KR102169281B1 - Hybrid laser bonding device - Google Patents

Abstract

The present invention relates to a hybrid laser bonding device including upper and lower heater heating in which poles and panels are not thermally deformed and more specifically, to the hybrid laser bonding device including upper and lower heater heating in which the poles and panels are not thermally deformed, wherein in the past, electronic devices were bonded with an ACF by setting temperature, pressure, and time to generate thermal energy during ACF bonding, but in the case of the existing method, a lot of thermal energy was required to cure the ACF, which is a bonding agent. Therefore, in the present invention, in a state in which the temperature of the tool and the backup part in contact with the product is maintained at a constant temperature at which the ACF is not cured, the insufficient thermal energy is compensated by using a laser to satisfy target temperature conditions required for the ACF required during bonding.

Description

Hybrid laser bonding device including upper and lower heater heating in which poles and panels are not thermally deformed {Hybrid laser bonding device}

In the present invention, when bonding objects to be bonded using ACF, a pole that can supplement the remaining heat energy required for heating ACF by using a laser while maintaining the temperature of the upper/lower tool and the backup unit at a constant temperature. And a hybrid laser bonding apparatus including upper and lower heater heating in which the panel is not thermally deformed.

In general, anisotropic conductive film (hereinafter referred to as ACF) is a particulate form of conductive particles (metal particles, carbon, metal coated plastic particles), adhesives (thermoplastic or thermosetting), and additives (dispersants). And the like are mixed to form a conductive adhesive layer in the form of a thin film. The ACF has excellent connection reliability, fine connectivity, and low-temperature connectivity, so it can be widely used for electrical connection such as display panel and TCP (Tape Carrier Package) or Printed Circuit Board and TCP (Tape Carrier Package). In addition, in recent years, it has been used as a mounting material for directly mounting the Bare Chip on a flexible printed circuit board (FPCB) or a glass substrate.

In general, the ACF is provided in the form of an ACF tape composed of an ACF layer to be bonded and an ACF protective film layer protecting the ACF layer. It is bonded to the ACF layer display panel or the printed circuit board by a predetermined length.

In the case of bonding using such ACF, conventionally, heat is applied from the top or bottom to heat the ACF.In this case, heat energy is lost to the surroundings during compression, and the heat heated in this way is Deformation or bending damage is given to peripheral devices and poles of panels.

Moreover, in the case of providing the necessary heat energy to the ACF by using a separate heating device, it takes a long time to melt the ACF, and it takes a long time to lower this temperature even after bonding is completed, making it impossible to configure various temperature profiles. There was also the problem of doing it.

Korean Patent Publication No. 10-1443707 (registered on September 17, 2014)

The present invention was conceived to solve the above problems, and an object of the present invention is a tool for main pressure during bonding and a backup unit for supporting the panel during main pressure in bonding a COF or chip to a panel using ACF While maintaining the temperature at a constant temperature so that ACF does not melt, the remaining thermal energy required up to the target temperature of the ACF is replenished through a laser. When heating ACF using only the heating device on the back-up side, Damages such as damage to peripheral devices by heat or bending of the poles of the panel can be prevented in advance, and the time to the temperature required for ACF heating and the time to be lowered after bonding can be shortened, according to various bonding conditions. It relates to a hybrid laser bonding apparatus including upper and lower heater heating in which poles and panels are not thermally deformed to configure various temperature profiles.

Other objects and advantages of the present invention will be described below, and will be understood by examples of the present invention. Further, the objects and advantages of the present invention can be realized by means and combinations shown in the claims.

The present invention is a means for solving the above problems,

Panel 20 to which the pole 10 is attached to one side; ACF (30) formed on the upper surface of the end of the panel (20); A chip 40 correspondingly bonded to the upper portion of the ACF 30; A tool 61 installed above the chip 40 to pressurize the chip 40 to the panel 20, and a transparent material under the panel 20, and when the tool 61 is pressurized, the panel ( 20) consists of a backup unit 62 for supporting, the tool 61 and the backup unit 62 are lower than the curing temperature of the ACF 30 and a preset temperature at which the chip 40 is not deformed. A heating unit 60 to heat the ACF 30; By irradiating a laser from the bottom of the backup unit 62 to the top, the laser passes through the backup unit 62 and the panel 20 to apply heat to the ACF 30, so that the chip 40 and the panel 20 A laser unit 70 to be bonded; It characterized in that it comprises a.

As described above, the present invention has an effect of blocking thermal energy lost to a tool and a backup unit during thermal compression bonding for ACF bonding.

In addition, in the present invention, after maintaining the tool for the main pressure and the backup unit for supporting the same at a constant temperature, it is possible to heat the ACF through a laser in a short time.

In addition, the present invention has the effect of minimizing the thermal deformation (Pol Damage/Warpage) of the product.

In addition, the present invention has the effect of possible configuration of various temperature profiles.

In addition, the present invention has the effect of implementing Flexible & Glass Panel Bonding.

In addition, the present invention has the effect of minimizing the amount of expansion (increase) in the case of Fine Pitch (the gap between parts becomes narrower).

1 is a view showing a first embodiment of a hybrid laser bonding apparatus including upper and lower heater heating in which poles and panels are not thermally deformed according to the present invention.
2 is a view showing a second embodiment of a hybrid laser bonding apparatus including upper and lower heater heating in which poles and panels are not thermally deformed according to the present invention.
3 is a graph of an embodiment showing that various temperature profiles can be configured during bonding through a hybrid laser bonding device including upper and lower heater heating in which poles and panels are not thermally deformed according to the present invention.
4 is a view showing the formation of chips or COFs during multi-bonding in a hybrid laser bonding apparatus including upper and lower heater heating in which poles and panels are not thermally deformed according to the present invention.
5 is a view of an embodiment showing a state in which the size of the laser is irradiated to fit the chip by irradiating the laser by applying a masking plate to FIG. 4B.

Before describing various embodiments of the present invention in detail, it will be appreciated that the application is not limited to the details of configurations and arrangements of elements described in the following detailed description or illustrated in the drawings. The present invention may be implemented and practiced in different embodiments and may be performed in various ways. Also, the device or element orientation (eg "front", "back", "up", "down", "top", "bottom" The expressions and predicates used herein with respect to terms such as ", "left", "right", "lateral"), etc. are used only to simplify the description of the present invention, and related devices Or you may find that the element simply indicates or does not mean that it should have a specific orientation. Further, terms such as “first” and “second” are used in this application and the appended claims for purposes of explanation and are not intended to represent or imply any relative importance or spirit.

The present invention has the following features to achieve the above object.

Hereinafter, exemplary embodiments of the present invention will be described in detail with reference to the accompanying drawings. Prior to this, terms or words used in the specification and claims should not be construed as being limited to their usual or dictionary meanings, and the inventors appropriately explain the concept of terms in order to explain their own invention in the best way. Based on the principle that it can be defined, it should be interpreted as a meaning and concept consistent with the technical idea of the present invention.

Accordingly, the embodiments described in the present specification and the configurations shown in the drawings are only the most preferred embodiment of the present invention, and do not represent all the technical spirit of the present invention, and thus various alternatives that can be substituted for them at the time of application It should be understood that there may be equivalents and variations.

Hereinafter, with reference to FIGS. 1 to 5, a hybrid laser bonding apparatus including upper and lower heater heating in which the pole and panel are not thermally deformed according to an exemplary embodiment of the present invention will be described in detail.

Hybrid laser bonding apparatus including upper and lower heater heating in which poles and panels are not thermally deformed according to the present invention include panel 20, ACF 30, Anisotropic Conductive Film, chip 40, Chip, COF 50, Chip On Film), a heating part 60, a buffer material 63, a laser part 70, and a masking plate 80.

First of all, the present invention proposes two embodiments.

1. In the first embodiment, the panel 20 and the chip 40 are bonded together, and a laser is irradiated from the bottom of the panel 20 toward the backup unit 62.

The panel 20 is a substrate, and the pole 10, which is a polarizing film on the upper surface, is formed on one surface (upper surface or lower surface or upper/lower surface) with a size smaller than the size of the panel 20, so that the pole 10 The chip 40 is bonded to the upper surface of the edge of the panel 20 in which) is not formed through the ACF 30.

The ACF 30 is formed on the upper surface of the end of the panel 20 described above, and the chip 40 is raised to correspond to the upper portion of the ACF 30, so that the ACF 30 is attached to the panel 20 described above. It is bonded to the panel 20 through.

The heating unit 60 is composed of a tool 61 and a backup unit 62,

The tool 61 is vertically spaced apart from the top of the chip 40, and is installed so as to move up and down, and is used to press the chip 40 to the panel 20,

The backup part 62 is installed in a transparent material under the panel 20 so as to face the tool 61, and serves to support the panel 20 when the tool 61 is pressurized (to be described later). In the second embodiment, since the laser is installed on the upper part of the tool 61 and irradiated to the lower part, the backup part 62 is not a transparent material, but the tool 61 is formed of a transparent material, so that the laser can be transmitted. To be.)

In addition, the tool 61 and the backup unit 62 are heated by having various heating devices therein, so that heat is applied to the ACF 30 when the main pressure is applied. At this time, the tool 61 and the backup unit 62 The heating temperature of the tool 61 has a heating temperature of 90 to 100°C, and the backup unit 62 has a heating temperature of 60 to 100°C, and the curing temperature of the ACF 30 (ex: ACF 30) is a suitable target. If the temperature is 160 ~ 170 ℃ or higher, ACF 30 is more than the proper target temperature, the ACF 30 is cured), while lower than the chip 40 and peripheral devices such as poles 10 and panel 20, etc. The ACF 30 is heated to a preset temperature (maximum temperature) that is not deformed.

At this time, the pre-set maximum temperature at which the poles 10 and panel 20 are not thermally deformed means that there are various types of main pressure targets subject to main pressure depending on the model, and the type of ACF 30 is also different. (This is because the type of bonding object and ACF, and various temperature information according to each type may be in a DB in the control unit 30 in advance.), at the time of main pressure (bonding compression), the tool on the top of the display 20 ( 61) The upper ambient temperature T1 measured by the first temperature sensor 91 installed around the pressurized position, and the lower measured by the second temperature sensor 92 installed around the backup unit 62 under the display 20 The ambient temperature T2 is received from the control unit 93 and is determined by the control unit 93 based on the upper ambient temperature T1 and the lower ambient temperature T2.

As the tool 61 and the backup unit 62 are heated to a low temperature (preset temperature), the deformation of the tool 61 and the backup unit 62 is reduced, and the product (chip 40 ), the pole 10, the panel 20) has an effect that does not cause thermal deformation.

In addition, the tool 61 is used in a structure in which the entire tool 61 is heated, or only the portion of the lowermost tip 64 in contact with the pressed object (chip 40 or COF 50 to be described later) is heated. .

The cushioning material 63 is integrally installed at the lowermost portion of the tool 61 that is in contact with the chip 40, and is made of Teflon & transparent silicon, and the chip through the tool 61 ( During the main pressure of 40), the chip 40 has a buffering effect so as not to be damaged.

The laser unit 70 is spaced apart from the lower end of the above-described backup unit 62 so as to face the ACF 30, and is a part to which the laser is irradiated. Accordingly, the laser irradiated from the laser unit 70 sequentially passes through the backup unit 62 and the panel 20 to apply heat to the ACF 30, thereby heating the tool 61 and the backup unit 62 The furnace supplements the thermal energy required for heating the insufficient ACF 30 so that the chip 40 and the panel 20 are bonded by the ACF 30.

Of course, in order to penetrate the laser, the backup unit 62 is made of a transparent material such as quartz.

Through the use of the laser unit 70 using a laser, the insufficient thermal energy of the ACF 30 heated by the tool 61 and the backup unit 62 (thermal energy required for the curing temperature of the ACF 3A0) is supplemented. Since it is, as shown in Fig. 3, it is possible to configure various temperature profiles. That is, it is possible to shorten the initial start rising temperature time and the end falling temperature time, start at a low temperature and increase the end temperature, and control the start/maintain/end temperature.

2. In the second embodiment, the overall configuration is the same, but if the panel 20 and the chip 40 are bonded in the first embodiment, the panel 20 and the COF 50 are bonded in this second embodiment, The irradiation direction of the laser is irradiated through the tool 61 from the upper surface of the panel 20, not the lower end as in the first embodiment. Of course, for the transmission of the laser, the tool 61 is formed of a transparent material.

The panel 20 is a substrate, and the pole 10, which is a polarizing film, is formed on the upper surface to have a size smaller than the size of the panel 20, so that the pole 10 is not formed on the upper surface of the edge of the panel 20 The chip 40 is bonded through the ACF 30.

The ACF 30 is formed on the top surface of the end of the panel 20 described above, and the COF 50 (a method in which the semiconductor chip 40 is mounted on a thin film type printed circuit board (PCB)) is an ACF. (30) It is raised to correspond to the upper portion, and is bonded to the panel 20 through the ACF 30 to the panel 20 described above.

The heating unit 60 is composed of a tool 61 and a backup unit 62,

The tool 61 is vertically spaced apart from the top of the COF 50, and is installed to be able to move up/down upwards and downwards, and is used to pressurize the COF 50 to the panel 20,

The backup part 62 is installed to face the tool 61 and serves to support the panel 20 when the tool 61 is pressed.

In addition, the tool 61 and the backup unit 62 are heated by having various heating devices therein, so that heat is applied to the ACF 30 when the main pressure is applied. At this time, the tool 61 and the backup unit 62 The heating temperature of the tool 61 has a heating temperature of 90 to 100°C, and the backup unit 62 has a heating temperature of 60 to 100°C, and the curing temperature of the ACF 30 (ex: ACF 30) is a suitable target. If the temperature is higher than 160 ~ 170 ℃, ACF (30) is higher than the appropriate target temperature, the ACF (30) is hardened), while the COF (50), poles 10 and panel 20 are not thermally deformed. It is to heat the ACF (30) to a preset maximum temperature that is not.

As the tool 61 and the backup unit 62 are heated to a low temperature (preset temperature), the deformation of the tool 61 and the backup unit 62 decreases, and the product (COF 50 ), the pole 10, the panel 20) has an effect that does not cause thermal deformation.

In addition, the tool 61 is used in a structure in which the entire tool 61 is heated, or only the portion of the lowermost tip 64 in contact with the compression object (COF 50) is heated.

The cushioning material 63 is integrally installed in the lowermost portion of the tool 61 that is in contact with the chip 40, and when the chip 40 is pressed through the tool 61, the chip 40 is not damaged. It was designed to have a buffering effect.

In addition, the buffer material 63 in this second embodiment is irradiated because heat has to be applied to the ACF 30 through the inside of the tool 61, the buffer material 63 and the COF 50 to be described later. In order to transmit the laser, a transparent sheet should be used for the buffer material 63, and a transparent material should be used for the COF 50 as well.

The laser unit 70 is installed spaced apart from the top of the above-described tool 61 so as to face the ACF 30, and is a part where the laser is vertically irradiated. Accordingly, after the laser irradiated from the laser unit 70 passes through the tool 61 formed of a transparent material, the tool 61 passes through the buffer material 63, which is a transparent sheet, and the COF 50 of a transparent material, By applying heat to the ACF 30, the COF 50 and the panel 20 are bonded.

The laser unit 70 supplements the thermal energy required for heating the ACF 30 (heat energy required for the curing temperature of the ACF 30), which is insufficient in the heating furnace of the tool 61 and the backup unit 62, and To allow the panel 20 to be bonded by the ACF (30).

In the case of the first and second embodiments described above,

A masking plate 80 for adjusting the size of the laser may be provided.

This masking plate 80, when bonding a plurality of chips 40 or a plurality of COFs 50 as a bonding object to the panel 20 at a preset interval,

In order to adjust the size of the irradiated laser beam according to the size of the bonding object, a masking plate 80 in which a plurality of through holes 81 corresponding to the size of a plurality of bonding objects are perforated at the bottom of the laser unit 70 is provided. It is provided so that the laser is irradiated according to the size of the bonding object while passing through only the size of the through hole 81.

In other words, in the case (B) in which a large number of chips 40 are formed during the multi-bonding of FIG. 4 as shown in FIG. 5, by applying the masking plate 80 and irradiating the laser, the size of the laser is adjusted to fit the chip 40. As shown in the state of irradiation, since the laser cannot adjust the size of the laser beam according to the chip 40 or COF 50 model (shape or size), when the model of the chip 40 or COF 50 is changed, Corresponding to this shape, by using the masking plate 80, it is easy to change the model of the chip 40 or the COF 50 and shorten the time.

In addition, when a single laser is irradiated to multiple chips 40 or multiple COFs 50 at the same time, the laser is irradiated while being irradiated according to the size or shape of each chip 40 or COF 50 There is an effect of increasing the accuracy of the location to be performed.

As described above, although the present invention has been described by the limited embodiments and drawings, the present invention is not limited thereto, and the technical spirit of the present invention and the following by those of ordinary skill in the technical field to which the present invention pertains. It goes without saying that various modifications and changes are possible within the equivalent range of the claims to be described.

10: pole 20: panel
30: ACF 40: chip
50: COF 60: heating part
61: tool 62: backup unit
63: cushioning material 64: tip
70: laser unit 80: masking plate
81: through hole 91: first temperature sensor
92: second temperature sensor 93: control unit

Claims (7)

Panel 20 to which the pole 10 is attached to one side;
ACF (30) formed on the upper surface of the end of the panel (20);
A chip 40 correspondingly bonded to the upper portion of the ACF 30;
A tool 61 installed above the chip 40 to pressurize the chip 40 onto the panel 20, and a tool 61 installed below the panel 20, formed of a transparent material for laser transmission, and (61) It consists of a backup unit 62 for supporting the panel 20 during main pressure, but the tool 61 and the backup unit 62 are preset in which the pole 10 and the panel 20 are not thermally deformed. To heat the ACF 30 to a maximum temperature, the tool 61 is a heating unit 60 having a heating temperature of 90 ~ 100 ℃, the backup unit 62 is 60 ~ 100 ℃;
By irradiating a laser from the bottom of the backup part 62 to the top, the laser passes through the backup part 62 and the panel 20 to apply heat to the ACF 30, so that the tool 61 and the backup part ( The heating furnace of 62) supplements the thermal energy required for the insufficient ACF 30 curing temperature, so that the chip 40 and the panel 20 are bonded to each other by the ACF 30; and a laser unit 70 is included. ,
The tool 61 allows the entire tool 61 to be heated, or only the portion of the lowermost tip 64 in contact with the chip 40 is heated,
The tool 61 is provided with a buffer material 63 made of a transparent material for buffering when pressed at the lowermost end in contact with the chip 40,
When bonding a plurality of chips 40 as a bonding object to the panel 20 at preset intervals, in order to adjust the size of the irradiated laser beam according to the size of the bonding object, the lower portion of the laser unit 70 A masking plate 80 in which a plurality of through holes 81 corresponding to the sizes of a plurality of bonding objects are perforated is provided, so that the laser penetrates only as much as the through hole 81 and irradiates according to the size of the bonding object,
The preset maximum temperature at which poles 10 and panels 20 are not thermally deformed is
During the main pressure, the upper ambient temperature T1 measured by the first temperature sensor 91 installed around the pressing position of the tool 61 on the upper portion of the display 20 and the backup unit 62 at the lower portion of the display 20 The lower ambient temperature T2 measured by the second temperature sensor 92 is received from the control unit 93, and is determined by the control unit 93 based on the upper ambient temperature T1 and the lower ambient temperature T2. Hybrid laser bonding apparatus including upper and lower heater heating in which the pole and panel are not thermally deformed.
Panel 20 to which the pole 10 is attached to one side;
ACF (30) formed on the upper surface of the end of the panel (20);
A COF 50 correspondingly bonded to an upper portion of the ACF 30;
It is installed on the upper part of the COF 50 and presses the COF 50 to the panel 20, but the tool 61 is formed of a transparent material for laser transmission, and is installed under the panel 20, and the COF ( 50) It is made of a backup unit 62 for supporting the panel 20 during main pressure, but the tool 61 and the backup unit 62 are pre-set maximum in which the pole 10 and the panel 20 are not thermally deformed. To heat the ACF 30 to a temperature, the tool 61 is a heating unit 60 having a heating temperature of 90 ~ 100 ℃, the backup unit 62 is 60 ~ 100 ℃;
By irradiating a laser from the top of the tool 61 to the bottom, the laser penetrates the tool 61 to apply heat to the ACF 30, so that the heating furnace between the tool 61 and the backup unit 62 is insufficient. Including; a laser unit 70 for supplementing the thermal energy required for the ACF 30 curing temperature so that the COF 50 and the panel 20 are bonded by the ACF 30,
The tool 61 allows the entire tool 61 to be heated, or only the portion of the lowermost tip 64 in contact with the COF 50 is heated,
The tool 61 is provided with a buffer material 63 made of a transparent material for buffering when pressing, at the lowest end in contact with the COF 50,
When bonding a plurality of COFs 50, which are bonding objects, to the panel 20 at preset intervals, in order to adjust the size of the irradiated laser beam according to the size of the bonding object, the lower part of the laser unit 70 A masking plate 80 in which a plurality of through holes 81 corresponding to the sizes of a plurality of bonding objects are perforated is provided, so that the laser penetrates only as much as the through hole 81 and irradiates according to the size of the bonding object,
The preset maximum temperature at which poles 10 and panels 20 are not thermally deformed is
During the main pressure, the upper ambient temperature T1 measured by the first temperature sensor 91 installed around the pressing position of the tool 61 on the upper portion of the display 20 and the backup unit 62 at the lower portion of the display 20 The lower ambient temperature T2 measured by the second temperature sensor 92 is received from the control unit 93, and is determined by the control unit 93 based on the upper ambient temperature T1 and the lower ambient temperature T2. A hybrid laser bonding device including upper and lower heater heating in which the pole and panel are not thermally deformed, characterized in that.
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