KR101966895B1 - Touch sensor inspecting apparatus and method - Google Patents

Abstract

The present invention relates to an apparatus and a method for inspecting a touch sensor.
The present invention relates to a method of manufacturing a flexible printed circuit board having a stage on which a touch sensor including a bonding pad portion bonded to a first contact portion of an FPCB and a sensing portion electrically connected to the bonding pad portion is disposed, And a rail guide portion for providing a path for moving the lower test block pressed by the upper push block toward the stage, and a rail guide portion for providing a path for moving the lower test block pressed by the upper push block toward the stage .
According to the present invention, it is possible to confirm whether or not there is a fine crack that may lead to a product defect in the bonding pad portion of the touch sensor through simple and quick electrical inspection without performing optical inspection.

Description

TECHNICAL FIELD [0001] The present invention relates to a touch sensor inspecting apparatus and method,

The present invention relates to an apparatus and a method for inspecting a touch sensor. More particularly, the present invention relates to a touch sensor inspecting apparatus and method for inspecting whether or not a fine crack that may lead to a product defect exists in a bonding pad portion of a touch sensor through a simple and quick electrical inspection without performing an optical inspection .

A touch sensor is a device for inputting a user's command by touching a character or a figure displayed on a screen of a video display device with a finger or other contact means of a person and is attached to a video display device and used.

The touch sensor is implemented by a resistive type, a light sensing type, and a capacitive type. The dual capacitance type touch sensor reads the contact position by detecting a change in the capacitance that the conductive detection pattern forms with other surrounding sensing patterns or the ground electrode or the like when a human hand or an object is contacted.

In order to meet the demand of the touch sensor market, it is necessary not only to provide a system capable of mass production of touch sensors, but also to check the function of the produced touch sensor in order to determine whether or not the produced touch sensor is defective.

Meanwhile, in the case of a conventional touch sensor function tester, a voltage is applied to a bonding pad portion of a touch sensor through a ground and a capacitance value is measured. When a measured value is compared with data of a reference range, However, if there is a slight crack in the bonding pad portion, cracks in the planar state are fine, and since the gap portion is electrically connected by the current supplied during the grounding process, There is a problem that it is difficult to distinguish between a positive product and a defective product.

In other words, a minute crack present in the bonding pad portion causes a product failure during use of the touch sensor in an actual environment, thereby lowering durability and causing a decrease in customer reliability. However, in the conventional inspection method, There is a problem that accurate inspection can not be performed.

Further, when an optical inspection process using an electron microscope or the like is added to inspect the micro-cracks of the bonding pad portion, there arises a problem that the inspection time and inspection cost increase and the manufacturing cost of the product increases.

Korean Patent Laid-Open Publication No. 10-2013-0136358 (Publication Date: December 12, 2013, Name: Touch Sensor Inspection Method and Apparatus) Korean Published Patent Application No. 10-2009-0056717 (Published Date: June 03, 2009, entitled: Jig Device for Inspection of Contact Sensor Module and Inspection Method Using the Same)

The present invention provides an apparatus and method for inspecting a touch sensor that allows a simple and rapid electrical inspection to check whether or not a micro-crack that may lead to a product defect exists in a bonding pad of a touch sensor without performing an optical inspection It is a technical task.

It is another object of the present invention to provide an apparatus and method for inspecting a touch sensor that can automate touch sensor function inspection and shorten inspection time.

According to an aspect of the present invention, there is provided an apparatus for inspecting a touch sensor, comprising: a touch sensor including a bonding pad portion bonded to a first contact portion of a flexible printed circuit board (FPCB) and a sensing portion electrically connected to the bonding pad portion; A lower test block adhered to the second contact portion of the FPCB, an upper push block pushing a lower test block adhered to the second contact portion of the FPCB, and a lower test block pushed by the upper push block toward the stage And a rail guide portion for providing a moving path.

In the touch sensor inspection apparatus according to the present invention, when the banding inspection mode is selected, the lower check block is moved in the state in which the second contact portion of the FPCB is pushed by the upper push block toward the stage The FPCB bands the bonding pad portion of the touch sensor.

In the touch sensor inspection apparatus according to the present invention, the lower region of the stage where the bonding pad portion adhered to the first contact portion of the FPCB is disposed is recessed inward to provide a space in which the lower inspection block is moved and arranged .

In the touch sensor inspection apparatus according to the present invention, when the banding inspection mode is selected, the upper push block is lowered to press the second contact portion of the FPCB adhered to the lower inspection block, And the lower inspection block is moved to the stage through the rail guide portion. When the FPCB bends the bonding pad portion of the touch sensor And the lower inspection block is stopped.

In the touch sensor inspection apparatus according to the present invention, a basic item inspection process is performed by the inspection logic included in the FPCB while the down operation of the upper push block and the movement operation of the lower inspection block are performed, And the touch sensor performance checking process is performed after the inspection process is completed.

In the touch sensor inspection apparatus according to the present invention, when the general inspection mode is selected, the upper push block is lowered to press the second contact portion of the FPCB bonded to the lower inspection block, A basic item inspection process is performed, and a touch sensor performance inspection process is performed after the basic item inspection process is completed.

A touch sensor inspection method according to the present invention includes a touch sensor placement step of placing a touch sensor including a bonding pad portion bonded to a first contact portion of a flexible printed circuit board (FPCB) on a stage and a sensing portion electrically connected to the bonding pad portion A lower test block adhering step for adhering a second contact portion of the FPCB to a lower test block, a lower test block pressing step for lowering an upper press block to press a lower test block adhered to a second contact portion of the FPCB, And performing an inspection process according to the touch sensor inspection process.

And a lower test block moving step of moving a lower test block pressed by the upper push block toward the stage when a banding inspection mode is selected in the touch sensor inspection method according to the present invention, , The FPCB moves the lower test block toward the stage while the second contact portion of the FPCB is pushed by the upper push block so that the FPCB bands the bonding pad portion of the touch sensor .

In the touch sensor inspection method according to the present invention, the lower region of the stage where the bonding pad portion bonded to the first contact portion of the FPCB is disposed is recessed inward to provide a space in which the lower inspection block is moved and arranged .

In the touch sensor inspection method according to the present invention, when the banding inspection mode is selected, the upper pressing block is lowered to press the second contact portion of the FPCB bonded to the lower inspection block, The lower inspection block is lowered in a state of pressing the second contact portion of the FPCB adhered to the lower inspection block, the lower inspection block is moved to the stage, and the FPCB bends the bonding pad portion of the touch sensor, And stops.

In the touch sensor inspection method according to the present invention, a basic item inspection process is performed by the inspection logic provided in the FPCB while the lower inspection block pressing step and the lower inspection block moving step are performed, The touch sensor performance checking process is performed.

In the touch sensor inspection method according to the present invention, when the general inspection mode is selected, the upper push block is lowered to press the second contact portion of the FPCB bonded to the lower inspection block, A basic item inspection process is performed, and a touch sensor performance inspection process is performed after the basic item inspection process is completed.

According to the present invention, there is provided a touch sensor inspection apparatus and method for allowing a simple and rapid electrical inspection to check whether or not a fine crack that may lead to a product defect exists in a bonding pad portion of a touch sensor, without performing an optical inspection .

Further, there is provided an apparatus and method for inspecting a touch sensor that can automate touch sensor function inspection and shorten inspection time.

FIG. 1 is a view illustrating a planar shape of a touch sensor inspection apparatus according to an embodiment of the present invention,
2 is a cross-sectional view illustrating a touch sensor testing apparatus according to an exemplary embodiment of the present invention,
3 to 7 are views for explaining a specific operation in a banding inspection mode in a touch sensor inspection apparatus according to an embodiment of the present invention,
8 to 10 are views for explaining a concrete operation in the general inspection mode in the touch sensor inspection apparatus according to an embodiment of the present invention,
11 is a flowchart illustrating an operation sequence in a banding inspection mode in a touch sensor inspection method according to an exemplary embodiment of the present invention,
12 is a diagram illustrating an operation flow chart in a general inspection mode in a touch sensor inspection method according to an embodiment of the present invention.

It is to be understood that the specific structural or functional description of embodiments of the present invention disclosed herein is for illustrative purposes only and is not intended to limit the scope of the inventive concept But may be embodied in many different forms and is not limited to the embodiments set forth herein.

The embodiments according to the concept of the present invention can make various changes and can take various forms, so that the embodiments are illustrated in the drawings and described in detail herein. It should be understood, however, that it is not intended to limit the embodiments according to the concepts of the present invention to the particular forms disclosed, but includes all modifications, equivalents, or alternatives falling within the spirit and scope of the invention.

The terms first, second, etc. may be used to describe various elements, but the elements should not be limited by the terms. The terms may be named for the purpose of distinguishing one element from another, for example, without departing from the scope of the right according to the concept of the present invention, the first element may be referred to as a second element, The component may also be referred to as a first component.

It is to be understood that when an element is referred to as being "connected" or "connected" to another element, it may be directly connected or connected to the other element, . On the other hand, when an element is referred to as being "directly connected" or "directly connected" to another element, it should be understood that there are no other elements in between. Other expressions that describe the relationship between components, such as "between" and "between" or "neighboring to" and "directly adjacent to" should be interpreted as well.

The terminology used herein is for the purpose of describing particular embodiments only and is not intended to be limiting of the invention. The singular expressions include plural expressions unless the context clearly dictates otherwise. In this specification, the terms "comprises" or "having" and the like are used to specify that there are features, numbers, steps, operations, elements, parts or combinations thereof described herein, But do not preclude the presence or addition of one or more other features, integers, steps, operations, components, parts, or combinations thereof.

Unless otherwise defined, all terms used herein, including technical or scientific terms, have the same meaning as commonly understood by one of ordinary skill in the art to which this invention belongs. Terms such as those defined in commonly used dictionaries are to be interpreted as having a meaning consistent with the meaning of the context in the relevant art and, unless explicitly defined herein, are to be interpreted as ideal or overly formal Do not.

Hereinafter, preferred embodiments of the present invention will be described in detail with reference to the accompanying drawings.

FIG. 1 is a diagram illustrating a planar shape of a touch sensor inspection apparatus according to an embodiment of the present invention. FIG. 2 is a cross-sectional view of a touch sensor inspection apparatus according to an exemplary embodiment of the present invention. to be.

1 and 2, a touch sensor inspection apparatus 100 according to an embodiment of the present invention includes a stage 110, a lower inspection block 120, an upper push block 130, and a rail guide 140, .

The stage 110 is a component in which the touch sensor 1, which is the object of the performance check, is disposed.

The touch sensor 1 disposed on the stage 110 may include a bonding pad unit 12 and a sensing unit 14. The bonding pad portion 12 of the touch sensor 1 is bonded to the first contact portion 22 of the flexible printed circuit board 2 and electrically connected to the sensing portion 14 connected to the bonding pad portion 12 through the electric wiring, Detects the touch input.

For example, a lower region of the stage 110 where the bonding pad portion 12 bonded to the first contact portion 22 of the FPCB 2 is disposed may provide a space in which a lower inspection block 120, It may be configured to have an inwardly recessed shape. The lower inspection block 120 may be formed in a lower region of the stage 110 so that the lower region of the stage 110 on which the bonding pad portion 12 of the touch sensor 1 is disposed has a shape recessed inward, The FPCB 2 bands the bonding pad portion 12 of the touch sensor 1 into a substantially S shape in the process of moving the touch sensor 1 to the bonding pad portion 12 ). ≪ / RTI >

The lower inspection block 120 is adhered to the second contact portion 24 of the FPCB 2.

For example, the lower inspection block 120 moves toward the stage 110 while the second contact portion 24 of the FPCB 2 is pushed by the upper push block 130, May be configured to bend the bonding pad portion 12 of the touch sensor 1 in an S shape.

The upper pressing block 130 is a component that presses the lower inspection block 120 adhered to the second contact portion 24 of the FPCB 2. [ For example, when an inspection start command for the touch sensor 1 is inputted, the upper push block 130 is lowered and the lower check block 120 adhered to the second contact portion 24 of the FPCB 2 is titrated Pressure.

The rail guide portion 140 provides a path through which the lower inspection block 120 pressed by the upper pressing block 130 moves toward the stage 110.

For example, the test for the touch sensor 1 can be performed according to the banding test mode and the general test mode, and the user can select one of the two modes as needed.

For example, when the banding inspection mode is selected, the upper pressing block 130 is lowered to press the second contact portion 24 of the FPCB 2 adhered to the lower inspection block 120, and the upper pressing block 130 The lower test block 120 is lowered while the second test block 120 of the FPCB 2 is pressed against the second contact portion 24 of the FPCB 2 bonded to the lower test block 120, The lower inspection block 120 may be stopped in a state where the FPCB 2 bends the bonding pad portion 12 of the touch sensor 1. In this case, For example, the ascending and descending operations of the lower inspection block 120 can be performed by the cylinder unit 150. [

For example, in the banding inspection mode, a basic item inspection process by the inspection logic provided in the FPCB 2 is performed while the down operation of the upper push block 130 and the movement operation of the lower inspection block 120 are performed , The touch sensor performance checking process may be performed after the basic item checking process is completed. In order to concentrate the stress on the bonding pad portion 12 in this way, during the lowering operation of the upper push block 130 and the lowering operation of the lower inspection block 120, the basic operation of the inspection logic provided in the FPCB 2 By configuring the item inspection process to be performed, the time required for the performance inspection of the touch sensor 1 can be reduced. For example, the base item inspection process may be a process independent of the performance test of the touch sensor, for example, a process of inspecting ancillary items such as version checking of the inspection program.

For example, when the normal inspection mode is selected, the upper pressing block 130 is lowered to press the second contact portion 24 of the FPCB 2 bonded to the lower inspection block 120, The basic item inspection process by the inspection logic is performed and the touch sensor performance inspection process can be performed after the basic item inspection process is completed.

Hereinafter, a specific operation in the banding inspection mode and the general inspection mode will be exemplified.

3 to 7 are views for explaining a specific operation in the banding inspection mode in the touch sensor testing apparatus 100 according to an embodiment of the present invention.

3, the touch sensor 1 is disposed on the stage 110 and the second contact portion 24 of the FPCB 2 is bonded to the lower inspection block 120. [ For example, as a method of disposing and fixing the touch sensor 1 on the stage 110, any known method including an air adsorption method can be applied. The touch sensor 1 includes a sensing unit 14 for sensing a touch input and a bonding pad unit 12 electrically connected to the sensing unit 14. The bonding pad unit 12 is connected to the FPCB 2, And is adhered to the first contact portion 22.

4, the upper push block 130 is lowered to press the lower check block 120 adhered to the second contact portion 24 of the FPCB 2.

5, when the upper push block 130 presses the second contact portion 24 of the FPCB 2 adhered to the lower test block 120, the lower test block 120 descends Is performed.

Next, referring to FIG. 6, a process of moving the lower inspection block 120 pressed by the upper pressing block 130 toward the stage 110 is performed. The stress generated in the FPCB 2 due to the bending of the lower inspection block 120 toward the stage 110 and the greater the moving distance of the lower inspection block 120, .

Next, referring to FIG. 7, a process of stopping the lower inspection block 120 at a preset point is performed. The lower inspection block 120 is moved toward the stage 110 in a state where the second contact portion 24 of the FPCB 2 is pushed by the upper pressing block 130 so that the FPCB 2 The lower inspection block 120 may be stopped when the bonding pad portion 12 of the touch sensor 1 is band-shaped in S shape.

For example, in the banding inspection mode, a basic item inspection process by the inspection logic provided in the FPCB 2 is performed while the down operation of the upper push block 130 and the movement operation of the lower inspection block 120 are performed , The touch sensor performance checking process may be performed after the basic item checking process is completed.

8 to 10 are views for explaining a specific operation in the general inspection mode in the touch sensor testing apparatus 100 according to an embodiment of the present invention.

8, the touch sensor 1 is disposed on the stage 110 and the second contact portion 24 of the FPCB 2 is bonded to the lower inspection block 120. FIG. For example, as a method of disposing and fixing the touch sensor 1 on the stage 110, any known method including an air adsorption method can be applied. The touch sensor 1 includes a sensing unit 14 for sensing a touch input and a bonding pad unit 12 electrically connected to the sensing unit 14. The bonding pad unit 12 is connected to the FPCB 2, And is adhered to the first contact portion 22.

9, the lower pressing block 130 is lowered to press the lower testing block 120 adhered to the second contact portion 24 of the FPCB 2.

Next, referring to FIG. 10, a basic item inspection process is performed by the inspection logic included in the FPCB 2, and a touch sensor performance inspection process is performed after the basic item inspection process is completed.

FIG. 11 is a flowchart illustrating an operation of the touch sensor inspection method according to an embodiment of the present invention. FIG. 12 is a flowchart illustrating a touch sensor inspection method according to an exemplary embodiment of the present invention. , And an operation flowchart in the normal inspection mode.

The operation principle of the touch sensor inspection method according to an embodiment of the present invention is substantially the same as the device described in detail above. Hereinafter, the inspection method will be described with reference to FIGS. 1 to 10 together with explanations of the inspection apparatus, as long as duplication of descriptions is as possible as possible.

First, a touch sensor inspection method according to an embodiment of the present invention in a banding inspection mode will be described with reference to FIGS. 1 to 7 and 11. FIG.

In the touch sensor arrangement step S10, the process of arranging the touch sensor 1 on the stage 110 is performed. For example, as a method of disposing and fixing the touch sensor 1 on the stage 110, any known method including an air adsorption method can be applied. The touch sensor 1 includes a sensing unit 14 for sensing a touch input and a bonding pad unit 12 electrically connected to the sensing unit 14. The bonding pad unit 12 is connected to the FPCB 2, And is adhered to the first contact portion 22.

For example, a lower region of the stage 110 where the bonding pad portion 12 bonded to the first contact portion 22 of the FPCB 2 is disposed may provide a space in which a lower inspection block 120, It may be configured to have an inwardly recessed shape. The lower inspection block 120 may be formed in a lower region of the stage 110 so that the lower region of the stage 110 on which the bonding pad portion 12 of the touch sensor 1 is disposed has a shape recessed inward, The FPCB 2 bands the bonding pad portion 12 of the touch sensor 1 into a substantially S shape in the process of moving the touch sensor 1 to the bonding pad portion 12 ). ≪ / RTI >

In the lower inspection block bonding step S20, a process of bonding the second contact portion 24 of the FPCB 2 to the lower inspection block 120 is performed.

If it is determined in step S31 that the banding inspection mode is selected, steps S40, S45, S50, S60, and S70 corresponding to the banding inspection mode are performed.

In the lower test block depression step S40, the upper press block 130 is lowered to press the lower check block 120 adhered to the second contact portion 24 of the FPCB 2.

In the lower inspection block descending step S45, the lower inspection block 120 is lowered in a state in which the upper pressing block 130 presses the second contact portion 24 of the FPCB 2 adhered to the lower inspection block 120 Process is performed.

In the lower test block moving step S50, a process of moving the lower test block 120 pressed by the upper pressing block 130 toward the stage 110 is performed.

For example, in the lower test block moving step (S50), the lower test block 120 is moved in the state in which the second contact portion 24 of the FPCB 2 is pushed by the upper push block 130, The FPCB 2 may be configured to band the bonding pad portion 12 of the touch sensor 1 by moving the FPCB 2 toward the stage 110 via the bonding pad portion 140.

For example, if a test start command is inputted after the lower test block adhering step S20, in the lower test block pressing step S40, the upper push block 130 is lowered and the lower The lower inspection block 120 is moved to the stage 110 via the rail guide portion 140 and then the FPCB 2 (see FIG. 2) May be configured to stop in a state of bending the bonding pad portion 12 of the touch sensor 1 in an S shape.

In step S60, a basic item inspection process for the touch sensor 1 is performed.

For example, the basic item inspection process may be configured to be performed together with a lower inspection block pressing step (S40) and a lower inspection block moving step (S50). More specifically, while the lowering operation of the upper push block 130 through the lower test block pushing step S40 and the lower test block 120 moving operation through the lower test block moving step S50 are performed, the FPCB 2 ) Is performed and the touch sensor performance checking process is performed after the basic item checking process is completed. In order to concentrate the stress on the bonding pad portion 12 in this way, during the lowering operation of the upper push block 130 and the lowering operation of the lower inspection block 120, the basic operation of the inspection logic provided in the FPCB 2 By configuring the item inspection process to be performed, the time required for the performance inspection of the touch sensor 1 can be reduced.

In step S70, the performance check process for the touch sensor 1 is performed after the basic item checking process is completed.

Next, with reference to FIG. 1, FIG. 2, FIG. 8 to FIG. 10, and FIG. 12, a touch sensor inspection method according to an embodiment of the present invention in a general inspection mode will be described.

Operations in steps S10, S20, and S40 are the same as in the banding inspection mode, so duplicate descriptions are omitted.

If it is determined in step S32 that the general inspection mode is selected, steps S40, S60, and S70 corresponding to the general inspection mode are performed.

In step S60, a basic item inspection process for the touch sensor 1 is performed.

After the basic item inspection process is performed through step S60, step S70 is performed.

In step S70, the performance check process for the touch sensor 1 is performed after the basic item checking process is completed.

As described above in detail, according to the present invention, it is possible to detect whether or not a fine crack that may lead to a product defect exists in a bonding pad portion of a touch sensor by a simple and quick electrical inspection without performing an optical inspection. An inspection apparatus and a method are provided.

Further, there is provided an apparatus and method for inspecting a touch sensor that can automate touch sensor function inspection and shorten inspection time.

1: Touch sensor
12: bonding pad portion
14:
2: FPCB
22: first contact
24: second contact
100: touch sensor inspection device
110: stage
120: Lower inspection block
130: upper push block
140: rail guide portion
150:
S10: Touch sensor placement step
S20: Lower test block bonding step
S40: Lower test block push step
S45: Lower test block descending step
S50: Sub-test block moving step

Claims (12)

A stage having a touch sensor including a bonding pad portion bonded to a first contact portion of a flexible printed circuit board (FPCB) and a sensing portion electrically connected to the bonding pad portion;
A lower inspection block bonded to a second contact of the FPCB;
An upper push block for pressing a lower test block adhered to a second contact portion of the FPCB; And
And a rail guide portion for providing a path through which the lower inspection block pressed by the upper pressing block moves toward the stage,
Wherein the lower region of the stage where the bonding pad portion bonded to the first contact portion of the FPCB is disposed is recessed inward to provide a space in which the lower inspection block is moved and disposed. The method according to claim 1,
Wherein the lower check block comprises:
And the FPCB moves toward the stage while the second contact portion of the FPCB is pushed by the upper pressing block, thereby causing the FPCB to band the bonding pad portion of the touch sensor. delete The method according to claim 1,
The upper push block is lowered to press the second contact portion of the FPCB adhered to the lower test block,
The lower test block descends in a state in which the upper push block presses the second contact portion of the FPCB adhered to the lower test block,
The lower inspection block moves to the stage through the rail guide portion,
Wherein the lower inspection block stops when the FPCB bends the bonding pad portion of the touch sensor. 5. The method of claim 4,
A basic item inspection process is performed by a check logic provided in the FPCB while a lowering operation of the upper push block and a movement operation of the lower check block are performed,
Wherein the touch sensor performance checking process is performed after the basic item checking process is completed. The method according to claim 1,
The upper push block is lowered to press the second contact portion of the FPCB adhered to the lower test block,
A basic item inspection process is performed by the inspection logic included in the FPCB,
Wherein the touch sensor performance checking process is performed after the basic item checking process is completed. A touch sensor placement step of placing a touch sensor including a bonding pad portion bonded to a first contact portion of a flexible printed circuit board (FPCB) on the stage and a sensing portion electrically connected to the bonding pad portion;
A lower test block bonding step of bonding a second contact portion of the FPCB to a lower inspection block;
A lower test block pressing step of lowering the upper pressing block to press a lower inspection block bonded to the second contact portion of the FPCB; And
And performing an inspection process of inspecting the touch sensor according to the selected inspection mode,
Wherein the lower region of the stage where the bonding pad portion bonded to the first contact portion of the FPCB is disposed is recessed inward to provide a space in which the lower inspection block is moved and disposed. 8. The method of claim 7,
And a lower test block moving step of moving the lower test block pressed by the upper push block toward the stage,
In the lower test block moving step,
Wherein the FPCB bands the bonding pad portion of the touch sensor by moving the lower inspection block toward the stage while the second contact portion of the FPCB is pressed by the upper pressing block. Touch Sensor Inspection Method. delete 8. The method of claim 7,
The upper push block is lowered to press the second contact portion of the FPCB adhered to the lower test block,
The lower test block descends in a state in which the upper push block presses the second contact portion of the FPCB adhered to the lower test block,
The lower inspection block moves to the stage,
Wherein the lower inspection block stops when the FPCB bends the bonding pad portion of the touch sensor. 9. The method of claim 8,
During the execution of the lower test block pushing step and the lower test block moving step, a basic item inspecting process is performed by the inspection logic included in the FPCB,
Wherein the touch sensor performance checking process is performed after the basic item checking process is completed. 8. The method of claim 7,
The upper push block is lowered to press the second contact portion of the FPCB adhered to the lower test block,
A basic item inspection process is performed by the inspection logic included in the FPCB,
Wherein the touch sensor performance checking process is performed after the basic item checking process is completed.

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