KR102169506B1 - 빔 주사 장치, 빔 주사 방법, 및 패턴 묘화 장치 - Google Patents
빔 주사 장치, 빔 주사 방법, 및 패턴 묘화 장치 Download PDFInfo
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- KR102169506B1 KR102169506B1 KR1020177025837A KR20177025837A KR102169506B1 KR 102169506 B1 KR102169506 B1 KR 102169506B1 KR 1020177025837 A KR1020177025837 A KR 1020177025837A KR 20177025837 A KR20177025837 A KR 20177025837A KR 102169506 B1 KR102169506 B1 KR 102169506B1
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Classifications
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- G—PHYSICS
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- G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
- G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
- G03F7/70—Microphotolithographic exposure; Apparatus therefor
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- G03F7/70358—Scanning exposure, i.e. relative movement of patterned beam and workpiece during imaging
- G03F7/70366—Rotary scanning
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- G02B26/00—Optical devices or arrangements for the control of light using movable or deformable optical elements
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- G—PHYSICS
- G02—OPTICS
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- G02B26/08—Optical devices or arrangements for the control of light using movable or deformable optical elements for controlling the direction of light
- G02B26/10—Scanning systems
- G02B26/12—Scanning systems using multifaceted mirrors
- G02B26/124—Details of the optical system between the light source and the polygonal mirror
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- G—PHYSICS
- G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
- G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
- G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
- G03F7/20—Exposure; Apparatus therefor
-
- G—PHYSICS
- G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
- G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
- G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
- G03F7/20—Exposure; Apparatus therefor
- G03F7/24—Curved surfaces
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
- H01L21/027—Making masks on semiconductor bodies for further photolithographic processing not provided for in group H01L21/18 or H01L21/34
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
- H01L21/027—Making masks on semiconductor bodies for further photolithographic processing not provided for in group H01L21/18 or H01L21/34
- H01L21/0271—Making masks on semiconductor bodies for further photolithographic processing not provided for in group H01L21/18 or H01L21/34 comprising organic layers
- H01L21/0273—Making masks on semiconductor bodies for further photolithographic processing not provided for in group H01L21/18 or H01L21/34 comprising organic layers characterised by the treatment of photoresist layers
- H01L21/0274—Photolithographic processes
Landscapes
- Physics & Mathematics (AREA)
- General Physics & Mathematics (AREA)
- Engineering & Computer Science (AREA)
- Optics & Photonics (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- Manufacturing & Machinery (AREA)
- Computer Hardware Design (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Power Engineering (AREA)
- Exposure And Positioning Against Photoresist Photosensitive Materials (AREA)
- Mechanical Optical Scanning Systems (AREA)
Applications Claiming Priority (3)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP2015057906 | 2015-03-20 | ||
JPJP-P-2015-057906 | 2015-03-20 | ||
PCT/JP2016/058644 WO2016152758A1 (ja) | 2015-03-20 | 2016-03-18 | ビーム走査装置、ビーム走査方法、および描画装置 |
Related Child Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
KR1020207005939A Division KR102195908B1 (ko) | 2015-03-20 | 2016-03-18 | 패턴 묘화 장치 및 패턴 묘화 방법 |
Publications (2)
Publication Number | Publication Date |
---|---|
KR20170127460A KR20170127460A (ko) | 2017-11-21 |
KR102169506B1 true KR102169506B1 (ko) | 2020-10-23 |
Family
ID=56979222
Family Applications (2)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
KR1020207005939A Active KR102195908B1 (ko) | 2015-03-20 | 2016-03-18 | 패턴 묘화 장치 및 패턴 묘화 방법 |
KR1020177025837A Active KR102169506B1 (ko) | 2015-03-20 | 2016-03-18 | 빔 주사 장치, 빔 주사 방법, 및 패턴 묘화 장치 |
Family Applications Before (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
KR1020207005939A Active KR102195908B1 (ko) | 2015-03-20 | 2016-03-18 | 패턴 묘화 장치 및 패턴 묘화 방법 |
Country Status (5)
Country | Link |
---|---|
JP (2) | JP6740999B2 (ja) |
KR (2) | KR102195908B1 (ja) |
CN (5) | CN110596888B (ja) |
TW (3) | TWI698662B (ja) |
WO (1) | WO2016152758A1 (ja) |
Families Citing this family (6)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
CN110596888B (zh) * | 2015-03-20 | 2022-04-01 | 株式会社尼康 | 图案描绘装置 |
WO2018066286A1 (ja) * | 2016-10-04 | 2018-04-12 | 株式会社ニコン | ビーム走査装置およびパターン描画装置 |
TWI736621B (zh) * | 2016-10-04 | 2021-08-21 | 日商尼康股份有限公司 | 圖案描繪裝置及圖案描繪方法 |
WO2019065224A1 (ja) * | 2017-09-26 | 2019-04-04 | 株式会社ニコン | パターン描画装置 |
WO2019082850A1 (ja) | 2017-10-25 | 2019-05-02 | 株式会社ニコン | パターン描画装置 |
CN114740630B (zh) * | 2022-06-15 | 2022-09-16 | 西安炬光科技股份有限公司 | 一种扫描光学系统及激光应用终端 |
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JP2010066402A (ja) * | 2008-09-09 | 2010-03-25 | Sharp Corp | 光走査装置及び画像形成装置 |
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CN110596886B (zh) | 2021-12-07 |
CN110596887B (zh) | 2022-04-01 |
KR20170127460A (ko) | 2017-11-21 |
TWI718030B (zh) | 2021-02-01 |
TW201704889A (zh) | 2017-02-01 |
JPWO2016152758A1 (ja) | 2017-12-28 |
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TW202028887A (zh) | 2020-08-01 |
CN110596888B (zh) | 2022-04-01 |
JP7074160B2 (ja) | 2022-05-24 |
CN111638631B (zh) | 2023-03-10 |
KR102195908B1 (ko) | 2020-12-29 |
JP6740999B2 (ja) | 2020-08-19 |
TW202024716A (zh) | 2020-07-01 |
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CN110596886A (zh) | 2019-12-20 |
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CN107430272A (zh) | 2017-12-01 |
CN110596887A (zh) | 2019-12-20 |
CN110596888A (zh) | 2019-12-20 |
KR20200024956A (ko) | 2020-03-09 |
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