KR102176691B1 - Thermoconductive high internal phase emulsion and heat dissipative composite using the same - Google Patents

Abstract

The present invention, a polymer resin continuous phase; And a liquid metal dispersion phase dispersed in the polymer resin continuous phase in a predetermined amount, and a heat-dissipating composite material formed therefrom.

Description

Thermally conductive high internal phase emulsion and heat dissipation composite material using the same {THERMOCONDUCTIVE HIGH INTERNAL PHASE EMULSION AND HEAT DISSIPATIVE COMPOSITE USING THE SAME}

The present invention relates to a thermally conductive high internal phase emulsion having high thermal conductivity, excellent electrical insulation, processability, and surface adhesion, and a heat dissipating composite material using the same.

In recent years, according to the miniaturization, weight reduction, thinness, and high performance of electronic devices, high-density packaging and high integration of devices are required. Accordingly, heat generated from various electronic devices such as smart phones, tablet PCs, notebook computers, and LED lights increases, and development of heat dissipating materials that effectively dissipate such heat has emerged as an important task.

Currently, the most widely used material as a heat dissipation material is metal, which has a high thermal conductivity and has the advantage of being able to effectively protect electronic components sensitive to heat because it has high mechanical strength while spreading heat to the surroundings faster than other materials. However, the metal heat dissipation material has disadvantages in that it is difficult to reduce weight due to high density, poor processability and moldability, and poor adhesion to other parts.

In order to overcome the shortcomings of such a metal heat dissipation material, development of a polymer resin/thermal conductive solid filler composite material that can replace it is in progress. Unlike metal heat dissipation materials, such a composite material has excellent processability and formability, and excellent adhesion to other parts surfaces, but has a disadvantage of low thermal conductivity. Specifically, since the polymer resin used as the matrix is a material having very low thermal conductivity, a large amount of thermally conductive filler must be included in order for the composite material to exhibit the desired level of thermal conductivity, but the higher the content of the thermally conductive filler There is a problem that the workability and mechanical properties are deteriorated.

Accordingly, research is being conducted by changing the type of matrix used for composite materials, the type of filler, and the method of mixing the filler into the matrix, but there is still a need for a composite material that exhibits high thermal conductivity and has excellent processability. do.

Accordingly, the present inventors confirmed that when preparing a high internal phase emulsion (HIPE) containing a liquid metal in a high content in a polymer resin, not only has high thermal conductivity, but also excellent electrical insulation, processability and surface adhesion. Thus, the present invention was completed.

The present invention is to provide a thermally conductive high internal phase emulsion having high thermal conductivity and excellent electrical insulation, processability and surface adhesion.

In addition, the present invention is to provide a heat-dissipating composite material manufactured using such a thermally conductive high internal phase emulsion.

In the present specification, the polymer resin continuous phase; And 74% by volume or more based on the total volume, the liquid metal dispersed phase dispersed in the continuous phase of the polymer resin; containing, a thermally conductive high internal phase emulsion is provided.

In addition, in the present specification, a heat-dissipating composite material prepared using the thermally conductive high internal phase emulsion is provided.

Hereinafter, a thermally conductive high internal phase emulsion and a heat dissipating composite material according to a specific embodiment of the present invention will be described in more detail.

In the present specification, "High Internal Phase Emulsion (HIPE)" is also referred to as a high dispersion phase emulsion, and refers to an emulsion system in which the volume of the internal phase, that is, the dispersed phase, occupies 74% by volume or more based on the total emulsion volume. do. Such a high internal phase emulsion may include both a water-in-oil emulsion and an oil-in-water emulsion. Specifically, the oil-in-water emulsion is in which a discontinuous "internal" oil phase is dispersed in a continuous "external" water phase, that is, the aqueous phase is a "continuous phase". In contrast, the water-in-oil emulsion is a form in which discontinuous'inner' water phases are dispersed among continuous'outer' oil phases, that is, the oil phase is'continuous phase' and the water phase is'dispersion phase'. .

At this time, "matrix (continuous phase)" represents a continuous phase surrounding a dispersed phase in a system in which two phases are mixed, and a "dispersed phase" is a system in which two phases are mixed. Represents the phase constituting the particles in the continuous phase.

According to one embodiment of the invention, a polymer resin continuous phase; And 74% by volume or more based on the total volume, the liquid metal dispersed phase dispersed in the continuous phase of the polymer resin; including, a thermally conductive high internal phase emulsion may be provided.

In the thermally conductive high internal phase emulsion, the liquid metal dispersion phase is an emulsion surrounded by a continuous polymer resin.Since all phases are liquid, it has excellent processability and moldability compared to conventional metal heat dissipation materials and composite materials with a high thermal conductive solid filler content. In addition, since it contains a high content of liquid metal and has high thermal conductivity, it is possible to manufacture a composite material with excellent heat dissipation performance.

In addition, since the polymer resin is included in a continuous phase, it has excellent surface adhesion and exhibits electrical insulation, so it can be applied to electronic devices requiring electrical insulation. Accordingly, the thermally conductive high internal phase emulsion can be easily applied to fields such as smart phones, tablet PCs, notebook computers, and LED lighting that require excellent electrical insulation properties with high thermal conductivity.

The'liquid metal' is a metal or alloy having a liquid form at room temperature, and while the existing metal or alloy returns to a crystalline atomic structure when cooled, it maintains an amorphous atomic structure, and thus weak regions ) Or shortcomings, so it has very high elasticity and strength, and has high thermal conductivity like ordinary metals. In addition, since it is in a liquid form, it can be contained in a higher content in the polymer resin than in the solid filler, and even if it is contained in a higher content in the polymer resin, deterioration in processability and mechanical properties is prevented.

In addition, as described above, the liquid metal dispersion phase is included in 74% by volume or more based on the total volume of the high internal emulsion, more preferably 75% by volume or more, or 80% by volume or more, or 75 to 95% by volume. I can. At this time, the upper limit of the volume of the liquid metal dispersed phase is not particularly limited, but when the maximum volume at which the stabilization of the dispersed phase is guaranteed while suppressing the phase separation of the high internal phase emulsion is viewed as the upper limit, the liquid metal dispersed phase represents the total volume of the high internal phase emulsion. It may be included in 95% by volume or less as a standard.

In particular, the present inventors use a liquid metal dispersed phase together with the polymer resin continuous phase in a specific amount, 74% by volume or more, 75% by volume or more, or 80% by volume or more, or 95% by volume or less, or 75% to 95% by volume. As a result, it was confirmed through an experiment that the thermally conductive high internal phase emulsion and the heat-dissipating composite material formed therefrom can have electrical insulation properties while having significantly improved thermal conductivity compared to the theoretical value at room temperature, and the invention was completed.

In particular, by simply mixing the continuous polymer resin phase and the liquid metal dispersed phase, a thermally conductive high internal phase emulsion comprising a liquid metal dispersed phase dispersed in the continuous polymer resin phase in an amount of 74 vol% or more based on the total volume described above can be provided. none. On the other hand, by mixing the polymer resin continuous phase and the liquid metal dispersion phase to prepare an emulsion containing a liquid metal dispersion phase of 20 to 60% by volume of the total volume, and partially adding the liquid metal dispersion phase, the thermally conductive high internal phase emulsion It can be prepared to include a liquid metal dispersion phase of 74% by volume or more based on the total volume, and the thermally conductive high internal phase emulsion prepared as described above may have the above-described effects and characteristics. That is, there is no known thermally conductive high internal phase emulsion containing 74 vol% or more of the liquid metal dispersed phase dispersed in the polymer resin continuous phase, or a method for providing the same, and the properties exhibited as the liquid metal dispersed phase is contained in a high volume ratio as described above. It does not appear to have been studied.

More specifically, the thermally conductive high internal phase emulsion is 2 W/m·K or more, or 6 W/m·K or more, or 8 W/m·K or more, or 2 to 30 W/m·K at 25°C. It can have thermal conductivity.

In addition, the thermally conductive high internal phase emulsion may have electrical insulation.

Meanwhile, the polymer resin continuous phase includes a polymer or copolymer used as a continuous phase in a high internal emulsion, and may be used without particular limitation as long as it is an electrically insulating material and has properties such as thermoplasticity.

Specific examples of the polymer or copolymer included in the polymer resin continuous phase may include at least one selected from the group consisting of epoxy resin, (meth)acrylate resin, poly-urethane, ABS, polyester, and polyolefin.

In addition, the polymer resin has a weight average molecular weight of 100 to 1,000,000 g/mol, more preferably 1,000 to 100,000 g/mol. In the case of using a polymer resin having the above-described range, it is possible to effectively disperse a high volume of liquid metal, thereby exhibiting high thermal conductivity due to the liquid metal and at the same time exhibiting electrical insulation.

The polymer resin continuous phase may be dissolved or dispersed in a predetermined organic solvent, and may have a viscosity of 0.01 mPas to 10 mPas, or 0.1 mPas to 1 mPas when dissolved or dispersed in an organic solvent. At this time, examples of the organic solvent that can be used are not limited, and non-limiting examples of organic solvents described below may be used without great limitation.

In addition, the polymer resin continuous phase may further include an organic solvent together with the above-described polymer or copolymer. Non-limiting examples of the organic solvent include ketones, alcohols, acetates and ethers, or mixtures of two or more thereof. Specific examples of such an organic solvent include ketones such as methyl ethylkenone, methyl isobutyl ketone, acetylacetone or isobutyl ketone; Alcohols such as methanol, ethanol, n-propanol, i-propanol, n-butanol, i-butanol, or t-butanol; Acetates such as ethyl acetate, i-propyl acetate, or polyethylene glycol monomethyl ether acetate; Ethers such as tetrahydrofuran or propylene glycol monomethyl ether; Or a mixture of two or more of these may be mentioned. In the continuous phase of the polymer resin, an organic solvent may be included so that the concentration of the solid content of the polymer or copolymer is 1% by weight to 70% by weight, or 2 to 50% by weight.

Meanwhile, the liquid metal dispersed phase exists in the form of droplets in the high internal phase emulsion. Specifically, the liquid metal dispersion phase may exist in the form of droplets having a size of about 5 μm to 800 μm, or 50 μm to 500 μm. When the liquid metal dispersed phase is present in the form of droplets of the above-described size, the thermal conductivity of the high internal phase emulsion can be maximized by having an appropriate interfacial thermal resistance.

Meanwhile, since the thermally conductive high internal phase emulsion of the embodiment includes the liquid metal dispersed phase, an oxide thin film may be formed on the surface. Specifically, the liquid metal dispersed phase is formed on the surface of an oxide thin film having a thickness of about 0.5 to 2 nm, within 10% of the total cross-sectional thickness as the surface comes into contact with oxygen during or after the preparation of the high internal emulsion. Can be. Due to the oxide thin film, the stability of the dispersion phase of the high internal phase emulsion can be improved, and percolation between the liquid metal droplets is suppressed, so that the high internal phase emulsion can exhibit electrical insulation.

Such liquid metals include gallium, gallium-indium alloys, gallium-tin alloys, K ₂₃ Cs ₇₇ , Rb ₁₃ Cs ₈₇ , Na ₂₂ K ₇₈ , Ubdakkiy 117, SbPbInBi, InCuBi, Wood's metal, and Fields metal. One or more selected from the group consisting of (Field's metal) and Indalloy 1E may be used.

For example, eutectic gallium-indium (EGaIn) is an alloy consisting of 75.5% gallium and 24.5% indium by weight, and has a melting point of 15 and exists in a liquid state at room temperature. The EGaIn has a characteristic of forming a gallium oxide (Ga ₂ O ₃ ) thin film of about 1 nm as a result of a self-passivation reaction on the surface immediately upon exposure to oxygen in the air. Therefore, since it has a relatively high surface energy of about 630 dynes/cm, it is possible to manufacture a nonspherical shape such as a triangular column or a cone shape even in a liquid state. Accordingly, when EGaIn is included in an amount of 70% by volume or more of the total volume of the emulsion, it may be possible to manufacture an article having a certain thickness and a specific shape.

Meanwhile, the thermally conductive high internal phase emulsion of the embodiment may further include a separate stabilizer, for example, thermally conductive particles, to prevent phase separation of the high internal phase emulsion and stabilize the dispersed phase.

Specifically, the high internal phase emulsion may further include thermally conductive particles present at the interface of the polymer resin continuous phase and the liquid metal dispersed phase, which are used as a stabilizer in addition to the above-described dispersed phase and the continuous phase. In particular, it is preferable that such thermally conductive particles exhibit high thermal conductivity in order to improve the thermal conductivity of the high internal emulsion. The thermally conductive particles may be irreversibly adsorbed on the liquid metal dispersion phase, for example, the thermally conductive particles may be adsorbed in a form surrounding the liquid metal dispersion phase.

More specifically, the thermally conductive particles may continuously or discontinuously surround the liquid metal dispersed phase. In addition, the thermally conductive particles may be adsorbed on the liquid metal in a single layer or may be adsorbed in a plurality of layers. In this case, when the thermally conductive particles are adsorbed on the liquid metal in a plurality of layers, the thermal conductivity of the high internal emulsion may be further improved.

In addition, the shape of the thermally conductive particles is not particularly limited, but spherical particles are preferable because they can be stably adsorbed on the surface of the liquid metal dispersed phase. In this case, the thermally conductive particles may have an average particle diameter of 10 nm to 100 μm. For example, the thermally conductive particles may have an average particle diameter of 50 nm to 30 μm, or 100 nm to 10 μm. In the case of using particles having an average particle diameter in the above-described range, it may be more effective in stabilizing the liquid metal dispersed phase by further suppressing the phase separation of the high internal phase emulsion.

These thermally conductive particles are not particularly limited as long as they are solid particles that are not dissolved in a polymer resin and can be adsorbed on the surface of the liquid metal dispersed phase, but specifically, the group consisting of metal particles, metal oxide particles, metal hydroxide particles, and polymer particles. It may be one or more selected from.

The metal particles may be transition metal particles of groups 3 to 12 or metal particles of groups 13 to 16, for example, titanium (Ti), vanadium (V), manganese (Mn), iron (Fe), Cobalt (Co), nickel (Ni), copper (Cu), niobium (Nb), molybdenum (Mo), ruthenium (Ru), rhodium (Rh), palladium (Pd), silver (Ag), hafnium (Hf), Tantalum (Ta), tungsten (W), iridium (Ir), platinum (Pt), gold (Au), lanthanum (La), cerium (Ce), aluminum (Al), gallium (Ga), indium (In), It may be tin (Sn), thallium (Tl), lead (Pd), bismuth (Bi), and the like. In addition, the metal oxide particles and the metal hydroxide particles may be oxide and hydroxide particles of the metal, respectively. In addition, the polymer particles may be polystyrene, polyester, polyester, polycarbonate, polyamide, polyimide, or polyurethane, but is not limited thereto.

More specifically, the thermally conductive particles are SnO ₂ , SiO ₂ , CeO ₂ , TiO ₂ , Al ₂ O ₃ , V ₂ O ₃ , La ₂ O ₃ , HfO ₂ and Nb ₂ O ₅ It may be one or more metal oxide particles selected from the group consisting of.

In addition, the thermally conductive particles may be included in an amount of 0.01 to 20% by weight based on the total weight of the high internal emulsion. In the case of including the thermally conductive particles in the above-described range, stability can be maintained even if the volume of the dispersed phase of the high internal phase emulsion is increased. Specifically, the thermally conductive particles may be included in an amount of 0.05 to 10% by weight, more specifically 0.1 to 5% by weight, based on the total weight of the high internal emulsion.

On the other hand, the thermally conductive high internal phase emulsion may be prepared by mixing a polymer resin continuous phase and a liquid metal dispersed phase according to commonly known methods and conditions. For example, the polymer resin continuous phase and the liquid metal dispersed phase may be mixed through a device such as a vortexing machine, a homogenizer, or a sonicator.

In addition, by simply mixing the continuous polymer resin phase and the liquid metal dispersed phase, a thermally conductive high internal phase emulsion including a liquid metal dispersed phase dispersed in the continuous polymer resin phase in an amount of 74 vol% or more based on the total volume described above can be provided. none. On the other hand, by mixing the polymer resin continuous phase and the liquid metal dispersion phase to prepare an emulsion containing a liquid metal dispersion phase of 20 to 60% by volume of the total volume, and partially adding the liquid metal dispersion phase, the thermally conductive high internal phase emulsion It can be prepared to contain a liquid metal dispersion phase of 74 vol% or more based on the total volume.

As described above, the thermally conductive high internal phase emulsion prepared as described above may have significantly improved thermal conductivity compared to the theoretical value at room temperature. This appears to be due to the fact that the polymer resin continuous phase and the liquid metal dispersed phase are more homogeneously distributed under the above-described method and conditions, or have a characteristic in that the path through which heat escapes is increased as the contact point increases.

Meanwhile, according to another embodiment of the invention, a heat dissipation composite material formed from the thermally conductive high internal phase emulsion of the above embodiment may be provided.

As described above, the thermally conductive high internal phase emulsion of the embodiment includes the above-described polymer resin continuous phase and a liquid metal dispersion phase of 74% or more by volume based on the total volume dispersed in the polymer resin continuous phase. Accordingly, the thermally conductive high internal emulsion may have high thermal conductivity in a liquid state at room temperature, and excellent electrical insulation, processability, and surface adhesion.

In addition, the thermally conductive high internal phase emulsion may contain thermally conductive solid particles at the interface between the polymer resin continuous phase and the liquid metal dispersed phase, so that phase separation may be suppressed as the dispersed phase is stabilized.

Specifically, the heat-dissipating composite material formed from the thermally conductive high internal phase emulsion of the embodiment exhibits electrical insulation, and at 25°C, 2 W/m·K or more, or 6 W/m·K or more, or 8 W/m·K or more It can have thermal conductivity.

Accordingly, a heat-dissipating composite material suitable for use in electronic devices such as smartphones, tablet PCs, notebook computers, and LED lights that require heat dissipation can be manufactured using the thermally conductive high internal phase emulsion.

In addition, the thermally conductive high internal emulsion may be a liquid having excellent processability at room temperature and a viscoelastic solid. Therefore, the heat dissipation composite material formed from the thermally conductive high internal phase emulsion of the embodiment is Since it exhibits solid properties on a long time scale, it is possible to implement a 3D structured article having a certain thickness and sharp edges, and the structure can be maintained even after time.

The thermally conductive high internal phase emulsion and the heat dissipation composite material formed therefrom according to the present invention, including a liquid metal dispersed phase in a high content of the polymer resin continuous phase, have high thermal conductivity, as well as excellent electrical insulation, processability and surface adhesion There is a characteristic that it is.

1 shows a photograph of a high internal phase emulsion prepared in Example 1 and a confocal laser scanning micrograph thereof.
2 shows the results of measuring the thermal conductivity of the emulsions of Examples and Comparative Examples.
Figure 3 shows the results of measuring the rheological properties of the high internal phase emulsion of Example 1.
4 shows the results of measuring the rheological properties of the emulsion of Comparative Example 1.
5 shows a photograph of a triangular column prepared using the high internal emulsion prepared in Example 1.

Hereinafter, a preferred embodiment is presented to aid the understanding of the present invention. However, the following examples are provided for easier understanding of the present invention, and the content of the present invention is not limited thereby.

[ Example : Thermal conductivity High internal injury Of emulsion (HIPE) Produce]

Example One

The following epoxy resin and EGaIn liquid metal were mixed using a homogenizer at room temperature at 30,000 rpm to prepare a thermally conductive high internal emulsion.

1) Epoxy resin: 2 Ton® Epoxy manufactured by ITW DEVCON was used (solid content 58% by weight in acetone solvent)

2) EGaIn liquid metal: Gallium-Indium eutectic manufactured by Sigma-Aldrich, having a thermal conductivity of 14.231 W/mK, was used.

Specifically, since the main material of 2 Ton® Epoxy has high viscosity, it was used after lowering the viscosity by mixing Epoxy resin and acetone in a volume ratio of 1:1, and 113 μL of EGaIn was added to 180.8 μL of epoxy resin mixed with acetone for about 1 minute. By mixing an approximate amount, an emulsion of EGaIn:Epoxy resin = 3.85: 6.15 (volume ratio) was prepared. Then, 175 μL of EGaIn was added to the emulsion and mixed. (EGaIn: Epoxy resin = 6.14: 3.86 / volume ratio). Then, the process of adding and mixing 175 μL of EGaIn was repeated three more times to obtain HIPE with a volume ratio of EGaIn:Epoxy resin = 8.18: 1.82. Then, the obtained HIPE was left in a fume hood for more than 12 hours to remove the acetone solvent, and the emulsion had a total volume of 903.4 μL of HIPE (EGaIn is 813 μL, Epoxy resin is 90.4 μL = final volume ratio is 9: 1). .

Example 2

As shown in Table 1 below, a thermally conductive high internal phase emulsion was prepared in the same manner as in Example 1, except that the contents of the epoxy resin and the EGaIn liquid metal were different from the examples.

[ Comparative example 1 to 3]

As shown in Table 1 below, an emulsion was prepared in the same manner as in Example 1, except that the contents of the epoxy resin and the EGaIn liquid metal were different from the examples.

[ Experimental example ]

Experimental example One: Thermal conductivity High internal injury Of emulsion (HIPE) Image observation

In each HIPE prepared in Example 1, HIPE images were observed using a confocal laser scanning microscope to confirm whether EGaIn droplets were stabilized by particles, and the results are shown in FIG. 1.

As shown in FIG. 1, it was confirmed that the gray EGaIn droplet had a cross-sectional diameter of about 20 to 300 μm in a pressed shape rather than a perfect spherical shape due to the high volume ratio of the droplet.

Experimental example 2: HIPE Thermal conductivity measurement

The thermal conductivity at 25° C. of the emulsions prepared in Examples and Comparative Examples was calculated by the following equation 1, and the results are shown in Table 1.

[Equation 1]

Thermal conductivity (κ) = Thermal diffusivity (α) * Specific heat (Cp) * Density (ρ)

At this time, the thermal diffusivity was measured using a high-temperature thermal diffusivity meter (LFA447, manufactured by NETZSCH), and the specific heat was measured using a low-temperature differential scanning calorimeter (DSC 214 Polyma, manufactured by NETZSCH), and the density was Sigma- The values provided by Aldrich were used, and in the case of the epoxy resin, the mass and volume were measured respectively, and then the calculated values were used.

As can be seen in Figure 2, based on the total volume of the liquid metal dispersion phase of 74% by volume or more, the thermally conductive high internal phase emulsion of the embodiment including; whereas the thermal conductivity exceeds the theoretically determined thermal conductivity (blue graph), It was confirmed that the emulsions of Comparative Examples 1 to 3 had a thermal conductivity less than the theoretical value.

Experimental example 3: electrical conductivity measurement

The electrical conductivity of the emulsions prepared in Examples and Comparative Examples was measured using a multimeter (KEW 1018, manufactured by Kyoritsu). The resistance value of the thermally conductive high internal phase emulsion of Examples 1 and 2 was measured by OL (over limit), and thus it was found that electricity did not flow, meaning 40 mΩ or more, which is the maximum resistance value that can be measured by a multimeter. Also, the results were the same even when the positions were changed and measured repeatedly.

Example 1 Example 2 Comparative Example 1 Comparative Example 2 Comparative Example 3 Volume of EGaIn
(vol%) 90 80 50 60 70 Thermal conductivity
(W/m·K
@ 25℃) 15.26 8.73 0.87 1.15 1.98 Resistance value
OL
(> 40 mΩ) OL
(> 40 mΩ) OL
(> 40 mΩ) OL
(> 40 mΩ) OL
(> 40 mΩ)

Experimental example 4: Rheological Characteristic measurement

In order to grasp the rheological properties of the emulsions each prepared in Example 1 and Comparative Example 1, measurements were made using a rheometer (MCR-302, manufactured by Anton-Paar), and the results are shown in FIGS. 3 and 4, respectively. Respectively shown.

Specifically, the graph (a) of FIG. 3 shows the EGaIn loss factor (G") and the storage factor (G') by fixing the frequency at 10 rad/s and performing an amplitude sweep in the range of 0.0001 to 1 strain. ) Is the result of each measurement, and (b) the graph shows the EGaIn loss factor (G") and storage factor (G") by fixing the strain to 0.001 and conducting a frequency sweep in the range of 100 to 0.1 rad/s. G') is the result of measuring each.

From Fig. 3(a), it can be seen that the linear viscoelastic region of EGaIn is up to the section where the strain is about 0.001, and from Fig. 3(b), the storage coefficient (G') of EGaIn is the loss factor (G") over the entire frequency range. It can be seen that EGaIn exhibits elasticity, and since the HIPE of the embodiment is a viscoelastic solid having not only viscosity but also elasticity, it can be processed into various types of materials, and even after a long time. It was confirmed that the shape can be maintained.

In addition, the graph (a) of FIG. 4 shows the loss factor (G") and storage factor of the emulsion of Comparative Example 1 by fixing the frequency at 10 rad/s and conducting an amplitude sweep in the range of 0.0001 to 0.1 strain. (G') is the result of measuring each, and (b) the graph shows the loss factor of the emulsion of Comparative Example 1 by fixing the strain at 0.0005 and conducting a frequency sweep at a frequency ranging from 100 to 0.1 rad/s ( G") and storage coefficient (G') were measured respectively.

From Figure 4 (a), it can be seen that the linear viscoelastic region of the emulsion of Comparative Example 1 is up to the section where the strain is about 0.0005, and in Figure 4 (b), the emulsion of Comparative Example 1 is Unlike the G" group, it was confirmed that the point is maintained higher than G', it can be seen that it has a property like a flowing liquid.

Experimental example 5: Example of HIPE Manufacturing of 3D-shaped article using

By manufacturing a triangular column using the HIPE prepared in Example 1, it was confirmed whether it was possible to implement a 3D-shaped article having a certain thickness and sharp edges, and the results are shown in 5 and 6. In this case, (a) of FIG. 5 is a top view picture, and (b) and (c) shows a side view picture.

As shown in FIG. 5, when using the HIPE prepared in the Example, it is possible to manufacture a 3D-shaped article having a certain thickness and sharp edges despite the emulsion form, and confirm that the shape is maintained even after time. Could

Claims (13)

Polymer resin continuous phase; And
Including; 74% by volume or more of a liquid metal dispersed phase dispersed in the continuous phase of the polymer resin based on the total volume,
The polymer resin has a weight average molecular weight of 100 to 1,000,000 g/mol,
Thermally conductive high internal phase emulsion.
The method of claim 1,
The thermally conductive high internal phase emulsion contains 75 to 95% by volume of a liquid metal dispersed phase.
The method of claim 1,
The thermally conductive high internal phase emulsion has a thermal conductivity of 2 W/m·K or more at 25° C., a thermally conductive high internal phase emulsion.
The method of claim 1,
The thermally conductive high internal phase emulsion has a thermal conductivity of 8 W/m·K or more at 25° C., a thermally conductive high internal phase emulsion.
The method of claim 1,
The thermally conductive high internal phase emulsion has electrical insulation properties, a thermally conductive high internal phase emulsion.
The method of claim 1,
The polymer resin is at least one selected from the group consisting of epoxy resin, (meth)acrylate resin, poly-urethane, ABS, polyester and polyolefin, a thermally conductive high internal phase emulsion.
delete The method of claim 1,
The liquid metal dispersed phase is a thermally conductive high internal phase emulsion in which an oxide thin film is formed on the surface.
The method of claim 1,
The liquid metal dispersed phase is 5㎛ to 800㎛ Thermally conductive high internal phase emulsion in the form of droplets of the size.
The method of claim 1,
The liquid metal is gallium, gallium-indium alloy, gallium-tin alloy, K ₂₃ Cs ₇₇ , Rb ₁₃ Cs ₈₇ , Na ₂₂ K ₇₈ , Ubdakkiy 117, SbPbInBi, InCuBi, Wood's metal, Fields metal ( Field's metal) and at least one selected from the group consisting of Indalloy 1E, a thermally conductive high internal phase emulsion.
The method of claim 1,
A thermally conductive high internal phase emulsion further comprising thermally conductive particles present at an interface between the polymer resin continuous phase and the liquid metal dispersed phase.
The method of claim 11,
The thermally conductive particles are adsorbed on the liquid metal dispersion phase, a thermally conductive high internal phase emulsion.
A heat dissipating composite material formed from the thermally conductive high internal phase emulsion of claim 1.

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