KR102199982B1 - Lighting source module and light system having the same - Google Patents

Abstract

The embodiment relates to a light source module.
The light source module according to the embodiment may include a plate having a length in a first direction longer than a width in the second direction and having a plurality of electrode portions and at least one insulating portion between the plurality of electrode portions; A plurality of light emitting chips arranged in the first direction on the first surface of the plate; And a molding member covering the plurality of light emitting chips, wherein the plurality of light emitting chips are electrically connected to the plurality of electrode parts, the plurality of insulating parts include the same material as the plurality of electrode parts, and the plate Includes a plurality of grooves concave in the direction of the first surface from a second surface opposite to the first surface, and at least one of the plurality of grooves is disposed on each electrode portion.

Description

Light source module and lighting system equipped with it {LIGHTING SOURCE MODULE AND LIGHT SYSTEM HAVING THE SAME}

The embodiment relates to a light source module and a lighting system including the same.

Light-emitting diodes, such as light-emitting diodes (Light Emitting Device), are a kind of semiconductor device that converts electrical energy into light, and are in the spotlight as a next-generation light source by replacing conventional fluorescent and incandescent lamps.

Since light-emitting diodes use semiconductor devices to generate light, they consume very little power compared to incandescent lamps that generate light by heating tungsten, or fluorescent lamps that generate light by colliding with a phosphor with ultraviolet rays generated through high-pressure discharge. .

In addition, since the light emitting diode generates light using the potential gap of a semiconductor device, it has a longer lifespan, faster response characteristics, and eco-friendly characteristics compared to conventional light sources.

Accordingly, many studies are being conducted to replace the existing light source with a light emitting diode, and as information processing technology develops, display devices such as LCD, PDP, and AMOLED are widely used. Among these display devices, the LCD requires a lighting system such as a backlight unit capable of generating light in order to display an image.

The embodiment provides a light source module in which a plurality of light emitting chips are arranged on a plate whose length is longer than that of the width.

The embodiment provides a light source module in which a plurality of light emitting chips are mounted on a plate including at least three electrode portions.

The embodiment provides a light source module covering a light emitting chip with a molding member having the same width as the width of the plate, and having two or three sides of the molding member open.

The light source module according to the embodiment includes: a plate having a length in a first direction longer than a width in the second direction perpendicular to the first direction, and having a plurality of electrode portions and at least one insulating portion between the plurality of electrode portions; A plurality of light emitting chips arranged in the first direction on the first surface of the plate; And a molding member covering the plurality of light emitting chips, wherein the plurality of light emitting chips are electrically connected to the plurality of electrode portions, and the plate is directed from a second surface opposite to the first surface to the first surface. It includes a plurality of concave grooves, a bonding layer is formed on a surface of the groove, and at least one of the plurality of grooves may be disposed on each electrode portion.

The embodiment may improve the heat dissipation efficiency of a light emitting chip.

According to the embodiment, by mounting a plurality of light emitting chips on a plate, the thickness of a light source module in which the plurality of light emitting chips are packaged may be provided thin.

The embodiment may improve the reliability of the light source module.

The embodiment may improve the reliability of a lighting system including a light source module.

1 is a plan view of a light source module according to a first embodiment.
2 is a side view of the light source module of FIG. 1.
3 is a perspective view of the light source module of FIG. 1.
4 is a view showing in detail a first electrode of the light source module of FIG. 2.
5 is a view showing in detail a second electrode of the light source module of FIG. 2.
6 is a diagram illustrating a center area of a third electrode part of the light source module of FIG. 2.
7 is a diagram illustrating a connection terminal of the light source module of FIG. 2.
8 is a diagram illustrating an example in which the light source module of FIG. 2 is mounted on a substrate.
9 is a cross-sectional view of the light source module and the substrate of FIG. 8 on the AA side.
10 is a cross-sectional view of the light source module and the substrate of FIG. 8 on the BB side.
11 and 12 are side views illustrating a modified example of a groove of the light source module according to the embodiment.
13 and 14 are examples in which the number and spacing of grooves in the plate of the light source module are modified according to the embodiment.
15A and 15B are views showing an example of changing the shape of a groove of a plate of a light source module according to an embodiment.
16 is a side view showing a part of a light source module according to the second embodiment.
17 is a perspective view showing a light source module according to a third embodiment.
18 is a side view showing a light source module according to a fourth embodiment.
19 is a view in which the light source module of FIG. 2 is mounted on a substrate.
20 and 21 are views illustrating a manufacturing process of the light source module of FIG. 1.
22 is a perspective view illustrating a display device having a light source module according to an exemplary embodiment.

In the description of the embodiment, each substrate, frame, sheet, layer or pattern, etc. is formed in "on" or "under" of each substrate, frame, sheet, layer or pattern In the case of being described as being "on" and "under", it includes both "directly" or "indirectly" formed . In addition, standards for the top or bottom of each component will be described with reference to the drawings. The size of each component in the drawings may be exaggerated for the sake of explanation, and does not mean a size that is actually applied.

Hereinafter, a light source module according to an exemplary embodiment will be described with reference to the accompanying drawings.

1 is a plan view of a light source module according to a first embodiment, FIG. 2 is a side view of the light source module of FIG. 1, FIG. 3 is a perspective view of the light source module of FIG. 1, and FIG. 4 is a first light source module of FIG. FIG. 5 is a view showing in detail the second electrode of the light source module of FIG. 2, FIG. 6 is a view showing a center area of the third electrode of the light source module of FIG. 2, and FIG. 7 2 is a view showing a light emitting chip and a connection terminal of the light source module.

Referring to FIGS. 1 to 7, the light source module 100 includes a plate 10 having a plurality of electrode parts 11, 13 and 15 and a plurality of insulating parts 113 and 114; A plurality of light emitting chips (50:51,53,55,57) disposed on the first surface (1) of the plate 10; A plurality of grooves (31, 32, 33) disposed on the second surface (2) of the plate (10); And a molding member 81 covering the plurality of light emitting chips 50:51,53,55,57.

The plate 10 includes a first surface 1 on which a plurality of light emitting chips 50 are arranged, a second surface 2 opposite to the first surface 1, and first to fourth side surfaces ( 3,4,5,6). The first surface 1 is formed as a continuous horizontal surface, and sidewall portions 12 and 14 may protrude from both ends. The second surface 2 may be formed as a horizontal surface, for example, a region excluding the grooves 31, 32, and 33 as a horizontal surface. The surfaces of the plurality of insulating portions 113 and 114 may be formed as flat horizontal surfaces with respect to the first surface 1, the second surface 2, the third side surface 5, and the fourth side surface 6. In addition, the surfaces of the plurality of insulating parts 113 and 114 may be formed in the same horizontal plane as the surface of the plate 10. At least one of the third and fourth side surfaces 5 and 6 becomes a surface to be mounted on the substrate, so that the light source module 100 emits light in the lateral direction.

The plate 10 includes a plurality of electrode portions 11, 13 and 15 divided by a plurality of insulating portions 113 and 114, and the plurality of insulating portions 113 and 114 may be formed in two or more, It is not limited to this. In an embodiment, the plate 10 has a length D2 that is one hundred times longer than the width D1, and a plurality of light emitting chips 50 are arranged in a line along the direction Y of the length D2. The width D1 of the plate 10 may be formed to be less than twice as long as the length of any one side of the light emitting chip 50. For example, when the light emitting chip 50 is rectangular, the length of the short side or the short side It may be less than 2 times.

The plate 10 may be formed in a bar shape having a predetermined length D2, and 10 or more, for example, 15 or more light emitting chips 50 may be arranged. The plate 10 has a length (D2) in the first direction (Y) of 100 to 200 times the width (D1) in the second direction (X), and the length (D2) is 50 mm or more. It may be, for example, it may be in the range of 50mm to 100mm. The width D1 of the plate 10 may be 1 mm or less, for example, 0.35 mm to 0.5 mm. The thickness T1 of the plate 10 may be thicker than the width D1. The thickness T1 of the plate 10 may be formed in a range of 1/80 to 1/120 times the length D2, for example, in a range of 0.5 mm to 0.6 mm. The thickness T1 of the plate 10 is a thickness excluding the first and second sidewall portions 12 and 14, and as the thickness increases, the heat dissipation surface area increases, so that the heat dissipation efficiency can be improved. The width D1 of the plate 10 may be 3 times or less, for example, 2 times or less than the width of the light emitting chip 50, that is, the width in the second direction. Here, the plate 10 may be provided with a width in consideration of the width of the light emitting chip 50 and a process margin. For example, the light emitting chip 50 may be spaced apart from the third and fourth side surfaces 5 and 6 of the plate 10 by a predetermined distance, for example, 50 μm or more, for example, 50 μm to 100 μm. As another example, the length D2 of the plate 10 may be 100 mm or more, and the light emitting chips 10 may be arranged in two or more rows, for example. When the light emitting chip 50 is in two or more rows, the width D1 may be 2 mm or less.

The plate 10 includes a first side wall portion 12 and a second side wall portion 14 facing each other. The first and second sidewall portions 12 and 14 protrude from the horizontal line of the first surface 1 of the plate 10 and reflect light emitted from the light emitting chip 50, and The overflow of the member 81 can be prevented. The first and second sidewall portions 12 and 14 may have the same material as the plate 10 and have a protruding structure, or may be attached to another metal material.

The first and second sidewall portions 12 and 14 have the same width as the width D1 of the plate 10, and the upper surface is higher than the upper surface of the light emitting chip 50, for example, the light emitting chip 50 It may be disposed higher than the high point of the wire 59 connected to. The top surfaces of the first and second sidewall portions 12 and 14 may be positioned at the same position as the top surfaces of the molding member 81. The thickness T2 of the first and second sidewall portions 12 and 14 is equal to or thicker than the width D1 of the plate 10, and may be formed to be, for example, 0.4 to 0.45 mm. The thickness T2 of the first and second sidewall portions 12 and 14 may be formed in consideration of the thickness of the light emitting chip 50 and the high point position of the wire 59, but is not limited thereto.

The entire area of the plate 10 may be used as a member for dissipating heat generated from the light emitting chip 50 and supplying power. The plate 10 has the first to fourth side surfaces 3, 4, 5, 6 and the second surface 2 exposed.

The material of the plate 10 may be formed of a metal having high heat dissipation efficiency, such as aluminum (Al) or a ceramic material. The plate 10 is a different metal material, for example, iron (Fe), titanium (Ti), magnesium (Mg), copper (Cu), nickel (Ni), gold (Au), chromium (Cr), tantalum It may further include at least one of nium (Ta), platinum (Pt), tin (Sn), silver (Ag), phosphorus (P), a selective alloy of the metal, or a ceramic material. In addition, a plating layer such as gold (Au) may be formed on the surface of the plate 10, but the embodiment is not limited thereto. The plate 10 may be formed in multiple layers by selectively using the metals, but the embodiment is not limited thereto.

In addition, the plate 10 may be formed of a metal having a reflection efficiency of 70% or more with respect to the light emitted from the light emitting chip 50, for example, a metal such as aluminum (Al), silver (Ag), and gold (Au). have. The plate 10 may be formed in consideration of heat dissipation efficiency and reflection efficiency, but is not limited thereto.

The plurality of electrode portions 11, 13, and 15 are arranged in a line, and are spaced apart and insulated by insulating portions 113 and 114 disposed between adjacent two electrode portions 11, 13, and 15. When one insulating portion is disposed on the plate 10, two electrode portions may be formed, and when two insulating portions are disposed, three electrode portions may be formed. In this case, the number of electrode portions is one more than the number of insulating portions. When the plurality of electrode portions 11, 13, and 15 are three, the first and second electrode portions 11 and 13 are disposed opposite to each other, and the first and second electrode portions 11, 13) and a third electrode unit 15 disposed therebetween. The first and second electrode portions 11 and 13 may be connected to a power source having the same polarity and may be connected to a power source having a polarity different from that of the power source connected to the third electrode unit 15. For example, the first and second electrode parts 11 and 13 may be connected to a negative (-) terminal of a power source, and the third electrode part 15 may be connected to a positive (+) terminal of a power source, It is not limited to this.

The insulating portions 113 and 114 are formed of a metal oxide having a first metal. The electrode portions 11, 13, and 15 of the plate 10 may be a first metal, such as a single metal or an alloy. For example, the first metal may be formed of aluminum (Al) or may be an alloy containing aluminum. The insulating parts 113 and 114 may be formed of a metal oxide having the first metal, for example, aluminum oxide (Al ₂ O ₃ ).

Here, the plurality of insulating parts 113 and 114 may be anodized regions formed by an anodizing process of the plate 10. Each of the insulating parts 113 and 114 is formed of, for example, an oxide film on aluminum metal, and the formation method is a method of anodizing among the anode and the cathode as a metal surface treatment method. Since electrons must be well collected, an oxide film is applied. Lose. Such a treatment method is called anodizing, anodizing, and aluminum oxide film treatment, and an oxide film is formed on the surface of the aluminum metal. Accordingly, the plate 10 may include a plurality of insulating parts 113 and 114 and a plurality of electrode parts 11, 13 and 15.

Since the insulating portions 113 and 114 have the same height as the thickness of the plate 10, they may be formed without having an interface at a boundary region between the adjacent two electrode portions 11, 15, 15 and 13. Since the insulating portions 113 and 114 in the plate 10 are formed by an anodic oxidation process, the boundary surface between the electrode portions 11, 13 and 15 and the insulating portions 113 and 114 may not exist, and the electrode portion ( 11, 13, 15) may be formed in the same horizontal plane as the surface.

The width of each of the insulating parts 113 and 114 is a gap between adjacent electrode parts 11, 13 and 15, and is a gap at which interference between two adjacent electrode parts 11, 13 and 15 does not occur due to the supplied rated voltage. I can. The width of each of the insulating parts 113 and 114 may be formed to be smaller than the width of either side of the light emitting chip 50. The width of each of the insulating parts 113 and 114 may be, for example, 70 μm or more, but is not limited thereto. As the number of insulating portions 113 and 114 in the plate 10 increases, the rigidity of the plate 10 decreases. This is a cause of lowering the stiffness in the longitudinal direction by disposing the insulating portions 113 and 114 of different materials in the long plate 10.

3 to 5, the length of the first electrode 11, that is, the length B1 in the first direction Y is the first side surface 3 of the plate 10 and the first insulating part ( 113), and the length B2 of the second electrode part 13 is a gap between the second side surface 4 and the second insulating part 114 of the plate 10. The length B1 of the first electrode part 11 may be the same as or different from the length B2 of the second electrode part 13, but is not limited thereto. The lengths B1 and B2 of the first and second electrode portions 11 and 13 may be changed according to the positions of the first and second insulating portions 113 and 114. One or a plurality of light emitting chips 51 and 53 may be disposed on the first and second electrode portions 11 and 13, or the light emitting chip may not be disposed.

The length of the third electrode part 15 may be a distance between the insulating parts 113 and 114 and is more than twice the sum of the lengths B1 and B2 of the first and second electrode parts 11 and 13 It may be formed long, but is not limited thereto. More than 80% of the light emitting chips 50 may be mounted on the third electrode unit 15.

As shown in FIG. 2, the plurality of light emitting chips 50, for example, 10 or more light emitting chips 50 may be arranged in a line on the first surface 1 of the plate 10. The plurality of light emitting chips 50 may include a plurality of arrays 50A and 50B connected in series, for example, a first array 50A and a second array 50B. In the first array 50A, first and second light emitting chips 51 and 55 located at both ends are connected in series, and are electrically connected to the first and third electrode parts 11 and 15. In the second array 50B, third and fourth light emitting chips 53 and 57 located at both ends are connected in series, and are electrically connected to the second and third electrode portions 13 and 15. The first array 50A and the second array 50B may connect the third electrode part 15 to a common electrode. The number of connection of light emitting chips of the first array 50A and the number of connection of light emitting chips of the second array 50B may be the same.

The center region 17 between the first array 50A and the second array 50B is a common electrode, and the second light emitting chip 55 and the fourth light emitting chip 57 are bonded to each other with a wire 59. . A separate connection terminal may not be provided in the center region 17. Accordingly, the spacing between the light emitting chips of the first array 50A adjacent to the center region 17 and the light emitting chips of the second array 50B may be the same as or different from the spacing between the light emitting chips in each of the arrays 50A and 50B. have.

The first light emitting chip 51 is connected to the first electrode part 11 by a wire 59, and the third light emitting chip 53 is connected to the second electrode part 13 by a wire 59 do. An area connected to the first electrode part 11 by a wire 59 is an area between the first light emitting chip 51 and the first side wall part 12, and the second electrode part 13 The area connected by 59 becomes an area between the third light emitting chip 53 and the second sidewall 14.

Among the regions of the third electrode 15, the regions connected by the wires 59 are a plurality of regions, the center region 17 of the plate 10, or the second and fourth light emitting chips 55 and 57 ). In addition, regions connected by the wires 59 in the first to third electrode portions 11, 13, and 15 may be located on the same plane, but the embodiment is not limited thereto.

The plurality of light emitting chips 50 are divided into two or more arrays 50A and 50B on the plate 10 to provide a driving circuit that is electrically and circuitly stabilized. In addition, when the plurality of light emitting chips 50 are arranged in two arrays 50A and 50B, it is possible to prevent exceeding the allowable capacity of the driving driver.

Each of the light-emitting chips 50 is an LED chip, and includes semiconductor layers having at least one of a group II-VI compound semiconductor and a group III-V compound semiconductor selectively having an element of Group II to VI. Can include. The light emitting chip 50 may be implemented as a chip that emits light in a visible light band such as red, green, blue, or white or an ultra violet band. The light emitting chip 50 may be implemented as a horizontal chip in which two electrodes in the chip are disposed adjacent to each other, or a vertical chip in which two electrodes in the chip are disposed on opposite sides, and the horizontal chip includes at least two wires. May be connected to, and the vertical chip may be connected to at least one wire. The at least one light emitting chip 50 may be mounted in a flip structure, but the embodiment is not limited thereto. In an embodiment, wires may be bonded to a horizontal chip. Each of the light emitting chips 50 may be connected by, for example, two wires 59.

The light emitting chip 50 may have a support substrate not shown below, for example, a support substrate made of a conductive, insulating, or translucent material, and the support substrate is on the first surface 1 of the plate 10. Can be glued together.

A connection terminal 171 is disposed between two adjacent light emitting chips among the plurality of light emitting chips 50, and the connection terminal 171 functions as an intermediate connection terminal connecting two adjacent light emitting chips, and is connected by a wire 59 do. In addition, the number of connection terminals 171 is disposed to be smaller than the total number of the light emitting chips 50, and may increase or decrease according to the interval between the light emitting chips 50.

The thickness of the connection terminal 171 may be formed to be thinner than the thickness of the light emitting chip 50, and due to this thickness, the height difference between both ends of the wire 59 is reduced to prevent the wire 59 from being struck. And, the tensile force acting on the wire 59 can be improved.

4 to 6, the connection terminal 171 includes a conductive layer 175 and an insulating layer 173, and the insulating layer 173 is formed of the conductive layer 175 and the plate 10. It is arranged between the first side (1). The conductive layer 175 overlaps the insulating layer 173 in a vertical direction, and electrically connects the two adjacent light emitting chips 50:51,53,55,57. The insulating layer 171 is made of a resin material such as silicon or epoxy or a material such as tape, and the conductive layer 175 is made of a material for bonding, such as gold or a gold alloy, or a metal with high reflectivity (Al , Ag) may include a metal such as, but is not limited thereto.

The spacing between the connection terminals 171 may be equal to or narrower than the spacing between the light emitting chips 50, but is not limited thereto. The size of the connection terminal 171 may be formed to be smaller than the size of the light emitting chip 50, but is not limited thereto. The connection terminal 171 may be disposed in a region between the light emitting chips 50 and may be molded so as not to be exposed by the molding member 81. As another example, a portion of the connection terminal 171 may be exposed on a side surface of the molding member 81, for example, a third or fourth side surface of the plate 10.

All of the connection terminals 171 may be disposed on the third electrode unit 15, and thus, the lengths of the first and second electrode units 11 and 13 may be shortened. As another example, at least one connection terminal may be disposed to be in contact with or overlap on the insulating portions 113 and 114, but the embodiment is not limited thereto. The connection terminal 171 may be removed, and in this case, the plurality of light emitting chips 50 may be connected to each other by wires.

A molding member 81 is disposed on the first surface 1 of the plate 10, and the molding member 81 is disposed between the first side wall portion 12 and the second side wall portion 14. The molding member 81 contacts the first and second sidewall portions 12 and 14 and covers the plurality of light emitting chips 50, connection terminals 171, and wires 59. The length of the molding member 81 is a distance between the first and second sidewall portions 12 and 14, and the width may be formed as the width D1 of the plate 10. The thickness of the molding member 81 may be the same as the height T2 of the first and second sidewall portions 12 and 14, but is not limited thereto. As another example, at least a portion of the molding member 81 may be formed to be thicker or thinner than the height T2 of the first and second sidewall portions 12 and 14, but is not limited thereto.

The upper surface and both sides of the molding member 81 are exposed, and light is extracted through the exposed surface. Both sides of the molding member 81 may be disposed on the same plane as the third and fourth side surfaces 5 and 6 of the plate 10, but the embodiment is not limited thereto.

The molding member 81 may have a corner portion between an upper surface and both side surfaces of each surface, a surface treated with a fillet, or a curved surface. Accordingly, the molding member 81 may be formed in a polygonal shape or a hemispherical shape in side cross section, but is not limited thereto.

The upper surface of the molding member 81 may be a flat horizontal surface, a concave curved surface or a convex curved surface. Alternatively, the upper surface of the molding member 81 may be formed as a rough surface.

The molding member 81 may include a light-transmitting resin material such as epoxy or silicone, and a phosphor or a diffusing agent may be selectively added therein, but the embodiment is not limited thereto. The phosphor may include, for example, a YAG series, a silicate series, or a TAG series fluorescent material. An optical lens (not shown) may be formed on the molding member 81, and the optical lens may include a concave lens shape, a convex lens shape, a lens having a concave portion and a convex shape in another portion.

An adhesive layer may be further formed at the interface between the molding member 81 and the plate 10, and the adhesive layer may be the same material as the molding member 81, a different material, or a material such as silicon or epoxy. have. A metal oxide such as TiO ₂ or SiO ₂ may be added to the adhesive layer, but the embodiment is not limited thereto.

The light source module 100 of the embodiment may be provided with a thin thickness by disposing a plate having a plurality of electrode portions 11, 13, and 15 under the plurality of light emitting chips 50. For example, the light emitting chip package is manufactured after mounting the light emitting chip on the lead frame in the body and packaging it with the molding member 81, and the light emitting chip package thus manufactured is arranged on a substrate (PCB) and provided as a light source module. Therefore, there is a problem that the thickness of the light source module becomes thick and the number of processes is complicated.

The light source module 100 according to the embodiment may be provided as a linear light source, and the plurality of light emitting chips 50 may be selected from a series connection, a series-parallel connection, or a parallel connection.

8 is an example in which the light source module of FIG. 2 is mounted on a substrate, FIG. 9 is a cross-sectional view of the light source module of FIG. 8 on the A-A side, and FIG. 10 is a cross-sectional view of the light source module of FIG. 8 on the B-B side.

Referring to FIGS. 8 to 10, when the plate 10 is a metal having a weak adhesive strength such as an aluminum material, a layer plated with a separate material may be included for bonding and bonding with the substrate 191. The plated layer may be provided on at least one of the second surface 2 and the third and fourth side surfaces 5 and 6 of the plate 10. The plated layer may be provided on the second surface 2 for efficiency in the manufacturing process of the light source module 100. The first to fourth side surfaces 3,4,5,6 of the plate 10 may be cut surfaces, and a plating layer is formed on the first to fourth side surfaces 3,4,5,6. Difficulty forming. Here, the cut first to fourth side surfaces 3, 4, 5, and 6 may have a rougher surface, such as roughness, than the second surface 2.

Here, a via structure vertically penetrating the plate 10 may be formed, but there is a problem that the molding member 81 penetrates into the via structure when the molding member 81 is molded. For this reason, when bonding the plate to the substrate, there is a problem that bonding failure occurs. In addition, when a plurality of via structures are formed on the plate, there is a problem in that rigidity may decrease. In addition, when the via structure is formed on the third and fourth side surfaces 5 and 6 of the plate 10, there is a problem that the process margin is reduced.

4 to 10, the embodiment provides a plurality of grooves 31, 32, 33 on the second surface 2 of the plate 10 without forming a via structure in the plate 10, and , A bonding layer 26 may be formed. The plate 10 may be provided in a structure capable of being mounted on the substrate 191 with the third side 5 or the fourth side 6 by the second side 2, and a molding member due to the via structure Leakage of 81 can be prevented, rigidity of the plate 10 can be prevented from deteriorating, and a margin can be improved during the manufacturing process of the light source module.

2 to 6, the plate 10 includes a plurality of grooves 31, 32, and 33. The plurality of grooves 31, 32, 33 are formed concave in the direction from the second surface 2 to the first surface 1 of the plate 10. The spacing D3 between the grooves 31, 32, and 33 disposed on the second surface 2 of the plate 10 may be formed to be wider than the spacing between the light emitting chips 50, for example. The spacing D3 may be 10 mm or less, for example, in the range of 7 mm to 9 mm, and the spacing D3 may vary depending on the number of grooves 31, 32, and 33.

The depth (T4) of the plurality of grooves (31, 32, 33) is less than the thickness (T1) of the plate 10, lower than the height (T2) of the first and second side wall portions (12, 14) Can be formed in depth. The depth T4 of the plurality of grooves 31, 32, 33 may be formed in a range of 30% to 70% of the thickness of the plate 10, for example, may be formed in a range of 0.27mm to 0.33mm. The distance T5 between the second groove 33 and the first surface 1 is in the range of 0.25 mm to 0.3 mm, and may be smaller than the depth T4 of the grooves 31, 32, and 33.

Each of the grooves 31, 32, and 33 may have the same or different width T3 and depth T4, but the width T3 may be wider than the depth T4. This can increase the bonding area efficiently by increasing the width T3 of the grooves 31, 32, and 33 disposed on the plate 10 having a long length D2. The width (T3) of the grooves (31, 32, 33) is wider than the depth (T4) of the grooves (31, 32, 33), for example, 140% of the depth (T4) of the grooves (31, 32, 33) It may be formed in the range of to 200%, for example, it may be formed in the range of 0.4mm to 0.6mm.

Here, the plurality of grooves 31, 32, and 33 may have the same width, or at least one or at least two may have different widths, but the embodiment is not limited thereto. The depth of the third groove 33 may be thinner than that of the first and second grooves 31 and 32, and this may secure the rigidity of the center region of the plate 10. In addition, since the number of the third grooves 33 is arranged in plural, electrical reliability can be improved. One of the third grooves 33 is disposed at the same distance as the center region 17 of the plate 10, that is, the first and second grooves 31 and 32, or the first and second grooves It can be placed in the center between (31,32).

The length of each of the grooves 31, 32 and 33 may be formed equal to the width D1 of the plate 10. Accordingly, the length of each of the grooves 31, 32, and 33 may be the same as the width of the molding member 81. In addition, the length of each of the grooves (31, 32, 33) is the same as the width of the first to third electrode portions (11, 13, 15), or the width of the first and second side wall portions (12, 14) Can be the same as Each of the grooves 31, 32, and 33 may have a length longer than the width T3. Here, the longitudinal direction of the grooves 31, 32 and 33 is a width direction of the plate 10 and is a direction orthogonal to the longitudinal direction of the plate 10.

4 to 6, at least one groove 31, 32, 33 may be disposed in each of the electrode portions 11, 13, and 15 in the plurality of grooves 31, 32, and 33. For example, the first electrode part 11 and the second electrode part 13 may have at least one groove 31 and 32, and the first groove 31 of the first electrode part 11 ) Is disposed to overlap the first side wall part 12 in a vertical direction, and the second groove 32 of the second electrode part 13 is disposed to overlap the second side wall part 14 in a vertical direction. do.

One or a plurality of third grooves 33 may be disposed in the third electrode part 15. The third groove 33 of the third electrode part 15 may be disposed in a larger number than the number of the grooves 31 and 32 of the first and second electrode parts 11 and 13, but limited to this I don't. A plurality of third grooves 33 of the third electrode part 15 may be disposed at regular or irregular intervals to fix the plate 10. The distance of the third groove 33 may be gradually increased as it approaches the center region 17 of the plate 10, which prevents the stiffness of the center region 17, which is relatively weaker than the surrounding region, from weakening. can do.

A bonding layer 26 may be formed in each of the grooves 31, 32, and 33. The bonding layer 26 may be of a material different from that of the plate 10. For example, the adhesive strength with the bonding member 199 of FIG. 9 is better than that of the plate 10, and electrical and thermal conductivity of the plate It can be formed of a material higher than (10). The bonding layer 26 may be formed of, for example, silver or a silver alloy. In addition, another layer, such as a base plating layer, may be formed between the bonding layer 26 and the plate 10. The underlying plating layer includes nickel, copper, a nickel alloy, or a copper alloy.

When the bonding layer 26 is formed in the grooves 31, 32, and 33, the bonding layer 26 may be exposed to the second surface 2, the third and fourth side surfaces 5 and 6 . Since the bonding layer 26 is disposed as a thin film on the surfaces of the grooves 31, 32, 33, the inner region 25 of each bonding layer 26 is an open groove. The third and fourth sides 5 and 6 are open. 8 to 10, when the third side surface 5 of the plate 10 is mounted on the substrate 191, the bonding layer 26 of the grooves 31, 32, 33 of the plate 10 And the pad 195 of the substrate 191 are bonded to the bonding member 199. In this case, the bonding member 199 may be disposed in the inner region 25 of the grooves 31, 32, and 33, so that the bonding area with the bonding layer 26 may be increased. The bonding member 199 may electrically connect the first to third electrode portions 11, 13, and 15 to the substrate 191 through the bonding layer 26. Here, the area of the pad 195 of the substrate 191 may be formed larger than the area of the grooves 31, 32, and 33.

Accordingly, the grooves 31, 32, 33 of each of the electrode portions 11, 13, 15 and the substrate 191 are connected to each other by the bonding member 199, so that the substrate 191 is ,13,15) and can be electrically connected.

The light emitted from the light source module 100 may be emitted through the molding member 81. Here, the third side surface 5, which is the mounting surface of the plate 10, may contact or be spaced apart from the substrate 191, and either side of the molding member 81 may contact the substrate 191 or, It may be spaced apart, but is not limited thereto. That is, when the third side surface 5 of the plate 10 is mounted on the substrate 191, the third side surface 5 of the plate 10 and one side of the molding member 81 are formed on the substrate ( 191) can be contacted, and in this case, light loss can be reduced.

The third electrode part 15 may include grooves not electrically connected to the substrate 191 among the plurality of third grooves 33, for example, the center region 17 of the third electrode part 15 The groove 33 disposed in) may be electrically connected to the substrate 191, and the remaining grooves may not be electrically connected to the substrate 191. This may improve heat dissipation efficiency by grooves other than electrically connected grooves. For the grooves that are not electrically connected, a heat dissipation pad or a dummy pad may be provided on the substrate 191 separately from other pads.

11 and 12 are diagrams illustrating an example in which the number of grooves is changed in the light source module according to the embodiment. In describing FIGS. 11 and 12, the same configuration as in the first embodiment will be described with reference to the description of the first embodiment.

Referring to FIG. 11, the plate 10 includes a plurality of third grooves 33 and 34 disposed in the third electrode unit 15, and among the plurality of third grooves 33 and 34, the plate 10 The number of grooves 33 disposed in the center region 17 of may be smaller than the number of grooves 34 disposed in an adjacent region. The groove 33 of the center region 17 may be formed in a single structure for rigidity, and the groove 34 of the region spaced apart from the center region 17 may be formed in a multi-structure. The multi-structure includes a structure in which two or more grooves 34 and two or more protrusions 34A are disposed within a gap B3 between the light emitting chips 50.

In the multi-structure groove 34 of FIG. 11, three grooves are collectively disposed within the gap B3, and the multi-structure groove 35 of FIG. 12 includes five grooves 35 and a protrusion 35A. It is placed collectively within the gap B3. The widths A2 and A3 of the multi-structured grooves 34 and 35 of FIGS. 11 and 12 may be formed in an area smaller than the spacing B3 of the light emitting chip 50, and if it deviates from this, there is a problem. In addition, the widths of the grooves 34 and 35 of the multi-structure may be the same as or narrower than the grooves 33 of the center region, but are not limited thereto. By forming a bonding layer on the surfaces of the multi-structured grooves 34 and 35, an area of bonding to the bonding member may be increased. By increasing this bonding area, electrical conductivity and thermal conductivity can be improved.

13 and 14 are examples in which the number of light source modules is adjusted according to the embodiment.

In the plate 10 of FIG. 13, five grooves 31, 32, and 33 that are smaller than the number of grooves 31, 32, and 33 of FIG. 2 may be disposed, and FIG. 14 shows the grooves 32 and 32 of FIG. 17 grooves 31, 32, 33 may be arranged more than the number of ,33). These grooves (31, 32, 33) may be arranged in an odd number, and have a constant interval (D4, D6). For example, the grooves 31, 32, and 33 disposed in the center region 17 of the first electrode part 11, the second electrode part 13, and the third electrode part 15 are fixed, and the grooves therebetween They can be increased or decreased by adjusting the spacing of them. 13 to 14, the grooves 31, 32, and 33 of the plate 10 increase as the gap (D6>D3>D4) between the grooves 33 of the third electrode part 15 becomes narrower. It can be seen that the number increases further,

15A and 15B are examples in which the grooves of the plate are modified.

As shown in FIG. 15A, the groove 36 of the plate 10 may have a polygonal shape, for example, a wide upper portion and a narrow lower portion, and a bonding layer 26 is formed on the surface thereof. The inner region 25A of the groove 36 may have an increased adhesion area with the bonding member due to the inclined side surface.

15B, the groove 37 of the plate 10 may have a hemispherical shape, and the bonding layer 26 and the inner region 25B are also formed in a hemispherical shape according to the shape of the groove 37. Can be.

16 is a perspective view of a light source module according to a second embodiment. In the description of the second embodiment, the same portions as those of the first embodiment will be referred to the description of the first embodiment.

Referring to FIG. 16, in the light source module, first and second grooves 31 and 32 are disposed under the first electrode part 11 and the second electrode part 13 of the plate 10, and the first And sub grooves 121, 122, 141 and 142 are disposed on the third and fourth side surfaces of the second electrode portions 11 and 13.

The sub grooves 121, 122, 141, and 142 disposed on the third and fourth side surfaces of the first and second electrode portions 11 and 13 may have a hemispherical shape or a polygonal shape. The sub-grooves 121, 122, 141, and 142 disposed on the third and fourth side surfaces overlap the first and second grooves 31 and 32 disposed under the first and second electrode parts 11 and 13 in a vertical direction. It may be arranged or misaligned.

The sub grooves 121, 122, 141, and 142 formed on the third and fourth side surfaces of the first and second electrode portions 11 and 13 may be formed in a vertical direction, for example, in a thickness direction of the plate 10.

Since the sub grooves 121, 122, 141, and 142 disposed on the third and fourth side surfaces of the first and second electrode portions 11 and 13 do not come into contact with the molding member 81, the molding member 81 It can prevent the occurrence of defects. Accordingly, when the sub-grooves 121, 122, 141, and 142 are disposed on the third and fourth sides, the first and second grooves 31 and 32 under the first and second electrode parts 11 and 13 are bonded to each other by a bonding member. Therefore, bonding efficiency can be improved. As another example, the grooves under the first and second electrode portions 11 and 13 may be removed.

The sub-grooves 121, 122, 141, and 142 disposed on the third and fourth side surfaces of the first and second electrode portions 11 and 13 may be formed to be less than the width of the plate 10, for example, of the plate 10. It can be formed to a depth of less than 30% of the width. The depths of the sub-grooves 121, 122, 141, and 142 disposed on the third and fourth sides may be formed to be less than 0.35 mm, or may have a curvature of 0.6 mm to 0.8 mm in the case of a hemispherical shape.

In addition, the spacing between the sub-grooves 121, 122, 141, and 142 disposed on the third and fourth sides may be formed to be less than the width of the light emitting chip 50, but is not limited thereto. A bonding layer may be formed in the sub grooves 121, 122, 141, and 142.

17 is a side view of a light source module according to a third embodiment. In describing FIG. 17, the same configuration as in the first embodiment will be described with reference to the description of the first embodiment.

Referring to FIG. 17, the light source module is a modified structure of the first and second electrode portions 11 and 13 of the plate 10 having a plurality of light emitting chips 50. First and second grooves 31 and 32 are disposed on the second surface of the first and second electrode portions 11 and 13, and sub grooves ( 31A, 32A) are placed. The sub grooves 31A and 32A disposed in the first and second side wall portions 12 and 14 are recessed to a predetermined depth from the upper surfaces of the first and second side wall portions 12 and 14, and the plate ( It has the same length as the width of 10).

The length and width of the first and second grooves 31 and 32 and the sub grooves 31A and 32A may be the same or different, but are not limited thereto. A bonding layer 26 formed in the grooves 31, 33, and 35 may be formed in the sub grooves 31A and 32A. At least one of these sub-grooves 31A and 32A may be bonded by a bonding member. Here, since the sub-grooves 31A and 32A are disposed on opposite sides to the grooves 31 and 32 disposed in the first and second electrode parts 13 and 15, bonding positions may be opposite to each other.

18 is a side view showing a part of a light source module according to a fourth embodiment. In describing FIG. 18, the same configuration as in the first embodiment will be described with reference to the description of the first embodiment.

Referring to FIG. 18, a plurality of connection terminals 171 are disposed in a region between adjacent light emitting chips 50, and the plurality of connection terminals 171 connect two adjacent light emitting chips 50 to each other. The plurality of connection terminals 171 connect two adjacent light emitting chips 50 in series by a wire 59, so that a distance (B4>B3) between two adjacent light emitting chips 50 may be widened. Accordingly, the number of light emitting chips 50 in the light source module may be reduced.

19 is a diagram illustrating a light emitting device having a light source module according to a third embodiment.

Referring to FIG. 19, the light source module 100 is mounted on a substrate 191. One side of the plate 10 of the light source module 100 faces the substrate 191, and a bonding member is bonded to the grooves 31, 32, 33 of the plate 10, and the substrate 191 ) Is mounted on the pad. Accordingly, the first to third electrode portions 11, 13, and 15 of the plate 10 may be electrically connected to the substrate 191, and the plurality of light emitting chips 50 emit light.

The substrate 191 includes line patterns P1, P2, P3 connected to the first electrode part 11, the second electrode part 13, and the third electrode part 15 of the plate 10, respectively, , In the line patterns P1, P2, and P3, at least three lines may be connected to each of the electrode portions 11, 13, and 15.

The substrate 191 may be a flexible substrate, a resin substrate, a ceramic substrate, or a substrate having a metal layer, but is not limited thereto.

In FIG. 19, the grooves 31, 32, and 33 disposed in the center regions of the first electrode part 11, the second electrode part 13, and the third electrode part 15 are the substrate 191 and the line pattern. Electrically connected by P3, grooves other than the center region of the third electrode unit 15 may or may not be electrically connected to the substrate 191. This can be used only for heat dissipation purposes when the grooves other than the center region of the third electrode unit 15 are not electrically connected, and thus heat dissipation efficiency may be further improved. In addition, the heat dissipation pad(s) of the substrate 191 may be disposed in regions corresponding to grooves other than the center region of the third electrode unit 15. The heat dissipation pad may not be electrically connected to the line patterns P1, P2, and P3.

20 and 21 are views illustrating a part of a manufacturing process of the light source module according to the first embodiment.

20 and 21, insulating portions 113 and 114 spaced apart from each other are disposed in the longitudinal direction (x-axis direction) of the original plate 100B, and a first surface in which a predetermined area A1 of the original plate 100B is concave. Is disposed, and as shown in FIG. 21, a plurality of grooves 31, 32, and 33 are formed long in the Y-axis direction on the second surface opposite to the first surface. Here, the position of the first surface on which the plurality of light emitting chips 50 are disposed may be located lower than the upper surface of the sidewall part. Here, a bonding layer may be formed in the plurality of grooves 31, 32, and 33 by a plating process, but the embodiment is not limited thereto.

Thereafter, a plurality of light emitting chips 50 are mounted on the first surface of the individual plate region 100A of the original plate 100B, connected with wires, and molded with a molding member 81. Thereafter, cutting is performed in units of the width of the individual plate area 100A in the x-axis direction, and the length of the plate area 100A is cut in the Y-axis direction. Accordingly, a plurality of grooves 31, 32, and 33 may be provided on the second surface of the plate region 100A of the individual light source module, and a plurality of electrode portions are provided by the insulating portions 113 and 114. In addition, since the grooves 31, 32, and 33 are disposed in each electrode portion, electrical connection with the substrate is possible.

<Lighting system>

The light source module according to the embodiment may be mounted on a substrate and applied to a lighting system. The lighting system includes a light source module, includes the display device shown in FIG. 22, and may include a lighting lamp, a traffic light, a vehicle headlight, and an electric sign.

22 is an exploded perspective view of a display device according to an exemplary embodiment.

Referring to FIG. 22, a display device 1000 includes a light guide plate 1041, a light source module 100 and a substrate 1033 according to an embodiment providing light to the light guide plate 1041, and under the light guide plate 1041. A reflective member 1022, an optical sheet 1051 over the light guide plate 1041, a display panel 1061 over the optical sheet 1051, the light guide plate 1041, a light source module 100, and a reflective member ( It may include a bottom cover 1011 accommodating the 1022, but is not limited thereto.

The bottom cover 1011, the light source module 100, the substrate 1033, the reflective sheet 1022, the light guide plate 1041, and the optical sheet 1051 may be defined as a light unit 1050.

The light guide plate 1041 serves to diffuse the light provided from the light source module 100 to form a surface light source. The light guide plate 1041 is made of a transparent material, for example, acrylic resin series such as PMMA (polymethyl methacrylate), PET (polyethylene terephthalate), PC (polycarbonate), COC (cycloolefin copolymer), and PEN (polyethylene naphtha late). ) It may contain one of the resins.

The light source module 100 is disposed on at least one side of the light guide plate 1041 to provide light to at least one side of the light guide plate 1041, and ultimately acts as a light source of a display device.

At least one light source module 100 disclosed above is disposed in the bottom cover 1011, and may directly or indirectly provide light from one side of the light guide plate 1041. The light source module 100 may be selected from modules according to an embodiment.

An insulating adhesive sheet may be attached between the light source module 100 and the side surface of the bottom cover 1011, but the embodiment is not limited thereto.

A heat dissipation plate may be disposed in the bottom cover 1011, and a portion of the heat dissipation plate may contact an upper surface of the bottom cover 1011.

The reflective member 1022 may be disposed under the light guide plate 1041. The reflective member 1022 reflects light incident on the lower surface of the light guide plate 1041 and supplies it to the display panel 1061, thereby improving the luminance of the display panel 1061. The reflective member 1022 may be formed of, for example, PET, PC, PVC resin, but is not limited thereto. The reflective member 1022 may be an upper surface of the bottom cover 1011, but is not limited thereto.

The bottom cover 1011 may accommodate the light guide plate 1041, the light source module 100, the substrate 1033 and the reflective member 1022. To this end, the bottom cover 1011 may include a receiving portion 1012 having a box shape with an open top surface, but is not limited thereto. The bottom cover 1011 may be combined with a top cover (not shown), but is not limited thereto.

The bottom cover 1011 may be formed of a metal material or a resin material, and may be manufactured using a process such as press molding or extrusion molding. In addition, the bottom cover 1011 may include a metal or non-metal material having good thermal conductivity, but is not limited thereto.

The display panel 1061 is, for example, an LCD panel, and includes first and second substrates made of transparent materials facing each other, and a liquid crystal layer interposed between the first and second substrates. A polarizing plate may be attached to at least one surface of the display panel 1061, and the structure of the polarizing plate is not limited thereto. The display panel 1061 transmits or blocks light provided from the light source module 100 to display information. The display device 1000 may be applied to various types of portable terminals, monitors of notebook computers, monitors of laptop computers, and video display devices such as televisions.

The optical sheet 1051 is disposed between the display panel 1061 and the light guide plate 1041, and includes at least one translucent sheet. The optical sheet 1051 may include at least one of, for example, a diffusion sheet, a horizontal/vertical prism sheet, and a brightness enhanced sheet. The diffusion sheet diffuses incident light, the horizontal or/and vertical prism sheet condenses incident light to the display panel 1061, and the brightness enhancement sheet reuses lost light to improve luminance. Let me do it. In addition, a protective sheet may be disposed on the display panel 1061, but the embodiment is not limited thereto.

The light guide plate 1041 and the optical sheet 1051 may be included as an optical member on the light path of the light source module 100, but the embodiment is not limited thereto.

The light source module disclosed in the above embodiment may be applied to a top-view type backlight unit, or to a backlight unit such as a portable terminal or a computer, as well as a lighting device such as a lighting lamp, a traffic light, a vehicle headlamp, an electric signboard, and a street light. Not limited. In addition, the light guide plate may not be disposed in the direct type light source module, but the embodiment is not limited thereto. In addition, a light-transmitting material such as a lens or glass may be disposed on the light source module, but the embodiment is not limited thereto.

It is not limited by the above-described embodiments and the accompanying drawings, but is limited by the appended claims. Therefore, it will be apparent to those of ordinary skill in the art that various types of substitutions, modifications and changes are possible within the scope of the technical spirit of the present invention described in the claims, and the appended claims It will be said to belong to the technical idea described in.

10: plate 11, 13, 15: electrode part
12,14: sidewall 31,32,33,34,35: groove
26: bonding layer 50,51,53,55,57: light emitting chip
81: molding member 100: light source module
113,114: insulation part 171: connection terminal
191: substrate

Claims (16)

A plate having a length in a first direction longer than a width in a second direction perpendicular to the first direction and having a plurality of electrode portions and at least one insulating portion between the plurality of electrode portions;
A plurality of light emitting chips arranged in the first direction on the first surface of the plate; And
And a molding member covering the plurality of light emitting chips,
The plurality of light emitting chips are electrically connected to the plurality of electrode units,
The plurality of electrode portions include a first electrode portion to a third electrode portion made of the plate,
The third electrode part is disposed between the first electrode part and the second electrode part,
The plate includes a plurality of grooves concave in the direction of the first surface from a second surface opposite to the first surface,
A bonding layer is formed on the surface of the groove,
The plurality of grooves
A first groove formed on the first electrode portion;
A second groove formed on the second electrode portion; And
Including a plurality of third grooves formed on the third electrode portion,
The width in the second direction of the first to third grooves is the same as the width in the second direction of the plate,
The depth of the first and second grooves is deeper than the depth of the third groove,
The plurality of third grooves,
A 3-1 groove disposed in the center area of the third electrode part; And
And a 3-2 groove spaced apart from the center region of the third electrode part and disposed in a spaced region adjacent to the first and second electrode parts than the center region,
The number of the 3-2 grooves is greater than the number of the 3-1 grooves,
The 3-2 groove has a structure in which two or more grooves and two or more protrusions are disposed within a gap between adjacent light emitting chips. The method of claim 1,
The length of the third electrode portion in the first direction is at least twice as long as the sum of the lengths of the first and second electrode portions in the first direction,
80% or more of the plurality of light emitting chips are disposed on the third electrode part,
The insulating part includes a first insulating part disposed between the first and third electrode parts and a second insulating part disposed between the second and third electrode parts,
The insulator module is formed in the same horizontal plane as the surface of the electrode part. The method according to claim 1 or 2,
The first electrode portion includes a first sidewall portion protruding from the first surface of the plate,
The second electrode part includes a second side wall part protruding from the first surface of the plate and facing the first side wall part,
The first side wall part and the second side wall part are in contact with the molding member. The method of claim 3,
The first groove overlaps the first side wall in a vertical direction,
The second groove is a light source module overlapping the second side wall in a vertical direction. The method of claim 3,
The plate includes first to fourth side surfaces disposed between the first surface and the second surface,
The first and second sides face in the first direction,
The third and fourth sides face in the second direction,
The molding member has an upper surface and both sides exposed,
A light source module in which both exposed sides of the molding member are disposed on the same plane as the third side and the fourth side of the plate. The method of claim 5,
The bonding layer is exposed on the second and third sides, and on the fourth side,
An inner region of the bonding layer is a light source module that is open from the second surface, the third side, and the fourth side. The method of claim 5,
The first electrode part and the second electrode part each include sub grooves on the third side and the fourth side,
The sub-groove formed on the third side is concave from the third side to the fourth side,
The sub-groove formed on the fourth side is concave from the fourth side to the third side,
Sub-grooves formed on the third side and the fourth side of the first electrode part are disposed to overlap or deviate from the first groove,
The sub-grooves formed on the third side and the fourth side of the second electrode part, respectively, are disposed to overlap or deviate from the second groove. delete delete delete delete delete delete delete delete delete

Images