KR101870511B1 - Laminated sealing film forming method and forming apparatus - Google Patents

Abstract

A laminated sealing film having a thin film thickness and a high sealing performance is formed while suppressing the productivity and adhesion of foreign matters. When a laminated sealing film 203 having a structure in which an inorganic film 201 and an organic film 202 are laminated is formed on an organic EL element S having a plurality of organic EL layers 102 as a light emitting layer on a substrate 101 , The step of forming the inorganic film 201 by the atomic layer deposition method and the step of forming the organic film 202 by the vapor deposition polymerization method are alternately repeated a plurality of times in one processing vessel 11. [

Description

TECHNICAL FIELD [0001] The present invention relates to a laminated sealing film forming method and a laminated sealing film forming method.

The present invention relates to a laminated sealing film forming method and apparatus for forming a laminated sealing film used in an organic EL device.

An organic EL display device using an organic EL element has attracted attention as a next-generation display device because it has a low power consumption, is a spontaneous emission type, and emits light of various colors derived from an organic light emitting material.

An organic EL element is formed in a state where an organic EL layer as an emitting layer, an electrode layer, and the like are laminated on a plurality of element formation regions formed in a matrix on a substrate.

As the organic EL display device using such an organic EL element, a combination of a color filter having a filter portion corresponding to red (R), green (G) and blue (B) It is known.

The organic compound forming the organic EL layer is generally susceptible to deterioration due to moisture or oxygen. Therefore, for the purpose of preventing moisture, oxygen and the like from entering the interface of the organic EL layer, A sealing film is formed at a temperature at which the organic EL layer does not affect the organic EL layer.

As a sealing film of an organic EL device, a laminated sealing film in which an inorganic film and an organic film are laminated has been proposed (for example, Patent Documents 1 and 2). In addition, as the sealing film of the inorganic type such as Al ₂ O ₃ is known and (for example, Patent Documents 3 and 4), as a sealing film of an organic poly polyimide is polyurea known (e.g. Patent Document 4).

Patent Document 1 discloses a laminated sealing film in which a first inorganic film (aluminum oxide film) having a thickness of 60 nm and a first organic film having a thickness of 1.3 m are formed, and then a second inorganic film having a thickness of 40 nm, 1 organic film and a third inorganic film, a third organic film, and a fourth inorganic film are formed under the same conditions as those of the second inorganic film and the first organic film have. Thus, conventionally, the film thickness per layer is relatively thick, and the number of repetitions of the inorganic film and the organic film is about 3 to 4 times to secure the sealing property.

On the other hand, in Non-Patent Document 1, it has been reported that the sealing performance of a laminated sealing film of an inorganic film and an organic film increases as the number of laminated layers increases.

Japanese Patent No. 5162179 Japanese Patent No. 4987648 Japanese Patent Application Laid-Open No. 2013-235726 Japanese Patent Application Laid-Open No. 2015-15499

Applied Physics Letters 102, 161908 (2013)

However, if the film thickness of each individual film of the laminated sealing film is increased to secure the sealing performance, the total number of repetition times becomes at least the entire thickness of the laminated sealing film. When the laminated sealing film becomes thick, the light transmittance decreases. Further, since the laminated sealing film is thickened, the gap between the organic EL layer which is the light emitting layer and the color filter becomes wide, and the gap between the organic EL layer and the filter corresponding to the red (R), green It is necessary to increase the area of the black matrix BM for partitioning the filter portions so as to increase the light shielding property from the viewpoint of preventing the leakage of light to the adjacent filter portions and increasing the light transmittance The area of the filter portion becomes small. As a result, the light extraction efficiency is lowered.

In recent years, the image quality of an image or an image required for an organic EL display device has become higher, and the influence of a decrease in light transmittance or a decrease in light extraction efficiency due to thickening of the laminated sealing film on image quality has become negligible .

On the other hand, as described in Non-Patent Document 1, since the sealing performance can be increased by increasing the number of laminated layers, the film thickness of the inorganic film and the organic film is reduced to increase the number of laminated layers, . However, as described in Patent Document 1, when manufacturing a laminated sealing film, it is a common practice to form an inorganic film and an organic film in separate devices, and the time for carrying the substrate between devices is repeated each time the lamination is repeated As the number of stacked layers increases, the productivity decreases. Also, at the time of transportation, the probability that particles such as particles adhere to the device increases, and the probability of occurrence of defects that lower the sealing performance by foreign matter also increases.

SUMMARY OF THE INVENTION Accordingly, it is an object of the present invention to provide a laminated sealing film forming method and apparatus capable of forming a laminated sealing film having a thin film thickness and high sealing performance while suppressing the productivity or the adhesion of foreign matters.

In order to solve the above problems, a first aspect of the present invention is a laminated sealing film forming method for forming a laminated sealing film having a structure in which an inorganic film and an organic film are laminated on an organic EL element in which a plurality of organic EL layers , Wherein the step of forming an inorganic film by an atomic layer deposition method and the step of forming an organic film by an evaporation polymerization method are alternately repeated a plurality of times in one processing vessel to form a laminated sealing film forming method to provide.

A second aspect of the present invention is a laminated sealing film forming apparatus for forming a laminated sealing film having a structure in which an inorganic film and an organic film are laminated on an organic EL element in which a plurality of organic EL layers as a light emitting layer are formed on a substrate, A first inorganic film raw material gas supply unit for supplying the first inorganic film raw material gas and the second inorganic film raw material gas into the processing container for forming the inorganic film by atomic layer deposition; A first organic film raw material gas supply unit for supplying a first organic film material gas and a second organic film material gas for forming the organic film by a deposition polymerization method into the processing vessel; 2 organic film material gas supply unit, an exhaust unit for exhausting the interior of the processing container, and a second inorganic film material gas supply unit for supplying the first inorganic film material gas and the second inorganic film material gas alternately into the processing vessel To form the inorganic film by an atomic layer deposition method and supplying the first organic film material gas and the second organic film material gas into the processing vessel at the same time to form the organic film by an evaporation polymerization method And a control unit for controlling the liquid crystal cell array to be alternately repeated a plurality of times.

As the inorganic film, aluminum oxide can be suitably used. Further, polyurea or polyimide may be suitably used as the organic film.

It is preferable that the film thickness of the inorganic film is 50 nm or less and the film thickness of the organic film is 500 nm or less. The thickness of the laminated sealing film is preferably 1 m or less.

Wherein the inorganic film is formed and the organic film is formed in a state in which the organic EL element is stacked on the stage in the processing vessel and the mounting surface of the stage is moved to a first temperature at which the organic film can be formed by vapor deposition polymerization And the temperature of the portion other than the mounting table of the processing container is adjusted to a second temperature at which film formation of the organic film by vapor deposition polymerization does not occur.

According to the present invention, when the laminated sealing film is formed, the inorganic film is formed by the atomic layer deposition method, and the organic film is formed by the deposition polymerization method, so that these films can be formed thin. By increasing the number of these laminated films, The inorganic film formed by the ALD method is thin and the film has a high sealing function. Therefore, even if the laminated water is laminated by a laminated water capable of securing the sealing performance, The film thickness of the entire film can be reduced. Further, since the inorganic film and the organic film are formed in the same processing vessel, the productivity can be reduced and foreign matter adhesion can be suppressed.

BRIEF DESCRIPTION OF THE DRAWINGS FIG. 1 is a cross-sectional view showing a laminated sealing film forming apparatus for forming a laminated sealing film;
2 is a cross-sectional view showing an organic EL element in which a plurality of organic EL layers are formed on a substrate.
3 is a sectional view showing a state in which a laminated sealing film is formed on an organic EL element by a manufacturing method according to an embodiment of the present invention.
4 is a cross-sectional view showing a state in which a laminated sealing film is formed on an organic EL element by a conventional manufacturing method.
5 is a sectional view for explaining the arrangement of an organic EL layer and a color filter when a thick laminated sealing film formed by a conventional manufacturing method is used.
6 is a cross-sectional view for explaining the arrangement of an organic EL layer and a color filter when a thin laminated sealing film formed by the manufacturing method of the embodiment of the present invention is used.

Hereinafter, embodiments of the present invention will be described with reference to the accompanying drawings.

1 is a sectional view showing a laminated sealing film forming apparatus for forming a laminated sealing film.

The laminated sealing film forming apparatus 100 is a laminated sealing film of an inorganic film and an organic film in an organic EL element including an organic EL layer which is a light emitting layer. An inorganic film is formed by atomic layer deposition (ALD) And the film is formed by a deposition polymerization method.

The laminated sealing film forming apparatus 100 includes a processing section 1 for performing a film forming process on the organic EL element S, a gas supplying section 2 for supplying a processing gas to the processing space of the processing section 1, An exhaust unit 3 for exhausting the processing space of the engine 1, and a control unit 4.

The processing unit 1 includes a processing vessel 11 for partitioning a processing space for film forming processing and a loading table 11 for loading the organic EL element S on which an organic EL layer and electrodes are formed on a substrate formed in the processing vessel 11 A first temperature adjusting unit 13 for adjusting the temperature of the loading table 12 to a first temperature and a second temperature adjusting unit 13 for adjusting a temperature of the part other than the loading table 12 of the processing tank 11 to a second temperature 2 temperature control unit 14. [ Although not shown, a loading / unloading port for loading / unloading the organic EL element S is formed on the side wall of the processing container 11, and the loading / unloading port can be opened / closed by a gate valve.

The first temperature control unit 13 controls the temperature of the loading surface of the loading table 12 to the first temperature (not shown) by passing a temperature control medium through a temperature control medium flow path (not shown) formed in the loading table 12 Adjust the temperature. The first temperature is a temperature at which the organic film can be formed by vapor deposition polymerization. The second temperature regulating unit 14 is a temperature regulating medium flow path (not shown) formed in a portion other than the loading table 12 on which the organic EL element S to be processed, such as a wall portion of the processing vessel 11, ), The temperature of the portion other than the loading table 12 is adjusted to the second temperature. The second temperature is a temperature at which film formation of the organic film by evaporation polymerization does not occur.

The gas supply unit 2 includes a first inorganic film source gas supply unit 21 for supplying a first inorganic film source gas and a second inorganic film source gas to be used for forming an inorganic film by the ALD method, A raw material gas supply unit (22), and a first organic film material gas supply unit (23) for supplying a first organic film material gas and a second organic film material gas, which are used for forming an organic film by the deposition polymerization method, And a second organic film source gas supply unit 24. The first inorganic film material gas supply unit 21, the second inorganic film material gas supply unit 22, the first organic film material gas supply unit 23 and the second organic film material gas supply unit 24 , A first gas supply pipe (25) for supplying the first inorganic film material gas, a second inorganic film material gas, a first organic film material gas, and a second organic film material gas to the processing container (11) A gas supply pipe 26, a third gas supply pipe 27 and a fourth gas supply pipe 28 are connected. The first gas supply pipe 25, the second gas supply pipe 26, the third gas supply pipe 27 and the fourth gas supply pipe 28 are provided with a first on-off valve 29, Off valve 30, a third on-off valve 31 and a fourth on-off valve 32 are provided.

Although not shown, a gas supply unit and a gas supply pipe for supplying a purge gas or a dilution gas including an inert gas or the like are provided. Although not shown, a flow controller is installed in the first gas supply pipe 25, the second gas supply pipe 26, the third gas supply pipe 27, and the fourth gas supply pipe 28 have.

As the inorganic film formed by the ALD method, a material having a function of sealing water or oxygen and having an insulating property is used, and aluminum oxide (Al ₂ O ₃ ) can be suitably used. The Al ₂ O ₃ film has a high sealing property, and ALD film formation results in a film having a very small defect and a good coverage. When an Al ₂ O ₃ film is formed as an inorganic film, trimethyl aluminum (TMA) can be appropriately used as the first inorganic film source gas, and H ₂ O gas or O ₃ can be appropriately used as the second inorganic film source gas Can be used. Then, by operating the on-off valves 29 and 30, the first inorganic film raw material gas and the second inorganic film raw material gas are alternately supplied with the purge in the processing container interposed therebetween.

The organic film formed by the vapor deposition polymerization method has a function of separating defects and cracks generated in the inorganic film and suppressing generation of cracks in the inorganic film due to bending of the substrate. As the organic film, a transparent resin material is used, and polyurea or polyimide can be suitably used. Of these, polyurea is particularly preferable. The polyurea film has a high transparency, a very good coverage, and is advantageous for thinning. When a polyurea film is formed as an organic film, a diamine monomer and an isocyanate monomer can be used as the first organic film material gas and the second organic film material gas, and an inert gas such as N ₂ gas, He gas, or Ar gas And is supplied into the processing vessel 11 together with the carrier gas contained therein. Examples of the first organic film material gas and the second organic film material gas used for forming the polyimide film include pyromellitic dianhydride and 4,4'-oxydianiline. When the organic film is formed, the first organic film material gas and the second organic film material gas are simultaneously supplied into the processing container 11 by simultaneously opening and closing the open / close valves 31 and 32.

The exhaust unit 3 includes an exhaust pipe 41 connected to a position opposite to the gas introduction portion of the side wall of the processing vessel 11, a pressure control valve 42 provided in the exhaust pipe 41, an exhaust pipe 41 A vacuum pump 43 for exhausting the inside of the processing vessel 11 through the exhaust pipe 41 and an exhaust gas processing facility 44 provided on the downstream side of the vacuum pump 43 in the exhaust pipe 41. The temperature control medium is also passed through the exhaust pipe 41 from the second temperature control unit 14 to adjust the temperature to a second temperature at which film formation of the organic film by deposition polymerization does not occur.

The control unit 4 controls each component of the laminated sealing film forming apparatus 100 such as the opening and closing valves 29, 30, 31 and 32, the vacuum pump 43, the first and second temperature adjusting units 13 and 14, And has a microprocessor (computer). The control unit 4 stores a process recipe, which is a program for executing the process of forming the laminated sealing film by alternately forming the inorganic film and the organic film in the laminated sealing film forming apparatus 100, in the storage medium therein, Recipe is called to execute a process of forming a laminated sealing film on the laminated sealing film forming apparatus 100. [

Next, a method of forming the laminated sealing film will be described.

An organic EL element S having a lower electrode 102, an organic EL layer 103, and an upper electrode 104 formed on a substrate 101 is first prepared as shown in Fig. Further, another layer such as an electron transport layer may be formed.

The material of the substrate 101 is not particularly limited, and examples thereof include a glass plate, a ceramic span, a plastic film, and a metal plate. The lower electrode 102 and the organic EL layer 103 are formed in the banks 105 in the form of a matrix. Therefore, a plurality of organic EL layers 103 are formed on the substrate 101 in an island shape. In addition, a driving circuit (not shown) is formed on the substrate 101.

The organic EL layer includes an organic luminescent material capable of injecting electrons and holes from the electrode and capable of recombining holes and electrons to move the injected charges to emit light. The organic luminescent material may be an organic material of low molecular weight or high molecular weight generally used for the luminescent layer, and is not particularly limited.

When the sealing film is formed on the thus obtained organic EL element S, the organic EL element S is brought into the processing container 11 of the forming apparatus 100 of Fig. 1 and is stacked on the loading table 12. Fig. At this time, the temperature of the upper surface of the loading table 12 is adjusted by the first temperature adjusting unit 13 to a first temperature at which the organic film can be formed, for example, 100 占 폚 by vapor deposition polymerization, The temperature of the portion other than the mounting table 12 such as the wall portion of the processing vessel 11 is adjusted to a second temperature, for example, 150 占 폚, at which film formation of the organic film by vapor deposition polymerization does not occur. The inside of the processing container 11 is depressurized to a predetermined pressure by the pressure control valve 42 while evacuating by the vacuum pump 43 to form the inorganic film by the ALD method first, Film deposition of the organic film is performed and these are alternately repeated a plurality of times to produce a laminated sealing film 203 in which the inorganic film 201 and the organic film 202 are laminated a plurality of times as shown in Fig. As the laminated water, it is preferable that the inorganic film 201 has five or more layers. 3 shows a case where the inorganic film 201 has five layers and the organic film 202 has four layers.

When the inorganic film 201 is formed by the ALD method, the first inorganic film raw material gas supply unit 21 performs the processing from the first inorganic film raw material gas supply unit 21 to the first inorganic film raw material gas supply unit 21 by switching the opening / closing operations of the first opening / closing valve 29 and the second opening / Supply of the first inorganic film source gas to the vessel 11 and supply of the second inorganic film source gas from the second inorganic film source gas supply unit 22 to the processing vessel 11 are carried out from a purge gas pipe The purging of the processing vessel 11 by the purge gas of the processing vessel 11 is carried out alternately. The first inorganic film source gas is a compound gas and the second inorganic film source gas is a reducing gas. After the first inorganic film source gas is first adsorbed on the surface of the organic EL element S, To form a very thin unit film. By repeating this process, an inorganic film 201 having a predetermined film thickness is formed.

The inorganic film 201 has a function of sealing moisture or oxygen and is an insulating film. When the film is formed by the ALD method, the film becomes a film with less defects and good coverage, resulting in a thin film having a high sealing function. As such an inorganic film 201, aluminum oxide (Al ₂ O ₃ ) can be suitably used. The Al ₂ O ₃ film has a high sealing property, and ALD film formation results in a film having a very small defect and a good coverage.

When an Al ₂ O ₃ film is formed as an inorganic film, trimethyl aluminum (TMA) can be appropriately used as the first inorganic film source gas, and H ₂ O gas or O ₃ can be appropriately used as the second inorganic film source gas Can be used.

The third open / close valve 31 and the fourth open / close valve 32 are opened so that the first organic film material gas supply unit 23 and the second organic film < RTI ID = 0.0 > The first organic film material gas and the second organic film material gas are simultaneously supplied from the raw material gas supply unit 24 to the processing container 11. [ The first organic film material gas and the second organic film material gas are monomers, which are deposited on the organic EL device S and polymerized to form the organic film 202. [

The organic film 202 has a function of separating defects and cracks generated in the inorganic film from other layers and suppressing the generation of cracks in the inorganic film due to bending of the substrate. By using the vapor deposition polymerization method, And thinning becomes easy. As the organic film 202, a transparent resin material is used, and polyurea or polyimide can be suitably used. Of these, polyurea is particularly preferable. The polyurea film is suitable as the organic film 202 of the laminated sealing film 203 because of its high transparency, very good coverage and favorable thickness.

When a polyurea film is formed as an organic film, as the first organic film material gas and the second organic film material gas, a diamine monomer and an isocyanate monomer can be used. These are fed into the processing vessel 11 together with a carrier gas containing an inert gas such as N ₂ gas, He gas or Ar gas to polymerize these monomers to form a polyurea film. When the polyimide film is formed, pyromellitic dianhydride and 4,4'-oxydianiline can be used as the first organic film material gas and the second organic film material gas. These are likewise fed into the processing vessel 11 together with the carrier gas to polymerize to form a polyimide film.

The thickness of the inorganic film 201 is preferably 50 nm or less, more preferably 30 nm or less. From the viewpoint of ensuring the sealing performance, 10 nm or more is preferable. The film thickness of the organic film 202 is preferably 500 nm or less, more preferably 200 nm or less. From the viewpoint of obtaining a good film-forming property, 50 nm or more is preferable. The total thickness of the laminated sealing film 203 is preferably 1 占 퐉 or less, more preferably 0.5 占 퐉 or less.

When the organic film 202 is formed by the vapor deposition polymerization method, the temperature of the mounting surface of the loading table 12 is adjusted by the first temperature adjusting unit 13 to the first temperature at which the organic film can be formed by vapor deposition polymerization And the temperature of the portion other than the loading table 12 is adjusted to the second temperature at which film formation of the organic film by the deposition polymerization does not occur by the second temperature adjusting unit 14. [ The deposition polymerization reaction occurs at a temperature below the predetermined temperature, and if the temperature is higher than the above temperature, the deposition polymerization reaction does not occur. Thus, by controlling the temperature in this manner, the organic film 202 is deposited only on the organic EL element S to be processed, It is possible to prevent the film from being formed almost at portions other than the base 12. If the organic film is formed thicker than the inorganic film and attached to a part other than the mounting table 12 such as the wall of the processing container 11, the maintenance period becomes shorter. However, Temperature is controlled to a second temperature at which film formation of an organic film by vapor deposition polymerization does not occur, such a problem can be prevented from occurring. In addition, since the organic film is less likely to be generated on the portion other than the stacking table 12, the organic film on the portion other than the stacking table 12 is less likely to be adversely affected when the inorganic film 201 is formed by the ALD method .

When the polyurea film is used as the organic film 202, the first temperature is 100 占 폚 or less, preferably 50 to 100 占 폚, and the second temperature is higher than 100 占 폚, preferably 150 to 180 占 폚.

When the inorganic film 201 is formed by the ALD method, a film can be formed over a wide range from room temperature to several hundreds of degrees Celsius. However, considering the treatment efficiency, it is preferable to perform film formation without changing the temperature setting at the organic film 202 Do. Since the inorganic film 201 is thinner than the organic film 202 although the film is also formed in a portion other than the mounting table 12 such as the wall portion of the processing container 11 set at the second temperature, , The thickness of the film formed on the portion other than the mounting table 12 is thin and does not greatly affect the maintenance property. Further, since the film formed on the portion other than the stacking table 12 is thin, adverse effects are not likely to be adversely affected when the organic film 202 is formed.

Conventionally, in such a laminated sealing film, the sealing performance is intended to be increased by increasing the film thickness per one layer. For example, as shown in Fig. 4, an inorganic film 201 'having a film thickness of several tens to several hundreds nm and an organic film 202' having a thickness of about several micrometers are laminated in three layers by a CVD method or a sputtering method Thereby forming a laminated sealing film 203 'having a total thickness of several micrometers.

However, when the film thickness of the laminated sealing film is increased, the light transmittance is lowered. 5, the gap between the organic EL layer 103, which is a light emitting layer, and the color filter 301 becomes wide, so that the red color of the color filter 301 from the organic EL layer The extraction angle of light to the filter portion 302 corresponding to the red (R), green (G) and blue (B) is small. In addition, since the gap between the organic EL layer 103 and the color filter 301 is wide, light leakage to the adjacent filter portion 302 is liable to occur. Therefore, the black matrix (BM) 303 is required to be increased to increase the light shielding property, and the area of the filter portion is relatively small. As described above, when the light extraction angle? Is small and the area of the black matrix (BM) 303 is large, the light extraction efficiency is lowered.

As described above, since the laminated sealing film is thickened, the light transmittance is lowered and the light extraction efficiency is lowered, and the required image quality is hardly obtained.

On the other hand, in the present embodiment, the inorganic film 201 is formed by the ALD method and the organic film 202 is formed by the evaporation polymerization method, so that the film thickness thereof is made thin. The inorganic film 201 by the ALD method, in particular, the Al ₂ O ₃ film is a film having a small defect and a good coverage and being thin and having a high sealing function, and the organic film 202 by the vapor deposition polymerization method, Or the polyimide film has good coverage and facilitates thinning. Therefore, even if they are laminated by a laminated water capable of securing the sealing performance, the total thickness of the laminated sealing film 203 can be reduced to about 1 占 퐉 or less. Thereby, the light transmittance of the laminated sealing film 203 can be increased. 6, the gap between the organic EL layer 103 and the color filter 301 is narrower than in the prior art, so that the light extraction angle? To the filter portion 302 can be widened as compared with the conventional one. In addition, since light leakage is less likely to occur, the area of the black matrix (BM) 303 can be made smaller than in the prior art. As a result, the light extraction efficiency is improved as compared with the prior art. In addition, although the ALD method has a slower film formation rate than the CVD method and the sputtering method, the entire film thickness can be made thinner, so that the entire film formation time can be made equal to or less than that of the conventional method.

Further, conventionally, when the laminated sealing film is produced, since the inorganic film and the organic film are heterogeneous films, it is common knowledge that the film is formed by a separate device. Therefore, each time the stacking is repeated, it takes time to transport the substrate between the devices, and the productivity is lowered as the number of stacking is increased. Also, at the time of transportation, the probability that particles such as particles adhere to the device increases, and the probability of occurrence of defects that lower the sealing performance by foreign matter also increases.

On the contrary, in the present embodiment, the inorganic film 201 and the organic film 202 are formed in one apparatus processing container, contrary to the above-mentioned technical knowledge. As a result, the inorganic film 201 and the organic film 202 can be repeatedly formed to form the laminated sealing film 203 without transporting the organic EL element S to be processed between different devices, It is possible to prevent the deterioration of the productivity and also prevent the foreign matter from adhering to the conveying path.

That is, in the present embodiment, since the inorganic film is formed by the ALD method and the organic film is formed by the evaporation polymerization method at the time of forming the laminated sealing film, these films can be formed thin and the inorganic film by the ALD method is thin, It is possible to reduce the film thickness of the entire laminated sealing film even if these are laminated by a laminated water capable of securing the sealing performance. Further, since the inorganic film and the organic film are formed in the same processing vessel, the productivity can be reduced and foreign matter adhesion can be suppressed.

Further, the present invention is not limited to the above-described embodiment and can be modified in various ways. For example, in the above-described embodiment, an example is shown in which an Al ₂ O ₃ film is used as an inorganic film by an ALD method and a polyurea or polyimide is used as an organic film by an evaporation polymerization method, but the present invention is not limited thereto . In the above embodiment, a laminated sealing film is formed by a single-wafer type device. However, a batch type device for collectively forming a laminated sealing film on a plurality of organic EL elements may be used.

1:
2: gas supply part
3: Exhaust unit
4:
11: Processing vessel
12: Loading stand
13: first temperature control unit
14: second temperature control unit
21: First inorganic film raw material gas supply unit
22: the second inorganic film raw material gas supply unit
23: First organic film raw material gas supply unit
24: second organic film raw material gas supply unit
29, 30, 31, 32: opening / closing valve
25, 26, 27, 28: gas supply piping
41: Exhaust piping
42: Pressure control valve
43: Vacuum pump
44: Exhaust gas treatment plant
100: Laminated sealing film forming apparatus
101: substrate
102: lower electrode
103: organic EL layer
104: upper electrode
201: inorganic film
202: organic film
203: laminated sealing film
301: Color filter
302:
303: Black Matrix
S: organic EL device

Claims (10)

A laminated sealing film forming method for forming a laminated sealing film having a structure in which an inorganic film and an organic film are laminated on an organic EL element in which a plurality of organic EL layers as a light emitting layer are formed on a substrate,
A step of forming an inorganic film by atomic layer deposition;
A step of forming an organic film by a vapor deposition polymerization method,
Alternately repeating a plurality of times in one processing vessel,
Wherein the inorganic film is formed and the organic film is formed in a state where the organic EL element is stacked on the stacking stage in the processing vessel and in the step of forming the inorganic film and the step of forming the organic film, Is a temperature controllable to a first temperature at which the organic film can be formed by vapor deposition polymerization, and the part other than the loading table including the exhaust pipe connected at a position opposed to the gas introducing part of the processing container, And the temperature is adjusted to a second temperature at which film formation of the film does not occur. The method according to claim 1,
Wherein the inorganic film is made of aluminum oxide. 3. The method according to claim 1 or 2,
Wherein a polyurea or polyimide is used as said organic film. 3. The method according to claim 1 or 2,
Wherein the inorganic film has a thickness of 50 nm or less and the organic film has a thickness of 500 nm or less. 3. The method according to claim 1 or 2,
Wherein the film thickness of the laminated sealing film is 1 占 퐉 or less. delete A laminated sealing film forming apparatus for forming a laminated sealing film having a structure in which an inorganic film and an organic film are laminated on an organic EL element in which a plurality of organic EL layers as a light emitting layer are formed on a substrate,
A processing container in which the organic EL device is accommodated,
A first inorganic film raw material gas supply unit and a second inorganic film raw material gas supply unit for supplying the first inorganic film raw material gas and the second inorganic film raw material gas for forming the inorganic film by the atomic layer deposition method into the processing vessel ,
A first organic film material gas supply unit and a second organic film material gas supply unit for supplying the first organic film material gas and the second organic film material gas for forming the organic film by the deposition polymerization method into the processing container,
An exhaust unit for exhausting the interior of the processing vessel,
The first inorganic film raw material gas and the second inorganic film raw material gas are alternately supplied into the processing container to form the inorganic film by an atomic layer deposition method; And a control unit for controlling the supply of the raw material gas simultaneously to the processing vessel so as to alternately repeat the formation of the organic film by the vapor deposition polymerization method a plurality of times,
A stacking table for stacking the organic EL elements in the processing container,
A first temperature adjusting unit for adjusting the temperature of the mounting surface of the mounting table to a first temperature at which the organic film can be formed by vapor deposition polymerization in the step of forming the inorganic film and the step of forming the organic film,
Wherein the temperature of the portion other than the mounting table including the exhaust pipe connected to the position opposite to the gas introduction portion of the processing container in the step of forming the inorganic film and the step of forming the organic film And a second temperature adjustment unit for adjusting the temperature to a second temperature at which film formation does not occur. 8. The method of claim 7,
And aluminum oxide is used as the inorganic film. 9. The method according to claim 7 or 8,
Characterized in that polyurea or polyimide is used as said organic film. delete

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