KR101928358B1 - Light emitting device package - Google Patents
Light emitting device package Download PDFInfo
- Publication number
- KR101928358B1 KR101928358B1 KR1020120047919A KR20120047919A KR101928358B1 KR 101928358 B1 KR101928358 B1 KR 101928358B1 KR 1020120047919 A KR1020120047919 A KR 1020120047919A KR 20120047919 A KR20120047919 A KR 20120047919A KR 101928358 B1 KR101928358 B1 KR 101928358B1
- Authority
- KR
- South Korea
- Prior art keywords
- light emitting
- light
- emitting device
- electrode
- lens
- Prior art date
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Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/42—Wire connectors; Manufacturing methods related thereto
- H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
- H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
- H01L2224/4805—Shape
- H01L2224/4809—Loop shape
- H01L2224/48091—Arched
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/15—Details of package parts other than the semiconductor or other solid state devices to be connected
- H01L2924/181—Encapsulation
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- Engineering & Computer Science (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Manufacturing & Machinery (AREA)
- Computer Hardware Design (AREA)
- Power Engineering (AREA)
- Led Device Packages (AREA)
Abstract
A light emitting device package according to an embodiment includes a body; A first electrode and a second electrode disposed on the body; A light emitting element disposed in the body and electrically connected to the first electrode and the second electrode; A molding part covering the light emitting element; And a lens positioned on the molding part, wherein the lens includes a light dispersing part for dispersing light generated from the light emitting element and a supporting part protruding from a lower periphery of the light dispersing part, Is thinner than the thickness in the boundary region with the light dispersing portion.
Description
An embodiment relates to a light emitting device package.
BACKGROUND ART Light emitting devices such as a light emitting diode (LD) or a laser diode using semiconductor materials of Group 3-5 or 2-6 group semiconductors are widely used for various colors such as red, green, blue, and ultraviolet And it is possible to realize white light rays with high efficiency by using fluorescent materials or colors, and it is possible to realize low energy consumption, semi-permanent life time, quick response speed, safety and environment friendliness compared to conventional light sources such as fluorescent lamps and incandescent lamps .
Therefore, a transmission module of the optical communication means, a light emitting diode backlight replacing a cold cathode fluorescent lamp (CCFL) constituting a backlight of an LCD (Liquid Crystal Display) display device, a white light emitting element capable of replacing a fluorescent lamp or an incandescent lamp Diode lighting, automotive headlights, and traffic lights.
1 is a side sectional view of a conventional light emitting device package.
The conventional light emitting device package may include a
The
The
The
1 (A), the thickness of the portion of the
This poor adhesion of the
The embodiment intends to improve the reliability of the light emitting device package.
A light emitting device package according to an embodiment includes a body; A first electrode and a second electrode disposed on the body; A light emitting element disposed in the body and electrically connected to the first electrode and the second electrode; A molding part covering the light emitting element; And a lens positioned on the molding part, wherein the lens includes a light dispersing part for dispersing light generated from the light emitting element and a supporting part protruding from a lower periphery of the light dispersing part, Is thinner than the thickness in the boundary region with the light dispersing portion.
The thickness of the support portion may gradually become thinner toward the edge region in the boundary region with the light dispersing unit.
The support may have a roughness on one side of the edge region.
The lens may include a phosphor.
The support portion may have a sloped side surface of the edge region.
The upper surface of the edge region may be an inclined surface.
The molding unit may include a phosphor.
The body includes a cavity having a side surface and a bottom surface, and the light emitting element may be positioned on a bottom surface of the cavity.
The side surface of the cavity may be inclined.
An adhesive may be positioned between the lens and the molding part.
A reflective layer may be formed on at least a part of the first electrode and the second electrode.
According to the embodiment, the stress with the body at the edge region of the lens is reduced, so that the adhesion failure of the lens is reduced, and the reliability of the light emitting device package can be improved.
1 is a side sectional view of a conventional light emitting device package.
2 is a side sectional view of a light emitting device package according to the first embodiment;
3 is a side sectional view of the light emitting device package according to the second embodiment.
4 is a side sectional view of a light emitting device package according to a third embodiment;
5 is a side sectional view of a light emitting device package according to a fourth embodiment;
6 is a side sectional view of a light emitting device package according to a fifth embodiment;
7 illustrates one embodiment of a process for attaching a lens to an array of light emitting device packages.
8 is a view illustrating an embodiment of a headlamp in which a light emitting device package according to an embodiment is disposed.
FIG. 9 is a diagram illustrating a display device in which a light emitting device package according to an embodiment is disposed.
DETAILED DESCRIPTION OF THE PREFERRED EMBODIMENTS Hereinafter, preferred embodiments of the present invention will be described with reference to the accompanying drawings.
In the description of the embodiment according to the present invention, in the case of being described as being formed "on or under" of each element, the upper (upper) or lower (lower) or under are all such that two elements are in direct contact with each other or one or more other elements are indirectly formed between the two elements. Also, when expressed as "on or under", it may include not only an upward direction but also a downward direction with respect to one element.
The thickness and size of each layer in the drawings are exaggerated, omitted, or schematically shown for convenience and clarity of explanation. Also, the size of each component does not entirely reflect the actual size.
2 is a side sectional view of the light emitting device package according to the first embodiment.
The light
The
A
The
The
The
The
The
A reflective layer (not shown) for reflecting the light generated from the
The light generated from the
The reflective layer is made of a material having a high reflectivity, and silver (Ag) may be coated on the first and
The
The
The
The phosphor may include a garnet-based phosphor, a silicate-based phosphor, a nitride-based phosphor, or an oxynitride-based phosphor.
For example, the garnet-base phosphor is YAG (Y 3 Al 5 O 12 : Ce 3 +) or TAG: may be a (Tb 3 Al 5 O 12 Ce 3 +), wherein the silicate-based phosphor is (Sr, Ba, Mg, Ca) 2 SiO 4 : Eu 2 + , and the nitride phosphor may be CaAlSiN 3 : Eu 2 + containing SiN, and the oxynitride phosphor may be Si 6 - x Al x O x N 8 -x: Eu may be a 2 + (0 <x <6 ), but not always limited thereto.
The light of the first wavelength range generated by the
The
The
The
The
When the
The
The
The
The light is uniformly dispersed at various angles by the
The width of the lower surface of the
The
The width of the
The supporting
Conventionally, the thickness of the support portion of the lens is relatively thick and uniform, and adhesion failure between the lens and the body frequently occurs particularly in the edge region.
The thickness d 2 of the
3 is a side sectional view of the light emitting device package according to the second embodiment.
The contents overlapping with the above embodiments will not be described again, and the differences will be mainly described below.
The light emitting
The
The thickness of the
3, the thickness of the supporting
4 is a side sectional view of the light emitting device package according to the third embodiment.
The contents overlapping with the above embodiments will not be described again, and the differences will be mainly described below.
The light emitting
The
The
The
The breaking process refers to a process in which a blade is not used, and both sides of the cut portion are gripped and pressure is applied to break the cut portion.
When the lens is separated into
According to the embodiment, since the
5 is a side sectional view of the light emitting device package according to the fourth embodiment.
The contents overlapping with the above embodiments will not be described again, and the differences will be mainly described below.
The light emitting
The
The thickness of the
The thickness of the
That is, since the adhesion of the
6 is a side sectional view of the light emitting device package according to the fifth embodiment.
The contents overlapping with the above embodiments will not be described again, and the differences will be mainly described below.
The light emitting
The
The thickness of the
6 shows a continuous slope from the
7 is a view showing an embodiment of a process of attaching a lens to an array of light emitting device packages.
Referring to FIG. 7, a
The
The
Hereinafter, a head lamp and a backlight unit will be described as an embodiment of an illumination system in which the above-described light emitting device package is disposed.
8 is a view showing an embodiment of a headlamp in which a light emitting device package according to an embodiment is disposed.
8, light emitted from the
FIG. 9 is a diagram illustrating a display device in which a light emitting device package according to an embodiment is disposed.
9, the
The light emitting module includes the above-described light
The
Here, the
The
The
In the
In the present embodiment, the
A liquid crystal display (LCD) panel may be disposed on the
In the
A liquid crystal display panel used in a display device is an active matrix type, and a transistor is used as a switch for controlling a voltage supplied to each pixel.
A
While the present invention has been particularly shown and described with reference to exemplary embodiments thereof, it is to be understood that the invention is not limited to the disclosed embodiments, but, on the contrary, This is possible.
Therefore, the scope of the present invention should not be limited to the described embodiments, but should be determined by the equivalents of the claims, as well as the claims.
100A to 100E: Light emitting device package 110: Body
121: first electrode 122: second electrode
130: light emitting element 140: molding part
150: lens 152:
154: support part 160: adhesive
210: light emitting device package array 220: mold
710: Light emitting module 720: Reflector
800: Display device 810: Bottom cover
820: reflector 840: light guide plate
850: first prism sheet 860: second prism sheet
870: Panel 880: Color filter
Claims (11)
A first electrode and a second electrode disposed on the body;
A light emitting element disposed in the body and electrically connected to the first electrode and the second electrode;
A molding part covering the light emitting element; And
And a lens positioned on the molding part,
Wherein the lens includes a light dispersing unit for dispersing light generated from the light emitting device and a support protruding from a lower periphery of the light dispersing unit,
Wherein the support portion includes a first region adjacent to the light scattering portion and a second region in an edge direction, the first region having a constant first thickness, the second region having a constant second thickness, Wherein the first thickness is greater than the second thickness.
Wherein the support portion has a roughness at the side of the edge region.
Wherein the lens comprises a phosphor.
And the width of the light dispersing portion corresponds to the width of the upper surface of the molding portion.
Wherein a width of the support portion corresponds to a width of an upper surface of the body.
Wherein the molding part comprises a phosphor.
Wherein the body includes a cavity having a side surface and a bottom surface, and the light emitting element is located on a bottom surface of the cavity.
And a side surface of the cavity is an inclined surface.
And an adhesive is disposed between the lens and the molding part.
And a reflective layer formed on at least a part of the first electrode and the second electrode.
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
KR1020120047919A KR101928358B1 (en) | 2012-05-07 | 2012-05-07 | Light emitting device package |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
KR1020120047919A KR101928358B1 (en) | 2012-05-07 | 2012-05-07 | Light emitting device package |
Publications (2)
Publication Number | Publication Date |
---|---|
KR20130124652A KR20130124652A (en) | 2013-11-15 |
KR101928358B1 true KR101928358B1 (en) | 2018-12-12 |
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Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
KR1020120047919A KR101928358B1 (en) | 2012-05-07 | 2012-05-07 | Light emitting device package |
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KR (1) | KR101928358B1 (en) |
Families Citing this family (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
CN118630121B (en) * | 2024-08-10 | 2024-11-08 | 南通东升灯饰有限公司 | LED (light-emitting diode) packaging body |
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2012
- 2012-05-07 KR KR1020120047919A patent/KR101928358B1/en active IP Right Grant
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KR20130124652A (en) | 2013-11-15 |
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