KR102025408B1 - Method for manufacturing bilateral symmetry based-on transparent led display divice - Google Patents

Abstract

According to the present invention, a bilaterally symmetrical transparent LED display device comprises: a transparent substrate; a plurality of first LED elements mounted on a front surface of the substrate; a plurality of second LED elements mounted on a rear surface of the substrate to correspond to mounting positions of the first LED elements, respectively; and a driving unit mounted on one side of the substrate, and including a first driving unit for controlling the first LED elements to be turned on by generating a first signal and a second driving unit for controlling the second LED elements to be turned on by generating a second signal symmetrical to the first signal based on a virtual Y axis. According to the bilaterally symmetrical transparent LED display device of the present invention, the LED elements are mounted on the rear surface of the substrate and the driving units are mounted on one side of the substrate, such that the rear surface of the substrate can be used as providing a display function, and the problem that display objects that are actually displayed are opposite to each other due to the same display on the front surface and the rear surface of the substrate can be prevented.

Description

Manufacturing method of transparent LED display device based on double-sided symmetry {METHOD FOR MANUFACTURING BILATERAL SYMMETRY BASED-ON TRANSPARENT LED DISPLAY DIVICE}

The present invention relates to a transparent LED display device based on double-sided symmetry and a method of manufacturing the same, and more particularly, mounting the LED elements on each side of the transparent substrate to extend the visibility in both directions, but the display of the LED elements in both directions are opposite to each other. It relates to a transparent LED display device and a method for manufacturing the same to prevent the problem.

With the development of thin film-based transparent substrates, recently developed LED display devices have a thin and transparent property and are easily attached to windows or other places of a building, and are being used for various display purposes such as advertisement.

LED display apparatuses based on such transparent substrates are mostly made of a structure in which a LED element is mounted on a surface of a substrate and a driving unit such as a drive IC is mounted on the rear surface thereof.

However, according to this structure, since the driving part is mounted on the rear surface of the substrate, there is a problem of impairing transparency, and the back surface of the substrate can not be used for other purposes. The problem is that the display effect can not be enjoyed in both directions, including the front as well as the rear.

Of course, the problem can be solved by mounting the LED elements on each of the front and rear surfaces of the substrate by using a known double-sided substrate, but in this case, the case of controlling the lighting of the LED elements mounted on both sides of the substrate with one driving unit will be described. For example, when "3" is displayed on the front surface of the substrate, one of the driving parts is mechanically processed to look at the rear side of the substrate due to the same process of LED elements on the back of the substrate. The problem is that it looks like the "E" flipped over by the standard.

 Referring to the prior art, such as LED display board for transparent display, Korean Patent No. 10-1789145, RGB package color through the data line with LED packages provided at each point of the matrix structure of the transparent display film substrate (023) A control board / control circuit through which signals are transmitted; A power supply unit for supplying power to each of the LED chips through the (+) electrode line and the (-) electrode line of the transparent display film substrate (023); And an LED package equipped with an RGB LED chip at each pixel point of the transparent display film substrate (023), the LED package being a buffer metal (034) and a base metal (030) for electrodes on the transparent display film substrate. The stacked structure is a structure in which a metal (035), which is capable of soldering or attaching silver paste, is deposited on the base metal 030 by plating or deposition, and the LED (+) electrode and the LED (-) are laminated on the stacked structure. Electrode is provided, the electrode for attaching the LED on both sides around the transparent display film substrate and the rear electrode for heat dissipation is formed on the back of the transparent display film substrate, the torsion phenomenon by heat treatment in the manufacturing process of the transparent display film substrate Through holes are formed in the underlying metal pattern for the electrodes to which the LEDs on the transparent display film substrate material are prevented to prevent damage. In addition, a metal mesh pattern surrounds the electrode terminal in a mesh structure to form an electrode to enhance the adhesion between the LED package and the transparent display film substrate, and the light-transmitting small size provided on the transparent display film substrate Green LED chips, red LED chips (047), and blue LED chips (048) are respectively provided on the substrate film (040), and the positive and negative electrodes of each LED chip are formed by metal ball bonding (050). And solder and silver paste around the sides of the electrodes, forming a silicon dome for device protection, and forming a guide dam 053 around the circle.

However, the above technique merely provides the effect of preventing the detachment of the LED package element and the detachment and disconnection of the metal circuit pattern, which may occur due to careless handling during the process. In this case, it is not possible to provide a separate means for solving the problem of inverting display objects such as displayed images and characters.

Therefore, in the transparent double-sided display device using the LED to prevent the display object is displayed on both sides of the display inverted at the same time and at the same time by providing a driving unit on one side of the substrate rather than the back of the substrate that can actively utilize the back of the substrate There is a need to develop advanced transparent double-sided LED display devices.

The present invention has been made to overcome the problems of the above technology, the front and back of the LED by blinking the LED element through the two drive means symmetrical processing of each LED element lighting pattern on the virtual Y axis of the front and back of the substrate The main object of the present invention is to provide an LED display device that maximizes the effect of the two-sided display because the display objects viewed from the same.

Another object of the present invention is to provide the convenience of the drive unit design by separately mounting the drive unit having two drive means on each of the front and rear surfaces of the substrate.

Still another object of the present invention is to join the back surfaces of substrates each provided with a driving means for convenience of production.

It is a further object of the present invention to protect the junction of the substrate via a protective layer comprising silicon and at the same time combine antireflection to more effectively block the exposure or transmission of light to the opposite side.

In order to achieve the above object, the double-sided symmetry-based transparent LED display device according to the present invention, a transparent material substrate; A plurality of first LED elements mounted on a front surface of the substrate; A plurality of second LED elements mounted on a rear surface of the substrate to correspond to mounting positions of the first LED elements; A first driving unit mounted on one side of the substrate and generating a first signal to control lighting of the first LED element, and generating a second signal symmetrical with respect to the first signal and a virtual Y axis; And a driving unit including a second driving unit to control lighting of the second LED device.

The first driver may be mounted on one side of the front surface of the substrate, and the second driver may be mounted at a position corresponding to a mounting position of the first driver on the rear surface of the substrate.

Furthermore, the said board | substrate is characterized in that the 1st board | substrate with which the said 1st LED element was mounted, and the 2nd board | substrate with which the said 2 LED element was mounted in the corresponding position of the said 1st LED element are characterized by the above-mentioned.

Additionally, a method of manufacturing a bonded LED display device, comprising: a first step of preparing a first substrate on which the first LED element is mounted on a front surface and a second substrate on which the second LED element is mounted on a front surface; A second step of installing the driver on one side of the first and second substrates; A third step of coating and forming a protective layer containing silicon on the back surface of each of the first and second substrates; And a fourth step of mutually bonding the back surfaces of the first and second substrates via an adhesive agent.

According to the double-sided symmetry-based transparent LED display device according to the present invention,

1) By mounting the LED element on the back of the substrate and mounting the drive unit on one side of the substrate can also be utilized to provide a display function,

2) It is possible to prevent the problem that the display objects actually displayed due to the same display on the front and back of the substrate are opposite to each other.

3) By preparing two boards on which LED elements are mounted and bonding them, not only can the production be more convenient.

4) by forming a protective layer on the junction site to protect the junction site as well as to provide a light reflection prevention function that the light of the LED element is unnecessarily transmitted to the opposite side.

1 is a perspective view showing the basic structure of the LED display device of the present invention.
2 is a cross-sectional view showing a modified embodiment of the LED display device of the present invention.
3 is a cross-sectional view showing a state in which a protective layer is additionally mounted in the embodiment of FIG. 2 (c).
4 is a cross-sectional view showing a state in which a fluorescent layer is further mounted.
5 is a flowchart illustrating a process of preparing alumina of a fluorescent layer.

Hereinafter, exemplary embodiments of the present invention will be described in detail with reference to the accompanying drawings. The accompanying drawings are not drawn to scale, and like reference numerals in each of the drawings refer to like elements.

1 is a perspective view showing the basic structure of the LED display device of the present invention.

As can be seen from Figure 1, the display device of the present invention is made of a rectangular shape (cuboid shape) in a thin film state, like a known LED display panel or display device, made of a transparent material, as well as providing a clear visibility of the glass window It provides a characteristic that can be conveniently attached to a back and utilized.

Specifically, a plurality of first LED elements 20 are mounted on the front surface of the transparent substrate 10, and although not specifically illustrated in FIG. 1, the back surface of the substrate 10, that is, the first LED elements 20. A plurality of LED elements, that is, the second LED element 30, is also mounted on the side opposite to the portion where the is mounted. At this time, the second LED element 30 is mounted directly behind the position where each of the first LED element 10 is mounted so that the first and second LED elements 20 and 30 overlap the front or rear surface of the substrate 10. To prevent problems that may occur

Unlike the known structure, the display device of the present invention is not mounted on the rear surface of the substrate 10, but is mounted on one side of the substrate 10 (for example, the upper side or the right side of the substrate). The back surface of the substrate 10 provides a foundation for mounting the second LED device 30 without obstructions.

In particular, the driving unit 100 of the present invention generates a first signal and the first driving unit 110 for controlling the lighting of the first LED device 20, and the second signal so as to be symmetrical with respect to the first signal and the virtual Y axis. It is characterized in that it comprises a second driving unit 120 for generating a second signal for lighting the LED device 30 to control the lighting of the second LED device 30. That is, the first signal of the first driving unit 110 and the second signal of the second driving unit 120 are signals for displaying a display object (image, text, number, video, etc.) having the same shape, but more specifically, This means that the shape of the display object by the second signal is processed to be Y-axis symmetric with respect to the shape of the display object by the first signal.

In other words, when the lighting pattern of the first LED element 20 is formed such that the first signal displays "3" on the front surface of the substrate 10, the second signal is "E" when viewed from the front surface of the substrate 10. When viewed from the rear surface of the substrate 10 in the direction of the observation, the lighting pattern of the second LED element 30 is formed in the Y-axis symmetry with the lighting pattern of the first LED element 20 so as to be displayed as "3". I can understand that.

In this case, the lighting of the first and second LED elements 20 and 30 does not coincide and overlaps (that is, the front and rear surfaces of the specific position where the first and second LED elements are mounted are not lit or turned off at the same time, but the front is lit, Back light may be turned off), which may cause the light emitted from the first and second LED elements 20 and 30 to influence each other, thereby preventing the display object from being properly displayed in each viewing direction. Such a problem does not actually occur because the light of the first LED device 20 is hardly transmitted to the back bracket point side of the substrate 30 that is opposite, for example, due to the intrinsic linear light divergence property of the LED device. It is not an exaggeration to see.

The driver 100 may be mounted on one side of the substrate 10, that is, the front and rear surfaces of the substrate 10, or as described later with reference to FIG. 2, on the front and rear surfaces of the substrate 10. May be mounted over.

In FIG. 1, although the driving unit 100 is shown in a comprehensive state mounted on one side of the substrate 10, the structure and function of the driving unit 100 will be described in more detail with reference to FIG. 2.

2 is a cross-sectional view showing a modified embodiment of the LED display device of the present invention.

As can be seen from Figure 2, the driving unit 100 mounted on both sides of the substrate can be implemented in three embodiments.

FIG. 2A illustrates that the driving unit 100 is mounted on one side of both sides of the substrate 10, and is strictly attached to the side surface of the substrate 10. That is, the structure may be referred to as a structure in contact with the substrate 10 through a connector in a state separated from the substrate 10. According to this structure, only the first and second LED elements 20 and 30 are mounted on the substrate 10, and power and data supply are provided in the driving unit 100 installed on the substrate 10. 2 The substrate 10 equipped with the LED elements 20 and 30 and the substrate equipped with the driving unit 100 are connected to each other to provide convenience of manufacturing the substrate.

Figure 2 (b) shows a state in which the driving unit is mounted on both sides of the substrate, it can be implemented in two embodiments.

 First, the front side driver 100 of the substrate 10 performs a power control function to supply power to the first and second LED elements 20 and 30.

In addition, the rear side driving unit 100 of the substrate 10 includes the first and second driving units 110 and 120 described above. The first driving unit 110 provides the above-described first signal, and the second driving unit 120 includes the first driving unit. A second signal is generated and delivered to the first and second LED devices 20 and 30, respectively.

Specifically, the power supply is supplied to the front surface of the substrate 10, and the rear surface of the substrate 10 provides a function of transmitting a signal (data) for driving control of the first and second LED elements 20 and 30. In this case, a via hole is penetrated between the first and second LED elements 20 and 30 of the substrate 10 so that the power line and the data line may move between both sides of the substrate. For example, the power line extends vertically at a predetermined interval. The data line extends horizontally at regular intervals to prevent the power line and the data line from being shorted.

In other words, the first embodiment of FIG. 2B divides the front and rear surfaces of the driving unit 100 into power supply and data transfer to effectively prevent the power line and the data line from being shorted.

The second embodiment of FIG. 2 (b) shows that the first driver 110 is mounted on the front surface of the substrate 10 and is located on the rear surface of the substrate 10 (ie, directly opposite the position where the first driver is mounted). The second drive unit 120 is mounted.

The first and second driver parts 110 and 120, which generate and transmit the first and second signals, respectively, are disposed to fit on the front and rear surfaces of the substrate 10. The first and second signal processing may be more specialized.

In this case, the power may be supplied to the first and second LED elements 20 and 30 through a separate power supply unit from the first and second driving units 110 and 120, or the first and second driving units 110 and 120 may perform a power supply function in parallel. have.

The embodiment according to FIG. 2 (c) relates to a structure in which two transparent substrates are bonded to each other, wherein the substrate 10 includes a first substrate 11 on which the first LED element 20 is mounted, The back surface (opposite side on which the LED element is mounted) of the 2nd board | substrate 12 with which the 2nd LED element 30 was mounted in the corresponding position of 1 LED element 20 is bonded. At this time, a resin-based adhesive may be used between the first and second substrates 11 and 12.

According to this structure, it is possible to provide a property that can ensure the convenience of manufacturing and installation than when mounting the first and second LED elements 20, 30 on each of both sides of one substrate 10.

3 is a cross-sectional view illustrating a state in which a protective layer is additionally mounted in the embodiment of FIG. 2C.

In the structure of FIG. 2 mentioned above, the protective layer 50 can be apply | coated especially to the structure of FIG. 2 (c) which bonds two board | substrates together.

In other words, as the two substrates 11 and 12 are bonded to each other and the thickness thereof increases, the weight and volume of the entire LED display device increase, thereby protecting the surface on which the first and second LED elements 20 and 30 are mounted. The need to do so may be relatively larger than the embodiments of FIGS. 2 (a) and 2 (b). For this purpose, peripheral parts of the first and second LED elements 20 and 30, that is, the first and second LED elements The protective layer 50 including silicon is formed on the front surface of each of the first and second substrates 11 and 12 on which the (20,30) is not mounted.

The silicon has a transparency buffering property, that is, the protective layer 50 including the silicon may perform a function of efficiently protecting the entire surface of the first and second substrates 11 and 12 from external impact. .

The method of manufacturing the LED display device including the protective layer 50 includes a first substrate 11 having the first LED element 20 mounted on the front surface and a second LED element 30 mounted on the front surface. The first step of preparing the second substrate 12, the second step of installing the drive unit 100 on one side of the first and second substrates 11 and 12, and the first and second substrates 11 and 12 A third step of applying and forming a protective layer 50 including silicon on a portion around the first and second LED elements 20 and 30 at a front surface of the first and second substrates 11 and 11 through an adhesive 40; And a fourth step of mutually bonding the back surface of 12).

At this time, the protective layer 50 is formed of a silicon material in the sealing sheet formed through the through holes corresponding to the size of the first and second LED elements 20 and 30 of each of the first and second substrates 11 and 12. Attached to the front surface, the first and second LED elements 20 and 30 are located in the through hole, so that the upper surface of the first and second LED elements 20 and 30 is not unnecessarily covered by the protective layer 50, but only in the peripheral portion thereof. The layer 50 can be processed to form.

In addition, the protective layer 50 may include a ceramic material as well as silicon.

The ceramic material includes kaolin and bentonite groups, and has a very large surface area and a large cation exchange ability, which is widely used as an adsorbent, and improves the physical properties of the protective layer 50, that is, the surface protection function of the substrate 10 by the characteristics of the ceramic. To provide the ability to In this case, the protective layer 50 may include silicon and a ceramic material at a weight ratio of 3 to 5: 1.

In order to improve the functionality of the ceramic material, the ceramic material may have a reactor. Specifically, the ceramic material may include a primary solution manufacturing step, a secondary solution manufacturing step, a tertiary solution manufacturing step, a fourth solution manufacturing step, It is possible to prepare through the fifth solution preparation step, the filtration washing step.

First, the primary solution preparation step is a nitrogen atmosphere of 50 to 70% by weight of isophorone diisocyanate and 30 to 50% by weight of 1,4-dioxane (1,4-dioxane) relative to the total weight of the primary solution It is a process of preparing a primary solution by stirring for 1 to 30 minutes under.

At this time, isophorone diisocyanate provides a function of improving the compatibility between the ceramic material and the polymer by providing a reactive group (that is, an isocyanate group) to the above-mentioned ceramic material.

In addition, dioxane is a substance that improves the permeability of ceramic material and silicon, which is an organic substance, and serves to enhance mixing of organic and inorganic substances.

Next, the secondary solution manufacturing step is 50 to 70% by weight of hydroxyethyl acrylate (Hydroxyethyl acrylate), 20 to 40% by weight of 1,4-dioxane, dibutyltin dilaurate (Dibutyltin) dilaurate) 0.1 to 10% by weight, hydroxyanisole (Hydroxyanisole) is a process of preparing a secondary solution by mixing.

In this case, hydroxyethyl acrylate serves to provide an acrylic group that is a reactive group to the ceramic material to improve compatibility between the ceramic material and the organic material.

In addition, 1,4-dioxane, as described above, provides a function of improving penetration between organic and inorganic substances, and thus, may generate a ceramic material having a reactive group, thereby improving gas barrier properties of the mixed coating agent.

Furthermore, dibutyltindilaurate and hydroxyanisole serve as catalysts, thereby providing a function of promoting the reaction rate of mixing the primary solution and the secondary solution, which will be described later.

Thereafter, the tertiary solution preparing step is performed by stirring 50 to 80 wt% of the primary solution and 20 to 50 wt% of the secondary solution at 30 to 50 ° C. for 1 to 6 hours based on the total weight of the tertiary solution. As a process for preparing the mixture, the primary solution and the secondary solution may be mixed to prepare a mixed solution containing isophorone diisocyanate and hydroxyethyl acrylate as an active ingredient.

Next, the fourth solution manufacturing step is a process of preparing a fourth solution by mixing 10 to 30% by weight of the ceramic powder made of any one of bentonite and kaolin with 70 to 90% by weight of toluene, based on the total weight of the fourth solution. In other words, it is a process of preparing a quaternary solution by mixing ceramic powder and its solvent toluene.

Subsequently, the fifth solution preparing step may be performed by stirring 20 to 40 wt% of the tertiary solution and 60 to 80 wt% of the fourth solution at 50 to 80 ° C. for 30 to 60 hours based on the total weight of the fifth solution. As a process for preparing a, it is a step of applying a reactor of isophorone diisocyanate and hydroxyethyl acrylate contained in the tertiary solution to the ceramic powder to produce a ceramic material with improved functionality.

Finally, the filtration washing step is a process of washing the residue obtained by filtering the fifth solution with toluene one to five times, and finally, by washing the residue (that is, the substance remaining in the filtration apparatus) with toluene. It is possible to obtain a ceramic material from which impurities have been removed.

The ceramic material manufactured through the above-described process improves the hardness and tensile strength of each of the first and second substrates 11 and 12 and reduces gas permeation, thereby providing a function of efficiently increasing the durability of the LED display device. .

4 is a cross-sectional view illustrating a state in which a fluorescent layer is further mounted.

Between the first and second steps described above, that is, after preparing the first and second substrates 11 and 12 on which the first and second LED elements 20 and 30 are mounted, the first and second substrates 11 and 12 ) May include forming the fluorescent layer 60 at the periphery of the region to which the first and second LED devices 20 and 30 are attached.

The fluorescent layer 60 reflects light emitted from the first and second LED elements 20 and 30 due to the reflected light while the external light is reflected on the surface of the substrate, particularly around the first and second LED elements 20 and 30. In order to prevent adverse effects (i.e., light bleeding or disturbance of LED linearity), the fluorescent layer 60 serves to enhance the visibility of the first and second LED elements 20 and 30 through the fluorescent material. The first and second LED elements 20 and 30 need not be formed in the entire area of the front of the first and second substrates 11 and 12 because they are to enhance visibility of the light of the first and second LED elements 20 and 30. It is more preferable to form in the peripheral part.

In particular, when the fluorescent layer 60 is formed together with the above-described protective layer 50, the fluorescent layer 60 is first applied to the circumferential region of the first and second LED elements 20 and 30, and then the protective layer ( At least a portion of 50) is applied to cover the circumferential region and other portions of the first and second LED elements 20 and 30, and is positioned in the order of substrate-fluorescent layer-protective layer from bottom to top.

Specifically, the fluorescent layer 60 may be manufactured by mixing 85 to 95% by weight of epoxy resin, 1 to 10% by weight of alumina, and 0.5 to 5% by weight of fluorescent pigment, based on the total weight of the fluorescent layer.

In general, fluorescent pigments contain strontium oxide as an active ingredient and exhibit fluorescence that luminesces in the dark after photoluminescence, and thus absorbs light sources in all areas including general light energy, sunlight, and fluorescent lamps as energy. As it becomes dark, it provides a function of converting the photoluminescent light energy into visible light to emit light. At this time, the fluorescent pigment has a characteristic of having a semi-permanent life by itself by repeatedly absorbing, accumulating and emitting light emitted from the fluorescent pigment.

In addition, the epoxy resin is a base constituting the fluorescent layer 60, it is applied to the circumferential portion of the first and second LED elements 20 and 30 in the first and second substrates 11 and 12, which can be easily cured. By providing a function, that is, a function of stably applying (forming) the fluorescent layer to the first and second substrates 11 and 12 is provided.

Alumina is an additive, and may have a transparent and transparent property. The alumina provides a function of widely diffusing light emitted by the fluorescent pigment. That is, such alumina is extended by extending the light divergence width of the first and second LED elements 20 and 30 having straightness, so that the light of the first and second LED elements 20 and 30 is unnecessarily exposed to the opposite sides. It can play the role of blocking something more reliably.

At this time, by increasing the surface area of the alumina by performing a process of forming a plurality of pores in the alumina, it is possible to further improve the light diffusion function than adding alumina, which will be described with reference to FIG.

5 is a flowchart illustrating a process of preparing alumina of a fluorescent layer.

Referring to FIG. 5, the process of manufacturing alumina having porosity may include a solvent separation step S500, a first drying step S510, a second drying step S520, and a third drying step S530. .

First, in the solvent separation step (S500), the alumina sol is added to the reaction vessel and sealed with a film, and then the reaction vessel is put into a dryer and then maintained at 70 to 80 ° C. for 1 to 6 hours to remove the solvent from the alumina sol. In this process, the alumina sol may be prepared by mixing aluminum butoxide, butanol, and nitric acid solution, in which the nitric acid solution serves as a solvent.

The alumina sol is sealed in a film after being put into a reaction vessel such as a beaker, wherein the film may be a sealing film made of a synthetic resin material generally used for sealing.

The sealed reaction vessel is dried at 70 to 80 ° C. for 1 to 6 hours to provide a function of separating the nitric acid solution, which is a solvent included in the alumina sol, from the transparent alumina.

Next, the first drying step (S510) is a process of drying the alumina sol in which the solvent is separated so that the weight of the reaction vessel after forming a plurality of through holes in the film of the reaction vessel to 70 to 80% of the weight before drying This is a step where the solvent separated from the alumina sol is volatilized and removed through the through hole.

In addition, since only the solvent is volatilized and removed through the through-holes, it is possible to prevent rapid drying of the alumina to prevent cracks on the alumina surface.

Thereafter, the second drying step (S520) removes the film of the reaction vessel that passed through the first drying step (S510) and raises the temperature of the reaction vessel to 170 to 190 ° C. at a rate of 3 to 4 ° C./h, and then 40 to Maintaining for 50 hours is a process of further drying the alumina sol dried through the first drying step (S510).

At this time, by adjusting the temperature increase rate to 3 to 4 ° C / hour to prevent the rapid temperature rise, thereby making it possible to prevent the alumina from losing stability and transparency or cracking. Furthermore, the solvent remaining in the alumina may be further removed due to the temperature of 170 to 190 ° C to obtain a high purity alumina.

Finally, the third drying step (S530) is a process of vacuuming the reaction vessel containing the alumina sol through the second drying step (S520) at a pressure of 9 to 11 torr for 90 to 110 hours at 150 to 200 ℃, This step is to dry the alumina more completely.

Through this, it is possible to obtain a transparent transparent alumina, which is a uniform gel without cracks on the surface, and to prevent cracking on the surface by preventing shrinkage of the alumina through heat treatment and vacuum treatment.

In addition, after the third drying step (S530), an impregnation step (S540) of impregnating the nano colloidal silica dispersion in the alumina sol may be performed, wherein the nanocolloidal silica dispersion improves the diffusion of light emitted from the fluorescent pigment. It provides the function of assisting light diffusion of alumina.

The impregnation step (S540) is specifically, the first mixed solution preparation step (S541), the first dehydration step (S542), the first impregnation material production step (S543), the second mixed solution preparation step (S544), the second dehydration step ( S545), the second impregnation material step (S546).

First, the primary mixed solution preparation step (S541) is a process of preparing a primary mixed solution by adding alumina to the nano-colloidal silica dispersion and then stirred for 10 to 40 minutes at 5 to 20 ℃.

In this case, the nano colloidal silica dispersion may be prepared by mixing sodium silicate and water, followed by stirring, and the nano colloidal silica dispersion may be impregnated in a plurality of pores formed in the alumina to assist light diffusion.

Next, the first dehydration step (S542) is a process of dehydration for 5 to 20 minutes at 20 to 40 ℃ after the first mixture is added to the dehydration tank, which is formed on the alumina by controlling the amount of silica impregnated in the pores By preventing the pores from fully closing, the surface area of the alumina is prevented from being excessively reduced.

At this time, if the dehydration treatment is less than 5 minutes, the dehydration effect may be insignificant, and if it exceeds 20 minutes, the amount of silica impregnated due to excessive dehydration may be excessively reduced, so it is preferable to dehydrate the primary mixed solution for 5 to 20 minutes. Do.

Thereafter, the primary impregnating material manufacturing step (S543) is a process of preparing the first impregnating material by drying the first mixed solution subjected to the first dehydration at 20 to 100 ° C. for 1 to 3 hours, through which the silica pore of alumina It can be supported on to produce a primary impregnated material.

Next, the impregnation process may be performed once more so that a sufficient amount of silica is supported on the primary impregnated material including alumina impregnated with silica. To this end, the primary impregnated material is added to the nanocolloidal silica dispersion and then 5 to It may include a secondary mixed solution preparing step (S544) to prepare a secondary mixed solution by stirring for 10 to 40 minutes at 20 ℃, which is the same function as the above-described primary mixed solution preparing step (S541) will be described in detail It will be omitted.

Thereafter, the second dehydration step (S545) is a process of dehydrating the secondary mixed solution in a dehydration tank for 5 to 20 minutes at 20 to 40 ° C. to allow complete drying of the solvent contained in the nano colloidal silica dispersion. . In this case, the pores of the alumina can be prevented from being closed by increasing the dehydration effect by performing the dehydration treatment for a longer time than the first dehydration step (S542).

Finally, the secondary impregnating material step (S546) is a process of drying the secondary dehydrated secondary mixture at 1 to 3 hours at 20 to 100 ° C. to prepare a secondary impregnating material. The weight of the impregnated alumina is 103 to 110% of the weight of the alumina before impregnation.

The alumina prepared through this maximizes the light diffusibility of the fluorescent material, thereby enhancing the fluorescence performance of the fluorescent layer.

As described so far, the configuration and operation of the double-sided symmetry-based transparent LED display device according to the present invention have been represented in the above description and drawings, but this is merely an example, and the spirit of the present invention is not limited to the above description and the drawings. And, of course, various changes and modifications are possible within the scope without departing from the spirit of the present invention.

10: substrate 11: first substrate
12 second substrate 20 first LED device
30: second LED element 40: adhesive
50: protective layer 60: fluorescent layer
100: drive unit 110: first drive unit
120: second drive unit

Claims (11)

A first substrate made of a transparent material having a plurality of first LED elements;
A second substrate having a plurality of second LED elements mounted to correspond to the mounting positions of the first LED elements, the second substrate being made of a transparent material bonded to the first substrate;
A first driver mounted on one side of the first and second substrates and generating a first signal for controlling lighting of the first LED element so that a first shape is observed from the front surface of the first substrate; And a driving unit including a second driving unit configured to generate a second signal to control lighting of the second LED element so that the first shape is not observed in the left and right sides of the second substrate, which is the back side of the first substrate. A method of manufacturing a double-sided symmetric based transparent LED display device,
A first step of preparing a first substrate on which the first LED element is mounted on the front surface and a second substrate on which the second LED element is mounted on the front surface;
A second step of installing the driver on one side of the first and second substrates;
A third step of coating and forming a protective layer containing silicon on the periphery of the first and second LED elements on the front of the first and second substrates;
And a fourth step of mutually bonding the back surfaces of the first and second substrates through an adhesive agent.
Between the first step and the second step,
Preparing a fluorescent layer by mixing 85 to 95 wt% of epoxy resin, 1 to 10 wt% of alumina, and 0.5 to 5 wt% of fluorescent pigment;
Forming the fluorescent layer around the periphery of the first and second LED elements. The method of claim 1,
The protective layer,
A method of manufacturing a transparent LED display device, comprising silicon and a ceramic material containing any one of kaolin and bentonite. The method of claim 2,
The ceramic material,
50 to 70% by weight of Isophorone diisocyanate and 30 to 50% by weight of 1,4-dioxane were stirred under a nitrogen atmosphere for 1 to 30 minutes based on the total weight of the primary solution. Preparing a primary solution;
50 to 70% by weight of hydroxyethyl acrylate (hydroxyethyl acrylate), 20 to 40% by weight of 1,4-dioxane, 0.1 to 10% by weight of dibutyltin dilaurate, hydroxy A secondary solution preparing step of preparing a secondary solution by mixing 0.1 to 10 wt% of roxyyanisole;
To prepare a tertiary solution by stirring 50 to 80% by weight of the primary solution and 20 to 50% by weight of the secondary solution at 30 to 50 ℃ for 1 to 6 hours relative to the total weight of the tertiary solution, step;
A fourth solution preparing step of preparing a fourth solution by mixing 10 to 30 wt% of ceramic powder made of any one of bentonite and kaolin and 70 to 90 wt% of toluene, based on the total weight of the fourth solution;
A fifth solution is prepared by stirring 20 to 40 wt% of the tertiary solution and 60 to 80 wt% of the fourth solution at 50 to 80 ° C. for 30 to 60 hours, based on the total weight of the fifth solution. step;
And a filtrate washing step of washing the residue obtained by filtering the fifth solution with toluene one to five times. The method of claim 1,
The alumina,
A solvent separation step of separating the solvent from the alumina sol by adding an alumina sol to the reaction container and sealing the film with a film, then putting the reaction container into a dryer and maintaining the same at 70 to 80 ° C. for 1 to 6 hours;
A first drying step of forming a plurality of through holes in the film of the reaction container and then drying the alumina sol in which the solvent is separated such that the weight of the reaction container becomes 70 to 80% of the weight before drying;
After removing the film of the reaction vessel subjected to the first drying step, the temperature of the reaction vessel is heated to 170 to 190 ℃ at a rate of 3 to 4 ℃ / h and maintained for 40 to 50 hours through the first drying step A second drying step of further drying the dried alumina sol;
Evacuating the reaction vessel containing the alumina sol through a second drying step at a pressure of 9 to 11 torr for 90 to 110 hours at 150 to 200 ° C. And a third drying step. The method of manufacturing a transparent LED display. The method of claim 4, wherein
After the third drying step,
Including; impregnating, impregnating the nano colloidal silica dispersion in the alumina sol after the third drying step,
The impregnation step,
Injecting the alumina to the nano-colloidal silica dispersion and stirred for 5 to 20 minutes at 10 to 40 minutes to prepare a primary mixed solution, the primary mixed solution manufacturing step;
A first dehydration step of dewatering the primary mixed solution in a dehydration tank for 5 to 20 minutes at 20 to 40 ° C .;
Preparing a first impregnating material by drying the first mixed solution subjected to primary dehydration at 20 to 100 ° C. for 1 to 3 hours to prepare a first impregnating material;
Injecting the primary impregnated material into the nano-colloidal silica dispersion, and then stirred for 5 to 20 minutes at 10 to 40 minutes to prepare a secondary mixture, secondary mixture preparation step;
A second dehydration step of dehydrating the second mixed solution in a dehydration tank for 5 to 20 minutes at 20 to 40 ° C .;
Preparing a secondary impregnating material by drying the secondary mixed solution subjected to secondary dehydration at 20 to 100 ° C. for 1 to 3 hours to produce a secondary impregnating material. Way. delete delete delete delete delete delete

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