KR102158825B1 - Apparatus for picking up semiconductor packages - Google Patents

Abstract

A device for picking up semiconductor packages, the device comprising: a vacuum panel having an adsorption area in which vacuum holes for vacuum adsorption of semiconductor packages are formed, and a vacuum chamber coupled to an upper portion of the vacuum panel and communicating with the vacuum holes And a main body forming a body, a blocking unit disposed in the vacuum chamber and configured to adjust the size of the adsorption area, and a driving unit for reducing the size of the adsorption area by bringing the blocking unit into close contact with the edge of the adsorption area .

Description

Semiconductor package pickup device {Apparatus for picking up semiconductor packages}

Embodiments of the present invention relate to an apparatus for picking up semiconductor packages. More specifically, it relates to an apparatus for picking up the semiconductor packages in order to transport the cut semiconductor packages in a cutting and sorting process for the semiconductor packages.

In general, semiconductor devices can be formed on a silicon wafer used as a semiconductor substrate by repeatedly performing a series of manufacturing processes, and the semiconductor devices formed as described above are formed through a dicing process, a die bonding process, and a molding process. It can be manufactured as a semiconductor strip made of packages.

The semiconductor strip manufactured as described above may be individualized into a plurality of semiconductor packages through a cutting and sorting process, and may be classified according to determination of good or defective products. For example, after loading the semiconductor strip on a chuck table, it may be individualized into a plurality of semiconductor packages using a cutting blade, and the individualized semiconductor packages may be cleaned and dried and then inspected by a vision module. . In addition, according to the inspection result by the vision module, it may be classified into good products and defective products.

The semiconductor packages may be transferred to good and defective trays, respectively, through a buffer table for performing an inspection process and a pallet table for sorting. For example, the semiconductor packages may be transferred to the good and defective trays via respective tables by a semiconductor package pickup device and a transfer device for moving the semiconductor package.

The semiconductor package pickup device may include a lower panel provided with a plurality of vacuum holes for adsorbing the semiconductor packages, and an upper panel disposed on the lower panel and configured to provide vacuum to the vacuum holes. A vacuum chamber connected to the vacuum holes may be provided between the lower panel and the upper panel, and the vacuum chamber may be connected to a vacuum pump through a vacuum pipe.

The semiconductor packages may be picked up by the pickup device and then transferred by the transfer device, and may be placed on a buffer table or a pallet table for inspection or sorting.

On the other hand, when performing a place operation on the picked up semiconductor packages, the vacuum provided to the vacuum holes may be released or air may be supplied into the vacuum chamber, whereby the semiconductor packages are transferred to the buffer table or the pallet table. Can be placed on top. However, the pressure applied to the vacuum holes may be different due to a difference in distance between the vacuum pipe and the vacuum holes, and thus an error may occur in pick-up and place operations of the semiconductor packages.

In addition, since the vacuum holes are disposed to correspond to the semiconductor packages, when the quantity or size of the semiconductor packages is changed, replacement of the semiconductor package pickup device may be required. In particular, when various types of semiconductor package pickup devices are prepared in advance and the semiconductor package pickup devices are replaced as necessary, a lot of cost and time may be required.

Korean Patent Publication No. 10-0604098 (2006.07.18)

Embodiments of the present invention provide a semiconductor package pick-up device capable of coping with various semiconductor packages to solve the above-described problems, and also capable of equalizing internal pressure of vacuum holes for pick-up operation of the semiconductor packages. It has its purpose to provide.

According to embodiments of the present invention, a semiconductor package pickup device includes: a vacuum panel having an adsorption region in which vacuum holes for vacuum adsorption of semiconductor packages are formed, and a vacuum coupled to an upper portion of the vacuum panel and communicating with the vacuum holes. A body forming a chamber, a blocking unit disposed in the vacuum chamber and configured to adjust the size of the adsorption area, and a driving unit for reducing the size of the adsorption area by bringing the blocking unit into close contact with the edge of the adsorption area. can do.

According to embodiments of the present invention, the blocking unit includes a first blocking member that is in close contact with an edge portion of the adsorption area, and is disposed inside the first blocking member and in close contact with an inside of the edge portion of the adsorption area It may include a second blocking member, a support member supporting the first and second blocking members, and elastic members disposed between the first and second blocking members and the support member. When the support member is lowered by the driving part, the first blocking member may be in close contact with the adsorption region before the second blocking member.

According to embodiments of the present invention, the blocking unit may have a rectangular ring shape or a bar shape.

According to embodiments of the present invention, a baffle plate having a plurality of through holes may be disposed in the vacuum chamber.

According to embodiments of the present invention, at least one vacuum unit for providing a vacuum in the vacuum chamber may be disposed in the vacuum chamber.

According to embodiments of the present invention, the vacuum unit may be connected to a compressed air source, and may have a hollow pipe shape to provide a flow path of air provided from the compressed air source in the vacuum chamber. In addition, the vacuum unit may have at least one opening connecting the vacuum chamber and the flow path of the air to provide the vacuum in the vacuum chamber.

According to embodiments of the present invention, the main body may include an upper panel disposed above the vacuum panel, and sidewalls disposed between the vacuum panel and the upper panel and forming the vacuum chamber.

According to embodiments of the present invention, the upper panel may include a plurality of vacuum pipes connected to a vacuum pump and a plurality of second vacuum holes connecting the vacuum pipes and the vacuum chamber.

According to embodiments of the present invention, a plurality of vacuum holes may correspond to each of the semiconductor packages.

According to the embodiments of the present invention as described above, an apparatus for picking up semiconductor packages includes a vacuum panel having an adsorption region in which a plurality of vacuum holes are formed, and a vacuum coupled to an upper portion of the vacuum panel and communicating with the vacuum holes. It may include a body forming a chamber. A baffle plate for uniformizing the internal pressure of the vacuum holes may be disposed in the main body in a horizontal direction, whereby the pickup and place operations of the semiconductor packages may be stably performed.

In particular, even when the size of the semiconductor packages is changed by configuring the vacuum panel so that a plurality of vacuum holes correspond to one semiconductor package, replacement of the semiconductor package pickup device is unnecessary. That is, since it is possible to easily cope with various semiconductor packages having different sizes, the manufacturing cost of the semiconductor packages can be greatly reduced.

In addition, by disposing a blocking unit for adjusting the size of the adsorption region in the vacuum chamber, it is possible to stably perform pickup and place operations for the semiconductor packages without vacuum loss even when the sizes of the semiconductor packages are changed. .

1 is a schematic configuration diagram illustrating a semiconductor package pickup apparatus according to an embodiment of the present invention.
2 and 3 are schematic cross-sectional views illustrating the semiconductor package pickup device illustrated in FIG. 1.
4 is a schematic enlarged cross-sectional view for explaining the vacuum panel illustrated in FIG. 2.
FIG. 5 is a schematic enlarged cross-sectional view illustrating a state in which semiconductor packages of different sizes are adsorbed on the vacuum panel shown in FIG. 2.
6 is a schematic cross-sectional view for explaining another example of the vacuum panel shown in FIG. 1.
7 is a schematic enlarged cross-sectional view for describing the vacuum panel shown in FIG. 6.
8 and 9 are schematic cross-sectional views for explaining the operation of the blocking unit and the driving unit shown in FIGS. 2 and 3.
10 and 11 are schematic cross-sectional views illustrating a semiconductor package pickup device according to another exemplary embodiment of the present invention.

Hereinafter, a head replacement device and a die bonding system including the same according to an embodiment of the present invention will be described in detail with reference to the accompanying drawings. In the present invention, various modifications may be made and various forms may be applied, and specific embodiments will be illustrated in the drawings and described in detail in the text. However, this is not intended to limit the present invention to a specific form disclosed, it should be understood to include all changes, equivalents, and substitutes included in the spirit and scope of the present invention. In describing each drawing, similar reference numerals have been used for similar elements. In the accompanying drawings, the dimensions of the structures are shown to be enlarged than the actual size for clarity of the present invention.

Terms such as first and second may be used to describe various components, but the components should not be limited by the terms. These terms are used only for the purpose of distinguishing one component from another component. For example, without departing from the scope of the present invention, a first element may be referred to as a second element, and similarly, a second element may be referred to as a first element.

The terms used in the present application are only used to describe specific embodiments, and are not intended to limit the present invention. Singular expressions include plural expressions unless the context clearly indicates otherwise. In the present application, terms such as "comprise" or "have" are intended to designate the presence of features, numbers, steps, actions, components, parts, or a combination thereof described in the specification, and one or more other features It is to be understood that the presence or addition of elements or numbers, steps, actions, components, parts, or combinations thereof, does not preclude in advance the possibility of being added.

In addition, unless otherwise defined, all terms used herein, including technical or scientific terms, have the same meaning as commonly understood by those of ordinary skill in the art to which the present invention belongs. Terms as defined in a commonly used dictionary should be interpreted as having a meaning consistent with the meaning in the context of the related technology, and should not be interpreted as an ideal or excessively formal meaning unless explicitly defined in this application. Does not.

1 is a schematic configuration diagram illustrating a semiconductor package pickup device according to an embodiment of the present invention, and FIGS. 2 and 3 are schematic cross-sectional views illustrating the semiconductor package pickup device illustrated in FIG. 1.

1 to 3, the semiconductor package pickup device 100 according to an embodiment of the present invention is used to pick up a plurality of semiconductor packages and to put the picked up semiconductor packages 10 on a table. I can. In particular, in a cutting and sorting process for the semiconductor packages 10, the semiconductor packages 10 may be picked up to transfer the semiconductor packages 10 located on the first table onto the second table, The semiconductor packages 10 may be placed on the second table.

In order to transfer the semiconductor packages 10, the semiconductor package pickup device 100 may be connected to a separate transfer device 200 as shown in FIG. 1. For example, the transfer device 200 may move the semiconductor package pickup device 100 in vertical and horizontal directions, and may have a rectangular coordinate robot shape for this purpose.

According to an embodiment of the present invention, the semiconductor package pickup device 100 includes a vacuum panel 110 having an adsorption region in which vacuum holes 112 for vacuum adsorption of the semiconductor packages 10 are formed, and the It may include a body 120 coupled to the upper portion of the vacuum panel 110 and forming a vacuum chamber 122 in communication with the vacuum holes 112. The vacuum panel 110 may have a substantially rectangular plate shape, and the main body 120 may have a substantially rectangular box shape with an open top.

A baffle plate 130 in which a plurality of through holes 132 are formed may be disposed in a horizontal direction in the vacuum chamber 122. The vacuum chamber 122 may be divided into an upper vacuum chamber and a lower vacuum chamber based on the baffle plate 130, and an upper portion of the baffle plate 130 is provided to provide a vacuum in the vacuum chamber 122. At least one vacuum unit 140 may be disposed.

Therefore, since the vacuum pressure applied by the vacuum unit 140 is transmitted to the vacuum holes 112 through the through holes 132 of the baffle plate 130, it is uniform within the vacuum holes 112. Suction force may be generated. That is, by disposing the baffle plate 130 between the vacuum holes 112 and the vacuum unit 140, the internal pressure of the vacuum holes 112 can be formed very uniformly, and thus the semiconductor In the pickup and place operation of the packages 10, the error occurrence rate can be greatly reduced.

The vacuum unit 140 may provide a path for the flow of compressed air in the inner space of the body 120, that is, the vacuum chamber 122. In particular, as shown, the vacuum unit 140 may have a substantially hollow pipe shape extending elongated and may have openings 142 communicating with the vacuum chamber 122.

The vacuum unit 140 may be connected to a compressed air source 150 that provides compressed air, and the compressed air may flow along the vacuum unit 140 at a high speed. Specifically, one side of the vacuum unit 140 may be connected to the compressed air source 150, and the compressed air may be discharged to the outside of the main body 120 through the other side of the vacuum unit 140.

By the flow of the compressed air, the internal pressure of the vacuum unit 140 may be lower than the pressure of the vacuum chamber 122 of the main body 120, whereby the vacuum chamber 122 through the openings 142 Air may be sucked from the vacuum unit 140. As a result, the vacuum unit 140 may provide a vacuum inside the main body 120, and accordingly, the semiconductor packages 10 may be vacuum-adsorbed on the lower surface of the vacuum panel 110. have.

As shown, a plurality of vacuum units 140 are disposed in the vacuum chamber 122, but since the number of the vacuum units 140 can be variously changed, the number of the vacuum units 140 is It will not limit the scope of the invention.

The vacuum unit 140 may be connected to the compressed air source 150 through an air pipe. As an example, although not shown, the compressed air source 150 may include an air pump and an air tank accommodating compressed air.

As shown in FIG. 3, when a plurality of vacuum units 140 are used, a common rail manifold 152 may be disposed between the vacuum units 140 and the compressed air source 150. . Specifically, the manifold 152 may be used to uniformly supply compressed air to the vacuum units 140, and is connected to the compressed air source 150 through a main air pipe 154 and branched It may be connected to the vacuum units 140 through air pipes 156.

According to an embodiment of the present invention, the vacuum holes 112 of the vacuum panel 110 may be configured such that a plurality of vacuum holes 112 correspond to each semiconductor package 10. That is, a plurality of vacuum holes 112 may be used to vacuum-adsorb one semiconductor package 10.

4 is a schematic enlarged cross-sectional view for explaining the vacuum panel illustrated in FIG. 2.

Referring to FIG. 4, a plurality of vacuum holes 112 may be used to vacuum-adsorb one semiconductor package 10. Compared to the prior art in which one vacuum hole is used for one semiconductor package 10, a plurality of vacuum holes 112 that are relatively small in size are used to vacuum-adsorb one semiconductor package 10. Even when the size of the semiconductor package 10 is changed, the semiconductor package pickup device 100 may be used as it is without being replaced.

5 is a schematic enlarged cross-sectional view illustrating a state in which semiconductor packages of different sizes are adsorbed on the vacuum panel shown in FIG. 2.

4 and 5, when semiconductor packages 10A having different sizes compared to the semiconductor packages 10 shown in FIG. 4 are adsorbed on the vacuum panel 110, the vacuum holes 112 ) May be located between the semiconductor packages 10A, but since the inner diameters of the vacuum holes 112 are relatively small, they do not have a significant effect on vacuum adsorption of the semiconductor packages 10A of different sizes. Does not.

Meanwhile, a plurality of recesses 114 may be provided on a lower surface of the vacuum panel 110 for adsorbing the semiconductor packages 10. The vacuum holes 112 may be connected to the recesses 114, whereby vacuum chambers defined by the semiconductor packages 10 and the recesses 114 may be formed. The recesses 114 may be used to increase an area to which a vacuum pressure is applied to the semiconductor packages 10.

6 is a schematic cross-sectional view for explaining another example of the vacuum panel shown in FIG. 2, and FIG. 7 is a schematic enlarged cross-sectional view for describing the vacuum panel shown in FIG. 6.

6 and 7, the vacuum panel 110 may include a base panel 110A and an adsorption pad 110B attached to a lower surface of the base panel 110A, and the vacuum holes 112 may be formed through the base panel 110A and the adsorption pad 110B. For example, the vacuum holes 112 may include upper vacuum holes 112A formed in the base panel 110A and lower vacuum holes 112B formed in the suction pad 110B.

As an example, a second recess into which the adsorption pad 110B is inserted may be provided on a lower surface of the base panel 110A. In particular, the adsorption pad 110B may be made of a material having flexibility in order to stably vacuum adsorption of the semiconductor packages 10. As an example, the adsorption pad 110B may be made of silicone resin, rubber, or the like.

Referring back to FIGS. 2 and 3, a blocking unit 160 for adjusting the size of an adsorption area in which the vacuum holes 112 are formed may be disposed in the vacuum chamber 122. The blocking unit 160 may be configured to be movable in a vertical direction by a driving unit 170, and the driving unit 170 moves the blocking unit 160 of the suction area to adjust the size of the suction area. You can stick to the edges.

As an example, the blocking unit 160 may have a substantially rectangular ring shape. As another example, the blocking unit 160 may have a bar shape. In this case, four blocking units 160 may be disposed in a substantially rectangular ring shape in the vacuum chamber 122.

8 and 9 are schematic cross-sectional views for explaining the operation of the blocking unit and the driving unit shown in FIGS. 2 and 3.

8 and 9, the blocking unit 160 is disposed inside the first blocking member 162 and the first blocking member 162 in close contact with the edge portion of the adsorption area, and the adsorption area It may include a second blocking member 164 in close contact with the inside of the edge portion.

The first and second blocking members 162 and 164 may be supported by the support member 166, and the driving part 170 may move the support member 166 in a vertical direction. For example, a pneumatic cylinder may be used as the driving unit 170. However, since the configuration of the driving unit 170 can be variously changed, the scope of the present invention will not be limited thereby.

According to an embodiment of the present invention, the first blocking member 162 may be elastically supported on the lower surface of the support member 166. For example, an elastic member 168 such as a coil spring may be disposed between the first blocking member 162 and the support member 166, and the first blocking member 162 is the elastic member 168 ) May be positioned lower than the second blocking member 164. Accordingly, when the support member 166 is lowered by the driving part 170, the first blocking member 162 may be in close contact with the adsorption region before the second blocking member 164.

Although not shown, an elastic member (not shown) may be disposed between the second blocking member 164 and the support member 166 to relieve impact. Even in this case, the first blocking member 162 may be positioned lower than the second blocking member 164.

As shown, the first and second blocking members 162 and 164 are used, but a third blocking member may be additionally disposed inside the second blocking member 164. Accordingly, the scope of the present invention will not be limited by the number of the blocking members 162 and 164.

The driving unit 170 may adjust the size of the adsorption area by adjusting the heights of the first and second blocking members 162 and 164. In particular, the driving unit 170 allows only the first blocking member 162 to be in close contact with the contact area according to the total size of the semiconductor packages 10, that is, the size of the semiconductor strip, or the first and second blocking members. All of them 162 and 164 may be in close contact with the contact area.

For example, as shown in FIG. 8, when picking up semiconductor packages 10A having a relatively small first size, the driving unit 170 may include the first blocking member 162 at the edge of the adsorption area. The support member 166 may be lowered so as to be in close contact with each other, and when picking up the semiconductor packages 10B having a second size smaller than the first size as shown in FIG. 9, the driving unit 170 The support member 166 may be lowered so that the first and second blocking members 162 and 164 are all in close contact with the edge portions of the adsorption area.

As a result, even when relatively small semiconductor packages 10A and 10B are picked up, the semiconductor packages 10A and 10B can be stably picked up without vacuum loss.

10 and 11 are schematic cross-sectional views illustrating a semiconductor package pickup device according to another exemplary embodiment of the present invention.

Referring to FIGS. 10 and 11, an apparatus 100 for picking up semiconductor packages 10 includes a vacuum panel 110 having an adsorption area in which vacuum holes 112 are formed, and an upper portion of the vacuum panel 110. It may include a body 180 that is coupled to and forms a vacuum chamber 122 communicating with the vacuum holes 112.

The main body 180 is an upper panel 182 disposed above the vacuum panel 110 and a sidewall disposed between the vacuum panel 110 and the upper panel 182 to form the vacuum chamber 122 S 184 may be included. In this case, the upper panel 182 has a plurality of vacuum pipes 186 connected to the vacuum pump 190 and a plurality of second vacuum holes connecting the vacuum pipes 186 and the vacuum chamber 122 ( 188) may be provided.

Although not shown, as an example, the vacuum pump 190 may include vacuum units as shown in FIGS. 2 and 3, and the vacuum pipes 186 are formed of the vacuum units through vacuum pipes. It can be connected to the openings.

According to the embodiments of the present invention as described above, the apparatus 100 for picking up the semiconductor packages 10 includes a vacuum panel 110 having a suction region in which a plurality of vacuum holes 112 are formed, and the vacuum It may include a body 120 coupled to the upper portion of the panel 110 and forming a vacuum chamber 122 communicating with the vacuum holes 112. A baffle plate 130 for equalizing the internal pressure of the vacuum holes 112 may be disposed in the main body 120 in a horizontal direction, thereby picking up and placing the semiconductor packages 10 This can be done stably.

In particular, by configuring the vacuum panel 110 to correspond to a plurality of vacuum holes 112 with respect to one semiconductor package 10, the semiconductor package pickup device even when the sizes of the semiconductor packages 10 are changed. The replacement of (100) is unnecessary. That is, since it can easily cope with various semiconductor packages 10 having different sizes, the manufacturing cost of the semiconductor packages 10 can be greatly reduced.

In addition, by disposing a blocking unit 160 for adjusting the size of the adsorption region in the vacuum chamber 112, the semiconductor packages 10 without vacuum loss even when the sizes of the semiconductor packages 10 are changed. It is possible to stably perform pick-up and place operations for.

Although the above has been described with reference to preferred embodiments of the present invention, those skilled in the art will be able to variously modify and change the present invention without departing from the spirit and scope of the present invention described in the following claims. You will understand that you can.

10: semiconductor package 100: semiconductor package pickup device
110: vacuum panel 112: vacuum hole
120: main body 122: vacuum chamber
130: baffle plate 140: vacuum unit
150: compressed air source 160: blocking unit
162: first blocking member 164: second blocking member
166: support member 168: elastic member
170: drive unit

Claims (9)

A vacuum panel having an adsorption region in which vacuum holes for vacuum adsorption of semiconductor packages are formed;
A main body coupled to an upper portion of the vacuum panel and forming a vacuum chamber communicating with the vacuum holes;
A blocking unit disposed in the vacuum chamber and configured to adjust the size of the adsorption area; And
Including a driving unit for reducing the size of the adsorption area by intimate contact with the blocking unit to the edge of the adsorption area,
A semiconductor package pickup device, characterized in that a plurality of vacuum holes correspond to each of the semiconductor packages. The method of claim 1, wherein the blocking unit,
A first blocking member in close contact with an edge portion of the suction region;
A second blocking member disposed inside the first blocking member and in close contact with the inner side of the edge portion of the adsorption region;
A support member supporting the first and second blocking members; And
Including elastic members disposed between the first and second blocking members and the support member,
When the support member is lowered by the driving unit, the first blocking member is in close contact with the adsorption region before the second blocking member. The semiconductor package pickup apparatus of claim 1, wherein the blocking unit has a rectangular ring shape or a bar shape. The semiconductor package pickup apparatus according to claim 1, further comprising a baffle plate disposed in the vacuum chamber and having a plurality of through holes formed therein. The semiconductor package pickup apparatus of claim 1, further comprising at least one vacuum unit disposed in the vacuum chamber and configured to provide a vacuum in the vacuum chamber. The method of claim 5, wherein the vacuum unit is connected to a compressed air source, has a hollow pipe shape to provide a flow path of air provided from the compressed air source in the vacuum chamber, and the vacuum in the vacuum chamber A semiconductor package pickup apparatus comprising at least one opening connecting the vacuum chamber and the air flow path in order to provide a power supply. The method of claim 1, wherein the main body,
An upper panel disposed on the vacuum panel; And
A semiconductor package pickup device disposed between the vacuum panel and the upper panel and including sidewalls for forming the vacuum chamber The semiconductor package pickup apparatus of claim 7, wherein the upper panel includes a plurality of vacuum pipes connected to a vacuum pump and a plurality of second vacuum holes connecting the vacuum pipes and the vacuum chamber. delete

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