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KR101913855B1 - Transparent printed circuit board, manufacturing method thereof, led module using the same - Google Patents

Transparent printed circuit board, manufacturing method thereof, led module using the same Download PDF

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Publication number
KR101913855B1
KR101913855B1 KR1020150030328A KR20150030328A KR101913855B1 KR 101913855 B1 KR101913855 B1 KR 101913855B1 KR 1020150030328 A KR1020150030328 A KR 1020150030328A KR 20150030328 A KR20150030328 A KR 20150030328A KR 101913855 B1 KR101913855 B1 KR 101913855B1
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KR
South Korea
Prior art keywords
adhesive layer
circuit board
printed circuit
layer
metal layer
Prior art date
Application number
KR1020150030328A
Other languages
Korean (ko)
Other versions
KR20160108646A (en
Inventor
남충모
정인호
Original Assignee
제이디엠 주식회사
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Application filed by 제이디엠 주식회사 filed Critical 제이디엠 주식회사
Priority to KR1020150030328A priority Critical patent/KR101913855B1/en
Publication of KR20160108646A publication Critical patent/KR20160108646A/en
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Publication of KR101913855B1 publication Critical patent/KR101913855B1/en

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    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/03—Use of materials for the substrate
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L33/00—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
    • H01L33/48—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof characterised by the semiconductor body packages
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/03—Use of materials for the substrate
    • H05K1/0313—Organic insulating material
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/18—Printed circuits structurally associated with non-printed electric components
    • H05K1/181—Printed circuits structurally associated with non-printed electric components associated with surface mounted components
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/01—Dielectrics
    • H05K2201/0104—Properties and characteristics in general
    • H05K2201/0108—Transparent

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  • Engineering & Computer Science (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Manufacturing & Machinery (AREA)
  • Computer Hardware Design (AREA)
  • Power Engineering (AREA)
  • Led Device Packages (AREA)

Abstract

A transparent substrate; A first adhesive layer formed on the transparent substrate; A metal layer formed by patterning on the first adhesive layer; And a second adhesive layer formed on an upper portion of a region of the metal layer except for a region where the LED element is attached and on the first adhesive layer, and a transparent printed circuit board according to an embodiment of the present invention.

Description

TECHNICAL FIELD [0001] The present invention relates to a transparent printed circuit board, a method of manufacturing the same, and an LED module using the transparent printed circuit board,

The present invention relates to a transparent printed circuit board, a method of manufacturing the same, and an LED module using the same. More particularly, the present invention relates to a transparent printed circuit board used for a transparent display or the like, a method of manufacturing the same, and an LED module using the same.

Recently, the use range of LED devices has been expanded to various fields such as automobile headlights and displays as well as indoor and outdoor lighting. In particular, in the field of transparent displays, LED devices are widely used because of their great advantages in terms of processing speed and power consumption.

A printed circuit board for use in a transparent display must have excellent transparency in its role. When a transparent printed circuit board is produced according to a general printed circuit board manufacturing method, for example, a pressure-sensitive adhesive is applied between a PET (polyethylene terephthalate) substrate that can be used as a transparent substrate and a metal layer, A PET substrate, an adhesive layer and a metal layer are formed, and then the metal layer is patterned.

However, in this case, the surface of the adhesive layer, which is in contact with the metal layer, is also uneven due to the surface unevenness of the metal layer, and accordingly, the completed transparent printed circuit board is formed according to the unevenness of the surface of the adhesive layer exposed so that the metal layer is not formed by patterning The transparency can not be secured.

Also, the LED package may be manufactured by mounting an LED element on a substrate using transparent PEN (Polyethylene Naphthalate) used as a transparent printed circuit board. However, the high unit price of PEN also raises the production cost of the LED display module .

Accordingly, there is a need for an effective method for reducing the production cost while securing transparency of the LED module for display.

A transparent printed circuit board, a method of manufacturing the same, and an LED module using the transparent printed circuit board according to an embodiment of the present invention are intended to ensure transparency of a transparent printed circuit board and an LED module.

Also, a transparent printed circuit board, a method of manufacturing the same, and an LED module using the transparent printed circuit board according to an embodiment of the present invention are intended to reduce the production cost of a transparent printed circuit board and an LED module.

According to an aspect of the present invention, there is provided a transparent printed circuit board,

A transparent substrate; A first adhesive layer formed on the transparent substrate; A metal layer formed by patterning on the first adhesive layer; And a second adhesive layer formed on an upper portion of a region of the metal layer excluding a region where the LED element is attached and an upper portion of the first adhesive layer.

The transparent substrate may include a heat resistant PET (polyethylene terephthalate) substrate.

The metal layer may include a Cu layer.

The first adhesive layer may have a thickness of 17.5 to 100 탆.

The transparent printed circuit board may further include a conductive layer formed on an upper portion of the metal layer to which the LED element is attached.

A transparent printed circuit board according to claim 5; And an LED element connected to the conductive layer by a low temperature solder bump.

According to another aspect of the present invention, there is provided a method of manufacturing a transparent printed circuit board,

Forming a first adhesive layer by applying a pressure-sensitive adhesive on a transparent substrate; Forming a metal layer on the first adhesive layer; Etching the metal layer to pattern the metal layer; And forming the second adhesive layer by applying the adhesive on the upper portion of the region except the region where the LED element is attached and the upper portion of the first adhesive layer among the patterned metal layers.

The transparent printed circuit board, the method of manufacturing the same, and the LED module using the transparent printed circuit board according to an embodiment of the present invention can ensure the transparency of the transparent printed circuit board and the LED module.

In addition, the transparent printed circuit board, the method of manufacturing the same, and the LED module using the transparent printed circuit board according to an embodiment of the present invention can reduce the production cost of the transparent printed circuit board and the LED module.

1 is a view showing a transparent printed circuit board according to an embodiment of the present invention.
2 is an enlarged view of the area A in Fig.
3 is a plan view of a transparent printed circuit board according to an embodiment of the present invention.
4 is a view showing an LED module according to another embodiment of the present invention.
5 is a flowchart illustrating a method of manufacturing a transparent printed circuit board according to an embodiment of the present invention.
6 is a detailed view illustrating a manufacturing process of a transparent printed circuit board according to an embodiment of the present invention.

BRIEF DESCRIPTION OF THE DRAWINGS The advantages and features of the present invention and the manner of achieving them will become apparent with reference to the embodiments described in detail below with reference to the accompanying drawings. The present invention may, however, be embodied in many different forms and should not be construed as limited to the embodiments set forth herein. Rather, these embodiments are provided so that this disclosure will be thorough and complete, and will fully convey the scope of the invention to those skilled in the art. To fully disclose the scope of the invention to those skilled in the art, and the invention is only defined by the scope of the claims. Like reference numerals refer to like elements throughout the specification.

FIG. 1 is a view showing a transparent printed circuit board 100 according to an embodiment of the present invention. FIG. 2 is an enlarged view of region A of FIG. 1, and FIG. 3 is a cross- A plan view of the circuit board 100;

1, a transparent printed circuit board 100 according to an exemplary embodiment of the present invention includes a transparent substrate 110, a first adhesive layer 120, a metal layer 130, and a second adhesive layer 140 .

The transparent substrate 110 may include a heat-resistant PET (polyethylene terephthalate) substrate that does not melt to about 180 °. Since the transparent printed circuit board 100 according to an embodiment of the present invention uses heat-resistant PET other than the conventional PEN, the production cost of the transparent printed circuit board 100 can be reduced. In addition, since general PET has a melting point of low temperature, the transparent printed circuit board 100 according to the present invention can be made of heat-resistant PET having a melting point of about 180 캜.

The first adhesive layer 120 is formed on the transparent substrate 110 and the metal layer 130 and the transparent substrate 110 are bonded to each other through the first adhesive layer 120. The transparent substrate 110, the first adhesive layer 120, and the metal layer 130 may be pressed together by a roller or the like while being attached to each other in a sheet form. When heat-resistant PET of approximately 188 mu m is used, the first adhesive layer 120 may be formed to a thickness of 17.5 to 100 mu m.

The metal layer 130 formed on the first adhesive layer 120 is patterned by an etching process using, for example, a photoresist. The metal layer 130 may serve as an electric wiring for transmitting electric power to the LED device. The metal layer 130 may include copper (Cu), but is not limited thereto. For example, the metal layer 130 may include nickel (Ni) having excellent electrical conductivity.

2, when the transparent substrate 110, the first adhesive layer 120, and the metal layer 130 are pressed together by a roller or the like while being attached to each other, the first adhesive layer 120 may be uneven or rugged. This is caused by the non-uniformity of the surface of the metal layer 130. In the case of an ordinary printed circuit board, the surface of the patterned metal layer is smoothly formed through a process such as planarization. However, when PET is used as a substrate as in the case of the present invention, it is difficult to perform a planarization operation. Therefore, after the metal layer 130 is patterned, the upper surface of the rugged first adhesive layer that does not cover the metal layer 130 may be exposed, and such uneven surface may adversely affect the transparency of the entire transparent printed circuit board I can go crazy.

Therefore, according to the present invention, a second adhesive layer 140 having the same composition as that of the first adhesive layer 140 is formed on the first adhesive layer 120, and the first adhesive layer 140 120 are not present. As shown in FIG. 3, the second adhesive layer 140 may be formed on the upper portion of the first adhesive layer 120 and the upper portion of the metal layer 130 excluding the region where the LED elements are attached. The second adhesive layer 140 may be applied by an electronic printing method to a liquid adhesive.

The second adhesive layer 140 ensures transparency of the transparent printed circuit board 100 as described above and at the same time prevents a part of the metal layer 130 exposed to the outside of the transparent printed circuit board 100 from being worn It protects it.

Referring back to FIG. 1, the conductive layer 170 may be formed on the upper portion of the region of the metal layer 130 where the LED element is located. The conductive layer 170 is used to increase the amount of light entering and exiting the LED device, and may include, for example, a nickel (Ni) layer and a gold (Au) layer.

4 is a view showing an LED module 400 using a transparent printed circuit board according to another embodiment of the present invention.

The LED element 150 may be located on top of the metal layer 130 shown in FIG. The LED element 150 may be connected to each other via a pair of metal layers 130 and a solder bump 160 at an upper portion of the pair of metal layers 130. [

The LED element 150 may be connected to the metal layer 130 or the conductive layer 170 through the solder bump 160. The solder bump 160 may include Sn solder bumps at a low temperature. A typical Sn solder bump has a melting point of about 240 캜. As described above, when heat-resistant PET is used as a transparent substrate, the melting point of the heat-resistant PET is about 180 캜. Therefore, when the LED device 150 is welded using a general Sn solder bump, there is a risk that the heat-resistant PET is crushed or melted. Therefore, the solder bump 160 according to the present invention has a low temperature Sn It is preferable to include solder bumps.

5 is a flowchart showing a method of manufacturing a transparent printed circuit board 100 according to another embodiment of the present invention.

In step S510, a first adhesive layer 120 is formed on the transparent substrate 110. [ In step S520, a metal layer 130 is formed on the first adhesive layer 120. [ The transparent substrate 110, the first adhesive layer 120, and the metal layer 130 may all be provided in the form of a sheet and pressed together by a roller or the like.

In step S530, the patterned metal layer 130 is formed on the metal layer 130 through an etching process using photoresist. .

In step S540, an adhesive layer is formed on an upper portion of the patterned metal layer 130 excluding the region to which the LED element 150 is to be attached and on the first adhesive layer 120, A second adhesive layer 140 is formed by applying an adhesive agent of the same material as the material of the first adhesive layer 120 by an electronic printing method so that a rough uneven surface does not exist on the upper surface.

The LED device 150 may be connected to the patterned metal layer 130 through the solder bumps 160 in order to manufacture the LED module 400. [

Hereinafter, a manufacturing process of the transparent printed circuit board 100 according to an embodiment of the present invention will be described in detail with reference to FIG.

6 is a view showing in detail a manufacturing process of a transparent printed circuit board 100 according to another embodiment of the present invention.

A first adhesive layer 120 is formed on the transparent substrate 110 and a metal layer 130 is formed on the first adhesive layer 120 as shown in FIG.

The transparent substrate 110, the first adhesive layer 120, and the metal layer 130 are all provided in the form of a sheet and then pressed together with a roller or the like. In this case, the transparent substrate 110 has a thickness of 188 탆, The first adhesive layer 120 may have a thickness of 17.5 탆 to 100 탆. The adhesive material constituting the first adhesive layer 120 may include rubber, acrylic, silicone or urethane adhesive.

Thereafter, a photosensitive agent layer 710 of a metal layer 130 pattern is formed on the photosensitive agent through a mask corresponding to the pattern of the metal layer 130 and the photosensitive layer 710 of the metal layer 130 is formed of a developer (see FIG. 6 (b) The metal layer 130 corresponding to the pattern of the mask is formed by performing an etching process on the upper surface of the metal layer 130 of the metal layer 130 after the etching process and removing the photosensitive layer 710 ) Reference). In this case, as shown in FIG. 6 (c), the surface of the first adhesive layer 120 exposed to the outside other than the patterned metal layer 130 is unevenly rugged.

6 (d), an area of the metal layer 130 excluding the area where the LED element 150 is mounted and the upper portion of the first adhesive layer 120 are printed electronically with a liquid pressure-sensitive adhesive A second adhesive layer 140 is formed. The second adhesive layer uses a pressure sensitive adhesive having the same composition as the pressure sensitive adhesive of the first pressure sensitive adhesive layer, so that the first adhesive layer and the second adhesive layer finally form one integrated pressure sensitive adhesive layer. However, the second adhesive layer 40 is also formed on a part of the upper surface of the patterned metal layer 130 where the LED element 150 is not connected.

Thereafter, as shown in FIG. 6E, a conductive layer 170 (including a Ni layer of about 3 um and an Au layer of about 0.3 um) is formed on the region to which the LED element 150 is connected by the electroless plating method ).

When the conductive layer 170 is formed, a transparent display module can be completed by connecting the conductive layer 170 and the LED device with a low-temperature Sn solder bump using a mask, in order to fabricate the LED module 400.

The transparent printed circuit board, the method of manufacturing the same, and the LED module using the transparent printed circuit board according to an embodiment of the present invention can ensure the transparency of the transparent printed circuit board and reduce the production cost of the transparent printed circuit board.

While the present invention has been described in connection with what is presently considered to be practical exemplary embodiments, it is to be understood that the invention is not limited to the disclosed embodiments, but, on the contrary, It will be understood. It is therefore to be understood that the above-described embodiments are illustrative in all aspects and not restrictive.

100: transparent printed circuit board
110: transparent substrate
120: first adhesive layer
130: metal layer
140: Second adhesive layer
150: LED element
160: Solder bump
170: Conductive layer
400: LED module

Claims (12)

delete delete delete delete delete delete Forming a first adhesive layer by applying a pressure-sensitive adhesive on a transparent substrate;
Forming a metal layer on the first adhesive layer;
Pressing the metal layer formed on the first adhesive layer;
Etching the metal layer to pattern the metal layer; And
And forming a second adhesive layer by coating the adhesive on the upper portion of the region except the region where the LED element is attached and the upper portion of the first adhesive layer among the patterned metal layers,
Wherein the first adhesive layer and the second adhesive layer are in contact with each other in a part of the region of the first adhesive layer.
8. The method of claim 7,
Wherein the transparent substrate comprises:
And a heat-resistant PET (polyethylene terephthalate) substrate.
8. The method of claim 7,
The metal layer may include,
Cu layer on the transparent printed circuit board.
8. The method of claim 7,
Wherein the forming of the first adhesive layer comprises:
And forming the first adhesive layer to a thickness of 17.5 to 100 mu m.
8. The method of claim 7,
A method of manufacturing a transparent printed circuit board,
Further comprising forming a conductive layer on an upper portion of a region of the metal layer where the LED element is to be attached.
12. The method of claim 11,
A method of manufacturing a transparent printed circuit board,
Further comprising the step of connecting the conductive layer and the LED element with a low-temperature solder bump.
KR1020150030328A 2015-03-04 2015-03-04 Transparent printed circuit board, manufacturing method thereof, led module using the same KR101913855B1 (en)

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Application Number Priority Date Filing Date Title
KR1020150030328A KR101913855B1 (en) 2015-03-04 2015-03-04 Transparent printed circuit board, manufacturing method thereof, led module using the same

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Application Number Priority Date Filing Date Title
KR1020150030328A KR101913855B1 (en) 2015-03-04 2015-03-04 Transparent printed circuit board, manufacturing method thereof, led module using the same

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KR101913855B1 true KR101913855B1 (en) 2018-11-23

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Families Citing this family (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
KR102091912B1 (en) * 2017-11-20 2020-04-28 한국산업기술대학교산학협력단 Flexible printed circuit board and display system including the same
KR102721329B1 (en) 2019-03-27 2024-10-23 주식회사 엘지화학 Transparent light emitting device display
KR102490505B1 (en) * 2022-05-13 2023-01-19 주식회사 루미디아 Transpaparent glass display substrate, transpaparent led display device and method for fabricating the same

Citations (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2006210916A (en) * 2005-01-25 2006-08-10 Shogen Koden Kofun Yugenkoshi Light emitting device
JP2007158181A (en) 2005-12-07 2007-06-21 Highlight Optoelectronics Inc Structure of light emitting diode, and manufacturing process thereof

Family Cites Families (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
KR20140118042A (en) * 2013-03-28 2014-10-08 서울바이오시스 주식회사 Light emitting diode and lighting device employing the same
KR20140142026A (en) * 2013-06-03 2014-12-11 삼성디스플레이 주식회사 Laminating Film and Substrate Laminated Appratus and Method of Manufacturing Organic Light Emitting Display Apparatus Using thereof

Patent Citations (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2006210916A (en) * 2005-01-25 2006-08-10 Shogen Koden Kofun Yugenkoshi Light emitting device
JP2007158181A (en) 2005-12-07 2007-06-21 Highlight Optoelectronics Inc Structure of light emitting diode, and manufacturing process thereof

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