KR101967736B1 - Illuminating device - Google Patents

Abstract

A light source module comprising a printed circuit board, at least one light source disposed on the printed circuit board, and a resin layer disposed on the printed circuit board to embed the light source; A light reflecting member disposed on at least one side of the resin layer and reflecting light emitted from the light source; And an optical plate including an upper surface disposed on the light source module and a sidewall formed integrally with the upper surface and extending in a downward direction and disposed on a side surface of the light reflecting member, A first air gap is formed between the light source module and the upper surface of the optical plate, and the optical plate is capable of providing an illumination device having a haze of 30% or less.

Description

ILLUMINATING DEVICE

The present invention relates to the field of illuminator technology.

The LED (Light Emitted Diode) device is a device that converts electrical signals to infrared rays or light using the characteristics of compound semiconductors. Unlike fluorescent light, unlike harmful substances such as mercury, it does not cause environmental stigma. It has a long lifetime advantage. In addition, it consumes low power compared to conventional light sources, has high visibility due to high color temperature, and has a small glare.

Accordingly, the current illumination device has been developed to use a conventional light source such as a conventional incandescent lamp or a fluorescent lamp as a light source. In particular, as disclosed in Japanese Patent Application Laid-Open No. 2001-0009209, A light emitting device that performs a surface light emitting function is provided.

In the above-described conventional lighting apparatus, a flat light guide plate is disposed on a substrate, and a plurality of side-type LEDs are arranged in an array on the side of the light guide plate. Here, the light guide plate is a type of plastic molded lens that performs a function of supplying uniform light to the light emitted from the LED. Therefore, although such a light guide plate is used as an essential part in a conventional lighting apparatus, The thickness of the entire product due to the thickness of the light guide plate itself is limited and it is difficult to apply to the portion where the light guide plate itself is formed due to the flexibility of the material of the light guide plate itself, .

In addition, there is a problem that a light loss occurs due to a part of light emitted from the side surface of the light guide plate, thereby lowering the light efficiency. In addition, characteristics of the LED (e.g., brightness and wavelength) Problems were also implied.

Published Patent Application No. 10-2012-0009209

SUMMARY OF THE INVENTION The present invention has been proposed in order to solve the above problems and provides a lighting device capable of being thinned, improving freedom of product design, improving heat radiation efficiency, and suppressing wavelength shift and light intensity reduction For that purpose.

In particular, it is another object of the present invention to provide a lighting apparatus for maximizing optical efficiency and reducing the thickness of an optical plate by implementing a structure in which a haze of an optical plate disposed on an upper portion of the light source is 30% or less .

As a means for solving the above-mentioned problems, in an embodiment of the present invention, a printed circuit board, at least one light source disposed on the printed circuit board, and a resin layer disposed on the printed circuit board to embed the light source, A light source module including the light source module; A light reflecting member disposed on at least one side of the resin layer and reflecting light emitted from the light source; And an optical plate including an upper surface disposed on the light source module and a sidewall formed integrally with the upper surface and extending in a downward direction and disposed on a side surface of the light reflecting member, A first air gap is formed between the light source module and the upper surface of the optical plate, and the optical plate is capable of providing an illumination device having a haze of 30% or less.

According to the present invention, by providing the light reflecting member, light loss generated on the side of the resin layer can be minimized, and the brightness and illuminance of the lighting apparatus can be improved.

Particularly, it is possible to provide a lighting apparatus that maximizes the light efficiency and reduces the thickness of the optical plate by implementing a structure in which the haze of the optical plate disposed on the light source is 30% or less.

Further, according to the present invention, the light guide plate is removed and light is guided by using the resin layer, thereby reducing the number of light emitting device packages and reducing the overall thickness of the lighting device.

According to the present invention, since the resin layer can be formed of a high heat-resistant resin, it is possible to provide a highly reliable lighting device having an effect of realizing a stable luminance despite the heat generated in the light emitting device package.

In addition, according to the present invention, flexibility can be ensured by forming a lighting device using a flexible printed circuit board and a resin layer, thereby improving the degree of freedom in product design.

According to the present invention, since the diffuser plate itself surrounds the side surface of the light source module, the diffuser plate itself can perform the function of the housing at the same time, so that the efficiency of the manufacturing process is improved by not using a separate structure, Durability and reliability can be improved. Further, according to the present invention, heat radiation efficiency can be improved, and wavelength shift and light intensity reduction can be suppressed.

1 shows a lighting device according to an embodiment of the present invention.
2A to 2D are views for explaining a first preferred embodiment according to the present invention.
Figs. 3 to 17 show the first to sixteenth embodiments of the light source module shown in Fig.
Fig. 18 shows an embodiment of the reflection pattern shown in Fig.
19 is a plan view of a seventeenth embodiment of the light source module shown in Fig.
20 is a cross-sectional view of the light source module shown in Fig. 19 in the direction AA '.
FIG. 21 is a cross-sectional view of the light source module shown in FIG. 19 in the BB 'direction.
FIG. 22 is a cross-sectional view of the light source module shown in FIG. 19 in the CC 'direction.
23 shows a headlamp for a vehicle according to an embodiment of the present invention.
24 is a perspective view of a light emitting device package according to an embodiment of the present invention.
25 is a top view of a light emitting device package according to an embodiment of the present invention.
26 is a front view of a light emitting device package according to an embodiment of the present invention.
27 is a side view of a light emitting device package according to an embodiment of the present invention.
Fig. 28 is a perspective view of the first lead frame and the second lead frame shown in Fig. 24. Fig.
29 is a view for explaining dimensions of respective portions of the first lead frame and the second lead frame shown in Fig.
Fig. 30 shows an enlarged view of the connecting parts shown in Fig. 29;
31 to 36 show a modified embodiment of the first lead frame and the second lead frame.
37 is a perspective view of a light emitting device package according to another embodiment of the present invention.
38 shows a top view of the light emitting device package shown in Fig.
39 shows a front view of the light emitting device package shown in Fig.
40 shows a cross-sectional view of the light emitting device package shown in Fig. 37 in the direction of the cd.
41 shows the first lead frame and the second lead frame shown in Fig.
FIG. 42 shows measured temperatures of the light emitting device package according to the embodiment of the present invention. FIG.
Fig. 43 shows an embodiment of the light emitting chip shown in Fig.
44 shows a lighting apparatus according to another embodiment.
45 shows a headlamp for a general vehicle which is a point light source.
46 shows a tail lamp for a vehicle according to an embodiment of the present invention.
47 shows a general tail lamp for a vehicle.
48A and 48B show the intervals of the light emitting device package of the light source module used in the automotive tail lamp according to the embodiment of the present invention.

Hereinafter, the configuration and operation according to the present invention will be described in detail with reference to the accompanying drawings. DETAILED DESCRIPTION OF THE PREFERRED EMBODIMENTS In the following description with reference to the accompanying drawings, the same reference numerals denote the same elements regardless of the reference numerals, and redundant description thereof will be omitted. The terms first, second, etc. may be used to describe various components, but the components should not be limited by the terms. The terms are used only for the purpose of distinguishing one component from another.

The present invention relates to a lighting apparatus, in which a light guide plate is removed and replaced with a resin layer, a light reflecting member is disposed on a side of a resin layer to improve brightness and illuminance, , The optical plate is processed and used as a support for the light reflection member, thereby ensuring the integrity of the product, durability and reliability, and securing the flexibility of the lighting apparatus itself. Particularly, a structure in which the haze of the optical plate applied to the lighting apparatus is set to be 30% or less is realized, thereby maximizing optical efficiency and reducing the thickness of the optical plate.

In addition, the lighting device according to the present invention is applicable to various lamp devices requiring illumination, such as a vehicle lamp, a domestic lighting device, and an industrial lighting device. For example, when it is applied to a vehicle lamp, it can be applied to a headlight, a vehicle interior light, a door scarf, a rear light, and the like. In addition, the illumination device of the present invention can be applied to a backlight unit field applied to a liquid crystal display device, and can be applied to all lighting-related fields that are currently developed, commercialized, or can be implemented according to future technology development.

Hereinafter, the term "light source module" means collectively construing configurations excluding an optical plate such as a diffusion plate and a light reflecting member.

Fig. 1 shows a lighting apparatus 1 according to an embodiment of the present invention. Referring to FIG. 1, the lighting apparatus 1 includes a light source module 100 that is a surface light source, and may further include a housing 150 that receives the light source module 100. The light source module 100 includes at least one light source that generates light, and can diffuse and disperse light generated from a light source, which is a point light source, to realize a surface light source and have flexibility and bend.

The housing 150 protects the light source module 100 from impact and can be made of a material (e.g., acrylic) through which the light emitted from the light source module 100 can be transmitted. The housing 150 may include a bent portion in terms of design, and the light source module 100 may be easily accommodated in the curved housing 150 because of its flexibility. Of course, since the housing 150 itself has a certain flexibility, it is also possible that the entire structure of the lighting apparatus 1 itself has certain flexibility.

2A is a conceptual diagram for explaining a structure of an optical plate applied to an embodiment of the present invention.

The optical plate 70 applied to the embodiments realizes the function of guiding and diffusing the light irradiated by the light source, and can be applied not only to the plate-like structure but also to the optical plate having the bent structure as shown in Fig. 2A can do. In particular, the optical plate applied to all embodiments of the present invention is characterized by a haze of 30% or less. In the embodiment of the present invention, the haze is defined as the ratio (b) of the diffused light among the light that passes through the optical plate 70 at the incident total light amount A. That is, the total light amount A incident on the optical plate is divided into light that is reflected and absorbed and light that is transmitted through the optical plate. Among them, the ratio (b / (a + b)) of the diffused light in the transmitted light is divided into straight light and diffused light, which is the light passing through the optical plate.

The optical plate 70 applied to the illuminating device according to the embodiment of the present invention may have a haze of 30% or less, which may include organic or inorganic beads inside the optical plate 70 Or by implementing a lens pattern on the surface of the optical plate 70.

FIGS. 2B to 2D show the structure of the illumination device according to the first embodiment 100-1 of the present invention, in which the haze of the optical plate described above with reference to FIG. 2A is set to 30% or less. More specifically, Sectional view of the illumination device shown in Fig. 1 in the AB direction. In addition, the method of adjusting the haze of the optical plate applied in Figs. 2B to 2D can be applied to the optical plate applied to the embodiment of the whole lighting apparatus of the present invention, which is proposed in Fig. 3 and thereafter.

2B shows a structure in which a haze is 30% or less by including beads in an optical plate 70. FIG. 2C shows a structure in which a lens pattern p-1 is formed on the surface of the optical plate 70, FIG. 2 (d) shows a structure in which the bead and the lens pattern p-1 are simultaneously formed on the optical plate, and the haze is 30% or less.

A light reflecting member 90 is formed on at least one of the one side surface and the other side surface of the resin layer 40, And an optical plate 70 is formed on the light source module 100-1. The optical plate 70 may be configured to transmit, diffuse, or homogenize the light. In the present embodiment, the optical plate 70 is applied as a diffusion plate. In particular, a first air gap is formed between the light source module and the upper surface of the diffusion plate, and the optical plate may have a haze of 30% or less.

The optical plate 70 may include a plurality of optical beads B therein to form a haze of 30% or less. The optical plate 70 may be formed of an acrylic resin, but is not limited thereto. In addition, the optical plate 70 may be formed of a material such as polystyrene (PS), polymethylmethacrylate (PMMA), cyclic olefin copoly (COC), polyethylene terephthalate ), High-permeability plastic such as polycarbonate or resin, and the like. The optical bead B may be formed of any one material selected from CaCO ₃ , Ca ₃ (SO ₄ ) ₂ , BaSO ₄ , TiO ₂ , SiO ₂ , and organic beads (Methacrylate Styrene). In this case, the optical bead may be included in an amount of 5% or less based on the total weight of the resin constituting the optical plate, or may be a combination of two or more kinds of optical beads as well as one kind of optical beads. The optical bead may have a particle diameter of 50 mu m or less.

In addition, as shown in FIG. 2C, it is also possible to form the lens pattern P-1 on the surface of the optical plate 70 to have a haze of 30% or less. In this case, the lens pattern (P-1) may be embossed patterns having a height d1 of the unit pattern in the range of 1 to 150 um and a diameter d2 in the range of 1 to 300 um in consideration of the unit pattern. Of course, each unit pattern may have a uniform size and a layout density, but they may be arranged in different sizes and nonuniform layouts. FIG. 2D shows a structure of a lighting apparatus having a structure in which a bead and a lens pattern (P-1) are simultaneously implemented on an optical plate and a haze is 30% or less.

The optical plate 70 may be disposed on the light source module 100-1 or more specifically on the resin layer 40. The optical plate 70 may be disposed over the entire surface of the resin layer 40, And diffuse uniformly. The thickness of the optical plate 70 may be basically in a range of 0.5 to 5 mm, but the present invention is not limited thereto and may be suitably changed in accordance with specifications of the lighting apparatus. Particularly, the optical plate 70 of the present invention has a structure having a top wall 71 and side walls 73 integrally formed with the top wall 71 as shown in FIGS. 2B to 2D, (73) covers the side surface of the light source module (100-1).

A first air gap 80 may be present between the upper surface 71 of the optical plate 70 and the resin layer 40. The refractive index difference with respect to the resin layer 40 can be generated due to the presence of the first air gap 80 and thus the uniformity of the light supplied to the optical plate 70 can be increased, Uniformity of light diffused and emitted through the plate 70 can be improved. The thickness of the first air gap 80 may range from more than 0 to 30 mm in order to minimize the deviation of light transmitted through the resin layer 40. However, the present invention is not limited thereto and the design can be changed if necessary.

The side wall 73 of the optical plate 70 surrounds the side surface of the light source module 100-1. The side wall 73 serves as a support for supporting the light reflecting member 90 and a housing for protecting the light source module 100-1 as described above. That is, the optical plate 70 according to the present invention can serve as the housing 150 shown in FIG. 1 as needed. According to this, since the optical plate 70 itself surrounds the side surface of the light source module 100-1, the optical plate 70 itself can perform the function of the housing at the same time, The effect of improving the process efficiency and the durability and reliability of the product itself can be obtained.

The structure of FIG. 2B to FIG. 2D has the same structure except for the manner of implementing the optical plate, and the structure of another illumination device will be described with reference to the same.

The printed circuit board 10 may be a printed circuit board using a flexible insulating substrate, that is, a flexible printed circuit board 10.

For example, the printed circuit board 10 may include circuit patterns (e.g., 6 and 7) disposed on at least one side of a base member (e.g., 5) and a base member (e.g., 5 may be a film having flexibility and insulation, such as polyimide or epoxy (for example, FR-4).

More specifically, the printed circuit board 10 includes an insulating film 5 (e.g., polyimide or FR-4), a first copper foil pattern 6, a second copper foil pattern 7, and a via contact 8, . ≪ / RTI > The first copper foil pattern 6 is formed on one surface (e.g., upper surface) of the insulating film 5 and the second copper foil pattern 7 is formed on the other surface (e.g., lower surface) The first copper foil pattern 6 and the second copper foil pattern 7 can be connected through the via contact 8 formed through the film 5.

Hereinafter, the case where the printed circuit board 10 is made of a flexible printed circuit board as described above will be described by way of example, and the term is used interchangeably. However, this is merely an example, It can be said that it can be used as the substrate 10.

The light emitting elements 20 are arranged on the flexible printed circuit board 10 in one or more numbers, and emit light. For example, the light emitting device 20 may be a side view type light emitting device package arranged such that light to be emitted proceeds in a direction 3 toward the side of the resin layer 40. The light emitting chip mounted on the light emitting device package may be a vertical light emitting chip, for example, the red light emitting chip shown in FIG. 43, but the embodiment is not limited thereto.

The resin layer 40 is disposed on the flexible printed circuit board 10 and the light emitting element 20 so as to embed the light emitting element 20 and is disposed in the lateral direction 3 of the resin layer 40 from the light emitting element 20. [ Can be diffused and guided in a direction toward one surface (for example, an upper surface) of the resin layer 40. [

The resin layer 40 may be made of a resin capable of diffusing light, and its refractive index may be formed within a range of 1.4 to 1.8, but is not limited thereto.

For example, the resin layer 40 may be formed of a high heat-resistant ultraviolet curing resin including an oligomer. In this case, the content of the oligomer may be 40 to 50 parts by weight. Urethane acrylate may be used as the ultraviolet ray hardening resin. However, the ultraviolet ray hardening resin may be epoxy acrylate, polyester acrylate, polyether acrylate, At least one of polybutadiene acrylate and silicone acrylate may be used.

Particularly, when urethane acrylate is used as an oligomer, two different types of urethane acrylate are mixed and used to realize different properties at the same time.

For example, isocyanate is used in the synthesis of Urethane Acrylate, and the physical properties (sulfur denaturation, weather resistance, chemical resistance, etc.) of Urethane Acrylate are determined by Isocyanate. At this time, one kind of Urethane Acrylate is implemented as Urethane Acrylate type-Isocyanate, and the NCO% of PDI (isophorone diisocyanate) or IPDI (isophorone diisocyanate) is 37% ) And another type of Urethane Acrylate as Urethane Acrylate type-Isocyanate, and the NCO% of PDI (isophorone diisocyanate) or IPDI (isophorone diisocyanate) is 30 ~ 50% or 25 ~ 35% (Hereinafter referred to as a 'second oligomer') according to an embodiment of the present invention. According to this, the first oligomer and the second oligomer having different physical properties can be obtained according to the NCO% control, and the oligomer constituting the resin layer 40 can be realized by mixing the first oligomer and the second oligomer. In this case, the first oligomer weight ratio in the oligomer may be in the range of 15 to 20, and the second oligomer weight ratio may be in the range of 25 to 35.

Alternatively, the resin layer 40 may further comprise at least one of a monomer and a photo initiator. More specifically, 35 to 45 parts by weight of isobornyl acrylate (IBOA), 10 to 15 parts by weight of 2-HEMA (2-hydroxyethyl methacrylate), 2 to 2 parts by weight of 2-hydroxybutyl Acrylate) in an amount of 15 to 20 parts by weight. In the case of a photoinitiator (for example, 1-hydroxycyclohexyl phenyl-ketone, diphenyl), or diphenyl (2,4,6-trimethylbenzoyl phosphine oxide), 0.5 to 1 part by weight may be used.

The resin layer 40 may be made of a thermosetting resin having high heat resistance. Specifically, the resin layer 40 may be made of a thermosetting resin including at least one of a polyester polyol resin, an acrylic polyol resin, and a hydrocarbon-based and / or ester-based solvent. Such a thermosetting resin may further include a thermosetting agent for improving the film strength.

In the case of a polyester polyol resin, the content of the polyester polyol resin may be 9 to 30% based on the total weight of the thermosetting resin. Also, in the case of an acrylic polyol resin, the content of the acrylic polyol may be 20 to 40% based on the total weight of the thermosetting resin.

In the case of the hydrocarbon-based and / or ester-based solvent, the content of the hydrocarbon-based and / or ester-based solvent may be 30 to 70% based on the total weight of the thermosetting resin. In the case of the thermosetting agent, the content of the thermosetting resin may be 1 to 10% based on the total weight of the thermosetting resin. When the resin layer 40 is formed of the material as described above, It is possible to minimize the decrease in luminance due to heat even if it is used in an apparatus, and a lighting apparatus with high reliability can be provided.

In addition, according to the present invention, the thickness of the resin layer 40 can be reduced by using the above-described materials for the surface light source realization, thereby realizing thinning of the entire product. According to the present invention, since a lighting device is formed using a flexible printed circuit board and a resin layer made of a soft material, the lighting device can be easily applied to a curved surface, thereby improving the degree of freedom of design, Application and application are possible.

The resin layer 40 may include a diffusion material 41 in which hollow (or void) is formed, and the diffusion material 41 may be in a form mixed or diffused with the resin constituting the resin layer 40, And can improve the reflection and diffusion characteristics of light.

For example, the light emitted from the light emitting element 20 to the inside of the resin layer 40 is reflected and transmitted by the hollow of the diffusion material 41, whereby light is diffused and condensed in the resin layer 40, (E.g., the upper surface) of the resin layer 40. [0050] At this time, the reflectance and diffusivity of light are increased by the diffusion material 41, so that the light amount and the uniformity of the outgoing light supplied to the upper surface of the resin layer 40 are improved and consequently the brightness of the light source module 100-1 is improved .

The content of the diffusing material 41 can be appropriately adjusted to obtain a desired light diffusion effect. Specifically, it may be adjusted in the range of 0.01 to 0.3% of the weight of the entire resin layer 40, but is not limited thereto. The diffusion material 41 may be composed of any one selected from the group consisting of sillicon, silica, glass bubble, PMMA, urethane, Zn, Zr, Al2O3, The particle size of the diffusion material 41 may be 1 탆 to 20 탆, but is not limited thereto.

A light reflecting member 90 is formed on at least one of the one side surface and the other side surface of the resin layer 40. The light reflecting member 90 reflects light emitted from the light source 20 toward the upper side of the resin layer 70 And serves as a guide for preventing light from being emitted to the outside through the side surface of the resin layer 40. [ The light reflection member 90 may be made of a material having excellent light reflectance, for example, a white resist, and further includes a synthetic resin dispersedly containing a white pigment or a synthetic resin having metal particles having excellent light reflection characteristics dispersed therein It is possible. As the white pigment, titanium oxide, aluminum oxide, zinc oxide, lead carbonate, barium sulfate, calcium carbonate and the like may be used, and in the case of including a metal powder, Ag powder excellent in reflectivity may be included. It is also possible that an additional fluorescent whitening agent is further included. That is, the light reflecting member 90 of the present invention can be formed using all materials that have been developed or can be implemented according to future technological developments, and have excellent light reflectance. On the other hand, the light reflection member 90 may be directly molded or bonded to the side surface of the resin layer 40, or may be attached via a separate adhesive material (or adhesive tape).

As described later, the optical plate 70 and the optical plate 70 can be formed by directly molding or bonding to the inside of the side wall 73 of the optical plate 70, It can also be combined.

Although the light reflecting member 90 is shown as being formed on the entire inner side surface of the side wall 73 of the optical plate 70 in the drawing, this is only an example and it is also possible to form the light reflecting member 90 only on the side surface of the resin layer 40 And may be formed on the side surface of the resin layer 40 and the side surface of the flexible printed circuit board 10. That is, in the range including the side surface of the resin layer 40, the formation range of the light reflecting member 90 is not limited.

According to this, by forming the light reflecting member 90 on the side surface of the resin layer 40, it is possible to prevent light leakage to the side surface of the resin layer 40, thereby reducing the light loss and increasing the light efficiency. The brightness and the illuminance of the illumination device relative to the power can be improved.

Fig. 3 shows a second embodiment 100-2 of the light source module shown in Fig. The same reference numerals as those in FIG. 2 denote the same components, and duplicate contents thereof will be omitted or briefly explained.

Referring to FIG. 3, in order to improve heat dissipation efficiency, the second embodiment may be a structure including the heat dissipating member 110 in the first embodiment 100-1.

The radiation member 110 is disposed on the lower surface of the flexible printed circuit board 10 and discharges heat generated from the light emitting device 20 to the outside. That is, the heat dissipating member 110 can improve the efficiency of emitting heat generated from the light emitting device 20, which is a heat source, to the outside.

For example, the heat radiation member 110 may be disposed on a part of the lower surface of the flexible printed circuit board 10. The heat-radiating member 110 may include a plurality of heat-radiating layers (e.g., 110-1 and 110-2) spaced apart. The heat-radiating layers 110-1 and 110-2 may overlap at least part of the light-emitting elements 20 in the vertical direction in order to improve the heat radiation effect. Here, the vertical direction may be the direction from the flexible printed circuit board 10 to the resin layer 40.

The heat radiation member 110 may be a material having a high thermal conductivity, for example, aluminum, an aluminum alloy, copper, or a copper alloy. Or the heat dissipating member 110 may be a metal core printed circuit board (MCPCB). The heat dissipating member 110 may be attached to the lower surface of the flexible printed circuit board 10 by an acrylic adhesive (not shown).

In general, when the temperature of the light emitting device is increased due to heat generated from the light emitting device, the light intensity of the light emitting device may decrease and wavelength shift of generated light may occur. Particularly, when the light-emitting device is a red light-emitting diode, the degree of wavelength shift and the degree of light reduction are significant.

However, the light source module 100-2 includes the heat dissipating member 110 on the lower surface of the flexible printed circuit board 10 to effectively discharge heat generated from the light emitting device 20 to the outside, thereby suppressing the temperature rise of the light emitting device It is possible to prevent the light intensity of the light source module 100-2 from decreasing or the wavelength shift of the light source module 100-2 from being generated.

Fig. 4 shows a third embodiment 100-3 of the light source module shown in Fig. The same reference numerals as those in FIG. 3 denote the same components, and the description overlapping with the contents described above will be omitted or briefly explained.

Referring to FIG. 4, the light source module 100-3 may have a structure in which a reflection sheet 30, a reflection pattern 31, and a first optical sheet 52 are added to the second embodiment.

The reflective sheet 30 is disposed between the flexible printed circuit board 10 and the resin layer 40 and may have a structure in which the light emitting device 20 is penetrated. For example, the reflective sheet 30 may be positioned on a remaining area of the flexible printed circuit board 10 on which the light emitting device 20 is located, except for one area.

The reflective sheet 30 may be made of a material having a high reflection efficiency. The reflective sheet 30 reflects light emitted from the light emitting element 20 to one surface (e.g., an upper surface) of the resin layer 40 and light leaks to the other surface (e.g., lower surface) of the resin layer 40 So that the optical loss can be reduced. The reflective sheet 30 may be formed in the form of a film and may include a synthetic resin dispersedly containing a white pigment in order to realize a characteristic of promoting reflection and dispersion of light.

Examples of the white pigment include titanium oxide, aluminum oxide, zinc oxide, lead carbonate, barium sulfate, calcium carbonate and the like. As the synthetic resin, polyethyleneterephthalate, polyethylene naphthalate, acrylic resin, colicarbonate, polystyrene, polyolefin , Cellulosic acid acetate, weather-resistant vinyl chloride, and the like can be used, but the present invention is not limited thereto.

The reflection pattern 31 is disposed on the surface of the reflection sheet 30 and can serve to scatter and disperse incident light. The reflective pattern 31 may be formed by printing a reflective ink containing any one of TiO2, CaCo3, BaSo4, Al2O3, Silicon, and Polystyrene on the surface of the reflective sheet 30, but the present invention is not limited thereto.

Further, the structure of the reflection pattern 31 may be a plurality of protruding patterns, and may be regular or irregular. The reflection pattern 31 may be a prism shape, a lenticular shape, a lens shape, or a combination thereof in order to increase the scattering effect of light, but is not limited thereto. 4, the cross-sectional shape of the reflection pattern 31 may be a polygonal shape such as a triangular shape or a quadrilateral shape, a semicircular shape, a sinusoidal shape, or the like. The shape of the reflection pattern 31 may be a polygonal shape Hexagonal), circular, elliptical, or semicircular.

Fig. 18 shows an embodiment of the reflection pattern shown in Fig. Referring to FIG. 18, the diameters of the reflection patterns 31 may be different from each other depending on the distance from the light emitting device 20.

For example, the reflection pattern 31 may be larger in diameter closer to the light emitting element 20. [ Specifically, the diameter may be larger in the order of the first reflection pattern 71, the second reflection pattern 72, the third reflection pattern 73, and the fourth reflection pattern 74. However, the embodiment is not limited thereto.

The first optical sheet 52 is disposed on the resin layer 40 and emits light emitted from one surface (for example, an upper surface) of the resin layer 40. The first optical sheet 52 can be formed using a material having excellent light transmittance, and for example, PET (Polyethylene Telephthalate) can be used.

2, the first air gap 80 is formed between the upper surface 71 of the optical plate 70 and the first optical sheet 52 As shown in Fig. The uniformity of the light supplied to the optical plate 70 can be increased due to the presence of the first air gap 80 and as a result the uniformity of the light diffused and emitted through the optical plate 70 can be improved Is as described above in the description of FIG.

Although the light reflecting member 90 is shown as being formed over the entire inner side surface of the side wall 73 of the optical plate 70 in the drawing, it is only one example, and if the light reflecting member 90 includes the side surface of the resin layer 40, The formation range of the reflective member 90 is not limited as described above in the description of FIG.

Fig. 5 shows a fourth embodiment 100-4 of the light source module shown in Fig.

5, the light source module 100-4 includes a second optical sheet 52, an adhesive layer 56, a light shielding pattern 60, and a second optical sheet 54 in the third embodiment 100-3 ) May be added.

The second optical sheet 54 is disposed on the first optical sheet 52. The second optical sheet 54 can be formed using a material having a high light transmittance. For example, PET can be used.

The adhesive layer 56 is disposed between the first optical sheet 52 and the second optical sheet 54 to attach the first optical sheet 52 and the second optical sheet 54.

The optical pattern 60 may be disposed on at least one of the upper surface of the first optical sheet 52 or the lower surface of the second optical sheet 54. [ The optical pattern 60 may be attached to at least one of the upper surface of the first optical sheet 52 or the lower surface of the second optical sheet 54 by the adhesive layer 56. [ Other embodiments may further include one or more optical sheets (not shown) on the second optical sheet 56. At this time, the structure including the first optical sheet 52, the second optical sheet 54, the adhesive layer 56, and the optical pattern 60 can be defined as the optical pattern layer 50-1.

The optical pattern 60 may be a light shielding pattern for preventing the light emitted from the light emitting element 20 from concentrating. The optical pattern 60 is aligned with the light emitting element 20 and can be bonded to the first optical sheet 52 and the second optical sheet 54 by the adhesive layer 56. [

The first optical sheet 52 and the second optical sheet 54 can be formed using a material having excellent light transmittance. For example, PET can be used.

The optical pattern 60 basically functions to prevent the light emitted from the light emitting element 20 from being concentrated. That is, the optical pattern 60 in addition to the above-described reflection pattern 31 can realize uniform surface light emission.

The optical pattern 60 may be a blocking pattern for shielding a part of the light emitted from the light emitting device 20 and may prevent the phenomenon that the light is excessively strong so that the optical characteristic is deteriorated or the yellow light is yellowish . For example, the optical pattern 60 can prevent light from concentrating on a region adjacent to the light emitting element 20 and can disperse light.

The optical pattern 60 can be formed by performing a printing process on the upper surface of the first optical sheet 52 or the lower surface of the second optical sheet 54 using light shielding ink. The optical pattern 60 is not a function to completely block the light, but can control the light shielding degree or the diffusing degree of the light by adjusting the density and / or the size of the optical pattern so as to perform a function of partial shielding and diffusion of light. For example, in order to improve the light efficiency, the optical pattern 60 may be adjusted so that the density of the optical pattern decreases as the distance from the light emitting device 20 increases. However, the present invention is not limited thereto.

Specifically, the optical pattern 60 can be implemented as a superimposed printing structure of a complex pattern. The structure of superimposed printing refers to a structure in which one pattern is formed and another pattern is printed on the pattern.

For example, the optical pattern 60 may include a diffusion pattern and a light shielding pattern, and may be a structure in which a diffusion pattern and a light shielding pattern are overlapped. For example, a diffusion pattern is formed on the lower surface of the polymer film (for example, the second optical sheet 54) in the light output direction using a light shielding ink containing at least one material selected from TiO2, CaCO3, BaSO4, Al2O3 and Silicon . And a light shielding pattern may be formed on the surface of the polymer film by using a light shielding ink containing Al or a mixed material of Al and TiO2.

That is, it is also possible to form a diffusion pattern on the surface of the polymer film by white printing, and then form a light-shielding pattern thereon or a double structure in the reverse order. Of course, it will be obvious that the formation design of such a pattern can be variously modified in consideration of light efficiency, intensity, and shading ratio.

Alternatively, in another embodiment, the optical pattern 60 may be a triple structure including a first diffusion pattern, a second diffusion pattern, and a light blocking pattern disposed therebetween. In such a triple structure, it is possible to select and implement the above-described materials. As an example, the first diffusion pattern may include TiO ₂ having a high refractive index, and the second diffusion pattern may include CaCO ₃ And TiO ₂ , and the light-shielding pattern may include Al with excellent shielding. Through this triple optical pattern, the embodiments can ensure the efficiency and uniformity of light. In particular, CaCO ₃ functions to realize white light finally through the function of subtracting exposure of yellow light, thus realizing more stable efficiency light. In addition to CaCO ₃ , diffusing materials used for diffusion pattern include BaSO ₄ , Al ₂ Inorganic materials having a large particle size and similar structure, such as O ₃ , Silicon, etc., can be utilized.

The adhesive layer 56 can surround the periphery of the optical pattern 60 and fix the optical pattern 60 to at least one of the first optical sheet 52 and the second optical sheet 54. [ As the material used for the adhesive layer 56, a thermosetting PSA, a thermosetting adhesive, or a UV cured PSA type material may be used, but the present invention is not limited thereto.

On the other hand, when the second optical sheet 54 is formed on the first optical sheet 52, the first air gap 80 described in the description of FIG. 2 is formed on the upper surface of the optical plate 70 71 and the first optical sheet 52, as shown in Fig. At this time, the thickness of the first air gap 80 and the function thereof are the same as those described in the description of FIG. 2, and are omitted.

Further, the range of formation of the light reflection member 90 is not limited as long as it includes the side surface of the resin layer 40 as described in the description of FIG.

Fig. 6 shows a fifth embodiment 100-5 of the light source module shown in Fig.

Referring to FIG. 6, the light source module 100-5 may have a structure in which a second air gap 81 is added to the fourth embodiment 100-4. That is, the fifth embodiment 100-5 may include a second air gap 81 between the first optical sheet 52 and the second optical sheet 54.

For example, a second air gap 81 may be formed in the adhesive layer 56. The adhesive layer 56 is formed by forming a space (second air gap 81) spaced around the optical pattern 60 and applying an adhesive material to the other portions to form the first optical sheet 52 and the second optical sheet 54 may be adhered to each other.

The adhesive layer 56 may have a structure in which the second air gap 81 is located at the periphery of the optical pattern 60. [ Or the structure in which the adhesive layer 56 surrounds the periphery of the optical pattern 60 and the second air gap 81 is located at a portion other than the periphery. The adhesive structure of the first optical sheet 52 and the second optical sheet 54 can be realized in addition to the function of fixing the printed optical pattern 60. [ The structure including the first optical sheet 52, the second optical sheet 54, the second air gap 81, the adhesive layer 56 and the optical pattern 60 is defined as the optical pattern layer 50-2. can do.

Since the second air gap 81 and the adhesive layer 56 have different indexes of refraction, the second air layer 81 diffuses the light traveling from the first optical sheet 52 toward the second optical sheet 56, Dispersion can be improved. Therefore, the embodiment can realize a uniform planar light source.

Fig. 7 shows a sixth embodiment 100-6 of the light source module shown in Fig. Referring to FIG. 7, the light source module 100-6 may have a structure in which via holes 212 and 214 are provided in the flexible printed circuit board 10 of the first embodiment to improve heat radiation.

The via holes 212 and 214 may penetrate the flexible printed circuit board 110 and may expose a portion of the light emitting device 20 or a portion of the resin layer 40. For example, the via holes 212 and 214 may include a first via hole 212 that exposes a portion of the light emitting device 20 and a second via hole 214 that exposes a portion of the bottom surface of the resin layer 40.

The heat generated from the light emitting device 20 as a heat source can be directly discharged to the outside through the first via hole 212 and the heat conducted from the light emitting device 20 to the resin layer 40 can be transferred to the second via hole 214). ≪ / RTI > Since the sixth embodiment discharges heat generated from the light emitting element 20 through the via holes 212 and 214 to the outside, the heat dissipation efficiency can be improved. The shapes of the first via hole 212 and the second via hole 214 may be various shapes such as polygonal, circular, and elliptical shapes.

Fig. 8 shows a seventh embodiment 100-7 of the light source module shown in Fig. 9, the light source module 100-7 may be a structure in which the reflection sheet 30, the reflection pattern 31, and the first optical sheet 52 are added to the sixth embodiment. In the seventh embodiment (100-7), the heat radiation efficiency can be improved by the first and second via holes (212, 214). The description of the configurations 30, 31, and 52 added in this embodiment is the same as that described above in Fig. 4, and is omitted.

Fig. 9 shows an eighth embodiment (100-8) of the light source module shown in Fig. 9, the light source module 100-8 includes a structure in which a second optical sheet 52, an adhesive layer 56, a light shielding pattern 60, and a second optical sheet 54 are added to the seventh embodiment Lt; / RTI > The configurations (52, 54, 56, 60) added in this embodiment are the same as those described above in Fig. 5, and are omitted.

Fig. 10 shows a ninth embodiment (100-9) of the light source module shown in Fig. 10, the light source module 100-9 includes the second optical sheet 52, the adhesive layer 56, the light shielding pattern 60, the second optical sheet 54, and the second air A gap 81 may be added. A second air gap 81 may be present between the first optical sheet 52 and the second optical sheet 54 of the tenth embodiment (100-10), and the second air gap 81 may be provided between the first optical sheet 52 and the second optical sheet 54, May be the same as described.

Fig. 11 shows a tenth embodiment (100-10) of the light source module shown in Fig. The same reference numerals as those in FIG. 1 denote the same components, and duplicate contents of the foregoing description will be omitted or briefly explained.

11, the heat dissipation member 310 of the light source module 100-10 is disposed on the lower surface of the flexible printed circuit board 10, unlike the heat dissipation member 110 of the second embodiment 100-2 The lower heat dissipation layer 310-1 and the lower heat dissipation layer 310-1 may have a penetration portion 310-1 through which the flexible printed circuit board 10 is in contact with the light emitting element 20 .

For example, the penetrating portion 310-1 can contact the first side portions 714 of the first lead frames 620 and 620 'of the light emitting device packages 200-1 and 200-2 to be described later.

According to the tenth embodiment, since the heat generated from the light emitting element 20 by the penetrating portion 310-1 is directly transmitted to the heat dissipating member 310 and is radiated to the outside, the heat dissipating efficiency can be improved.

12 shows an eleventh embodiment (100-11) of the light source module shown in Fig. 12, the light source module 100-11 may be a structure in which the reflective sheet 30, the reflective pattern 31, and the first optical sheet 52 are added to the tenth embodiment, 31, and 52 may be the same as those described in FIG.

13 shows a twelfth embodiment (100-12) of the light source module shown in Fig. 13, the light source module 100-12 includes the second optical sheet 52, the adhesive layer 56, the light shielding pattern 60, and the second optical sheet 54 ) May be added. The added configurations 52, 54, 56, and 60 may be the same as those described in FIG.

Fig. 14 shows a thirteenth embodiment (100-13) of the light source module shown in Fig. Referring to FIG. 14, the light source module 100-13 may have a structure in which a second air gap 81 is added to the twelfth embodiment (100-12). The second air gap 81 may exist between the first optical sheet 52 and the second optical sheet 54 of the thirteenth embodiment 100-13 and the second air gap 81 may exist between the first optical sheet 52 and the second optical sheet 54, May be the same as those described above.

FIG. 15 shows a fourteenth embodiment of the light source module shown in FIG. 1, FIG. 16 shows a fifteenth embodiment of the light source module shown in FIG. 1, FIG. 17 shows a sixteenth embodiment of the light source module shown in FIG. For example.

The reflective sheet 30-1, the second optical sheet 54-1, and the diffuser plate 70-1 shown in Figs. 15 to 17 are the same as the reflective sheet 30-1 shown in Figs. 6, 10, and 14 30, the second optical sheet 54, and the optical plate 70 as shown in Fig.

Irregularities R1, R2, and R3 may be formed on one or both surfaces of at least one of the reflective sheet 30-1, the second optical sheet 54-1, and the diffuser plate 70-1. The irregularities R1, R2, and R3 serve to reflect and diffuse the incident light, thereby forming a geometric pattern of light emitted to the outside.

For example, first irregularities R1 may be formed on one surface (e.g., an upper surface) of the reflective sheet 30-1, and a second irregularity R2 may be formed on one surface of the second optical sheet 54-1 And third irregularities R3 may be formed on one surface (e.g., a lower surface) of the optical plate 70. These irregularities R1, R2, and R3 may have a regular or irregular plurality of patterns. And may be a prism shape, a lenticular shape, a concave lens shape, a convex lens shape, or a combination thereof in order to enhance the reflection and diffusion effect of light, but the present invention is not limited thereto.

In addition, the cross-sectional shapes of the protrusions and recesses R1, R2, and R3 may have various shapes such as a triangle, a quadrangle, a semi-circle, and a sine wave. The size or density of each pattern can be changed according to the distance from the light emitting device 20.

The irregularities R1, R2, and R3 can be formed by directly processing the reflective sheet 54-1, the second optical sheet 54-1, and the optical plate 70, but there is no limitation thereto, A method of attaching a film, or the like, can be formed in all the ways that are currently developed and commercialized or can be implemented according to future technology development.

The embodiment can easily realize a geometric light pattern through the combination of the patterns of the first to third irregularities (R1, R2, R3). In another embodiment, concaves and convexes may be formed on one surface or both surfaces of the second optical sheet 52.

However, the embodiment in which the protrusions (R1, R2, or R3) are formed is not limited to the embodiment shown in Figs. 15 to 17, and the reflective sheet 54, the first optical sheet 52, Irregularities for increasing the reflection and diffusion effect of light may be formed on one or both surfaces of at least one of the sheet 54 and the optical plate 70. [

FIG. 19 is a plan view of a seventeenth embodiment 100-17 of the light source module shown in FIG. 1, FIG. 20 is a cross-sectional view in the AA 'direction of the light source module 100-17 shown in FIG. 19, 21 is a sectional view in the BB 'direction of the light source module 100-17 shown in FIG. 19, and FIG. 22 is a sectional view in the CC' direction of the light source module 100-17 shown in FIG.

19 to 22, the light source module 100-17 includes a plurality of sub-light source modules 101-1 through 101-n, where n is a natural number of 1, The sub-light source modules 101-1 to 101-n can be separated or combined with each other. The plurality of sub light source modules 101-1 to 101-n may be electrically connected to each other. At this time, the optical plate 70 and the light reflecting member 90 are formed by joining the sub light source modules 101-1 to 101-n to each other after the light reflecting member 90 is mounted on the side wall 73 formed on the inner side of the optical plate 70.

Each of the sub-light source modules 101-1 to 101-n includes at least one connector (e.g., 510, 520, 530) that can be connected to the outside. For example, the first sub-light source module 101-1 may include a first connector 510 including at least one terminal (e.g., S1, S2). The second sub light source module 101-2 includes a first connector 520 and a second connector 530 for respectively connecting to the outside and the first connector 520 includes at least one terminal P1, P2), and the second connector 530 may include at least one terminal (e.g., Q1, Q2). At this time, the first terminals S1, P1 and Q1 may be positive terminals and the second terminals S2, P2 and Q2 may be negative terminals. Although FIG. 21 illustrates that each connector (e.g., 510, 520, 530) includes two terminals, the number of terminals is not limited thereto.

20 to 22 show a structure in which connectors 510, 520, or 530 are added to the fifth embodiment 100-5. However, the present invention is not limited thereto, and the sub light source modules 101-1 to 101- n each include a connector (e.g., 510, 520, or 530) and a connection fixture (e.g., 410-1, 420-1) to the light source modules 100-1 through 100-20 according to any of the above- , 410-2) may be added.

20 and 21, each of the sub light source modules 101-1 to 101-n includes a flexible printed circuit board 10, a light emitting element 20, a reflection sheet 30, a reflection pattern 31, The first optical sheet 52, the second optical sheet 54, the adhesive layer 56, the optical pattern 60, the heat radiation member 110, the at least one connector 510, 520, Or 530), and at least one connection fixture (410, 420). The same reference numerals as those in FIG. 1 denote the same components, and duplicate contents of the foregoing description will be omitted or briefly explained. In comparison with other embodiments, each of the sub-light source modules 101-1 to 101-n of the seventeenth embodiment may have a different size or a different number of light emitting elements, Can be the same.

The first sub light source module 101-1 may include a first connector 510 electrically connected to the light emitting device 20 and provided on the flexible printed circuit board 10 for electrical connection with the outside . For example, the first connector 510 may be embodied in a patterned form on the flexible printed circuit board 10.

The second sub light source module 101-2 may include a first connector 520 and a second connector 530 that are electrically connected to the light emitting device 20. The first connector 520 is provided on one side of the flexible printed circuit board 10 to be electrically connected to the outside (for example, the first connector 510 of the first sub light source module 101-1) 2 connector 530 may be provided on the other side of the flexible printed circuit board 10 to electrically connect to another external (e.g., a connector (not shown) of the third sub-light source module 101-3).

The connection fixing portions (e.g., 410-1, 420-1, and 410-2) couple with other sub-light source modules in the outside and fix the two sub-light source modules coupled to each other. The connection fixing portions 410-1, 420-1, and 410-2 may be protruding portions of a side surface of the resin layer 40 or protruding portions of the resin layer 40, Can be.

22, the first sub light source module 101-1 may include a first connection fixing part 410-1 having a structure in which a part of the side surface of the resin layer 40 is protruded. The second sub light source module 101-2 includes a first connection fixing part 420-1 having a structure in which a part of a side surface of the resin layer 40 is embedded and a second connection fixing part 420-1 having a structure in which another part of the side surface of the resin layer 40 is protruded And a second connection fixing portion 410-2.

The first connection fixing portion 410-1 of the first sub light source module 101-1 and the first connection fixing portion 420-1 of the second sub light source module 101-2 are fixed to each other by male and female .

Although embodiments have shown that the connection fixture (e.g., 410-1, 420-1, 410-2) is implemented as part of the resin layer 40, it is not limited thereto, And the connecting fixture can be transformed into another connectable form.

The shape of the sub light source modules (101-1 to 101-n, n> 1) may be a shape in which a certain portion is protruded, but the present invention is not limited thereto and can be implemented in various forms. For example, the shape of the sub-light source modules 101-1 to 101-n, n> 1 as viewed from above may be circular, elliptical, polygonal, or a part thereof projecting laterally.

For example, one end of the first sub-light source module 101-1 may include a protrusion 540 at the center, and the first connector 510 may be provided on the flexible printed circuit board 10 corresponding to the protrusion 540 The first connection fixing part 410-1 may be provided on the resin layer 40 of the remaining part of the first sub light source module 101-1 other than the protrusion part 540. [

One end of the second sub light source module 101-2 may have a groove portion 545 at the center and the first connector 520 may be provided on the flexible printed circuit board 10 corresponding to the groove portion 545, The first connection fixing part 420-1 may be provided on the resin layer 40 of the remaining part of the other end of the second sub light source module 101-2 other than the first connection part 545. The other end of the second sub light source module 101-2 includes a protrusion 560 at the center and the second connector 530 may be provided on the flexible printed circuit board 10 corresponding to the protrusion 560, The second connection fixing part 410-2 may be provided on the resin layer 40 of the remaining part of the other end of the second sub light source module 101-2 other than the protrusion part 560. [

Each of the sub-light source modules 101-1 to 101-n may be an independent light source itself, may be modified in various ways, and two or more sub-light source modules may be assembled together The embodiment can improve the degree of freedom of product design. Also, in the embodiment, when some of the assembled sub-light source modules are damaged or broken, only the damaged sub-light source module can be used.

The above-described light source module can be used in a display device, a pointing device, and a lighting system in which a surface light source is required. The light source module according to the embodiment may be easily installed even in a place where illumination is required but a place where the lighting is to be installed is not easily installed (for example, a ceiling or a floor having a curvature) There is an advantage. For example, the lighting system may include a lamp, or a streetlight, which may be, but is not limited to, a vehicle headlamp.

Fig. 23 shows a headlamp 900-1 for a vehicle according to the embodiment, and Fig. 45 shows a general headlamp for a vehicle, which is a point light source. Referring to FIG. 23, the vehicle headlamp 900-1 includes a light source module 910 and a light housing 920.

The light source module 910 may be the embodiments 100-1 to 100-17 described above. The light housing 920 accommodates the light source module 910 and may be made of a light transmitting material. The vehicle light housing 920 may include bends depending on the vehicle location and the design being mounted. Meanwhile, as described above, the diffusion plate itself can serve as the light housing 920 for a vehicle, and a separate light housing 920 for a vehicle other than the diffusion plate can be provided as described above. Since the light source module 910 uses the flexible printed circuit board 10 and the resin layer 40, the light source module 910 can be easily mounted to the vehicle housing 920 having a bend since it has flexibility. In addition, since the light source modules 100-1 to 100-21 have a structure that improves heat dissipation efficiency, the vehicle headlamp 900-1 according to the embodiment can prevent wavelength shift and decrease in brightness. Further, as described above, another light reflecting member is formed on the side of the resin layer, so that there is an effect that the light loss can be reduced and the luminance improvement to the same power can be realized.

45 is a point light source, a spot (spot) 930 may appear on the light emitting surface during light emission. However, since the vehicle headlamp 900-1 according to the embodiment is a planar light source Uniformity of luminance and illumination can be realized over the whole light-emitting surface without generating spots.

Fig. 24 is a perspective view of a light emitting device package 200-1 according to the first embodiment, Fig. 25 is a top view of the light emitting device package 200-1 according to the first embodiment, Fig. FIG. 27 is a side view of a light emitting device package 200-1 according to the first embodiment. FIG. 27 is a front view of the light emitting device package 200-1 according to the embodiment.

The light emitting device package 200-1 shown in FIG. 24 may be a light emitting device package included in the light source modules 100-1 through 100-17 according to the above-described embodiments, but is not limited thereto.

24 to 27, a light emitting device package 200-1 includes a package body 610, a first lead frame 620, a second lead frame 630, a light emitting chip 640, a zener diode 645 ), And a wire 650-1.

The package body 610 may be formed of a substrate having good insulating or thermal conductivity, such as a silicon-based wafer level package, a silicon substrate, silicon carbide (SiC), aluminum nitride (AlN) Or may be a structure in which a plurality of substrates are stacked. However, the embodiment is not limited to the material, structure, and shape of the body.

For example, the length X1 of the package body 610 in the first direction (e.g., the X-axis direction) is 5.95 mm to 6.05 mm and the length Y1 of the package body 610 in the second direction Lt; / RTI > The length Y2 of the package body 610 in the third direction (e.g., the Z-axis direction) may be 1.6 mm to 1.7 mm. For example, the first direction may be a direction parallel to the long side of the package body 610.

The package body 610 may have a cavity 601 with an open top and a side wall 602 and a bottom 603. The cavity 601 may be formed in a cup shape, a concave container shape, or the like, and the side wall 602 of the cavity 601 may be perpendicular or inclined to the bottom 603. The shape of the cavity 601 viewed from above may be circular, elliptical, polygonal (e.g., rectangular). The corner portion of the cavity 601, which is a polygon, may be curved. For example, the length X3 of the cavity 601 in the first direction (e.g., the X-axis direction) is 4.15 mm to 4.25 mm and the length X4 of the cavity 601 is 0.64 mm to 0.9 mm, and the depth of the cavity 601 (e.g., the length in the Z-axis direction, Y3) may be 0.33 mm to 0.53 mm.

The first lead frame 620 and the second lead frame 630 may be disposed on the surface of the package body 610 so as to be electrically separated from each other in consideration of heat dissipation or mounting of the light emitting chip 640. [ The light emitting chip 640 is electrically connected to the first lead frame 620 and the second lead frame 630. The number of the light emitting chips 640 may be one or more.

A reflective member (not shown) may be provided on the cavity side wall of the package body 610 to reflect the light emitted from the light emitting chip 640 in a predetermined direction.

The first lead frame 620 and the second lead frame 630 may be spaced apart from each other within the upper surface of the package body 610. A part of the package body 610 (for example, the bottom 603 of the cavity 601) is positioned between the first lead frame 620 and the second lead frame 630 so as to electrically disconnect them.

The first lead frame 620 may include one end (e.g., 712) exposed to the cavity 601 and the other end (e.g., 714) that is exposed through one side of the package body 610 through the package body 610 have. The second lead frame 630 has one end (for example, 744-1) exposed at one side of one side of the package body 610 and the other end (for example, 744-1) exposed at the other side of one side of the package body 610, 2), and an intermediate portion (e.g., 742-2) exposed to the cavity 601. [

The distance X2 between the first lead frame 620 and the second lead frame 630 may be 0.1 mm to 0.2 mm. The upper surface of the first lead frame 620 and the upper surface of the second lead frame 630 may be located on the same plane as the bottom 603 of the cavity 601.

Fig. 28 is a perspective view of the first lead frame 620 and the second lead frame 630 shown in Fig. 24, Fig. 29 is a perspective view showing the first lead frame 620 and the second lead frame 630 shown in Fig. Fig. 30 is a view for explaining the dimension of the portion of the first lead frame 620 adjacent to the boundary portion 801 between the first top surface portion 712 and the first side surface portion 714 shown in Fig. 29, Portions 732, 734, 736 of FIG.

28 to 30, the first lead frame 620 includes a first top surface portion 712 and a first side surface portion 714 that is bent from the first side portion of the first top surface portion 712.

The first upper surface portion 712 is located on the same plane as the bottom of the cavity 601 and is exposed by the cavity 601 and the light emitting chips 642 and 644 can be disposed.

29, both ends of the first upper surface portion 712 may have a portion S3 protruding in the first direction (x-axis direction) with respect to the first side surface portion 714. [ The protruding portion S3 of the first upper surface portion 712 may be a portion that supports the first lead frame in the lead frame array. The length of the protruding portion S3 of the first upper surface portion 712 in the first direction may be 0.4 mm to 0.5 mm. The length K of the first upper surface portion 712 in the first direction may be 3.45 mm to 3.55 mm and the length J1 of the first upper surface portion 712 may be 0.6 mm to 0.7 mm. The first direction may be the x-axis direction in the xyz coordinate system, and the second direction may be the y-axis direction.

The second side of the first upper surface portion 712 may have at least one groove portion 701. At this time, the second side of the first upper surface portion 712 may face the first side of the first upper surface portion 712. For example, the second side portion of the first upper surface portion 712 may have one groove portion 701 in the middle, but the present invention is not limited thereto, and the number of the groove portions formed in the second side portion may be two or more. The groove 701 may have a shape corresponding to the protrusion 702 provided in the second lead frame 630 described later.

The groove portion 701 shown in FIG. 29 may be formed in various shapes such as a trapezoidal shape, but not limited thereto, and circular, polygonal, and elliptical shapes. The length S2 of the groove portion 701 in the first direction may be 1.15 mm to 1.25 mm and the length S1 of the groove portion 701 in the second direction may be 0.4 mm to 0.5 mm.

The angle? 1 formed by the bottom 701-1 and the side surface 701-2 of the groove portion 701 may be greater than or equal to 90 占 and less than 180 占. The light emitting chips 642 and 644 may be disposed on the first top surface portion 712 on both sides of the groove portion 701.

The first side portion 714 may be bent at an angle downward from the first side of the first top surface portion 712 and the first side portion 714 may be exposed from one side of the package body 610 . For example, the angle formed by the first upper surface portion 712 and the first side surface portion 714 may be greater than or equal to 90 degrees and less than 180 degrees.

The first lead frame 620 may have at least one through hole 720 in at least one of the first top surface portion 712 and the first side surface portion 714. For example, the first lead frame 620 may have one or more through holes 720 adjacent to the boundary portion between the first top surface portion 712 and the first side surface portion 714. 26 shows two through holes 722 and 724 spaced from each other adjacent to a boundary portion between the first top surface portion 712 and the first side surface portion 714, but the embodiment is not limited thereto.

The at least one through hole 720 may be formed in one area of each of the first top surface portion 712 and the first side surface portion 714 adjacent to the boundary portion between the first top surface portion 712 and the first side surface portion 714 have. The through holes (for example, 722-1) formed in one region of the first top surface portion 712 and the through holes (for example, 722-2) formed in one region of the first side surface portion 714 may be connected to each other .

A portion of the package body 610 is filled in the through hole 720 to improve the degree of coupling between the first lead frame 620 and the package body. The through hole 720 also serves to easily form a bend between the first upper surface portion 712 and the first side surface portion 714. However, when the size of the through hole 720 is too large or the number of the through holes 720 is too large, the first top surface portion 712 and the first side surface portion 714 may be broken when the first lead frame 620 is bent The size and number of the through holes 720 should be appropriately adjusted. Also, the size of the through hole 720 is related to the size of the connecting portions 732, 734, and 736, which will be described later, and thus also relates to the heat dissipation of the light emitting device package.

Embodiments according to sizes of the first lead frame 620 and the second lead frame 630 having the through-holes described below can achieve optimal heat radiation efficiency considering the degree of coupling and the ease of bending.

In order to improve the degree of coupling with the package body 610 and to facilitate bending of the first lead frame 620 and to prevent damage during bending, the embodiment includes a first through hole 722 and a second through hole 724 And the length D11 of the first through hole 722 in the first direction and the length D12 of the second through hole 724 in the first direction may be 0.58 mm to 0.68 mm, And the length D2 in the second direction may be 0.19 mm to 0.29 mm. The area of the first through-hole 722 may be the same as the area of the second through-hole 724, but the present invention is not limited thereto and they may be different from each other.

30, the first lead frame 620 is located adjacent to the boundary portion 801 between the first top surface portion 712 and the first side surface portion 714 and is spaced apart from each other by the through hole 720, And may have connecting portions 732, 734, 736 connecting the first top surface portion 712 and the first side surface portion 714 to each other. For example, the connecting portions 732, 734, and 736 may each include a first portion 732-1, 734-1, or 736-1 corresponding to a portion of the first top surface portion 712, And a second portion 732-2, 734-2, or 736-2 corresponding to the portion. A through hole 720 may be located between each of the connection portions 732, 734, 736.

The first leadframe 620 may have at least one connection portion located corresponding or aligned with the light emitting chip 642,

Specifically, the first lead frame 620 may include first through third connection portions 732, 734, 736. The first connection portion 732 may be located corresponding to or aligned with the first light emitting chip 642 and the second connection portion 734 may be located corresponding to or aligned with the second light emitting chip 644. [ have. And the third connecting portion 736 may be located between the first connecting portion 732 and the second connecting portion 734 and may be disposed between the first light emitting chip 642 and the second light emitting chip 644 Lt; / RTI > For example, the third connection portion 736 may be positioned correspondingly or in alignment with the groove portion 701 of the first lead frame 620, but is not limited thereto.

The length C11 of the first connecting portion 732 in the first direction and the length C2 of the second connecting portion 734 in the first direction are equal to the length E of the third connecting portion 736 in the first direction, . For example, the length C11 of the first connecting portion 732 in the first direction and the length C2 of the second connecting portion 734 in the first direction may be 0.45 mm to 0.55 mm, and the length of the third connecting portion 736 may be 0.3 mm to 0.4 mm in the first direction. The reason for positioning the third connection portion 736 between the first through hole 722 and the second through hole 724 is to prevent breakage between the first top surface portion 712 and the first side surface portion 714 at the time of bending It is for this reason.

The ratio of the length E of the third connecting portion 736 in the first direction to the length C11 of the first connecting portion 732 in the first direction may be 1: 1.2-1.8. The ratio of the length D11 or D12 in the first direction of the through hole 722 to the length B1 in the first direction of the upper end 714-1 of the first side portion 714 may be 1:

Since the first connecting portion 732 is aligned with the first light emitting chip 642 and the second connecting portion 734 is aligned with the second light emitting chip 644, heat generated from the first light emitting chip 642 The heat generated from the second light emitting chip 644 can be mainly emitted to the outside through the second connecting portion 734. [

Since the lengths C11 and C2 in the first direction of each of the first connecting portion 732 and the second connecting portion 734 are larger than the length E of the third connecting portion 736 in the first direction The first connecting portion 732 and the second connecting portion 734 are larger than the area of the third connecting portion 736. [ Accordingly, by enlarging the area of the connection portions 732 and 734 disposed adjacent to the light emitting device 20, the efficiency of emitting heat generated from the first light emitting chip 642 and the second light emitting chip 644 to the outside Can be improved.

The first side portion 714 may be divided into an upper end portion 714-1 connected to the first upper surface portion 712 and a lower end portion 714-2 connected to the upper end portion 714-1. That is, the upper end portion 714-1 may include a portion of the first to third connection portions 732, 734, 736, and the lower end portion 714-2 may be located below the upper end portion 714-1.

The length F1 of the upper end 714-1 in the third direction may be 0.6 mm to 0.7 mm and the length F2 of the lower end 714-2 in the third direction may be 0.4 mm to 0.5 mm. The third direction may be the z-axis direction in the xyz coordinate system.

The side surfaces of the upper end portion 714-1 and the side surfaces of the lower end portion 714-2 may have a stepped portion in order to improve the degree of coupling with the package body 620 and airtightness to prevent moisture permeation. For example, both side ends of the lower end portion 714-2 may be protruded laterally with respect to the side surface of the upper end portion 714-1. The length B1 of the upper end 714-1 in the first direction may be 2.56 mm to 2.66 mm and the length B2 of the lower end 714-2 in the first direction may be 2.7 mm to 3.7 mm. The thickness t1 of the first lead frame 620 may be 0.1 mm to 0.2 mm.

The second lead frame 630 may be arranged to surround at least one side of the first lead frame 620. For example, the second lead frame 630 may be disposed around the other sides of the first lead frame 630 except for the first side portion 714.

The second lead frame 630 may include a second top surface portion 742 and a second side surface portion 744. The second upper surface portion 742 may be disposed so as to surround the periphery of the other side portions except for the first side portion of the first upper surface portion 712. 24 and 28, the second upper surface portion 742 is located on the same plane as the bottom surface of the cavity 601 and the first upper surface portion 712, and can be exposed by the cavity 601. [ The thickness t2 of the second lead frame 630 may be 0.1 mm to 0.2 mm.

The second upper surface portion 742 includes a first portion 742-1, a second portion 742-2, and a third portion 742-3, depending on the position surrounding the periphery of the first upper surface portion 712. [ . The second portion 742-2 of the second upper surface portion 742 may be a portion corresponding to or facing the second side of the first upper surface portion 712. [ The first portion 742-1 of the second upper surface portion 742 is connected to one end of the second portion 742-2 and corresponds to one of the remaining sides of the first upper surface portion 712, . The third portion 742-3 of the second upper surface portion 742 is connected to the other end of the second portion 742-2 and is connected to the other of the remaining sides of the first upper surface portion 712, can see.

The length H1 of the first portion 742-1 and the third portion 742-3 in the second direction may be 0.65 mm to 0.75 mm and the length H2 in the first direction may be 0.78 mm to 0.88 mm Lt; / RTI > The length I of the second portion 742-2 in the first direction may be 4.8 mm to 4.9 mm.

The second portion 742-2 of the second upper surface portion 742 may have a protrusion 702 corresponding to the groove portion 701 of the first upper surface portion 712. For example, the shape of the protrusion 702 may match the shape of the groove 701, and the protrusion 702 may be positioned to align with the groove 701. The projecting portion 702 can be located in the groove portion 701. The number of the protrusions 702 may be the same as the number of the grooves 701. The projecting portion 702 and the groove portion 701 are spaced apart from each other, and a portion of the package body 610 may be positioned therebetween. The protruding portion 702 is an area for wire bonding with the first light emitting chip 642 and the second light emitting chip 644 and is arranged in alignment between the first light emitting chip 642 and the second light emitting chip 644 Wire bonding can be facilitated.

The length S5 of the protrusion 702 in the first direction may be 0.85 mm to 0.95 mm and the length S4 of the second direction may be 0.3 mm to 0.4 mm and the protrusion 702 may be the second portion 2 may be greater than or equal to 90 ° and less than 180 °.

The second side surface portion 744 may be bent from at least one side of the second upper surface portion 742. [ The second side surface portion 744 may be bent downward at a predetermined angle (e.g., 90 占 from the second upper surface portion 742).

For example, the second side portion 744 may include a first portion 744-1 that is bent at one side of the first portion 742-1 of the second upper surface portion 742 and a third portion 744-1 that is bent at the other side of the third portion 742-1 of the second upper surface portion 742. [ And a second portion 744-2 that is bent at one side of portion 742-3.

The first portion 744-1 and the second portion 744-2 of the second side portion 744 may be bent to be located on the same side in the second lead frame 630. [ The first portion 744-1 of the second side portion 744 may be spaced from the first side portion 714 and may be located on one side (e.g., the left side) of the first side portion 714. [ The second portion 744-2 of the second side portion 744 may be spaced from the first side portion 714 and may be located on the other side (e.g., the right side) of the first side portion 714. [ The first side portion 714 and the second side portion 744 may be located on the same plane. As shown in FIG. 24, the first side portion 714 and the second side portion 744 may be exposed to the same side of the package body 610. The length A of the second side portion 744 in the first direction may be 0.4 mm to 0.5 mm and the length G in the third direction may be 1.05 mm to 1.15 mm.

One side of the first portion 742-1 and the third portion 742-3 of the second upper surface portion 742 may have a bent step g1. For example, the bent step g1 may be formed at a portion where one side of the first portion 742-1 of the second upper surface portion 742 and one side of the first portion 744-1 of the second side portion 744 meet As shown in FIG. Since the area of the first top surface portion 712 and the first side surface portion 714 corresponding to the bent step g1 can be designed to be wide, the heat generating area of the embodiment can be increased to improve the heat generating efficiency . This is because the area of the first lead frame 620 is related to the heat emission of the light emitting chips 642 and 644.

The other portions of the first portion 742-1 and the third portion 742-3 of the second upper surface portion 742 may have a bent step g2. The reason for forming the bent step g2 is to facilitate visual observation of the bonding material (e.g., solder) when bonding the light emitting device package 200-1 to the flexible printed circuit board 10 to be.

The first side portion 714 of the first lead frame 620 and the second side portion 744 of the second lead frame 630 are connected to the flexible printed circuit of the light source modules 100-1 to 100-21 according to the embodiment. So that the light emitting chip 640 can irradiate light in the direction 3 toward the side of the resin layer 40. [ That is, the light emitting device package 200-1 may have a side view type structure.

The Zener diode 645 may be disposed on the second lead frame 630 to improve the withstand voltage of the light emitting device package 200-1. For example, the Zener diode 645 may be disposed on the second upper surface portion 742 of the second lead frame 630. [

The first light emitting chip 642 can be electrically connected to the second lead frame 630 by the first wire 652 and the second light emitting chip 644 can be electrically connected to the second wire 654 by the second lead 654, And the Zener diode 645 may be electrically connected to the first lead frame 620 by the third wire 656. The Zener diode 645 may be electrically connected to the frame 630 and the Zener diode 645 may be electrically connected to the first lead frame 620 by the third wire 656. [

For example, one end of the first wire 652 may be connected to the first light emitting chip 642, and the other end may be connected to the protrusion 702. One end of the second wire 654 may be connected to the second light emitting chip 644 and the other end may be connected to the protrusion 702.

The light emitting device package 200-1 may further include a resin layer (not shown) filled in the cavity 601 to surround the light emitting chip. The resin layer may be made of a colorless transparent polymer resin material such as epoxy or silicone.

The light emitting device package 200-1 can emit red light using only a red light emitting chip without using a phosphor, but the embodiment is not limited thereto. The resin layer may include a phosphor to change the wavelength of the light emitted from the light emitting chip 640. For example, even if a light emitting chip of a different color than red is used, a light emitting device package that emits light of a desired color by changing the wavelength of light by using a phosphor can be realized.

31 shows a first lead frame 620-1 and a second lead frame 630 according to another embodiment. The same reference numerals as those in Fig. 28 denote the same components, and duplicate contents thereof will be omitted or briefly explained.

Referring to FIG. 31, the first lead frame 620-1 has a structure in which the third connection portion 736 is removed from the first lead frame 620 shown in FIG. That is, the first lead frame 620-1 may have one through hole 720-1 adjacent to the boundary portion between the first top surface portion 712 and the first side surface portion 714 '. The first connection portion 732 may be located at one side of the through hole 720-1 and the second connection portion 734 may be located at the other side of the through hole 720-1.

32 shows a first lead frame 620-2 and a second lead frame 630-1 according to another embodiment. The same reference numerals as those in Fig. 28 denote the same components, and duplicate contents thereof will be omitted or briefly explained.

32, the first top surface portion 712 'of the first lead frame 620-2 is connected to the groove portion 701 in the first top surface portion 712 of the first lead frame 620 shown in FIG. 32, May be omitted. The second portion 742-2 'of the second top surface portion 742' of the second lead frame 630-1 is electrically connected to the second top surface portion 742 of the second lead frame 630 shown in FIG. The protrusion 702 may be omitted from the second portion 742-2 of the first portion 742-2. The remaining components may be the same as those described in Fig.

33 shows a first lead frame 620-3 and a second lead frame 630 according to another embodiment. The same reference numerals as those in Fig. 28 denote the same components, and duplicate contents thereof will be omitted or briefly explained.

33, the first lead frame 620-3 is connected to at least one of the connecting portions 732, 734, 736 of the first lead frame 620 shown in FIG. 28 by a fine Holes h1, h2 and h3 may be formed.

At least one of the connecting portions 732-1, 734-1, and 736-1 of the first lead frame 620-3 may include a through hole (not shown) formed in a boundary portion between the first top surface portion 712 and the first side surface portion 714 h1, h2, h3). At this time, the diameter of the micro throughholes h1, h2 and h3 may be smaller than the lengths D11 and D12 in the first direction or the length D2 in the second direction of the through holes 722 and 724. The number of the micro through-holes h1 and h2 formed in the first connecting portion 732-1 and the second connecting portion 734-1 is the same as the number of the micro through holes h1 and h2 formed in the third connecting portion 736-1 h3), but the present invention is not limited thereto. The shape of the fine through holes (h1, h2, h3) may be circular, elliptical, polygonal, or the like. The micro through holes h1, h2 and h3 not only facilitate the bending of the first lead frame 620-3 but also improve the bonding force between the first lead frame 620-3 and the package body 610. [

34 shows a first lead frame 620-4 and a second lead frame 630 according to another embodiment. The same reference numerals as those in Fig. 28 denote the same components, and duplicate contents thereof will be omitted or briefly explained.

Referring to Fig. 34, the first lead frame 620-4 includes a first top surface portion 712 "and a first side surface portion 714 ". The first top surface portion 712 "and the first side surface portion 714 " are modifications of the first top surface portion 712 and the first side surface portion 714 shown in Fig. That is, the first lead frame 620-4 has the through holes 722 and 724 omitted from the first top surface portion 712 and the first side surface portion 714 of the first lead frame 620 shown in FIG. 26, A plurality of fine through holes h4 are provided in a region Q2 of the boundary portion Q between the first top surface portion 712 "and the first side surface portion 714" to be.

The boundary portion Q between the first top surface portion 712 "and the first side surface portion 714" is divided into a first boundary region Q1, a second boundary region Q2, and a third boundary region Q3 . The first boundary region Q1 may be an area corresponding to or aligned with the first light emitting chip 642 and the second boundary area Q2 may be an area corresponding to or aligned with the first light emitting chip 642. [ And the third border area Q3 may be a region between the first border area Q1 and the second border area Q2. For example, the first boundary region Q1 may correspond to the first connecting portion 732 shown in FIG. 28, and the second boundary region Q2 may correspond to the second connecting portion 734 shown in FIG. 28, As shown in FIG.

The first boundary region Q1 and the second boundary region Q2 serve as passages for transmitting heat generated from the first light emitting chip 642 and the second light emitting chip 644 and are provided with a plurality of micro through holes h4 Can facilitate bending between the first top surface portion 712 " and the first side surface portion 714 ". 32, the diameter of the plurality of through-holes h4 is the same and the spacing distance is the same, but the embodiment is not limited thereto. In another embodiment, at least one of the plurality of through-holes h4 has a different diameter Or the separation distance may be different.

35 shows a first lead frame 620 and a second lead frame 630-2 according to another embodiment. The second lead frame 630-2 in Fig. 35 may be a modification of the second lead frame 630 shown in Fig. The same reference numerals as those in Fig. 28 denote the same components, and duplicate contents thereof will be omitted or briefly explained.

35, the second portion 742-2 of the second upper surface portion 742 " shown in Fig. 35, unlike the second portion 742-2 of the second upper surface portion 742 shown in Fig. 28, 2 "has a broken structure and does not connect the first portion 742-1 and the third portion 742-3.

The second top surface portion 742 "of the second lead frame 630-2 includes a first portion 742-1, a second portion 742-2 ", and a third portion 742-3 . Each of the first to third portions 742-1, 742-2 ", and 742-3 is positioned around a corresponding one of the sides of the first top surface portion 712 of the first lead frame 620 .

The second portion 742-2 "of the second upper surface portion 742" is connected to the first portion 704 and the third portion 742-3, which are connected to the first portion 742-1, And a second region 705 spaced apart from the first region 704. Since the package body 610 is filled in the spaced space 706 between the first region 704 and the second region 705, the coupling force between the package body 610 and the second lead frame 630-2 Can be improved. The second lead frame 630-2 shown in FIG. 34 is divided into first sub frames 744-1, 742-1 and 704 and second sub frames 744-2, 742-3 and 705 And they can be electrically separated from each other.

36 shows a first lead frame 810 and a second lead frame 820 according to another embodiment.

36, the first lead frame 810 includes a first top surface portion 812 and a first side surface portion 814 and a second side surface portion 816 that are bent from the first side portions of the first top surface portion 812 . Light emitting chips 642 and 644 may be disposed on the first upper surface portion 812.

The second side of the first upper surface portion 812 may have at least one first trench 803, 804 and a first protrusion 805. Here, the second side of the first top surface portion 812 may be the opposite side of the first side of the first top surface portion 812. For example, the second side of the first top surface portion 812 may have one first protrusion 805 positioned between the two first grooves 803 and 804 and the first grooves 803 and 804, It is not. The first trenches 803 and 804 correspond to the second projections 813 and 814 provided in the second lead frame 820 to be described later and the first projections 805 are provided in the second lead frame 820 And may be a shape corresponding to the second trench 815. The first trenches 803 and 804 and the first protrusions 805 shown in FIG. 34 may be formed in various shapes such as a rectangular shape, but not limited thereto, and circular, polygonal, and elliptical shapes. The light emitting chips 642 and 644 may be disposed on the first upper surface portion 812 on both sides of the first trench portions 803 and 804. [

The first side surface portion 814 is connected to one region of the first side portion of the first top surface portion 712 and the second side surface portion 816 is connected to another region of the first side portion of the first top surface portion 712, The first side portion 814 and the second side portion 816 may be spaced apart from each other. The first side portion 814 and the second side portion 816 may be exposed from either the same side of the package body 610. [

The first lead frame 610 may have at least one through hole 820 in at least one of the first top surface portion 812 and the first side surface portion 814. For example, the first lead frame 810 may have one or more through holes 840 adjacent to a boundary portion between the first top surface portion 812 and the first side surface portion 814. The through hole 820 may have the same structure as described with reference to FIGS. 28 and 30, and the function thereof may be the same.

The first lead frame 810 is positioned adjacent to the boundary portion 801 between the first top surface portion 812 and the first side surface portion 814 and is spaced apart from each other by the through hole 720 and the first top surface portion 712 And connecting portions 852, 854, and 856 connecting the first side portion 714 and the first side portion 714 to each other. The structure and function of the connecting portions 852, 854 and 856 may be the same as those described in Figs. 28 and 30. The first lead frame 810 may have at least one connection portion located corresponding to or adjacent to the light emitting chip 642 or 644. [

The length of the connection portion (e.g., 852, 854) corresponding to or located adjacent to the light emitting chips 642, 644 in the first direction is greater than the length of the first portion of the connection portion (e.g., 856) that does not correspond to or is not adjacent to the light emitting chips 642, Direction. ≪ / RTI >

The lower side portion of the second side portion 814 may protrude laterally to improve the degree of coupling with the package body 620 and the airtightness for preventing moisture permeation.

The second lead frame 820 may be disposed around at least one side of the first lead frame 810. The second lead frame 820 may include a second top surface portion 822 and a third side surface portion 824. The second upper surface portion 822 may be divided into a first portion 832 and a second portion 834 depending on a position disposed around the first upper surface portion 812.

The second portion 834 of the second upper surface portion 822 may be a portion corresponding to or facing the second side of the first upper surface portion 812. The first portion 832 of the second upper surface portion 822 is connected to one end of the second portion 834 and may correspond to or face the third side of the first upper surface portion 712. The third side may be a side perpendicular to the first side or the second side.

The second portion 834 of the second upper surface portion 822 may have second projections 813 and 814 corresponding to the first trench portions 803 and 804 of the first upper surface portion 812. The second projections 813 and 814 are regions for wire bonding with the first light emitting chip 642 and the second light emitting chip 644 and are provided between the first light emitting chip 642 and the second light emitting chip 644 The wire bonding can be facilitated.

The third side surface portion 824 may be bent downward at a predetermined angle (e.g., 90 占 from the second upper surface portion 822). For example, the third side portion 824 may be bent at one side of the first portion 832 of the second upper surface portion 822. The second side surface portion 816 and the third side surface portion 824 may be symmetrical with respect to the first side surface portion 814. The lower side portion of the third side portion 824 may protrude in the lateral direction to improve the degree of coupling with the package body 620 and the airtightness to prevent moisture permeation. The first side portion 814, the second side portion 816 and the third side portion 824 may be exposed to the same side of the package body 610. [

37 is a perspective view of a light emitting device package 200-2 according to another embodiment, Fig. 38 is a top view of the light emitting device package 200-2 shown in Fig. 37, Fig. 37 is a cross-sectional view of the light emitting device package 200-2 shown in FIG. 37, and FIG. 41 is a cross-sectional view of the light emitting device package 200-2 shown in FIG. (620 ') and a second lead frame (630'). The same reference numerals as those in Figs. 24 to 28 denote the same constituent elements, and duplicate contents thereof will be omitted or briefly explained.

Referring to FIGS. 37 to 41, the first lead frame 620 'of the light emitting device package 200-2 may include a first top surface portion 932 and a first side surface portion 934. Unlike the first top surface portion 712 shown in Fig. 28, the first top surface portion 932 shown in Fig. 41 is not formed with a groove portion. The second upper surface portion 942 of the second lead frame 630 'may be similar to the structure in which the second portion 742-2 of the second upper surface portion 742 shown in FIG. 32 is omitted.

The first side surface portion 934 may have the same structure as the first side surface portion 714 shown in Fig. The length P1 in the first direction of the first top surface portion 932 may be smaller than the length of the first top surface portion 712 shown in Fig. 28, and the length of the first top surface portion 932 in the second direction J2 may be greater than the length J1 of the first top surface portion 712 in the second direction. For example, the length P1 of the first top surface portion 932 in the first direction may be 4.8 mm to 4.9 mm, and the length J2 of the first top surface portion 932 may be 0.67 mm to 0.77 mm. Therefore, since the area of the first top surface portion 932 shown in Fig. 37 is larger than the area of the first top surface portion 712 shown in Fig. 32, the embodiment of Fig. 37 can mount the light emitting chip of a larger size have. The sizes of the first side portions 944, the through holes 722 and 724, and the connecting portions may be the same as those described in Fig.

The second lead frame 630 'may include a second top surface portion 942 and a second side surface portion 944. The second top surface portion 942 includes a first portion 942-1 disposed about the third side of the first top surface portion 932 and a second portion 942-2 disposed about the fourth side portion . The third side of the first top surface portion 932 is a side perpendicular to the first side of the first top surface portion 932 and the fourth side of the first top surface portion 932 is a side of the first top surface portion 932 It may be a side facing the three sides.

The first portion 942-1 and the second portion 942-2 of the second upper surface portion 942 are located apart from each other and can be electrically separated from each other.

The second side portion 944 has a first portion 944-1 connected to the first portion 942-1 of the second upper surface portion 942 and a second portion 942-2 of the second upper surface portion 942 And a second portion 944-2 connected to the second portion 944-2. The length P2 of the first portion 942-1 and the second portion 942-2 of the second upper surface portion 942 in the first direction is smaller than the length P2 of the second upper surface portion 742 shown in Fig. 1 portion 742-1 and the third portion 742-3 in the first direction.

For example, the length P2 of the first portion 942-1 and the second portion 942-2 of the second upper surface portion 942 in the first direction is 1.04 mm to 1.14 mm, and the length in the second direction P3) may be 0.45 mm to 0.55 mm.

The length of the protruding portion S22 of the first top surface portion 932 protruding to support the first lead frame 620 'in the lead frame array in the first direction may be 0.14 mm to 0.24 mm.

The first light emitting chip 642 may be electrically connected to the first portion 942-1 of the second top surface portion 942 by the first wire 653 and the second light emitting chip 644 may be electrically connected to the second wire And may be electrically connected to the first portion 942-2 of the second upper surface portion 942 by the second upper surface portion 655. [

The first light emitting chip 642 and the second light emitting chip 644 can emit light of the same wavelength. For example, the first light emitting chip 642 and the second light emitting chip 644 may be red light emitting chips that emit red light.

The first light emitting chip 642 may emit light of different wavelengths. For example, the first light emitting chip 642 may be a red light emitting chip, the second light emitting chip 644 may be a yellow light emitting chip, and the first light emitting chip 642 may be a light emitting chip mounted on the light emitting device package 200-2 according to the second embodiment. The second light emitting chip 642 and the second light emitting chip 644 can operate individually.

A first power source (e.g., a negative power source) may be supplied to the first lead frame 620 ', and a second power source (e.g., a positive power source) may be supplied to the second lead frame 630' have. Since the second lead frame 630 'is divided into two electrically separated portions 942-1 and 944-1, and 942-2 and 944-2, the first lead frame 620' By supplying a second power source to the first portion 942-1 and the second portion 942-2 of the second top surface portion 942 of the second lead frame 630 ' The light emitting chip 642 and the second light emitting chip 644 can be operated individually.

Therefore, when the light emitting device package 200-2 shown in FIG. 37 is mounted on the light source modules 100-1 to 100-21 according to the embodiment, the light source modules 100-1 to 100-21 can be mounted in various colors Of the surface light source. For example, when only the first light emitting chip 642 is operated, the embodiment generates a red surface light source, and when the second light emitting chip 644 is operated, the embodiment can generate a yellow surface light source.

FIG. 42 shows measured temperatures of the light emitting device packages 200-1 and 200-2 according to the embodiment. The measured temperature shown in FIG. 42 represents the temperature of the light emitting chip when the light emitting device package is emitting light.

Case 1 shows the measured temperature of the light emitting chip when the length of the first part of the side part of the first lead frame and the length of the second part in the first direction are the same as the length of the third part, ) Represents the measurement temperature of the light emitting chip shown in Fig. 24, and Case 3 (case 3) represents the measurement temperature of the light emitting chip shown in Fig.

42, the measurement temperature t1 of the case 1 is 44.54 占 폚, the measurement temperature t2 of the case 2 is 43.66 占 폚, and the measurement temperature t3 of the case 3 is 43.58 占 폚.

Accordingly, by changing the design of the connecting portions 732, 734, 736 of the first side portion 714 of the first lead frame 620, the embodiment can improve the heat radiation effect, and the light emitting device packages 200-1, 200 -2), it is possible to prevent the light intensity reduction and the wavelength shift from occurring.

Fig. 43 shows an embodiment of the light emitting chip 640 shown in Fig. The light emitting chip 640 shown in Fig. 43 may be a vertical chip that emits red light having a wavelength range of 600 nm to 690 nm, for example.

Referring to FIG. 43, the light emitting chip 640 includes a second electrode layer 1801, a reflective layer 1825, a light emitting structure 1840, a passivation layer 1850, and a first electrode layer 1860.

The second electrode layer 1801 together with the first electrode layer 1860 provides power to the light emitting structure 1840. The second electrode layer 1801 may include an electrode material layer 1810 for current injection, a support layer 1815 located on the electrode material layer 1810, and a bonding layer 1820 located on the support layer 1815 have. The second electrode layer 1801 may be bonded to the first lead frame 620 of the light emitting device package 200-1 shown in FIG. 28, for example, the first top surface portion 712.

The electrode material layer 1810 may be Ti / Au, and the support layer 1815 may be a metal or a semiconductor material. The support layer 1815 may also be a material with high electrical and thermal conductivity. For example, the support layer 1815 may be formed of a metal containing at least one of copper (Cu), a copper alloy, gold (Au), nickel (Ni), molybdenum (Mo), and copper-tungsten Material, or a semiconductor including at least one of Si, Ge, GaAs, ZnO, and SiC.

The bonding layer 1820 is disposed between the support layer 1815 and the reflective layer 1825 and the bonding layer 1820 serves to bond the support layer 1815 to the reflective layer 1825. The bonding layer 1820 may include at least one of a bonding metal material, for example, In, Sn, Ag, Nb, Pd, Ni, Au, The bonding layer 1820 is formed to bond the support layer 815 by a bonding method. Therefore, when the support layer 1815 is formed by plating or vapor deposition, the bonding layer 1820 may be omitted.

A reflective layer 1825 is disposed on the bonding layer 820. The reflective layer 1825 reflects light incident from the light emitting structure 1840, thereby improving light extraction efficiency. The reflective layer 825 may be formed of a metal or an alloy including at least one of a reflective metal material such as Ag, Ni, Al, Rh, Pd, Ir, Ru, Mg, Zn, Pt, Au and Hf.

The reflective layer 1825 may include a conductive oxide layer such as IZO (indium zinc oxide), IZTO (indium zinc tin oxide), IAZO (indium aluminum zinc oxide), IGZO (indium gallium zinc oxide), IGTO (indium gallium tin oxide) , Aluminum zinc oxide (AZO), antimony tin oxide (ATO), or the like. The reflective layer 825 may be formed of a multilayer of a metal and a conductive oxide such as IZO / Ni, AZO / Ag, IZO / Ag / Ni, and AZO / Ag / Ni.

An ohmic region 1830 may be positioned between the reflective layer 1825 and the light emitting structure 1840. The ohmic region 1830 is a region in ohmic contact with the light emitting structure 1840 to supply power to the light emitting structure 1840 smoothly.

A material including at least one of Be, Au, Ag, Ni, Cr, Ti, Pd, Ir, Sn, Ru, Pt, and Hf in ohmic contact with the light emitting structure 1840, The ohmic region 1830 can be formed. For example, the material forming the ohmic region 1830 may include AuBe and may be in the form of a dot.

The light emitting structure 1840 may include a window layer 1842, a second semiconductor layer 1844, an active layer 1846, and a first semiconductor layer 1848. The window layer 1842 is a semiconductor layer disposed on the reflective layer 1825, and its composition may be GaP.

The second semiconductor layer 1844 is disposed on the window layer 1842. The second semiconductor layer 1844 may be formed of compound semiconductors such as Group 3-Group 5, Group 2-Group 6, and the like, and may be doped with a second conductivity type dopant. For example, the first semiconductor layer 1844 may include any one of AlGaInP, GaInP, GaN, AlN, AlGaN, InGaN, InN, InAlGaN, AlInN, AlGaAs, GaP, GaAs, Mg, Zn, Ca, Sr, Ba) may be doped.

The active layer 1846 is disposed between the second semiconductor layer 1844 and the first semiconductor layer 848 and includes electrons and holes provided from the second semiconductor layer 1844 and the first semiconductor layer 1848 holes can be generated by the energy generated in the recombination process.

The active layer 1846 may be a compound semiconductor of Group 3-Group 5 or Group 2-Group 6 and may be a single well structure, a multi-well structure, a quantum-wire structure, or a quantum dot structure. .

For example, the active layer 1846 may have a single or multiple quantum well structure with a well layer and a barrier layer. The well layer may be a material having a band gap lower than the energy band gap of the barrier layer. For example, the active layer 1846 may be AlGaInP or GaInP.

The first semiconductor layer 1848 may be formed of a semiconductor compound. The first semiconductor layer 1848 may be formed of a compound semiconductor such as a group III-V, a group II-VI, or the like, and may be doped with a first conductivity type dopant. For example, the first semiconductor layer 1848 may include any one of AlGaInP, GaInP, GaN, AlN, AlGaN, InGaN, InN, InAlGaN, AlInN, AlGaAs, GaP, GaAs, Si, Ge, Sn, etc.) may be doped.

The light emitting structure 1840 may emit red light having a wavelength range of 600 nm to 690 nm and the first semiconductor layer 1848, the active layer 1846, and the second semiconductor layer 1844 may have a composition capable of generating red light have. The upper surface of the first semiconductor layer 848 may be formed with a roughness 1870 in order to increase light extraction efficiency.

A passivation layer 1850 is disposed on the side of the light emitting structure 1840. The passivation layer 1850 serves to electrically protect the light emitting structure 1840. The passivation layer 1850 may include an insulating material, such as SiO ₂ , SiO _x , SiO _x N _y , Si ₃ N ₄ , or Al ₂ O ₃ . The passivation layer 1850 may be disposed on at least a portion of the top surface of the first semiconductor layer 1848.

The first electrode layer 1860 may be disposed on the first semiconductor layer 1848 and may have a predetermined pattern. The first electrode layer 1860 may be a single or multiple layers. For example, the first electrode layer 1860 may include a first layer 1862, a second layer 1864, and a third layer 1866 that are sequentially stacked. The first layer 1862 is in ohmic contact with the first semiconductor layer 1848 and may be formed of GaAs. The second layer 1864 may be formed of an AuGe / Ni / Au alloy. The third layer 1866 may be formed of a Ti / Au alloy.

The first electrode layer 860 may be electrically bonded to the second lead frame 630 or 630 'by wires 652, 654, 653, or 655, as shown in FIGS.

Generally, as the temperature of a light emitting chip increases, a wavelength shift occurs, and the brightness decreases. However, the red light emitting chip (Red LED) emitting red light in comparison with the blue light emitting chip (Blue LED) generating blue light and the amber LED generating yellow light has a wavelength shift Is more severe. Therefore, in the light emitting device package and the light source module using the red light emitting chip, it is very important to take measures to dissipate heat to suppress the temperature increase of the light emitting chip.

However, the light source modules 100-1 to 100-21 and the light emitting device packages 200-1 to 200-2 included in the lighting apparatus 1 according to the embodiment can improve the heat dissipation efficiency Therefore, even if a red light emitting chip is used, it is possible to suppress the temperature shift of the light emitting chip and suppress the wavelength shift and the decrease in light intensity.

Fig. 44 shows a lighting apparatus 2 according to another embodiment. Referring to Figure 48, the illumination device 2 includes a housing 1310, a light source module 1320, a diffuser plate 1330, and a microlens array 1340.

The housing 1310 accommodates the light source module 1320, the diffusion plate 1330, and the microlens array 1340, and may be made of a light transmitting material.

The light source module 1320 may be any one of the above-described embodiments 100-1 to 100-17.

The diffusion plate 1330 may function to uniformly diffuse the light emitted from the light source module 1320 through the entire surface. The diffusion plate 1330 may be made of the same material as the optical plate 70, but is not limited thereto. In another embodiment, the diffuser plate 1330 may be omitted.

The microlens array 1340 may have a structure in which a plurality of microlenses 1344 are disposed on the base film 1342. Each of the microlenses 1344 can be spaced apart from each other by a predetermined interval. Between each microlens 1344 may be a plane, and each microlens 1344 may be spaced apart from each other with a pitch of 50 to 500 micrometers.

Although the diffusion plate 1330 and the microlens array 1340 are separate components in FIG. 44, in another embodiment, the diffusion plate 1330 and the microlens array 1340 may be integrated.

Fig. 46 shows a tail light 900-2 for a vehicle according to the embodiment, and Fig. 47 shows a general tail light for a vehicle.

46, the automotive tail lamp 900-2 may include a first light source module 952, a second light source module 954, a third light source module 956, and a housing 970. [

The first light source module 952 may be a light source for serving as a turn signal lamp, the second light source module 954 may be a light source for acting as a light source, and the third light source module 956 may be a light source for acting as a stop light. But the present invention is not limited thereto, and the roles may be mutually changed.

The housing 970 accommodates the first to third light source modules 952, 954, and 956, and may be made of a light-transmitting material. The housing 970 may have a curvature depending on the design of the vehicle body. At least one of the first to third light source modules 952, 954, and 956 may be implemented in any one of the above-described embodiments 100-1 to 100-17.

In the case of a taillight, the light intensity should be above 110 candela (cd) at the time of stopping, and it is possible to view at a distance and usually requires a light intensity of more than 30%. For light output of 30% or more, the number of light emitting device packages to be applied to the light source module (for example, 952, 954, or 956) should be increased by 25% to 35% or more and the output of individual light emitting device packages should be increased by 25% to 35% .

When the number of the light emitting device packages is increased, it may be difficult to manufacture due to the limitation of the arrangement space. Therefore, by increasing the output of the individual light emitting device packages mounted on the light source module, ) Can be obtained. Since the value obtained by multiplying the output W of the light emitting device package by the number N is the total output of the light source module, it is possible to determine the appropriate output and the number of the light emitting device package according to the area of the light source module have.

For example, in the case of a light emitting device package having a consumed power of 0.2 watt and an output of 13 lumens, light intensity of about 100 candela can be obtained by disposing 37 to 42 in a certain area. However, in the case of a light emitting device package having a consumption power of 0.5 watt and a luminous flux of 30 lumens, light of similar intensity can be obtained by arranging only 13 to 15 in the same area. In order to obtain a constant output, the number of light emitting device packages to be disposed in the light source module having a constant area may be determined according to the arrangement pitch, the content of the light diffusion material in the resin layer, and the pattern shape of the reflection layer. Here, the distance may be a distance from the midpoint of one of the two adjacent light emitting device packages to the other intermediate point.

When the light emitting device packages are arranged in the light source module, the light emitting device packages are arranged at regular intervals. In the case of the high output light emitting device package, the number of arrangement can be relatively reduced. Further, when the light emitting device packages with high output are arranged at narrow intervals, the intensity of light can be made higher than that when the light emitting device packages are arranged at wide intervals.

48A and 48B show the intervals of the light emitting device package of the light source module used in the automotive tail lamp according to the embodiment. For example, FIG. 48A may be the first light source module 952 shown in FIG. 46, and FIG. 48B may be the second light source module 954 shown in FIG.

48A and 48B, the light emitting device packages 99-1 to 99-n or 98-1 to 98-m may be disposed on the substrate 10-1 or 10-2 have. n > 1, and m > 1.

(For example, ph1, ph2, ph3 or pc1, pc2, pc3) between two neighboring light emitting device packages may be different from each other, but the range of the interval is suitably 8 to 30 mm.

(For example, ph1, ph2, ph3 or pc1, pc2, pc3) may vary depending on the power consumption of the light emitting device packages 99-1 to 99-n or 98-1 to 98- Is less than 8 mm, light from neighboring light emitting device packages (for example, 99-3 to 99-4) may interfere with each other to generate a recognizable list. In addition, when the arrangement interval (for example, ph1, ph2, ph3 or pc1, pc2, pc3) is 30 mm or more, a dark region can be generated due to a region where light does not reach.

As described above, since the light source modules 100-1 to 100-17 have flexibility, they can be easily mounted on the housing 970 having a curvature, The degree of freedom can be improved.

Also, since the light source modules 100-1 to 100-17 have a structure improving the heat emission efficiency, the automotive tail lamp 900-2 according to the embodiment can prevent wavelength shift and decrease in brightness.

Since the general automotive tail lamp shown in FIG. 47 is a point light source, partial spots 962 and 964 may appear on the light emitting surface when emitting light. However, since the automotive tail lamp 900-2 according to the embodiment is a surface light source, It is possible to realize a uniform luminance and illuminance throughout.

While the present invention has been particularly shown and described with reference to exemplary embodiments thereof, it is to be understood that the invention is not limited to the disclosed exemplary embodiments, but, on the contrary, Those skilled in the art will appreciate that many suitable modifications and variations are possible in light of the present invention. Accordingly, all such modifications and variations as fall within the scope of the present invention should be considered.

10: printed circuit board 20: light source
30: reflective sheet 31: reflective pattern
40: resin layer 52: first optical sheet
54: second optical sheet 56: adhesive layer
60: optical pattern 70: optical plate
80: first air gap 90: light reflecting member
110: heat radiating members 101-1 to 101-n: sub light source module
410-1, 420-1, 410-2: connection fixing portions 510, 520, 530, 540: connectors
610: package body 620: first lead frame
630: second lead frame 640: light emitting chip
645: Zener diode 650: Wire
712: first upper surface portion 714: first side surface portion
722,724: Through hole 742: Second top surface portion
744: second side portion 801: second electrode layer
810: Electrode material layer 815: Support layer
820: bonding layer 825: reflective layer
830: Ohmic region 840: Light emitting structure
850: passivation layer 860: first electrode layer
900: vehicle light 910: light source module
920: Light housing

Claims (45)

A light source module including a printed circuit board, a plurality of light sources disposed on the printed circuit board, and a resin layer disposed on the printed circuit board to embed the plurality of light sources;
A light reflecting member disposed on at least one side of the resin layer and reflecting light emitted from the light source;
And an optical plate including an upper surface disposed on the light source module and a side wall integrally formed with the upper surface and extending in a downward direction and disposed on a side surface of the light reflecting member,
A first air gap is formed between the light source module and the upper surface of the optical plate,
Wherein the light reflection member is disposed in contact with a side surface of the resin layer and a side surface of the printed circuit board,
Wherein the light reflection member extends into the first air gap,
An upper surface of the light reflection member is in contact with a lower surface of the upper surface of the optical plate,
Wherein the optical plate has a haze of 30% or less.
The method according to claim 1,
Wherein the optical plate comprises:
Further comprising a plurality of optical beads inside the optical plate.
The method of claim 2,
Wherein the optical bead comprises:
Wherein the light emitting device is formed of any one material selected from CaCO ₃ , Ca ₃ (SO ₄ ) ₂ , BaSO ₄ , TiO ₂ , SiO ₂ , and organic beads (Methacrylate Styrene).
The method of claim 3,
Wherein the optical bead comprises:
And the beads formed of different materials are combined and contained in the optical plate.
The method of claim 2,
Wherein the optical bead comprises:
Wherein the optical plate comprises 5% or less of the total weight of the resin constituting the optical plate.
The method of claim 2,
Wherein the optical bead comprises:
And a particle diameter of 50 mu m or less.
The method according to claim 1 or 2,
And a lens pattern disposed on an upper surface of the optical plate.
The method of claim 7,
Wherein the lens pattern is embossed in a protruding structure.
The method of claim 8,
The lens pattern may include:
Wherein the height of the unit pattern is 1 占 퐉 to 150 占 퐉 and the diameter is in the range of 1 占 퐉 to 300 占 퐉.
The method according to claim 1,
Wherein the resin layer comprises:
But are not limited to, urethane acrylate, epoxy acrylate, polyester acrylate, polyether acrylate, polybutadiene acrylate, silicone acrylate, An ultraviolet curable resin containing at least one of the ultraviolet curable resin and the ultraviolet curable resin.
The method according to claim 1,
Wherein the resin layer comprises:
Wherein the thermosetting resin comprises at least one of a polyester polyol resin, an acrylic polyol resin, and a hydrocarbon-based or ester-based solvent.
The method according to claim 1,
Wherein the resin layer comprises:
And a transparent substrate made of at least one selected from the group consisting of silicon, silica, glass bubble, PMMA, urethane, Zn, Zr, Al ₂ O ₃ , Further comprising a diffusion material.
The method according to claim 1,
The light source module includes:
And a reflective sheet disposed between the printed circuit board and the resin layer.
14. The method of claim 13,
The light source module includes:
And a reflective pattern formed on the reflective sheet.
15. The method of claim 14,
The reflection pattern
Lighting devices comprising an any one of _{TiO2, CaCO 3, BaSO 4,} Al 2 O 3, Silicon, PS (Polystyrene).
The method according to claim 1,
The light source module includes:
And an optical pattern layer disposed between the resin layer and the upper surface of the optical plate, the optical pattern layer having an optical pattern for dispersing light.
18. The method of claim 16,
Wherein the optical pattern layer comprises:
A first optical sheet disposed on an upper surface of the resin layer;
A second optical sheet disposed on the first optical sheet;
An adhesive layer disposed between the first optical sheet and the second optical sheet; And
And an air gap which is disposed on a main surface of the optical pattern and separates the optical pattern from the adhesive layer.
The method according to claim 1,
The light source includes:
Wherein the light emitting device package is a side view type light emitting device package.
The method according to claim 1,
The light source includes:
A package body having a cavity;
A first lead frame having one end exposed to the cavity and the other end exposed through one side of the package body through the package body;
A second lead frame including one end exposed at one side of the one side of the package body, the other end exposed at the other side of the one side of the package body, and an intermediate part exposed to the cavity;
And at least one light emitting chip disposed on the first lead frame, the light emitting device package including a first semiconductor layer, an active layer, and a second semiconductor layer. delete delete delete delete delete delete delete delete delete delete delete delete delete delete delete delete delete delete delete delete delete delete delete delete delete delete

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