KR101854655B1 - Apparatus and method for attaching sheet - Google Patents

Abstract

The sheet applying apparatus 10 includes a supporting means 11 having a supporting surface 21 capable of supporting a semiconductor wafer W and a releasing means 12 for releasing the adhesive sheet S to face the supporting surface 21 A concave portion detecting means 13 for detecting the position of the concave portion C formed on the adhesive sheet S and a jointed robot 15 for mounting the semiconductor wafer W on the supporting surface 21. [ And a pressing means 18 for pressing and bonding the adhesive sheet S to the semiconductor wafer W supported by the supporting means 11. The articulated robot 15 operates on the basis of the detection result of the recess detecting means 13 so that the semiconductor wafer W is held on the supporting surface 12 so that the recess center position DC and the semiconductor wafer center position WC coincide with each other. (21).

Description

[0001] APPARATUS AND METHOD FOR ATTACHING SHEET [0002]

The present invention relates to a sheet applying apparatus and a patch applying method, and more particularly, to a sheet applying apparatus and a patch applying method capable of attaching an adhesive sheet having a concave portion on an adhesive layer to an adherend.

BACKGROUND ART [0002] Semiconductor wafers (hereinafter also referred to as " wafers ") are of a type in which solder bumps (hereinafter referred to as " bumps " Further, a protective adhesive sheet is pasted on the circuit surface side of the wafer, and back grinding or the like is performed. Such an adhesive sheet is disclosed, for example, in Patent Document 1, and has an opening (concave portion) which is smaller in diameter than the outer shape of the wafer and on which the adhesive layer is not formed, on one surface side of the base sheet. Such an adhesive sheet is cut along the outer edge of the wafer after being attached to the circuit surface side of the wafer, and only the outer edge of the wafer is sealed to prevent the penetration of the washing water at the time of backside polishing.

Further, Japanese Patent Application Laid-Open No. 2004-328995 discloses a sticking device for sticking an adhesive sheet to a wafer and cutting the adhesive sheet along the outer edge of the wafer, for example.

Japanese Patent Application Laid-Open No. 2005-123382 Japanese Patent Application Laid-Open No. 2007-62004 Japanese Patent Application Laid-Open No. 2006-352054

(Summary of the Invention)

(Problems to be Solved by the Invention)

However, in the sheet applying apparatus of Patent Document 2, when the adhesive sheet of Patent Document 1 is employed, there is a problem that the concave portion and the wafer can not be aligned with each other, and thus the problem can not be solved.

Here, in Patent Document 3, the adhesive sheet is preliminarily cut out to the outer shape of the wafer, and the deviation of the position of the adhesive sheet is detected by the detection means during the release of the adhesive sheet, So that the outer shape of the outer tube is approximately matched. However, in Patent Document 3, the table for supporting the wafer is moved in order to correct the amount of deviation, which results in a problem that the configuration of the moving mechanism around the table becomes complicated.

[Object of the invention]

SUMMARY OF THE INVENTION An object of the present invention is to provide a sheet attaching device and a sticking method capable of precisely disposing the concave portion of an adhesive sheet having concave portions at a predetermined position of an adherend and attaching the adhesive sheet to an adherend, And the like.

In order to achieve the above object, the present invention provides a sheet applying apparatus in which an adhesive layer is provided on one surface of a substrate sheet, and an adhesive sheet having a concave portion formed on the adhesive layer at predetermined intervals is attached to one surface of an adherend ,

A supporting means having a supporting surface capable of supporting the adherend on the other surface side of the adherend, a releasing means for releasing the adhesive sheet so as to face the supporting surface, and an adhesive sheet And a pressing means for pressing the adhesive sheet from the base sheet side to attach the adherend to the adherend, wherein the pressing means comprises a pressing means for pressing the adherend against the adherend, The conveying means employs a configuration in which the adherend is placed on the supporting surface so that the concave portion is disposed at a predetermined position of the adherend and the adhesive sheet is adhered on the basis of the detection result of the recess detecting means have.

In the present invention, it is also possible to employ a configuration in which a cutting means capable of cutting the adhesive sheet attached to the adherend is employed.

And an adherend detecting means for detecting the position of the adherend,

The conveying means is preferably configured to mount the adherend on the supporting surface so that the concave portion is pasted to a predetermined position of the adherend based on the detection result of the adhered member detecting means.

The cutting means may be configured to be capable of cutting the adhesive sheet in a shape based on the detection results of the concave portion detecting means or the adherend detecting means.

The method for attaching a sheet according to the present invention is a sheet applying method for attaching an adhesive sheet provided with an adhesive layer on one surface of a base sheet and a concave portion formed on the adhesive layer at a predetermined interval to one surface of an adherend,

A step of loosening the adhesive sheet so as to face the support surface,

A step of detecting the position of the concave portion in the adhesive sheet that has been released so as to face the support surface,

A step of placing the adherend on the supporting surface so that the concave portion is disposed at a predetermined position of the adherend and the adhesive sheet is adhered on the basis of the detection result of the recess;

And pressing the adhesive sheet from the base sheet side to attach the adhesive sheet to the adherend.

According to the present invention, since the position of the concave portion is detected by the concave portion detecting means, and the adherend is placed on the supporting surface by the conveying means on the basis of the detection result, the positioning can be performed without moving the supporting means , The support means and the structure around the support means can be simplified and compact.

Further, since the cutting means cuts the adhesive sheet in a shape based on the detection results of the recessed portion detecting means and the adherend detecting means, the adhesive sheet can be attached to the adhesive sheet or the adherend having various shapes.

1 is a schematic front view of a sheet applying apparatus according to an embodiment;
Fig. 2 (a) is a front view of a partial section of the main part of Fig. 1, and Fig. 2 (b) is a schematic perspective view of the adhesive sheet viewed from below.

BEST MODE FOR CARRYING OUT THE INVENTION Hereinafter, embodiments of the present invention will be described with reference to the drawings.

In this specification, " upper " and " lower " are used with reference to Fig. 1 unless otherwise specified.

1 and 2, the sheet applying apparatus 10 includes support means 11 for supporting a wafer W as an adherend, and a belt-like release sheet RL on one side of the strip- A releasing means 12 for releasing the raw sheet R with the adhesive sheet S adhered thereon, concave portion detecting means 13 for detecting the position of the concave portion C formed in the adhesive sheet S, A pressing means 18 for pressing and sticking the adhesive sheet S to the wafer W supported by the supporting means 11, An alignment device 19 for positioning the wafer W before it is supported by the supporting means 11 and a control means 20 for controlling the overall operation of the present sheet attaching device 10 have.

A plurality of bumps B are formed on one surface (upper surface) of the wafer W. These bumps B are electrodes of the semiconductor chip and have a predetermined height.

The adhesive sheet S includes a base sheet BS and an adhesive layer AD laminated on one surface of the base sheet BS (upper surface in FIG. 2B). The adhesive layer (AD) is provided with a concave portion (C) at predetermined intervals in the extending direction of the adhesive sheet (the adhesive may not be provided on the bottom surface of the concave portion). Each of the concave portions C is formed in a shape of a size and a size in which all the bumps B on the wafer W are accommodated. A reference mark BM is provided between the neighboring concave portions C. The positions of the reference marks BM and the center positions DC of the concave portions in the short width direction (Y-axis direction) of the adhesive sheet S are the same without deviating in the Y-axis direction. The distance D in the X axis direction between the reference mark BM and the concave center position DC closest to the unwinding direction (X axis direction) of the adhesive sheet S is set to be the same. That is, the relative positional relationship between each concave-portion center position DC and the corresponding reference mark BM is always constant, and the concave-portion center position DC can be determined from the position of the reference mark BM have.

The supporting means 11 has a peripheral edge roughly the same as the peripheral edge shape of the wafer W and a supporting surface 21 capable of holding and holding the wafer W from the other surface An outer table 25 provided in a concave shape to form a gap between the inner table 22 and the inner table 22 and a linear motor 25 as a driving device for raising and lowering the inner table 22 27, and the inner table 22 is provided so as to be movable up and down according to the thickness of the adhesive sheet S and the thickness of the wafer W.

The unwinding means 12 includes a support roller 33 provided on the frame F for supporting the raw material sheet R rolled up in a roll form, a collecting roller 34 for collecting the release sheet RL, A plurality of guide rollers 36 to 39 disposed between the support roller 33 and the collection roller 34, a drive roller 41 rotatable through the motor M1 as a drive device, A pinch roller 42 sandwiching a release sheet RL between the release sheet RL and the release sheet RL during release of the raw material sheet R and peeling the adhesive sheet S from the release sheet RL A stripping plate 43 and a load cell 44 for detecting the tension applied to the adhesive sheet S when the adhesive sheet S is stuck to the wafer W by the pressing means 18, A drive means 47 for moving the release plate 43 so that the detected value of the load cell 44 is a predetermined value and a drive means 47 for moving the brake shoe 50, Cylinders 53 and 54 serving as drive devices for restraining the release of the adhesive sheet S by sandwiching the adhesive sheet S and a pair of guide rollers 37 to 39 and load cells 44, A frame F1 for supporting the measuring roller 46 and the cylinders 53 and 54 and a winding means 56 for winding the unnecessary adhesive sheet S1 on the outer side of the wafer W. The releasing means 12 is capable of releasing the adhesive sheet S peeled off from the release sheet RL in the release plate 43 so as to face above the support surface 21. [

The driving unit 47 includes a uniaxial robot 58 as a driving unit and a slider (not shown) of the uniaxial robot 58 is attached to the frame F1 and is connected to the load cell 44 via the control unit 20. [ The frame F1 is supported so as to be vertically movable in accordance with the tensile force of the adhesive sheet S detected by the tension sensor.

The winding means 56 includes a roller 60 supported on a frame F2, a driving roller 61 driven by a motor M2 as a driving device, and a driving roller 61, And a take-up roller 63 that follows the drive roller 61 and rotates. The frame F2 is supported on the slider 65A of the linear motor 65 as a driving device and is movable in the X-axis direction.

The concave portion detecting means 13 is constituted by imaging means such as a camera provided above the peeling plate 43 shown in Fig. 1 and picks up the reference mark BM in the released adhesive sheet S And detects the position of the reference mark BM in the X-axis and Y-axis directions, and outputs the detected data to the control means 20.

The articulated robot 15 includes a base 70 and a first arm 71 to a sixth arm 76 disposed on the upper surface side of the base 70, Called six-axis robot having a holding chuck 77 attached to the free end side, and the holding chuck 77 can be moved in any position or any direction within the working region. The holding chuck 77 is connected to the cutter blade holder 79 for supporting the cutter blade 78 so as to be capable of being peeled off and peeled from the carrier arm holder 81 shown in a plan view in a circle surrounded by a chain double- ). The conveying arm holder 81 supports the conveying arm 82. The conveying arm 82 is provided with a plurality of suction ports not shown and connected to the holding chuck 77, So that the wafer W can be held by suction. Here, the cutting means is constituted by the cutter blade 78, the cutter blade holder 79 and the articulated robot 15, and the cutting means is constituted by the transfer arm holder 81, the transfer arm 82 and the articulated robot 15 Thereby constituting conveying means.

The pressing means 18 includes a frame 84 movable in the X-axis direction through a slider (not shown) of the linear motor 65, a cylinder 85 serving as a driving device provided on the upper surface side of the frame 84, And a pressing roller 86 rotatably supported on an output shaft of the cylinder 85 and provided so as to be vertically movable by the operation of the cylinder 85. [

The alignment device 19 includes a rotation table 89 protruding from the upper surface of the base 88 and sensors for detecting the orientation marks such as the V notch and the orientation flat formed on the outer circumferential edge of the wafer W And an adherend detecting means (90) for detecting the adherend. The rotating table 89 is provided so as to be rotatable in the circumferential direction of the wafer W while supporting the wafer W on the upper surface thereof. The adherend detecting means 90 detects the position of the outer peripheral edge of the wafer W by taking an image of the outer circumferential edge of the wafer W and a bearing mark and outputs the detection result to the control means 20 .

The control means 20 may be a sequencer or a PC. The control means 20 is connected with input means (not shown) such as an operation panel, and the input means is capable of inputting operating conditions and data of the means. The control means 20 also has a function of inputting the detection results of the recessed portion detection means 13, the load cell 44 and the adhered substance detection means 90, The amount of operation, the speed of operation, and the like, and controlling them. The function of determining the center position DC of the concave portion from the data input from the concave portion detecting means 13 and the function of determining the center position DC of the concave portion when the adhesive sheet S is attached to the wafer W And also has a function of determining the position of the wafer center position WC and the orientation mark from the data inputted from the adhered object detection means 90. [ Further, the control means 20 is connected to each device controlled by a cable (not shown) or a wireless structure or the like.

Next, a method of attaching the adhesive sheet S in the present embodiment will be described.

The raw sheet R is pulled out from the supporting roller 33 by a predetermined length and the peeling sheet RL is peeled off from the peeling plate 43 at the raised position as shown in Fig. The sheet is fixed to the take-up roller 63 while the release sheet RL is fixed to the take-

When the power source is turned on, the motors M1 and M2 are operated to wind the adhesive sheet S over a predetermined length, and at the same time, the peeling sheet RL is wound by the collecting roller 34, The adhesive sheet S peeled off from the release sheet RL is released so as to face above the support surface 21. [ Subsequently, the operations of the motors M1 and M2 are stopped, and the brake shoes 50 and 51 abut against the guide rollers 37 and 39, respectively, thereby suppressing the release of the adhesive sheet S. After the release of the adhesive sheet S is suppressed, the reference mark BM of the adhesive sheet S positioned on the release plate 43 is detected by the recess detecting means 13, (20). The control means 20 determines the position of the concave center position DC based on the input data from the concave portion detecting means 13 and also obtains the center position H after the attaching.

Then, the articulated robot 15 is operated to hold the transfer arm holder 81 on the holding chuck 77, and then the wafer W is sucked and held by the transfer arm 82. The position of the wafer center position WC and the position of the orientation mark are detected by the adherend detection means 90 by rotating the wafer W by placing the wafer W on the rotation table 89 of the alignment device 19 , And outputs the position data to the control means (20). In the control means 20, the wafer center position WC and the position of the orientation mark are determined on the basis of the input data from the adherend detection means 90.

Next, the articulated robot 15 is operated so that the wafer W on the rotating table 89 is sucked and held by the transfer arm 82 to be transferred to the inner table 22 and the wafer W ). The control means 20 controls the operation of the articulated robot 15 such that the wafer W is positioned at the post-application center position H obtained before the wafer center position WC is obtained. That is, the conveying means supports the wafer W so that the concave portion C is disposed at a predetermined position of the wafer W and the adhesive sheet S is pasted on the basis of the detection result of the concave portion detecting means 13 Place on the surface (21).

After the wafer W is placed on the support surface 21, the cylinder 85 of the pressing means 18 is operated to press the adhesive sheet (not shown) by the pressing roller 86 as indicated by the two- S from the base sheet BS side, the pushing means 18 is moved to the left side in Fig. 1 by the operation of the linear motor 65. [ As the pressing roller 86 moves, a tensile force is applied to the adhesive sheet S, and a tensile force is applied to the tension measuring roller 46. Thus, the frame F1 is lowered by the uniaxial robot 58 so that the control means 20 maintains the predetermined tension while the load cell 44 detects the change in the tension thereof. As a result, The adhesive sheet S is pasted on the upper surface of the outer table 25 and the upper surface of the wafer W. [ As a result, the adhesive sheet S is pressed against the wafer W by the pressing roller 86 in a state in which a predetermined tension is applied. The center position WC of the wafer on the support surface 21 and the center position WC of the wafer on the support surface 21 are set so that the wafer center position WC matches the center position H after the application, The center position DC coincides with the X-axis and Y-axis directions.

When the attachment of the adhesive sheet S is completed, the holding chuck 77 is swung from the transfer arm holder 81 to the cutter blade holder 79 in the articulated robot 15. Then, the articulated robot 15 is operated to cut the adhesive sheet S along the outer circumferential edge of the wafer W through the cutter blade 78. In this cutting, the articulated robot 15 rotates about the center of the concave portion (DC) or the wafer center position (WC) as the center of rotation after attaching and corresponds to the diameter dimension of the wafer W And is controlled by the control means 20 so that the cutter blade 78 moves and cuts into a circular trajectory.

After the adhesive sheet S is cut, the holding chuck 77 is swapped back to the transfer arm holder 81 by the articulated robot 15. The wafer W to which the adhesive sheet S is attached is sucked and held by the transfer arm 82 by the operation of the articulated robot 15 and is removed from the inner table 22 and transferred to a post-process or the like. The unnecessary adhesive sheet S1 is peeled off from the upper surface of the outer table 25 and is wound by the take-up roller 63. As a result, Subsequently, the brake shoes 50 and 51 are separated from the guide rollers 37 and 39, and the frame F1 is raised. Simultaneously with this, the pushing roller 86 rises by the operation of the cylinder 85, returns to the position shown in Fig. 1 together with the frame F2, releases the new adhesive sheet S, The same operation as described above is performed.

Therefore, according to this embodiment, the recessed-portion center position DC is detected by the recess detecting means 13 and the operation of the articulated robot 15 is controlled based on the positional information, So that the adhesive sheet S can be attached by matching the wafer W and the concave portion C. It is possible to align the wafer W with the concave portion C without moving the inner table 22 and simplify the structure of the supporting means 11. [

As described above, the best configuration, method, and the like for carrying out the present invention are disclosed in the above description, but the present invention is not limited thereto.

While the present invention has been particularly shown and described with reference to particular embodiments thereof, it will be understood by those skilled in the art that various changes in form and details may be made therein without departing from the spirit and scope of the invention as defined by the appended claims. Accordingly, a person skilled in the art can make various changes.

Therefore, the description defining the shapes and the like disclosed above is merely illustrative for ease of understanding of the present invention, and is not intended to limit the present invention. Therefore, The description in the name of the member which is outside the scope of the present invention is included in the present invention.

For example, as long as the cutting means and the conveying means can exhibit the same functions as those of the above embodiment, various modifications are possible.

Further, the drive device in the above embodiment can adopt an electric device such as a rotary motor, a linear motor, a linear motor, a uniaxial robot, a multi-joint robot, an actuator such as an air cylinder, a hydraulic cylinder, a rodless cylinder and a rotary cylinder And they may be directly or indirectly combined (some may overlap with those exemplified in the embodiment).

The adherend in the present invention is not limited to a semiconductor wafer, but may be a glass plate, a steel plate, a resin plate, or the like, and the semiconductor wafer may be a silicon semiconductor wafer or a compound semiconductor wafer.

The reference mark BM may be formed at any position of the adhesive layer AD and the base sheet BS as long as it can be detected by the recess detecting means 13. The shape and position of the reference mark BM The present invention is not limited thereto.

The concave portion detecting means 13 detects the forming edge of the concave portion C and detects the concave portion center position DC by the intersection of the vertical bisectors of the two strings at the forming edge You can. According to this, the reference mark BM of the adhesive sheet S can be omitted.

In the case where the adhesive sheet S is a raw material sheet adhered to one surface of the release sheet RL with a predetermined gap and the concave portion C is formed in the adhesive sheet S, Convex detecting means capable of detecting a convex portion formed on the outer periphery of the concave portion C may be employed instead of the means.

10 sheet attaching device
11 Supporting means
12 Solution
13 concave portion detecting means
15 Multi-joint robot
18 Push means
78 Cutter blade
82 Carrying arm
90 adherend detection means
AD adhesive layer
BS substrate sheet
C concave portion
S adhesive sheet
W Semiconductor wafer (adherend)

Claims (5)

A sheet applying apparatus in which an adhesive layer is provided on one surface of a substrate sheet and an adhesive sheet having a concave portion formed on the adhesive layer at predetermined intervals is attached to one surface of an adherend,
A supporting means having a supporting surface capable of supporting the adherend on the other surface side of the adherend; a releasing means for releasing the adhesive sheet to face the supporting surface; and an adhesive sheet And a pressing means for pressing the adhesive sheet from the side of the base sheet to apply the adherend to the adherend, wherein the pressing means comprises:
Wherein the conveying means mounts the adherend on the supporting surface so that the concave portion is disposed at a predetermined position of the adherend and the adhesive sheet is adhered based on the detection result of the concave portion detecting means Sheet attaching device. A sheet applying method in which an adhesive layer is provided on one surface of a substrate sheet and an adhesive sheet having a concave portion formed on the adhesive layer at predetermined intervals is attached to one surface of an adherend,
A step of loosening the adhesive sheet so as to face the support surface,
A step of detecting the position of the concave portion in the adhesive sheet that has been released so as to face the support surface,
A step of placing the adherend on the supporting surface so that the concave portion is disposed at a predetermined position of the adherend and the adhesive sheet is adhered on the basis of the detection result of the recess;
And adhering the adhesive sheet to the adherend by pressing it from the base sheet side. delete delete delete

Images