KR101847934B1 - Current measuring apparatus of hanger for planting - Google Patents

Abstract

The present invention relates to a current measuring apparatus of a hanger for plating and, more specifically, relates to the current measuring apparatus of a hanger for plating with a shunt current sensor, which detects information of a current applied to a substrate from an electroplating device with a shunt current sensor, and stably supplies power to a communication module by a wire to transmit the detected current information.

Description

TECHNICAL FIELD [0001] The present invention relates to a current measuring apparatus for a plating hanger using a shunt current sensor,

The present invention relates to a current measuring device for a plating hanger, and more particularly to a current measuring device for detecting current information applied to a substrate in an electroplating apparatus by using a shunt current sensor, To a current measuring device for a plating hanger using a shunt current sensor capable of supplying power.

In order to pattern a metal film on a substrate, an electroplating method which is superior in resistance to electric mobility and has a lower manufacturing cost than the vapor deposition method is preferred.

Conventionally, the principle of electroplating is disclosed in Korean Patent Laid-Open Publication No. 10-2010-0034318 (published on April 1, 2010), in which a copper plate and a cathode which form an anode in a plating tank containing an electrolyte, ) Is immersed in the substrate, copper ions (Cu2 +) separated from the copper plate migrate to the substrate and a metal film is formed.

As a general example of such an electroplating method, an electroplating method using a weck hanger is a method in which an object to be plated is mounted on a wick hanger and is mounted on a vertical or horizontal rail and is activated and settled in a plating liquid contained in a plating vessel, Is used as a negative electrode and a metal or an insoluble metal to be plated is used as an anode.

Then, when a current is applied to the electrode through the rectifier, the plating solution is electrolyzed, the metal ions contained in the plating solution are separated and adhered to the surface of the object to be plated, and after a certain period of time, a thin metal film is formed, .

In the future electroplating method, it is required to control the current density and the scattering of the plating thickness in order to uniformly form the thickness of the metal film in accordance with the trend of thinning of the printed circuit board in the future.

Specifically, a conventional uniformly electrodeposited (Throwing Power) method is exemplified.

In this uniform electrodeposition method, a plurality of cathode hangers are connected to one rectifier, and a clamp is divided into several branches in a cathode hanger, and a current flows by holding the substrate in a clamping manner.

However, such a uniform electrodeposition method has a problem that it is difficult to uniformly form a copper metal film on a substrate.

That is, the plating area of the substrate is large and the current start in the hanger is changed, and the plating current is scattered on the substrate due to clamp contamination and difference in strength of the clamp aggregate.

The current density of the substrate varies due to the difference in the plating current, and the dispersion of the plating thickness becomes uneven.

As a result, the copper metal film of the printed circuit board has a non-uniform spread of the plating thickness as a whole, so that the surface quality is lowered and the reliability of the printed circuit board is lowered.

Conventionally, a technique of detecting and controlling current information applied to a substrate for plating in real time has been shown. However, in order to secure power required for transmitting current information to the outside, conventionally, a battery is mounted on each communication module, Respectively.

When the battery is mounted on each communication module as described above, stable power supply can not be provided due to discharge of the battery or the like during long use, and it is inconvenient to check whether the battery is discharged or not.

Published Japanese Patent Application No. 10-2015-0073641 Patent No. 10-1300325 Published Japanese Patent Application No. 10-2014-0028858

SUMMARY OF THE INVENTION The present invention has been made in order to solve the above-mentioned problems, and it is an object of the present invention to provide a shunt current sensor which detects current information applied to a substrate using a shunt current sensor, And an object thereof is to provide a current measuring apparatus for a plating hanger using a current sensor.

In order to attain the above object, a current measuring apparatus for a hanger for plating using a shunt current sensor according to the present invention comprises: a main power supply rail provided outside a plating tank in which a substrate and a positive electrode plate are arranged facing each other; A hanger having one end coupled to the main feed rail and moving along the main feed rail; A jig whose upper end is coupled to the hanger and grips the substrate by a clamp; An auxiliary guide rail disposed parallel to the main power feeding rail and supporting the other end of the hanger; An auxiliary feed rail long mounted on the auxiliary guide rail; A shunt current sensor mounted on the hanger for detecting current information applied to the substrate; A communication module mounted on the hanger and connected to the shunt current sensor; And a shunt current sensor electrically connected to the jig and the hanger, wherein the communication module is connected to the auxiliary power supply rail and is connected to the power supply, The current information of the substrate detected by the shunt current sensor is transmitted to the outside.

The rectifier is composed of a DC rectifier, and the communication module has an anode connected to the auxiliary feed rail and a cathode connected to the hanger.

Wherein the rectifier is formed by a rectifier of a pulse reverse (PR), wherein the anode of the communication module is connected to the auxiliary feeding rail and the cathode of the communication module is connected to the auxiliary guide rail, and the auxiliary feeding rail and the auxiliary guide rail are electrically non- .

A first insulating pad is disposed between the shunt current sensor and the hanger, and a second insulating pad is disposed between the hanger and the jig to electrically disconnect the hanger and the jig.

The communication module transmits the current information to the outside through the auxiliary power feed rail.

And a contact member which is in electrical contact with the auxiliary power supply rail is mounted at the other end of the hanger, the contact member includes: a bracket coupled to the other end of the hanger; And a connection terminal coupled to the bracket to make contact with the auxiliary power feeding rail, wherein the connection terminal is connected to the communication module by wire to supply power of the auxiliary power feeding rail to the communication module.

The bracket includes: a fixing bracket fixedly coupled to the other end of the hanger; A rotation bracket rotatably mounted on the fixed bracket in a vertical direction and having the connection terminal coupled thereto; And an elastic member installed between the fixing bracket and the rotation bracket and applying an elastic force to rotate the rotation bracket in the direction of the auxiliary power supply rail, wherein the rotation bracket is made of a nonconductor and the connection terminal is made of a conductor And the rotation bracket rotates in the direction of the auxiliary power feeding rail by the elastic force of the elastic member so that the connection terminal always contacts the auxiliary power feeding rail.

The connection terminal includes a roller that is rotatably mounted on the rotation bracket and contacts the auxiliary power supply rail.

Alternatively, the connection terminal includes an elastic brush having one end coupled to the rotation bracket and the other end contacting the auxiliary power supply rail.

A long hole is formed in the fixing bracket in the longitudinal direction of the hanger, and the fastening member is coupled to the hanger through the long hole to adjust the position of the bracket.

According to the current measuring apparatus of the plating hanger using the shunt current sensor of the present invention as described above, the following effects can be obtained.

The current information applied to the substrate can be detected using the shunt current sensor and the power can be stably supplied to the communication module for transmitting the detected current information.

Particularly, in the present invention, power is supplied to the communication module, which transmits the current information detected by the shunt current sensor to the outside, by wire, through the auxiliary power feed rail supporting the other end of the hanger, The hanger can be stably supported and a stable power source can be supplied to the communication module together with the wire.

In addition, power can be stably supplied to the communication module even when the hanger is moved by the contact member.

In addition, by controlling the rectifier individually by the control unit, when a difference occurs in the amount of current applied to the substrate, the amount of current applied to the substrate is adjusted at the end of the plating section using the rectifier, The plating thickness can be made uniform.

1 is a perspective view of a substrate plating apparatus equipped with a current measuring apparatus according to an embodiment of the present invention,
2 is a front view of a substrate plating apparatus equipped with a current measuring apparatus according to an embodiment of the present invention,
3 is a plan view of a substrate plating apparatus equipped with a current measuring apparatus according to an embodiment of the present invention,
FIG. 4 is a graph for explaining the adjustment of the plating thickness of the substrate by the substrate plating apparatus according to the embodiment of the present invention,
5 is a schematic plan view for explaining the operation of the positive electrode plate and the rectifier in the substrate plating apparatus according to the embodiment of the present invention.
6 is a schematic front view of a substrate plating apparatus equipped with a current measuring apparatus according to an embodiment of the present invention;
7 is a perspective view of a contact member of a substrate plating apparatus equipped with a current measuring apparatus according to an embodiment of the present invention.
8 is an exploded perspective view of a contact member of a substrate plating apparatus equipped with a current measuring apparatus according to an embodiment of the present invention.

1 to 3, the substrate plating apparatus equipped with the current measuring apparatus of the present invention includes a plating tank 10, a positive electrode plate 15, a main power supply rail 16, a hanger 20, A jig 30, a shunt current sensor 40, a communication module 50, a rectifier 60, a control unit 70, an auxiliary guide rail, an auxiliary power supply rail 82, and the like.

In the plating tank 10, a substrate 35 is disposed and filled with a plating liquid.

The positive electrode plate 15 is disposed on both sides of the substrate 35 inside the plating tank 10.

The main power feed rail 16 is disposed along the moving direction of the substrate 35 from the outside of the plating tank 10.

The main power supply rail 16 is connected to a ground terminal.

The hanger 20 is disposed in a direction orthogonal to the main power feeding rail 16 and has one end coupled to the main power feeding rail 16 and moving along the main power feeding rail 16.

The upper end of the jig 30 is coupled to the hanger 20 and a plurality of clamps are attached to the jig 30. The clamp holds the substrate 35 to fix the substrate 35 to the jig 30. [

The shunt current sensor 40 is mounted on the hanger 20 and detects current information applied to the substrate 35.

Since the conventional structure and operation of the shunt current sensor 40 are sufficient using conventional well-known techniques, a detailed description thereof will be omitted.

The shunt current sensor 40 may be mounted directly on the hanger 20 but may be provided with a first insulation pad (not shown) between the shunt current sensor 40 and the hanger 20 for insulation with the hanger 20. [ 21) are arranged in the vicinity of the center of the wafer.

The shunt current sensor 40 is electrically connected to the jig 30 to which the substrate 35 is mounted and is electrically connected to the hanger 20 connected to the main power supply rail 16, The current information applied to the substrate 35 mounted on the substrate 35 is detected.

More specifically, the shunt current sensor 40 is connected to the jig 30 and the hanger 20 via electric wires or the like, respectively.

A second insulation pad 22 is disposed between one end of the hanger 20 and the jig 30 so that the hanger 20 and the jig 30 connected to the shunt current sensor 40 are electrically It is preferable to block the connection to the second terminal.

More specifically, the second insulating pad 22 is disposed on the hanger 20 between the position where the shunt current sensor 40 is mounted and the jig 30. As shown in FIG.

Therefore, the shunt current sensor 40 can detect the amount of current applied to the substrate 35 mounted on the jig 30 or the current density.

The communication module 50 is attached to the hanger 20 and is connected to the shunt current sensor 40 to transmit the current information detected by the shunt current sensor 40 to the outside by wire or wirelessly.

The rectifier (60) is connected to the main power supply rail (16) and the positive electrode plate (15) to supply power.

The rectifier 60 includes a DC rectifier 61 or a PR (pulse reverse) rectifier 62.

The control unit 70 receives the current information from the communication module 50 in a wired or wireless manner and controls the rectifier 60 to control the current density applied to the substrate 35.

That is, the controller 70 controls the rectifier 60 according to the current information detected by the shunt current sensor 40 to control the current density applied to the substrate 35.

The control unit 70 sums the amounts of current applied to the respective substrates 35 during the plating process using the current information detected through the shunt current sensor 40, The amount of current applied to the substrate 35 in the remaining plating period is controlled in proportion to the slope of the straight line connecting the summed amount of current summed up to the predetermined time predetermined for each of the plurality of gate electrodes 35 and the final reference value at the final time.

The adjustment of the amount of current applied to the substrate 35 is performed by controlling the amount of current applied to the positive electrode plate 15 through the rectifier 60 and controlling the amount of current to be transmitted to the substrate 35 through the plating liquid And the current value applied to the substrate 35 is adjusted.

The predetermined time is preset at the end of the plating section.

The controller 70 controls the amount of current applied to the substrate 35 according to the slope in the remaining plating period after the predetermined time so that the final summed current amount added at the final time of plating is equal to the final reference value So that the plating layer formed on the substrate 35 has a constant thickness.

On the other hand, as shown in FIG. 5, in the plating period after the specific time, the positive electrode plate 15 is divided into a plurality of portions with a width smaller than the width of the substrate 35.

Each rectifier 60 is individually connected to each of the positive electrode plates 15 and the control unit 70 individually controls currents applied to the plurality of positive electrode plates 15 through the plurality of rectifiers 60 .

When the two plates 35 simultaneously face one of the positive plates 15 when the rectifier 60 individually controls the positive plates 15, the controller 70 controls the positive plates 15 And an amount of current corresponding to the substrate 35 facing a large area.

For example, when only the first substrate 35a faces the positive electrode plate 15 as shown in FIG. 5A, the controller 70 controls the amount of current corresponding to the first substrate 35a, that is, The amount of current corresponding to the calculated slope corresponding to the first substrate 35a is applied to the positive electrode plate 15 through the rectifier 60. [

When the first substrate 35a and the second substrate 35b face each other with one of the positive electrode plates 15 entering the second substrate 35b as shown in Fig. 5 (b) If the area of the substrate 35a facing the positive electrode plate 15 is larger than the area of the second substrate 35b adjacent to the positive electrode plate 15b, the controller 70 can still measure the amount of current corresponding to the first substrate 35a .

5 (c), the first substrate 35a and the second substrate 35b move and the second substrate 35b contacts the positive electrode plate 15 more than the first substrate 35a When the facing area becomes large, the controller 70 applies a current amount corresponding to the second substrate 35b.

When the first substrate 35a and the second substrate 35b move and only the second substrate 35b faces the corresponding positive electrode plate 15 as shown in FIG. 5 (d), the controller 70 Applies an amount of current corresponding to the second substrate 35b.

The above process is equally applied to all of the positive electrode plates 15, in which a plurality of positive electrode plates 15 are disposed apart from each other.

Thus, a more accurate current amount can be applied to the positive electrode plate 15 to make the thickness of the plating layer formed on the substrate 35 uniform.

Whether or not the size of the area where the positive electrode plate 15 faces the substrate 35 can be judged by the moving speed of the substrate 35 with time, the mounting of another sensor, or the like.

The auxiliary guide rail 81 is disposed parallel to the main power feed rail 16 and the other end of the hanger 20 is supported.

One end of the hanger 20 is supported by the main power supply rail 16 and the other end is supported by the auxiliary guide rail 81 so that the hanger 20 can move more stably have.

The auxiliary power feeding rail 82 is long mounted on the auxiliary guide rail 81.

The auxiliary feed rail 82 is connected to the communication module 50 to supply power to the communication module 50.

A contact member 90 which is in electrical contact with the auxiliary power feeding rail 82 is mounted on the other end of the hanger 20 so that the auxiliary power feeding rail 82 supplies power to the communication module 50 And the contact member 90 will be described later.

The communication module 50 receiving the power through the auxiliary power feed rail 82 transmits the current information of the substrate 35 detected by the shunt current sensor 40 to the outside.

As described above, since the communication module 50 is supplied with power through a wired line rather than wireless, the communication module 50 can be stably supplied with power.

6 (a), when the rectifier 60 is composed of the DC rectifier 61, the communication module 50 is connected to the auxiliary power supply rail (not shown) through the connection member 90 82, and a cathode is connected to the hanger 20 to receive power.

Through the above structure, the communication module 50 can commonly share the cathode or the ground terminal together with the shunt current sensor 40.

6 (b), when the rectifier 60 is formed of a pulse reverse rectifier 62, the communication module 50 is configured such that the anode is connected to the connection member 90 via the connection member 90, And a negative electrode is connected to the auxiliary guide rail 81 to receive power.

The cathode of the communication module 50 is connected to the auxiliary guide rail 81 rather than the hanger 20 so that the communication module 50 can be stably supplied with power even when the PR rectifier 62 is used. can do.

The communication module 50 transmits the current information to the outside in a wired or wireless manner as described above. In the present embodiment, the current information is wired to the outside using the auxiliary power feeding rail 82 for supplying power, So that it is possible to omit the parts and the like necessary for the wireless communication, thereby reducing the unit cost and the like, and there is no list of the noise generated in the wireless communication.

The contact member 90 mounted on the other end of the hanger 20 and in electrical contact with the auxiliary power supply rail 82 is connected to the bracket 91 and the connection terminal 92 as shown in Figs. .

The bracket 91 is coupled to the other end of the hanger 20.

The connection terminal 92 is coupled to the bracket 91 and is in electrical contact with the auxiliary power supply rail 82.

The connection terminal 92 is connected to the communication module 50 by wire to supply power of the auxiliary power supply rail 82 to the communication module 50.

In the present embodiment, the bracket 91 is composed of a fixing bracket 91a, a rotation bracket 91b, and an elastic member 91d.

The fixing bracket 91a is fixedly coupled to the other end of the hanger 20. [

The rotation bracket 91b is rotatably mounted to the fixing bracket 91a in the vertical direction, and the connection terminal 92 is engaged.

The elastic member 91d is installed between the fixing bracket 91a and the rotation bracket 91b to apply an elastic force to rotate the rotation bracket 91b in the direction of the auxiliary power supply rail 82. In this embodiment, The elastic member 91d is formed of a torsion spring.

The rotation bracket 91b is rotated in the direction of the auxiliary power feeding rail 82 by the elastic force of the elastic member 91d so that the connection terminal 92 always contacts the auxiliary power feeding rail 82. [

The fixing bracket 91a may be engaged only at a specific position on the other end of the hanger 20. However, as in the present embodiment, the fixing bracket 91a moves in the longitudinal direction of the hanger 20, So that it can be varied.

A long hole 91c is formed in the fixing bracket 91a in the longitudinal direction of the hanger 20 and a fastening member such as a bolt is coupled to the hanger 20 through the long hole 91c, The position of the bracket 91 can be adjusted along the longitudinal direction of the hanger 20.

It is possible to adjust the position of the contact member 90 when the contact member 90 is installed on the hanger 20 so that the contact member 90 always contacts the auxiliary power supply rail 82 .

The connection terminals 92 contacting the auxiliary power feed rail 82 may have various structures.

The connection terminal 92 may be formed of a roller that is rotatably mounted on the rotation bracket 91b and contacts the auxiliary power supply rail 82 or one end thereof is coupled to the rotation bracket 91b, And an elastic brush that contacts the auxiliary power supply rail (82).

When the hanger 20 is moved by the connection terminal 92 as described above, the connection terminal 92 can always be electrically connected to the auxiliary power feeding rail 82.

The present invention supplies electric power to the communication module 50 which externally transmits the current information detected by the shunt current sensor 40 to the auxiliary power supply rails (not shown) supporting the other end of the hanger 20 82 so that the hanger 20 can be stably supported and power can be supplied to the communication module 50 as wired lines.

Further, power can be stably supplied to the communication module (50) even when the hanger (20) is moved by the contact member (90).

When the amount of current applied to the substrate 35 is different by controlling the rectifier 60 individually by the controller 70, the rectifier 60 is used at the end of the plating section, By controlling the amount of current applied to the substrate 35, the thickness of the final plating of the substrate 35 can be made uniform.

The apparatus for measuring the current of the hanger for plating using the shunt current sensor of the present invention is not limited to the embodiment described above and can be variously modified within the scope of the technical idea of the present invention.

10: plating tank, 15: positive electrode plate, 16: main power supply rail,
20: a hanger, 21: a first insulating pad, 22: a second insulating pad
30: jig, 35: substrate, 35a: first substrate, 35b: second substrate,
40: Shunt current sensor, 50: Communication module,
60: rectifier, 61: DC rectifier, 62: PR rectifier,
70:
81: auxiliary guide rail, 82: auxiliary feeding rail,
Wherein the elastic member is provided with at least one connecting terminal and at least one connecting terminal,

Claims (10)

A main power supply rail provided outside the plating vessel in which the substrate and the positive electrode plate are disposed so as to face each other; A hanger having one end coupled to the main feed rail and moving along the main feed rail; A jig whose upper end is coupled to the hanger and grips the substrate by a clamp; An auxiliary guide rail disposed parallel to the main power feeding rail and supporting the other end of the hanger; An auxiliary feed rail long mounted on the auxiliary guide rail; A shunt current sensor mounted on the hanger for detecting current information applied to the substrate; A communication module mounted on the hanger and connected to the shunt current sensor; And a rectifier connected to the main power supply rail and the positive electrode plate to supply power,
Wherein the shunt current sensor is electrically connected to the jig and the hanger, respectively,
Wherein the communication module is connected to the auxiliary power supply rail and is supplied with power, transmits current information of the substrate detected by the shunt current sensor to the outside,
And a contact member which is in electrical contact with the auxiliary feed rail is mounted at the other end of the hanger,
The contact member
A bracket coupled to the other end of the hanger;
And a connection terminal coupled to the bracket and contacting the auxiliary power supply rail,
Wherein the connection terminal is connected to the communication module by a wire to supply the power of the auxiliary power feed rail to the communication module. The method according to claim 1,
Wherein the rectifier comprises a DC rectifier,
Wherein the communication module has an anode connected to the auxiliary feed rail and a cathode connected to the hanger. The method according to claim 1,
Wherein the rectifier comprises a PR (pulse reverse) rectifier,
Wherein the communication module has an anode connected to the auxiliary power supply rail and a cathode connected to the auxiliary guide rail,
Wherein the auxiliary power feeding rail and the auxiliary guide rail are electrically non-conductive to each other. The method according to claim 1,
A first insulation pad is disposed between the shunt current sensor and the hanger,
And a second insulating pad is disposed between the hanger and the jig to electrically disconnect the hanger from the jig. The method according to claim 1,
Wherein the communication module transmits the current information to the outside via the auxiliary power feed rail. delete The method according to claim 1,
The bracket
A fixed bracket fixedly coupled to the other end of the hanger;
A rotation bracket rotatably mounted on the fixed bracket in a vertical direction and having the connection terminal coupled thereto;
And an elastic member installed between the fixing bracket and the rotation bracket and applying an elastic force to rotate the rotation bracket in the direction of the auxiliary power supply rail,
Wherein the rotation bracket is made of a nonconductor, the connection terminal is made of a conductor,
And the rotation bracket rotates in the direction of the auxiliary power feeding rail by the elastic force of the elastic member so that the connection terminal always contacts the auxiliary power feeding rail. The method of claim 7,
Wherein the connection terminal is made of a roller rotatably mounted on the rotation bracket and contacting the auxiliary power supply rail. The method of claim 7,
Wherein the connection terminal comprises an elastic brush having one end coupled to the rotation bracket and the other end contacting the auxiliary power supply rail. The method of claim 7,
Wherein a long hole is formed in the fixing bracket in the longitudinal direction of the hanger,
Wherein the fastening member is coupled to the hanger through the elongated hole to adjust the position of the bracket.

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