KR102045373B1 - A load lock chamber, a vacuum processing system having a load lock chamber, and a method for evacuating the load lock chamber - Google Patents

Abstract

A load lock chamber 100 for the vacuum processing system 500 is described. The load lock chamber includes load lock walls surrounding the load lock chamber volume, the load lock walls comprising a first load lock wall 101 and a second load lock wall 102, and a second load lock wall ( 102 is arranged opposite to the first load lock wall 101. The load lock chamber further comprises at least one first vacuum suction outlet 110 and at least one second vacuum suction outlet 111 for evacuating the load lock chamber 100; At least one first vacuum suction outlet 110 is located at the first load lock wall 101, and at least one second vacuum suction outlet 111 is located at the second load lock wall 102. Also described is a method for evacuating a vacuum processing system and a load lock chamber.

Description

A load lock chamber, a vacuum processing system having a load lock chamber, and a method for evacuating the load lock chamber

Embodiments of the present invention relate to a load lock chamber, a vacuum processing system having a load lock chamber, and a method for evacuating a load lock chamber. Embodiments of the present invention specifically relate to a load lock chamber having vacuum suction outlets, a vacuum processing system for processing a substrate, and a method for evacuating the load lock chamber to vacuum.

Substrates are often coated at pressures in the range of 5 * 10 ^-4 hPa to 0.5 hPa, for example under high-vacuum conditions, in vacuum processing systems or vacuum coating facilities. Load and unload locks (or inlet and outlet chambers) are applied to the substrates to increase plant productivity and to avoid situations where the entire plant must be evacuated for each substrate, and particularly for high-vacuum sections. Used.

In order to improve material flux rate and increase productivity in modern in-line coating installations, separate load and unload lock chambers are used. A simple so-called three-chamber coating unit allows the substrate from atmospheric pressure to a suitable transition pressure of, for example, p = 1 * 10 ⁻³ hPa to p = 1.0 hPa of sequential vacuum coating section (one or more process chambers). A load lock pumped and an unload lock where the substrate is adjusted back to the atmospheric pressure level by evacuation. In some systems, the load lock and unload lock are provided by the same load lock chamber.

The task of the load and unload lock chambers is to evacuate to a sufficient and sufficiently low transition pressure over the process range and to evacuate as quickly as possible back to atmospheric pressure. After the substrate is unloaded from the load lock chamber, the load lock chamber is evacuated again.

At the same time, the desire for less contamination during the vacuum process has increased over the last few years. For example, when producing displays, the acceptance of contamination by particles has decreased, quality standards, and also the quality expected by customers. For example, when the chambers of the processing system are not properly evacuated to vacuum, when components of the process system or transport system produce particles during the process, when the substrate to be processed introduces particles into the evacuated process system, and so on. Contamination may occur. Thus, there are a plurality of possible contaminating particle sources in the deposition system during operation that affect the product quality. Cleaning and replacing components, as well as continuous vacuum pumping in the process system, is a way to reduce the risk of contamination of the product. Nevertheless, as mentioned above, the process should be carried out in the fastest and most efficient way possible. Cleaning and replacement procedures take time for maintenance, and such time cannot be used for production time.

In view of the above, an object of the embodiments described herein is to provide a load lock chamber, a vacuum processing system, and a method for evacuating a load lock chamber that overcome at least some of the problems in the art. To provide.

In view of the above, there is provided a load lock chamber, a vacuum processing system, and a method for evacuating a load lock chamber, in accordance with the independent claims. Additional aspects, advantages, and features are apparent from the dependent claims, the description, and the accompanying drawings.

According to one embodiment, a load lock chamber for a vacuum processing system is provided. The load lock chamber includes load lock walls surrounding the load lock chamber volume. The load lock walls comprise a first load lock wall and a second load lock wall, the second load lock wall being arranged opposite to the first load lock wall. The load lock chamber further comprises at least one first vacuum suction outlet and at least one second vacuum suction outlet for evacuating the load lock chamber. At least one first vacuum suction outlet is located at the first load lock wall, and at least one second vacuum suction outlet is located at the second load lock wall.

According to another embodiment, a load lock chamber for a vacuum processing system is provided. The load lock chamber includes a carrier for carrying the substrate, and the carrier includes a carrier front side facing the same direction as the substrate front side of the substrate. The substrate front side of the substrate is the side to be processed in the vacuum process in the vacuum processing system. The carrier further includes a carrier back side on the side of the substrate back side of the substrate. The load lock chamber includes a load lock front wall facing the carrier front side of the carrier and a load lock rear wall facing the carrier rear side of the carrier; And two vacuum suction outlets on the load lock rear wall.

According to a further embodiment, a vacuum processing system for processing a substrate is provided. The vacuum processing system includes a vacuum processing chamber adapted to process a substrate; And a load lock chamber configured to transfer the substrate from atmospheric conditions to vacuum conditions, in accordance with embodiments described herein.

According to a further embodiment, a vacuum processing system for processing a substrate is provided. The vacuum processing system includes a vacuum processing chamber adapted to process a substrate. The vacuum processing chamber has a processing tool facing the processing area, which processing area is on the first side of the vacuum processing system. The vacuum processing system further includes a load lock chamber configured to transfer the substrate from the atmospheric conditions into the vacuum processing system. The load lock chamber includes a load lock front wall on the first side of the vacuum processing system and a load lock rear wall facing the second side of the vacuum processing system arranged opposite the first side of the vacuum processing system. The load lock chamber further includes a first vacuum suction outlet and a second vacuum suction outlet at the load lock rear wall.

According to a further embodiment, a method for evacuating a load lock chamber for a vacuum processing system is provided. The method includes opening a first vacuum sealable valve to insert a substrate into a load lock chamber; Inserting at least one substrate into the load lock chamber; Closing the first vacuum sealable valve; And providing suction from at least two load lock walls of the load lock chamber arranged opposite each other, or by providing suction from two vacuum suction outlets in the load lock rear wall, thereby reducing the load lock chamber from 0.05 mbar to Evacuating at a pressure of 1 mbar.

Embodiments also relate to apparatuses for performing the disclosed methods and include apparatus parts for performing each described method feature. Such method features may be performed by hardware components, by a computer programmed by appropriate software, by any combination of the two, or in any other manner. In addition, the embodiments also relate to methods of operating the described apparatus. The method includes method features for performing all the functions of the apparatus.

In a manner in which the above listed features of the embodiments described herein may be understood in detail, a more specific description, briefly summarized above, may be made with reference to the embodiments. The accompanying drawings are directed to embodiments and are described below.
1 illustrates a load lock chamber and a vacuum processing chamber in accordance with embodiments described herein;
2 shows a schematic perspective view of a load lock chamber with load lock walls in accordance with embodiments described herein;
3A-3C show schematic views from the horizontal direction of load lock chambers in accordance with embodiments described herein;
4A and 4B show schematic views from the horizontal direction of load lock chambers in accordance with embodiments described herein;
5 shows a schematic view from the horizontal direction of a load lock chamber in accordance with embodiments described herein;
6 shows a schematic cross-sectional view from the vertical direction of a load lock chamber in accordance with embodiments described herein;
7 shows a schematic cross-sectional view from the vertical direction of a load lock chamber in accordance with embodiments described herein;
8A and 8B show schematic perspective views of front and back views of a carrier carrying a substrate, in accordance with embodiments described herein;
9 illustrates a vacuum processing system having a load lock chamber in accordance with embodiments described herein; And
10 shows a flowchart of a method for evacuating a load lock chamber in accordance with embodiments described herein.

Reference will now be made in detail to various embodiments, with one or more examples of various embodiments illustrated in the drawings. In the following description of the drawings, like reference numerals refer to like components. In general, only differences to individual embodiments are described. Each example is provided by way of explanation, and is not meant to be limiting. Also, features illustrated or described as part of one embodiment may be used with or for other embodiments to create a further embodiment. The detailed description is intended to include such modifications and variations.

In addition, in the following description, a load lock chamber may be understood as a chamber for a vacuum processing system. According to embodiments described herein, the load lock chamber can provide a transition chamber from atmospheric conditions to low pressure or vacuum. For example, a load lock chamber according to embodiments described herein has a substrate inlet for receiving substrates delivered at atmospheric conditions, and a substrate outlet adapted to be connected to a vacuum chamber, such as a processing chamber or an intermediate chamber. Can be. The load lock chamber according to the embodiments described herein may be evacuated to vacuum and include respective equipment that may be connectable to vacuum pumps, such as vacuum suction outlets, vacuum pumping outlets, or vacuum ports. can do. In addition, a load lock chamber according to embodiments described herein can have a substrate transport system for transporting a substrate within and / or to a vacuum chamber (eg, a vacuum processing chamber). In some embodiments, the load lock chamber may include a carrier for carrying the substrate in and / or through the load lock chamber. The load lock chamber may have a vacuum sealable valve at the substrate inlet and the substrate outlet. According to some embodiments, which may be combined with other embodiments described herein, the vacuum sealable valve may be provided from a group consisting of a gate valve, a slit valve, and a slot valve. Can be.

FIG. 1 is a load lock chamber connected to a processing chamber 700 having a processing tool or processing equipment 710 to show an example of a possible field of application for the embodiments described herein. An embodiment of 100 is shown. Processing equipment may include, for example, a deposition source. In the embodiment shown in FIG. 1, the substrate is essentially vertically-oriented in the processing chamber and the load lock chamber. Vertically oriented substrates may have some deviation from the vertical, ie 90 ° orientation, in the load lock chamber or processing system to allow stable transport with several degrees of inclination, i.e., the substrates may be ± 20 ° from the vertical orientation. It can be appreciated that the deviation can be less or less, such as ± 10 ° or less.

While the embodiments shown in the figures refer to substrates that are substantially vertically oriented, the embodiments described herein also include a load lock chamber and a vacuum processing system for substrates that are arranged horizontally or substantially horizontally. It can be understood that it can be applied to.

As used herein, the term "substantially" or "essentially" may mean that there may be any deviation from the property indicated with "substantially". have. For example, the term “substantially horizontal” may refer to a direction that may deviate from the exact horizontal direction, eg, by about 1 ° to about 10 °. According to some embodiments, the term “substantially” describing a value or range of values may include a deviation of up to 15% from the value.

In FIG. 1, the load lock chamber is connected to the processing chamber via a sluice 400. The substrate 300 may be transported through the slaw 400 after the load lock chamber 100 is evacuated to an appropriate pressure level, such as a vacuum pressure level. In some embodiments, load lock chamber 100 may also be used as an unload-chamber for unloading a substrate from processing chamber 700. For example, the load lock chamber 100 may have two tracks for transporting substrates to and from the processing chamber 700, as will be described in detail with respect to FIG. 9. The load lock chamber 100 used as the unload lock chamber can be evacuated to bring the pressure level in the load lock chamber to atmospheric pressure conditions.

According to some embodiments, the load lock chamber and the processing chamber may be directly connected to each other, as illustratively shown in FIG. 1. In some embodiments, as described in detail with respect to FIG. 9, a buffer chamber may be provided between the load lock chamber and the processing chamber.

According to some embodiments, a load lock chamber for a vacuum processing system is described. The load lock chamber includes load lock walls surrounding the load lock chamber volume. The load lock walls comprise a first load lock wall and a second load lock wall, the second load lock wall being arranged opposite to the first load lock wall. The load lock chamber further comprises at least one first vacuum suction outlet and at least one second vacuum suction outlet for evacuating the load lock chamber. At least one first vacuum suction outlet is located at the first load lock wall, and at least one second vacuum suction outlet is located at the second load lock wall.

As mentioned above, the pressure in the load lock chamber typically varies periodically between ambient and vacuum conditions. In known systems, pumping ports for vacuum generation are disposed at the bottom of the load lock chamber and cause a pumping flow in the direction (downward direction) from the top of the chamber to the bottom of the chamber. In load lock chambers with vacuum suction outlets (or vacuum pumping outlets or vacuum pumping ports) on opposite sides of the load lock chamber according to the embodiments described herein, the pumping flow is inward-outward from the downward direction. And from the front side to the back side. The stream of particles during the vacuum exhaust of the load lock chamber according to the embodiments described herein is typically transported from contaminated or contaminated areas (eg, carrier frame, glass holders, or chamber wall). By varying the pumping flow away from the substrate center, additional particle contamination of the substrate to be processed can be prevented. The arrangement of vacuum suction outlets or pumping ports of the embodiments described herein ensures that the gas flow during pumping will always be guided away from the substrate center. Potential particle contamination will not migrate from the outside onto the substrate.

FIG. 2 shows a schematic perspective view of the load lock chamber 100. The load lock chamber 100 shown in FIG. 2 has been greatly simplified to explain the geometric terms used with respect to the load lock chamber according to the embodiments described herein. The load lock chamber 100 shown in FIG. 2 has been simplified as a cuboid. However, one of ordinary skill in the art will appreciate that the load lock chamber can be formed differently (especially not like a cuboid), and other shapes are also possible as long as other shapes are suitable for the function of the load lock chamber according to the embodiments described herein. I can understand that.

The load lock chamber 100 shown in FIG. 2 includes a first load lock wall 101 and a second load lock wall 102 arranged opposite to each other. According to some embodiments, walls arranged substantially opposite each other can be understood to oppose each other with respect to the load lock chamber volume. For example, the walls arranged opposite to each other can be arranged on opposite sides of the load lock chamber volume. In one example, the walls arranged opposite each other may be arranged on one axis of the load lock chamber (eg, the load locks 101 and 102 or the load walls opposite to each other on the height axis 107 of the load lock chamber). See opposing walls 103 and 104 on the length axis 108 of the chamber). One skilled in the art can understand that two opposing walls may deviate to some extent from the strict parallel arrangement of the respective walls. The load lock chamber volume can be described as a volume surrounded by load lock walls. In one example, the load lock volume can be understood as a volume evacuated or evacuable through, for example, vacuum suction outlets.

As can be seen in FIG. 2, the load lock chamber 100 further includes walls 103 and 104 arranged opposite to each other. The wall 103 can be referred to as a first connecting load lock wall connecting the opposite load lock walls 101 and 102. The wall 104 may be referred to as a second connecting load lock wall that connects the opposing load lock walls 101 and 102 and is arranged opposite to the first connecting load lock wall 103. The load lock chamber may further include walls 105 and 106, which may also be described as load lock front wall 105 and load lock rear wall 106. The terms "load lock front wall" and "load lock rear wall" are described in more detail below.

FIG. 3A shows an example of a load lock chamber 100 in accordance with embodiments described herein. 3a shows a view from the horizontal direction towards the load lock chamber. The load lock chamber of FIG. 3A is shown in cross-section cut away in the vertical direction. The load lock chamber 100 includes load lock walls 101, 102, 103, and 104, the walls 101 and 102 are opposing walls and the walls 103 and 104 are arranged opposite each other. FIG. 3A shows a first vacuum suction outlet 110 located at the first load lock wall 101, and a second vacuum suction outlet 111 located at the second load lock wall 102.

Vacuum suction outlet or vacuum pumping outlet as used herein may be understood as an outlet of the load lock chamber, which helps to evacuate the load lock chamber. In particular, the vacuum suction outlet may be an outlet through which suction force can be applied to the gas or air in the load lock chamber. In some embodiments, the vacuum suction outlet includes an opening in the load lock wall. According to some embodiments, the vacuum suction outlet can lead out of the load lock chamber. In some examples, the vacuum suction outlet may be considered as part of a load lock chamber (as part of the load lock walls, arranged inside the load lock walls, or arranged outside the chamber walls), channel, conduit, passageway, Can lead to a pipe, or a collection pipe. The vacuum suction outlets may comprise a vacuum pumping port configured to be connected to a vacuum pump, a particle pump, a particle trap, or other devices suitable for evacuating the load lock chamber.

The example of the load lock chamber 100 shown in FIG. 3A also shows a carrier 120 that can carry the substrate 300, with the edges of the carrier shown as dashed lines. For example, the carrier 120 may include a frame and clamps for holding the substrate. Other implementations of the carrier are also possible, such as electrostatic carriers, carriers that carry the substrate by adhesion, and the like.

According to embodiments described herein, the opposing arrangement of vacuum suction outlets helps to direct suction flow away from the substrate (or, specifically, the center of the substrate). The arrangement shown in the examples also helps to reduce (particle) contamination of the substrate prior to processing.

In some embodiments, the load lock chamber defines a substrate holding position 116 (in particular, in the substrate transport direction), where the substrate is held during vacuum evacuation. According to some embodiments, the substrate holding position may substantially correspond to the center point of the substrate (while the substrate is stationary in the load lock chamber). As an example, the vacuum suction outlets shown in FIG. 3A are arranged approximately in the substrate holding position. In general, the holding position of the substrate during vacuum evacuation of the load lock chamber is such that when the evacuation process of the load lock chamber begins, the substrate is stopped or the substrate carrier is stopped (and / or locked in place). ) Position can be recognized. In some examples, the holding position may allow for fixing the carrier in a position that allows for stopping during vacuum evacuation and supporting the substrate.

An example of a substrate 300 arranged vertically in FIG. 3A is a substantially horizontal line 117 that extends substantially at half the height of the substrate in the load lock chamber (eg, when the substrate is in a substrate holding position). Shows more. According to some embodiments described herein, the upper half of the load lock chamber above line 117 is sucked by vacuum suction outlet 110 and the lower half of the load lock chamber below line 117 is vacuum suction. It is sucked by the outlet 111. In this example, the flow of sucked air or gas is induced away from the horizontal center of the substrate. For example, a substantially horizontal line can be described as a (virtual) neutral line.

FIG. 3B shows a view from a horizontal direction towards a load lock chamber in accordance with embodiments described herein. FIG. The load lock chamber of FIG. 3B is shown in cross section cut in the vertical direction. 3B shows a load lock chamber having two first vacuum inlet outlets 110 at the first load lock wall 101 and two second vacuum inlet outlets 111 at the second load lock wall 102. An embodiment of 100 is shown. The example of FIG. 3B shows that the vacuum suction outlets 110 and 111 can be arranged on the side of the load lock chamber, for example, towards the walls 103 and 104, respectively. FIG. 3A shows an arrangement of vacuum suction outlets arranged approximately at the center position or holding position of the substrate, the holding position of which in some embodiments is-in the case of a vertically arranged substrate- It can correspond to the center position. According to some embodiments, the center position of the substrate can be understood as the center of the substrate in the transport direction at the time of vacuum evacuation of the load lock chamber.

The example shown in FIG. 3B with the vacuum suction outlets 110 and 111 arranged in the edge position or the side position or the non-center position of the load lock walls 101 and 102 is a vacuum exhaust of the load lock chamber. Further increase the effect of directing flow away from the substrate, in particular from the substrate center. For example, the vacuum suction outlets 110 and 111 may be arranged to direct the flow away from the center position of the substrate during the vacuum exhaust of the load lock chamber.

FIG. 3C shows a view from a horizontal direction towards a load lock chamber in accordance with embodiments described herein. FIG. The load lock chamber of FIG. 3C is shown in cross section cut in the vertical direction. 3C shows a rod having two first vacuum inlet outlets 110 at the first connecting rod lock wall 103 and two second vacuum inlet outlets 111 at the second connecting rod lock wall 104. An embodiment of the lock chamber 100 is shown. The example of FIG. 3C shows that the vacuum suction outlets 110 and 111 can be arranged towards the top and bottom of the load lock chamber, for example towards the walls 101 and 102, respectively. According to embodiments described herein, the arrangement of vacuum suction outlets can help direct the flow of sucked gas or air away from the center of the substrate.

Also shown in FIG. 3C is a vertical line 116 that can define a substrate holding position, and a horizontal line 117 that can define a horizontal centerline of the substrate in the load lock chamber. In the embodiment shown in FIG. 3C, the right half of the load lock chamber on the right side of line 116 is sucked by vacuum suction outlet 110, and the left half of the load lock chamber on the left side of line 116 is vacuum suction. It is sucked by the outlet 111. In this example, the flow of sucked air or gas is induced away from the vertical center of the substrate. For example, a substantially vertical line can be described as a (virtual) neutral line. Those skilled in the art will understand that the descriptions of "upper", "lower", "left", and "right" exemplarily refer to the projection plane of the figures shown, but may depend on the orientation of the substrate and the chamber in the chamber. Can be.

4A shows an example of a load lock chamber in accordance with embodiments described herein. 4A shows a view from the horizontal direction towards the load lock chamber. The load lock chamber of FIG. 4A is shown in cross section cut in the vertical direction. The load lock chamber 100 includes load lock walls 101, 102, 103, and 104. The load lock chamber 100 of FIG. 4A provides vacuum suction outlets 112, 113, and 111 to the three load lock walls 102, 103, and 104 of the load lock chamber. The load lock walls 103 and 104 providing the vacuum suction outlets 112 and 113 are load lock walls arranged opposite to each other. As can be seen in FIG. 4A, the load lock wall 103 and the load lock wall 104 are channels 130 and 131 for guiding sucked air from the vacuum suction outlets 112 and 113 to the pumping port. ), The pumping port can be connected to a vacuum pump. In FIG. 4A, the vacuum suction outlets 111 can be configured to include a vacuum pumping port connectable to the vacuum pump or to be connected to the vacuum pumping port. The arrows shown in FIG. 4A show the schematic flow direction of the stream drawn from the load lock chamber volume. The arrangement of the vacuum suction outlets 111, 112, and 113 allows to direct the flow of gas or air away from the substrate or away from the center of the substrate, as described above. According to some embodiments, the arrangement shown in FIG. 4A can be described as a U-shaped arrangement of vacuum suction outlets.

FIG. 4B directs air or gas from the load lock chamber through channels 130 and 131 to allow further suction into the vacuum pump through the vacuum suction outlets 111, as indicated by the arrows. An arrangement of the load lock chamber 100 with inducing vacuum suction outlets 110 is shown. Those skilled in the art will appreciate that vacuum suction outlets 111 (or, for example, vacuum pumping ports connectable to a vacuum pump) may also be connected to the other side of the load lock chamber, such as the upper side first wall 101 or the first connecting wall. It can be appreciated that it can be arranged on the 103 and the second connecting wall 104. The remaining walls of the load lock chamber may be equipped with channels for guiding sucked air or gas.

FIG. 5 shows a view from the horizontal direction towards the load lock chamber. FIG. The load lock chamber of FIG. 5 is shown in cross section cut in the vertical direction. FIG. 5 shows an embodiment of a load lock chamber 100 providing vacuum pumping ports to four load lock walls 101, 102, 103, and 104. The load lock chamber 100 of FIG. 5 also provides channels 130 and 131 through which air or gas sucked from the load lock chamber volume is guided from the vacuum suction outlets 112 and 113. Channels 130 and 131 direct the sucked gas or air to a vacuum suction outlet configured or included to be connected to a vacuum pumping port.

In the example shown in FIG. 5, both channels 130 and 131 lead to vacuum suction outlets 111. Those skilled in the art will appreciate that in other embodiments, the channels may be connected to the vacuum suction outlets 110 (or may be positioned in fluid communication with the vacuum suction outlet 110). In some embodiments, the channels may be positioned in fluid communication with both vacuum suction outlets 110 and 111 at the load lock walls 101 and 102. In yet another embodiment, each of the channels 130, 131 may be positioned in fluid communication with vacuum suction outlets of one of the load lock walls, respectively. According to some embodiments, the arrangement shown in FIG. 5 may be described as an O-shaped arrangement of vacuum suction outlets.

According to some embodiments, which can be combined with other embodiments described herein, the number of vacuum intake outlets for each load lock wall is greater than two, eg, four, five, or five There may be more than, for example eight or ten. In some embodiments, a plurality of openings may be provided in the load lock wall that serve as vacuum suction outlets. For example, the load lock wall may be provided as a kind of shower or sintered material for providing a plurality of openings which act as vacuum suction outlets, especially over the entire area of the load lock wall. According to some embodiments, the plurality of openings that serve as vacuum suction outlets may lead to a channel or the like to collect gas or air sucked through the openings.

According to some embodiments, a load lock chamber for a vacuum processing system is provided, the load lock chamber comprising a carrier for carrying a substrate. The carrier includes a carrier front side facing the same direction as the substrate front side of the substrate. Typically, the front side of the substrate is the side to be processed in the vacuum process in the vacuum processing system. The carrier further includes a carrier back side on the side of the back side of the substrate. According to the embodiments described herein, the load lock chamber further comprises a load lock front wall facing the carrier front side of the carrier and a load lock rear wall facing the carrier rear side of the carrier. The load lock chamber includes two vacuum suction outlets in the load lock rear wall or a first vacuum suction outlet in the load lock rear wall and a second vacuum suction outlet in the load lock front wall.

FIG. 6 shows an example of the load lock chamber 200 in a schematic cross-section cut in the horizontal direction. The viewpoint for the load lock chamber of FIG. 6 is from the vertical direction, in particular from above the load lock chamber. Those skilled in the art can understand that FIG. 6 shows a cross-sectional view in the horizontal direction of the substrate 300 arranged in a vertical arrangement. Those skilled in the art can also understand that the embodiments described herein can also be applied to load lock chambers in which the substrate is arranged substantially horizontally. In the embodiment shown in FIG. 6, a plurality of openings serving as vacuum suction outlets 210, 211 are provided in the load lock walls 205 and 206. The load lock walls 205 and 206 may be described as a kind of shower or sintered material for providing a plurality of openings that act as vacuum suction outlets, particularly over the entire area of the load lock walls 205, 206. For example, the plurality of openings distributed over the entire area of the load lock chamber walls 205, 206 may cause the substrate 300 to bend in one direction due to irregularities in the suction stream of gas or air in the load lock chamber. Can be prevented. As can be seen in FIG. 6, a plurality of openings serving as vacuum suction outlets 110, 111 lead to vacuum suction outlets 213 and 214 (or vacuum pumping port) configured to be connected to a vacuum pump or the like.

The load lock chamber 200 includes a load lock front wall 205 and a load lock rear wall 206. According to some embodiments, the terms described in FIG. 2 may also be applied to the terms of FIGS. 6 and 7 correspondingly. For example, the schematic geometry of the load lock chamber shown in FIGS. 6 and 7 may be as described in connection with FIG. 2. In the cross-sectional view of FIG. 6, a first connecting rod lock wall 203 and a second connecting rod lock wall 204 are shown. The first connecting rod lock wall and the second connecting rod lock wall may be opposing walls of the load lock chamber. In some embodiments, the first connecting load lock wall and the second connecting load lock wall may comprise a first load lock wall and a second load lock wall and / or a load lock front wall (as illustratively shown in FIG. 2). And wall connecting the load lock rear wall. The load lock chamber 200 shown in FIG. 6 has a plurality of first vacuum suction outlets 210 on the load lock front wall 205 of the load lock chamber and a plurality of load lock rear walls 206 of the load lock chamber. The second vacuum suction outlets 211 are provided and the load lock rear wall is arranged opposite the load lock front wall.

According to some embodiments, the load lock front wall may be understood as the wall of the load lock chamber, facing the front side of the substrate. The front side of the substrate is the side (or surface) of the substrate to be processed or processed in the processing chamber to which the load lock chamber is connected (either directly or through additional chambers or processing units such as heating units, etc.). In some embodiments, the load lock front wall may be understood as the wall of the load lock chamber, facing the front side of the carrier of the load lock chamber. For example, the front side of the carrier may be the side of the carrier, pointing in the same direction as the substrate front side. As will be described in detail below, the carrier may have a different shape on the carrier front side than the carrier back side. In some embodiments, the load lock front wall may be understood as a wall arranged on the first side of the processing system, and the load lock chamber may be part of the processing system. The first side of the processing system may be the side of the processing system where the processing area is provided. According to some embodiments, a processing area of a processing system is a processing tool or processing equipment for processing a substrate (especially the front side of the substrate), such as a heating device, a cooling device, a material source, deposition equipment, plasma generation equipment, Evaporation equipment, coating equipment, cleaning equipment, etching equipment, and the like.

According to some embodiments described herein, the load lock front wall of the load lock chamber may be arranged on the same side as the processing area of the processing system, and the load lock chamber may be part of the processing system. In particular, the load lock front wall of the load lock chamber can be oriented in the same direction as the processing area of the processing system and the load lock chamber can be part of the processing system.

One skilled in the art can understand that the load lock rear wall is the wall of the load lock chamber, which is arranged opposite the load lock front wall. In particular, where appropriate, the above description of the load lock front wall can correspondingly be applied to the load lock rear wall. For example, the load lock rear wall may be a wall of the load lock chamber, facing the rear wall of the substrate carrier and / or the rear wall of the substrate.

6 again, the load lock front wall is indicated by reference numeral 205 and the load lock rear wall is indicated by reference numeral 206. The embodiment of the load lock chamber of FIG. 6 shows the substrate 300 carried by the substrate carrier 220. The substrate carrier front side is indicated by reference numeral 225, and the substrate front side is indicated by reference numeral 305. In the example shown in FIG. 6, the front side 305 of the substrate 300 and the front side 225 of the carrier 220 are coplanar with each other. For example, to avoid shadowing effects when processing the substrate, the substrate is conveyed using the front side that is coplanar with the front side of the carrier.

One skilled in the art can understand that the carrier may be provided in a shape different from the shape shown in FIGS. 6 and 7. For example, the carrier may be adapted to secure the substrate electrostatically, magnetically or adhesively, or may include a receptacle for a mask, such as an edge exclusion mask, to be applied to the carrier and the substrate during processing. In some embodiments, the carrier itself can provide an edge exclusion mask.

As can be seen in the example of FIG. 6, two vacuum suction outlets 213 and 214 arranged in the load lock front wall 205 and the other in the load lock rear wall 206. Is located at the center position of the substrate. In some embodiments, the center position may correspond to the center position of the substrate in the horizontal direction (in the case of a vertically arranged substrate). According to some embodiments, the center position of the substrate may be understood as the center of the substrate in the transport direction at that time during vacuum evacuation of the load lock chamber (eg, in the substrate holding position). Vacuum suction outlets 210 and 211 arranged in both the load lock front wall and the rear wall of the load lock chamber may also help to prevent bending of the substrate in one direction. The arrows shown in FIG. 6 show the flow direction during vacuum evacuation of the load lock chamber.

FIG. 7 shows an example of the load lock chamber 200 in a schematic cross-section cut in the horizontal direction. The viewpoint for the load lock chamber of FIG. 7 is from a vertical direction, in particular from above the load lock chamber. FIG. 7 shows an embodiment of a load lock chamber 200 that includes a substrate carrier 220 having a front side 225, a load lock front wall 205, and a load lock rear wall 206. Shown is a substrate 300 having a substrate front side 305, carried by the substrate carrier 220. The load lock chamber 200 of FIG. 7 includes two vacuum suction outlets 210 and 211 both arranged at the load lock rear wall 206. The two vacuum suction outlets 210 and 211 are arranged at a distance with respect to the central position of the substrate, in particular in the edge region or in the boundary region of the substrate 300. For example, the edge region or boundary region (or respective edge regions shown on the left and right sides of the substrate in FIG. 7) may comprise about 20% of the extension of the substrate in the horizontal direction.

According to some embodiments, two vacuum suction outlets help guide the flow of gas or air away from the substrate center position during the vacuum exhaust of the substrate. In the example of FIG. 7, in particular, the two vacuum suction outlets 210 and 211 not only guide the air or gas of the load lock chamber away from the substrate center position, but also the front side 305 of the substrate 300. To guide away from In particular, the flow is directed from the front side of the substrate to the back side of the substrate. With the arrangement shown in FIG. 7, particle contamination on the front side of the substrate (which is the side of the substrate to be processed) is reduced.

8A and 8B show a carrier 220 (also referred to as a substrate carrier) for carrying a substrate. In particular, carrier 220 is configured to carry a substrate in a load lock chamber in accordance with embodiments described herein. In some embodiments, the carrier can be configured to transport the substrate through the load lock chamber. For example, the carrier may be adapted to hold the substrate before the substrate enters the load lock chamber and after the substrate leaves the load lock chamber, eg, when the substrate is in progress into a vacuum processing system. According to some embodiments, the carrier front side may be adapted to carry a mask for the substrate, such as a mask to cover portions of the substrate during processing (eg, during the deposition process). In some embodiments, the mask can be an edge exclusion mask. The carrier may be configured to receive the mask before entering the load lock chamber, before the carrier enters the processing chamber, or while the carrier is in the processing chamber.

As can be seen in FIGS. 8A and 8B, the carrier front side 225 (shown in FIG. 8A) and carrier back side 226 (shown in FIG. 8B) of the carrier 220 are designed differently. Can be. For example, the back side 226 may contain receptacles for fixing devices (eg, clamping devices, movable clamping devices, etc.), operating devices 227, control devices, handles 224, and the like. 223 (or recesses, notches, or pouches). The front side of the carrier may include receptacle (s) 221 for a mask, marks 222 for positioning the substrate, and the like. According to some embodiments, the front side of the carrier may be configured to undergo a process. For example, the front side of the carrier may have a defined resistance to temperature, chemicals, deposition, and the like. In some embodiments, the carrier front side can be designed to not include complex geometries that can be cleaned hard after the substrate has been processed. According to some embodiments, the front side of the carrier may, for example, have flat surfaces, fewer receptacles for the equipment compared to the rear side of the carrier, optionally with suitable material or (eg, the carrier front side surface). It may have a simple geometric shape, including surface treatment) for smoothing.

FIG. 8A shows a front view of the carrier 220 with the carrier front side 225. 8B shows a rear view of the carrier with carrier back side 226. The carrier 220 holds the substrate 300. In FIG. 8A, the front side 305 of the substrate 300 can be seen, and in FIG. 8B the rear side 306 of the substrate 300 can be seen. The carrier 220 is configured such that the substrate front side 305 is substantially coplanar with the carrier front side 225 when the substrate is carried by the carrier 220. According to some embodiments, the carrier front side and the substrate front side that are substantially on the same plane can be understood in that the carrier front side and the substrate front side form a plane that is continuous in the plane of the substrate.

According to some embodiments, the load lock chamber may include guide devices, such as rails, for guiding a carrier in the load lock chamber. The carrier for the load lock chamber according to the embodiments described herein may comprise transport devices, eg rollers, for moving and transporting in the guide devices.

According to some embodiments, a load lock chamber as described herein (and a carrier for a load lock chamber as described herein) can be adapted for large area substrates. According to some embodiments, large area substrates or respective carriers, the carriers having a plurality of substrates, may have a size of at least 0.67 m². Typically, the size may be about 0.67 m 2 (0.73 × 0.92 m—4.5 generations) or more, more typically about 2 m 2 to about 9 m 2 or even up to 12 m 2. Typically, the substrates or carriers are large area substrates as described herein, and structures, systems, chambers, slurs, and valves in accordance with embodiments described herein are such substrates. Or carriers. For example, a large area substrate or carrier may be 4.5 generations corresponding to about 0.67 m 2 substrates (0.73 × 0.92 m), 5 generations corresponding to about 1.4 m 2 substrates (1.1 × 1.3 m), about 4.29 m 2 substrates (1.95). 7.5 generations corresponding to mx 2.2 m), 8.5 generations corresponding to about 5.7 m 2 substrates (2.2mx 2.5 m), or even 10 generations corresponding to about 8.7 m 2 substrates (2.85mx 3.05 m). Even larger generations such as the 11th and 12th generations and corresponding substrate areas can be similarly implemented. According to some embodiments, which can be combined with other embodiments described herein, the system can be configured, for example, for manufacturing TFTs using static deposition.

According to some embodiments, the arrangement and load lock chamber of the vacuum suction outlets of the embodiments described herein are away from the substrate, in particular, the substrate front side and / or the substrate center, during the vacuum exhaust of the load lock chamber. It provides a flow of air or gas, which is directed away from it. Particles sucked from the load lock chamber are guided away from the substrate front side. By guiding the sucked particles away from the substrate front side, the particles flowing in the load lock chamber do not pass through the substrate front side and thus do not cause contaminations on the substrate front side. Embodiments described herein having vacuum suction outlets on opposite sides of the load lock chamber or vacuum suction outlets on the rear side of the load lock chamber reduce contamination of the substrate front side and increase the quality of the processed product. .

According to some embodiments, the vacuum suction outlets cause the vacuum suction outlets to direct a stream or flow of air or gas during the vacuum exhaust away from a position in the load lock chamber in which the substrate is held during the vacuum exhaust. Can be located. In some embodiments, the load lock chamber provides a substrate holding position where the substrate is held during vacuum evacuation.

According to some embodiments, a vacuum processing system for processing a substrate is provided. The vacuum processing system includes a vacuum processing chamber adapted to process a substrate; And a load lock chamber in accordance with any of the embodiments described herein. The load lock chamber may be configured to transfer the substrate from atmospheric conditions to vacuum conditions. In some embodiments, the load lock chamber is configured to transfer the substrate from atmospheric conditions to the vacuum processing chamber.

In some embodiments, when the substrate is in a load lock chamber, the load lock chamber may be evacuated, for example, to bring the load lock chamber to low pressure, low vacuum, or medium vacuum. For example, the load lock chamber can reach a typical pressure of about 1 mbar. According to some embodiments, the processing chamber is configured to have a load lock chamber (ie, by, for example, having an ultimate vacuum (base pressure) of about 10 ⁻⁸ mbar to about 10 ⁻⁵ mbar. Lower pressure).

According to some embodiments, a vacuum processing system for processing a substrate is provided. The vacuum processing system can include a vacuum processing chamber adapted to process a substrate. The vacuum processing chamber can have a processing tool facing the processing area, which processing area is on the first side of the vacuum processing system. The vacuum processing system can further include a load lock chamber configured to transfer the substrate from atmospheric conditions to vacuum conditions. The load lock chamber may comprise a load lock front wall on the first side of the vacuum processing system and a load lock rear wall facing the second side of the vacuum processing system arranged opposite the first side of the vacuum processing system. According to some embodiments described herein, the load lock chamber further comprises a first vacuum suction outlet and a second vacuum suction outlet at the load lock rear wall, or a first vacuum suction outlet and a load lock rear wall at the load lock front wall. The second vacuum suction outlet further comprises.

9 shows a vacuum processing system in accordance with embodiments described herein. 9 illustrates a vacuum processing system 500 in accordance with embodiments described herein. Examples of processing systems include a first vacuum processing chamber 501 and a buffer chamber 521. In some embodiments, vacuum processing system 500 may include additional processing chambers. The vacuum chambers may be deposition chambers or other processing chambers, where a vacuum is created in the chambers. In FIG. 9, a load lock chamber 522 can be seen that provides a transition from atmospheric conditions external to the processing system to vacuum conditions within the chambers of the processing system. The load lock chamber 522 may be a load lock chamber as described in detail above and may include an arrangement of vacuum suction outlets as described in detail in the above embodiments. According to embodiments described herein, load lock chamber 522 and vacuum chamber 501 (and additional vacuum chambers, if any) may be connected via linear transport paths by a transport system. According to embodiments described herein, a transport system may include a dual track transport system that includes several transport tracks 561, 563, 564. In some embodiments, the transport system can further include a rotation module that allows rotation of the substrates along the transport path. For example, large area substrates typically used for display manufacturing can be transported along linear transport paths in vacuum processing system 500. Typically, linear transport paths are provided by transport tracks 561 and 563, such as, for example, linear transport tracks having a plurality of rollers arranged along a line.

According to typical embodiments, the transport tracks and / or the rotation tracks are connected to the guiding system by the transport system at the bottom of the large area substrates and at the top of the essentially vertically oriented large area substrates. Can be provided by

According to different embodiments, which can be combined with other embodiments described herein, dual track transport systems of vacuum chambers, ie transport systems with a first transport path and a second transport path, are stationary. (fixed) may be provided by a dual track system, a movable single track system, or a movable dual track system. The fixed double track system comprises a first transport track and a second transport track, wherein the first transport track and the second transport track cannot be laterally displaced, ie the substrate is to be moved in a direction perpendicular to the transport direction. Can't. The moveable single track system provides a dual track transport system by having a linear transport track that can be displaced laterally, ie perpendicular to the transport direction, whereby the substrate is on the first transport path. Or on a second transport route, wherein the first transport route and the second transport route are remote from each other. The moveable dual track system includes a first transport track and a second transport track, wherein both transport tracks can be laterally displaced, that is, both transport tracks are capable of transporting their respective positions to the first transport track. It may switch from the path to the second transport path and vice versa.

According to some embodiments, vacuum processing system 500 may include a processing tool, such as processing tool 570 illustratively shown in chamber 501 of vacuum processing system 500. For example, processing tools provided in a vacuum processing system can be provided by a material deposition source, an evaporator, a target, a plasma generating device, a heating device, a cooling device, a cleaning device, and the like. In some embodiments, heating, cooling, cleaning, reaching high vacuum conditions, and the like, may be provided in a buffer chamber, such as buffer chamber 521 of FIG. 9. Typically, the processing tool faces the processing region 580, which is on the first side 590 of the vacuum processing system (the load lock front wall 505 of the load lock chamber is on the first side 590). Arranged). The vacuum processing system further includes a second side 591 opposite the first side 590 (load lock rear wall 506 of the load lock chamber facing the second side 591 of the vacuum processing system). According to some embodiments, the first side 590 of the vacuum processing system 500 may be described by a vacuum processing chamber having approximately the same orientation as the load lock chamber in the vacuum processing system. In the absence of a processing chamber with the same orientation as the load lock chamber (eg, the processing chamber arranged after the rotating module in the vacuum processing system 500), the first side may be the first side of the substrate during vacuum evacuation of the load lock chamber. It can be described as the facing side.

10 shows a flowchart of a method for evacuating a load lock chamber for a vacuum processing system. The method 600 includes, at block 610, opening the first vacuum sealable valve to insert the substrate into the load lock chamber. According to some embodiments, the first vacuum sealable valve may be provided as a transition between the load lock chamber and the environment of the processing system in which the load lock chamber may be part. According to some embodiments, the load lock chamber may be a load lock chamber as described with respect to FIGS. 1 to 7. The features of the load lock chamber described above can also be applied to a load lock chamber as used in the method according to the embodiments described herein. At block 620, at least one substrate is inserted into the load lock chamber. For example, the substrate can be provided in a carrier, which can carry and transport the substrate, in particular in a vacuum processing system. For example, the carrier may be a carrier as described with respect to FIGS. 7, 8A, and 8B. In particular, the carrier may provide a carrier front side facing in the same direction as the substrate front side, which is the side to be processed of the substrate.

In block 630, the first vacuum sealable valve is closed. According to the embodiments described herein, the load lock chamber is then evacuated to a pressure of 0.05 mbar to 1 mbar by providing suction from at least two opposing load lock walls of the load lock chamber. For example, suction may be provided through vacuum suction outlets. According to some embodiments, two opposing walls of the load lock chamber, eg, the first wall 101 and the second wall 102, or the front wall of the load lock chamber as shown in the figures described above. Suction may be provided by vacuum pumping ports located at 205 and rear wall 206. According to some embodiments, suction may be provided through vacuum suction outlets, which may be connectable to a vacuum pump. The vacuum suction outlets may be provided in the walls of the load lock chamber in a U-shaped arrangement, an X-shaped arrangement, or an O-shaped arrangement, as described in detail above. Some of the examples may provide suction from three or even four sides of the load lock chamber for evacuating the load lock chamber.

According to some embodiments, block 630 may additionally or alternatively provide suction from at least two vacuum suction outlets provided at or within the rear wall of the load lock chamber. Evacuating the lock chamber to a pressure of 0.05 mbar to 1 mbar. For example, the load lock chamber may have a front side corresponding to the front side (surface or side to be treated) of the substrate, and a rear side opposite the front side, as described in detail above in particular with respect to FIGS. 6 to 8. It may include.

While the foregoing is directed to embodiments, other and further embodiments may be devised without departing from the basic scope, the scope of which is determined by the claims that follow.

Claims (15)

As a load lock chamber 100 (200) for a vacuum processing system 500,
Load lock walls 101; 102; 103; 104, 105; 106; 205; 206 surrounding the load lock chamber volume, the load lock walls being the first load lock wall 101; 103; 105 and the second load lock. A wall (102; 104; 106), wherein the second load lock wall (102; 104; 106) is arranged opposite the first load lock wall (101; 103; 105);
At least one first vacuum suction outlet (110) and at least one second vacuum suction outlet (111) for evacuating the load lock chamber (100; 200);
The at least one first vacuum suction outlet 110 is located at the first load lock wall 101 (103; 105), and the at least one second vacuum suction outlet 111 is the second load lock wall. Located at (102; 104; 106),
The load lock chamber,
Opposing a first connecting load lock wall (103; 105) connecting the first load lock wall (101) and the second load lock wall (102), and the first connecting load lock wall (103; 105); Arranged second connecting load lock walls (104; 106); And
At least one third vacuum suction outlet 113 arranged in the first connecting rod lock wall 103; 105, and at least one fourth vacuum suction arranged in the second connecting rod lock wall 104; 106. It further comprises an outlet 112,
The at least one first vacuum suction outlet 110, the at least one second vacuum suction outlet 111, the at least one third vacuum suction outlet 113, and the at least one fourth vacuum suction outlet ( The group of 112 includes two or more vacuum pumping ports configured to be connected to a vacuum pump,
Load lock chamber for vacuum processing system. The method of claim 1,
The load lock chamber (100; 200) has two first vacuum suction outlets (110) at the first load lock wall (101; 103) and two at the second load lock wall (102; 104; 106). Including second vacuum suction outlets 111,
Load lock chamber for vacuum processing system. The method according to claim 1 or 2,
The number of at least one of the group consisting of the first vacuum suction outlet 110, the second vacuum suction outlet 111, the third vacuum suction outlet 113, and the fourth vacuum suction outlet 112 is 2 Overtime,
Load lock chamber for vacuum processing system. The method according to claim 1 or 2,
The load lock chamber (100; 200) defines a substrate holding position (116) where the substrate (300) is held during vacuum exhaust, and the vacuum suction outlets (110; 111; 112; 113) define the substrate during vacuum exhaust. Arranged to induce one or more flow directions pointing away from the holding position,
Load lock chamber for vacuum processing system. The method according to claim 1 or 2,
The load lock chamber 100 (200) is adapted to provide a vacuum in the range of 0.05 mbar to 1 mbar,
Load lock chamber for vacuum processing system. The method according to claim 1 or 2,
Vacuum suction outlets 110; 111; 112; 113 are configured to be connected to a vacuum pump arrangement,
Load lock chamber for vacuum processing system. As a load lock chamber 100 (200) for a vacuum processing system 500,
A carrier (120; 220) for carrying a substrate (300), said carrier comprising a carrier front side (225) facing in the same direction as the substrate front side (305) of said substrate (300), said substrate The substrate front side 305 of 300 is the side to be processed in the vacuum process in the vacuum processing system 500, and the carrier 120; 220 is on the side of the substrate rear side 306 of the substrate 300. Further comprising a carrier back side 226,
The load lock chamber (100; 200) is:
A load lock front wall 205 facing the carrier front side 225 of the carrier 120 and 220 and a load lock rear wall 206 facing the carrier rear side 226 of the carrier 120; And
And further comprising two vacuum suction outlets 210; 211 at the load lock rear wall 206, the two vacuum suction outlets 210; 211 being vacuum pumping ports configured to be connected to a vacuum pump. ,
Load lock chamber for vacuum processing system. The method of claim 7, wherein
When the carrier 220 carries the substrate 300, the carrier 220 carries the substrate 300 with the substrate front side 305 coplanar with the carrier front side 225. Configured to;
The vacuum suction outlets 210; 211 are arranged in the load lock rear wall 206 such that a pumping stream is guided away from the carrier front side 225 when the load lock chamber 200 is pumped with vacuum. that;
At least one is selected from the group consisting of
Load lock chamber for vacuum processing system. A vacuum processing system 500 for processing a substrate 300,
A vacuum processing chamber (501; 502; 503; 521) adapted to process the substrate (300); And
A load lock chamber (100; 200) according to any one of claims 1 or 2 or 7 or 8, configured to transfer the substrate from atmospheric conditions to vacuum conditions,
Vacuum processing system for processing a substrate. The method of claim 9,
The vacuum in the processing chamber 501; 502; 503; 521 is an ultra-high vacuum having a pressure in the range of 10 ⁻⁸ mbar to 10 ⁻⁵ mbar.
Vacuum processing system for processing a substrate. A vacuum processing system 500 for processing a substrate,
Vacuum processing chamber 501; 502; 503; 521 adapted to process substrate 300-the vacuum processing chamber 501; 502; 503; 521 has a processing tool 570 facing processing area 580. The processing region 580 is on a first side 590 of the vacuum processing system 500;
A load lock chamber (100; 200; 522) configured to transfer the substrate (300) from atmospheric conditions into the vacuum processing system;
The vacuum processing system, arranged opposite the load lock front wall 105; 205 on the first side 590 of the vacuum processing system 500, and the first side 590 of the vacuum processing system 500. A load lock rear wall 106; 206 facing the second side 591 of 500; And
A first vacuum suction outlet 110 and a second vacuum suction outlet 111 at the load lock rear wall 106; 206, the first vacuum suction outlet 110 and the second vacuum suction outlet 111 111 are vacuum pumping ports configured to be connected to a vacuum pump,
Vacuum processing system for processing a substrate. A method (600) for evacuating a load lock chamber (100; 200; 522) for a vacuum processing system (500),
Opening (610) a first vacuum sealable valve to insert a substrate (300) into the load lock chamber (100; 200; 522);
Inserting (620) at least one substrate (300) into the load lock chamber (100; 200; 522);
Closing (630) the first vacuum sealable valve; And
Suction from at least two load lock walls of the load lock chamber arranged opposite to each other and from at least two connecting walls 103; 104; 106 connecting the at least two load lock walls and arranged opposite to each other; By providing the suction is provided by two or more vacuum pumping ports configured to be connected to a vacuum pump, or from two vacuum suction outlets 110; 111 in the load lock rear wall 106; By providing suction, wherein the two vacuum suction outlets are vacuum pumping ports configured to be connected to a vacuum pump, evacuating the load lock chamber 100; 200; 522 to a pressure of 0.05 mbar to 1 mbar ( Which includes 640,
Method for evacuating the load lock chamber. The method of claim 12,
Evacuating the load lock chamber (100; 200; 522) includes providing suction from at least three load lock walls of the load lock chamber;
Method for evacuating the load lock chamber. delete delete

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