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KR101873997B1 - Light emitting device package and lighting system including the same - Google Patents

Light emitting device package and lighting system including the same Download PDF

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Publication number
KR101873997B1
KR101873997B1 KR1020110061506A KR20110061506A KR101873997B1 KR 101873997 B1 KR101873997 B1 KR 101873997B1 KR 1020110061506 A KR1020110061506 A KR 1020110061506A KR 20110061506 A KR20110061506 A KR 20110061506A KR 101873997 B1 KR101873997 B1 KR 101873997B1
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KR
South Korea
Prior art keywords
cavity
light emitting
lead frame
emitting device
disposed
Prior art date
Application number
KR1020110061506A
Other languages
Korean (ko)
Other versions
KR20130006823A (en
Inventor
이동용
Original Assignee
엘지이노텍 주식회사
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Application filed by 엘지이노텍 주식회사 filed Critical 엘지이노텍 주식회사
Priority to KR1020110061506A priority Critical patent/KR101873997B1/en
Publication of KR20130006823A publication Critical patent/KR20130006823A/en
Application granted granted Critical
Publication of KR101873997B1 publication Critical patent/KR101873997B1/en

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    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42—Wire connectors; Manufacturing methods related thereto
    • H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
    • H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
    • H01L2224/4805—Shape
    • H01L2224/4809—Loop shape
    • H01L2224/48091—Arched
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42—Wire connectors; Manufacturing methods related thereto
    • H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
    • H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
    • H01L2224/481—Disposition
    • H01L2224/48151—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive
    • H01L2224/48221—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked
    • H01L2224/48245—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being metallic
    • H01L2224/48247—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being metallic connecting the wire to a bond pad of the item
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/73—Means for bonding being of different types provided for in two or more of groups H01L2224/10, H01L2224/18, H01L2224/26, H01L2224/34, H01L2224/42, H01L2224/50, H01L2224/63, H01L2224/71
    • H01L2224/732—Location after the connecting process
    • H01L2224/73251—Location after the connecting process on different surfaces
    • H01L2224/73265—Layer and wire connectors

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  • Engineering & Computer Science (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Manufacturing & Machinery (AREA)
  • Computer Hardware Design (AREA)
  • Power Engineering (AREA)
  • Led Device Packages (AREA)
  • Planar Illumination Modules (AREA)

Abstract

An embodiment includes a body having a first cavity and a second cavity, and having a partition between the first cavity and the second cavity; A first lead frame and a second lead frame disposed to extend from the bottom of the cavity to the side of the cavity and electrically separated from each other; And a first light emitting device disposed in the first cavity and a second light emitting device disposed in the second cavity.

Description

TECHNICAL FIELD [0001] The present invention relates to a light emitting device package and a lighting system including the light emitting device package.

The embodiment relates to a light emitting device package, which improves heat dissipation characteristics and light efficiency of a light emitting device package.

BACKGROUND ART Light emitting devices such as a light emitting diode (LED) or a laser diode (LD) using a semiconductor material of Group 3-5 or 2-6 group semiconductors have been developed with thin film growth technology and device materials, Green, blue, and ultraviolet rays. By using fluorescent materials or combining colors, it is possible to realize white light rays with high efficiency. Also, compared to conventional light sources such as fluorescent lamps and incandescent lamps, low power consumption, It has the advantages of response speed, safety, and environmental friendliness.

Therefore, the light emitting diode can be replaced with a transmission module of an optical communication means, a light emitting diode backlight replacing a cold cathode fluorescent lamp (CCFL) constituting a backlight of an LCD (Liquid Crystal Display) display device, White LED lightings, automotive headlights and traffic lights.

The light emitting device package can supply current from the lead frame to the light emitting element disposed in the body.

The embodiment attempts to improve the heat dissipation characteristics and light efficiency of the light emitting device package.

An embodiment includes a body having a first cavity and a second cavity, and having a partition between the first cavity and the second cavity; A first lead frame and a second lead frame disposed to extend from the bottom of the cavity to the side of the cavity and electrically separated from each other; And a first light emitting device disposed in the first cavity and a second light emitting device disposed in the second cavity.

At least one of the first lead frame and the second lead frame may extend to the outer surface of the body.

At least one of the first lead frame and the second lead frame may extend to the bottom surface of the body.

The first lead frame may be disposed on the surface of the first cavity and may be electrically connected to the first light emitting device.

The second lead frame may be disposed on the surface of the second cavity and may be electrically connected to the second light emitting device.

The height of the partition may be lower than the height of the body.

The height of the barrier rib may be not less than the height of the uppermost portion of the active layer of the light emitting device.

The light emitting device package may further include a third lead frame extending from a bottom surface of the first cavity to a surface of the partition and a bottom surface of the second cavity.

The third lead frame may be electrically connected to the first light emitting device and the second light emitting device.

A reflective layer may be formed on at least one surface of the first lead frame, the second lead frame, and the third lead frame.

Another embodiment provides an illumination system comprising the light emitting device package described above.

In the light emitting device package according to the embodiment, the heat radiation efficiency is improved due to an increase in the area of the lead frame, the lead frame reflects the light emitted from the light emitting device in the cavity to improve the luminance of the light emitting device package, Therefore, it is possible to prevent foreign matter from entering into the package.

1 to 3 are sectional views of one embodiment of a light emitting device package,
4 is a plan view of the light emitting device package of FIG. 2,
5 is a view illustrating first and second lead frames of the light emitting device package of FIG. 3,
6 and 7 are sectional views of another embodiment of the light emitting device package,
8 is a view showing the first and second lead frames of the light emitting device package of FIG. 6,
9 is a plan view of the light emitting device package of FIG. 6,
10 is an exploded perspective view of an embodiment of a lighting device including a light emitting device package according to embodiments,
11 is a view illustrating an embodiment of a display device including a light emitting device package according to embodiments.

DETAILED DESCRIPTION OF THE PREFERRED EMBODIMENTS Hereinafter, preferred embodiments of the present invention will be described with reference to the accompanying drawings.

In the description of the embodiment according to the present invention, in the case of being described as being formed "on or under" of each element, the upper (upper) or lower (lower) or under are all such that two elements are in direct contact with each other or one or more other elements are indirectly formed between the two elements. Also, when expressed as "on or under", it may include not only an upward direction but also a downward direction with respect to one element.

The thickness and size of each layer in the drawings are exaggerated, omitted, or schematically shown for convenience and clarity of explanation. Also, the size of each component does not entirely reflect the actual size.

FIGS. 1 to 3 are sectional views of one embodiment of the light emitting device package, and FIG. 4 is a plan view of the light emitting device package of FIG.

A light emitting device package 100 according to an embodiment shown in FIG. 1 includes a body 110, a first lead frame 121 and a second lead frame 122 provided on the body 110, The light emitting device 130 according to the embodiment of the present invention is installed on the first lead frame 121 and the second lead frame 122 and is electrically connected to the first lead frame 121 and the second lead frame 122, And a molding part 150 surrounding the molding part 150.

The body 110 may be formed of a silicon material, a synthetic resin material, or a metal material. If the body 110 is made of a conductive material such as a metal material, an insulating layer may be coated on the surface of the body 110 to prevent an electrical short between the first and second lead frames 121 and 122 . A cavity may be formed in the body 110, and the light emitting device 130 may be disposed.

The first lead frame 121 and the second lead frame 122 are electrically disconnected from each other and supply current to the light emitting device 130. The first lead frame 121 and the second lead frame 12 may extend from the bottom of the cavity to the side wall of the cavity, respectively.

Since the light emitted from the light emitting device 130 is reflected by the first lead frame 121 and the second lead frame 122 in the cavity, the luminance of the entire light emitting device package 100 is increased, Can be improved.

In addition, it is preferable to use a metal such as titanium, copper, nickel, gold, chromium, tantalum, platinum, P, at least one of aluminum (Al), indium (In), palladium (Pd), cobalt (Co), silicon (Si), germanium (Ge), hafnium (Hf), ruthenium (Ru) The heat generated from the light emitting device 130 can be emitted through the first lead frame 121 and the second lead frame 122 made of a material or an alloy so that the heat radiation characteristic of the light emitting device package 100 can be improved have.

Since the first lead frame 121 and the second lead frame 122 are formed so as to surround a part of the body 110, an infiltration path of moisture or air due to the difference in material between the body 110 and the lead frame Can be reduced.

In the embodiment shown in FIG. 2, the first lead frame 121 and the second lead frame 122 may extend to the upper surface and the outer surface of the body 110. At this time, the luminous efficiency is similar to that of the embodiment shown in FIG. 1, but the radiation characteristics and the infiltration paths of moisture and air can be further reduced.

In the embodiment shown in FIG. 3, the first lead frame 121 and the second lead frame 122 extend to the upper surface, the outer surface, and the bottom surface of the body 110. At this time, the luminous efficiency is similar to that of the embodiment shown in FIG. 1 and FIG. 2, but the radiation characteristics and the infiltration path of moisture and air can be further reduced.

FIG. 4 is a plan view of the light emitting device package of FIG. 2. FIG. 4 illustrates a cavity formed in the body 110 and a light emitting device 130 inside the cavity, with the molding part 150 and the lens 170 omitted. The first and second lead frames 121 and 122 extend from the bottom of the cavity through the side wall of the cavity and the upper portion of the body 110 to the outer surface of the body 110. The side wall of the cavity may have an inclination with respect to the bottom surface of the cavity as shown in Fig.

The light emitting device 130 may be a horizontal light emitting device, a vertical light emitting device, or a flip-type light emitting device. The light emitting device 130 may be mounted on the body 110, or may be mounted on the first lead frame 121 or the second lead frame 122 As shown in FIG. The first lead frame 121 and the light emitting device 130 are electrically connected through the conductive adhesive layer 135 and the second lead frame 122 and the light emitting device 130 are electrically connected to the wire 140 Respectively. The light emitting device 130 may be connected to the lead frames 121 and 122 by a flip chip method or a die bonding method in addition to the wire bonding method.

The molding part 150 may surround and protect the light emitting device 130. In addition, the molding unit 150 may include a phosphor 155 to change the wavelength of light emitted from the light emitting device 130. The molding part 150 may be formed to cover at least the light emitting device 130 and the wire 140.

The light of the first wavelength range emitted from the light emitting device 130 may be converted into the light of the second wavelength range by the phosphor 155. In the embodiment shown in FIGS. 2 and 3, The lens 170 may be disposed so that the light of the second wavelength range passes through the optical path conversion unit such as the lens 170 or the like and the optical path can be changed.

The lens 170 is emitted from the light emitting device 130 and can convert the optical path through the refraction of the wavelength converted light in the phosphor 155. In particular, when the light emitting device package is used in the backlight unit, Can be adjusted.

The lens 170 is made of a material having a high light transmittance. For example, the lens 170 may be made of an acrylic resin such as polymethyl methacrylate (PMMA), polyethylene terephthalate (PET), polycarbonate (PC), cycloolefin copolymer (COC), and polyethylene naphthalate ) Resin.

(PMMA), polycarbonate (PC), polyethylene (PE), or a resin injection molded article, for example.

The lens 170 may be fixed to the upper surface of the body 110. The lens 170 may be fixed to the body 110 with an adhesive or the like. In order to adjust the directing angle of the light emitted from the device 130.

5 is a view illustrating first and second lead frames of the light emitting device package of FIG.

The first lead frame 121 includes a first end 121a to a fifth end 121e. The first end 121a may be disposed at the bottom of the cavity in the light emitting device package. 121b may be disposed on the side wall of the cavity, the third stage 121c may be disposed on the upper surface of the body, the fourth stage 121d may be disposed on the outer surface of the body, 121e may be disposed on the bottom surface of the body.

The second lead frame 122 also includes a first end 122a to a fifth end 122e which may be disposed at the bottom of the cavity in the light emitting device package, The second end 122b may be disposed on the side wall of the cavity, the third end 122c may be disposed on the upper surface of the body, the fourth end 122d may be disposed on the outer surface of the body, The end 122e may be disposed on the bottom surface of the body.

Since the light emitting device may be disposed on the first end 121a of the first lead frame 121, the first end 122a may be longer than the first end 122a of the second lead frame 122.

A reflective layer may be formed on the surfaces of the first lead frame 121 and the second lead frame 122 to increase the reflection efficiency of light emitted from the light emitting device. The reflective layer may be made of an oxide such as silicon, titanium or aluminum, and may be formed of a plurality of layers.

6 and 7 are sectional views of another embodiment of the light emitting device package.

The light emitting device package 200 according to the present embodiments is similar to the embodiment shown in FIGS. 1 to 3 except that the cavity 280 formed in the body 210 is divided into the first cavity 281 and the second cavity 282 ).

A partition wall is disposed between the first cavity 281 and the second cavity 282. A third lead frame 223 may be formed on the surface of the partition wall.

The height of the barrier ribs may be higher than the height of the first light emitting device 230 in the first cavity 281 and the second light emitting device 231 in the second cavity 282. In particular, Of the active layer in the adjacent cavities 281 and 282, so that interference of light between the light emitting devices 230 and 231 in the adjacent cavities 281 and 282 can be reduced.

The height of the barrier ribs is lower than the height of the body 210 so that the light emitted from the two light emitting devices 230 and 231 in the entire cavity 280 can be combined in one light emitting device package 200 and travel outside.

The first lead frame 221 is disposed on the surface of the first cavity 281 and is electrically connected to the first light emitting device 230. The second lead frame 222 is electrically connected to the second cavity 282 and may be electrically connected to the second light emitting device 231.

In the cavity 280 including the first cavity 281 and the second cavity 282, a molding part including a phosphor may be formed as in the above-described embodiments, and a lens is disposed in the molding part, The angle of incidence of the light beam can be adjusted.

The third lead frame 223 may directly connect the first light emitting device 230 and the second light emitting device 231 in series and may be connected through an island type zener diode although not shown. The third lead frame 223 extends from the bottom surface of the first cavity 281 to the surface of the partition wall and the bottom surface of the second cavity 282.

7, the reflective layers 261, 262 and 263 are formed on the surfaces of the first lead frame 221, the second lead frame 222 and the third lead frame 223, It is increasing.

8 is a view showing first and second lead frames of the light emitting device package of FIG.

The first and second lead frames 221 and 222 may be formed only on the bottom and sidewalls of the first and second cavities 281 and 282. In this embodiment, Respectively.

A region of the first cavity 281 and the upper portion of the second cavity 282 in the light emitting device package 200 is defined as a cavity 280 and a structure of the first and second lead frames 221 and 222 is described do.

The first lead frame 221 is comprised of a first end 221a to a seventh end 221e of which the first end 221a may be disposed on the first bottom of the first cavity 281, The end 221b may be disposed on the first side wall of the first cavity 281 and the third end 221c may be disposed on the second bottom of the first cavity 281, The fifth stage 221e may be disposed on the upper surface of the body, the sixth stage 221f may be disposed on the outer surface of the body, the seventh stage 221e may be disposed on the second side wall of the first cavity 281, The second lead frame 222 is composed of a first end 222a to a seventh end 222e and a first end 222a of which is connected to the second cavity 222a 282 and the second end 222b may be disposed on the first side wall of the second cavity 282 and the third end 222c may be disposed on the second bottom of the second cavity The fourth end 222d may be disposed on the second sidewall of the second cavity 282 and the fifth end 222e may be disposed on the top of the body The sixth end 222f may be disposed on the outer surface of the body, and the seventh end 222g may be disposed on the bottom surface of the body.

The second lead frame 222 is comprised of a first stage 222a to a seventh stage 222e in which the positional relationship within the second cavity 282 is determined by the position of the first cavity 281 ). ≪ / RTI >

The third lead frame 223 is made up of a first end 223a to a fifth end 223e of which the first end 223a can be disposed at the first bottom of the first cavity 281, The second end 223b may be disposed on the first side wall of the partition wall and the third end 223c may be disposed on the first bottom of the second cavity 282 and the fourth end 223d may be disposed on the first side of the partition wall And the fifth stage 223e is disposed on the upper surface of the partition wall.

Since the first light emitting device 230 is disposed at the first end 221a of the first lead frame and the second light emitting device 231 is disposed at the first end 222a of the second lead frame, The length may be longer than the first end 233a and the third end 233c of the third lead frame 233.

FIG. 9 is a plan view of the light emitting device package of FIG. 6, and the first and second light emitting devices 230 and 231 are shown in the cavity formed in the body 210 and the cavity. The first and second lead frames 221 and 222 extend from the bottom of the cavity through the side wall of the cavity and the upper portion of the body 110 to the outer surface of the body 210. The side wall of the cavity may have an inclination with respect to the bottom surface of the cavity as shown in Fig. The third lead frame 223 electrically connects the first and second light emitting devices 230 and 231 disposed in the respective cavities in series.

The light emitted from each of the light emitting devices 230 and 231 may be transmitted through the first lead frame 221 and the second lead frame 222 and the second lead frame 222 by the light emitting device package 200 according to the present embodiment, 3 lead frame 233, the luminance of the entire light emitting device package 200 is increased and the luminous efficiency can be improved.

Further, as described above, it is expected that the heat radiation characteristics of the light emitting device package 200 can be improved and the airtightness can be improved.

A plurality of light emitting device packages according to embodiments may be arranged on a substrate, and a light guide plate, a prism sheet, a diffusion sheet, and the like may be disposed on the light path of the light emitting device package. Such a light emitting device package, a substrate, and an optical member can function as a light unit. Still another embodiment may be implemented as a display device, an indicating device, a lighting system including the semiconductor light emitting device or the light emitting device package described in the above embodiments, for example, the lighting system may include a lamp, a streetlight .

Hereinafter, the illumination device and the backlight unit will be described as an embodiment of the illumination system in which the above-described light emitting device package is disposed.

10 is an exploded perspective view of an embodiment of a lighting device including a light emitting device package according to embodiments.

The illumination device according to the embodiment includes a light source 600 for projecting light, a housing 400 in which the light source 600 is embedded, a heat dissipation unit 500 for emitting heat of the light source 600, And a holder 700 for coupling the heat dissipating unit 500 to the housing 400.

The housing 400 includes a socket coupling part 410 coupled to an electric socket and a body part 420 connected to the socket coupling part 410 and having a light source 600 embedded therein. The body 420 may have one air flow hole 430 formed therethrough.

A plurality of air flow openings 430 are provided on the body portion 420 of the housing 400. The air flow openings 430 may be formed of one air flow openings or a plurality of flow openings may be radially arranged Various other arrangements are also possible.

The light source 600 includes a plurality of the light emitting device packages 650 on a circuit board 610. Here, the circuit board 610 may be inserted into the opening of the housing 400, and may be made of a material having a high thermal conductivity to transmit heat to the heat dissipating unit 500, as described later.

A holder 700 is provided under the light source. The holder 700 may include a frame and another air flow hole. Although not shown, an optical member may be provided under the light source 100 to diffuse, scatter, or converge light projected from the light emitting device package 150 of the light source 100.

The luminous efficiency of the light emitting device package 650 provided therein can be improved, and the airtightness and heat dissipation characteristics can be improved.

11 is a view illustrating an embodiment of a display device including a light emitting device package according to embodiments.

The display device 800 according to the embodiment includes a bottom cover 810, a reflector 820 disposed on the bottom cover 810, light source modules 830 and 835 for emitting light, An optical sheet including a light guide plate 840 disposed in front and guiding light emitted from the light source modules 830 and 835 to the front of the display device and prism sheets 850 and 860 disposed in front of the light guide plate 840, An image signal output circuit 872 connected to the display panel 870 and supplying an image signal to the display panel 870, And a color filter 880 disposed in the color filter 880. Here, the bottom cover 810, the reflection plate 820, the light source modules 830 and 835, the light guide plate 840, and the optical sheet may form a backlight unit.

The light source module comprises a light emitting device package 835 on a substrate 830. Here, the substrate 830 may be a PCB or the like, and the light emitting device package 835 may be the embodiment shown in FIG.

The bottom cover 810 can house components within the display device 800. [ Also, the reflection plate 820 may be formed as a separate component as shown in the drawing, or may be provided on the rear surface of the light guide plate 840 or on the front surface of the bottom cover 810 in a state of being coated with a highly reflective material .

Here, the reflection plate 820 can be made of a material having a high reflectance and can be used in an ultra-thin shape, and polyethylene terephthalate (PET) can be used.

The light guide plate 840 scatters the light emitted from the light source module so that the light is uniformly distributed over the entire screen area of the LCD. Accordingly, the light guide plate 830 is made of a material having a good refractive index and transmittance, and is made of a material having a high light transmittance. For example, the light guide plate 830 may be made of a material such as polymethyl methacrylate (PMMA), polycarbonate (PC) PolyEthylene (PE) or resin injection molding.

The first prism sheet 850 may be formed of a light-transmissive and elastic polymeric material on one side of the support film, and the polymer may have a prism layer in which a plurality of three-dimensional structures are repeatedly formed. Here, as shown in the drawings, the plurality of patterns may be provided with a floor and a valley repeatedly as stripes.

In the second prism sheet 860, the direction of the floor and the valley on one side of the supporting film may be perpendicular to the direction of the floor and the valley on one side of the supporting film in the first prism sheet 850. This is for evenly distributing the light transmitted from the light source module and the reflective sheet to the front surface of the display panel 870.

Although not shown, a protective sheet may be provided on each prism sheet, and a protective layer including light diffusing particles and a binder may be provided on both sides of the support film. The prism layer may also be made of a polymeric material selected from the group consisting of polyurethane, styrene butadiene copolymer, polyacrylate, polymethacrylate, polymethyl methacrylate, polyethylene terephthalate elastomer, polyisoprene, have.

Although not shown, a diffusion sheet may be disposed between the light guide plate 840 and the first prism sheet 850. The diffusion sheet may be made of polyester and polycarbonate-based materials, and the light incidence angle can be maximized by refracting and scattering light incident from the backlight unit. The diffusion sheet includes a support layer including a light diffusing agent, a first layer formed on the light exit surface (first prism sheet direction) and a light incidence surface (in the direction of the reflection sheet) . ≪ / RTI >

In an embodiment, the diffusion sheet, the first prism sheet 850 and the second prism sheet 860 form an optical sheet, which may be made of other combinations, for example a microlens array, Or a combination of one prism sheet and a microlens array, or the like.

The display panel 870 may include a liquid crystal display (LCD) panel, and may include other types of display devices that require a light source in addition to the liquid crystal display panel 860. In the display panel 870, a liquid crystal is positioned between glass bodies, and a polarizing plate is placed on both glass bodies to utilize the polarization of light. Here, the liquid crystal has an intermediate property between a liquid and a solid, and liquid crystals, which are organic molecules having fluidity like a liquid, are regularly arranged like crystals. The liquid crystal has a structure in which the molecular arrangement is changed by an external electric field And displays an image.

A liquid crystal display panel used in a display device is an active matrix type, and a transistor is used as a switch for controlling a voltage supplied to each pixel. A color filter 880 is provided on the front surface of the display panel 870 so that only red, green, and blue light is transmitted for each pixel of the light projected from the display panel 870, thereby displaying an image.

In the display device described above, luminous efficiency can be improved in the light emitting device package 835 provided therein, and airtightness and heat dissipation characteristics can be improved.

While the present invention has been particularly shown and described with reference to exemplary embodiments thereof, it is to be understood that the invention is not limited to the disclosed exemplary embodiments, but, on the contrary, It will be understood that various modifications and applications are possible. For example, each component specifically shown in the embodiments can be modified and implemented. It is to be understood that all changes and modifications that come within the meaning and range of equivalency of the claims are therefore intended to be embraced therein.

100, 200: light emitting device package 110, 210: body
121, 221: first lead frame 221, 222: second lead frame
223: third lead frame 230: light emitting element
231, 232: first and second light emitting devices 135, 235: conductive adhesive
140, 240: wire 150: molding part
155: phosphor 170: lens
400: housing 500:
600: light source 700: holder
800: Display device 810: Bottom cover
820: reflector 830: circuit board module
840: light guide plate 850, 860: first and second prism sheets
870: Panel 880: Color filter

Claims (11)

A body having a first cavity and a second cavity formed therebetween, and having a partition between the first cavity and the second cavity;
A first lead frame extending from a bottom of the first cavity to a side of the first cavity;
A second lead frame extending from the bottom of the second cavity to the side of the second cavity;
A third lead frame extending from a bottom surface of the first cavity to a surface of the partition and a bottom surface of the second cavity;
A first light emitting element disposed on the first lead frame in the cavity;
A second light emitting element disposed on the second lead frame in the cavity;
A first wire electrically connecting the first light emitting device and the third lead frame; And
And a second wire electrically connecting the second light emitting element and the third lead frame,
Each of the first to third lead frames is electrically separated,
The height of the partition is higher than the height of the first light emitting device in the first cavity and the second light emitting device in the second cavity and is lower than the height of the body,
The first cavity may include a first bottom surface on which the first light emitting device is disposed, a second bottom surface disposed between the first bottom surface and the upper surface of the body, a first sidewall connecting the first bottom surface and the second bottom surface, And a second sidewall connecting the second bottom and the upper surface of the body,
The second cavity has a first bottom on which the second light emitting device is disposed, a second bottom disposed between a first bottom of the second cavity and an upper surface of the body, a first bottom of the second cavity, A first sidewall connecting the second bottom of the cavity and a second sidewall connecting the second bottom of the second cavity and the top surface of the body,
The partition wall includes an upper surface, a first sidewall connecting the upper surface and the first bottom of the first cavity, and a second sidewall connecting the upper surface and the first bottom of the second cavity,
The first lead frame includes a first end disposed at a first bottom of the first cavity, a second end disposed at a first side wall of the first cavity, a third end disposed at a second bottom of the first cavity, A fourth end disposed on a second side wall of the first cavity, a fifth end disposed on an upper surface of the body, a sixth end disposed on an outer surface of the body, And a seventh stage disposed on a bottom surface of the body,
Wherein the second lead frame has a first end disposed on a first bottom of the second cavity, a second end disposed on a first sidewall of the second cavity, a third end disposed on a second bottom of the second cavity, A fourth end disposed on a second side wall of the second cavity, a fifth end disposed on an upper surface of the body, a sixth end disposed on an outer surface of the body, And a seventh stage disposed on a bottom surface of the body,
Wherein the third lead frame has a first end disposed on a first bottom of the first cavity, a second end disposed on a first sidewall of the partition, a third end disposed on a first bottom of the second cavity, A fourth end disposed on a second sidewall of the barrier rib, and a fifth end disposed on an upper surface of the barrier rib,
Wherein the first light emitting element is disposed on a first end of the first lead frame and the second light emitting element is disposed on a first end of the second lead frame, Emitting device package. delete delete delete The method according to claim 1,
The first wire connects the upper surface of the first light emitting device and the first end of the third lead frame,
The second wire connects the upper surface of the second light emitting device and the third end of the third lead frame,
Wherein a length of each of the first end of the first lead frame and the first end of the second lead frame is longer than the length of the first end and the third end of the third lead frame. delete delete delete delete 6. The method according to claim 1 or 5,
Wherein a reflective layer is formed on a surface of at least one of the first lead frame, the second lead frame, and the third lead frame, and each of the first through third lead frames has the same width. delete
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