KR102037900B1 - Apparatus and method for treating substrates - Google Patents

Abstract

The substrate processing apparatus of the present invention includes an index module and a processing module, and the processing module includes an application block for forming a liquid film by applying a liquid on a substrate. The coating block includes a heat treatment unit for heat treating a substrate, a liquid treatment unit for supplying liquid to the substrate to apply the liquid onto the substrate, and a transfer unit provided with a transfer robot for transferring the substrate between the heat treatment unit and the liquid treatment unit. The liquid processing unit is disposed on the side of the conveying unit based on the longitudinal direction of the conveying unit, and the heat treatment unit includes a shear heat treatment chamber disposed between the conveying unit and the index frame. The shear heat treatment chamber includes a heating unit and a cooling unit arranged in the housing, wherein the substrate is conveyed by the conveying member.

Description

Substrate processing apparatus and substrate processing method {APPARATUS AND METHOD FOR TREATING SUBSTRATES}

The present invention relates to an apparatus and method for treating a substrate, and more particularly, to an apparatus and method for forming a liquid film such as a photosensitive liquid on a substrate.

In order to manufacture a semiconductor device, various patterns must be formed on a substrate such as a semiconductor wafer. The semiconductor pattern is formed by continuously performing various processes such as a deposition process, a lithography process, and an etching process.

Among these, a photolithography process is a coating process of applying a photoresist such as a photoresist on a substrate to form a photoresist layer on the substrate, and transferring a pattern formed on a reticle to a photoresist layer on the substrate to form a circuit An exposure step to form and a developing step of supplying a developing solution to the photoresist layer on the substrate to selectively remove the exposed area or the opposite area. Heat treatment is performed on the substrate before and after applying the photoresist on the substrate and before and after supplying the developer on the substrate.

Korean Unexamined Patent Application Publication No. 2016-0017699 discloses an example of a substrate processing apparatus that performs the above-described coating process and developing process. According to this, the substrate processing apparatus has a coating module and a developing module stacked on each other, and each of the coating module and the developing module has a conveying chamber, a liquid processing chamber, and a baking unit. The conveying chamber is provided with its longitudinal direction elongated along the first direction, with baking chambers disposed on one side of both sides with respect to the first direction, and liquid processing chambers provided on the other side. In addition, buffers are provided at both ends of the transfer chamber for substrate transfer with the index module and the interface module. The cooling unit and the heating unit are sequentially arranged in the housing of the bake chamber, and the housing is provided with a conveying plate for conveying the substrate therein. The conveying plate conveys the substrate to the heating unit, and when the heating is completed, the substrate is cooled by the cooling unit through the conveying plate while the substrate is placed on the conveying plate.

However, in the substrate processing apparatus having the above-described structure, baking chambers are provided on one side of both sides of the conveyance chamber in the longitudinal direction, thereby limiting the number of liquid processing chambers provided in the coating module or the developing module.

In addition, the substrate provided in the container is taken out by the robot provided in the index module and placed in the buffer, and then the robot provided in the transfer chamber takes out the substrate placed in the buffer and transfers it to the baking chamber, and when the baking process is completed, the substrate is applied again. It must be returned to the chamber. Therefore, a large number of transfer steps are required before the substrate is brought into the application chamber from the container. Such a large number of transfer steps similarly occur in the process of carrying out the substrate from which the process is completed in the application chamber from the application module.

In addition, the transfer plate provided in the bake chamber can directly exchange substrates only with the robots provided in the transfer chamber, so that when the substrate placed on the transfer plate is cooling, the new substrate cannot be heated.

It is an object of the present invention to provide a substrate processing apparatus and method capable of providing a large number of processing chambers within a limited space in a processing module such as an application module or a developing module.

In addition, an object of the present invention is to provide a substrate processing apparatus and method that can reduce the transfer step of the substrate during the processing process.

In addition, an object of the present invention is to provide a substrate processing apparatus and method capable of performing a heat treatment on a new substrate even while performing a cooling treatment on the substrate in the heat treatment chamber.

The object of the present invention is not limited thereto, and other objects not mentioned will be clearly understood by those skilled in the art from the following description.

The present invention provides an apparatus for processing a substrate. According to one embodiment, the substrate processing apparatus includes an index module and a processing module sequentially arranged along a first direction, wherein the index module includes a load port on which a container containing a substrate is placed, a container placed on the load port, and An index frame provided with an index robot for transferring a substrate between the processing modules, the processing module includes a coating block for forming a liquid film by applying a liquid on the substrate, the coating block is a heat treatment unit for heat treating the substrate, the substrate And a conveying part provided with a conveying robot for conveying the substrate between the heat treatment part and the liquid processing part, the liquid processing part supplying a liquid onto the substrate and applying the liquid to the substrate, wherein the liquid processing part is based on the first direction. It is disposed in the side portion, the heat treatment portion includes a shear heat treatment chamber disposed between the conveying portion and the index frame It is.

According to one embodiment, the shear heat treatment chamber includes a housing, a heating unit disposed in the housing and heating the substrate, a cooling unit disposed in the housing and cooling the substrate, and a conveying member for conveying the substrate in the housing. The heating unit and the cooling unit may be disposed along a second direction perpendicular to the first direction when viewed from the top.

According to one embodiment, when viewed from the first direction, the housing includes a first region overlapping with the conveying unit and a second region deviating from the region overlapping with the conveying unit, and the cooling unit includes the first region. The heating unit may be disposed in an area, and the heating unit may be disposed in the second area.

According to one embodiment, the transfer robot may be provided to directly exchange the substrate with the shear heat treatment chamber.

According to one embodiment, the index robot may be provided to convey the substrate to the heating unit of the shear heat treatment chamber.

According to one embodiment, the plurality of shear heat treatment chambers are provided, the plurality of shear heat treatment chambers are divided into a first group and a second group, the heat treatment chamber of the first group and the heat treatment chamber of the second group is Arranged along a second direction, each of the first group and the second group may be provided with one heat treatment chamber or a plurality of heat treatment chambers stacked on each other.

In example embodiments, the substrate processing apparatus may further include an interface module provided on an opposite side of the index module with respect to the processing module and connected to an exposure apparatus.

According to one embodiment, the interface module includes an interface frame and a conveying means disposed in the interface frame to convey the substrate, and the heat treatment part further comprises a rear end heat treatment chamber disposed between the conveyance part and the interface frame. Can be.

According to one embodiment, the post-heat treatment chamber further comprises a housing, a heating unit disposed in the housing and heating the substrate, a cooling unit disposed in the housing and cooling the substrate, and a conveying member for conveying the substrate in the housing. And the heating unit and the cooling unit are disposed along a second direction perpendicular to the first direction when viewed from the top, and wherein the housing overlaps with the conveying unit when viewed from the first direction. And a second area deviating from an area overlapping the area and the conveying part, wherein one of the cooling unit and the heating unit is disposed in the first area, and the other is disposed in the second area, The robot may be provided to convey the substrate directly from the post heat treatment chamber.

According to one embodiment, the liquid treatment unit is provided on both sides of the conveying unit, respectively, a plurality of the post-heat treatment chamber is provided, the plurality of post-heat treatment chamber is divided into a first group and a second group, the first The heat treatment chamber of the group and the heat treatment chamber of the second group may be arranged along the second direction, and each of the first group and the second group may be provided with one heat treatment chamber or a plurality of heat treatment chambers stacked on each other.

According to one embodiment, the conveying part includes a front conveying chamber disposed adjacent to the front end heat treatment chamber and provided with a front conveying robot, and a rear conveying chamber disposed adjacent to the rear end heat treating chamber and provided with a rear conveying robot, wherein the front end conveying chamber is provided. The conveying chamber and the rear stage conveying chamber are arranged side by side in the first direction, and the heat treatment part further comprises an intermediate heat treatment chamber disposed between the front conveying chamber and the rear conveying chamber, and the liquid treatment part is provided with the first treatment chamber. A first liquid processing chamber disposed on the side of the front conveying chamber based on a direction and performing a process of applying a first liquid to the substrate, and disposed on the side of the rear conveying chamber based on the first direction, It may include a second liquid treatment chamber for performing a process for applying a second liquid to the.

According to one embodiment, the intermediate heat treatment chamber further comprises a housing, a heating unit disposed in the housing and heating the substrate, a cooling unit disposed in the housing and cooling the substrate, and a conveying member for conveying the substrate in the housing. And the heating unit and the cooling unit are disposed along a second direction perpendicular to the first direction when viewed from the top, and wherein the housing conveys the front conveying chamber and the rear end conveying when viewed from the first direction. A first region overlapping the chamber and a second region deviating from the region overlapping the front conveying chamber and the rear conveying chamber, wherein one of the cooling unit and the heating unit is disposed in the first region, and One is disposed in the second area, and the front conveying robot and the rear conveying robot each half the intermediate heat treatment chamber and the direct substrate. To be provided.

In example embodiments, the processing module may further include a development block provided to be stacked with the application block and performing a development process.

According to another embodiment of the present invention, a substrate processing apparatus includes an index module, a processing module, and an interface module sequentially arranged along a first direction, wherein the index module includes a load port on which a container in which a substrate is accommodated is placed and And an index frame provided with an index robot for transferring a substrate between the container placed in the load port and the processing module, wherein the processing module is provided to be laminated with the coating block to perform a coating process for forming a liquid film on the substrate. And a developing block for performing a developing process, wherein the interface module includes an interface frame connected to an external exposure apparatus and a transfer member disposed in the interface frame, wherein the coating block and the developing block heat-treat the substrate, respectively. Heat treatment chamber to supply liquid to the substrate And a transfer chamber having a burr and a transfer robot for transferring a substrate between the heat treatment chamber and the liquid treatment chamber, wherein the heat treatment chamber is disposed in the housing, the heating unit arranged to heat the substrate, and disposed within the housing. And a conveying member for conveying the substrate in the housing, wherein the housing is free from the first region overlapping with the conveying chamber and the region overlapping with the conveying chamber when viewed from the first direction. And a second region, wherein one of the cooling unit and the heating unit is disposed in the first region, and the other is disposed in the second region.

In example embodiments, the cooling unit may be disposed in the first region, and the heating unit may be disposed in the second region.

According to one embodiment, the heat treatment chamber provided in the application block includes a shear heat treatment chamber disposed between the index module and the processing module, wherein in the application block, the transfer robot and the index robot are each shear heat treatment. It may be provided to exchange the substrate directly with the chamber.

According to one embodiment, the heat treatment chamber provided in the developing block includes a rear stage heat treatment chamber disposed between the processing module and the interface module, and in the developing block, the transfer member provided to the transfer robot and the interface includes: It may be provided to directly exchange the substrate with the post-heat treatment chamber.

According to one embodiment, the conveying chamber provided in the coating block includes a front conveying chamber adjacent to the index module and a rear conveying chamber adjacent to the interface module, and the front conveying chamber and the rear conveying chamber are in the first direction. Arranged along, the heat treatment chamber further comprises an intermediate heat treatment chamber disposed between the front conveying chamber and the rear conveying chamber and a rear heat treating chamber disposed between the rear conveying chamber and the interface module, the shear conveying chamber The transport robot provided in the transport robot and the transport robot provided in the rear transport chamber may be provided to directly exchange the substrate with the intermediate heat treatment chamber.

According to one embodiment, the liquid processing chamber provided in the application block is disposed on the side of the front conveying chamber relative to the first direction, the front liquid processing chamber for performing a process of applying a first liquid to the substrate; It may include a rear stage liquid processing chamber disposed on the side of the rear stage conveying chamber relative to the first direction, and performs a process of applying a second liquid to the substrate.

According to one embodiment, the liquid treatment chamber is provided on both sides of the conveying chamber, the plurality of heat treatment chambers are provided, the plurality of heat treatment chambers are divided into a first group and a second group, the first The heat treatment chamber of the group and the heat treatment chamber of the second group are arranged along the second direction perpendicular to the first direction when viewed from the top, and each of the heat treatment chambers of the first group and the second group is one or stacked on each other. A plurality of heat treatment chambers may be provided.

According to one embodiment, the developing block or the application block may further include a transfer mechanism for transporting a substrate between the buffer and the heat treatment chamber stacked on each other and one or a plurality of buffers provided to be stacked with the heat treatment chamber. .

According to one embodiment, the heat treatment chamber provided in the developing block includes a shear heat treatment chamber disposed between the index frame and the transfer chamber, and the substrate processing apparatus is provided in a stack with the shear heat treatment chamber. The apparatus may further include a transfer mechanism disposed between the buffer and the index frame and the transfer chamber to transfer the substrate between the shear heat treatment chamber and the buffer.

According to one embodiment, the index robot and the transfer robot provided in the developing block may be provided to exchange a substrate directly with the buffer.

In an embodiment, the interface module may further include an additional process chamber provided in the interface frame and performing a predetermined process on the substrate, and one or more interface buffers provided in the interface frame and storing the substrate. have.

In one embodiment, the heat treatment chambers provided in the application block and the development block may further include a post-heat treatment chamber disposed between the processing module and the interface module, respectively.

According to one embodiment, the conveying member is a first robot for directly transporting the substrate between the interface buffer and the post-heat treatment chamber of the coating block, an interface robot for transporting the substrate between the interface buffer and the exposure apparatus, and the interface buffer And a second robot directly transferring the substrate between the post-heat treatment chambers of the developing block.

The present invention also provides a substrate processing method. According to an embodiment of the present invention, the substrate processing method includes the step of conveying the substrate directly to the heating unit by the index robot, heat treating the substrate in the heating unit, the conveying member takes over the substrate in the heating unit Transferring the substrate to the second region, cooling the substrate in the second region, and the transfer robot directly takes the substrate from the first region and transfers the substrate directly to the liquid processing unit, and at the liquid processing unit. Applying a liquid onto the substrate.

According to another embodiment of the present invention, the substrate processing method includes the step of conveying the substrate to the heating unit of the shear heat treatment chamber by the index robot, the heat treatment of the substrate in the heating unit of the shear heat treatment chamber, the conveying member Acquiring the substrate by a heating unit of the shear heat treatment chamber and transferring the substrate to a first region of the shear heat treatment chamber; and cooling the substrate in the first region of the shear heat treatment chamber. Taking the substrate from the first region of the shear heat treatment chamber and conveying the substrate to the shear liquid treatment chamber; applying the first liquid onto the substrate in the shear liquid treatment chamber; Conveying the substrate to the first region of the intermediate heat treatment chamber, and the conveying member of the intermediate heat treatment chamber. Transferring the substrate from the first region of the intermediate heat treatment chamber to a heating unit of the intermediate heat treatment chamber, heating the substrate in the heating unit of the intermediate heat treatment chamber, wherein the transfer member of the intermediate heat treatment chamber is Transferring the substrate from the heating unit of the intermediate heat treatment chamber to the first region of the intermediate heat treatment chamber, cooling the substrate in the first region of the intermediate heat treatment chamber, and the rear transfer robot is configured to perform the intermediate heat treatment chamber. Taking the substrate in the first region of the substrate and transferring the substrate to the second liquid processing chamber; applying the second liquid on the substrate in the second liquid processing chamber; Conveying the substrate to a first region of the substrate; Transferring the substrate to a heating unit of the post-heat treatment chamber in a region, heating the substrate from a heating unit of the post-heat treatment chamber, and a conveying member of the post-heat treatment chamber heats the substrate in the post-heat treatment chamber. Transferring the unit to a first region of the post-heat treatment chamber, and cooling the substrate in the first region of the post-heat treatment chamber.

In example embodiments, the first liquid may be a liquid for forming an anti-reflection film on a substrate, and the second liquid may be a liquid for forming a photoresist film on the anti-reflection film formed on the substrate.

According to the present invention, a large number of processing chambers can be provided in a limited space in an application module or a development module.

Moreover, according to this invention, the conveyance step of a board | substrate can be reduced at the time of advancing a processing process.

In addition, according to the present invention, a heat treatment can be performed on a new substrate even while a cooling treatment is performed on the substrate in the heat treatment chamber.

The effects of the present invention are not limited to the above-described effects, and effects that are not mentioned will be clearly understood by those skilled in the art from the present specification and the accompanying drawings.

1 is a perspective view schematically showing a substrate processing apparatus according to an embodiment of the present invention.
2 is a front view of the substrate processing apparatus of FIG. 1.
3 is a plan view of the substrate processing apparatus of FIG. 1 showing an application block.
4 is a plan view of the substrate processing apparatus of FIG. 1 showing a developing block.
5 is a view showing an example of a hand of the transfer robot.
6 is a plan view schematically illustrating an example of a heat treatment chamber.
7 is a front view of the heat treatment chamber of FIG. 6.
8 is a view schematically showing an example of a liquid processing chamber.
9 is a flowchart sequentially showing a substrate processing method.
FIG. 10 is a view schematically showing an example of a conveyance path of a substrate before being carried into the exposure apparatus in the container.
11 is a view schematically showing an example of a transport path of a substrate to a container after being taken out of the exposure apparatus.
12 to 16 are views schematically showing another example of the substrate processing apparatus of the present invention.

Hereinafter, embodiments of the present invention will be described in more detail with reference to the accompanying drawings. The embodiments of the present invention can be modified in various forms, and the scope of the present invention should not be construed as being limited to the following embodiments. This embodiment is provided to more completely explain the present invention to those skilled in the art. Therefore, the shape of the elements in the drawings are exaggerated to emphasize a more clear description.

1 is a perspective view schematically illustrating a substrate processing apparatus according to an embodiment of the present invention, and FIG. 2 is a front view of the substrate processing apparatus of FIG. 1. 3 is a plan view of the substrate processing apparatus of FIG. 1 showing an application block, and FIG. 4 is a plan view of the substrate processing apparatus of FIG. 1 showing a developing block.

1 to 4, the substrate processing apparatus 1 includes an index module 20, a processing module 30, and an interface module 40. According to one embodiment, the index module 20, the processing module 30, and the interface module 40 are sequentially arranged in a line. Hereinafter, the direction in which the index module 20, the processing module 30, and the interface module 40 are arranged is referred to as a first direction 12, and a direction perpendicular to the first direction 12 when viewed from the top. A direction perpendicular to both the first direction 12 and the second direction 14 is referred to as a second direction 14 and is referred to as a third direction 16.

The index module 20 conveys the board | substrate W from the container 10 in which the board | substrate W was accommodated to the processing module 30, and accommodates the completed board | substrate W in the container 10. FIG. The longitudinal direction of the index module 20 is provided in the second direction 14. The index module 20 has a load port 22 and an index frame 24. The load port 22 is located on the opposite side of the processing module 30 with respect to the index frame 24. The container 10 in which the substrates W are accommodated is placed in the load port 22. A plurality of load ports 22 may be provided, and the plurality of load ports 22 may be disposed along the second direction 14.

As the container 10, a sealed container 10 such as a front open unified pod (FOUP) may be used. The vessel 10 may be placed in the load port 22 by an operator or by a transfer means (not shown), such as an overhead transfer, an overhead conveyor, or an automatic guided vehicle. Can be.

An index robot 2200 is provided inside the index frame 24. In the index frame 24, a guide rail 2300 having a longitudinal direction in the second direction 14 may be provided, and the index robot 2200 may be provided to be movable on the guide rail 2300. The index robot 2200 includes a hand 2220 on which the substrate W is placed, and the hand 2220 moves forward and backward, rotates about the third direction 16, and the third direction 16. It may be provided to be movable along.

The processing module 30 performs an application process and a development process on the substrate W. FIG. The processing module 30 has an application block 30a and a developing block 30b. The coating block 30a performs a coating process on the substrate W, and the developing block 30b performs a developing process on the substrate W. As shown in FIG. A plurality of application blocks 30a are provided, and they are provided stacked on each other. A plurality of developing blocks 30b are provided, and the developing blocks 30b are provided stacked on each other. According to the embodiment of Fig. 1, two application blocks 30a are provided, and two development blocks 30b are provided. The application blocks 30a may be disposed below the development blocks 30b. According to an example, the two application blocks 30a perform the same process with each other and may be provided in the same structure with each other. In addition, the two developing blocks 30b may perform the same process and may be provided in the same structure.

Referring to FIG. 3, the application block 30a has a heat treatment part 3200, a heat treatment part 3400, a transfer part 3400, and a liquid treatment part 3600. The heat treatment unit 3200 performs a heat treatment process on the substrate (W). The heat treatment process may include a cooling process and a heating process. The liquid processor 3600 supplies a liquid onto the substrate W to form a liquid film. The liquid film may be a photoresist film or an antireflection film. The conveying unit 3400 conveys the substrate W between the heat treatment unit 3200 and the liquid processing unit 3600 in the application block 30a.

The conveying unit 3400 has a plurality of conveying chambers 3402 and 3404. The conveying chambers 3402 and 3404 are provided with their longitudinal directions parallel to the first direction 12. The transfer robots 3342 and 3424 are provided in the transfer chambers 3402 and 3404. According to one example, the transfer robots 3422 and 3424 have a hand 3420 on which the substrate W is placed, the hand 3420 moving forward and backward, rotating about the third direction 16, and It may be provided to be movable along three directions 16. In the conveyance chambers 3402, 3404, guide rails 3300 are provided, the longitudinal direction of which is provided in parallel with the first direction 12, and the transfer robots 3342, 3424 are movable on the guide rails 3300. Can be provided.

5 is a view showing an example of a hand of the transfer robot. Referring to FIG. 5, the hand 3420 has a base 3428 and a support protrusion 3429. The base 3428 may have an annular ring shape in which a portion of the circumference is bent. The base 3428 has an inner diameter larger than the diameter of the substrate W. The support protrusion 3429 extends inward from the base 3428. A plurality of support protrusions 3429 may be provided to support edge regions of the substrate W. As shown in FIG. By way of example, four support protrusions 3429 may be provided at equal intervals.

2 and 3, two conveying chambers 3402 and 3404 may be provided, and two conveying chambers may be arranged along the first direction 12. The two transfer chambers 3402 and 3404 may be provided in the same structure with each other. Hereinafter, a transfer chamber located closer to the index module 20 among the two transfer chambers 3402 and 3404 is referred to as a front transfer chamber 3402 and positioned closer to the interface module 40. The transferred transfer chamber is referred to as a rear transfer chamber 3404. In addition, the conveyance robot provided in the front conveyance chamber 3402 is called the shear conveyance robot 3342, and the conveyance robot provided in the rear conveyance chamber 3404 is called the rear conveyance robot 3424.

The heat treatment unit 3200 has a plurality of heat treatment chambers 3202, 3204, and 3206. 6 is a plan view schematically illustrating an example of a heat treatment chamber, and FIG. 7 is a front view of the heat treatment chamber of FIG. 6. The heat treatment chambers 3202, 3204, 3206 have a housing 3210, a cooling unit 3220, a heating unit 3230, and a conveying plate 3240.

Housing 3210 is generally provided in the shape of a cuboid. An inlet (not shown) through which the substrate W enters and exits is formed on the sidewall of the housing 3210. One or two inlets may be provided depending on the positions provided in the heat treatment chambers 3202, 3204, and 3206. The inlet can be kept open. A door (not shown) may optionally be provided to open and close the entrance. The cooling unit 3220, the heating unit 3230, and the conveying plate 3240 are provided in the housing 3210. The interior of the housing 3210 has a first region 3212 and a second region 3214. The first region 3212 and the second region 3214 are provided side by side along the second direction 14. According to an example, the heat treatment chambers 3202, 3204, and 3206 have a first region 3212 overlapping with the transfer chambers 3402 and 3404 and the second region 3214 is conveyed when viewed from the first direction 12. It is disposed to be out of a position overlapping with the chambers 3402 and 3404. According to an example, the cooling unit 3220 is disposed in the first region 3212, and the heating unit 3230 is disposed in the second region 3214.

The cooling unit 3220 has a cooling plate 3222. The cooling plate 3222 may have a generally circular shape when viewed from the top. The cooling plate 3222 is provided with a cooling member 3224. According to an example, the cooling member 3224 is formed inside the cooling plate 3222 and may be provided as a flow path through which a cooling fluid flows.

The heating unit 3230 has a heating plate 3322, a cover 3234, and a heater 3333. The heating plate 3322 has a generally circular shape when viewed from the top. The heating plate 3322 has a larger diameter than the substrate W. As shown in FIG. The heater 3333 is provided in the heating plate 3322. The heater 3333 may be provided as a heat generating resistor to which a current is applied. The heating plate 3322 is provided with lift pins 3238 that can be driven in the vertical direction along the third direction 16. The lift pins 3328 receive the substrate W from the conveying means outside the heating unit 3230 and place it on the heating plate 3322 or lift the substrate W from the heating plate 3322 to move the substrate W outside the heating unit 3230. Turn over to the conveying means. According to one example, three lift pins 3238 may be provided. The cover 3234 has a space in which the lower portion is open. The cover 3234 is positioned above the heating plate 3322 and moved up and down by the driver 3236. When the cover 3234 is in contact with the heating plate 3322, the space surrounded by the cover 3234 and the heating plate 3322 is provided as a heating space for heating the substrate W. As shown in FIG.

The conveying plate 3240 is generally provided in a disc shape and has a diameter corresponding to that of the substrate W. As shown in FIG. A notch 3244 is formed at the edge of the conveying plate 3240. The notch 3244 may have a shape corresponding to the protrusion 3429 formed on the hands 3420 of the transfer robots 3422 and 3424. In addition, the notch 3344 is provided in a number corresponding to the protrusion 3429 formed in the hand 3420, and is formed at a position corresponding to the protrusion 3429. When the upper and lower positions of the hand 3420 and the conveying plate 3240 are changed at the position where the hand 3420 and the conveying plate 3240 are aligned in the vertical direction, the substrate W may be moved between the hand 3420 and the conveying plate 3240. Delivery takes place. The conveying plate 3240 is mounted on the guide rail 3249 and may be moved between the first region 3212 and the second region 3214 along the guide rail 3249 by the driver 3246. The conveyance plate 3240 is provided with a plurality of slit-shaped guide grooves 3322. The guide groove 3324 extends from the end of the conveying plate 3240 to the inside of the conveying plate 3240. The guide grooves 3322 are provided in the longitudinal direction along the second direction 14, and the guide grooves 3324 are positioned to be spaced apart from each other along the first direction 12. The guide groove 3322 prevents the conveying plate 3240 and the lift pins 3238 from interfering with each other when the takeover of the substrate W is made between the conveying plate 3240 and the heating unit 3230.

According to the embodiment of FIG. 6, the heating of the substrate W is performed while the substrate W is directly placed on the heating plate 3322, and the cooling of the substrate W is carried by the transfer plate 3240 on which the substrate W is placed. ) Is in contact with the cold plate 3322. The transfer plate 3240 is made of a material having a high heat transfer rate so that heat transfer between the cooling plate 3222 and the substrate W is performed well. According to an example, the conveying plate 3240 may be provided with a metal material.

The heating unit 3230 provided in the heat treatment chambers of some of the heat treatment chambers 3202, 3204, and 3206 may supply gas during heating of the substrate W to improve the adhesion rate of the substrate W of the photoresist. In one example, the gas may be a hexamethyldisilane gas.

2 and 3, some of the heat treatment chambers 3202, 3204, 3206 are provided in a location adjacent to the index module 20. Hereinafter, these heat treatment chambers are referred to as a front heat treatment chamber 3202. The other portion of the heat treatment chambers 3202, 3204, 3206 is provided at a location adjacent to the interface module 40. Hereinafter, these heat treatment chambers are referred to as a rear heat treating chamber (3206). Another portion of the heat treatment chambers 3202, 3204, 3206 is located between the front heat treatment chamber 3202 and the back heat treatment chamber 3204. Hereinafter, these heat treatment chambers have a middle heat treating chamber (3204).

According to one example, the front end heat treatment chamber 3202, the back end heat treatment chamber 3204, and the intermediate heat treatment chamber 3206 may be provided in substantially the same arrangement and the same number except for the positions of the inlets through which the substrate W enters and exits. Can be. Hereinafter, the arrangement of the shear heat treatment chamber 3202 will be briefly described.

The shear heat treatment chamber 3202 is provided in plurality. According to an example, the shear heat treatment chambers 3202 are divided into a first group 3202a and a second group 3202b. One or a plurality of shear heat treatment chambers 3202 are provided in the first group 3202a and the second group 3202b, respectively. Shear heat treatment chambers 3202 belonging to the same group are provided to be stacked on each other. In an example, three shear heat treatment chambers 3202 may be provided in the first group 3202a and the second group 3202b, respectively. The shear heat treatment chamber 3202 belonging to the first group 3202a and the shear heat treatment chamber 3202 belonging to the second group 3202b are disposed along the second direction 14 when viewed from the top. In this case, in the shear heat treatment chamber 3202 belonging to the first group 3202a, the second region 3214 of the housing 3210 and the shear heat treatment chamber 3202 belonging to the second group 3202b may be used. The second regions 3214 are disposed on opposite sides of the second region 3214 based on a line parallel to the longitudinal direction of the carrier 3400.

The liquid processing unit 3600 has a plurality of liquid processing chambers 3602 and 3604. The liquid treatment chambers 3602 and 3604 may be provided in plural along the longitudinal direction of the transfer part 3400. In addition, some of the liquid treatment chambers 3602 and 3604 may be provided to be stacked on each other. 8 is a diagram schematically showing an example of the liquid treatment chambers 3602 and 3604.

Referring to FIG. 8, the liquid treatment chambers 3602 and 3604 have a housing 3610, a cup 3620, a support unit 3640, and a liquid supply unit 3660. Housing 3610 is generally provided in the shape of a cuboid. An inlet (not shown) through which the substrate W enters and exits is formed on the sidewall of the housing 3610. The inlet can be opened and closed by a door (not shown). The cup 3620, the support unit 3640, and the liquid supply unit 3660 are provided in the housing 3610. The upper wall of the housing 3610 may be provided with a fan filter unit 3670 to form a downdraft in the housing 3260. Cup 3620 has a processing space with an open top. The support unit 3640 is disposed in the processing space and supports the substrate W. FIG. The support unit 3640 is provided such that the substrate W is rotatable during the liquid treatment. The liquid supply unit 3660 supplies the liquid to the substrate W supported by the support unit 3640.

2 and 3, some of the liquid treatment chambers 3602 and 3604 may be disposed on the side of the front conveying chamber 3402. Hereinafter, these liquid treatment chambers are referred to as front liquid treating chambers 3602. Another portion of the liquid treatment chambers 3602, 3604 may be disposed on the side of the rear conveying chamber 3404. Hereinafter, these liquid treatment chambers are referred to as rear heat treating chambers 3604. The shear liquid treatment chamber 3602 may be provided at both sides thereof based on the longitudinal direction of the shear transfer chamber 3402. The rear stage liquid treatment chamber 3604 may be provided at both sides thereof based on the longitudinal direction of the rear stage transfer chamber 3404.

The front liquid treatment chamber 3602 applies the first liquid on the substrate W, and the rear liquid treatment chamber 3604 applies the second liquid on the substrate W. FIG. The first liquid and the second liquid may be different kinds of liquids. According to one embodiment, the first liquid is an antireflection film and the second liquid is a photoresist. The photoresist may be applied onto the substrate W on which the antireflection film is applied. Optionally, the first liquid may be a photoresist and the second liquid may be an antireflection film. In this case, the antireflection film may be applied onto the substrate W to which the photoresist is applied. Optionally, the first liquid and the second liquid are liquids of the same kind, both of which may be photoresists.

2 and 4, the developing block 30b includes a heat treatment unit 3200, a transfer unit 3400, and a liquid treatment unit 3600. The heat treatment unit 3200, the conveying unit 3400, and the liquid processing unit 3600 of the developing block 30b are formed by the heat treatment unit 3200, the conveying unit 3400, and the liquid processing unit 3600 of the application block 30a. It may be provided in a generally similar structure and arrangement.

According to the embodiment of FIG. 4, the shear heat treatment chamber 3202 of the developing block 30b is provided only on one side of the conveyance chamber 3600 based on a line extending in the longitudinal direction. The developing block 30b may additionally be provided with a front end buffer 3802 and a transfer mechanism 3900. A plurality of front end buffers 3802 are provided and stacked on each other. The shear buffer 3802 is provided to be stacked with the shear heat treatment chamber 3202. In one example, the shear buffer 3802 is disposed below the shear heat treatment chamber 3202. The transfer mechanism 3900 conveys the substrate W between the shear heat treatment chamber 3202 and the shear buffer 3802. Each transfer mechanism 3900 includes a hand 3920 on which the substrate W is placed, and the hand 3920 may be provided to move forward and backward and move along the third direction 16. Only one transfer mechanism 3900 is provided for the plurality of development blocks 30b, and the transfer mechanism 3900 may carry the substrate W between the development blocks 30b. Alternatively, a transfer mechanism 3900 may be provided to each of the plurality of developing blocks 30b.

Optionally, an intermediate buffer (not shown) may be provided between the front end transfer robot 3342 and the rear end transfer robot 3424 of the developing block 30b to exchange the substrate W therein. In this case, a plurality of intermediate buffers may be provided to be stacked with the intermediate heat treatment chamber 3206. Alternatively, the intermediate heat treatment chamber 3206 may be provided on only one side of the conveyance chamber 3400 based on a line extending in the longitudinal direction, and an intermediate buffer may be provided on the opposite side of the intermediate heat treatment chamber 3206. Optionally, a rear end buffer (not shown) may be provided to exchange the substrate W between the rear end transfer robot 3424 of the developing block 30b and the transfer member 4600 of the interlace module. In this case, a plurality of back end buffers may be provided to be stacked with the back end heat treatment chamber 3204. Alternatively, the rear end heat treatment chamber 3204 may be provided on only one side of the transfer chamber 3400 based on a line extending in the longitudinal direction, and a rear end buffer may be provided on the opposite side of the rear end heat treatment chamber 3204.

In addition, a shear buffer (not shown) may optionally be provided between the index module 20 and the shear conveyance chamber 3402 of the application block 30a. Optionally, an intermediate buffer (not shown) may be provided between the front conveying chambers 3402 and 3404 of the application block 30a and the rear conveying chambers 3402 and 3404. Optionally, a back end buffer may be provided between the back end transfer chambers 3402 and 3404 of the application block 30a and the interface module 40.

The interface module 40 connects the processing module 30 to an external exposure apparatus 50. The interface module 40 has an interface frame 4100, an additional process chamber 4200, an interface buffer 4400, and a conveying member 4600.

The upper end of the interface frame 4100 may be provided with a fan filter unit to form a downdraft therein. The additional process chamber 4200, the interface buffer 4400, and the conveying member 4600 are disposed in the interface frame 4100. The additional process chamber 4200 may perform a predetermined additional process before the substrate W, which has been processed in the application block 30a, is carried into the exposure apparatus 50. Optionally, the additional process chamber 4200 may perform a predetermined additional process before the substrate W, which has been processed in the exposure apparatus 50, is carried into the developing block 30b. According to an example, the addition process may be an edge exposure process of exposing the edge region of the substrate W, an upper surface cleaning process of cleaning the upper surface of the substrate W, or a lower surface cleaning process of cleaning the lower surface of the substrate W. Can be. A plurality of additional process chambers 4200 may be provided, and they may be provided to be stacked on each other. The additional process chambers 4200 may all be provided to perform the same process. Optionally, some of the additional process chambers 4200 may be provided to perform different processes.

The interface buffer 4400 provides a space in which the substrate W to be transported between the application block 30a, the additional process chamber 4200, the exposure apparatus 50, and the developing block 30b temporarily stays during the transport. The interface buffer 4400 may be provided in plural, and the plurality of interface buffers 4400 may be provided to be stacked on each other.

According to an example, an additional process chamber 4200 may be disposed on one side of the carrier 3400 and an interface buffer 4400 on the other side of the carrier 3400.

The conveying member 4600 conveys the substrate W between the application block 30a, the additional process chamber 4200, the exposure apparatus 50, and the developing block 30b. The conveying member 4600 may be provided by one or a plurality of robots. According to one example, the conveying member 4600 has a first robot 4602, a second robot 4604, and an interface robot 4606. The first robot 4602 transfers the substrate W between the application block 30a, the additional process chamber 4200, and the interface buffer 4400, and the interface robot 4606 uses the interface buffer 4400 and the exposure apparatus ( The substrate W may be transported between 50, and a second robot 4604 may be provided to transport the substrate W between the interface buffer 4400 and the developing block 30b.

The first robot 4602, the interface robot 4606, and the second robot 4604 each include a hand on which the substrate W is placed, and the hand moves forward and backward, with axes parallel to the third direction 16. It may be provided to be rotatable relative to the reference, and to be movable along the third direction 16.

The hands of the index robot 2200, the first robot 4602, the interface robot 4606, and the second robot 4460 may all be provided in the same shape as the hands 3420 of the transfer robots 3422 and 3424. . Optionally, the hand of the robot that directly exchanges the substrate W with the transfer plate 3240 of the heat treatment chamber is provided in the same shape as the hand 3420 of the transfer robots 3342 and 3424, and the hands of the remaining robots have different shapes. It may be provided as.

According to one embodiment, the index robot 2200 is provided to directly exchange the substrate W with the heating unit 3230 of the shear heat treatment chamber 3202 provided in the application block 30a.

In addition, the shear transfer robot 3422 provided in the application block 30a includes the transfer plate 3240 located in the first region 3212 of the shear heat treatment chamber 3202 and the second region 3214 of the intermediate heat treatment chamber 3206. Each of the transfer plate 3240 and the front end liquid treatment chamber 3602 may be provided to directly exchange the substrate W. Further, the rear stage transfer robot 3424 provided in the application block 30a has a transfer plate 3240 located in the first region 3212 of the intermediate heat treatment chamber 3206 and a first region 3212 of the rear stage heat treatment chamber 3204. The transfer plate 3240 and the substrate W may be directly exchanged with the rear liquid treatment chamber 3604.

In addition, the shear transfer robot 3422 provided in the developing block 30b includes a shear buffer 3802, a transfer plate 3240 located in the first region 3212 of the intermediate heat treatment chamber 3206, and a shear liquid treatment chamber 3602. It is provided to exchange the substrate (W) directly with. In addition, the shear transfer robot 3342 provided to the developing block 30b may exchange the substrate W directly with the transfer plate 3240 and / or the rear buffer located in the first region 3212 of the shear heat treatment chamber 3202. May be provided. The back stage transfer robot 3424 provided in the developing block 30b is disposed on the transfer plate 3240 located in the first region 3212 of the intermediate heat treatment chamber 3206 and the first region 3212 of the rear stage heat treatment chamber 3204. It is provided to directly exchange the substrate (W) with the transport plate (3240) positioned, and the rear liquid treatment chamber (3604). In addition, the rear end transfer robot 3424 provided in the developing block 30b may be provided to exchange the substrate W with the intermediate buffer and / or the rear end buffer.

In addition, in the interface module 40, the first robot 4602 may include a transfer plate 3240, an interface buffer 4400, and a transfer plate 3240 located in the first area 3212 of the rear end heat treatment chamber 3204 provided in the application block 30a. It may be provided to exchange the auxiliary process chamber 4200 and the substrate (W). The second robot 4604 may be provided to exchange the substrate W with the heating unit 3230 and the interface buffer 4400 of the post-heat treatment chamber 3204 provided to the developing block 30b. In addition, the interface robot 4606 may be provided to exchange the substrate W with the interface buffer 4400 and the exposure apparatus 50.

Next, an embodiment of a method of processing a substrate using the substrate processing apparatus of FIG. 1 will be described with reference to FIGS. 9 through 11.

9 is a flowchart sequentially showing a substrate processing method. FIG. 10 is a view schematically showing an example of a conveyance path of a substrate before being carried into the exposure apparatus in the container, and FIG. 11 is a view schematically showing an example of a conveyance path of the substrate from the exposure apparatus to the container after being taken out.

Referring to FIG. 9, a coating treatment step S20, an edge exposure step S40, an exposure step S60, and a development step S80 are sequentially performed on the substrate W. In FIG.

Coating treatment step (S20) is a heat treatment step (S21) in the shear heat treatment chamber (3202), an anti-reflection film coating step (S22) in the shear liquid treatment chamber 3602, a heat treatment step (S23), the rear end in the intermediate heat treatment chamber (3206) The photoresist film applying step (S24) in the liquid treatment chamber 3604 and the heat treatment step (S25) in the subsequent heat treatment chamber 3204 are performed sequentially.

Hereinafter, an example of the conveyance path | route of the board | substrate W from the container 10 to the exposure apparatus 50 is demonstrated with reference to FIG.

The index robot 2200 removes the substrate W from the container 10 and conveys the substrate W to the heating unit 3230 of the shear heat treatment chamber 3202. When the heating process is completed in the shear heat treatment chamber 3202, the transfer plate 3240 takes out the substrate W from the heating unit 3230 disposed in the second region 3214 of the shear heat treatment chamber 3202, and thus the shear heat treatment chamber After moving to the first region 3212 of 3202, the conveying plate 3240 contacts the cooling unit 3220 to perform a cooling process. When the cooling process is completed, the transfer plate 3240 is moved to the upper portion of the cooling unit 3220, and the shear transfer robot 3342 takes out the substrate W from the first region 3212 of the shear heat treatment chamber 3202. To the front liquid processing chamber 3602.

In the shear liquid treatment chamber 3602, an antireflection film is applied onto the substrate W. FIG.

The shear transfer robot 3342 takes the substrate W out of the shear liquid treatment chamber 3602 and loads the substrate W into the first region 3212 of the intermediate heat treatment chamber 3206. In the first region 3212 of the intermediate heat treatment chamber 3206, the transfer plate 3240 conveys the substrate W to the heating unit 3230 provided in the second region 3214 of the intermediate heat treatment chamber 3206. When the heating process is completed, the conveying plate 3240 removes the substrate W from the heating unit 3230 and moves to the first region 3212 of the intermediate heat treatment chamber 3206, after which the conveying plate 3240 is cooled. The unit 3220 is contacted to perform a cooling process. When the cooling process is completed, the conveying plate 3240 is moved to the upper portion of the cooling unit 3220, and the rear conveying robot 3424 carries out the substrate W from the intermediate heat treatment chamber 3206 and the rear liquid treating chamber 3604. Return to).

Thereafter, a photoresist film is applied onto the substrate W in the rear liquid treatment chamber 3604.

The rear stage transfer robot 3424 takes out the substrate W from the rear stage liquid processing chamber 3604 and loads the substrate W into the first region 3212 of the rear stage heat treatment chamber 3204. In the first region 3212, the conveying plate 3240 conveys the substrate W to the heating unit 3230 provided in the second region 3214. When the heating process is completed, the conveying plate 3240 removes the substrate W from the heating unit 3230 and moves to the first region 3212 of the post-heat treatment chamber 3204, after which the conveying plate 3240 is cooled. The unit 3220 is contacted to perform a cooling process. When the cooling process is completed, the conveying plate 3240 is moved to the upper portion of the cooling unit 3220, and the first robot 4602 of the interface module 40 carries out the substrate W from the rear end heat treatment chamber 3204. It returns to the auxiliary process chamber 4200.

An edge exposure process is performed on the substrate W in the auxiliary process chamber 4200.

Thereafter, the first robot 4602 transports the substrate W from the auxiliary process chamber 4200 and conveys the substrate W to the interface buffer 4400.

Thereafter, the interface robot 4606 unloads the substrate W from the interface buffer 4400 and conveys it to the exposure apparatus 50.

In the development treatment step S80, the heat treatment step S81 is performed in the post-heat treatment chamber 3204, the developing process S82 is performed in the rear-end heat treatment chamber 3604, and the heat treatment process S83 is sequentially performed in the intermediate heat treatment chamber 3206. Is done. Alternatively, the developing process S82 may be performed in the shear liquid treatment chamber 3602, and then the heat treatment process S83 may be performed in the shear heat treatment chamber 3202.

Hereinafter, an example of the conveyance path | route of the board | substrate W from the exposure apparatus 50 to the container 10 is demonstrated with reference to FIG.

The interface robot 4606 carries out the substrate W from the exposure apparatus 50 and conveys the substrate W to the interface buffer 4400.

Thereafter, the second robot 4604 carries the substrate W out of the interface buffer 4400 and conveys the substrate W to the heating unit 3230 of the post-heat treatment chamber 3204 of the developing block 30b. When the heating process is completed in the heating unit 3230, the transfer plate 3240 takes the substrate W out of the heating unit 3230 disposed in the second region 3214 of the rear end heat treatment chamber 3204, thereby providing a post heat treatment chamber ( The substrate W is conveyed to the first region 3212 of 3204, and then the conveying plate 3240 contacts the cooling unit 3220 to perform a cooling process. When the cooling process is completed, the transfer plate 3240 is moved to the upper portion of the cooling unit 3220, and the rear stage transfer robot 3424 takes out the substrate W from the first region 3212 of the rear stage heat treatment chamber 3204. To the rear stage liquid processing chamber 3604.

The developing process is performed by supplying a developing solution onto the substrate W in the rear liquid treating chamber 3604.

The rear stage transfer robot 3424 takes out the substrate W from the rear stage liquid processing chamber 3604 and loads the substrate W into the first region 3212 of the intermediate heat treatment chamber 3206 of the developing block 30b. In the first region 3212 of the intermediate heat treatment chamber 3206, the conveying plate 3240 conveys the substrate W to the heating unit 3230 provided in the second region 3214. When the heating process is completed, the conveying plate 3240 removes the substrate W from the heating unit 3230 and moves to the first region 3212 of the intermediate heat treatment chamber 3206, after which the conveying plate 3240 is cooled. The unit 3220 is contacted to perform a cooling process. When the cooling process is completed, the transfer plate 3240 is moved to the upper portion of the cooling unit 3220, and the front end transfer robot 3342 takes out the substrate W from the intermediate heat treatment chamber 3206 to the front end buffer 3802. Return.

Thereafter, the index robot 2200 unloads the substrate W from the front end buffer 3802 and transfers it to the container 10.

Between the index robot 2200 and the front end transfer robot 3342, between the front end transfer robot 3342 and the rear end transfer robot 3424, and between the rear end transfer robot 3424 and the transfer member 4600 of the interface module 40. The transfer of the W may be through a buffer, whereas the transfer of the substrate W therebetween is via a transfer plate 3240 located in the first region 3212 of the heat treatment chambers 3202, 3204, 3206. Can be done. For example, the transfer of the substrate W between the front end transfer robot 3342 and the index robot 2200 may be performed through the front end buffer 3802, and optionally the transfer plate 3240 may include the first of the first heat treatment chamber 3202. The shear transfer robot 3342 transfers the substrate W to the transfer plate 3240 in the state of being located in the area 3212, and then the index robot 2200 is moved from the transfer plate 3240 located in the first area 3212. The substrate W may be delivered.

In the above-described example, the cooling unit is disposed in the first region and the heating unit is disposed in the second region in the entire heat treatment chambers. Alternatively, in some of the heat treatment chambers, the cooling unit may be disposed in the second region, and the heating unit may be disposed in the first region. For example, in the front heat treatment chamber, the cooling unit is disposed in the first region, the heating unit is disposed in the second region, and in the intermediate heat treatment chamber or the post heat treatment chamber, the cooling unit is disposed in the second region, and the heating unit is in the first region. Can be placed in

In the following, various modifications of the present invention will be described schematically. 12 to 16 are views schematically showing another example of the substrate processing apparatus of the present invention.

1 and 2 illustrate the case where two coating blocks 30a and two developing blocks 30b are provided, respectively. However, as shown in FIG. 12, the processing module 30 may include one coating block 30a and one developing block 30b in the substrate processing apparatus 2.

2 to 4, the application block 30a and the developing block 30b have two transfer chambers 3402 and 3404, respectively. Alternatively, as shown in FIG. 13, in the substrate processing apparatus 3, the application block 30a or the development block 30b may include only one transfer chamber 3402. In this case, the liquid treatment chambers 3602 and 3604 provided in the application block 30a may apply different kinds of liquids onto the substrate W. Optionally, the liquid treatment chambers 3602 and 3604 may both be photoresist. Can be applied onto the substrate (W).

3, the front end heat treatment chamber 3202, the front end transfer chamber 3402, the intermediate heat treatment chamber 3206, the rear end conveyance chamber 3404, and the rear end heat treatment chamber 3204 are sequentially applied to the application block 30a. The first liquid processing chamber 3602 is disposed in a line along the direction 12, and the first liquid processing chamber 3602 is disposed at the side of the front conveying chamber 3402, and the second liquid processing chamber 3604 is disposed at the side of the rear conveying chamber 3404. It was described as being deployed. In contrast, however, as shown in FIG. 14, the application block 30a of the substrate processing apparatus 4 includes a shear heat treatment chamber 3202, a shear conveyance chamber 3402, a first intermediate heat treatment chamber 3206a, and an intermediate conveyance chamber. 3406, the second intermediate heat treatment chamber 3206b, the rear stage transfer chamber 3404, and the rear stage heat treatment chamber 3204 are sequentially disposed, and the shear liquid treatment chamber 3602 is disposed on the side of the front transfer chamber 3402. The intermediate liquid processing chamber 3606 may be disposed on the side of the intermediate transfer chamber 3406, and the rear liquid processing chamber 3604 may be disposed on the side of the rear transfer chamber 3404. In this case, according to an embodiment, the front liquid treatment chamber 3602, the middle liquid treatment chamber 3606, and the rear liquid treatment chamber 3604 are sequentially disposed on the substrate W, and the lower anti-reflection film, the photoresist film, And an upper antireflection film can be applied.

In addition, in FIGS. 1-4, it demonstrated that the coating block 30a which performs a coating process process, and the developing block 30b which performs a developing process process are provided laminated | stacked on each other. In contrast, however, as shown in FIG. 15, the processing modules of the substrate processing apparatus 5 include a processing block 31 which performs both a coating treatment process and a developing treatment process, and the processing blocks 31 are stacked on one or each other. Plural can be provided. Referring to FIG. 15, the processing block 31 may include a front end heat treatment chamber 3202, a front end transfer chamber 3402, an intermediate heat treatment chamber 3206, a rear end conveyance chamber 3404, and a rear end heat treatment chamber 3204. It is arrange | positioned along one direction 12, and the 1st liquid processing chamber 3602 is arrange | positioned at the side of the front conveyance chamber 3402, and the 2nd liquid processing chamber 3604 is arrange | positioned at the side of the rear conveyance chamber 3404. In this case, the front liquid treatment chamber 3602 may perform an application process, and the rear liquid treatment chamber 3604 may perform a development process.

1 to 4 illustrate that the processing block of the substrate processing apparatus 1 performs a coating treatment process and a developing treatment process. In contrast, however, as shown in FIG. 16, the substrate processing apparatus 6 may include only the index module 20 and the processing block 37 without the interlace module. In this case, the processing block 37 performs only a coating treatment process, and the film applied on the substrate W may be a spin on hard mask film.

The foregoing detailed description illustrates the present invention. In addition, the above-mentioned contents show preferred embodiments of the present invention, and the present invention can be used in various other combinations, modifications, and environments. That is, changes or modifications may be made within the scope of the concept of the invention disclosed in the present specification, the scope equivalent to the disclosures described above, and / or the skill or knowledge in the art. The described embodiments illustrate the best state for implementing the technical idea of the present invention, and various modifications required in the specific fields and applications of the present invention are possible. Thus, the detailed description of the invention is not intended to limit the invention to the disclosed embodiments. Also, the appended claims should be construed to include other embodiments.

20: index module 30: processing module
30a: application block 30b: development block
40: interface module 50: exposure apparatus
3200: heat treatment chamber 3202: shear heat treatment chamber
3204: post-heat treatment chamber 3206: intermediate heat treatment chamber
3400: conveying chamber 3402: shear conveying chamber
3404: rear conveying chamber 3600: liquid treatment chamber
3602: front liquid treatment chamber 3604: rear liquid treatment chamber

Claims (26)

delete delete delete delete delete delete delete delete delete delete delete delete delete delete delete delete delete delete delete delete delete delete delete delete Including an index module, a processing module, and an interface module sequentially disposed along the first direction,
The index module,
An index frame provided with a load port on which a container containing a substrate is placed, and an index robot for transferring the substrate between the container placed on the load port and the processing module,
The processing module,
A coating block for performing a coating process for forming a liquid film on a substrate, and a development block provided to be laminated with the coating block and performing a developing process;
The interface module,
An interface frame connected to an external exposure apparatus; A conveying member disposed in the interface frame,
The coating block and the developing block each include a heat treatment chamber for heat treating the substrate; A liquid processing chamber for supplying a liquid to the substrate to process the substrate; A transfer chamber having a transfer robot for transferring a substrate between the heat treatment chamber and the liquid processing chamber,
The heat treatment chamber provided in the application block includes a shear heat treatment chamber;
The shear heat treatment chamber is disposed between the conveying chamber and the index frame,
The liquid processing chamber is provided on the side of the transfer chamber with respect to the first direction and the side of the transfer chamber with reference to the first direction among the transfer chamber and the index frame.
In the coating block, the transfer robot and the index robot are respectively provided to exchange a substrate directly with the shear heat treatment chamber,
The heat treatment chamber includes a housing, a heating unit disposed in the housing and heating the substrate, a cooling unit disposed in the housing and cooling the substrate, and a transfer member for conveying the substrate in the housing,
The housing includes a first region overlapping with the conveying chamber and a second region deviating from an region overlapping with the conveying chamber when viewed from the first direction.
One of the cooling unit and the heating unit is disposed in the first region, the other is disposed in the second region,
The conveying chamber provided in the application block,
A front conveying chamber adjacent the index module; A rear conveying chamber adjacent the interface module;
The front conveying chamber and the rear conveying chamber are arranged along the first direction,
The heat treatment chamber,
An intermediate heat treatment chamber disposed between the front conveying chamber and the rear conveying chamber; Further comprising a rear end heat treatment chamber disposed between the rear end conveyance chamber and the interface module,
The transfer robot provided in the front transfer chamber and the transfer robot provided in the rear transfer chamber are respectively provided to directly exchange the substrate with the intermediate heat treatment chamber.
The liquid treatment chamber provided in the application block,
A shear liquid treatment chamber disposed at a side of the shear conveyance chamber based on the first direction and performing a process of applying a first liquid to a substrate; In the method of processing a substrate using a substrate processing apparatus disposed on the side of the rear conveying chamber on the basis of the first direction, comprising a rear liquid processing chamber for performing a process of applying a second liquid to the substrate ,
The index robot conveying a substrate to a heating unit of the shear heat treatment chamber;
Heating the substrate in a heating unit of the shear heat treatment chamber;
The conveying member transferring the substrate to a first region of the shear heat treatment chamber by the heating unit of the shear heat treatment chamber;
Cooling the substrate in a first region of the shear heat treatment chamber;
A front conveying robot provided to the front conveying chamber receiving the substrate in the first region of the front heat treating chamber and conveying the substrate to the front liquid processing chamber;
Applying the first liquid onto the substrate in the shear liquid treatment chamber;
The shear conveying robot conveying the substrate to the first region of the intermediate heat treatment chamber;
Conveying the substrate from the first region of the intermediate heat treatment chamber to the heating unit of the intermediate heat treatment chamber by a conveying member of the intermediate heat treatment chamber;
Heating the substrate in a heating unit of the intermediate heat treatment chamber;
Conveying the substrate from the heating unit of the intermediate heat treatment chamber to the first region of the intermediate heat treatment chamber by the conveying member of the intermediate heat treatment chamber;
Cooling the substrate in a first region of the intermediate heat treatment chamber;
Transferring, by the rear stage transfer robot provided to the rear stage transfer chamber, the substrate in the first region of the intermediate heat treatment chamber to the second liquid processing chamber;
Applying the second liquid onto the substrate in the second liquid processing chamber;
Conveying the substrate to the first region of the rear stage heat treatment chamber by the rear stage transfer robot;
Conveying the substrate from the first region of the post-heat treatment chamber to the heating unit of the post-heat treatment chamber by a conveying member of the post-heat treatment chamber;
Heating the substrate in a heating unit of the post heat treatment chamber;
Conveying the substrate from the heating unit of the post heat treatment chamber to a first region of the post heat treatment chamber by a conveying member of the post heat treatment chamber; And
And cooling the substrate in a first region of the post-heat treatment chamber. The method of claim 25,
The first liquid is a liquid for forming an anti-reflection film on the substrate,
And the second liquid is a liquid for forming a photoresist film on the anti-reflection film formed on the substrate.

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