecessary, and thus, damage to the glass substrate during cutting portion processing is greatly reduced.

In the cutting part processing apparatus of a glass substrate of the present invention,

The two-way cut contact part, as shown in FIG. 4, is formed in a shape that contacts the upper and lower edges of the glass substrate cutting part at one time (FIG. 4(a)) (eg, a long-shaped heating member), or one edge and a vertical surface It may be formed in a shape contacting the whole (FIG. 4(b) or (c)).

The heating member, as shown in Fig. 4 or 5, may be formed in the shape of a polygonal column such as a cylinder, a triangular column, a square column, a pentagonal column, and the two-way cut contact part or the three-way cut part contact part is the cylinder, It may be formed in an engraved shape, such as a polygonal column. In addition, the heating member is formed in the shape of a cylinder, a polygonal column, etc., and the two-way cut contact portion and the three-direction cut portion contact portion are continuously engraved around the cylinder, polygonal column, etc. to form one circular or circular band. Can be.

In the cutting part processing apparatus of a glass substrate of the present invention,

The heating element may be heated by means commonly used in this field. For example, an electric resistance method, a high frequency induction heating method, or the like may be used.

The high-frequency induction heating method is a method in which a heating member located in the middle of a coil through which a high-frequency current flows is rapidly heated by an eddy current (EDDYCURRENT) generated by an electromagnetic induction action and heat loss of some HYSTERESIS, as shown in FIG. 3. It means the way it is heated by.

The high-frequency induction heating method can effectively concentrate energy on the heating member penetrating the coil, enabling rapid temperature rise, and is particularly advantageous in preventing a decrease in temperature of the heating member due to contact with the cooling member. Can be used.

In the present invention, it means that the heating temperature of the heating member rises above the Tg of the glass. Glass Tg varies from 750℃ to 1300℃ depending on the type of glass. In the practice of the present invention, the temperature of the heating member is preferably maintained higher than the Tg of the glass by 50° C., preferably 100° C. or more, and even more preferably 200-500° C. .

The shape of the heating member supporter is not particularly limited as long as it has a structure capable of fixing the heating member, and a shape known in the art may be used.

The glass substrate support is a component capable of fixing the glass substrate, and may be provided with various types of fixing means known in the art. In particular, the glass substrate support may further include a cooling means for cooling the glass substrate. The cooling means may be, for example, a cooling plate in which a conduit through which a low-temperature refrigerant flows is formed on the bottom of the support.

In the apparatus for processing a glass substrate cutting portion of the present invention, the "cooling" means a state in which the temperature of the glass substrate is lower than that of the peripheral portion by a forced method.

The cooling may cool the entire glass substrate or selectively cool only the processed portion of the glass substrate, but it is preferable to cool the entire glass substrate for stable control.

The cooling of the glass substrate may be performed by placing the glass substrate in a working environment maintained at a low temperature for a certain period of time, and may also be performed by contacting the glass substrate with a cooling plate maintained at a low temperature. Preferably, the cutting operation is performed while being fixed to a cooling plate maintained at a constant temperature so as to avoid an increase in the temperature of the glass during operation.

In the processing apparatus of the glass substrate cutting unit of the present invention, since the temperature of the glass substrate during processing is heated to a temperature of the heating member above the Tg of the glass, the strip is formed by the temperature difference inside the glass even when the temperature of the glass substrate is 0 to 50°C. Is possible. However, it is also possible to cool the glass substrate in order to increase the effect of strip cutting. The "cooling" means that the temperature of the glass substrate is lower than that of the peripheral portion by a forced method.

In the present invention, the cooling temperature of the glass substrate is preferably cooled to a temperature lower than room temperature (25 °C), more preferably 10 °C or more lower than room temperature so that the glass substrate in contact with the heating member can be cut and separated without dust. . In the practice of the present invention, the temperature of the glass substrate is preferably 10 °C or less, and more preferably in the range of 0 to 10 °C to reduce energy consumed for excessive cooling.

When the temperature of the glass substrate is high, the amount to be cut from the edge increases, making it difficult to precisely cut the edge of the thin glass, and when the temperature of the glass substrate is too low, excessive energy consumption is caused, and certain process control becomes difficult I can.

In the present invention, the heating member and the glass substrate can be moved relatively. That is, the heating member may move, the glass substrate may move, or the glass substrate and the heating member may move simultaneously. The movement of the heating member and the glass substrate may be performed by operating the heating member support and the glass substrate support, respectively.

The moving speed of the heating member and/or the glass substrate may be adjusted in consideration of productivity, cutting depth, temperature difference, and pressure difference.

In the present invention, one of the heating member support and the glass substrate support may be fixed, and the other may be installed to move while maintaining contact between the heating member and the cutting portion of the glass substrate. Preferably, the heating member support is fixed and the glass substrate support is moved. This is because when the heating member support moves, a temperature change occurs in the heating unit due to convection caused by the movement, making it difficult to cut a uniform strip.

In the present invention, the contact between the heating member and the edge of the glass substrate is preferably made by pressing so that a pressure of about 0.1-3.0 Kgf/cm2, more preferably 0.5-1.5 Kgf/cm2 is applied to the heating member. If the pressure is too high, the amount of cutting may be increased and it may not be suitable for edge processing of thin glass. If the pressure is too low, irregularities are formed on the edge, or if the edge is not cut at the correct angle, the edge is cut evenly. Can not.

In the present invention, the edge of the glass substrate cutting portion may be cut in a range of ① 30 µm-5 mm along the horizontal and vertical planes at the edge where the horizontal and vertical surfaces intersect, and the vertical surface of the glass substrate cut portion is ② 50 µm-5 It may be cut in the range of mm, but is not limited thereto.

Except for the contents described above, the structure, each component, etc. of the apparatus for processing a cutting portion of a glass substrate of the present invention may be used without limitation, known in the art.

Although the present invention has been described in connection with the above-mentioned preferred embodiments, it is possible to make various modifications or variations without departing from the spirit and scope of the invention. Accordingly, the appended claims will cover such modifications or variations as long as they fall within the gist of the present invention.

Claims (4)

And a heating member, the heating member support, and a glass substrate support,
In the cutting part processing apparatus of a glass substrate provided so that at least one of the heating member support and the glass substrate support can be moved to sequentially contact the cutting part of the glass substrate fixed to the heating member and the glass substrate support,
The heating member includes a three-way cut contact portion contacting the glass substrate cut portion,
The three-way cut contact portion includes one vertical contact surface and two edge contact surfaces that are in contact with the vertical surface of the glass substrate cut portion, and the corner contact surfaces form an inner angle greater than 90 degrees and less than 180 degrees at both ends of the vertical contact surface. A cutting unit processing apparatus of a glass substrate, characterized in that connected. delete The method according to claim 1,
The heating member is formed in a shape of a cylinder or a polygonal column, and the three-way cutting portion contact portion is formed in the shape of an engraved shape on the cylinder or polygonal column. The method according to claim 1,
The heating member is formed in a cylindrical shape, and the three-way cutting portion contact portion is continuously engraved around the cylinder to form one circular band.

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