[go: up one dir, main page]
More Web Proxy on the site http://driver.im/

KR101870421B1 - Ems antenna module and method of manufacturing the same and semiconductor package including the same - Google Patents

Ems antenna module and method of manufacturing the same and semiconductor package including the same Download PDF

Info

Publication number
KR101870421B1
KR101870421B1 KR1020160162604A KR20160162604A KR101870421B1 KR 101870421 B1 KR101870421 B1 KR 101870421B1 KR 1020160162604 A KR1020160162604 A KR 1020160162604A KR 20160162604 A KR20160162604 A KR 20160162604A KR 101870421 B1 KR101870421 B1 KR 101870421B1
Authority
KR
South Korea
Prior art keywords
substrate
radiation angle
encapsulant
ems
antenna pattern
Prior art date
Application number
KR1020160162604A
Other languages
Korean (ko)
Other versions
KR20180063403A (en
Inventor
권용태
이준규
이재천
Original Assignee
주식회사 네패스
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by 주식회사 네패스 filed Critical 주식회사 네패스
Priority to KR1020160162604A priority Critical patent/KR101870421B1/en
Priority to PCT/KR2017/013910 priority patent/WO2018101767A1/en
Publication of KR20180063403A publication Critical patent/KR20180063403A/en
Application granted granted Critical
Publication of KR101870421B1 publication Critical patent/KR101870421B1/en

Links

Images

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01Q—ANTENNAS, i.e. RADIO AERIALS
    • H01Q1/00—Details of, or arrangements associated with, antennas
    • H01Q1/12—Supports; Mounting means
    • H01Q1/22—Supports; Mounting means by structural association with other equipment or articles
    • H01Q1/2283—Supports; Mounting means by structural association with other equipment or articles mounted in or on the surface of a semiconductor substrate as a chip-type antenna or integrated with other components into an IC package
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/48—Arrangements for conducting electric current to or from the solid state body in operation, e.g. leads, terminal arrangements ; Selection of materials therefor
    • H01L23/488—Arrangements for conducting electric current to or from the solid state body in operation, e.g. leads, terminal arrangements ; Selection of materials therefor consisting of soldered or bonded constructions
    • H01L23/498—Leads, i.e. metallisations or lead-frames on insulating substrates, e.g. chip carriers
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/48—Arrangements for conducting electric current to or from the solid state body in operation, e.g. leads, terminal arrangements ; Selection of materials therefor
    • H01L23/488—Arrangements for conducting electric current to or from the solid state body in operation, e.g. leads, terminal arrangements ; Selection of materials therefor consisting of soldered or bonded constructions
    • H01L23/498—Leads, i.e. metallisations or lead-frames on insulating substrates, e.g. chip carriers
    • H01L23/49811—Additional leads joined to the metallisation on the insulating substrate, e.g. pins, bumps, wires, flat leads
    • H01L23/49816—Spherical bumps on the substrate for external connection, e.g. ball grid arrays [BGA]
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/48—Arrangements for conducting electric current to or from the solid state body in operation, e.g. leads, terminal arrangements ; Selection of materials therefor
    • H01L23/488—Arrangements for conducting electric current to or from the solid state body in operation, e.g. leads, terminal arrangements ; Selection of materials therefor consisting of soldered or bonded constructions
    • H01L23/498—Leads, i.e. metallisations or lead-frames on insulating substrates, e.g. chip carriers
    • H01L23/49827—Via connections through the substrates, e.g. pins going through the substrate, coaxial cables
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/52—Arrangements for conducting electric current within the device in operation from one component to another, i.e. interconnections, e.g. wires, lead frames
    • H01L23/522—Arrangements for conducting electric current within the device in operation from one component to another, i.e. interconnections, e.g. wires, lead frames including external interconnections consisting of a multilayer structure of conductive and insulating layers inseparably formed on the semiconductor body
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/52—Arrangements for conducting electric current within the device in operation from one component to another, i.e. interconnections, e.g. wires, lead frames
    • H01L23/522—Arrangements for conducting electric current within the device in operation from one component to another, i.e. interconnections, e.g. wires, lead frames including external interconnections consisting of a multilayer structure of conductive and insulating layers inseparably formed on the semiconductor body
    • H01L23/5226—Via connections in a multilevel interconnection structure
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/58—Structural electrical arrangements for semiconductor devices not otherwise provided for, e.g. in combination with batteries
    • H01L23/64—Impedance arrangements
    • H01L23/66—High-frequency adaptations
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01Q—ANTENNAS, i.e. RADIO AERIALS
    • H01Q1/00—Details of, or arrangements associated with, antennas
    • H01Q1/12—Supports; Mounting means
    • H01Q1/22—Supports; Mounting means by structural association with other equipment or articles
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01Q—ANTENNAS, i.e. RADIO AERIALS
    • H01Q1/00—Details of, or arrangements associated with, antennas
    • H01Q1/12—Supports; Mounting means
    • H01Q1/22—Supports; Mounting means by structural association with other equipment or articles
    • H01Q1/24—Supports; Mounting means by structural association with other equipment or articles with receiving set
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01Q—ANTENNAS, i.e. RADIO AERIALS
    • H01Q1/00—Details of, or arrangements associated with, antennas
    • H01Q1/12—Supports; Mounting means
    • H01Q1/22—Supports; Mounting means by structural association with other equipment or articles
    • H01Q1/24—Supports; Mounting means by structural association with other equipment or articles with receiving set
    • H01Q1/241—Supports; Mounting means by structural association with other equipment or articles with receiving set used in mobile communications, e.g. GSM
    • H01Q1/242—Supports; Mounting means by structural association with other equipment or articles with receiving set used in mobile communications, e.g. GSM specially adapted for hand-held use
    • H01Q1/243—Supports; Mounting means by structural association with other equipment or articles with receiving set used in mobile communications, e.g. GSM specially adapted for hand-held use with built-in antennas
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01Q—ANTENNAS, i.e. RADIO AERIALS
    • H01Q1/00—Details of, or arrangements associated with, antennas
    • H01Q1/36—Structural form of radiating elements, e.g. cone, spiral, umbrella; Particular materials used therewith
    • H01Q1/38—Structural form of radiating elements, e.g. cone, spiral, umbrella; Particular materials used therewith formed by a conductive layer on an insulating support
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2223/00—Details relating to semiconductor or other solid state devices covered by the group H01L23/00
    • H01L2223/58—Structural electrical arrangements for semiconductor devices not otherwise provided for
    • H01L2223/64—Impedance arrangements
    • H01L2223/66—High-frequency adaptations
    • H01L2223/6661—High-frequency adaptations for passive devices
    • H01L2223/6677—High-frequency adaptations for passive devices for antenna, e.g. antenna included within housing of semiconductor device
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/02—Bonding areas; Manufacturing methods related thereto
    • H01L2224/04—Structure, shape, material or disposition of the bonding areas prior to the connecting process
    • H01L2224/04105—Bonding areas formed on an encapsulation of the semiconductor or solid-state body, e.g. bonding areas on chip-scale packages
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/10—Bump connectors; Manufacturing methods related thereto
    • H01L2224/12—Structure, shape, material or disposition of the bump connectors prior to the connecting process
    • H01L2224/12105—Bump connectors formed on an encapsulation of the semiconductor or solid-state body, e.g. bumps on chip-scale packages
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/18—High density interconnect [HDI] connectors; Manufacturing methods related thereto
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/18—High density interconnect [HDI] connectors; Manufacturing methods related thereto
    • H01L2224/23—Structure, shape, material or disposition of the high density interconnect connectors after the connecting process
    • H01L2224/24—Structure, shape, material or disposition of the high density interconnect connectors after the connecting process of an individual high density interconnect connector
    • H01L2224/241—Disposition
    • H01L2224/24151—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive
    • H01L2224/24153—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being arranged next to each other, e.g. on a common substrate
    • H01L2224/24195—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being arranged next to each other, e.g. on a common substrate the item being a discrete passive component
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42—Wire connectors; Manufacturing methods related thereto
    • H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
    • H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
    • H01L2224/481—Disposition
    • H01L2224/48151—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive
    • H01L2224/48221—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked
    • H01L2224/48225—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being non-metallic, e.g. insulating substrate with or without metallisation
    • H01L2224/48227—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being non-metallic, e.g. insulating substrate with or without metallisation connecting the wire to a bond pad of the item

Landscapes

  • Engineering & Computer Science (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Computer Hardware Design (AREA)
  • Power Engineering (AREA)
  • Computer Networks & Wireless Communication (AREA)
  • Variable-Direction Aerials And Aerial Arrays (AREA)
  • Structures Or Materials For Encapsulating Or Coating Semiconductor Devices Or Solid State Devices (AREA)

Abstract

An EMS antenna module and a semiconductor package including the EMS antenna module are disclosed. An EMS antenna module according to an embodiment of the present invention includes a substrate including an antenna pattern and a via hole, a first encapsulant on the substrate, and a radiation angle adjusting unit for adjusting a signal radiation angle of the antenna. The radiation angle of the antenna signal can be maintained through the radiation angle adjuster of the EMS antenna module to improve the signal transmission speed and the semiconductor package including the semiconductor package can operate normally while maintaining the inherent performance from the electromagnetic interference or the obstacle.

Description

TECHNICAL FIELD [0001] The present invention relates to an EMS antenna module, a manufacturing method thereof, and a semiconductor package including the EMS antenna module,

The present invention relates to an EMS antenna module, a method of manufacturing the EMS antenna module, and a semiconductor package including the EMS antenna module. More particularly, the present invention relates to an EMS antenna module for improving the signal transmission speed and distance, To a semiconductor package capable of preventing signal interference.

Recently, the advanced electronic industry has developed remarkably according to the development of semiconductor technology, and the generation of electromagnetic waves has increased sharply. Many of the electromagnetic waves generated by such electronic devices cause problems because they interfere with normal operation of other electronic devices.

Electromagnetic Compatibility (EMC) refers to the ability of electromagnetic waves emitted from a device that generates electromagnetic waves to operate normally from the effects of electromagnetic waves from other devices, while not impairing the performance of other devices. Electrons are referred to as electromagnetic interference (EMI) or electromagnetic interference (EMI), and unwanted electromagnetic waves incidentally generated from the electronic apparatus are radiated into a space or conducted through a power line to cause an electromagnetic interference to the device itself or another device . The latter is referred to as Electromagnetic Susceptibility (EMS) and refers to the ability of an apparatus or system to operate without performance degradation in the presence of electromagnetic interference, while maintaining its inherent performance from the effects of radiated or conducted unwanted electromagnetic waves The ability to operate.

A semiconductor package including an antenna for handling a signal such as a network module is required to have various electromagnetic wave shielding or radiation structures in order to excellently implement electromagnetic interference (EMI) or electromagnetic interference immunity (EMS) characteristics as well as miniaturization.

In a conventional fan-out semiconductor package, a semiconductor chip is attached to a PCB substrate having an antenna pattern by using an adhesive, and electrically connected to the PCB substrate through wire bonding. Such a conventional package structure can receive electromagnetic interference in the signal transmission of an antenna from an external device or the like, and it is difficult to expect a high transmission speed because the signal concentration of the antenna is low. In addition, not only the final package thickness due to the wire bonding and the PCB substrate is thickened but also the electrical performance is deteriorated as the loop length of the wire becomes longer.

Korean Patent Publication No. 10-2016-0067961 (Intel Corporation)

The present invention provides a fan-out package that improves the transmission speed and distance by optimizing the radiation angle of the antenna module by inserting the EMS structure, and protects the EMS antenna module from oxidation and damage by embedding the EMS antenna module in a semiconductor package.

According to an aspect of the present invention, there is provided an EMS antenna module comprising: a substrate including an upper surface having an antenna pattern formed thereon and a lower surface facing the upper surface; A first encapsulant provided on an upper surface of the substrate; And a radiation angle adjusting unit positioned to surround the substrate and the first encapsulation member and adjusting a signal radiation angle of the antenna pattern, wherein the radiation angle adjusting unit is spaced apart from the antenna pattern.

In addition, the substrate may include a via hole passing through the upper and lower surfaces of the substrate, and the antenna pattern may be electrically connected through the via hole.

In addition, the via hole may include a connection extension portion extending along the lower surface of the substrate at a lower portion of the via hole.

The upper surface of the substrate may be provided with a protection layer covering the antenna pattern, and the lower surface of the substrate may be provided with a protection layer covering the connection extension portion.

The upper surface of the radiation angle adjusting portion may be coplanar with the upper surface of the first encapsulant.

The lower surface of the radiation angle adjusting portion may be flush with the lower surface of the substrate.

In addition, the radiation angle adjusting unit may have an inner side inclined so that a signal emission angle of the antenna pattern is reduced.

A method of manufacturing an EMS antenna module according to an embodiment of the present invention includes disposing a substrate having an antenna pattern on a first carrier, sealing the substrate with a first encapsulation material, And a step of forming recesses to be recessed from the upper surface of the first encapsulation member, filling the recesses with a conductive member, cutting the conductive member and the substrate, and separating them into respective modules.

Also, the upper surface of the first encapsulant may be ground prior to removing the first carrier.

Further, it is possible to attach the first tape to the surface from which the first carrier is removed before forming the groove, and to remove the first tape after forming the groove.

In addition, a second tape may be attached to the lower surface of the substrate before cutting the conductive member and the substrate.

According to an aspect of the present invention, there is provided a semiconductor package including an EMS antenna module, the substrate including an antenna pattern formed on an upper surface thereof and a via hole connected to the antenna pattern, And a radiation angle adjusting unit positioned to surround the substrate and the first encapsulation member and adjusting a signal radiation angle of the antenna pattern. A semiconductor chip; A second encapsulant for molding the EMS antenna module and the semiconductor chip to be integrated; A wiring part provided below the EMS antenna module and the semiconductor chip and electrically connected to the EMS antenna module and the semiconductor chip; And an external connection terminal electrically connected to the wiring portion.

The wiring portion may include a first insulation layer that exposes signal pads of the semiconductor chip and a via hole of the EMS antenna module, a re-wiring layer electrically connected to the signal pad and the via hole, and a second insulation layer that electrically isolates the re- An insulating layer, and a bump metal layer electrically connected to the re-wiring layer.

The second encapsulant may be the same material as the first encapsulant.

The radiation angle adjusting portion may extend to the lower portion of the substrate and may be connected to the wiring portion.

In addition, the radiation angle adjusting unit may have an inner side inclined so that a signal emission angle of the antenna pattern is reduced.

The EMS antenna module and the semiconductor package including the EMS antenna module according to the embodiment of the present invention can improve the transmission speed of the antenna signal by adjusting the optimal radiation angle.

Also, by making the radiation angle adjuster ground to the ground, it is possible to absorb the signal radiated to the side, thereby reducing the noise.

In addition, EMS antenna modules can be used to improve overall package thickness reduction and electrical signal transmission speed, rather than wire-bonded PCB substrates with built-in antennas.

In addition, an EMS antenna module can be built in the package to protect against oxidation and damage.

1 is a cross-sectional view illustrating an EMS antenna module according to an embodiment of the present invention.
2 to 9 are cross-sectional views illustrating a method of manufacturing the EMS antenna module of FIG.
10 is a cross-sectional view illustrating a wire bonding semiconductor package having a conventional antenna.
11 is a cross-sectional view illustrating a semiconductor package including the EMS antenna module of FIG.
12 to 18 are sectional views for explaining a method of manufacturing the semiconductor package of FIG.
19 is a cross-sectional view illustrating a semiconductor package according to an embodiment of the present invention.
20 is a cross-sectional view illustrating a semiconductor package according to an embodiment of the present invention.

Hereinafter, embodiments of the present invention will be described in detail with reference to the accompanying drawings. It is to be understood that the embodiments described below are provided only to illustrate the present invention and are not intended to limit the scope of the present invention. The present invention may be embodied in other embodiments. In order to explain the present invention clearly, parts not related to the description are omitted in the drawings, and the width, length, thickness, etc. of the components in the drawings may be exaggerated for convenience. Like reference numerals designate like elements throughout the specification. In addition, the following terms "and / or" include any one of the listed items and any combination of one or more of them.

1 is a cross-sectional view illustrating an EMS antenna module 100 according to an embodiment of the present invention.

Referring to FIG. 1, an EMS antenna module 100 according to an exemplary embodiment of the present invention includes a substrate 110, a first encapsulant 120, and a radiation angle controller 130 on which an antenna pattern 113 is formed do.

The substrate 110 may be a via frame including a via hole 114 vertically penetrating the substrate 110. For example, the substrate 110 may be a printed circuit board (PCB) on which the antenna pattern 113 is formed, or an insulation substrate. The insulating frame may comprise an insulating material. For example, silicon, glass, ceramic, plastic, or polymer.

An antenna pattern 113 may be provided on the upper surface 111 of the substrate 110. The antenna pattern 113 may extend along the upper surface 111 of the substrate 110 and form a pattern. The antenna pattern 113 may be a conductive material and may include, for example, a metal, and may include copper (Cu), aluminum (Al), silver (Ag), or an alloy thereof.

The antenna pattern 113 may be formed using various methods such as vapor deposition, plating, and the like. For example, the antenna pattern 113 may be formed on the upper surface 111 of the substrate 110 by an LDS (Laser Direct Structuring) method. The LDS method refers to forming a metal pattern through a plating process after patterning using a laser on the surface of a thermoplastic resin formed by injection or the like. The surface of the resin processed through the laser processing can have a rough surface, and the anchoring effect can increase the adhesion of the plating metal. The antenna pattern 113 may be formed in various ways other than the above-described method.

The via hole 114 may be formed to penetrate the upper surface 111 of the substrate 110 and the lower surface 112 of the substrate 110 on which the antenna pattern 113 is formed. The via hole 114 may be filled with a conductive material, and the conductive material may include a metal, for example, copper (Cu), aluminum (Al), silver (Ag) . The conductive material filled in the via hole 114 and the antenna pattern 113 may be the same conductive material and may be connected to one end of the antenna pattern 113. Therefore, the antenna pattern 113 can be connected to the lower surface 112 of the substrate via the via hole 114.

A connection extension portion 115 may be formed on the lower surface 112 of the substrate 110 so that a conductive material filled in the via hole 114 extends along the lower surface 112. The connection extension portion 115 is provided to have an area larger than the area of the via hole 114, thereby improving the connection reliability with the wiring portion of the package in which the EMS antenna module 100 is mounted.

As shown in the figure, the antenna pattern 113 and the connection extension portion 115 may be formed integrally with the via hole 114. Alternatively, unlike the drawing, the connection extension part 115 may be in the form of a pad attached to one end of the via hole 114.

The substrate 110 may further include a protective layer 116 on the top surface 111 and the bottom surface 112. The protective layer 116 is formed to cover the upper surface 111 of the substrate 110 on which the antenna pattern 113 is formed and the lower surface 112 on which the connection extension portion 115 is formed, Thereby protecting the extension portion 115. [

For example, if the substrate 110 is a printed circuit board, the protective layer 116 may be a solder resist. The solder resist is a functional coating material to be applied to a printed circuit board, masking and protecting the surface circuit of the substrate, and preventing solder bridging during soldering. The solder resist may be formed by a photo process such as PSR (Photo Solder Resist), LPI (Liquid Photo Imaging), or an IR (Infra Red) process.

The first encapsulant 120 may be formed on the top surface 111 of the substrate 110. The first encapsulant 120 may comprise an insulating material and may include, for example, an epoxy molding compound (EMC), an encapsulant, a PPG (prepreg) or a PI (polyimide). have. The first encapsulant 120 is provided to cover the upper portion of the substrate 110 to protect the antenna pattern 113 formed on the upper surface 111 from an external impact.

The radiation angle adjusting unit 130 may be spaced apart from the substrate 110 and the first encapsulation member 120 without being connected to the antenna pattern 113. [

1, the radiation angle adjusting unit 130 is formed on both sides of the EMS antenna module 100 so as to be spaced apart from the antenna pattern 113 to adjust the signal radiation angle A of the antenna Lt; / RTI > In addition, when the cross-sectional view is viewed from the side, the radiation angle adjusting portion 130 may have a rectangular shape or a triangular shape in the vertical direction. Although a rectangular shape is shown in the drawing, it is needless to say that the present invention may be provided in various shapes other than the above formations.

The radiation angle adjuster 130 may include a metal and may include, for example, copper (Cu), gold (Au), silver (Ag), titanium (Ti), or an alloy thereof. Meanwhile, the radiation angle adjusting unit 130 may be formed by a process such as electroless plating, electrolytic plating, sputtering, or printing.

The upper surface of the radiation angle adjusting part 130 may be flush with the upper surface of the first encapsulant 120. This is to adjust the signal radiation angle A of the antenna pattern 113 by forming the height of the radiation angle adjusting part 130 by the thickness of the first encapsulant 120. The lower surface of the radiation angle adjusting part 130 may be equal to or lower than a height at which the antenna pattern 113 of the EMS antenna module 100 is formed. That is, the lower surface of the radiation angle adjusting portion 130 is positioned on the interface between the first encapsulant 120 and the substrate 110 or the core layer (not shown) of the substrate 110 below the first encapsulant 120 can do. This is to prevent the signal of the antenna pattern 113 from being radiated to the side, so as not to affect other devices (not shown) mounted together.

Meanwhile, the lower surface of the radiation angle adjusting part 130 may be flush with the lower surface of the substrate 110 (see FIG. 19). The upper and lower lengths of the radiation angle adjusting unit 130 are formed to be equal to the height of the EMS antenna module 100 and are grounded to the ground so that signals radiated to the side are absorbed to prevent interference such as crosstalk . The bottom surface of the radiation angle adjusting portion 130 may be connected to the wiring portion.

Also, the radiation angle adjusting unit 130 may be inclined so that the signal radiation angle A of the antenna pattern 113 becomes small (see FIG. 20). For example, the radiating angle adjuster 130 may have an inverted trapezoidal shape with the upper side longer than the lower side, or an inverted triangle shape with the base lower side and the vertex lower side. 20 shows an inverted trapezoidal shape, but the present invention is not limited thereto, and any shape can be included in the technical idea of the present invention as long as the signal emission angle A of the antenna can be reduced. It is possible to concentrate the signal by reducing the signal emission angle A of the antenna, thereby improving the signal transmission speed.

FIGS. 2 to 9 are cross-sectional views illustrating a method of fabricating the EMS antenna module 100 of FIG. 1 according to an embodiment of the present invention.

2 shows a process of attaching the substrate 110 to the first carrier 140. Fig.

2, a strip substrate 110a in which a unit substrate 110 including an antenna pattern 113 connected to a via hole 114 is continuously provided, and the strip substrate 110a is divided into a first Is placed on the carrier (140). The strip substrate 110a may be fixed to the first carrier 140 by the first adhesive layer 141. [ At this time, the strip substrate 110a is disposed on the first carrier 140 with the antenna pattern 113 facing upward.

Although a strip substrate 110a is shown in which two unit substrates 110 are connected to each other, a strip substrate having three or more unit substrates 110 connected thereto may be used. In this case, a plurality of EMS antenna modules (100) can be produced.

The first carrier 140 is for supporting the strip substrate 110a and may be made of a material having a high rigidity and a low thermal deformation. The first carrier 140 may be a rigid type and may include silicon, glass, ceramic, plastic, or polymer, A mold molding or a polyimide tape may be used.

The first adhesive layer 141 may be a double-sided adhesive film. The first adhesive layer 141 may be adhered and fixed on the first carrier 140 on one side and the strip substrate 110a on the other side.

Fig. 3 shows a process of molding the first encapsulant 120. Fig.

Referring to FIG. 3, the first encapsulant 120 may be injected in a fluid state between the first carrier 140 and the upper mold (not shown) to be provided on the first carrier 140, It can be pressed and cured at a high temperature by the mold. The first encapsulant 120 covers the top of the strip substrate 110a and is injected so as to surround the side surface, and is cured and integrated with the lapse of time.

The first encapsulation material 120 is injected in a fluid state by the method of encapsulating the first encapsulation material 120. Alternatively, a method of applying or printing the first encapsulation material 120 may be used. Also, various techniques commonly used in the related art can be used as a molding method of the encapsulant.

Meanwhile, although not shown in the drawing, a process of grinding the first encapsulant 120 when the first encapsulant 120 is thickly formed on the strip substrate 110a may be added to adjust the thickness of the first encapsulant 120. Since the thickness of the first encapsulant 120 is related to the height of the above-described radiation angle adjusting unit 130, it may be formed at a suitable height according to the design of the signal radiation angle A.

4 shows a process of removing the first carrier 140 and attaching the first tape 150a.

Referring to FIG. 4, the first carrier 140 supporting the strip substrate 110a may be removed. And the first tape 150a can be attached to the surface from which the first carrier 140 is removed.

The first tape 150a serves to bond a wafer, a chip, and the like to the frame so as not to be separated from the equipment during a sawing process. In the present invention, the first tape 150a may be used to attach the strip substrate 110a integrated with the first encapsulant 120 to the sawing equipment in the foil mount process.

As an example, the first tape 150a may be a UV tape. The UV tape adheres to the material and fixes the material firmly with high adhesive force before UV irradiation. After UV irradiation, the adhesive strength decreases due to curing, and the surface of the material is easily peeled off without contamination or damage.

Or the first tape 150a may be any tape that can fix the strip substrate 110a. As an example, it may be a double-sided adhesive film.

Fig. 5 shows a process of forming the recess 160. Fig.

Referring to FIG. 5, a recess 160 may be formed in the upper surface of the first encapsulant 120 integrated with the strip substrate 110a. The groove 160 may be formed by mounting a strip substrate 110a integrated with the first encapsulant 120 on the first tape 150a and fixing the strip substrate 110a with a half- As shown in FIG. The half-sawing can be performed using a blade, a laser unit or its equivalent, and the material of the blade can be different depending on the object. As an example, a diamond blade can be used.

The recess 160 may surround the area where the antenna pattern 113 is provided and may be spaced apart from the antenna pattern 113. For example, the groove 160 may be formed apart from the boundary of the region, when viewed from above, surrounding the region where the antenna pattern 113 is provided. Further, the groove 160 may be formed deeper than the height of the antenna pattern 113.

The shape of the radiation angle adjusting part 130 can be variously designed for adjusting the signal radiation angle A of the antenna as described above. The shape can also be variously provided. For example, the upper side may have an inverted trapezoidal shape longer than the lower side, or may have an inverted triangular shape with the base side up and the vertex down.

6 shows a process of removing the first tape 150a.

After the groove 160 is formed, the first tape 150a remaining on the lower surface of the first strip substrate 110a can be removed so that the strip substrate 110a can be easily picked up.

For example, when the first tape 150a is a UV tape as described above, it can be peeled off without contamination or damage by curing by irradiating UV. UV irradiation can be performed for this purpose.

Fig. 7 shows a step of filling the groove 160 with the conductive member 161. Fig.

The conductive member 161 is filled with the shape of the recess 160 and the conductive member 161 filled in the recess 160 of the rectangular shape is shown in the figure. In addition, the conductive member 161 may be filled to form the same plane as the upper surface of the first encapsulant 120. If the upper surface of the filled conductive member 161 and the upper surface of the first encapsulant 120 are not coplanar, the process of forming the coplanar surface by grinding may be performed.

Since the conductive member 161 serves as the radiation angle adjusting unit 130 of the EMS antenna module 100 after the sawing process described later, the conductive member 161 may include a metal. For example, copper (Cu), gold (Au), silver (Ag), titanium (Ti), or an alloy thereof.

Meanwhile, the conductive member 161 may be formed by a method such as electroless plating, electrolytic plating, sputtering, or printing.

Fig. 8 shows a process of attaching the second tape 150b.

It is necessary that the strip substrate 110a is fixed to cut each unit EMS antenna module 100. [ To this end, a second tape 150b may be attached to the lower surface of the strip substrate 110a.

The second tape 150b may be made of the same material as the first tape 150a. That is, the second tape 150b may be a UV tape. The UV tape adheres to the material and fixes the material firmly with high adhesive force before UV irradiation. After UV irradiation, the adhesive strength decreases due to curing, and the surface of the material is easily peeled off without contamination or damage.

Alternatively, the second tape 150b may be made of a different material from the first tape 150a, and any tape capable of fixing the strip substrate 110a during a sawing process may be used. As an example, it may be a double-sided adhesive film.

Fig. 9 shows a sawing process for cutting the strip substrate 110a.

In the soaking process, the strip substrate 110a on which the second tape 150b is attached and fixed can be cut and separated into the respective unit EMS antenna modules 100. The conductive member 161 filled in the groove 160 is cut and then disposed to surround the antenna pattern 113 of the unit EMS antenna module 100 to adjust a radiation angle A ).

The sawing process can cut from the upper surface of the conductive member 161 in a direction perpendicular to the upper surface of the conductive member 161 to the lower surface of the strip substrate 110a to which the second tape 150b is attached. The cutting can be carried out using a diamond blade, a laser unit or its equivalent.

In the drawing, a strip substrate 110a on which two unit substrates 110 are continuously provided is illustrated as an example. 8 and 9, the conductive member 161 positioned between the two unit substrates 110 can be cut at least once or twice. In order to narrow the width of the radiation angle adjusting part 130 formed by cutting the conductive member 161, it is necessary to perform cutting twice more. On the other hand, the conductive member 161 positioned at both ends of the strip substrate 110a may be sufficient for one cutting. The first sealing member 120 sealing the side surface of the strip substrate 110a may be cut off or the first sealing member 120 may be cut so that the first sealing member 120 remains after the cutting. The unit EMS antenna module 100 is cut so that the first encapsulant 120 is removed.

Next, the semiconductor package 1000 including the EMS antenna module 100 and the manufacturing method thereof will be described.

10 is a cross-sectional view illustrating a wire bonding fan-out semiconductor package having a conventional antenna.

10, a semiconductor chip 201 is mounted on a printed circuit board 401 having an antenna pattern 101 therein, and a structure in which a semiconductor chip 201 is electrically connected to the printed circuit board 401 through wire bonding . Such a conventional package structure can receive electromagnetic interference in the signal transmission of an antenna from an external device or the like and can not control the signal radiation angle of the antenna, so that signal concentration is low and a fast transmission rate is difficult to expect. In addition, not only the thickness of the final package due to the bonding of the wire 102 and the printed circuit board 401 is increased but also the electrical performance is deteriorated as the loop length of the wire 102 becomes longer.

11 is a cross-sectional view illustrating a semiconductor package 1000 according to an embodiment of the present invention.

11, a semiconductor package 1000 according to an embodiment of the present invention includes an EMS antenna module 100, a semiconductor chip 200, a second encapsulant 300, a wiring part 400, (500).

The EMS antenna module 100 includes an antenna pattern 113 on an upper surface 111 and a via hole 114 connected to the antenna pattern 113 through an upper surface 111 and a lower surface 112, A first encapsulant 120 disposed on the substrate 110 and a second encapsulant 120 surrounding the first encapsulant 120 and the antenna pattern 113 And a radiation angle adjusting unit 130 disposed to be spaced apart from the radiation angle adjusting unit 130. A connection extension portion 115 connected to the via hole 114 and extending along the lower surface 112 of the substrate 110 and a connection extension portion 115 provided on the upper surface 111 and the lower surface 112 of the substrate 110 And may further include a protective layer 116.

The antenna pattern 113 of the EMS antenna module 100 is connected to the via hole 114 and may be electrically connected to the signal pad 210 of the semiconductor chip 200 through the wiring portion 400. Accordingly, the antenna pattern 113 can receive a signal transmitted from the semiconductor chip 200. The second encapsulant 300 sealing the first encapsulant 120 and the semiconductor package 1000 provided on the upper portion of the substrate 110 is capable of transmitting a signal, By adjusting the signal emission angle (A, see FIG. 1), the signal can be concentrated and the transmission speed can be improved.

The radiation angle adjusting unit 130 of the EMS antenna module 100 adjusts the signal radiation angle A and absorbs the signal radiated to the side to be supplied to the semiconductor chip 200 or other device Electromagnetic interference (EMI) can be prevented from occurring.

On the other hand, electromagnetic interference immunity (EMS) can be provided so as to shield electromagnetic waves radiated from other elements (not shown) and transmit signals normally.

The semiconductor chip 200 may be, for example, an integrated circuit (Die or IC: Integrated Circuit). Alternatively, the semiconductor chip 200 may be a memory chip or a logic chip. For example, the memory chip may include DRAM, SRAM, flash, PRAM, ReRAM, FeRAM, or MRAM. . The logic chip, which is an example, may be a controller that controls memory chips.

Although not shown, the semiconductor chip 200 may have an active surface including an active region in which a circuit is formed, and an inactive surface opposite to the active surface. A signal pad 210 for exchanging signals with the outside may be formed on the active surface. In this case, the signal pad 210 may be formed integrally with the semiconductor chip 200, and the signal pad 210 and the active surface may be formed on the same plane.

Alternatively, the signal pad 210 may be a bump attached to one surface of the semiconductor chip 200, not the signal pad 210 formed integrally with the semiconductor chip. For example, the bump may be a copper pillar bump or a solder bump.

The signal pad 210 is electrically connected to the wiring part 400. The connection between the signal pad 210 and the wiring part 400 can be made by a bump or a conductive adhesive material. For example, it may be a solder joint bonding by a molten material of a metal (including lead (Pb) or tin (Sn)).

The semiconductor chip 200 may be disposed such that the active surface on which the signal pad 210 is formed faces downward, so that the semiconductor chip 200 faces the wiring portion 400. At this time, the active surface of the semiconductor chip 200 and the lower surface of the EMS antenna module 100 may form the same plane. And may be disposed adjacent to the EMS antenna module 100 and electrically connected to the wiring part 400 through the signal pad 210. [

The second encapsulant 300 may be molded to integrate the EMS antenna module 100 and the semiconductor chip 200 together. The second encapsulant 300 may include an insulator and may include, for example, an epoxy mold compound (EMC) or an encapsulant.

The second encapsulant 300 may be injected in a fluid state and then cured in a high temperature environment. For example, the second encapsulant 300 may include a process of heating and pressing the second encapsulant 300. At this time, a vacuum process may be added to remove gas or the like in the second encapsulant 300. [ As the second encapsulant 300 is cured, the EMS antenna module 100 and the semiconductor chip 200 are integrated to form a single structure. After the second encapsulant 300 is sealed, the semiconductor package 1000 may have a rectangular cross section.

Also, the second encapsulant 300 may be filled between the EMS antenna module 100 and the semiconductor chip 200. The second encapsulant 300 may be disposed to surround the upper and side surfaces of the EMS antenna module 100 and the semiconductor chip 200. Therefore, the EMS antenna module 100 and the semiconductor chip 200 may be surrounded by the second encapsulant 300 and may not be exposed to the outside, and may be protected from external impacts.

Meanwhile, the second encapsulant 300 may be the same material as the first encapsulant 120 of the EMS antenna module 100.

The wiring part 400 is located below the EMS antenna module 100 and the semiconductor chip 200 and electrically connects the EMS antenna module 100 and the external connection terminal 500 to be described later.

The wiring portion 400 includes insulating layers 410 and 430 and wiring layers 420 and 440. Specifically, the wiring portion 400 may include a first insulating layer 410, a re-wiring layer 420, a second insulating layer 430, and a bump metal layer 440.

For example, the first insulating layer 410 may be disposed under the EMS antenna module 100 and the semiconductor chip 200. The redistribution layer 420 is disposed between the first insulation layer 410 and the second insulation layer 430 and electrically connected to the signal pad 210 of the semiconductor chip 200 and the via hole 114 of the EMS antenna module 100 Can be connected. The second insulating layer 430 may be disposed between the redistribution layer 420 and the bump metal layer 440. The bump metal layer 440 may be connected to the redistribution layer 420.

The redistribution layer 420 and the bump metal layer 440 comprise a conductive material and may comprise, for example, a metal. For example, copper (Cu), aluminum (Al), or an alloy thereof.

The first insulating layer 410 and the second insulating layer 430 may include an organic or inorganic insulating material. The first insulating layer 410 and the second insulating layer 430 may include an organic insulating material such as an epoxy resin and may be formed of an inorganic insulating material such as silicon oxide (SiOx), silicon nitride (SiNx) . ≪ / RTI >

The wiring part 400 can be formed by a metal wiring rearranging step (RDL). For example, a metal pattern of a fine pattern can be formed on one surface of the semiconductor chip 200 on which the signal pad 210 is formed, that is, on the active surface using a photoresist process and a plating process. In addition, the first insulating layer 410 and the second insulating layer 430 may be formed of a dielectric coating.

The wiring part 400 can rewire the semiconductor chip 200 to form a circuit. That is, the semiconductor chip 200 is rewired by the wiring portion 400, so that the semiconductor package 1000 can have a fan-out structure. Therefore, the input / output terminals of the semiconductor chip 200 can be miniaturized and the number of input / output terminals can be increased.

The external connection terminal 500 may be connected to the bump metal layer 440 to electrically connect the semiconductor package 1000 to an external circuit or another semiconductor package (not shown).

Although a solder ball is shown as an example of the external connection terminal 500 in the figure, it may be a solder bump or may be made of a material other than solder.

 In addition, the surface of the external connection terminal 500 can be prevented from being oxidized by performing surface treatment such as organic coating or metal plating. For example, the organic material may be an OSP (Organic Solder Preservation) coating, and the metal plating may be treated with gold (Au), nickel (Ni), lead (Pb), silver (Ag) plating or the like.

12 to 18 are cross-sectional views for explaining a method of fabricating the semiconductor package 1000 of FIG. 11 according to an embodiment of the present invention, according to process steps.

Hereinafter, contents overlapping with those already described with reference to FIG. 11 will be briefly described or omitted.

12 shows a process of attaching the EMS antenna module 100 and the semiconductor chip 200 on the second carrier 600. FIG.

Referring to FIG. 12, the EMS antenna module 100 and the semiconductor chip 200 are disposed on the second carrier 600. The EMS antenna module 100 and the semiconductor chip 200 may be fixed to the second carrier 600 by the second adhesive layer 610. [

In this case, the EMS antenna module 100 is disposed on the second carrier 600 with the first encapsulant 120 and the radiating angle adjuster 130 facing upward, and the semiconductor chip 200 is mounted on the signal pad 210 are formed on the second carrier 600 with the active surface (not shown) facing downward. The EMS antenna module 100 and the semiconductor chip 200 may be arranged to be apart from each other.

Meanwhile, although one semiconductor chip 200 is disposed together with the EMS antenna module 100 in the drawing, a plurality of semiconductor chips may be arranged according to the design.

Although a single semiconductor package 1000 is fabricated on the second carrier 600 in the figure, a plurality of EMS antenna modules 100 and semiconductor chips 100 may be mounted on the second carrier 600 at predetermined intervals, A plurality of semiconductor packages 1000 can be manufactured simultaneously in a single process.

The second carrier 600 supports the EMS antenna module 100 and the semiconductor chip 200. The second carrier 600 may be made of a material having low rigidity and low thermal deformation. The second carrier 600 may be a rigid type material. For example, the second carrier 600 may be made of a molding material or a polyimide tape.

The second adhesive layer 610 may be a double-sided adhesive film, one side of which is fixed on the second carrier 600, and the EMS antenna module 100 and the semiconductor chip 200 may be attached to the other side .

Fig. 13 shows a process of molding the second encapsulant 300. Fig.

Referring to FIG. 13, the second encapsulant 300 may be injected in a fluid state between the third carrier 600 and the upper mold (not shown) and may be provided on the second carrier 600, It can be pressed and cured at a high temperature by the mold. The second encapsulant 300 covers the upper surface of the EMS antenna module 100 and the semiconductor chip 200 and is injected so as to surround the side surface, and is hardened and integrated as time elapses.

The second encapsulant 300 is injected in a fluid state by a method of sealing the second encapsulant 300. Alternatively, a method of applying or printing may be used. Also, various techniques commonly used in the related art can be used as a molding method of the encapsulant.

14 shows a process of removing the second carrier 600 and attaching the third carrier 700. Fig.

After the second carrier 600 is removed, the third carrier 700 may be attached to the face opposite the removed face. The upper surface of the sealed second encapsulant 300 may be fixed to the third carrier 700 by the third adhesive layer 710. [

The third carrier 700 may be the same material as the second carrier 600 and the third adhesive layer 710 may also be the same material as the second adhesive layer 610. [

15 to 17 illustrate a rewiring process for forming the wiring portion 400 of the semiconductor package 1000 and a process for attaching the external connection terminal 500. FIG.

15, one surface of the EMS semiconductor module 100 on which the connection extension portion 115 of the via hole 114 is formed and the other surface of the semiconductor chip 200 on which the signal pad 210 is formed The first insulating layer 410 may be formed. The first insulating layer 410 may expose the connection extension portion 115 and the signal pad 210 through an etching process after coating an insulating material.

The re-wiring layer 420 is formed on the first insulating layer 410. The redistribution layer 420 is connected to the exposed connection extension part 115 and the signal pad 210 and connects the EMS antenna module 100 and the semiconductor chip 200. The re-distribution layer 420 may be formed by coating a metal material on the first insulation layer 410 and then forming a metal pattern through a photoresist process or the like. For example, the re-distribution layer 420 may be coated through a conventional plating process. The semiconductor chip 200 may be rewired by the rewiring layer 420 so that the semiconductor package 1000 may have a fan-out structure.

16, a second insulating layer 430 is formed on the redistribution layer 420 and a bump metal layer 440 connected to the redistribution layer 420 is formed on the second insulating layer 430 .

The second insulating layer 430 may be coated with an insulating material on the redistribution layer 420 and then exposed through holes having uniform spacing of the redistribution layer 420 through an etching process.

The bump metal layer 440 is formed on the second insulating layer 430 and may be connected to the re-wiring layer 420 through the exposed holes. The bump metal layer 440 may be formed by coating a metal material on the second insulating layer 430 and then performing a photoresist process or the like.

Referring to FIG. 17, an external connection terminal 500 is formed on the bump metal layer 440 of the wiring part 400. The external connection terminal 500 may be connected to the bump metal layer 440.

The external connection terminal 500 is electrically connected to the wiring part 400 and can be used as a medium for connecting the semiconductor package 1000 to an external circuit or another semiconductor package (not shown). For example, one side of the external connection terminal 500 may be connected to the bump lower metal layer 24, and the other side may be exposed to the outside.

Fig. 18 shows a process of removing the third carrier 700. Fig.

When removing the third carrier 700, the third adhesive layer 710 may also be removed at the same time.

19 and 20 are cross-sectional views for explaining another embodiment of the semiconductor package 1000 according to an embodiment of the present invention. The semiconductor packages 2000 and 3000 according to another embodiment of the present invention have the same configuration except that the shapes of the semiconductor package 1000 and the radiation angle adjusting portions 130-1 and 130-2 of FIG. The description of the bar is to be simplified or omitted.

19, a semiconductor package 2000 according to another embodiment of the present invention includes an EMS antenna module 100, a semiconductor chip 200, a second encapsulant 300, a wiring part 400, (500).

The lower surface of the radiation angle adjusting part 130-1 of the EMS antenna module 100 is provided in the same plane as the lower surface of the substrate 110 so that the radiation angle adjusting part 130-1 is connected to the wiring part 400). The vertical length of the radiation angle adjusting part 130-1 is set to be equal to the height of the EMS antenna module 100 to be grounded to the wiring part 400 so that the signal radiated to the side can be absorbed to reduce the noise .

The radiation angle adjusting unit 130-1 which is grounded to the wiring unit 400 may be formed in a process of forming the recess 160 in the manufacturing process of the EMS antenna module 100, To the lower surface of the first substrate 110a. At this time, the strip substrate 110a integrated with the first encapsulant 120 can be firmly fixed using the first tape 150a.

20, a semiconductor package 3000 according to another embodiment of the present invention includes an EMS antenna module 100, a semiconductor chip 200, a second encapsulant 300, a wiring part 400, (500).

In the present embodiment, the radiation angle adjusting unit 130-2 of the EMS antenna module 100 may be inclined. By making the inner side of the radiation angle adjusting section 130-2 be inclined so that the signal radiation angle A of the antenna pattern 113 is made small, the signal can be concentrated and the signal transmission speed can be improved.

For example, the radiation angle adjuster 130-2 may have an inverted trapezoidal shape with the upper side longer than the lower side, or an inverted triangular shape with the base side up and the vertex down. Although the figure shows an inverted trapezoidal shape, the present invention is not limited thereto, and any shape can be included in the technical idea of the present invention as long as the signal emission angle A of the antenna can be reduced.

The radiation angle adjusting unit 130-2 having an inclined inner surface may be formed in the process of forming the recess 160 in the manufacturing process of the EMS antenna module 100 such that the recess 160 is formed in the shape of an inverted trapezoid 160). The groove 160 such as the inverted trapezoid or inverted triangle shape is formed by mounting and fixing the strip substrate 110a integrated with the first encapsulant 120 on the first tape 150a and performing half sawing .

While the present invention has been particularly shown and described with reference to exemplary embodiments thereof, it is clearly understood that the same is by way of illustration and example only and is not to be taken by way of limitation, You will understand. Accordingly, the true scope of the invention should be determined only by the appended claims.

100: EMS antenna module 110: substrate
113: antenna pattern 114: via hole
115: connection extension part 116: protective layer
120: first encapsulant 130: radiation angle adjusting section
A: signal emission angle 140: first carrier
150a: first tape 150b: second tape
160: groove 161: conductive member
200: semiconductor chip 300: second encapsulant
400: Wiring part 500: External connection terminal
600: second carrier 700: third carrier

Claims (16)

A substrate including an upper surface having an antenna pattern formed thereon and a lower surface facing the upper surface;
A first encapsulant provided on an upper surface of the substrate; And
And a radiation angle adjusting unit positioned to surround the substrate and the first encapsulation member and adjusting a signal radiation angle of the antenna pattern,
Wherein the radiation angle adjusting portion is spaced apart from the antenna pattern, and the upper surface of the radiation angle adjusting portion is flush with the upper surface of the first sealing material. The method according to claim 1,
Wherein the substrate includes a via hole penetrating the upper surface and the lower surface of the substrate,
And the antenna pattern is electrically connected through the via hole. 3. The method of claim 2,
And the via hole includes a connection extension portion extending along a lower surface of the substrate at a lower portion of the via hole. The method of claim 3,
The upper surface of the substrate is provided with a protective layer covering the antenna pattern,
And a lower surface of the substrate is provided with a protection layer covering the connection extension portion. delete The method according to claim 1,
Wherein the lower surface of the radiation angle adjusting portion is coplanar with the lower surface of the substrate. The method according to claim 1,
Wherein the radiation angle adjusting unit is provided with an inner side surface inclined so that a signal radiation angle of the antenna pattern is reduced. A substrate on which an antenna pattern is provided is disposed on a first carrier,
Sealing the substrate with a first sealing material,
Forming a groove recessed from an upper surface of the first encapsulation material so as to surround the antenna pattern,
The groove is filled with a conductive member,
And cutting the conductive member and the substrate into separate modules. 9. The method of claim 8,
And grinding the top surface of the first encapsulant prior to removing the first carrier. 9. The method of claim 8,
Attaching a first tape to a surface from which the first carrier is removed before forming the groove,
And removing the first tape after forming the groove. 9. The method of claim 8,
And attaching a second tape to the lower surface of the substrate prior to cutting the conductive member and the substrate. A substrate including an antenna pattern formed on an upper surface thereof and including a via hole connected to the antenna pattern, a first encapsulant provided on the substrate, and a second encapsulant positioned to surround the substrate and the first encapsulant, An EMS antenna module including a radiation angle adjusting unit for adjusting a radiation angle;
A semiconductor chip;
A second encapsulant for molding the EMS antenna module and the semiconductor chip to be integrated;
A wiring part provided below the EMS antenna module and the semiconductor chip and electrically connected to the EMS antenna module and the semiconductor chip; And
And an external connection terminal electrically connected to the wiring portion, wherein the radiation angle adjusting portion extends to a lower portion of the substrate and is connected to the wiring portion. 13. The method of claim 12,
The wiring portion may include a first insulation layer exposing a signal pad of the semiconductor chip and a via hole of the EMS antenna module, a re-wiring layer electrically connected to the signal pad and the via hole, and a second insulation layer And a bump metal layer electrically connected to the re-wiring layer. 13. The method of claim 12,
And the second encapsulation material is the same material as the first encapsulation material. delete 13. The method of claim 12,
Wherein the radiation angle adjusting portion is provided such that an inner side thereof is inclined so that a signal radiation angle of the antenna pattern is reduced.
KR1020160162604A 2016-12-01 2016-12-01 Ems antenna module and method of manufacturing the same and semiconductor package including the same KR101870421B1 (en)

Priority Applications (2)

Application Number Priority Date Filing Date Title
KR1020160162604A KR101870421B1 (en) 2016-12-01 2016-12-01 Ems antenna module and method of manufacturing the same and semiconductor package including the same
PCT/KR2017/013910 WO2018101767A1 (en) 2016-12-01 2017-11-30 Ems antenna module, manufacturing method therefor, and semiconductor package comprising same

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
KR1020160162604A KR101870421B1 (en) 2016-12-01 2016-12-01 Ems antenna module and method of manufacturing the same and semiconductor package including the same

Publications (2)

Publication Number Publication Date
KR20180063403A KR20180063403A (en) 2018-06-12
KR101870421B1 true KR101870421B1 (en) 2018-06-26

Family

ID=62241630

Family Applications (1)

Application Number Title Priority Date Filing Date
KR1020160162604A KR101870421B1 (en) 2016-12-01 2016-12-01 Ems antenna module and method of manufacturing the same and semiconductor package including the same

Country Status (2)

Country Link
KR (1) KR101870421B1 (en)
WO (1) WO2018101767A1 (en)

Families Citing this family (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN111403356B (en) * 2020-04-02 2024-08-02 杭州晶通科技有限公司 Preparation technology of fan-out type packaging structure of modularized antenna

Citations (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2007318469A (en) * 2006-05-26 2007-12-06 Murata Mfg Co Ltd Antenna system and high frequency module

Family Cites Families (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2008017421A (en) * 2006-07-10 2008-01-24 Seiko Epson Corp Semiconductor device
JP2009266979A (en) * 2008-04-24 2009-11-12 Shinko Electric Ind Co Ltd Semiconductor device
JP2013026438A (en) * 2011-07-21 2013-02-04 Teramikros Inc Semiconductor device built-in substrate module and method of manufacturing the same
US10319688B2 (en) 2013-12-09 2019-06-11 Intel Corporation Antenna on ceramics for a packaged die

Patent Citations (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2007318469A (en) * 2006-05-26 2007-12-06 Murata Mfg Co Ltd Antenna system and high frequency module

Also Published As

Publication number Publication date
WO2018101767A1 (en) 2018-06-07
KR20180063403A (en) 2018-06-12

Similar Documents

Publication Publication Date Title
US20220320010A1 (en) Semiconductor device and manufacturing method thereof
KR101858952B1 (en) Semiconductor package and method of manufacturing the same
US8030750B2 (en) Semiconductor device packages with electromagnetic interference shielding
CN106711094B (en) Semiconductor package and method of manufacturing the same
TWI387070B (en) Chip package and manufacturing method thereof
US7851894B1 (en) System and method for shielding of package on package (PoP) assemblies
US7572681B1 (en) Embedded electronic component package
US7651889B2 (en) Electromagnetic shield formation for integrated circuit die package
US20090072357A1 (en) Integrated shielding process for precision high density module packaging
KR101858954B1 (en) Semiconductor package and method of manufacturing the same
KR101809521B1 (en) Semiconductor package and method of manufacturing the same
KR101837514B1 (en) Semiconductor package, method of manufacturing the same and system in package
US20110057301A1 (en) Semiconductor package
JP2023522881A (en) Integrated system-in-package with radiation shielding
US6933173B2 (en) Method and system for flip chip packaging
KR20200018357A (en) Emi shielding for flip chip package with exposed die backside
KR20180002913A (en) Semiconductor package and method of manufacturing the same
US20040243032A1 (en) Lie-down massager
EP2648218B1 (en) Integrated circuit and method of manufacturing the same
CN111987078A (en) Semiconductor device and method for manufacturing semiconductor device
US20200381368A1 (en) Semiconductor package including an electromagnetic shield and method of fabricating the same
KR102041666B1 (en) Semi-conductor package and method for manufacturing the same and module of electronic device using the same
KR101870421B1 (en) Ems antenna module and method of manufacturing the same and semiconductor package including the same
US20180240738A1 (en) Electronic package and fabrication method thereof
US20210225783A1 (en) Semiconductor device package and the method of manufacturing the same

Legal Events

Date Code Title Description
A201 Request for examination
E902 Notification of reason for refusal
E701 Decision to grant or registration of patent right
GRNT Written decision to grant