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KR102031737B1 - Lighting device - Google Patents

Lighting device Download PDF

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Publication number
KR102031737B1
KR102031737B1 KR1020130008290A KR20130008290A KR102031737B1 KR 102031737 B1 KR102031737 B1 KR 102031737B1 KR 1020130008290 A KR1020130008290 A KR 1020130008290A KR 20130008290 A KR20130008290 A KR 20130008290A KR 102031737 B1 KR102031737 B1 KR 102031737B1
Authority
KR
South Korea
Prior art keywords
pin
support
case
hole
light emitting
Prior art date
Application number
KR1020130008290A
Other languages
Korean (ko)
Other versions
KR20140095377A (en
Inventor
전성호
Original Assignee
엘지이노텍 주식회사
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by 엘지이노텍 주식회사 filed Critical 엘지이노텍 주식회사
Priority to KR1020130008290A priority Critical patent/KR102031737B1/en
Publication of KR20140095377A publication Critical patent/KR20140095377A/en
Application granted granted Critical
Publication of KR102031737B1 publication Critical patent/KR102031737B1/en

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Classifications

    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F21—LIGHTING
    • F21K—NON-ELECTRIC LIGHT SOURCES USING LUMINESCENCE; LIGHT SOURCES USING ELECTROCHEMILUMINESCENCE; LIGHT SOURCES USING CHARGES OF COMBUSTIBLE MATERIAL; LIGHT SOURCES USING SEMICONDUCTOR DEVICES AS LIGHT-GENERATING ELEMENTS; LIGHT SOURCES NOT OTHERWISE PROVIDED FOR
    • F21K9/00—Light sources using semiconductor devices as light-generating elements, e.g. using light-emitting diodes [LED] or lasers
    • F21K9/20—Light sources comprising attachment means
    • F21K9/23—Retrofit light sources for lighting devices with a single fitting for each light source, e.g. for substitution of incandescent lamps with bayonet or threaded fittings
    • F21K9/238—Arrangement or mounting of circuit elements integrated in the light source
    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F21—LIGHTING
    • F21K—NON-ELECTRIC LIGHT SOURCES USING LUMINESCENCE; LIGHT SOURCES USING ELECTROCHEMILUMINESCENCE; LIGHT SOURCES USING CHARGES OF COMBUSTIBLE MATERIAL; LIGHT SOURCES USING SEMICONDUCTOR DEVICES AS LIGHT-GENERATING ELEMENTS; LIGHT SOURCES NOT OTHERWISE PROVIDED FOR
    • F21K9/00—Light sources using semiconductor devices as light-generating elements, e.g. using light-emitting diodes [LED] or lasers
    • F21K9/20—Light sources comprising attachment means
    • F21K9/23—Retrofit light sources for lighting devices with a single fitting for each light source, e.g. for substitution of incandescent lamps with bayonet or threaded fittings
    • F21K9/235—Details of bases or caps, i.e. the parts that connect the light source to a fitting; Arrangement of components within bases or caps
    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F21—LIGHTING
    • F21K—NON-ELECTRIC LIGHT SOURCES USING LUMINESCENCE; LIGHT SOURCES USING ELECTROCHEMILUMINESCENCE; LIGHT SOURCES USING CHARGES OF COMBUSTIBLE MATERIAL; LIGHT SOURCES USING SEMICONDUCTOR DEVICES AS LIGHT-GENERATING ELEMENTS; LIGHT SOURCES NOT OTHERWISE PROVIDED FOR
    • F21K9/00—Light sources using semiconductor devices as light-generating elements, e.g. using light-emitting diodes [LED] or lasers
    • F21K9/20—Light sources comprising attachment means
    • F21K9/23—Retrofit light sources for lighting devices with a single fitting for each light source, e.g. for substitution of incandescent lamps with bayonet or threaded fittings
    • F21K9/237—Details of housings or cases, i.e. the parts between the light-generating element and the bases; Arrangement of components within housings or cases
    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F21—LIGHTING
    • F21V—FUNCTIONAL FEATURES OR DETAILS OF LIGHTING DEVICES OR SYSTEMS THEREOF; STRUCTURAL COMBINATIONS OF LIGHTING DEVICES WITH OTHER ARTICLES, NOT OTHERWISE PROVIDED FOR
    • F21V21/00—Supporting, suspending, or attaching arrangements for lighting devices; Hand grips
    • F21V21/002—Supporting, suspending, or attaching arrangements for lighting devices; Hand grips making direct electrical contact, e.g. by piercing
    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F21—LIGHTING
    • F21V—FUNCTIONAL FEATURES OR DETAILS OF LIGHTING DEVICES OR SYSTEMS THEREOF; STRUCTURAL COMBINATIONS OF LIGHTING DEVICES WITH OTHER ARTICLES, NOT OTHERWISE PROVIDED FOR
    • F21V23/00—Arrangement of electric circuit elements in or on lighting devices
    • F21V23/003—Arrangement of electric circuit elements in or on lighting devices the elements being electronics drivers or controllers for operating the light source, e.g. for a LED array
    • F21V23/004—Arrangement of electric circuit elements in or on lighting devices the elements being electronics drivers or controllers for operating the light source, e.g. for a LED array arranged on a substrate, e.g. a printed circuit board
    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F21—LIGHTING
    • F21V—FUNCTIONAL FEATURES OR DETAILS OF LIGHTING DEVICES OR SYSTEMS THEREOF; STRUCTURAL COMBINATIONS OF LIGHTING DEVICES WITH OTHER ARTICLES, NOT OTHERWISE PROVIDED FOR
    • F21V23/00—Arrangement of electric circuit elements in or on lighting devices
    • F21V23/003—Arrangement of electric circuit elements in or on lighting devices the elements being electronics drivers or controllers for operating the light source, e.g. for a LED array
    • F21V23/007—Arrangement of electric circuit elements in or on lighting devices the elements being electronics drivers or controllers for operating the light source, e.g. for a LED array enclosed in a casing
    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F21—LIGHTING
    • F21V—FUNCTIONAL FEATURES OR DETAILS OF LIGHTING DEVICES OR SYSTEMS THEREOF; STRUCTURAL COMBINATIONS OF LIGHTING DEVICES WITH OTHER ARTICLES, NOT OTHERWISE PROVIDED FOR
    • F21V23/00—Arrangement of electric circuit elements in or on lighting devices
    • F21V23/06—Arrangement of electric circuit elements in or on lighting devices the elements being coupling devices, e.g. connectors
    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F21—LIGHTING
    • F21V—FUNCTIONAL FEATURES OR DETAILS OF LIGHTING DEVICES OR SYSTEMS THEREOF; STRUCTURAL COMBINATIONS OF LIGHTING DEVICES WITH OTHER ARTICLES, NOT OTHERWISE PROVIDED FOR
    • F21V29/00—Protecting lighting devices from thermal damage; Cooling or heating arrangements specially adapted for lighting devices or systems
    • F21V29/50—Cooling arrangements
    • F21V29/502—Cooling arrangements characterised by the adaptation for cooling of specific components
    • F21V29/507—Cooling arrangements characterised by the adaptation for cooling of specific components of means for protecting lighting devices from damage, e.g. housings
    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F21—LIGHTING
    • F21S—NON-PORTABLE LIGHTING DEVICES; SYSTEMS THEREOF; VEHICLE LIGHTING DEVICES SPECIALLY ADAPTED FOR VEHICLE EXTERIORS
    • F21S2/00—Systems of lighting devices, not provided for in main groups F21S4/00 - F21S10/00 or F21S19/00, e.g. of modular construction
    • F21S2/005—Systems of lighting devices, not provided for in main groups F21S4/00 - F21S10/00 or F21S19/00, e.g. of modular construction of modular construction
    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F21—LIGHTING
    • F21Y—INDEXING SCHEME ASSOCIATED WITH SUBCLASSES F21K, F21L, F21S and F21V, RELATING TO THE FORM OR THE KIND OF THE LIGHT SOURCES OR OF THE COLOUR OF THE LIGHT EMITTED
    • F21Y2113/00—Combination of light sources
    • F21Y2113/10—Combination of light sources of different colours
    • F21Y2113/13—Combination of light sources of different colours comprising an assembly of point-like light sources
    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F21—LIGHTING
    • F21Y—INDEXING SCHEME ASSOCIATED WITH SUBCLASSES F21K, F21L, F21S and F21V, RELATING TO THE FORM OR THE KIND OF THE LIGHT SOURCES OR OF THE COLOUR OF THE LIGHT EMITTED
    • F21Y2115/00—Light-generating elements of semiconductor light sources
    • F21Y2115/10—Light-emitting diodes [LED]

Landscapes

  • Engineering & Computer Science (AREA)
  • General Engineering & Computer Science (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Physics & Mathematics (AREA)
  • Optics & Photonics (AREA)
  • Arrangement Of Elements, Cooling, Sealing, Or The Like Of Lighting Devices (AREA)
  • Non-Portable Lighting Devices Or Systems Thereof (AREA)

Abstract

Embodiments include a heat dissipation body, a case including a light emitting module unit on a lower surface of the heat dissipating body, an insertion unit inserted into the heat dissipating body and a terminal connected to an external power source, and a light dissipation module unit inserted into the case. And a power control unit for controlling the power supply unit, a plurality of parts for controlling the light emitting module unit on the support substrate, and a plurality of parts formed on the support substrate and connected to the case to receive power. Provided is a lighting device comprising a connector including a pin. Thus, the contact can be made clear by replacing the connection through the wire with the connection through the pin.

Description

Lighting device {LIGHTING DEVICE}

Embodiments relate to a lighting device.

Light emitting diodes (LEDs) are a type of semiconductor device that converts electrical energy into light. Light emitting diodes have the advantages of low power consumption, semi-permanent life, fast response speed, safety and environmental friendliness compared to conventional light sources such as fluorescent and incandescent lamps. Accordingly, many researches are being conducted to replace existing light sources with light emitting diodes, and light emitting diodes have been increasingly used as light sources for lighting devices such as various lamps, liquid crystal displays, electronic displays, and street lamps that are used indoors and outdoors.

A lighting device having such a light source generally receives positive power and negative power by using two wires when connecting an internal module substrate and an external power source.

However, when molding around the module substrate, the molding liquid flows out through the opening for discharging the wires, making the wire connection unstable, and there is a problem in that cleaning is performed for reliability.

Embodiments provide a lighting device including a connector with improved reliability.

Embodiments include a heat dissipation body, a case including a light emitting module unit on a lower surface of the heat dissipating body, an insertion unit inserted into the heat dissipating body and a terminal connected to an external power source, and a light dissipation module unit inserted into the case. And a power control unit for controlling the power supply unit, a plurality of parts for controlling the light emitting module unit on the support substrate, and a plurality of parts formed on the support substrate and connected to the case to receive power. Provided is a lighting device comprising a connector including a pin.

According to an embodiment, the contact can be made clear by replacing the connection through the wire with the connection through the pin.

In addition, through tightly fixing the connector pins and the housing can be prevented from flowing to the outside to improve the reliability.

In addition, since the sealing material does not flow to the outside, the cleaning process may be omitted, thereby reducing the process cost and time.

1 is a perspective view of the lighting apparatus according to the first embodiment as seen from below.
FIG. 2 is a perspective view of the lighting device of FIG. 1 viewed from above. FIG.
3 is an exploded perspective view of the lighting apparatus of FIG. 1.
4 is a cross-sectional view of the lighting device of FIG. 1 cut into Ι-Ι '.
5 is an exploded perspective view illustrating a relationship between a housing and a module substrate of FIG. 1.
6 is a perspective view illustrating a coupling between the housing and the module substrate of FIG. 5.
FIG. 7 is a cross-sectional view taken along line II-II ′ of FIG. 6.
8 is a cross-sectional view taken along line III-III ′ of FIG. 6.
9 to 12 are process charts showing the manufacturing method of the lighting apparatus of FIG. 1.
13 is a perspective view of the lighting apparatus according to the second embodiment, viewed from above.
14 is a perspective view illustrating a module substrate of the lighting apparatus of FIG. 13.
15 is a cross-sectional view taken along line IV-IV 'of FIG. 13.
16 is a perspective view of a lighting apparatus of another application example of the second embodiment.

DETAILED DESCRIPTION Hereinafter, exemplary embodiments of the present invention will be described in detail with reference to the accompanying drawings so that those skilled in the art may easily implement the present invention. As those skilled in the art would realize, the described embodiments may be modified in various different ways, all without departing from the spirit or scope of the present invention. In the drawings, parts irrelevant to the description are omitted in order to clearly describe the present invention, and like reference numerals designate like parts throughout the specification.

Throughout the specification, when a part is said to "include" a certain component, it means that it can further include other components, without excluding other components unless specifically stated otherwise.

The present invention provides a lighting device having a connector 180 with improved reliability.

Hereinafter, the lighting apparatus according to the first embodiment will be described with reference to FIGS. 1 to 8.

1 is a perspective view of the lighting apparatus according to the first embodiment viewed from below, FIG. 2 is a perspective view of the lighting apparatus of FIG. 1 viewed from above, FIG. 3 is an exploded perspective view of the lighting apparatus of FIG. 1, and FIG. 4. 1 is a cross-sectional view of the illuminating device of FIG. 1 cut in the line Ι-Ι ', FIG. 5 is an exploded perspective view showing the relationship between the housing and the module substrate of FIG. 1, and FIG. It is a perspective view, FIG. 7: is a figure which shows the cross section which cut | disconnected FIG. 6 to II-II ', and FIG. 8 is a figure which shows the cross section which cut | disconnected FIG. 6 to III-III'.

1 to 8, the lighting device 1 includes a case 170 including a connection terminal 173 at an upper portion and an insertion portion 174 at a lower portion thereof, and an insertion portion of the case 170. The heat dissipation body 150 including the first accommodating groove 151 into which the 174 is inserted, emits light on the lower surface of the heat dissipation body 150, and includes a light emitting module unit including a plurality of light emitting elements 131. 130, a guide member 100 coupled to a circumferential region below the heat dissipation body 150 to firmly fix the light emitting module unit 130 to the heat dissipation body 150.

The heat dissipation body 150 accommodates the light emitting module unit 130 and the power control unit 160 including accommodation grooves 151 and 152 on both sides, and the light emitting module unit 130 or / and the power control unit 160. ) To release the heat generated.

Specifically, as shown in FIGS. 3 and 4, the first receiving groove 151 in which the power control unit 160 is disposed is formed on the first surface of the heat dissipation body 150, and the first surface is formed. A second receiving groove 152 in which the light emitting module unit 130 is disposed may be formed on the second surface opposite to.

The outer surface of the heat dissipation body 150 may have a concave-convex structure, and the heat dissipation efficiency may be improved by increasing the surface area of the heat dissipation body 150 by the concave-convex structure.

The outer surface of the heat dissipation body 150 may have a concave-convex structure, and the heat dissipation efficiency may be improved by increasing the surface area of the heat dissipation body 150 by the concave-convex structure. The uneven structure may include, but is not limited to, an iron structure having a wave shape bent in one direction as shown.

In addition, the heat dissipation body 150 may be formed of a metal or resin material having excellent heat dissipation efficiency, but is not limited thereto. For example, the material of the heat dissipation body 150 may include at least one of aluminum (Al), nickel (Ni), copper (Cu), silver (Ag), and tin (Sn).

The through hole 153 may be formed on the bottom surface of the heat dissipation body 150, and the light emitting module unit 130 and the power control unit 160 may be connected to the wiring 165 through the through hole 153. Can be electrically connected by

The light emitting module unit 130 may be disposed in the second receiving groove 152 formed on the bottom surface of the heat dissipation body 150. The light emitting module unit 130 may include a substrate 132 and the plurality of light emitting elements 131 mounted on the substrate 132.

The substrate 132 may be a circuit pattern printed on the insulator, and may include, for example, a general printed circuit board (PCB), a metal core PCB, a flexible PCB, and the like. Can be.

In addition, the surface of the substrate 132 may be formed of a color in which light is efficiently reflected, for example, white, silver, or the like.

The plurality of light emitting elements 131 may be mounted on the substrate 132. Each of the plurality of light emitting elements 131 may include at least one light emitting diode (LED). The light emitting diodes may be red, green, blue, or white light emitting diodes emitting red, green, blue, or white light, respectively, but are not limited thereto.

In addition, arrangement | positioning of the said some light emitting element 131 is not limited. However, in the embodiment, the wiring 165 is formed under the light emitting module unit 130, and the light emitting device may not be mounted in the area where the wiring 165 is formed among the areas of the light emitting module unit 130. . For example, when the wiring 165 is formed in the middle region of the light emitting module unit 130 as shown, the light emitting element may not be mounted in the middle region.

The heat sink 140 may be attached to a bottom surface of the light emitting module unit 130. The heat sink 140 may be formed of a thermally conductive silicon pad or a thermal conductive tape having excellent thermal conductivity, and may effectively transfer heat generated by the light emitting module unit 130 to the heat dissipating body 150.

The protection ring 120 may be formed of a rubber or silicon material, and may be formed in a circumferential region of the light emitting module unit 130.

In addition, the inner upper end of the protective ring 120 may be formed to have an inclination 122 to improve light distribution of the light emitting module unit 130.

The protection ring 120 prevents moisture or foreign matter from penetrating between the guide member 100 and the light emitting module unit 130, and at the same time, a side region of the light emitting module unit 130 is the heat dissipating body 150. By preventing direct contact with, the withstand voltage of the lighting device 1 can be improved.

In addition, the protection ring 120 may firmly fix the light emitting module unit 130 and protect it from external impact, thereby improving reliability of the lighting device 1.

The light emitting module unit 130 is driven by receiving power by being electrically connected to the power control unit 160 and the wiring 165 through a through hole 153 penetrating the bottom surface of the heat dissipation body 150. Can be.

The light emitting module unit 130 may be firmly fixed to the second receiving groove 152 by the guide member 100. The guide member 100 has an opening 101 to expose the plurality of light emitting devices 131 mounted on the light emitting module unit 130, and the circumferential surface of the light emitting module unit 130 is the heat dissipation body ( It can be fixed by crimping to the second receiving groove 152 of 150.

The lens 110 may be included between the guide member 100 and the light emitting module unit 130.

The lens 110 may have various shapes such as a concave lens, a convex lens, and a parabola type lens.

The lens 110 may adjust light distribution of light emitted from the light emitting module unit 130 as desired. In addition, the lens 110 may be used to change the wavelength of the light including a phosphor, but is not limited thereto.

3 and 4, the case 170 has an insertion portion 174 inserted into the first receiving groove 151 of the heat dissipation body 150 in the lower region, and an external power source and an electrical power supply in the upper region. It may include a connection terminal 173 and a connection portion 172 between the insertion portion 174 and the connection terminal 173 connected to.

Sidewalls of the insertion portion 174 may be disposed between the power supply control unit 160 and the heat dissipation body 150 to improve the breakdown voltage by preventing an electrical short between the two.

The connection terminal 173 may be coupled to an external power source by screwing with a socket 175 to supply power to the lighting device 1.

However, the shape of the connection terminal 173 may be variously modified according to the design of the lighting device 1, but is not limited thereto.

The power control unit 160 may be disposed in the insertion unit 174.

The power control unit 160 is a DC converter for converting AC power provided from an external power source to DC power, a driving chip for controlling the driving of the light emitting module unit 130, for protecting the light emitting module unit 130 An electrostatic discharge (ESD) protection element may be included, but is not limited thereto.

The power control unit 160 may include a support substrate 161, a plurality of components 162 and a connector 180 mounted on the support substrate 161.

The support substrate 161 has an area and a shape corresponding to the diameter of the case 170 as shown in FIG. That is, it may be formed to be fitted into the case 170, the width is narrowed to fill the connection portion 172 and the connection terminal 173 inside.

The plurality of components 162 may include, for example, a DC converter for converting AC power provided from an external power source into DC power, a driving chip for controlling driving of the light emitting module unit 130, and the light emitting module unit 130. Electrostatic discharge (ESD) protection element for protecting the) may be included, but is not limited thereto.

The connector 180 is formed in an edge region of the support substrate 161, that is, an area disposed in the connection terminal 173 and the connection portion 172 of the case 170.

The connector 180 may include a first pin 181 and a second pin 182, and the first pin 181 and the second pin 182 may be connected to the connection terminal 173 of the case 170. It is connected to receive a positive power and a negative power, respectively.

That is, the first pin 181 and the second pin 182 are fixed to the connector 180 by replacing the conventional wire.

The first pin 181 penetrates through the connection part 172 of the case 170 and contacts the outer wall of the connection terminal, and the second pin 182 is a bottom surface of the connection terminal 173 of the case 170. It penetrates through and is exposed to the outside.

The inside of the case 170 is filled by the molding material 250 in a state in which the power control unit 160 is inserted.

The molding material 250 may be a silicone two-component resin, and is cured to fix the power control unit 160.

Hereinafter, the coupling structure of the connector 180 and the case 170 will be described in more detail with reference to FIGS. 5 to 8.

5 to 8, the case 170 may have a cylindrical insertion portion 174, and the insertion portion 174 may have a cylindrical or polygonal cylindrical shape.

The connection terminal 173 has a thread for engaging the socket 175 and includes a side and a bottom surface on which the thread is formed.

The side surface of the connection terminal 173 is formed in a cylindrical shape having a thread on the surface, the diameter of the connection terminal 173 is smaller than the diameter of the insertion portion 174.

A second through hole 178 through which the second pin 182 of the connector 180 penetrates is formed on the bottom surface of the connection terminal 173.

The connection part 172 formed between the connection terminal 173 and the insertion part 174 may have a bent surface as shown in FIG. 5, but may be formed as one inclined surface.

A first through hole 177 through which the first pin 181 of the connector 180 penetrates is formed in a boundary area between the connection unit 172 and the connection terminal 173.

In this case, a pin groove 176 extending from the first through hole 177 and contacting the first pin 181 may be formed at a side surface of the connection terminal 173, and the pin groove 176 may include a plurality of pin grooves 176. It may be formed across the threads.

The power control unit 160 is fitted to the insertion unit 174 of the case 170, and has a shape corresponding to the cross section of the case 170.

That is, the support substrate 161 includes a main region 164 corresponding to the inserting portion 174 and a sub region 163 corresponding to the connecting portion 172 and the connecting terminal 173. .

The component 162 may not be mounted in the sub region 163, and a connector 180 for receiving external power is formed.

Accordingly, the second width of the sub-region 163 may be smaller than the first width and may have a different width depending on the diameter of the connection portion 172 and the diameter of the connection terminal 173.

For example, as illustrated in FIG. 5, a region corresponding to the connecting portion 172 has an inclined side and a bent side, and a region corresponding to the connecting terminal 173 has a rectangular shape corresponding to the diameter of the connecting terminal 173. Can be.

The connector 180 formed in the sub region 163 includes a connector body 184, the first pin 181, and the second pin 182 as shown in FIG. 5.

The connector body 184 extends from the end of the sub-region 163 to the boundary of the connection portion 172 and the connection terminal 173, and includes first pins 181 and first ends at both ends of the connector body 184. And a first support part 188 and a second support part 187 that support the two pins 182 and are fitted with the first and second through holes 177 and 178 of the case 170.

The first support part 188 supports the first pin 181 and is formed to protrude from the connector body 184 to be fitted with the first through hole 177.

In this case, the shape of the first support part 188 corresponds to the shape of the first through hole 177. When the cross section of the first through hole 177 is formed to have the conical shape as illustrated in FIG. 8, the first support part 188 is formed. ) Can also be formed to have a conical shape.

The first pin 181 protrudes from an end of the first support 188.

Meanwhile, the second support part 187 supports the second pin 182 and protrudes from the connector body 184 to be fitted with the second through hole 178.

The shape of the second support part 187 corresponds to the shape of the second through hole 178. When the cross section of the second through hole 178 is formed to have the cylindrical shape as illustrated in FIG. 7, the second support part 187 may also be formed. It may be formed to have a cylindrical shape.

In FIGS. 7 and 8, the first support part 188 is formed in a conical shape, and the second support part 187 is formed in a cylindrical shape. However, the present invention is not limited thereto, and the first support part 188 is formed in a cylindrical shape. Various shapes that are combined are possible.

The second pin 182 protrudes from an end of the second support 187.

The first support 188 is formed higher than the second support 187, and the height difference is determined according to the height difference between the first through hole 177 and the second through hole 178.

In addition, in FIG. 5, the connector body 184 has a bent surface in an area where the first support part 188 and the second support part 187 are formed, but the first support part 188 and the second support part ( 187) may have a shape connecting diagonally.

The connector body 184 includes at least one guide protrusion 190, and as shown in FIG. 5, the guide body 190 is engaged with the edge of the sub-region 163 of the support substrate 161. Protrudes toward the support substrate 161.

The guide protrusion 190 protrudes to form the same plane as the rear surface of the support substrate 161 to guide the position of the connector 180 on the support substrate 161.

In addition, the connector 180 is formed in a central region of the connector 180 body as a guide protrusion 190 and is fitted with one of the plurality of heat dissipation holes of the support substrate 161 to fix the connector 180. May comprise a rib (RIB).

As such, while connecting the connector 180 of the power control unit 160 with the case 170, the pins 181 and 182 may be exposed to the outside to connect the power to the outside.

In addition, since the first and second through holes 177 and 178 and the first and second support parts 188 and 187 are fitted to expose the first pin 181 and the second pin 182, the case When molding the inside of the molding member 250, the molding member may be prevented from flowing outwardly through the first and second through holes 178.

Hereinafter, a process of coupling the power control unit 160 and the case 170 will be described with reference to FIGS. 9 to 12.

First, as shown in FIG. 9, a printed circuit board matrix 11 including a plurality of support substrates 161 corresponding to the plurality of power control units 160 is formed.

At this time, the printed circuit board substrate 11 is cut V to facilitate the cutting according to the shape of each support substrate 161.

In addition, the printed circuit board substrate 11 forms a hole 12 in each of the supporting substrates 161 at the edge region that is joined to the guide protrusion 190 of the connector 180.

Therefore, the support substrate 161 has a vertical section at the edge region where the hole 12 is formed, and a cross section other than the one having the inclined section along V cut.

Next, as shown in FIG. 10, the component 162 is mounted on each of the supporting substrates 161 separated from the printed circuit board substrate 11, and the connector 180 is attached.

In this case, the guide protrusion 190 is aligned with the edge region and the connector 180 is attached to the support substrate 161 so that the guide protrusion is fitted into the heat dissipation hole, and the first pin 181 and the second pin are attached. One end of 182 is soldered according to the circuit pattern of the support substrate 161 and electrically connected thereto.

Next, as shown in FIG. 11, the power control unit 160 slides through the insertion unit 174 of the case 170.

In this case, the first pin 181 and the second pin 182 are aligned so as to be exposed toward the first through hole 177 and the second through hole 178 and the first and second support portions 188 and 187. ) Is fixed by sliding until it is fitted into the first and second through holes 177 and 178.

Finally, the molding member 250 is filled in the case 170, and then hardened to fix the power control unit 160 and the case 170.

In this case, the molding material 250 may be a silicone two-component resin.

As described above, even when the liquid resin is filled with the molding material 250 at room temperature, the first and second through holes 177 and 178 are fitted by the first and second support parts 188 and 187 so that the first and second through holes 177 and 178 are fitted. And since the resin does not flow to the outside through the second through holes 177 and 178, a cleaning process is not required.

Hereinafter, a lighting apparatus according to a second exemplary embodiment of the present invention will be described with reference to FIGS. 13 to 16.

FIG. 13 is a perspective view of the lighting apparatus according to the second embodiment, viewed from above, FIG. 14 is a perspective view illustrating the module substrate of the lighting apparatus of FIG. 13, and FIG. 15 is a cross-sectional view taken along the line IV-IV ′ of FIG. 13. It is a figure which shows, FIG. 16 is a perspective view of the illuminating device of the other application example of 2nd Example.

As in the first embodiment, the lighting device 2 includes a case 170 including a connection terminal 173 at an upper portion and an insertion portion 174 at a lower portion thereof, and a heat dissipating body accommodating the case 170. 150, a light emitting module unit 130, and a guide member 100.

In the second embodiment, since the configuration of the lower side of the lighting device 2, that is, the light emitting module unit 130 side is the same as that of the first embodiment, the description will be omitted and the upper structure of the lighting device 2 will be described.

3 and 4, the case 170 includes an inserting portion 174 inserted into the first receiving groove 151 of the heat dissipating body 150 in a lower region. It may include a pin terminal (191, 192) and the insertion portion 174 and the connecting portion 171 between the pin terminal (191, 192) electrically connected to the external power source.

Sidewalls of the insertion portion 174 may be disposed between the power supply control unit 160 and the heat dissipation body 150 to improve the breakdown voltage by preventing an electrical short between the two.

The pin terminals 191 and 192 surround pins protruding from the bottom surface of the connection unit 171 and are coupled to an external power source to provide power to the lighting device 2.

The connection part 171 formed between the pin terminals 191 and 192 and the insertion part 174 may have a bent surface as shown in FIG. 13, but may be formed as one inclined surface.

 The power control unit 160 may be disposed in the insertion unit 174 of the case 170.

The power control unit 160 may include a support substrate 161, a plurality of components 162 and a connector 200 mounted on the support substrate 161.

The support substrate 161 has an area and a shape corresponding to the diameter of the case 170 as shown in FIG. 14. That is, it may be formed to fit inside the case 170, the width is narrowed to fill the connection portion 171 is formed.

The plurality of components 162 may include, for example, a DC converter for converting AC power provided from an external power source into DC power, a driving chip for controlling driving of the light emitting module unit 130, and the light emitting module unit 130. Electrostatic discharge (ESD) protection element for protecting the) may be included, but is not limited thereto.

The connector 200 is formed at an edge region of the support substrate 161, that is, an area facing the pin terminals 191 and 192 of the case 170.

The connector 200 may include a first pin 221 and a second pin 222, and the first pin 221 and the second pin 222 may be pin terminals 191 and 192 of the case 170. ) And receive a positive power and a negative power, respectively.

That is, the first pin 221 and the second pin 222 is fixed to the connector 200 by replacing the conventional wire.

The first pin 221 and the second pin 222 penetrate the bottom surface of the connection part 171 of the case 170 to be connected to an external power source in a state surrounded by the pin terminals 191 and 192.

The pin terminals 191 and 192 have two through holes 193 and 194 through which the first pin 221 and the second pin 222 of the connector 200 pass.

The power control unit 160 is fitted to the insertion unit 174 of the case 170, and has a shape corresponding to the cross section of the case 170.

The connector body is formed at the end of the sub-region 163 of the support substrate 161 and supports the first pin 221 and the second pin 222 on one surface of the connector body and through holes of the case 170. Two supports 211 and 212 fitted with 193 and 194.

Two support parts 211 and 212 may be formed on the same line on one surface of the connector body, and the support parts 211 and 212 support the first pin 221 and the second pin 222. It protrudes from the connector body so as to fit with the through holes (193, 194).

In this case, the shapes of the support parts 211 and 212 correspond to the shapes of the through holes 193 and 194. When the cross-sections of the through holes 193 and 194 are formed to have a conical shape as shown in FIG. 15, the support parts 211 and 212 are formed. It may also be formed to have a conical shape.

The first pin 221 or the second pin 222 protrudes from the ends of the support parts 211 and 212.

In FIG. 15, the support parts 211 and 212 are formed in a conical shape. However, the support parts 211 and 212 are not limited thereto, and various shapes may be fitted into the through holes 193 and 194.

The connector body includes at least one guide protrusion 230, and as shown in FIG. 14, the guide protrusion 230 supports the substrate 161 from the connector body so as to be engaged with an edge of the sub-region 163 of the support substrate 161. Protrudes towards

As such, while connecting the connector 200 of the power control unit 160 to the case 170, the pins 221 and 222 may be exposed to the outside to connect the power to the outside.

In addition, since the through holes 193 and 194 and the support parts 211 and 212 are fitted to each other, when the inside of the case 170 is molded with the molding material 250, the molding material 250 is formed of the first and the second materials. 2 It can be prevented from flowing to the outside through the through holes (193, 194).

As described above, in the second embodiment, the pin may fill the through hole while connecting the power by pin coupling instead of screw coupling connected to the socket.

In addition, the lighting device 2 has a square pillar shape in the configuration of the connection portion 171a of the case 17 as shown in FIG. 16, and is fitted with the connection portion to pins 221 and 222 of the connector 200 of FIG. 14. It may have a terminal 190 exposed.

Although the embodiments of the present invention have been described in detail above, the scope of the present invention is not limited thereto, and various modifications and improvements of those skilled in the art using the basic concepts of the present invention defined in the following claims are also provided. It belongs to the scope of rights.

Lighting devices 1, 2
Case 170
Heat dissipation body 150
Power control unit 160
Light emitting module 130
Connector 180, 200

Claims (16)

A heat dissipation body including first and second accommodation grooves;
A light emitting module unit including a substrate disposed on the second receiving groove of the heat dissipating body and at least one light emitting element disposed on the substrate;
A case including an insertion part inserted into the first receiving groove of the heat dissipation body, a connection terminal connected to an external power source, and a connection part connecting the connection terminal of the insertion part;
A power control unit inserted into the insertion unit of the case and controlling the light emitting module unit; And
It is filled in the case and includes a molding material for fixing the power control unit,
The power control unit
Support substrate,
A plurality of parts disposed on the support substrate;
A first pin formed on the support substrate and connected to the connection terminal through the connection part of the case;
A connector formed on the support substrate and including a second pin penetrating through the connection terminal of the case and exposed to the outside;
The connector
A connector body fixed on the support substrate;
A first support part protruding from the connector body and surrounding a portion of the first pin to support the first pin;
A second support part protruding from the connector body and surrounding a portion of the second pin to support the second pin;
A first through hole through which the first support part passes is formed in a boundary area between the connection part and the connection terminal,
A second through hole through which the second support part passes is formed in the bottom surface of the connection part.
The first support part is fitted to the first through hole,
The second support part is fitted into the second through hole,
The first pin contacts the outer surface of the connection terminal via the first through hole,
The second pin protrudes out of the case through the second through hole,
A pin groove is formed on a side surface of the connection terminal to extend from the first through hole and to contact the first pin.
Lighting device. Claim 2 has been abandoned upon payment of a set-up fee. The method of claim 1,
And the first and second supporting parts are formed on the same surface of the connector body. Claim 3 has been abandoned upon payment of a set-up fee. The method of claim 2,
The shape of the first through hole is
Corresponds to the shape of the first support,
The shape of the second through hole is,
Lighting device corresponding to the shape of the second support. Claim 4 has been abandoned upon payment of a setup registration fee. The method of claim 2,
The connector further includes a guide protrusion for guiding a position on the support substrate,
The guide projection is
Protrudes from the edge of the support substrate to be coplanar with the rear surface of the support substrate,
The support substrate is a lighting device that the side that is in contact with the guide projection is formed vertically. Claim 5 was abandoned upon payment of a set-up registration fee. The method of claim 2,
The connection terminal of the case is a pin terminal to which the second pin is exposed,
The pin terminal includes a through hole for receiving the respective pins and fitting to the first and second support,
The first and second support parts are formed on the same surface of the connector body. delete delete delete delete delete delete delete delete delete delete delete
KR1020130008290A 2013-01-24 2013-01-24 Lighting device KR102031737B1 (en)

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KR1020130008290A KR102031737B1 (en) 2013-01-24 2013-01-24 Lighting device

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KR102439547B1 (en) * 2015-11-05 2022-09-02 엘지이노텍 주식회사 Lamp unit and lamp for vehicle using the same

Citations (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
KR101001599B1 (en) 2010-03-30 2010-12-17 엘지이노텍 주식회사 Lighting device

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Publication number Priority date Publication date Assignee Title
KR101090983B1 (en) * 2010-04-07 2011-12-08 엘지이노텍 주식회사 Lighting device
KR101728918B1 (en) * 2010-12-17 2017-04-20 타이코에이엠피 주식회사 Connector for Socket and using this LED bulb

Patent Citations (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
KR101001599B1 (en) 2010-03-30 2010-12-17 엘지이노텍 주식회사 Lighting device

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