[go: up one dir, main page]
More Web Proxy on the site http://driver.im/

KR102028206B1 - 레이저 가공 방법 및 레이저 가공 장치 - Google Patents

레이저 가공 방법 및 레이저 가공 장치 Download PDF

Info

Publication number
KR102028206B1
KR102028206B1 KR1020130019345A KR20130019345A KR102028206B1 KR 102028206 B1 KR102028206 B1 KR 102028206B1 KR 1020130019345 A KR1020130019345 A KR 1020130019345A KR 20130019345 A KR20130019345 A KR 20130019345A KR 102028206 B1 KR102028206 B1 KR 102028206B1
Authority
KR
South Korea
Prior art keywords
laser beam
output
plasma
wafer
bonding pad
Prior art date
Application number
KR1020130019345A
Other languages
English (en)
Korean (ko)
Other versions
KR20130103357A (ko
Inventor
히로시 모리카즈
Original Assignee
가부시기가이샤 디스코
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by 가부시기가이샤 디스코 filed Critical 가부시기가이샤 디스코
Publication of KR20130103357A publication Critical patent/KR20130103357A/ko
Application granted granted Critical
Publication of KR102028206B1 publication Critical patent/KR102028206B1/ko

Links

Images

Classifications

    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K26/00—Working by laser beam, e.g. welding, cutting or boring
    • B23K26/36—Removing material
    • B23K26/38—Removing material by boring or cutting
    • B23K26/382—Removing material by boring or cutting by boring
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K10/00—Welding or cutting by means of a plasma
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K26/00—Working by laser beam, e.g. welding, cutting or boring
    • B23K26/02—Positioning or observing the workpiece, e.g. with respect to the point of impact; Aligning, aiming or focusing the laser beam
    • B23K26/06—Shaping the laser beam, e.g. by masks or multi-focusing
    • B23K26/062—Shaping the laser beam, e.g. by masks or multi-focusing by direct control of the laser beam
    • B23K26/0622—Shaping the laser beam, e.g. by masks or multi-focusing by direct control of the laser beam by shaping pulses
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K26/00—Working by laser beam, e.g. welding, cutting or boring
    • B23K26/02—Positioning or observing the workpiece, e.g. with respect to the point of impact; Aligning, aiming or focusing the laser beam
    • B23K26/06—Shaping the laser beam, e.g. by masks or multi-focusing
    • B23K26/064—Shaping the laser beam, e.g. by masks or multi-focusing by means of optical elements, e.g. lenses, mirrors or prisms
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K26/00—Working by laser beam, e.g. welding, cutting or boring
    • B23K26/02—Positioning or observing the workpiece, e.g. with respect to the point of impact; Aligning, aiming or focusing the laser beam
    • B23K26/06—Shaping the laser beam, e.g. by masks or multi-focusing
    • B23K26/067—Dividing the beam into multiple beams, e.g. multifocusing
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K2101/00—Articles made by soldering, welding or cutting
    • B23K2101/36—Electric or electronic devices
    • B23K2101/40—Semiconductor devices

Landscapes

  • Physics & Mathematics (AREA)
  • Optics & Photonics (AREA)
  • Engineering & Computer Science (AREA)
  • Plasma & Fusion (AREA)
  • Mechanical Engineering (AREA)
  • Laser Beam Processing (AREA)
KR1020130019345A 2012-03-09 2013-02-22 레이저 가공 방법 및 레이저 가공 장치 KR102028206B1 (ko)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
JP2012053616A JP6034030B2 (ja) 2012-03-09 2012-03-09 レーザー加工方法およびレーザー加工装置
JPJP-P-2012-053616 2012-03-09

Publications (2)

Publication Number Publication Date
KR20130103357A KR20130103357A (ko) 2013-09-23
KR102028206B1 true KR102028206B1 (ko) 2019-10-02

Family

ID=49128368

Family Applications (1)

Application Number Title Priority Date Filing Date
KR1020130019345A KR102028206B1 (ko) 2012-03-09 2013-02-22 레이저 가공 방법 및 레이저 가공 장치

Country Status (4)

Country Link
JP (1) JP6034030B2 (zh)
KR (1) KR102028206B1 (zh)
CN (1) CN103302411B (zh)
TW (1) TWI597118B (zh)

Families Citing this family (9)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
KR101682269B1 (ko) * 2013-09-25 2016-12-05 주식회사 엘지화학 레이저 커팅 장치 및 그 커팅 방법
JP6682146B2 (ja) * 2016-12-12 2020-04-15 住友重機械工業株式会社 レーザパルス切出装置及びレーザ加工方法
JP7239298B2 (ja) 2018-10-23 2023-03-14 株式会社ディスコ レーザー加工方法
JP2020066015A (ja) 2018-10-23 2020-04-30 株式会社ディスコ レーザー加工方法
JP2020066045A (ja) 2018-10-26 2020-04-30 株式会社ディスコ レーザー加工方法
JP7404043B2 (ja) * 2019-03-22 2023-12-25 ビアメカニクス株式会社 レーザ加工装置及びレーザ加工方法
US12103110B2 (en) 2019-03-22 2024-10-01 Via Mechanics, Ltd. Laser processing apparatus and laser processing method
KR102522756B1 (ko) * 2021-12-28 2023-04-19 주식회사 아이티아이 복수 레이저를 이용한 가공장치 및 방법
JP2024002189A (ja) 2022-06-23 2024-01-11 株式会社ディスコ レーザー加工装置

Citations (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2002144068A (ja) * 2000-11-16 2002-05-21 Sumitomo Heavy Ind Ltd レーザ加工装置及び加工方法

Family Cites Families (12)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH0910971A (ja) * 1995-06-23 1997-01-14 Hitachi Ltd レーザ加工方法
JP3756723B2 (ja) * 1999-07-27 2006-03-15 松下電工株式会社 プリント配線板の加工方法
JP2003163323A (ja) 2001-11-27 2003-06-06 Sony Corp 回路モジュール及びその製造方法
JP4646525B2 (ja) * 2004-02-05 2011-03-09 ヤマザキマザック株式会社 プラズマ検出装置、及びプラズマ検出装置付きレーザ加工機
US7273998B2 (en) * 2004-09-15 2007-09-25 General Electric Company System and method for monitoring laser shock processing
JP2007067082A (ja) * 2005-08-30 2007-03-15 Disco Abrasive Syst Ltd ウエーハの穿孔方法
JP5011072B2 (ja) * 2007-11-21 2012-08-29 株式会社ディスコ レーザー加工装置
JP2012094591A (ja) * 2010-10-25 2012-05-17 Disco Abrasive Syst Ltd ビアホールの加工方法およびレーザー加工装置
JP5912293B2 (ja) * 2011-05-24 2016-04-27 株式会社ディスコ レーザー加工装置
JP5869259B2 (ja) * 2011-08-24 2016-02-24 株式会社ディスコ 穿孔方法およびレーザー加工装置
JP5969767B2 (ja) * 2012-01-27 2016-08-17 株式会社ディスコ レーザー加工装置
JP5964604B2 (ja) * 2012-02-09 2016-08-03 株式会社ディスコ レーザー加工装置

Patent Citations (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2002144068A (ja) * 2000-11-16 2002-05-21 Sumitomo Heavy Ind Ltd レーザ加工装置及び加工方法

Also Published As

Publication number Publication date
TW201400219A (zh) 2014-01-01
JP6034030B2 (ja) 2016-11-30
TWI597118B (zh) 2017-09-01
KR20130103357A (ko) 2013-09-23
CN103302411A (zh) 2013-09-18
CN103302411B (zh) 2017-04-12
JP2013184213A (ja) 2013-09-19

Similar Documents

Publication Publication Date Title
KR102028206B1 (ko) 레이저 가공 방법 및 레이저 가공 장치
KR102003566B1 (ko) 레이저 가공 장치
KR101252874B1 (ko) 레이저 가공기
JP5912293B2 (ja) レーザー加工装置
KR102316369B1 (ko) 레이저 가공 방법 및 레이저 가공 장치
KR101364389B1 (ko) 레이저 가공 장치
KR101253791B1 (ko) 레이저 광선 조사 장치 및 레이저 가공기
KR101953918B1 (ko) 레이저 가공 장치
KR101322845B1 (ko) 레이저 가공장치
JP5869259B2 (ja) 穿孔方法およびレーザー加工装置
KR101337702B1 (ko) 레이저 광선 조사 장치 및 레이저 가공기
JP2008212999A (ja) レーザー加工装置
JP5101869B2 (ja) ウエーハの加工方法
KR20120131096A (ko) 레이저 가공 장치
JP2012091218A (ja) レーザー加工装置
JP5053727B2 (ja) レーザー加工装置
JP6017809B2 (ja) レーザー加工装置
JP2013198905A (ja) レーザー加工装置

Legal Events

Date Code Title Description
PA0109 Patent application

Patent event code: PA01091R01D

Comment text: Patent Application

Patent event date: 20130222

PG1501 Laying open of application
A201 Request for examination
PA0201 Request for examination

Patent event code: PA02012R01D

Patent event date: 20170222

Comment text: Request for Examination of Application

Patent event code: PA02011R01I

Patent event date: 20130222

Comment text: Patent Application

E902 Notification of reason for refusal
PE0902 Notice of grounds for rejection

Comment text: Notification of reason for refusal

Patent event date: 20190116

Patent event code: PE09021S01D

E701 Decision to grant or registration of patent right
PE0701 Decision of registration

Patent event code: PE07011S01D

Comment text: Decision to Grant Registration

Patent event date: 20190627

GRNT Written decision to grant
PR0701 Registration of establishment

Comment text: Registration of Establishment

Patent event date: 20190926

Patent event code: PR07011E01D

PR1002 Payment of registration fee

Payment date: 20190926

End annual number: 3

Start annual number: 1

PG1601 Publication of registration
PR1001 Payment of annual fee

Payment date: 20220902

Start annual number: 4

End annual number: 4

PR1001 Payment of annual fee

Payment date: 20230829

Start annual number: 5

End annual number: 5

PR1001 Payment of annual fee

Payment date: 20240829

Start annual number: 6

End annual number: 6