KR102107622B1 - The light device - Google Patents

Abstract

The surface lighting apparatus according to the first embodiment includes a panel; A power module disposed on the panel; And a protective layer disposed on the power module, wherein the protective layer comprises: a first layer comprising an adhesive material; A second layer comprising a metallic material; And a third layer comprising an insulating material.
The surface lighting apparatus according to the second embodiment includes a panel; A power module formed on the panel; A first protective layer disposed between the panel and the power module; And a second protective layer disposed on the power module.

Description

Lighting device {THE LIGHT DEVICE}

The embodiment relates to a lighting device.

Recently, in relation to green energy, the development of OLED (ORGANIC LIGHT EMITTING DIODE) and LED (LED: LIGHT EMITTING DIODE) is being activated.

Various types of lighting devices using the LEDs and LEDs are being released, and while the LEDs are not easy to implement a surface light source as a point light source, the LED light has the advantage of being a surface light source.

The LED is manufactured as one module by connecting a power module on a panel. At this time, the power module is manufactured by forming a power circuit or the like on the PCB. Local heat spots are generated locally on the panel located on the PCB or the lower surface of the PCB by heat generated from the power module. , There was a problem that can cause the luminance irregularity of the overall LED.

Accordingly, there is a need for a surface lighting device having a new structure capable of reducing or preventing luminance irregularity of the LED due to heat generated in the power supply circuit.

The embodiment is to provide a surface lighting device that can improve the reliability by controlling the heat transmitted to the LED panel.

The surface lighting apparatus according to the first embodiment includes a panel; A power module disposed on the panel; And a protective layer disposed on the power module, wherein the protective layer comprises: a first layer comprising an adhesive material; A second layer comprising a metallic material; And a third layer comprising an insulating material.

The surface lighting apparatus according to the second embodiment includes a panel; A power module formed on the panel; A first protective layer disposed between the panel and the power module; And a second protective layer disposed on the power module.

The surface lighting device according to the embodiment includes a protective layer or a first protective layer and a second protective layer to control heat transmitted to the LCD panel.

Accordingly, it is possible to reduce the temperature of the LED panel located at the bottom of the power module, and to make the temperature of the LED panel uniform. Therefore, since the luminance unevenness due to the temperature unevenness of the LED panel can be prevented, the reliability of the surface lighting device can be improved as a whole.

In addition, it is possible to reduce the weight and cost compared to the conventional heat dissipation layer can improve the process efficiency.

1 is a top view of a surface lighting device according to an embodiment.
2 is a perspective view of a surface lighting apparatus according to the first embodiment.
3 is a cross-sectional view of the surface lighting device of FIG. 2 cut with Ι-Ι '.
4 is an enlarged view of a protective layer according to the first embodiment.
5 is an enlarged view of A of FIG. 3.
6 is a top view of the surface lighting apparatus according to the second embodiment.
7 is a perspective view of a surface lighting device according to a second embodiment.
8 is a cross-sectional view of the surface lighting device of FIG. 7 cut with Ι-Ι '.
9 is an enlarged view of a second protective layer according to the second embodiment.
10 and 11 are views showing a heat distribution diagram of a conventional surface lighting device and a surface lighting device according to an embodiment.
12 to 17 are views for explaining a method of manufacturing a surface lighting device according to an embodiment.
18 is a perspective view of a surface lighting device according to another embodiment.
19 illustrates an application example in which the surface lighting device of various embodiments of the present invention is applied to a vehicle.

Hereinafter, exemplary embodiments of the present invention will be described in detail with reference to the accompanying drawings so that those skilled in the art to which the present invention pertains may easily practice. However, the present invention can be implemented in many different forms and is not limited to the embodiments described herein.

Throughout the specification, when a part “includes” a certain component, it means that the component may further include other components, not to exclude other components, unless otherwise stated.

In addition, in order to clearly describe the present invention in the drawings, parts irrelevant to the description are omitted, and thicknesses are enlarged to clearly express various layers and regions, and like reference numerals are assigned to similar parts throughout the specification. .

When a portion of a layer, film, region, plate, etc. is said to be “above” another portion, this includes not only the case “directly above” the other portion but also another portion in the middle. Conversely, when one part is "just above" another part, it means that there is no other part in the middle.

Hereinafter, the lighting device according to the first embodiment will be described in detail with reference to FIGS. 1 to 5. 1 is a top view of the surface lighting device according to the embodiment, FIG. 2 is a perspective view of the surface lighting device according to the first embodiment, and FIG. 3 is a cross-sectional view of the surface lighting device of FIG. 2 cut with Ι-Ι ' , FIG. 4 is an enlarged view of the protective layer according to the first embodiment, and FIG. 5 is an enlarged view of A of FIG. 3.

1 to 5, the surface lighting apparatus 1000a according to the first embodiment includes an LED panel 300 and a power module 200. The surface lighting device according to the first embodiment may include an LED lighting device.

The LCD panel 300 includes a lower substrate 310, an organic light emitting diode 320, and an upper substrate 330. The lower substrate 310, the organic light emitting diode 320, and the upper substrate 330 are stacked in order to form the LED panel 300. In this case, the organic light emitting diode 320 and the upper substrate 330 may be stacked if they have the lower substrate 310 and the stepped portion 270.

The power module 200 is electrically or physically connected to the LED panel 300 by a connector 230 in an edge area of the LED panel 300 to supply power to the LED panel 300. .

The power module 200 includes a module board 210, a power integrated circuit 220, a connector 230, and other elements 221.

The module board 210 is a printed circuit board on which a plurality of circuit patterns are printed, and supports a power integrated circuit 220, a connector 230, and other elements 221.

The module board 210 may be a rigid substrate, and a circuit pattern may be formed on a metal-based or rigid resin-based substrate.

The module board 210 may have a smaller area than the LED panel 300, and may be disposed in a central area on the upper surface of the LED panel 300 or on one side.

On the module board 210, a power integrated circuit 220 and other elements 221 are included, and the power integrated circuit 220 is connected to the outside to process the power for the LED according to the dimming signal, and the LED panel ( 300) A positive power supply and a negative power supply are applied to the positive and negative electrodes, respectively.

The module board 210 includes a connector 230 in close proximity to the power integrated circuit 220, and the connector 230 is formed on the LCD panel 300 by the connecting member 240 In combination with the circuit board, the positive power and the negative power are supplied. The connecting member 240 may include a conductive material. In one example, the connecting member 240 may include a wire.

One end of the connecting member 240 is connected to the module board 210, and the other end of the connecting member 240 is connected to the LED panel 300. Accordingly, the connector 230 may receive power from the module board 210 and transmit the power to the LED panel 300 by the connection member 240.

Meanwhile, the OLED panel 300 has a configuration as shown in FIGS. 3 to 5.

When the LCD panel 300 has an area of 10 cm * 10 cm, the LCD panel 300 includes the lower substrate 310, the lower electrode 321, the light emitting layer 322, and the upper electrode ( 323) and an upper substrate 330.

The lower substrate 310 is a transparent substrate, and may be a glass or transparent resin substrate, preferably polyethylene terephthalate (PET), polyethylene naphthalate (PEN) and polyethersulfone (PES).

The lower electrode 321 is formed on the lower substrate 310.

The lower electrode 321 is a positive electrode, and may be a conductive material having good light transmittance, preferably ITO, IZO, IZTO, but is not limited thereto.

A light emitting layer 322 is formed on the lower electrode 321.

The light emitting layer 322 is an organic material layer that emits light by receiving charges from positive and negative electrodes from the positive electrode, and the amount of light is adjusted according to the voltage applied to the positive electrode and the negative electrode.

An upper electrode 323 is formed on the emission layer 322.

The upper electrode 323 is a reflective electrode, and reflects light emitted from the light emitting layer 322 to emit light to the outside through the lower substrate 310.

The upper electrode 323 is formed of a conductive material, and may be formed of a reflective material such as aluminum or silver.

In this case, the upper electrode 323 may be formed of a light-transmitting electrode like the lower electrode 321, and a reflective layer may be separately formed on the light-transmitting electrode.

In this way, the lower electrode 321, the emission layer 322, and the upper electrode 323 form the organic light emitting diode 320.

In addition, in order to improve the light extraction efficiency of the LED panel 300, a light extraction pattern may be formed on the lower substrate 310 or the like.

The upper electrode 323 functions as a negative electrode, and the upper substrate 330 is formed on the upper electrode 323.

The upper substrate 330 may be a sealing substrate for covering a lower layered structure and protecting the light emitting layer 322 to prevent moisture from penetrating into the LED device and reducing life.

The upper substrate 330 may be formed of glass or insulating resin as an insulating substrate.

At this time, the light emitting structure formed on the lower substrate 310, that is, the lower electrode 321, the light emitting layer 322, the upper electrode 323 and the upper substrate 330 above the light emitting structure is lower It has a smaller area than the substrate 310.

As an example, as shown in FIG. 3, the LCD panel 300 may have a stepped portion exposing the lower substrate 310 to a part of the edge region. The step portion may be formed in a central region of one side of the LED panel 300 as shown in FIG. 2. However, the embodiment is not limited thereto, and the step portion may be formed in the entire area of one side of the OLED panel, the central area of all sides, or the entire area.

A pad portion 250 for connecting the printed circuit board electrode 260 and the connecting member 240 may be formed on the LED panel 300 exposed by the step portion. In addition, a sealing material 270 for protecting the inside of the stepped portion may be formed.

A protective layer 400 is further disposed on the power module 200. That is, the protective layer 400 may be formed on the power module 200 to cover the power module 200.

The protective layer 400 includes a first layer 410, a second layer 420 formed on the first layer 410, and a third layer 430 formed on the second layer 420. It can contain.

In detail, the first layer 410 may include an adhesive material. For example, the first layer 410 may include a resin-based adhesive material. In one example, the first layer 410 may include an epoxy resin. The first layer 420 serves to bond the LED panel 300 and the power module 200.

The second layer 420 may include a conductive material. In detail, the second layer 420 may include a metal material. For example, the second layer 420 may include at least one metal of aluminum, copper, and alloys containing the same. The second layer 420 serves to make the thermal conductivity in the planar direction higher than the thermal conductivity in the thickness direction by a metal material having high thermal conductivity.

The second layer may be formed to a thickness of about 30㎛ to about 50㎛. When the second layer is formed to less than 30㎛, the effect of thermal conductivity may be negligible, and when it is formed to exceed 50㎛, the thickness and weight may increase to decrease process efficiency.

The third layer 430 may include an insulating material. In detail, the third layer 430 may include an insulating material having an emissivity of about 0.9 or more.

As an example, the third layer 430 may include boron nitride. In detail, the third layer 523 may include an oxide in boron nitride and have an emissivity of about 0.9 or more. Alternatively, as an example of the second layer 522, the surface of the aluminum may be anodized to make the anodized oxide layer have an emissivity of 0.9 or more, thereby performing the role of the third layer 523 together. However, the embodiment is not limited thereto, and the third layer 523 may use a material having an emissivity of 0.9 or more, or by modifying the material to have an emissivity of 0.9 or more, various materials may be used.

Since the third layer 430 has a high emissivity, the third layer 430 serves as a radiator to increase radiant heat transfer.

The protective layer 400 may be formed by sequentially stacking the first layer 410, the second layer 420, and the third layer 430 described above.

The protective layer 400 may control heat transfer from the power module 200.

Conventionally, heat is generated as the power is driven in the power module, and heat generated in the power module is transferred to the LED panel. However, the heat is not uniformly transferred to the LED panel, and heat is intensively transferred to the portion of the LED panel where the power module is located, and thus a temperature difference is generated in the entire area of the LED panel.

Due to the non-uniform temperature distribution generated on the LED panel, a luminance change may occur in part, and thus there is a problem in that efficiency and reliability of the entire surface lighting device are deteriorated.

To solve this problem, the surface lighting apparatus 1000 according to an embodiment may reduce the temperature non-uniformity difference by arranging the protective layer 400 on the power module 200. That is, the protective layer 400 is disposed on the power module 200 and may serve as a heat dissipation layer that disperses heat transfer from the power module 200 to the LED panel 300.

10 is a diagram showing a temperature distribution on the LED panel by heat transferred to the LED panel when the power module is driven in the conventional surface lighting device, and FIG. 11 is a power module in the surface lighting device according to the embodiment When the 200 is driven, it is a diagram showing the temperature distribution on the LED panel 300 by heat transferred to the LED panel 300.

Referring to FIG. 10, when the power module is driven in the conventional surface lighting device, it can be seen that high-temperature heat is intensively transferred only to the portion where the power module is located in the LED panel. That is, it can be seen that the temperature unevenness between the portion where the power module is located and the portion where the power module is not located is large in the O.

However, referring to FIG. 11, in the surface lighting device according to the embodiment, when the power module is driven, it is understood that heat transmitted from the power module 200 is uniformly transmitted from the LED panel 300 as a whole. You can. That is, it can be seen that the difference in temperature non-uniformity can be reduced as heat is evenly transferred to other regions other than the portion where the power module 200 is located.

Accordingly, the surface lighting apparatus according to the embodiment can reduce the temperature of the LED panel located at the bottom of the power module, and can make the temperature of the LED panel uniform. Therefore, since the luminance unevenness due to the temperature unevenness of the LED panel can be prevented, the reliability of the surface lighting device can be improved as a whole.

In addition, it is possible to reduce the weight and cost compared to the conventional heat dissipation layer can improve the process efficiency.

Hereinafter, the surface lighting device according to the second embodiment will be described in detail with reference to FIGS. 6 to 9. In the description of the surface lighting apparatus according to the second embodiment, descriptions of parts identical or similar to those of the surface lighting apparatus according to the first embodiment described above will be omitted. That is, the description of the surface lighting device according to the second embodiment is essentially combined with the description of the surface lighting device according to the first embodiment.

FIG. 6 is a top view of the surface lighting device according to the second embodiment, FIG. 7 is a perspective view of the surface lighting device according to the second embodiment, and FIG. 8 is a view of the surface lighting device of FIG. 7 cut to Ι-Ι ' 9 is an enlarged view of a second protective layer according to the second embodiment.

6 to 9, the surface lighting device according to the second embodiment includes a first protective layer 510 and a second protective layer 520. The surface lighting device according to the second embodiment may include an LED lighting device.

In detail, the first protective layer 510 is disposed between the LED panel 300 and the power module 200, and the second protective layer 520 is disposed on the power module 200.

The surface lighting device according to the second embodiment includes a first protective layer 510 and a second protective layer 520 unlike the lighting device according to the first embodiment.

The first protective layer 510 includes a metal material. In detail, the first protective layer 510 includes at least one metal of aluminum, copper, and alloys containing the same.

The first protective layer 510 is disposed between the LED panel 300 and the power module 200 through an adhesive material, for example, an adhesive material such as epoxy.

In addition, the second protective layer 520 includes a first layer 521, a second layer 522 and a third layer 523. In detail, the first layer 521 may include epoxy, and the second layer 522 may include at least one metal of aluminum, copper, and alloys containing the same. The second layer may be formed to a thickness of about 30㎛ to about 50㎛. In addition, the third layer 523 may include an insulating material having an emissivity of 0.9 or more.

As an example, the third layer 523 may include boron nitride. In detail, the third layer 523 may include an oxide in boron nitride and have an emissivity of about 0.9 or more. Alternatively, as an example of the second layer 522, the anodized oxide layer may have an emissivity of 0.9 or more by anodizing the surface of aluminum to perform the role of the third layer 523 together. However, the embodiment is not limited thereto, and the third layer 523 may use a material having an emissivity of 0.9 or more, or by modifying the material to have an emissivity of 0.9 or more, various materials may be used.

The surface lighting device according to the second embodiment further includes a first protective layer disposed between the power module and the LED panel together with the second protective layer disposed on the power module.

The first protective layer 510 also serves to uniformize the temperature of the LED panel together with the second protective layer 520. That is, the first protective layer 510 may control heat transfer to the LCD panel 300 disposed under the power module 200. In detail, by inducing heat transfer in the planar direction from the first protective layer 510, intensive heat transfer that can be transferred to the LED panel 300 can be reduced.

Accordingly, the surface lighting device according to the second embodiment can reduce the temperature of the LED panel located at the bottom of the power module and make the temperature of the LED panel uniform. Therefore, since the luminance unevenness due to the temperature unevenness of the LED panel can be prevented, the reliability of the surface lighting device can be improved as a whole.

Hereinafter, a method of manufacturing the surface lighting apparatus according to the embodiment will be described with reference to FIGS. 12 to 17.

First, the lower electrode 321 is formed on the lower substrate 310.

The lower substrate 310 is a transparent substrate, and may be a glass or transparent resin substrate.

The lower electrode 321 is a positive electrode, and may be a conductive material having good light transmittance, preferably ITO, IZO, IZTO, but is not limited thereto.

The lower electrode 321 may be formed by vacuum deposition or lamination, but is not limited thereto.

In this case, the lower electrode 321 may be formed smaller than the lower substrate 310, and may be formed by exposing the lower substrate 310 in the stepped 250 region as shown in FIG. 5.

Next, a light emitting layer 322 is formed on the lower electrode 321 as shown in FIG. 13.

Since the light emitting layer 322 has a plurality of layered structures, preferably a charge transport layer, a light emitting layer, and a pneumatic transport layer, each layer is deposited and deposited.

The light emitting layer 322 may be formed with different materials depending on the color of light emission.

Next, an upper electrode 323 is formed on the light emitting layer 322 as shown in FIG. 14.

The upper electrode 323 is a reflective electrode, and reflects light emitted from the light emitting layer 322 to emit light to the outside through the lower substrate 310.

The upper electrode 323 is formed of a conductive material, and may be formed of a reflective material such as aluminum or silver.

Next, an upper substrate 330 is formed as shown in FIG. 15.

The upper substrate 330 may be a sealing substrate for protecting the light emitting layer 322 by covering the lower stacked structure and preventing the life of the moisture from penetrating into the LED device.

The upper substrate 330 may be formed of glass or insulating resin as an insulating substrate.

Next, a printed circuit board 260 of the power module is formed on the lower substrate 310 exposed at the step 350 as shown in FIG. 16.

The printed circuit board 260 may be connected and bonded through ACF bonding (Anisotropic conductive film bonding).

Next, the pad portion 250 is formed on the printed circuit board 260 by a soldering process, and after the module board 210 is formed on the power module 200, the connector 230 is padded. It can be connected to the unit 250. Subsequently, the connecting member 240, that is, one end and the other end of the wire may be connected to the connector 230 and the pad unit 250.

Next, as shown in FIG. 17, by forming a sealing material 340 in the stepped portion 350 region, the device side and edge regions may be sealed, and a protective layer 400 may be formed on the power module 200. Alternatively, in the surface lighting apparatus according to the second embodiment, after forming the first protective layer 510 before forming the power module 200, after forming the power module 200, the power module 200 ), A second protective layer 520 may be formed.

As explained earlier. The surface lighting device according to the embodiment may reduce luminance unevenness that may occur due to temperature unevenness of the LED panel. That is, by dissipating heat generated from the power module to prevent the phenomenon of being concentrated to the LED panel, it is possible to prevent a hot spot that may occur locally on the LED panel, and the overall of the LED panel By reducing the temperature difference that may occur in the region, it is possible to maintain the temperature of the LCD panel uniformly.

Therefore, the surface lighting device according to the embodiment can prevent luminance unevenness and the like caused by the surface lighting device, thereby improving the reliability of the surface lighting device as a whole.

Hereinafter, a surface lighting device according to another embodiment will be described with reference to FIG. 18.

In the description of the surface lighting apparatus according to FIG. 18, descriptions of parts identical or similar to those of the surface lighting apparatus according to the first and second embodiments described above will be omitted. That is, it is essentially combined with the description of the surface lighting apparatus according to the first and second embodiments.

The LCD panel 300 includes a lower substrate 310, a lower electrode 321, a light emitting layer 322, an upper electrode 323 and an upper substrate 330.

The configuration of the LED panel 300 is the same as that of the first embodiment, and a description thereof is omitted.

The OLED panel 300 has a step in the edge region as shown in FIG. 18, and the lower substrate 310 is exposed by the step region.

When the LED panel 300 has a rectangular shape, the steps are all formed on a rectangular border. That is, four stepped regions are formed in the edge region of the lower substrate. Printed circuit boards 260 are respectively formed in the exposed areas of the lower substrate 310 exposed by the stepped areas. In detail, the printed circuit board 240 includes a first substrate, a second substrate, a third substrate and a fourth substrate. The first substrate, the second substrate, the third substrate and the fourth substrate are attached to surround the edge region of the LED panel 300 and are electrically connected to each other.

In addition, a pad portion 250 for connecting a connector is formed on at least one of the first substrate, the second substrate, the third substrate, and the fourth substrate.

The pad unit 250 may be two pad units that respectively transmit positive and negative power applied to the LED panel 300 from the power module 200, and may further include a feedback pad unit. .

That is, the connection member 240 described in the first or second embodiment may be connected to the pad parts. The connector 230 and the connecting member 240 are the same as the connector or the connecting member described in the first or second embodiment, so a description thereof will be omitted.

In addition, a protective layer 400 is formed on the power module 200. Although only the protective layer formed on the power module is illustrated in FIG. 18, the embodiment is not limited thereto, and as in the second embodiment, the first protective layer and the power disposed between the power module 200 and the LED panel It goes without saying that it may include a second protective layer formed on the module.

The surface lighting device of various embodiments illustrated in FIGS. 1 to 18 may function as a surface light source by attaching the power module 200 to the upper surface of the LED panel 300 and emitting light through the rear surface.

Such a surface lighting device is applicable as a vehicle lamp as shown in FIG. 21 in addition to a general lighting device because the device is compact and highly integrated.

In the case of FIG. 21, it can be applied as a tail light or an indoor light of the vehicle 600, and the thickness of the lighting device is thin, so it can be applied as a light source for various vehicles.

Although the embodiments of the present invention have been described in detail above, the scope of the present invention is not limited thereto, and various modifications and improvements of those skilled in the art using the basic concept of the present invention defined in the following claims are also provided. It belongs to the scope of rights.

Claims (12)

panel;
A power module disposed on the panel;
A first protective layer disposed between the panel and the power module; And
It includes a second protective layer disposed on the power module,
The panel includes a lower substrate; An organic light emitting diode disposed on a part of the lower substrate; An upper substrate disposed on the organic light emitting diode; And a stepped region where the lower substrate is exposed due to an area difference between the lower substrate, the organic light emitting diode, and the upper substrate,
The power module may include a module board disposed on the first protective layer, a printed circuit board disposed on the lower substrate exposed by the stepped region; And a connecting member electrically connecting the power module and the printed circuit board,
The second protective layer,
A first layer comprising an adhesive material;
A second layer comprising a metallic material; And
A third layer comprising an insulating material,
The first protective layer is a lighting device comprising at least one of aluminum, copper, and alloys containing the same. According to claim 1,
The power module includes a power integrated circuit disposed on the module board, a connector disposed on the module board and electrically connected to the connection member, and a pad portion disposed on the printed circuit board and electrically connected to the connection member. Including,
A lighting device disposed on the stepped region and including a sealing material covering the printed circuit board and the pad portion. According to claim 1,
The first layer of the second protective layer comprises a resin-based adhesive material for adhering the panel and the power module. According to claim 3,
The second layer of the second protective layer is a surface illumination device comprising at least one conductive material of aluminum, copper, and alloys containing them. The method of claim 4,
The third layer of the second protective layer is a surface lighting device having a radiance of 0.9 or more to dissipate heat generated by the power module. delete delete delete delete delete delete delete

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