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KR102012642B1 - Nir film, method for manufacturing the same, and camera module having the same - Google Patents

Nir film, method for manufacturing the same, and camera module having the same Download PDF

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Publication number
KR102012642B1
KR102012642B1 KR1020120137367A KR20120137367A KR102012642B1 KR 102012642 B1 KR102012642 B1 KR 102012642B1 KR 1020120137367 A KR1020120137367 A KR 1020120137367A KR 20120137367 A KR20120137367 A KR 20120137367A KR 102012642 B1 KR102012642 B1 KR 102012642B1
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KR
South Korea
Prior art keywords
near infrared
layer
strength reinforcing
reinforcing layer
infrared
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Application number
KR1020120137367A
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Korean (ko)
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KR20140069725A (en
Inventor
김경진
Original Assignee
엘지이노텍 주식회사
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Priority to KR1020120137367A priority Critical patent/KR102012642B1/en
Publication of KR20140069725A publication Critical patent/KR20140069725A/en
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Publication of KR102012642B1 publication Critical patent/KR102012642B1/en

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    • G—PHYSICS
    • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03B—APPARATUS OR ARRANGEMENTS FOR TAKING PHOTOGRAPHS OR FOR PROJECTING OR VIEWING THEM; APPARATUS OR ARRANGEMENTS EMPLOYING ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ACCESSORIES THEREFOR
    • G03B11/00—Filters or other obturators specially adapted for photographic purposes
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B27/00—Layered products comprising a layer of synthetic resin
    • B32B27/06—Layered products comprising a layer of synthetic resin as the main or only constituent of a layer, which is next to another layer of the same or of a different material
    • B32B27/08—Layered products comprising a layer of synthetic resin as the main or only constituent of a layer, which is next to another layer of the same or of a different material of synthetic resin
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B7/00—Layered products characterised by the relation between layers; Layered products characterised by the relative orientation of features between layers, or by the relative values of a measurable parameter between layers, i.e. products comprising layers having different physical, chemical or physicochemical properties; Layered products characterised by the interconnection of layers
    • B32B7/02—Physical, chemical or physicochemical properties
    • G—PHYSICS
    • G02—OPTICS
    • G02B—OPTICAL ELEMENTS, SYSTEMS OR APPARATUS
    • G02B1/00—Optical elements characterised by the material of which they are made; Optical coatings for optical elements
    • G02B1/04—Optical elements characterised by the material of which they are made; Optical coatings for optical elements made of organic materials, e.g. plastics
    • G—PHYSICS
    • G02—OPTICS
    • G02B—OPTICAL ELEMENTS, SYSTEMS OR APPARATUS
    • G02B5/00—Optical elements other than lenses
    • G02B5/20—Filters
    • G02B5/208—Filters for use with infrared or ultraviolet radiation, e.g. for separating visible light from infrared and/or ultraviolet radiation
    • G—PHYSICS
    • G02—OPTICS
    • G02B—OPTICAL ELEMENTS, SYSTEMS OR APPARATUS
    • G02B5/00—Optical elements other than lenses
    • G02B5/20—Filters
    • G02B5/22—Absorbing filters
    • G02B5/223—Absorbing filters containing organic substances, e.g. dyes, inks or pigments

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  • Physics & Mathematics (AREA)
  • General Physics & Mathematics (AREA)
  • Optics & Photonics (AREA)
  • Health & Medical Sciences (AREA)
  • Toxicology (AREA)
  • Laminated Bodies (AREA)
  • Optical Filters (AREA)

Abstract

Near-infrared film according to the present invention is a transparent resin; And a near infrared absorbing layer comprising a near infrared absorber absorbing near infrared rays which are mixed and dispersed in the transparent resin in a bead shape, wherein the method for producing a near infrared film has a powder form absorbing near infrared rays in a transparent resin dissolved in a solvent. Mixing the near infrared absorber to form a resin-absorber mixture; Spreading the resin-absorber mixture in a uniform thickness on a plate to form a preliminary near infrared absorbing layer; And curing the preliminary near infrared absorbing layer to form a near infrared absorbing layer.

Description

Near-infrared film, manufacturing method thereof, and a camera module having the same {NIR FILM, METHOD FOR MANUFACTURING THE SAME, AND CAMERA MODULE HAVING THE SAME}

The present invention relates to a near infrared film, a method of manufacturing the same, and a camera module having the same.

Recently, digital camera modules capable of storing digital images and / or video are being mounted on various electronic products such as smart phones, tablet PCs, and small game machines.

Recently, the development of digital camera module technology to realize slimness, low power consumption, high resolution image acquisition and light weight is in progress, and recently, technology development of a filter that maximizes the performance of the lens and the lens that determines the image quality of the camera module has been recently developed. It is actively underway.

The NIR filter is a typical filter installed in the camera module, and the NIR filter serves to filter NIR having a wavelength between 700 nm and 1100 nm.

Near-infrared rays included in natural light affect the quality of digital images obtained from the digital camera module. The CMOS image sensor mounted in the digital camera module has high sensitivity to red, so that near-infrared light included in natural light passing through the lens is filtered out. If the image is captured directly by the CMOS image sensor, red color is included in the image captured by the CMOS image sensor. Recently, most camera modules have a near infrared filter that blocks near infrared rays.

The conventional near infrared filter is manufactured in the form of a plate by mixing the material blocking the near infrared rays into the molten glass, and thus, the conventional near infrared filter including the glass substrate is very thick and increases the volume of the camera module, and the brittleness is weak. Even a small impact applied from the outside has a problem that is easily broken.

The present invention provides a near-infrared filter, a method for manufacturing the same, and a camera module having the same, which is formed to a very thin thickness to reduce the total volume of the camera module and is not damaged by an externally applied shock or the like.

The technical problem to be achieved by the present invention is not limited to the technical problem mentioned above, and other technical problems not mentioned above may be clearly understood by those skilled in the art from the following description. will be.

In one embodiment, the near infrared film is a transparent resin; And a near infrared absorbing layer comprising a near infrared absorber that is mixed with and dispersed in the transparent resin in a bead shape to absorb incident near infrared rays.

In one embodiment, the method for producing a near-infrared film includes mixing a near-infrared absorber in a powder form absorbing near infrared rays to a transparent resin dissolved in a solvent to form a resin-absorber mixture; Spreading the resin-absorber mixture in a uniform thickness on a plate to form a preliminary near infrared absorbing layer; And curing the preliminary near infrared absorbing layer to form a near infrared absorbing layer.

In one embodiment, the camera module comprises a camera body; A lens disposed on the camera body through which external light passes; An image sensor facing the lens and configured to capture light passing through the lens; And a near-infrared absorbing layer interposed between the lens and the image sensor and including a near-infrared absorber that is mixed and dispersed in the transparent resin in the shape of a transparent resin and a bead to absorb incident near-infrared light, a strength reinforcing layer disposed on the near-infrared absorbing layer, and It includes a near-infrared film including a near-infrared reflective layer formed on the exposed surface of the strength reinforcing layer and the near-infrared absorbing layer, respectively.

According to the near-infrared film according to the present invention, a method of manufacturing the same, and a camera module having the same, a near-infrared film having a structure reflecting near-infrared rays, absorbing near-infrared rays, and reflecting near-infrared rays is disposed on a path of light passing through a lens and incident on an image sensor. , The near-infrared film is made of synthetic resin to prevent breakage during impact and transfer applied from the outside, and the near-infrared film is made of synthetic resin to make the thickness of the near-infrared film very thin, greatly reducing the volume of the camera module to which the near-infrared film is mounted. You can.

1 is a cross-sectional view showing a near infrared filter according to an embodiment of the present invention.
FIG. 2 is a cross-sectional view illustrating a near infrared filter in which the strength reinforcing layer of FIG. 1 is disposed.
3 is an enlarged view of a portion 'A' of FIG. 2.
4 is a cross-sectional view illustrating a near infrared reflecting layer disposed on the strength reinforcing layer illustrated in FIG. 2.
5 is an enlarged view of a portion 'B' of FIG. 4.
6 to 12 are cross-sectional views illustrating a method of manufacturing a near infrared filter according to an embodiment of the present invention.
13 is a cross-sectional view showing a camera module equipped with a near infrared filter according to an embodiment of the present invention.

Hereinafter, exemplary embodiments of the present invention will be described in detail with reference to the accompanying drawings. In this process, the size or shape of the components shown in the drawings may be exaggerated for clarity and convenience of description. In addition, terms that are specifically defined in consideration of the configuration and operation of the present invention may vary depending on the intention or custom of the user or operator. Definitions of these terms should be interpreted as meanings and concepts corresponding to the technical spirit of the present invention based on the contents throughout the present specification.

1 is a cross-sectional view showing a near infrared filter according to an embodiment of the present invention.

Referring to FIG. 1, the near infrared filter 100 includes a near infrared absorbing layer 30.

The near-infrared absorbing layer 30 is interposed between, for example, a lens for focusing external light among a digital camera module that changes external light into a digital image and a CMOS image sensor into which external light passes through the lens, thereby preventing external light. Near infrared rays having a wavelength length of about 700 nm to about 1100 nm included are selectively absorbed and visible light included in the external light passes.

The near infrared absorbing layer 30 includes a transparent resin 10 and a near infrared absorbing body 20.

The transparent resin 10 includes a high heat-resistant transparent synthetic resin having a transmittance of visible light of 90% or more and a glass transition temperature (Tg) of 100 ° C or more.

When the visible light transmittance of the transparent resin 10 is 90% or less, the visible light included in the external light may not pass through the transparent resin 10 smoothly, which may cause deterioration of the quality of the digital image captured by the CMOS image sensor.

In addition, when the glass transition temperature (Tg) of the transparent resin 10 is 100 ° C or less, the glass transition temperature (Tg) of the transparent resin 10 is 100 because the shape of the transparent resin 10 may be rapidly deformed in a high temperature environment. It is preferable that it is more than degreeC.

Examples of the synthetic resin suitable for the transparent resin 10 having a transmittance of visible light of 90% or more and a glass transition temperature (Tg) of 100 ° C or higher include, for example, polycarbonate, polymethylmethacrylate, Styrene-acrylonitrile, polystyrene, cyclic olefin copolymer, cyclic olefin copolymer, polyurethane, and polyacrylate.

Of these transparent synthetic resins, polycarbonate, polymethylmethacrylate, styrene-acrylonitrile, polystyrene, cyclic olefin copolymers are thermoplastic resins, and polyurethanes and polyacrylates are thermosetting resins.

That is, in one embodiment of the present invention, the transparent resin 10 having a visible light transmittance of 90% or more and a glass transition temperature (Tg) of 100 ° C. or more may use both a thermosetting resin or a thermoplastic resin.

The near-infrared absorber 20 is mixed and dispersed in a uniform distribution in the transparent resin 10, and the near-infrared absorber 20 serves to absorb near-infrared rays included in external light.

The near infrared absorber 20 may include an organic near infrared absorber or an inorganic near infrared absorber that absorbs near infrared having a wavelength length of about 680 nm, about 688 nm, about 705 nm, about 716 nm, about 721 nm, about 731 nm, or about 731 nm or more.

The near infrared absorber 20 may be used by using a single type of organic or inorganic near infrared absorbers alone or by blending at least two types of organic and inorganic near infrared absorbers that absorb near infrared rays having different wavelength lengths.

In one embodiment of the present invention, the transmittance of the near infrared ray having a wavelength length of about 700 nm passing through the near infrared absorbing layer 30 is limited to about 25% or less, which is a CMOS when the near infrared transmittance of the near infrared absorbing layer 30 is about 25% or more. This is because the red color may be included in the image captured by the image sensor.

In one embodiment of the present invention, the total thickness T of the near infrared absorbing layer 30 including the transparent resin 10 and the near infrared absorbing body 20 may be, for example, about 0.1 mm or less, and the near infrared absorbing layer 30. By forming the total thickness (T) of about 0.1mm to reduce the total volume of the camera module, it is possible to prevent damage due to external impact by the transparent resin (10).

FIG. 2 is a cross-sectional view illustrating a near infrared filter in which the strength reinforcing layer of FIG. 1 is disposed. 3 is an enlarged view of a portion 'A' of FIG. 2.

2 and 3, the strength reinforcing layer 40 is formed on one side of the near infrared absorbing layer 30 including the transparent resin 10 and the near infrared absorbing body 20, for example, the upper surface of the near infrared absorbing layer 30. Can be formed.

The strength reinforcing layer 40 prevents the near-infrared absorbing layer 30 from being scratched or damaged by an external impact, and serves as a base of the near-infrared reflecting layer to be described later. prevent.

The material constituting the strength reinforcing layer 40 is a high heat-resistant transparent resin having a glass transition temperature (Tg) of about 150 ° C. or more, and has a processing property and a transmittance of visible light having a thickness of about 0.005 mm to about 0.5 mm. % To 99%, and optical refractive index is 1.4 to 1.6.

As the synthetic resin that satisfies the physical-optical properties required for the strength reinforcing layer 40, polyamide-based resin or florene epoxy-based resin may be included.

Since the strength reinforcement layer 40 is repeatedly formed on the upper surface of the near-infrared absorbing layer 30 using polyamide-based resin or florene epoxy-based resin having excellent heat resistance and strength, the strength reinforcement layer 40 has high surface heat resistance and Has a high surface strength.

The strength reinforcing layer 40 is formed on the upper surface of the near infrared absorbing layer 30 by a spin coating process, a dip coating process, or a blade coating process.

Although in one embodiment of the present invention is shown and described that is formed on the upper surface of the near infrared absorbing layer 30 of the strength reinforcing layer 40 in consideration of the thickness of the near infrared filter 100, otherwise the strength reinforcing layer 40 is near infrared It may be formed on the lower surface of the near-infrared absorbing layer 30 facing the upper surface of the absorbing layer 30.

In addition, in order for the strength reinforcing layer 40 according to an embodiment of the present invention to have a high transmittance characteristic for visible light, ITO (Indium Tin Oxide) for improving the transmittance of visible light forms a synthetic resin forming the strength reinforcing layer 40. Included.

In addition, in one embodiment of the present invention, the strength reinforcing layer 40 formed on the upper surface of the near-infrared absorbing layer 30 may be formed in a different direction to implement a high rigidity.

4 is a cross-sectional view illustrating a near infrared reflecting layer disposed on the strength reinforcing layer illustrated in FIG. 2. 5 is an enlarged view of a portion 'B' of FIG. 4.

The near infrared reflecting layer 50 is disposed on the strength reinforcing layer 40 disposed on the near infrared absorbing layer 30.

The near infrared reflecting layer 50 serves to reflect the near infrared rays included in the external light passing through the lens.

In one embodiment of the present invention, the total thickness of the near infrared reflecting layer 50, the strength reinforcing layer 40 and the near infrared absorbing layer 30 is about 0.1 mm or less.

The near infrared reflecting layer 50 is formed by stacking tens of first near infrared reflecting layers 52 and tens of second near infrared reflecting layers 54, and the first near infrared reflecting layer 52 and the second near infrared reflecting layer 54 are formed. Alternately stacked.

In an embodiment of the present invention, the first near infrared reflecting layer 52 is a high refractive index layer having a relatively high refractive index, and the second near infrared reflecting layer 54 has a low refractive index having a relatively low refractive index compared to the first near infrared reflecting layer 52. Refractive index layer.

The first and second near infrared reflecting layers 52 and 54 are alternately formed so that the near infrared reflecting layer 50 formed on the strength reinforcing layer 40 has the principle of multi-interfering near infrared rays included in the external light incident on the near infrared reflecting layer 50. It is reflected by using to prevent the near infrared rays from entering the CMOS image sensor.

In one embodiment of the present invention, the near infrared reflecting layer 50 may be selectively disposed on the strength reinforcing layer 40 in consideration of the overall thickness of the near infrared filter 100, but the near infrared reflecting layer 50 to increase the blocking rate of the near infrared ray ) May be disposed on a lower surface of the near infrared absorbing layer 30 that faces the upper surface.

In an embodiment of the present invention, the near infrared reflecting layer 50 is disposed on the upper surface of the strength reinforcing layer 40 and the lower surface of the near infrared absorbing layer 30 to improve the blocking rate of the near infrared rays.

As shown in FIG. 4, the near-infrared reflection layer 50 is formed on the lower surface of the strength reinforcing layer 40 formed on the upper surface of the near-infrared absorbing layer 30 and the lower surface of the near-infrared absorbing layer 30, respectively. In this case, the near infrared rays included in the external light passing through the lens are primarily reflected by the near infrared reflecting layer 50 disposed on the intensity reinforcing layer 40 to be blocked.

In addition, the near infrared rays transmitted without being reflected by the near infrared reflecting layer 50 disposed on the strength reinforcing layer 40 are secondarily absorbed and blocked by the near infrared absorbing layer 30 disposed below the strength reinforcing layer 40.

In addition, the near infrared ray transmitted through the near infrared ray absorbing layer 30 without being absorbed by the near infrared ray absorbing layer 30 is reflected by the near infrared ray reflecting layer 50 formed on the bottom surface of the near infrared ray absorbing layer 30 such that the near infrared ray included in the external light is a CMOS image sensor. It can be suppressed or prevented from entering.

6 to 12 are cross-sectional views illustrating a method of manufacturing a near infrared filter according to an embodiment of the present invention.

Referring to FIG. 6, in order to manufacture a near infrared filter, first, a solvent, a transparent resin 10a, and a near infrared absorber 20 are mixed in the barrel 1 to form a resin-absorber mixture 30a.

The transparent resin 10a provided in the cylinder 1 is a synthetic resin having a transmittance of visible light of 90% or more and a glass transition temperature (Tg) of 100 ° C or higher. The transparent resin 10a is, for example, polycarbonate. , Polymethylmetacrylate, styrene-acrylonitrile, polystyrene, cyclic olefin copolymer, polyurethane and polyacrylate Any one can be mentioned.

Of these transparent resins 10a, polycarbonate, polymethylmethacrylate, styrene-acrylonitrile, polystyrene, cyclic olefin copolymers are thermoplastic resins, and polyurethanes and polyacrylates are thermosetting resins.

The near-infrared absorber 20 having a bead shape mixed with the transparent resin 10a in the cylinder 1 is mixed and dispersed in a uniform distribution in the transparent resin 10a melted by a solvent, and the near-infrared absorber ( 20) absorbs near infrared rays included in external light.

The near infrared absorber 20 may include an organic near infrared absorber or an inorganic near infrared absorber that absorbs near infrared having a wavelength length of about 680 nm, about 688 nm, about 705 nm, about 716 nm, about 721 nm, about 731 nm, or 731 nm or more, and the near infrared absorber 20 ) May be used by using a single type of organic or inorganic near infrared absorbers alone or by blending at least two types of organic and inorganic near infrared absorbers absorbing near infrared rays having different wavelength lengths into the transparent resin 10a.

Referring to FIG. 7, the resin-absorber mixture 30a is provided on the wide plate 3, and the resin-mixture mixture 30a provided on the top surface of the plate 3 is transferred on the top surface of the plate 3. Spread by (5), the preliminary near-infrared absorbing layer 30b which has a sheet shape with a thin thickness is formed on the flat plate 3.

At this time, the gap between the end of the blade 5 and the upper surface of the flat plate 3 is about 0.1 mm or less.

After the preliminary near infrared absorption layer 30b formed on the upper surface of the plate 3 is formed by the blade 5 as shown in FIG. 8, heat or light is provided to the preliminary near infrared absorption layer 30b as shown in FIG. 7. The solvent contained in the preliminary near infrared absorbing layer 30b is volatilized, and a hardened near infrared absorbing layer 30 is formed on the upper surface of the flat plate 3.

The near-infrared absorbing layer 30 has the hardened transparent resin 10 and the near-infrared absorber 20 disperse-distributed inside the transparent resin 10. The near infrared absorber 20 included in the transparent resin 10 efficiently absorbs near infrared rays having a wavelength length of 680 nm, 688 nm, 705 nm, 716 nm, 721 nm, and 731 nm.

Referring to FIG. 9, after the near infrared absorbing layer 30 is formed on the plate 3, the strength reinforcing layer is formed on the near infrared absorbing layer 30.

The strength reinforcing layer prevents the near-infrared absorbing layer 30 formed on the flat plate 3 from being scratched or damaged by an external impact, and serves as a base of the near-infrared reflecting layer, which will be described later. It serves to prevent this from happening.

In order to form the strength reinforcing layer on the near-infrared absorbing layer 30 formed on the flat plate 3, a flowable synthetic resin constituting the strength reinforcing layer is disposed in the cylinder (not shown). In addition, in order to improve the transmittance of visible light of the strength reinforcing layer, ITO may be added to the container in which the flowable synthetic resin forming the strength reinforcing layer is stored.

The flowable synthetic resin constituting the strength reinforcing layer is a high heat-resistant transparent resin having a glass transition temperature (Tg) of about 150 ° C. or more, and is capable of forming a very thin thickness between about 0.005 mm and about 0.5 mm, and has a visible light transmittance of 70%. To 99%, and has an optical refractive index of 1.4 to 1.6.

As the synthetic resin that satisfies the physical-optical properties required for the strength reinforcing layer, a polyamide series resin or a florene epoxy series resin may be included.

The flowable synthetic resin contained in the barrel is provided on the upper surface of the near infrared absorbing layer 30 disposed on the flat plate 3.

The flowable synthetic resin provided as the near infrared absorbing layer 30 is spread in a thin film form by a spin coating process, a dip coating process or a blade coating process, and thus a preliminary strength reinforcing layer 40a is formed on the near infrared absorbing layer 30. In one embodiment of the present invention, the preliminary strength reinforcing layer 40a is formed by blade coating fixing, for example using the blades 7.

After the preliminary strength reinforcement layer 40a is formed, the preliminary strength reinforcement layer 40a is cured by heat or light to form the first strength reinforcement layer 40, and the preliminary strength reinforcement layer 40a and the curing process are repeated a plurality of times. As shown, the strength reinforcing layer 40 is formed on the near infrared absorbing layer 30.

10 and 11, after the strength reinforcement layer 40 is formed on the near infrared absorbing layer 30, the near infrared reflection layer is formed on the strength reinforcement layer 40.

In order to form the near-infrared reflective layer on the strength reinforcing layer 40, one cylinder contains a first synthetic resin melted by a solvent, which has a first light refractive index. Another cylinder contains a second synthetic resin melted by a solvent, the second synthetic resin having a second optical refractive index lower than the first optical refractive index.

As shown in FIG. 9, the first synthetic resin having the first light refractive index is vacuum-deposited on the strength reinforcement layer 40 by a low temperature vacuum deposition process to form a first near infrared reflecting layer 52 on the strength reinforcement layer 40. do.

After the first near infrared reflecting layer 52 is formed on the strength reinforcing layer 40, as shown in FIG. 10, the second synthetic resin having the second optical refractive index is formed on the first near infrared reflecting layer 52 by a low temperature vacuum deposition process. The vacuum is deposited at low temperature to form a second near infrared reflecting layer 54 on the first near infrared reflecting layer 52.

The first and second near infrared reflecting layers 52 and 54 are alternately formed to form a near infrared reflecting layer 50 having a plurality of first and second near infrared reflecting layers 53 and 54 on the strength reinforcing layer 40. .

The near infrared reflecting layer 50 is formed on the top surface of the strength reinforcing layer 40 and the near infrared absorbing layer 30 as shown in FIG. 12 in the same manner as shown in FIGS. 10 and 11.

13 is a cross-sectional view showing a camera module equipped with a near infrared filter according to an embodiment of the present invention. The near-infrared film of the camera module shown in FIG. 13 has substantially the same configuration as the near-infrared film shown in FIGS. 1 to 5, and thus redundant description of the near-infrared film of the camera module shown in FIG. 12 will be omitted. .

4 and 12, the camera module 200 includes a body 210, a lens 220, an image sensor 230, and a near infrared film 100.

Body 210 includes a lens 220, the lens serves to improve the optical characteristics of the external light and to focus the external light to provide to the image sensor 230, the lens may be made of a plurality of combinations.

The image sensor 230 is fixed to the body 210, and the image sensor 230 senses external light passing through the lens 220 to generate a digital image or video corresponding to the external light.

The near infrared film 100 is fixed to the body 210, and the near infrared film 100 is disposed on a path of light incident through the lens 220 and incident on the image sensor 230.

The near infrared film 100 includes a near infrared absorbing layer 30, a strength reinforcing layer 40, and a near infrared reflecting layer 50.

The near-infrared absorbing layer 30 includes a transparent resin 10 and a near-infrared absorber 20 that is mixed and dispersed in a bead shape to absorb incident near-infrared rays.

The strength reinforcing layer 40 is disposed on the near infrared absorbing layer 30, and the near infrared reflecting layer 50 is formed on the exposed surface of the strength reinforcing layer 40 and the near infrared absorbing layer 30, respectively.

As described in detail above, a near infrared film having a structure reflecting near infrared rays, absorbing near infrared rays, and reflecting near infrared rays is disposed in a path of light passing through the lens and incident to the image sensor, and the near infrared film is manufactured by using a synthetic resin material. To prevent damage during the impact and transfer applied in the manufacture of a near-infrared film made of a synthetic resin material to form a very thin thickness of the near-infrared film can greatly reduce the volume of the camera module is mounted with a near-infrared film.

Although embodiments according to the present invention have been described above, these are merely exemplary, and it will be understood by those skilled in the art that various modifications and equivalent embodiments of the present invention are possible therefrom. Therefore, the true technical protection scope of the present invention will be defined by the following claims.

10 ... transparent resin 20 ... Near infrared absorber
30 ... Near-infrared absorbing layer 40 ... Strength reinforcing layer
50 ... Near infrared reflecting layer 100 ... Near infrared film

Claims (21)

Transparent resins;
A near infrared absorbing layer comprising a near infrared absorbing body mixed with and dispersed in the bead to absorb incident near infrared rays; And
It includes a strength reinforcing layer disposed on one side of the near infrared absorbing layer,
The strength reinforcing layer is a near-infrared film formed by repeating the step of applying a synthetic resin dissolved in a solvent on the near infrared absorbing layer to form a preliminary strength reinforcing layer, and curing the preliminary strength reinforcing layer. The method of claim 1,
The transparent resin is a near-infrared film containing a synthetic resin having a visible light transmittance of 90% or more and a glass transition temperature of 100 ° C or more. The method of claim 1,
The transparent resin is a near infrared film comprising at least one resin selected from the group consisting of polycarbonate, polymethyl methacrylate, styrene-acrylonitrile, polystyrene, cyclic olefin copolymer, polyurethane and polyacrylate. The method of claim 1,
The near-infrared absorber is a near-infrared film including an organic-inorganic absorber having a maximum absorption of near infrared at wavelengths of 680 nm, 688 nm, 705 nm, 716 nm, 721 nm, and 731 nm. The method of claim 1,
The near-infrared film whose thickness of the said transparent resin is 0.1 mm or less. delete The method of claim 1,
The strength reinforcing layer is a near infrared film formed in multiple layers on the near infrared absorbing layer. The method of claim 1,
The strength reinforcing layer is a near-infrared film comprising any one of polyamide and florene epoxy. The method of claim 1,
The strength reinforcing layer has a glass transition temperature of 150 ℃ or more, has a thickness of 0.005mm ~ 0.5mm, visible light transmittance of 70% to 99% and the refractive index of the near infrared film of 1.4 to 1.6. The method of claim 1,
The strength reinforcing layer is near-infrared film containing indium tin oxide (ITO) to increase the transmittance of visible light. The method of claim 1,
And a near infrared reflecting layer disposed on the strength reinforcing layer and alternately stacked with a first near infrared reflecting layer having a first photorefractive index and a second near infrared reflecting layer having a second photorefractive index. The method of claim 11,
And the near infrared reflecting layer is disposed on the exposed near infrared absorbing layer. Mixing the near-infrared absorber in powder form to absorb the near-infrared rays into a transparent resin dissolved in a solvent to form a resin-absorber mixture;
Spreading the resin-absorber mixture in a uniform thickness on a plate to form a preliminary near infrared absorbing layer;
Curing the preliminary near infrared absorbing layer to form a near infrared absorbing layer; And
Forming a strength reinforcement layer in multiple layers on one side of the near infrared absorbing layer,
The forming of the strength reinforcing layer may include applying a synthetic resin dissolved in a solvent on the near infrared absorbing layer to form a preliminary strength reinforcing layer, and curing the preliminary strength reinforcing layer. The method of claim 13,
The transparent resin includes a synthetic resin having a transmittance of visible light of 90% or more and a glass transition temperature of 100 ° C. or more,
The transparent resin is a method of producing a near-infrared film comprising at least one resin selected from the group consisting of polycarbonate, polymethyl methacrylate, styrene-acrylonitrile, polystyrene, cyclic olefin copolymer, polyurethane and polyacrylate. . The method of claim 13,
In the step of forming a resin-absorber mixture, the near-infrared absorber has a wavelength of 680nm, 688nm, 705nm, 716nm, 721nm, 731nm method for producing a near infrared film. delete delete The method of claim 13,
The method of manufacturing a near-infrared film in which the synthetic resin dissolved in the solvent is mixed with indium tin oxide (ITO), which increases the transmittance of the strength reinforcing layer. The method of claim 13,
After the step of forming a strength reinforcing layer in a multilayer on one side of the near infrared absorbing layer,
Forming a near infrared reflecting layer by alternately forming a first near infrared reflecting layer having a first refractive index and a second near infrared reflecting layer having a second optical refractive index on the other side facing the one side of the strength reinforcing layer and the near infrared absorbing layer, respectively. Method of producing a near-infrared film further comprising. The method of claim 19,
The first and second near infrared reflecting layer is a method of manufacturing a near infrared film formed by a deposition process. Camera body;
A lens disposed on the camera body through which external light passes;
An image sensor facing the lens and configured to capture light passing through the lens; And
A near-infrared absorbing layer interposed between the lens and the image sensor and including a near-infrared absorber that is mixed and dispersed in the transparent resin in the shape of a transparent resin and a bead to absorb incident infrared rays, a strength reinforcing layer disposed on the near-infrared absorbing layer, and the A near infrared film including a strength reinforcing layer and a near infrared reflecting layer each formed on an exposed surface of the near infrared absorbing layer,
The strength reinforcing layer is formed by repeating the step of applying a synthetic resin dissolved in a solvent on the near infrared absorbing layer to form a preliminary strength reinforcing layer, and curing the preliminary strength reinforcing layer.
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CN105549132B (en) * 2015-12-09 2017-11-07 同济大学 A kind of near-infrared omnidirectional absorber based on hyperbolic photonic crystal
CN109215615B (en) 2018-09-26 2020-06-19 北京小米移动软件有限公司 Display unit working parameter compensation method and device

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JP2001019898A (en) * 1999-07-05 2001-01-23 Mitsubishi Chemicals Corp Infrared-absorbing film and preparation thereof
WO2011158635A1 (en) * 2010-06-18 2011-12-22 株式会社大真空 Infrared blocking filter
JP2012103340A (en) * 2010-11-08 2012-05-31 Jsr Corp Near-infrared cut filter, solid-state imaging sensor and solid-state imager equipped with the same

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JP3457132B2 (en) * 1996-11-14 2003-10-14 三菱化学株式会社 filter
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JP2001019898A (en) * 1999-07-05 2001-01-23 Mitsubishi Chemicals Corp Infrared-absorbing film and preparation thereof
WO2011158635A1 (en) * 2010-06-18 2011-12-22 株式会社大真空 Infrared blocking filter
JP2012103340A (en) * 2010-11-08 2012-05-31 Jsr Corp Near-infrared cut filter, solid-state imaging sensor and solid-state imager equipped with the same

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