KR101865933B1 - Optical Module, Optical Printed Circuit Board and Fabricating method of the same - Google Patents

Abstract

An optical module according to an embodiment of the present invention includes: a first lower case having a first side sloped and a receiving groove formed on an upper side; A light transmitting portion inserted into the receiving groove of the lower case; And a first upper case coupled to the lower case and embedding a light transmission part inserted in the upper case, wherein the second side surface of the first lower case is provided with at least one coupling groove for coupling with the second lower case, Respectively.

Description

TECHNICAL FIELD [0001] The present invention relates to an optical module, an optical printed circuit board including the optical module,

The present invention relates to a structure of an optical printed circuit board and a manufacturing method thereof.

A printed circuit board (PCB), which is generally used, is an electrical printed circuit board, which is coated with a substrate on which a copper thin film circuit is implemented, and is used by electric signal transmission by inserting various components. Such a conventional electric printed circuit board has a problem in signal transmission because it can not follow the electric signal transmission capability of the substrate rather than the processing capability of an electric element as a component.

Especially, these electric signals are sensitive to the external environment and generate noises, which is a great obstacle to electronic products requiring high precision. As a complement to this, an optical printed circuit board using an optical waveguide was developed instead of a metallic circuit such as copper of an electric printed circuit board, and it became possible to produce a high-precision high-tech equipment more stable in radio interference and noise phenomenon.

According to the prior art, in the case of an optical printed circuit board, an optical waveguide is manufactured by bending optical fibers at 90 degrees as disclosed in Prior Art 1 (Publication No. 10-2011-0038522) 0112731), a mirror is formed on the inner core layer to produce an optical waveguide.

However, in the above-mentioned prior art document 1, in the manufacture of an optical printed circuit board, a structure is adopted in which optical fibers are folded at 90 degrees to connect optical fibers with a signal transmission unit TX and a signal reception unit RX. The light loss occurs in the process of folding the optical fiber 90 by 90 degrees. In addition, when there is a step between the bent portion of the optical fiber and the printed circuit board layer in the lamination process for embedding in the printed circuit board, high pressure is applied and transmission loss occurs. In addition, the total thickness of the optical module including the bent portion increases the overall thickness of the printed circuit board.

In the prior art 2, the core protruding outward has a problem in that it is difficult to maintain the angle due to deformation (curling or twisting, etc.) due to heat, pressure and resin flow during lamination have.

In an embodiment according to the present invention, an optical printed circuit board having a new structure and a manufacturing method thereof are provided.

In addition, in the embodiment of the present invention, an asymmetric optical module is provided.

 It is to be understood that both the foregoing general description and the following detailed description are exemplary and explanatory and are not intended to limit the invention to the precise forms disclosed. .

An optical module according to an embodiment of the present invention includes: a first lower case having a first side sloped and a receiving groove formed on an upper side; A light transmitting portion inserted into the receiving groove of the lower case; And a first upper case coupled to the lower case and embedding a light transmission part inserted in the upper case, wherein the second side surface of the first lower case is provided with at least one coupling groove for coupling with the second lower case, Respectively.

According to another aspect of the present invention, there is provided an optical printed circuit board including: a first insulating layer having a circuit pattern formed thereon; At least one optical module embedded in the first insulating layer and having a first side and a second side facing the first side in an asymmetrical shape having different inclination angles; And an optical element electrically connected to the circuit pattern.

According to another aspect of the present invention, there is provided a method of manufacturing an optical printed circuit board, the method comprising: preparing a lower case having a receiving groove formed thereon; Inserting a light transmitting portion in the receiving groove of the prepared lower case; And forming an optical module by coupling an upper case surrounding the upper surface of the optical transmission unit on the lower case, wherein the first side of the lower case is formed obliquely with respect to the path of light, Is formed at a right angle.

According to the embodiment of the present invention, optical fibers or optical waveguides are inserted into the upper case and the lower case which are sloped side by side, thereby forming reflection parts for light reflection on the side surfaces of the upper and lower cases, It is possible to improve the characteristics and reduce the thickness of the entire optical printed circuit board.

In addition, optical coupling can be induced in arbitrary length and direction without direct processing of the optical waveguide or optical fiber, and productivity can be improved through process efficiency superior to individual processing such as optical waveguide or optical fiber .

1 is a view for explaining an optical module according to a first embodiment of the present invention.
FIGS. 2 to 5 are a perspective view and a cross-sectional view for explaining the manufacturing method of the optical module shown in FIG. 1 step by step.
6 and 7 are views for explaining a method of coupling a plurality of optical modules.
8 is a sectional view of an optical printed circuit board according to the first embodiment of the present invention.
Figs. 9 to 13 are cross-sectional views illustrating the method of manufacturing the optical printed circuit board shown in Fig.
14 is a sectional view of an optical printed circuit board according to a second embodiment of the present invention.
15 to 19 are cross-sectional views for explaining a manufacturing method of the optical printed circuit board shown in Fig.
20 is a view showing an optical printed circuit board according to a third embodiment of the present invention.

Hereinafter, embodiments of the present invention will be described in detail with reference to the accompanying drawings so that those skilled in the art can easily carry out the present invention. The present invention may, however, be embodied in many different forms and should not be construed as limited to the embodiments set forth herein.

Throughout the specification, when an element is referred to as "comprising ", it means that it can include other elements as well, without excluding other elements unless specifically stated otherwise.

In the embodiments of the present invention, optical fibers or optical waveguides are inserted into the upper case and the lower case, both of which are sloped sides, so that a reflection portion for light reflection is formed on the side surfaces of the upper and lower cases, Thereby reducing the thickness of the entire optical printed circuit board. In addition, optical coupling can be induced in arbitrary length and direction without direct processing on the optical waveguide or optical fiber, and productivity can be increased through process efficiency superior to individual processing such as optical waveguide or optical fiber .

1 is a view for explaining an optical module according to a first embodiment of the present invention. (a) is a perspective view of the optical module, and (b) is a sectional view of the optical module.

1 (a) and 1 (b), the optical module 100 includes a lower case 110, a coupling groove 114 formed on one side of the lower case 110, A light transmitting part 120 inserted into the lower case 110 and the upper case 130 and a reflection formed on the left side surfaces of the lower case 110 and the upper case 130. [ (140).

The lower case 110 has an upper receiving groove 112 formed thereon. The receiving groove 112 provides a seating space for allowing the light transmitting unit 120 to be easily seated.

The lower case 110 is formed of a light-transmitting material that transmits light. More preferably, the lower case 110 is formed of a material having a lower refractive index than the material constituting the light transmitting portion 120.

The first side surface of the lower case 110 has a predetermined inclination angle with respect to the transmission path of the light, and the second side surface facing the first side surface has an angle different from the first side surface. Accordingly, the cross section of the lower case 110 has an asymmetric shape in the right and left sides.

Preferably, the lower case 110 includes a lower surface, a left surface extending upward from one end of the lower surface, and a right surface extending upward from the other end of the lower surface.

At this time, it is preferable that the internal angle formed by the lower surface of the lower case 110 and the left surface is 45 ° or 135 °. The internal angle formed by the lower surface of the lower case 110 and the left side surface is determined by the initial direction of incidence of light.

The inner angle formed by the lower surface of the lower case 110 and the right side surface is different from the inner angle formed by the lower surface and the left surface. The internal angle between the lower surface of the lower case 110 and the right side surface is 90 degrees.

That is, the left side surface of the lower case 110 is formed to be inclined at 45 degrees or 135 degrees, and the right side surface is formed to be perpendicular to the lower surface at 90 degrees. Accordingly, the cross section of the lower case 110 has an asymmetric shape with respect to the left side and the right side with respect to the center point.

A coupling groove 114 is formed on the right side surface of the lower case 110. It is formed later for coupling with another lower case.

Preferably, the coupling groove 114 is located at a central point of the finally fabricated optical module 100.

That is, the coupling groove 114 is located at the center of a straight line connecting the lower surface of the lower case 110 and the upper surface of the upper case 130.

This is to allow the lower surface of the other lower case to be coupled downward when the plurality of lower cases 110 are coupled with each other, or to be coupled to the upper surface of the other lower case.

In other words, when the plurality of optical modules finally manufactured are coupled to each other, one of them is included in the plurality of optical modules when the lower case is placed below and the other is placed above the upper case So that the imaginary optical transmission unit is placed on a straight line.

The upper case 130 is coupled to the lower case 110.

The upper case 130 is formed of a light-transmitting material that transmits light. More preferably, the upper case 130 is formed of a material having a refractive index lower than that of the material of the light transmitting portion 120, like the lower case 110.

The upper case 130 includes a lower surface, a left surface extending upward from one end of the lower surface, and a right surface extending upward from the other end of the lower surface.

At this time, the internal angle formed by the lower surface of the upper case 130 and the left side surface is 90 degrees, and the internal angle formed by the lower surface and the right side surface of the upper case 130 is 90 degrees.

The light transmitting portion 120 is embedded in the upper case 130 and the lower case 110.

The optical transmission unit 120 provides a transmission path of light.

At this time, the optical transmission unit 120 may be formed of optical fibers.

Alternatively, the optical transmission unit 120 may include an optical waveguide including a core layer for transmitting an optical signal and an upper or lower clad layer surrounding the core layer.

A reflective portion 140 is formed on the left side surface of the lower case 110.

Preferably, a reflective portion 140 is formed on an obliquely formed side surface of the lower case 110.

The reflector 140 receives the light emitted from the optical transmitter to be described later and reflects the received light in a direction perpendicular to the incidence direction.

In addition, the reflection unit 140 may reflect the light reflected through the reflection unit other than the optical transmitter in a direction perpendicular to the incident direction.

The reflective portion 140 has an inclination angle corresponding to the inclination angle of the left side surface of the lower case 110. [ The reflective portion 140 may be formed by laminating a metal material by coating, laminating, or spraying.

As described above, in the optical module 100 according to the first embodiment of the present invention, the optical transmission part 120 is inserted into the lower case 110 and the upper case 130, The reflective portion 140 is formed on the left side surface of the reflective layer 110.

One end of the light transmitting part 120 embedded in the lower case 110 is exposed on the right side of the lower case 110 where the reflection part 140 is not formed.

Accordingly, in the embodiment of the present invention, the optical module 100 having cross-sectional asymmetric shapes is provided, one side of the optical module 100 is formed obliquely to form the reflecting portion 140, The side surfaces are formed vertically so that one end of the light transmitting portion 120 buried therein is exposed.

Accordingly, there is provided an optical module 100 that transmits light to the outside using only one optical module manufactured as described above, or receives light transmitted from the outside. In addition, the coupling pin can be inserted between the plurality of optical modules having the coupling groove formed on one side as described above, so that the optical path can be easily changed. In this case, since the optical transmission unit 120 formed inside the optical module for providing the optical path is not processed, reliability of the optical transmission unit 120 can be secured by increasing the light transmission efficiency.

Hereinafter, a method of manufacturing an optical module according to a first embodiment of the present invention will be described with reference to the accompanying drawings.

FIGS. 2 to 5 are a perspective view and a cross-sectional view for explaining the manufacturing method of the optical module shown in FIG. 1 step by step.

First, referring to FIG. 2, a lower case 110 is prepared.

The lower case 110 is formed of a light-transmitting material capable of transmitting light.

Preferably, the lower case 110 is formed of a material having a lower refractive index than the material of the light transmitting portion 120 to be inserted later.

The lower case 110 is made of a polymer material such as acryl, epoxy, polyimide, fluorinated acrylic, or fluorinated polyimide.

A receiving groove 112 is formed in the upper portion of the lower case 110. The first receiving groove 112 may be formed by processing an upper portion of the lower case 110 with a laser so as to correspond to a size of a light transmitting portion 120 to be formed later.

The receiving groove 112 is formed to have a depth corresponding to the thickness of the light transmitting portion 120. That is, the depth of the receiving groove 112 is equal to or greater than the thickness of the light transmitting portion 120, so that the light transmitting portion 120 is completely inserted into the receiving groove 112.

The receiving grooves 112 may be formed in a single unit, depending on the type of the light transmitting unit 120, or may be formed in a plurality of units.

If the optical transmission unit 120 to be inserted later is an optical fiber, a plurality of the receiving grooves 112 may be formed according to the number of inserted optical fibers. At this time, it is preferable that the receiving groove 112 is formed to have a V or U shape for easy insertion and seating of the optical fiber.

In the embodiment of the present invention, it is assumed that the optical transmission unit 120 is formed of optical fibers. However, it will be obvious to those skilled in the art that the light transmitting portion 120 may be formed of an optical waveguide including the core layer and the upper or lower clad layer.

In addition, when the light transmitting portion 120 is an optical waveguide including a core layer and an upper or lower clad layer, the receiving groove 112 may be formed as a single piece. This is because the optical waveguide is formed as a single component including a plurality of core layers, so that the optical waveguide of the single component can be inserted into the single receiving groove 112.

Meanwhile, the side surface of the lower case 110 is formed with a certain inclination angle with respect to the transmission path of the light.

That is, the lower case 110 includes a lower surface 110a, a left surface 110b extending upward from the left end of the lower surface 110a and a right surface 110b extending upward from the right end of the lower surface 110a 110c.

The internal angle A formed by the lower surface 110a of the lower case 110 and the left surface 110b and the internal angles formed by the lower surface 110a and the right surface 110c are different from each other.

That is, the internal angle A between the lower surface 110a and the left surface 110b of the lower case 110 has a predetermined inclination angle according to the transmission path of light. At this time, the internal angle A is formed at 45 degrees or 135 degrees.

Alternatively, the internal angle between the lower surface 110a and the right surface 110c is 90 degrees.

That is, the left side surface 110b of the lower case 110 is a reflection surface for reflecting light, and the right side surface 110c is an exposed surface exposed to the outside, It is cotton.

The internal angle A is formed to have 45 degrees or 135 degrees, but any angle may be formed. For example, when the optical module 100 having the internal angle A of 45 ° but having the internal angle of 135 ° is required, if the optical module made of the lower case formed at 45 ° is turned upside down, The optical module having the internal angle of?

A coupling groove 114 is formed on the right side surface 110c of the lower case 110. [

It is preferable that a plurality of coupling grooves 114 are formed on the right side surface 110c to provide a reliable coupling force with the other lower case.

At this time, the coupling grooves 114 are formed at both ends of the right side 110c. If the coupling groove 114 is formed in the middle portion of the right side surface 110c, it may interfere with the optical transmission of the light transmitting portion 120 inserted later.

The coupling groove 114 is formed at a proper height on the right side surface 110c of the lower case 110 so as to be positioned at the center point with respect to the thickness direction of the optical module 100 to be finally manufactured. That is, the coupling groove 114 is formed at a specific height of the right side surface 110c of the lower case 110 in consideration of the thickness of the upper case 130. [

The reflector 140 is formed on the left surface 110b of the lower case 110. [

The reflector 140 is formed of a metal material such as aluminum or silver having high reflectivity.

Referring to FIG. 3, the light transmitting portion 120 is inserted into the receiving groove 112 formed in the lower case 110.

The receiving groove 112 has a V shape or a U shape and is provided with a plurality of the receiving grooves 112. The optical transmitting portion 120 is inserted into the plurality of receiving grooves 112 with optical fibers.

4, the upper case 130 is prepared.

The upper case 130 is also formed of a light transmitting material that can transmit light in the same manner as the lower case 110. The lower case 110 is preferably made of a material having a lower refractive index than the material forming the inserted light transmitting portion 120 .

That is, the upper case 130 is made of a polymer material such as acryl, epoxy, polyimide, fluorinated acrylic, or fluorinated polyimide.

The upper case 130 includes a lower surface, a left surface extending upward from the left end of the lower surface, and a right surface extending upward from the right end of the lower surface.

The inner angle formed by the lower surface of the upper case 130 and the left side surface and the inner angle formed by the lower surface and the right side surface are equal to each other and preferably 90 degrees.

5, the upper case 130 is coupled to the lower case 110 through which the light transmitting portion 120 is inserted through the receiving groove 112. [

As described above, in the embodiment of the present invention, the light transmitting portion 120 is inserted into the lower case 110 having a predetermined inclination angle at one side and the other side is vertical, and the upper case 130 . Accordingly, the manufactured optical module 100 has a left-right asymmetric shape.

When the optical module 100 is manufactured as described above, the manufactured optical module 100 can be used singly to manufacture an optical printed circuit board, and a plurality of optical modules can be coupled to each other, .

An optical printed circuit board on which only one optical module 100 is used externally receives light transmitted from outside or transmits internally generated light to the outside.

In addition, an optical printed circuit board to which a plurality of optical modules 100 are coupled performs both transmission and reception of light internally.

Hereinafter, a method of mutually coupling the plurality of optical modules 100 will be described.

A plurality of optical modules (the first optical module and the second optical module) manufactured as described above are prepared.

The first optical module 100a and the second optical module 100b are manufactured through the same manufacturing process and have the same shape and structure.

Next, the first optical module 100a is arranged so that the right side face and the right side face of the second optical module 100b face each other. In other words, the first optical module 100a and the second optical module 100b are arranged such that the surface on which the coupling groove is formed and the surface on which the coupling groove is formed face each other.

At this time, whether the lower case included in the second optical module 100b is placed under the upper case or the lower case is placed on the upper case is changed according to the arrangement of the optical devices.

When the optical devices are disposed on the same layer, the second optical module 100b is disposed such that the lower case is placed on the bottom surface.

Thereafter, the coupling pin 200 is prepared, a part of the coupling pin 200 is inserted into the coupling groove formed in the first optical module 100a, and the remaining part is inserted into the coupling formed in the second optical module 100b Into the groove.

Accordingly, the right side surface of the first optical module 100a and the right side surface of the second optical module 100b are connected to each other. At this time, one end of the optical transmission unit is exposed on the right side of the first optical module 100a and one end of the optical transmission unit is exposed on the right side of the second optical module 100b, The respective light transmitting portions formed in the light emitting portions 100a and 100b are connected to each other.

Meanwhile, the optical device includes an optical transmitter and an optical receiver. When the optical transmitter and the optical receiver are formed on the same layer, the optical module coupled as described above is applied.

That is, when the optical transmitter and the optical receiver are formed on the same layer, the first optical module 100a and the second optical module 100b are combined so as to have symmetrical shapes.

7, the first optical module 100a is arranged so that the right side of the first optical module 100a and the right side of the second optical module 100c face each other. The second optical module 100c shown in FIG. 7 is the same as the second optical module 100b shown in FIG. 6, but is denoted by the same reference numeral for convenience of explanation.

The surfaces of the first optical module 100a on which the coupling grooves are formed and the surfaces of the second optical module 100c on which the coupling grooves are formed face each other.

At this time, the second optical module 100c is disposed such that the upper case is placed on the bottom surface.

Thereafter, the coupling pin 200 is prepared, a part of the coupling pin 200 is inserted into the coupling groove formed in the first optical module 100a, and the remaining part of the coupling pin 200 is coupled with the coupling formed in the second optical module 100c Into the groove.

Accordingly, the right side surface of the first optical module 100a and the right side surface of the second optical module 100c are connected to each other. At this time, one end of the optical transmission unit is exposed on the right side of the first optical module 100a and one end of the optical transmission unit is exposed on the right side of the second optical module 100c. The respective light transmitting portions formed in the light emitting portions 100a and 100c are connected to each other.

That is, when the optical transmitter and the optical receiver are formed on different layers, the upper case of the second optical module 100c is placed on the bottom surface as described above. Accordingly, the first optical module 100a and the second optical module 100c are coupled so as to have an asymmetrical shape.

8 is a sectional view of an optical printed circuit board according to the first embodiment of the present invention.

8, the optical printed circuit board 300 includes a first insulating layer 310, a circuit pattern 320 formed on at least one surface of the first insulating layer 310, An optical transmitter 330 and an optical receiver 340 connected to the circuit pattern 320 and the first and second insulation layers 310 and 310, And a second insulating layer 350 filling the first insulating layer 100.

The first insulating layer 310 and the second insulating layer 350 function as a base member for providing durability to the optical printed circuit board.

The first and second insulating layers 310 and 350 may be a supporting substrate of an optical printed circuit board on which a single circuit pattern is formed, but a circuit pattern 320 of the plurality of optical printed circuit boards having a stacked structure is formed Which may be referred to as an insulating layer region.

In the case where each of the first and second insulating layers 310 and 350 is an insulating layer among a plurality of laminated structures, a plurality of circuit patterns are formed continuously on the upper or lower surface of the first and second insulating layers 310 and 350 As shown in FIG.

A conductive via (not shown) is formed in the first insulating layer 310 to electrically connect circuit patterns between different layers.

The circuit pattern 320 may be formed of an electrically conductive metal such as gold, silver, nickel, and copper for electrical signal transmission, and is preferably formed using copper.

The circuit pattern 320 may be formed by a conventional manufacturing process such as an additive process, a subtractive process, a modified semi- additive process (MSAP), or a semi-additive process (SAP) And detailed description is omitted here.

The first and second insulating layers 310 and 350 may be a thermosetting or thermoplastic polymer substrate, a ceramic substrate, an organic-inorganic composite substrate or a glass fiber impregnated substrate. In the case of including a polymer resin, FR- Bismaleimide Triazine), and ABF (Ajinomoto Build up Film). Alternatively, the epoxy resin may include a polyimide resin, but the present invention is not limited thereto.

The optical module 100 fabricated as described above is embedded in the first insulation layer 310. This can be formed by forming through holes passing through one surface and the other surface of the first insulation layer 310 and inserting the optical module 100 into the through holes formed as described above.

An optical transmitter 350 is formed on one of the circuit patterns 320 formed on the upper surface of the first insulating layer 310 and an optical receiver 340 is formed on the other circuit pattern 320.

The optical printed circuit board 300 according to the first embodiment of the present invention is characterized in that the optical transmitter 330 and the optical receiver 340 are formed on the same plane. In other words, the optical transmitter 330 and the optical receiver 340 are both formed in the upward direction or in the downward direction with respect to the optical module 100.

The optical transmitter 330 generates and outputs an optical signal, and includes a driver integrated circuit (not shown) and a light emitting element (not shown). The light emitting element is driven by the driver integrated circuit.

In this case, the light emitting device may include a VCSEL (Vertical-Cavity Surface-Emitting Laser), which is a light source device for emitting a light signal. The VCSEL is a light source element that transmits or amplifies a light source signal in a manner of vertically irradiating a laser beam.

The optical receiver 340 includes a receiver integrated circuit (not shown) and a light receiving element (not shown).

The light receiving element receives light generated from the optical transmitter 330 and is driven by the receiver integrated circuit. The light receiving element may include a photo detector (PD), which is an element for detecting an optical signal.

As described above, in the embodiment of the present invention, the space in which the optical module 100 manufactured as described above is inserted, thereby inserting the optical module 100 into the formed space, It is possible to manufacture an optical printed circuit board having high reliability and efficiency.

At this time, the left side of the optical module 100 is formed obliquely, and the right side is formed at a right angle. The left side of the optical module is placed inside the first insulating layer 310 and the right side is exposed to the outside.

Accordingly, an external device is connected to the right side of the optical module 100 exposed to the outside of the first insulating layer 310, so that light generated from the external device is reflected into the optical module 100. The reflector 140 formed on the left side of the optical module 100 reflects the light in a direction perpendicular to the incident direction. An optical receiver 340 is formed in the reflection direction of the light by the reflection unit 140.

Figs. 9 to 13 are cross-sectional views illustrating the method of manufacturing the optical printed circuit board shown in Fig.

Referring to FIG. 8, a first insulating layer 310 is first prepared. When a conductive layer (not shown) is laminated on at least one surface of the first insulating layer 310, the laminated structure of the first insulating layer 310 and the conductive layer may be a conventional CCL (Copper Clad Laminate) have.

Alternatively, the conductive layer may be formed by performing non-electrolytic plating on the first insulating layer 310. When the conductive layer is formed by non-electrolytic plating, the top and bottom surfaces of the first insulating layer 310 may be illuminated to smoothly perform plating.

Thereafter, the conductive layer formed on at least one surface of the first insulating layer 310 is etched to form a circuit pattern 320.

The circuit pattern 320 may be formed by a dry film lamination process, an exposure process, a development process, an etching process, and a peeling process.

Next, referring to FIG. 10, a through hole 315 (cavity) is formed through the first surface of the first insulating layer 310 and the second surface opposite to the first surface.

Referring to FIG. 11, the optical module 100 is embedded in the through hole 315.

12, an optical transmitter 330 is mounted on a circuit pattern formed on the upper surface of the first insulating layer 310, and a circuit pattern 320 (see FIG. 12) formed on the upper surface of the first insulating layer 310, The optical receiver 340 is mounted.

13, a second insulating layer 350 filling the formed circuit pattern 320, the optical module 100, the optical transmitter 330, and the optical receiver 340 is formed on the first insulating layer 310 are formed on the upper and lower surfaces, respectively.

Since the optical path can be easily formed by inserting the optical module 100 manufactured as described above into the insulating layer, not only the productivity of the optical printed circuit board can be increased, but also the efficiency of the optical transmission Can be increased. Further, by using a single optical module, an optical printed circuit board similar to the USB type can be provided.

14 is a sectional view of an optical printed circuit board according to a second embodiment of the present invention.

14, the optical printed circuit board 400 includes a first insulating layer 410, a circuit pattern 420 formed on at least one surface of the first insulating layer 410, An optical transmitter 430 and an optical receiver 440 connected to the circuit pattern 420 and the first and second insulation layers 410 and 440, And a second insulating layer 450 filling the optical module.

Prior to the description of the optical printed circuit board 400 according to the second embodiment, the same parts as those of the optical printed circuit board 300 according to the first embodiment will be omitted for convenience of explanation.

The optical printed circuit board 400 couples a plurality of optical modules to each other, and the combined optical modules are inserted into the first insulation layer 410.

That is, as shown in FIG. 7, a plurality of optical modules are coupled to each other so as to have an asymmetrical shape, and the combined optical modules are inserted into the first insulating layer 410.

At this time, since the combined optical modules are inserted into the first insulating layer 410, the optical transmitter 430 and the optical receiver 440 are formed on different layers.

15 to 19 are cross-sectional views for explaining a manufacturing method of the optical printed circuit board shown in Fig.

Referring to FIG. 15, a first insulating layer 410 is first prepared. When a conductive layer (not shown) is stacked on at least one side of the first insulating layer 410, the laminated structure of the first insulating layer 410 and the conductive layer may be a conventional CCL (Copper Clad Laminate) have.

Alternatively, the conductive layer may be formed by performing non-electrolytic plating on the first insulating layer 410. When the conductive layer is formed by non-electrolytic plating, the top and bottom surfaces of the first insulating layer 410 may be illuminated to smoothly perform plating.

Thereafter, the conductive layer formed on at least one surface of the first insulating layer 410 is etched to form a circuit pattern 420.

The circuit pattern 420 can be formed by a dry film lamination, exposure, development, etching, and peeling processes.

Referring to FIG. 16, a through hole 415 (cavity) is formed through the first surface of the first insulating layer 410 and the second surface opposite to the first surface.

Referring to FIG. 17, the optical modules 100a and 100c are embedded in the through holes 415.

To this end, a process of combining a plurality of optical modules as shown in FIG. 7 is performed.

18, an optical transmitter 430 is mounted on a circuit pattern formed on the upper surface of the first insulating layer 410 and a circuit pattern 420 (see FIG. The optical receiver 440 is mounted.

Referring to FIG. 19, a second insulating layer 450 filling the formed circuit pattern 420, the optical modules 100a and 100c, the optical transmitter 430, and the optical receiver 440, Layer 410 are formed on the upper and lower surfaces, respectively.

20 is a view showing an optical printed circuit board according to a third embodiment of the present invention.

20, the optical printed circuit board 500 includes a first insulating layer 510, a circuit pattern 520 formed on at least one surface of the first insulating layer 510, An optical transmitter 530 and an optical receiver 540 connected to the circuit pattern 520 and an optical receiver 540 formed on upper and lower portions of the first insulation layer 510, And a second insulating layer 550 filling the optical module.

Prior to the description of the optical printed circuit board 500 according to the third embodiment, the same parts as those of the optical printed circuit boards 300 and 400 according to the first and second embodiments will be omitted for convenience of description. .

The optical printed circuit board 500 couples a plurality of optical modules to each other, and the combined optical modules are inserted into the first insulation layer 510.

That is, as shown in FIG. 6, a plurality of optical modules are combined to have a symmetrical shape, and the combined optical modules are inserted into the first insulation layer 510.

At this time, since the combined optical modules are inserted into the first insulation layer 510, the optical transmitter 530 and the optical receiver 540 are formed on the same layer.

While the present invention has been particularly shown and described with reference to exemplary embodiments thereof, it is to be understood that the invention is not limited to the disclosed exemplary embodiments, It belongs to the scope of right.

100: optical module
200:
300, 400, 500: optical printed circuit board

Claims (24)

delete delete delete delete delete delete delete delete A first insulating layer in which a circuit pattern is formed and includes a through hole;
A plurality of optical modules embedded in the through holes of the first insulating layer; And
And an optical element electrically connected to the circuit pattern,
The plurality of optical modules including a first optical module and a second optical module,
The first optical module includes:
A first lower case having a first side surface formed to be inclined and having a first receiving groove formed thereon;
A first light transmitting portion inserted into the first receiving groove of the first lower case;
A first reflector for reflecting light incident on the first inner surface of the first lower case; And
And a first upper case coupled to the first lower case to embed the first light transmitting part inserted into the first lower case,
At least one first coupling groove for coupling with the second lower case is formed on the second side surface of the first lower case facing the first side,
The second optical module includes:
The second lower case having a first side surface formed to be inclined and having a second receiving groove formed thereon;
A second light transmitting portion inserted into the second receiving groove of the second lower case;
A second reflector for reflecting light incident on the first inner surface of the second lower case; And
And a second upper case coupled to the second lower case and embedding the second light transmitting part inserted into the second lower case,
At least one second coupling groove for coupling with the first lower case is formed on a second side surface of the second lower case facing the first side,
The inner angle formed by the lower surface of the first lower case and the first inner surface of the first lower case is the same as the inner angle formed by the lower surface of the first lower case and the first reflecting portion,
The inner angle formed by the lower surface of the second lower case and the first inner surface of the second lower case is the same as the inner angle formed by the lower surface of the second lower case and the second reflecting portion,
The first coupling groove is located at a central point of a straight line connecting the lower surface of the first lower case and the upper surface of the first upper case,
Wherein the second engagement groove is located at a central point of a straight line connecting the lower surface of the second lower case and the upper surface of the second upper case,
The first engagement groove and the second engagement groove are disposed at positions corresponding to each other,
Wherein one end of the first light transmitting portion is exposed to the outside through a second side surface of the first lower case and one end of the second light transmitting portion is exposed to the outside through a second side surface of the second lower case,
Wherein one end of the first light transmitting portion and one end of the second light transmitting portion are in direct contact with each other and located on the same straight line,
The first lower case, the first upper case, the second lower case, and the second upper case may include a light source that includes a material having a refractive index lower than that of the first light transmitting unit and the second light transmitting unit, Printed circuit board. delete 10. The method of claim 9,
Wherein the internal angle between the lower surface of the first optical module and the first side surface of the first lower case is any one of 45 ° and 135 °,
Wherein the internal angle formed by the lower surface of the first optical module and the second side surface of the first lower case is 90 °. delete delete delete 10. The method of claim 9,
Wherein the optical device includes an optical transmitter and an optical receiver,
Wherein when the optical transmitter and the optical receiver are formed on the same layer, the first optical module and the second optical module have mutually symmetric shapes,
Wherein when the optical transmitter and the optical receiver are formed on different layers, the first optical module and the second optical module have mutually asymmetric shapes and combine with each other. 16. The method of claim 15,
Further comprising: a second insulation layer formed on at least one of an upper surface and a lower surface of the first insulation layer and embedding the optical transmitter, the optical receiver, and the optical modules. delete delete delete delete delete delete delete delete

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