KR101953212B1 - LED Display Board - Google Patents

Abstract

The present invention includes a plurality of LED unit modules connected in a tile shape, the plurality of LED unit modules each comprising a transparent film; A first wiring formed on the transparent film; An insulating pattern formed on the first wiring; A plurality of LEDs contacting the first wiring; A second wiring formed on the insulating pattern; And a plurality of connectors formed on edge portions of the transparent film and contacting the second wiring.

Description

LED Display Board {LED Display Board}

In particular, the present invention relates to an LED electronic signboard using a LED unit module formed by integrating an LED array on a transparent film as a transparent LED FAADE by bonding or inserting the LED unit module into a glass in the form of a tile, and a manufacturing method thereof.

With the recent rapid development of display technology, liquid crystal displays have already established themselves as image display devices for notebooks, monitors and TV sets.

High-resolution small image display devices are being used in the mobile and smartphone markets all over the world.

A thin film transistor (Liquid Crystal Display) as a liquid crystal image display device (LCD) emits an AMOLED image display device called an organic light emitting diode .

Now, the display window of a mobile electronic device is mainly composed of an AMOLED image display device and a high-resolution low temperature polycrystalline thin film transistor liquid crystal display device.

The brightness of light measured on the screen display unit of the liquid crystal display device is generally 400 cd / m 2, which is not a big problem in displaying an image in a room where the external light source is weak.

On the other hand, in the outdoor environment, the liquid crystal display device has increased the light source of the backlight to over 700 cd / m 2, making it possible to use it in the environment where the outdoors and direct sunlight are avoided.

The fragility of the liquid crystal display with respect to external light in the outdoors promotes the adoption of a light emitting diode (LED), which is a semiconductor element that has a high light efficiency and emits brighter light.

LEDs have been used in various forms from the past, but only partial color implementations such as green and red LEDs have been implemented.

NICHIA in Japan has been rapidly applied to a variety of fields such as the development of blue LEDs and phosphors and the rapid development of white light sources, as well as outdoor signs and display boards for rooftop advertising, railway lines in subway stations, and indicators.

Several years ago, the revolution of the global light source that replaced the existing lighting with the LED light came. Compared to conventional light sources, LEDs have the greatest advantages of high efficiency, long life and environmental friendliness. Therefore, the application of LED technology has begun to take various forms, and we are deeply involved in our lives.

The field of image display, which has been mainly performed only in the existing room, has been developed for outdoor use due to the development of LED technology, so that high resolution and full color display can be easily achieved.

In this trend, display technology has been developed to provide advertising and information by directly attaching LEDs to the windows used in the outer walls of shops and buildings.

Such a display device technology is an expensive display device that a few customers are looking for yet, but the effect of the display device is expected to increase exponentially in the future. Therefore, there is a growing need for alternative products or improved products with cost savings and convenience in adopting LED integrated products in glass.

However, such a display device has a complicated process in which an LED array is mounted on a glass in the manufacturing process, a disadvantage that it is necessary to install the LED array on a free glass, and an expensive display device.

Specifically, in order to mount an LED array on a transparent glass plate and connect the LED array, it is necessary to form an integral structure by using a glass ball as a method of patterning a transparent conductive material. As a result, There is a problem that the process is essential.

In addition, there is a disadvantage in that a display device can not be used in a desired size in the field, and it is necessary to cut the standard size or custom size from the time of manufacture.

SUMMARY OF THE INVENTION The present invention has been made in order to solve the problems of the related art, and it is an object of the present invention to provide an LED unit module using a transparent film and a plurality of LEDs, And a method of manufacturing the LED electronic circuit board.

The present invention is applicable to a high-resolution device and a flexible device by forming an LED unit module using a transparent film and a plurality of LEDs, connecting the LED unit module to a glass window used as an outer wall, And an object of the present invention is to provide an LED electric signboard and a method of manufacturing the same.

According to an aspect of the present invention, there is provided a light emitting diode module comprising: a plurality of LED unit modules connected in a tile shape; A first wiring formed on the transparent film; An insulating pattern formed on the first wiring; A plurality of LEDs contacting the first wiring; A second wiring formed on the insulating pattern; And a plurality of connectors formed on edge portions of the transparent film and contacting the second wiring.

The transparent film may be one of polyethylene terephthalate (PET), polypropylene (PP), and polyimide (PI), and may have a thickness of 0.2 mm or less.

The first wiring may be formed of one of copper (Cu), aluminum (Al), indium tin oxide (ITO), and indium zinc oxide (IZO) , And a first width.

The insulating pattern is formed of a photocurable resin and formed through a process of 130 degrees or less, and may have a width twice or more of the first width.

The insulating pattern may have a multilayer structure of a first layer formed in a region between the first wirings and a second layer formed on the first layer and the first wiring.

The second wiring is made of one of silver nanoparticles, graphene, and carbon nano tube (CNT), has a thickness of 0.3 mm or more, and has a second width smaller than the first width And can be formed through a process of 130 degrees or less.

The first width may be 6 to 7 times the second width.

The plurality of LED unit modules may further include an adhesive layer or an attracting plate formed on a back surface of the transparent film, respectively.

The upper portion of the first and second wires and the transparent film having the insulation pattern may be subjected to a parylene coating process.

The LED display board may further include a controller for driving the plurality of LED unit modules according to a preset program.

As described above, according to the present invention, it is possible to supply an inexpensive product in comparison with the price of an LED product directly integrated on a window, and secondly, it is possible to spread quickly by convenient construction. Thirdly, it is expected to expand into high-resolution technology connection and folding display devices. In addition, it can be made in a flexible form that can be produced in any form by making it in film form. Therefore, economic and environmental effects such as improvement of the beauty of attachment LED product that forms the existing media facade, It is expected.

In addition, the present invention provides an LED display module with a transparent film, a plurality of LEDs, and an LED unit module connected to a glass window used as an outer wall, .

The present invention is also applicable to a high-resolution device and a flexible device by forming an LED unit module with a transparent film and a plurality of LEDs, connecting the LED unit module to a glass window used as an outer wall, This has an easy effect.

1 is a plan view showing an LED electronic signboard according to an embodiment of the present invention;
2 is a plan view showing an LED unit module according to an embodiment of the present invention;
3 is a cross-sectional view illustrating an LED unit module according to an embodiment of the present invention.
4 is a photograph showing an LED display board according to an embodiment of the present invention.
5 is a photograph showing the connector of the LED unit module according to the embodiment of the present invention.

Hereinafter, the present invention will be described in detail with reference to the accompanying drawings.

The transparent LED LED display panel according to the present invention can be manufactured by patterning a conductive copper or transparent conductive film (ITO: indium tin oxide) wiring on a film (PET series) which is light, And an image is displayed by mounting an LED array.

According to the present invention, it is possible to connect a LED unit module and to realize a transparent electric signboard of a desired size easily by a tile-type adhesive installation in the size of a glass window used as a transparent outer wall.

As a transparent conductive film, it is possible to introduce a new material capable of thick film and printing technique in addition to a conventional ITO transparent conductive film, thereby realizing a more convenient manufacturing method.

In addition, the LED MODULE circuit is designed as ARTWORK in consideration of the fairness like the PCB on the PET film.

In the present invention, unlike conventional circuit boards, there is a need for a design technique for solving the characteristics of the substrate material and the resistivity and process difficulties of patterned copper and ITO wiring and Ag wiring printed on thick film.

In the production of the transparent film PCB according to the present invention, when only one layer is provided between the Ag layer and the Cu layer, the Ag layer and the Cu layer CLEAR layer are melted and SHORT occurs. When the CLEAR layer is laminated in order to prevent this, the Ag wiring can not overcome the thickness of the CLEAR layer and a wiring OPEN phenomenon occurs due to the step difference.

When the thickness of the Ag wiring is increased to overcome the step difference, cracking of the wiring is also difficult in the manufacturing process.

In addition, resistance irregularity of the wiring in the process of forming the etching and the clear layer has been improved.

That is, securing the manufacturing process technology is a big problem. As shown in [References], the design improvement and application of various process conditions have been successfully accomplished.

 The thickness of the PCB pattern is designed to be 0.3MM or more, and the PAD is formed at the end of the CU LAYER LINE of the PCB.

AG LAYER LINE Thickness - It is designed to be 0.3MM or more. The width of the clear sheet is more than twice the width of the line, and the AG LAYER line is overlapped with the line of CU LAYER.

Through the test pattern, the improvement of the coating problem of the CLEAR area was found, and the Ag content of the Ag layer was adjusted to 60% through the test pattern.

The CLEAR region was first applied to the inversion region of the Cu region to overcome the step with the Cu layer.

Techniques such as the introduction of conduction paste material which is low temperature baking and the securing of uniformity are required for mounting devices such as LED, driving chip, connector on transparent film.

Copper is used in the existing circuit diagram after the CU plate is printed on the transparent film, but transparency is remarkably reduced. By using silver nano technology, transparent circuit is printed by printing the transparency to the maximum. In addition, shrinkage of transparent film may occur during processing. In addition to reflecting the design, it is improved to minimize shrinkage by experimentally adjusting the temperature of the Ag and CLEAR areas of the film.

As the use of the transparent film LED electric signboard according to the present invention

1) Video display for advertising, publicity and information in various show windows

2) Indoor. LED panel device on outer wall

3) Application of LED Luminary Device such as Ceiling

.

As a function of the product according to the invention

1) LED array module (In order to increase the transparency, the LED device is packaged in a very small size, and circuit diagram (pattern) is applied to the transparent silver nano method. The crossing part of the project had to develop specially developed methods for this project, but it also helped to develop new methods.

2) Transparent LED blinking array (No matter how transparent it is, transparency can not be reduced by itself.) It is possible to make transparency as much as possible after putting circuit (pattern) on the transparent film up to 97% As a result of our efforts to achieve color display products, the Patch-10 achieves close to 90% transparency (depending on the density of the product produced, how often the device is densely packed)

3) Easy to move with thin film structure (0.2mm transparency is known as a way to print circuit on film surface and attach LED chip. Flexible which is hot issue nowadays,

4) It is easy to attach and detach by adhesive surface. (It was the most important point when considering this technology.) So far, the media facade has been installed on large buildings, and most of them have been damaged by the basic design of the building. I have come to think that I can not simply fix the basic design of the building and install it firmly and firmly. I have developed a product with excellent adhesive strength and it has been contracted in anticipation of the shrinkage force that can occur during production and operation, In particular, it was made to cope sufficiently with the heat shrinkage force generated when the parts were bonded.

 It is possible to construct n x n type tiled system by connecting with unit module (16X16 = 196LED's). (In general metal cabinet type, although it is made by attaching several 16x16 module types, it is built up to 1m x 1m size. The width of one piece is limited, but the length can be made the same size as glass, so it is convenient to move and install.)

2 is a plan view illustrating an LED unit module according to an embodiment of the present invention. FIG. 3 is a cross-sectional view of a LED unit module according to an embodiment of the present invention. FIG. 4 is a photograph showing an LED electric signboard according to an embodiment of the present invention, and FIG. 5 is a photograph showing a connector of the LED unit module according to an embodiment of the present invention.

1 to 5, an LED display panel 110 according to an embodiment of the present invention includes a plurality of LED unit modules 120, 122, 124, 126, 128, and 130 connected in a tile form, And a controller 150.

The controller 150 may be connected to one or more LED unit modules 120, 122, 124, 126, 128, and 130 and may include a plurality of LED unit modules 120, 122, 124, 126, 128 , 130).

One LED unit module 120 includes a transparent film 140, a plurality of LEDs 142, first and second wirings 144 and 146, a plurality of connectors 148, an insulation pattern 152 ).

Specifically, the transparent film 140 may be made of a transparent polymer material such as polyethylene terephthalate (PET), polypropylene (PP), or polyimide (PI), and has a transmittance of 97% or more and a transmittance of 0.2 mm or less.

A first wiring 144 is formed on the transparent film 140. The first wiring 144 serves to connect the plurality of LEDs 142 and has a first width w1.

For example, the first wiring 144 may be formed of a metal material such as copper (Cu) or aluminum (Al), a transparent conductive material such as indium tin oxide (ITO), indium zinc oxide And may have a thickness of 0.3 mm or more, and a pad may be formed at an end of the first wiring 144.

An insulating pattern 152 is formed on the first wiring 144. The insulating pattern 152 serves to planarize the step of the first wiring 144. [

For example, the insulating pattern 152 may be formed of a resin that is cured with ultraviolet light (UV), and may be formed through a process of 130 degrees or less (preferably 110 degrees or less).

Particularly, the insulating pattern 152 is formed by first forming a first layer in a region (CLEAR region) between adjacent first wirings 144, forming a first layer formed first after forming the first wiring 144 and a first layer 144 The step of the first wiring 144 can be minimized by forming the second layer on top of the second wiring 144 so that the insulating pattern 152 has a multilayer structure.

By making the width of the insulation pattern 152 equal to or more than twice the width of the first wiring 144, the step of the first wiring 144 can be minimized.

A plurality of LEDs 142 are connected to the first wiring 144 exposed through the insulation pattern 152. The plurality of LEDs 142 may be miniaturized by applying a chip scale package.

A second wiring 146 is formed on the insulation pattern 152. The second wiring 146 serves to connect the plurality of LEDs 142 and the plurality of connectors 148. The first wiring 146 has a first width w1, And a second width (w2) smaller than the first width (w2).

For example, the second wiring 146 is made of a new material having a relatively high transmittance and relatively low resistance such as silver (Ag) nanoparticles, graphene, carbon nano tube (CNT) And may be connected to the first wiring 144 through the contact hole of the insulation pattern 152. [

Here, when silver (Ag) is used as the material of the second wiring 146, the content can be determined to be 60% or more, and the coating process can be improved.

The second wiring 146 may be formed through a printing method such as screen printing, may have a thickness of 0.3 mm or more, and may be formed through a process of 130 degrees or less (preferably 110 degrees or less) .

Particularly, in order to compensate for the shrinkage of the transparent film 140, the width of the first wiring 144 in the overlap region of the first and second wirings 144 and 146 is set to be larger than the width of the second wiring 146 6 to 7 times.

On the other hand, a circuit part such as an anti-static circuit or a signal amplification circuit may be formed on the transparent film 140. In the circuit part, the device can be connected using the second wiring 146 to improve the transmittance.

An upper portion of the transparent film 140 having the first and second wirings 144 and 146 and the insulating pattern 152 formed thereon is subjected to a parylene coating process so as to increase the withstand voltage and to have a waterproof function. .

A plurality of connectors 148 are formed at the edges of the transparent film 140 to contact the second wires 146. The plurality of connectors 148 are connected to the plurality of LEDs 144 through the first and second wires 144, And the plurality of LED unit modules 120, 122, 124, 126, 128, and 130 may be connected to each other through a plurality of connectors 148. [

Although not shown, an adhesive layer or an attracting plate may be formed on the back surface of the transparent film 140 to easily attach and detach it to a glass window used as an outer wall.

It will be apparent to those skilled in the art that various modifications and variations can be made in the present invention without departing from the spirit or scope of the invention as defined in the appended claims. It can be understood that

110: LED display board 120: LED unit module
140: Transparent film 142: Multiple LEDs
144, 146: first and second wirings 148: multiple connectors
152: Insulation pattern

Claims (10)

A plurality of LED unit modules connected in a tile form
/ RTI >
The plurality of LED unit modules include
A transparent film;
A first wiring formed on the transparent film;
An insulating pattern formed on the first wiring;
A plurality of LEDs contacting the first wiring;
A second wiring formed on the insulating pattern;
A plurality of connectors formed on edge portions of the transparent film and contacting the second wiring,
Lt; / RTI >
The first width of the first wiring is larger than the second width of the second wiring,
Wherein the first width is 6 to 7 times the second width in the overlap region where the second wiring is connected to the first wiring through the contact hole of the insulation pattern.
The method according to claim 1,
Wherein the transparent film is made of one of polyethylene terephthalate (PET), polypropylene (PP) and polyimide (PI), and has a thickness of 0.2 mm or less.
The method according to claim 2, wherein
The first wiring is made of one of copper (Cu), aluminum (Al), indium tin oxide (ITO), indium zinc oxide (IZO) .
The method of claim 3,
Wherein the insulating pattern is made of a photocurable resin and formed through a process of 130 degrees or less and has a width twice or more of the first width.
5. The method of claim 4,
Wherein the insulating pattern has a multilayer structure of a first layer formed in a region between the first wirings and a second layer formed over the first layer and the first wiring.
5. The method of claim 4,
Wherein the second wiring is formed of one of silver nanoparticles, graphene, and carbon nano tube (CNT), has a thickness of 0.3 mm or more, and is formed through a process of 130 degrees or less.
The method according to claim 6,
Wherein the second wiring is made of silver nanoparticles, and the content of the silver nanoparticles is 60% or more.
The method according to claim 6,
Wherein each of the plurality of LED unit modules further comprises an adhesive layer or an attracting plate formed on a back surface of the transparent film.
9. The method of claim 8,
Wherein an upper portion of the first and second wires and the transparent film on which the insulating pattern is formed is subjected to a perylene coating process.
10. The method of claim 9,
And a controller for driving the plurality of LED unit modules according to a preset program.

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