KR101881720B1 - Semiconductor device case with multi function, material management system using the same, and method thereof - Google Patents

Abstract

The present invention relates to a material management system and a method thereof using a semiconductor element case having multi-functions capable of counting the number of used or remaining semiconductor elements by providing a counting function to a case containing numerous semiconductor elements when manufacturing a semiconductor assembly as well as reading the history of each semiconductor element to minimize the defect rate of the semiconductor elements and the semiconductor assembly and rapidly replace a defective semiconductor element by providing an RFID tagging function and the like. According to the present invention, the material management system comprises at least one semiconductor element case for transmitting RFID tag information in a low-power Bluetooth manner, an administrator mobile device for inquiring manufacturing precautions and semiconductor element manufacturing process information based on the RFID tag information, and a semiconductor element and an assembly management server which are connected to the administrator mobile device through a network and store information about manufacturing precautions and manufacturing processes of the semiconductor elements.

Description

BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a material management system using a semiconductor element case having a multi-

BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a system and a method for managing a material using a semiconductor element case having a multi-function, and more particularly, Counting function can be used to count the number of remaining semiconductor devices, and RFID tagging function can be provided to browse the history of each semiconductor device to minimize the defective rate of semiconductor devices and semiconductor assemblies, And more particularly, to a material management system using a semiconductor device case having a multi function and a method thereof.

In order to manufacture a semiconductor device, a high degree of precision is required. Accordingly, in a conventional semiconductor device production line, a high-performance factory facility capable of precision processing is arranged to perform a semiconductor device manufacturing process.

At the same time, the operator observes the operation status of each facility closely through the management system of the semiconductor device manufacturing facility, thereby improving the line work efficiency, and is now being automated.

On the other hand, it is known that the semiconductor device manufactured in this way is formed by synthetic resin before the transportation, inspection, and use, and the semiconductor device is housed mainly using synthetic resin.

Korean Patent Application No. 10-1986-0004108 Korean Patent Laid-Open Publication No. 10-1996-0019642

SUMMARY OF THE INVENTION The present invention has been made to solve the above-mentioned problems, and it is an object of the present invention to provide a semiconductor device and a method of manufacturing the semiconductor device, The present invention provides a material management system using the semiconductor element case having a multi function and a method thereof.

In addition, the present invention provides a multi-function semiconductor device case having a multi-function case for minimizing the defect rate of semiconductor devices and semiconductor assemblies by reading the history of each semiconductor device by providing an RFID tagging function or the like, Management system and method therefor.

In addition, the present invention can quickly search for a semiconductor device case having a multi-function case using Bluetooth communication, and it is possible to search for a semiconductor device manufacturing process, an RFID tag manufacturing process, and a semiconductor assembly manufacturing process by a management server The present invention provides a material management system using the semiconductor device case having a multi function and a method thereof.

According to an aspect of the present invention, there is provided an RFID tag comprising: at least one semiconductor element case for transmitting RFID tag information in a low-power Bluetooth manner; A manager mobile device for inquiring process information, a semiconductor device and an assembly management server, which are connected to the manager mobile device through a network and store manufacturing instructions and semiconductor device manufacturing process information, The semiconductor element case includes a case body for holding the semiconductor element, a loss prevention wire connected to the case body, a cover type upper body connected to the loss prevention wire, A dial counter for transmitting a count signal, An RFID identifier in which the information is stored, and an ID board for recognizing the use of 1000 semiconductor elements when the count signal is changed from '9 9 9' to '0 0 0' to generate an alarm signal And a Bluetooth module for transmitting the RFID tag information and the alarm signal to the administrator mobile device.

The configuration of the present invention is characterized in that the manufacturing process information of the semiconductor device described above includes PLC (Programmable Logic Controller) driving data of a factory facility at the time of manufacturing a semiconductor device, video data photographed from a CCTV connected to the factory facility operating state photographing, Real-time temperature / humidity data for the plant facility from the temperature / humidity sensor, and hazardous substance data generated from the gas sensor at the plant facility, and the PLC drive data includes the plant operation stoppage corresponding to the identification ID, , Data generated by a control command for performing a previous process iteration or skipping a subsequent process.

The constitution of the present invention is characterized in that the inner surface of the case body is divided into a "molded product" and a "fiber material", and the "fiber material" And 70 to 80 wt% of paraffin oil, 14 to 20 wt% of styrene-ethylene-propylene tri-block copolymer resin as thermoplastic resin, 5 to 10 wt% of hydrogenated resin % Of an antioxidant, and 1 to 2% by weight of an antioxidant.

In the configuration of the present invention, when the RFID tag is connected to one port of the RFID tag and the cover-type upper body is separated from the case body while being extended through the loss prevention wire, the RFID tag It is preferable to recognize the RFID tag of the RFID tag type semiconductor element by the tag type for the RFID identifier inside the cover type upper body for the RFID tag type semiconductor element with the tag attached thereto.

According to the configuration of the present invention, the above-mentioned adunone board transmits the RFID tag information to the administrator mobile device in a low-power Bluetooth manner by controlling the Bluetooth module, It is desirable to inquire the assembly management server so as to be able to confirm the manufacturing precautions and the manufacturing process information of the semiconductor device with respect to the RFID tag type semiconductor device.

As a means for achieving the above object, the construction of the method of the present invention is characterized in that a semiconductor device and an assembly management server each comprise a semiconductor device (m is a natural number of 2 or more) The method comprising the steps of: receiving manufacturing process information on a device, storing the identification information of each device in a DB, matching the identification ID of the device, and serial number of the device; The serial number of the semiconductor device and the manufactured factory equipment identification ID are provided to manufacture the RFID tag and provide the RFID tag to the factory facility corresponding to the factory equipment identification ID so that the RFID tag type semiconductor device as the semiconductor device with the RFID tag attached is controlled A semiconductor device and an assembly management server accessing an administrator mobile device via a network, Performing authentication for the administrator mobile device in accordance with a request from the administrator mobile device; and controlling the semiconductor device and the assembly management server to transmit the RFID tag information to the semiconductor device on which the RFID tagging is performed on the semiconductor device case having multi- Extracting a serial number of the semiconductor device from the RFID tag information after receiving the RFID tag information, and providing manufacturing process information matched with the serial number extracted by the semiconductor device and the assembly management server to the manager mobile device via the network .

A semiconductor device case having a multi-function according to an embodiment of the present invention, a material management system using the same, and a method thereof are characterized in that when a semiconductor assembly is manufactured using diodes, transistors, and semiconductor elements therein, Function to provide the effect of counting the number of semiconductor devices used or remaining inside.

Also, a semiconductor device case having a multi-function according to another embodiment of the present invention, a material management system using the same, and a method thereof may provide an RFID tagging function and the like to browse the history of each semiconductor device, It provides the effect of minimizing the defect rate and enabling quick replacement in case of failure.

In addition, a semiconductor device case having a multi-function according to another embodiment of the present invention, a material management system using the same, and a method thereof can search quickly using Bluetooth communication when managing a semiconductor device case having multi functions And provides an effect of collectively managing the manufacturing process of the semiconductor device, the RFID tag manufacturing process, and the semiconductor assembly manufacturing process by the management server.

1 is a block diagram of a material management system using a semiconductor device case having multi functions according to an embodiment of the present invention.
2 is a perspective view showing a semiconductor device case in a material management system using a semiconductor device case having multi functions according to an embodiment of the present invention.
3 is a view illustrating components formed on a cover-type upper body of a semiconductor device case having multi functions according to an embodiment of the present invention.
4 is a configuration block diagram of a semiconductor device and an assembly management server of a material management system using a semiconductor device case having multi functions according to an embodiment of the present invention.
FIG. 5 is a flowchart illustrating a method of managing a material using a semiconductor device case having a multi-function according to an exemplary embodiment of the present invention.

DETAILED DESCRIPTION OF THE PREFERRED EMBODIMENTS Hereinafter, a detailed description of preferred embodiments of the present invention will be given with reference to the accompanying drawings. In the following description of the present invention, detailed description of known functions and configurations incorporated herein will be omitted when it may make the subject matter of the present invention rather unclear.

In the present specification, when any one element 'transmits' data or signals to another element, the element can transmit the data or signal directly to the other element, and through at least one other element Data or signal can be transmitted to another component.

1 is a block diagram of a material management system using a semiconductor device case having multi functions according to an embodiment of the present invention.

1, the structure of a material management system using a multi-function semiconductor device case according to an exemplary embodiment of the present invention includes at least one semiconductor element case 100 for transmitting RFID tag information in a low- A manager mobile device 200 for inquiring manufacturing precautions and semiconductor device manufacturing process information based on the RFID tag information, and a management server 200 for connecting to the manager mobile device 200 through the network 300 And a semiconductor device and an assembly management server 400 in which manufacturing precautions and semiconductor device manufacturing process information are stored.

FIG. 2 is a perspective view showing a semiconductor device case in a material management system using a semiconductor device case having a multi-function according to an embodiment of the present invention. FIG. 3 is a perspective view of a semiconductor device having a multi- Fig. 7 is a view showing components formed in the cover-type upper body of the element case. Fig.

2 and 3, the semiconductor device case 100 in the material management system using the multi-function semiconductor device case according to an embodiment of the present invention includes a case body (not shown) A cover-type upper body 110 connected to the loss prevention wire 150, a cover-type upper body 110 connected to the case body 140, A dial counter 120 which is formed in the RFID tag 110 and transmits a count signal, an RFID identifier 180 in which RFID tag information is stored, and a count signal of '9 9 9' to '0 0 0' The RFID tag information and the alarm signal are transmitted to the manager mobile device 200. The RFID tag information and the alarm signal are transmitted to the manager mobile device 200 through the Bluetooth It comprises a module (170).

The outer circumferential surface of the fastening end 130 formed on the cover type upper body 110 and the inner circumferential surface of the case body 140 can be brought into contact with each other to be fastened .

The inner surface of the case body 140 is divided into a "molded body" and a "fiber material." The "fiber material" includes a reinforcing layer formed by connecting fibers formed of thermosetting synthetic fibers between carbon fibers and reinforcing fibers And 70 to 80% by weight of paraffin oil, 14 to 20% by weight of a styrene-ethylene-propylene tri-block copolymer resin as a thermoplastic resin, 5 to 10% by weight of a hydrogenated resin, And 1 to 2% by weight of an anti-shock agent.

In case that at least n (n is a natural number of 1000 or more) diodes, transistors, pseudodemiconductor elements, etc. are put into the inside of the case body 140 and then the semiconductor device is taken out during the semiconductor device manufacturing process, 110 may count the number written through the dial counter 120.

The loss prevention wire 150 may be formed in the upper end region of the fastening end 130 of the cover type upper body 110 by one first fastening hole and the upper end region of the case body 140 between the other fastening holes So that loss of the cover-type upper body 110 due to separation from the case body 140 can be prevented.

The cover-type upper body 110 is formed in a cylindrical shape having a bottom surface opened. The dial counter 120 is provided on an upper surface of the cover-type upper body 110. The lower end of the cover body 110 is fastened to the case body 140, The fastening end 130 is formed.

The dial counter 120 may include a first dial 121 in the 1-digit unit, a second dial 122 in the 10-digit unit, a third dial 123 in the 100-digit unit, and an operation lever 124 have. More specifically, in the dial counter 120, the first to third dials 121, 122, and 123 having the numbers 0 to 9 engraved at regular intervals in the circumferential direction have the same center rotation axis . The count signal can be transmitted to the adonaboard 160 by the switch S / W connected to the port of the adonaboard 160 according to the operation of the operation lever 124.

The above-described arduino board 160 can control the first rotation drive stage 121a, the second rotation drive stage 122a, and the third rotation drive stage 123a connected to respective ports in accordance with the count signal have. Here, the first rotation driving stage 121a to the third rotation driving stage 123a are rotatable cylinders formed on the sides of the first dial 121 to the third dial 123, respectively, And a motor.

Here, the first rotation driving part 121a to the third rotation driving part 123a, the other ID board 160, the Bluetooth module 170, and the RFID identifier 180 are disposed on the outer side of the cover- Which is fixed to the inner upper end region of the cover-type upper body 110 and is finished by a lattice-like or lattice-like panel in the form of an inner partition wall.

With this constitution, the adonaboard 160 can display the dial counter 120 in the default state of the first to third dials 121, 122 and 123 according to the operation of the operation lever 124, And controls the first rotation driving stage 121a to display '0 0 1' from the number '0 0 0'.

In the same manner, when the number of the external display boards of the dial counter 120 is changed from '9 9 9' to '0 0 0' according to the operation of the operation lever 124, And transmits the alarm signal to the manager mobile device 200 through the Bluetooth module 170. The manager mobile device 200 transmits the alarm signal through the network 300 to the semiconductor device and / To the assembly management server 400.

In addition, the RFID tag 160 is connected to the RFID identifier 180 in one port, so that the cover-type upper body 110 is separated from the case body 140 while extending through the loss prevention wire 150 The RFID tag type semiconductor device with the RFID tag inside the case body 140 can be tagged to the RFID identifier 180 inside the cover type upper body 110, Can be recognized.

Accordingly, the adouno board 160 controls the Bluetooth module 170 to transmit the recognized RFID tag information to the administrator mobile device 200 in a low-power Bluetooth manner, and the RFID tag information The RFID tag type semiconductor element can be checked by referring to the semiconductor element and the assembly management server 400 through the network 300 for the RFID tag type semiconductor element. The administrator mobile device 200 may be a terminal operated by a process operator of a semiconductor assembly manufacturing process using an RFID tag type semiconductor device.

In addition, the manufacturing process information of the semiconductor device described above includes PLC (Programmable Logic Controller) driving data of a factory facility at the time of manufacturing a semiconductor device, video data photographed from a CCTV connected to the factory facility operating state photographing, Real-time temperature / humidity data for the plant facility, and hazardous substance data generated at the plant facility from the gas sensor. The PLC drive data may be data indicating that the plant is shut down, the plant is restarted, The data may be any one of data generated by a control command for skipping a process, and the PLC driving of the present invention may be changed to correspond to a predetermined manual.

Further, the additional information of the semiconductor device manufacturing process information may be malfunction event information or line status event information including an identification ID corresponding to the factory equipment when the factory equipment performs operations other than predetermined operations.

Accordingly, the manager mobile device 200 receives the PLC driving data, the image data, the temperature / humidity data, and the hazardous material data for each of the factory facilities of the RFID tagged identification device, Type history of the manufacturing process can be read and the operation information of the semiconductor device includes the malfunction event information or the line status event information and if an error occurs during the test process after the semiconductor assembly manufacturing process, Information or line status event information can be utilized to facilitate the replacement of semiconductor elements.

That is, according to the present invention, a plurality of semiconductor elements produced in each process facility are placed in a semiconductor element case 100 having a multi-function, and the semiconductor elements are assembled into a semiconductor assembly manually or automatically To the manufacturing process of the semiconductor device, it is possible to reduce the defect rate of the finally produced semiconductor assembly and to manage replacement easily.

Meanwhile, the manager mobile device 200, which groups and manages the semiconductor device cases 100 through the identification numbers of the semiconductor device cases 100, performs BLE beacon-based collision avoidance and power- Consumption reduction method can be used. That is, the semiconductor device case 100 having the multi-functions distributed around the manager mobile device 200 automatically performs an operation-off operation to minimize BLE-addressing data collision. More specifically, the Bluetooth module 170 of the semiconductor device case 100 performs the first BLE Advertising for a preset time, and then the first BLE Advertising (BLE Advertising) A low power sleeping mode or power source that generates a random number that is a random number with a uniform distribution between each set minimum time and maximum time and then does not perform BLE ad- Off state for shutting off the power supply.

On the other hand, the Bluetooth module 170 of the semiconductor device case 100 having the other multi function also has a function for the operation off state of the Bluetooth module 170 of the semiconductor device case 100 having the above- The manager mobile device 200 performs BLE adbiting for the administrator mobile device 200 for a preset time and then maintains the operation off state for the generated random number time in the same manner, The process performed by the Bluetooth module 170 of the semiconductor device case 100 having another multi function is the same.

In this manner, all of the Bluetooth modules 170 within the area where the plurality of Bluetooth modules 170 are concentrated can perform BLE adverting evenly within a preset minimum time and maximum time.

4 is a configuration block diagram of a semiconductor device and an assembly management server of a material management system using a semiconductor device case having multi functions according to an embodiment of the present invention.

4, a semiconductor device and assembly management server 400 of a material management system using a semiconductor device case having a multi function according to an embodiment of the present invention includes a transmission / reception unit 410, a control unit 420 and a DB 430. The control unit 420 includes a semiconductor device manufacturing process management module 421, a semiconductor assembly manufacturing process management module 422, a semiconductor device counting module 423, .

The semiconductor device manufacturing process management module 421 includes PLC (Programmable Logic Controller) driving data for each semiconductor device fabricated from each of m (m is a natural number of 2 or more) factory facilities for manufacturing a semiconductor device, Real-time temperature / humidity data for factory facilities from the temperature / humidity sensor at the time of the process, hazardous substance data generated at the factory facility from the gas sensor, other malfunction event information, line status Reception unit 410 to receive the manufacturing process information corresponding to the event information through the network 300 and then store the identification ID and the serial number of the semiconductor device in the DB 430 .

Then, the semiconductor device manufacturing process management module 421 provides the serial number of each semiconductor device stored in the DB 430 to the RFID tag manufacturing facility through the network 300, And provides the RFID tag to a factory facility corresponding to the factory facility identification ID to control the transmitting / receiving unit 410 so that the RFID tag type semiconductor device is manufactured. Accordingly, the RFID tag information stored in the RFID tag attached to the RFID tag type semiconductor element may be the serial number for each semiconductor element, and the manufactured factory identification ID.

The semiconductor assembly manufacturing process management module 422 performs authentication for the administrator mobile device 200 according to an access request of the administrator mobile device 200 through the transceiver 410. [

Thereafter, the semiconductor assembly manufacturing process management module 422 receives the RFID tag information from the manager mobile device 200 on the semiconductor device 100 having the multi-function on the RFID tagged semiconductor device, The serial number of the semiconductor device is extracted. The semiconductor assembly manufacturing process management module 422 transmits PLC drive data, image data, temperature / humidity data, and hazardous substance data for each identification ID of each factory facility, which is manufacturing process information matching with the extracted serial number, The controller 410 controls the transmission / reception unit 410 to transmit the data to the administrator mobile device 200, thereby monitoring the feedback type for each semiconductor device, thereby providing a manufacturer's normal history browsing.

On the other hand, when the semiconductor assembly manufacturing process management module 422 receives an error occurrence notification from the administrator mobile device 200 after the semiconductor assembly manufacturing process through the network 300 together with the RFID tag information, Reception unit 410 to transmit malfunction event information or line status event information to the administrator mobile device 200 through the network 300 when analyzing whether there is malfunction event information or line status event information in the process information The replacement of the semiconductor element can be carried out with ease. Here, the malfunction event information is information generated when the factory facility performs an operation other than the predetermined operation according to the monitoring of each factory facility itself, and the line status event information is transmitted to the factory facility through the line sensor of the factory facility, It may be the information generated when the factory facility detects that the manufactured product is deviating from the preset line.

The above-described semiconductor element counting module 423 includes a semiconductor element counting module 422 having a multi-function packaging function (not shown) The case number of the semiconductor device 100 and the number of semiconductor elements contained therein can be received and stored in the DB 430. When the RFID tag type semiconductor elements are also packaged together, Lt; / RTI >

Thereafter, the semiconductor device counting module 423 counts the number of the semiconductor devices 100 for each of the semiconductor device cases 100 having the multi-functions managed by the administrator mobile device 200 for the administrator mobile device 200 via the network 300. [ And controls the transmitting / receiving unit 410 to receive the usage counting information together with the case identification number of the semiconductor device case 100 having the multi function.

Accordingly, the semiconductor device counting module 423 calculates the remaining amount information of the semiconductor device using the usage amount count information in the semiconductor device number information corresponding to each case identification number, then matches the operation information with each case identification number, (430).

When the remaining amount information of the semiconductor elements corresponding to each case identification number is equal to or less than a preset threshold value, the semiconductor element counting module 423 transmits the case identification number to the manager mobile device ( 200 to allow the semiconductor device fabrication process operator who operates the manager mobile device 200 to recognize the semiconductor device fabrication process, thereby improving the efficiency of the semiconductor device fabrication process.

FIG. 5 is a flowchart illustrating a method of managing a material using a semiconductor device case having a multi-function according to an exemplary embodiment of the present invention.

5, a method of managing a material using a semiconductor device case having a multi-function according to an embodiment of the present invention includes: a semiconductor device and an assembly management server 400, The manufacturing process information for each semiconductor device manufactured from each of the m facilities (m is a natural number of 2 or more) is collected and stored in the DB 430 by matching with the ID of each factory facility and the serial number of the semiconductor device And the semiconductor device and assembly management server 400 provide the serial number of each semiconductor device stored in the DB 430 as an RFID tag manufacturing facility through the network 300 and the produced factory equipment identification ID (S120) of manufacturing an RFID tag and providing the RFID tag as a factory facility corresponding to a factory facility identification ID so as to produce an RFID tag type semiconductor element as a semiconductor element with an RFID tag, A step S130 of performing authentication for the administrator mobile device 200 in response to an access request of the manager mobile device 200 through the network 300 by the body element and assembly management server 400, And the assembly management server 400 receive the RFID tag information from the manager mobile device 200 via the network 300 on the semiconductor element case 100 having the multi function, (S140) of extracting a serial number of the semiconductor device from the tag information, and manufacturing process information matched with the serial number extracted by the semiconductor device and assembly management server (400) through the network (300) (Step S150).

The operation of the material management system using the semiconductor device case having the multi function according to the embodiment of the present invention and the method thereof will be described below.

The semiconductor device and assembly management server 400 may store manufacturing process information for each semiconductor device manufactured from each of m (m is a natural number of 2 or more) factory facilities (not shown) for manufacturing a semiconductor device through the network 300 And stores it in the DB 430 by matching with the ID of each factory facility and the serial number of the semiconductor device (S110).

Subsequently, the semiconductor device and assembly management server 400 provides the serial number of each semiconductor device stored in the DB 430 to the manufactured factory facility identification ID by an RFID tag manufacturing facility (not shown) through the network 300 The RFID tag is manufactured and provided as a factory facility corresponding to the factory facility identification ID, so that the RFID tag type semiconductor element as the semiconductor element with the RFID tag is controlled to be manufactured (S120).

Next, the semiconductor device and assembly management server 400 performs authentication for the administrator mobile device 200 according to an access request of the administrator mobile device 200 through the network 300 (S130).

The semiconductor device and assembly management server 400 receives the RFID tag information from the manager mobile device 200 through the network 300 on the semiconductor element 100 having the multi function The serial number of the semiconductor device is extracted from the RFID tag information (S140).

Next, the semiconductor device and assembly management server 400 provides manufacturing process information matching the extracted serial number to the administrator mobile device 200 through the network 300 (S150).

As described above, preferred embodiments of the present invention have been disclosed in the present specification and drawings, and although specific terms have been used, they have been used only in a general sense to easily describe the technical contents of the present invention and to facilitate understanding of the invention , And are not intended to limit the scope of the present invention. It is to be understood by those skilled in the art that other modifications based on the technical idea of the present invention are possible in addition to the embodiments disclosed herein.

100: semiconductor element case 110: cover-type upper body
120: dial counter 130: fastening end
140: Case body 150: Lost prevention wire
160: Arduino board 170: Bluetooth module
180: RFID identifier 200: administrator mobile device
300: network 400: semiconductor device and assembly management server
410: Transmitting / receiving unit 420:
421: Semiconductor device manufacturing process management module 422: Semiconductor assembly manufacturing process management module
423: Semiconductor device counting module 430: DB

Claims (6)

A manager mobile device for inquiring manufacturing precautions and manufacturing process information of the semiconductor device based on the RFID tag information; And a semiconductor device and an assembly management server, which are connected to each other through a network and store manufacturing instructions and semiconductor device manufacturing process information,
In the semiconductor device case described above,
A case body for holding a semiconductor device, a loss prevention wire connected to the case body,
A cover-type upper body connected to the loss prevention wire,
A dial counter formed in the cover-type upper body for transmitting a count signal,
An RFID identifier in which RFID tag information is stored,
An idle board for recognizing the use of 1000 semiconductor elements when the count signal is changed from '9 9 9' to '0 0 0' to generate an alarm signal,
And a Bluetooth module for transmitting the RFID tag information and the alarm signal to the administrator mobile device. The method according to claim 1,
The manufacturing process information of the above-described semiconductor device includes PLC (Programmable Logic Controller) driving data of a factory facility at the time of manufacturing a semiconductor device, image data photographed from a CCTV connected to the photographing operation of the factory facility, Real-time temperature / humidity data for the facility, and hazardous substance data generated from the gas sensor at the factory facility,
Wherein the PLC driving data includes data generated by a control command for stopping the factory facility corresponding to the identification ID, restarting the factory facility, repeating the previous process or skipping the process afterwards Material management system using one semiconductor element case. The method according to claim 1,
The inner surface of the case body is divided into a "formed body" and a "fiber material ". The reinforcing layer formed by connecting the connecting fibers formed of the thermosetting synthetic fibers between the carbon fibers and the reinforcing fibers is formed And,
The inner surface of the reinforcing layer is coated with 70 to 80% by weight of paraffin oil, 14 to 20% by weight of a tri-olefin copolymer resin of styrene-ethylene-propylene as a thermoplastic resin, 5 to 10% by weight of a hydrogenated resin, 1 to 2% Wherein the shock absorbing layer is formed by mixing a plurality of semiconductor elements of the multi-function type. The method according to claim 1,
In the case where the cover-type upper body is separated from the case body while the cover-type upper body is extended through the loss prevention wire, the RFID tag attached to the RFID tag in the case body Wherein the RFID tag of the RFID tag type semiconductor element is recognized by the tag type for the RFID identifier inside the cover type upper body with respect to the RFID tag type semiconductor element. The method according to claim 1,
By controlling the Bluetooth module, the RFID tag information is transmitted to the administrator mobile device by the low-power Bluetooth method, and the manager mobile device inquires the semiconductor element and the assembly management server through the network based on the RFID tag information A material management system using a semiconductor device case having a multi-function, characterized by enabling to confirm manufacturing precautions and manufacturing process information of an RFID tag type semiconductor device. A semiconductor device and an assembly management server receives manufacturing process information for each semiconductor device manufactured from each m (m is a natural number of 2 or more) factory facilities for manufacturing semiconductor devices through a network, Storing the serial number of the device in a database,
The semiconductor device and the assembly management server provide an RFID tag manufacturing facility with a serial number for each semiconductor device stored in the DB and a manufactured factory facility identification ID through a network to manufacture an RFID tag and provide a factory facility corresponding to the factory facility identification ID Controlling the manufacture of an RFID tag type semiconductor element, which is a semiconductor element having an RFID tag attached thereto,
The semiconductor device and the assembly management server performing authentication for the administrator mobile device according to an access request of the administrator mobile device via the network;
The semiconductor device and the assembly management server receive the RFID tag information from the manager mobile device via the network on the semiconductor device having the RFID tagged on the semiconductor device case having the multi function, Extracting,
And providing the semiconductor device and the assembly management server with manufacturing process information matched with the extracted serial number to the manager mobile device through the network.

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