KR101839366B1 - Bonding unit of probe pin bonding device - Google Patents

Abstract

The present invention relates to a bonding unit for a probe pin bonding apparatus, and more particularly to a bonding unit for a probe pin bonding apparatus for reducing the pitch of probe pins bonded to a probe card. According to an embodiment of the present invention, there is provided a probe pin bonding apparatus for bonding a probe pin to a probe card, comprising: a bonding grip module for transferring a probe pin to an upper portion of the probe card; A bonding vision module for recognizing a position and a shape of the probe pin; And a laser module positioned at one side of the bonding grip module.

Description

[0001] BONDING UNIT OF PROBE PIN BONDING DEVICE [0002]

The present invention relates to a bonding unit for a probe pin bonding apparatus, and more particularly to a bonding unit for a probe pin bonding apparatus for reducing the pitch of probe pins bonded to a probe card.

Generally, a probe card is an apparatus for checking the electrical performance of a chip formed on a semiconductor substrate. More specifically, a plurality of probe pins are bonded to a plurality of probe pins on a probe card, and a plurality of probe pins are brought into contact with the pads of the semiconductor chip to check whether the chips are normal or not by applying an electrical signal.

In recent years, circuit patterns of semiconductor devices have become finer as semiconductor devices are increasingly highly integrated. Therefore, a probe card in which probe pins are bonded so as to have an interval corresponding to the interval of fine circuit patterns of semiconductor devices is required.

In order to reduce the pitch between the probe pins, the probe pin has been continuously developed with minimum thickness while maintaining the elasticity.

However, conventionally, even if the thickness of the probe pin is reduced, there is a limit in reducing the pitch of the probe pin due to the grip module for transferring the probe pin.

Specifically, when a conventional grip module is bonded to a probe card, the grip module may come into contact with an adjacent probe pin to cause a failure. In other words, conventionally, there has been a limit in reducing the pitch of the probe pins because at least the pitch between the probe pins is required by the thickness of the grip module that grips and transfers the probe pins.

Therefore, there is a need for a bonding unit for a probe pin bonding apparatus that can minimize the pitch of the probe pins without being affected by the thickness of the grip module.

SUMMARY OF THE INVENTION It is an object of the present invention to provide a bonding unit for a probe pin bonding apparatus capable of minimizing the pitch of probe pins bonded to a probe card.

It is to be understood that both the foregoing general description and the following detailed description are exemplary and explanatory and are not intended to limit the invention to the precise form disclosed. There will be.

According to an aspect of the present invention, there is provided a probe pin bonding apparatus for bonding a probe pin to a probe card, comprising: a bonding grip module for transferring a probe pin to an upper portion of a probe card; A bonding vision module for recognizing a position and a shape of the probe pin; And a laser module positioned at one side of the bonding grip module.

According to an aspect of the present invention, there is provided a bonding apparatus comprising: a bonding unit including a bonding unit for transferring a probe pin on a wafer; and an array unit for aligning the probe pins transferred from the pick- And a probe pin bonding device.

According to an embodiment of the present invention, the bonding grip module may further include a bonding elastic member for vacuum-bonding and transferring the probe pin.

In an embodiment of the present invention, the bonding grip module includes: a bonding grip body forming an outer shape; A bonding grip slope formed on one side of the bonding grip body; And a bonding grip absorbing surface provided at a lower portion of the other side of the bonding grip body and having a step.

In an embodiment of the present invention, the inclination angle of the bonding grip slope may be determined so as to correspond to the laser beam irradiation angle of the laser module.

In an exemplary embodiment of the present invention, the bonding vacuum section may include a bonding vacuum tube inserted through the entire back surface of the bonding grip body; A bonding vacuum hole provided on the bonding grip absorption surface and communicating with the bonding vacuum tube; And a bonding vacuum buffer provided on the front surface of the bonding grip body and communicating the bonding vacuum tube with one side of the bonding vacuum hole.

In an embodiment of the present invention, a solder paste may be applied to a position where the probe pin is to be bonded in the probe card.

In an embodiment of the present invention, the bonding grip module includes a pair of bonding grippers spaced apart from each other by a predetermined interval. A bonding sloping surface provided on both sides of the bonding gripper so as to be narrowed downward; A bonding tip provided at a lower end of the bonding gripper; And a bonding control unit extending rearward from a pair of the bonding gripers and adjusting the interval of the bonding tips.

According to the embodiment of the present invention, the bonding unit for the probe pin bonding apparatus can minimize the pitch between the probe pins when the probe pins are bonded to the probe card.

First, when the bonding grip module is prepared to have bonding pincushion, the probe pin is transferred to the bonding grip module while being vacuum-adsorbed. At this time, the probe pin is fixed and conveyed to the bonding grip absorption surface provided on the lower side of the other side of the bonding grip body. That is, when the probe pin is fixed to the probe card, only one side is adsorbed to the bonding grip adsorption surface and the other side is open. Therefore, even when the probe pin is bonded very close to the probe pin bonded to one side, the bonding grip module does not contact the adjacent probe pin.

In addition, since the bonding pin module having the bonding vacuum section fixes and transports the probe pin by vacuum suction, the probe pin is stable without being damaged by the pressure received from the bonding grip module during transportation.

On the other hand, in the case of the bonding grip module provided with the bonding tip, the bonding tip is provided with a step on the lower end of the bonding gripper. At this time, the bonding tip for fixing the probe pin is provided with a minimum width capable of fixing the probe pin. Therefore, the bonding grip module provided with the bonding tip can be bonded in close proximity to the probe pin located at one side of the probe pin.

In addition, the bonding tip is automatically adjusted by the bonding adjuster so as not to damage the probe pin. Accordingly, the bonding grip module provided with the bonding tip can securely transfer and transport the probe pin.

It should be understood that the effects of the present invention are not limited to the above effects and include all effects that can be deduced from the detailed description of the present invention or the configuration of the invention described in the claims.

1 is a perspective view showing a state in which a pick-up grip module of a probe pin bonding apparatus picks up a probe pin on a wafer.
2 is a top view showing the base unit of the probe pin bonding apparatus.
3 is a front view showing a state in which the pick-up turn module of the probe pin bonding apparatus feeds the probe pins to the array unit.
4 is a front view showing an array unit of the probe pin bonding apparatus.
5 is a side view showing the array unit of the probe pin bonding apparatus.
6 is a view showing a state in which probe pins are aligned using an array vision module of a probe pin bonding apparatus.
7 is a perspective view illustrating a bonding grip module having a bonding elasticity according to the first embodiment of the present invention and a dipping unit.
8 is a perspective view showing a state in which the linear measurement module of the bonding unit for the probe pin bonding apparatus measures the elevation of the probe card.
9 is a side view showing a state in which the height of the probe pin of the probe pin bonding apparatus is measured.
10 is a front view showing a bonding grip module having bonding elasticity according to the first embodiment of the present invention bonding a probe pin to a probe card.
11 is a perspective view illustrating a bonding grip module according to a second embodiment of the present invention in which probe pins are bonded to a probe card.
12 is a front view showing a state in which the bonding grip module according to the second embodiment of the present invention bonds the probe pins to the probe card.

DETAILED DESCRIPTION OF THE PREFERRED EMBODIMENTS Hereinafter, the present invention will be described with reference to the accompanying drawings. The present invention may, however, be embodied in many different forms and should not be construed as limited to the embodiments set forth herein. In order to clearly illustrate the present invention, parts not related to the description are omitted, and similar parts are denoted by like reference characters throughout the specification.

Throughout the specification, when a part is referred to as being "connected" (connected, connected, coupled) with another part, it is not only the case where it is "directly connected" "Is included. Also, when an element is referred to as "comprising ", it means that it can include other elements, not excluding other elements unless specifically stated otherwise.

The terminology used herein is for the purpose of describing particular embodiments only and is not intended to be limiting of the invention. The singular expressions include plural expressions unless the context clearly dictates otherwise. In this specification, the terms "comprises" or "having" and the like refer to the presence of stated features, integers, steps, operations, elements, components, or combinations thereof, But do not preclude the presence or addition of one or more other features, integers, steps, operations, elements, components, or combinations thereof.

Hereinafter, embodiments of the present invention will be described in detail with reference to the accompanying drawings.

1 to 12, the probe pin bonding apparatus 1000 includes a pick-up unit 100, an array unit 300, and a bonding unit 400. Hereinafter, each configuration will be described in detail using each drawing.

FIG. 1 is a perspective view showing a state in which a pick-up grip module of a probe pin bonding apparatus picks up a probe pin on a wafer, FIG. 2 is a top view showing a base unit of a probe pin bonding apparatus, And the turn module transfers the probe pins to the array unit.

First, a probe pin 10 according to an embodiment of the present invention will be described.

The probe pin 10 may include a first pin body 11, a second pin body 12, a meter probe 13, and a test body 14.

Specifically, the first pin body 11 may have one end extending upward and the other end extending to one side, and one end and the other end may be bent and extended vertically. For example, it may be in the form of "b".

The second pin body 12 may extend from the upper end of the first pin body 11 to one side.

The meter probe 13 may be provided at one end of the upper surface of the second pin body 12 and protrude upward.

The inspection member 14 may be formed to protrude from one end of the second pin body 12 to one side.

The shape of the probe pin 10 is not limited to the embodiment, and any one of the probe pins 10 practiced by the ordinary artisan can be included in one embodiment.

1 to 3, the pickup unit 100 includes a pickup grip module 110, a first pickup vision module 120, a pickup turn module 130, and a second pickup vision module 140 And the probe pins 10 on the wafer W can be transferred to the array unit 300.

The pick-up grip module 110 has a pick-up grip body 111 and a pickup grip concentrator 112 and can transfer the probe pins 10 on the wafer W to the base unit 200.

The pick-up grip body 111 forms an outer shape of the pick-up grip module 110. Inside the pick-up grip body 111 is a through hole (not shown) (Not shown) may be provided.

The pick-up grip mechanism 112 has a pick-up grip vacuum body 113 and a pick-up grip vacuum hole 114, and can vacuum-suck the probe pin 10.

Specifically, the pick-up grip vacuum body 113 may be coupled to one side of the pick-up grip body 111, and the inside of the pick-up grip body 111 may be evacuated.

The pick-up grip vacuum hole 114 is connected to a through hole provided in the pick-up grip body 111 and extends to the lower end of the pickup grip body 111. At this time, the inner diameter of the pickup grip vacuum hole 114 is formed to such a size that the probe pin 10 can be attracted.

The first pick-up vision module 120 is provided on one side of the pick-up grip module 110. The first pick-up vision module 120 recognizes the shape of the probe pin 10 when the pick-up grip module 110 picks up the probe pin 10 on the wafer W, The position to be vacuum-suctioned is determined. That is, the first pick-up vision module 120 can cause the pick-up grip module 110 to safely and accurately vacuum-transfer the probe pin 10.

The pick-up grip module 110 provided as described above is interlocked with the first pick-up vision module 120 so that the probe pin 10 on the wafer W is vacuum-adsorbed to the pickup grip vacuum hole 114, 200).

The base unit 200 has a base body 210, a polar chuck 215, and a base motor 220.

Specifically, the base body 210 has a cylindrical shape, and may be provided to be rotatable to one side or the other side. At this time, the shape of the base body 210 is not limited to a cylindrical shape. For example, the base body 210 may have a disc shape. In addition, the base body 210 may be provided with a porous vapor chuck 215 on its upper surface.

The porous chuck 215 may be mounted on and fixed to the upper surface of the base body 210. Although not shown, the uppermost layer of the porous chuck 215 is formed of a porous ceramic, and a light source and a vacuum module may be provided under the porous ceramic layer. At this time, the porous ceramic is composed of minute cracks having a very small gap as compared with the probe pins 10 seated on the upper surface. Therefore, when the vacuum module sucks the air on the upper surface of the porous chuck 215, there is no possibility that the probe pin 10 falls into a minute crack of the porous chuck 215 and a direct physical pressure is applied to the probe pin 10 It does not support. That is, the probe pin 10 can be securely adsorbed and fixed on the upper surface of the porous chuck 215.

Since the porous ceramic of the porous chuck 215 has numerous microcracks, the light emitted from the light source provided in the lower layer of the porous ceramic is easily transmitted. That is, the second pick-up vision module 140 can accurately recognize the shape of the probe pin 10 on the upper portion of the porous chuck 215.

The base motor 220 is provided on one side of the base body 210 and can rotate the base body 210 to one side or the other side. At this time, the base motor 220 can rotate the base body 210 in conjunction with the second pick-up vision module 140.

Specifically, the second pick-up vision module 140 recognizes the shape of the probe pin 10 mounted on the base unit 200. The second pick-up vision module 140 rotates the base body 210 in cooperation with the base motor 220 so that the probe pin 10 has a predetermined shape. At this time, the predetermined configuration of the probe pin 10 may be a form in which the pick-up turn module 130 can easily transfer the probe pin 10 to the array unit 300.

The pick-up turn module 130 includes a pick-up turn body 131, a pick-up turn shaft 132 and a pick-up turn 133. The pick-up turn module 130 picks up the probe pins 10 located on the base unit 200, And is rotated and mounted on the array unit (300).

Specifically, the pickup-turn body 131 forms an outer shape of the pickup-turn module 130 and may have a cylindrical shape. However, the shape of the pickup-turn body 131 is not limited to the embodiment .

The pick-up rotation shaft 132 is provided at the upper end of the pick-up body 131. The pick-up turn body 131 is hinged to be rotatable to one side or the other side with the pick-up rotation shaft 132 as an axis.

The pick-up turn 133 includes a pickup turn vacuum body 134 and a pick-up turn vacuum bar 135 and is capable of vacuum picking up the probe pin 10 on the base unit 200.

Specifically, the pickup-turn vacuum body 134 is coupled to one side of the pickup-turn body 131 and is connected to the pickup-turn vacuum bar 135 through the inside of the pickup-turn body 131.

The pick-up turn vacuum bar 135 is coupled to the other side of the pick-up body 131. The pick-up turn vacuum bar 135 may be formed in a columnar shape with one side open and the other side closed, and a longitudinal hole may be formed therein.

Turn pickup vacuum body 134 can make the inside of the pick-up turn vacuum bar 135 into a vacuum state so that the probe pin 10 can be vacuum-adsorbed to one side of the pickup turn vacuum bar 135.

The second pick-up vision module 140 is provided adjacent to one side of the pick-up body 131, and can recognize the position and the shape of the probe pin 10.

The pick-up turn module 130 provided as described above vacuum-sucks the probe pin 10 on the base unit 200 and rotates the pick-up turn body 131 using the pick-up turn shaft 132, 10 can be vertically erected. At this time, the second pick-up vision module 140 recognizes the position and shape of the probe pin 10 so that the probe pin 10 is accurately vacuum-adsorbed to the pickup turn vacuum bar 135, So that it can be seated. At this time, the probe pin 10 may be provided so that the lower side of the first pin body 11 is seated and fixed to the array unit 300.

Although not shown, the pickup unit 100 may further include a drive module (not shown).

The driving module includes a plurality of driving units (not shown) and is connected to the pickup grip module 110 and the first pickup vision module 120, the pickup turn module 130 and the second pickup vision module 140, respectively And may be provided to transport each module.

In addition, the pickup unit 100 may be configured so that the pickup grip module 110 and the pickup turn module 130 are provided as one pickup transfer module (not shown). Specifically, in one embodiment, the pick-up grip module 100 for lifting the probe pins 10 on the wafer W upward and transferring the probe pins 10 to the base unit 200 and the probe pins 10 on the base unit 200 are rotated The pick-up grip module 110 and the pick-up turn module 130 are connected to one pick-up conveying module 130. The pickup pick- As shown in FIG. In this case, the probe pin 10 can be mounted on the array unit 300 without going through the base unit 200. That is, the pick-up transfer module rotates the probe pins 10 on the wafer W so that the probe pins 10 can be mounted directly on the array unit 300 while the probe pins 10 on the wafer W are lifted upward, .

FIG. 4 is a front view showing the array unit of the probe pin bonding apparatus, FIG. 5 is a side view showing the array unit of the probe pin bonding apparatus, and FIG. 6 is a view showing a state in which probe pins are aligned using the array vision module of the probe pin bonding apparatus. Fig.

4 to 6, the array unit 300 includes an array grip module 310, an array vision module 320, and aligns the probe pins 10 transferred from the pickup unit 100 .

The array grip module 310 includes an array upper body 311, an array lower body 312, an array grip body 313, an array tightening body 314, an array connector 315 and an array motor 316 .

The array upper body 311 forms the upper contour of the array grip module 310 and the array lower body 312 forms the lower contour of the array grip module 310.

Specifically, the upper surface of the array lower body 312 can be extended to the rear by projecting upward from the center, as shown in FIG. 4, when viewed from the front. The lower surface of the array upper body 311 may have a shape such that a center thereof is embedded upward to correspond to the array lower body 312. That is, the lower surface of the array upper body 311 and the upper surface of the array lower body 312 may be engaged with each other.

Further, as shown in FIG. 5, the array upper body 311 and the array lower body 312 may be formed so as to have curved surfaces when they are viewed from the side.

The lower surface of the array upper body 311 and the upper surface of the array lower body 312 may be slid forward or rearward while being engaged with each other.

The array connector 315 is provided to connect the array upper body 311 and the array lower body 312 so that when the array upper body 311 slides from the array lower body 312, So as not to be detached from the array lower body 312.

In particular, a plurality of array connectors 315 may be formed extending in the longitudinal direction of the array upper body 311 to guide the movement path of the array upper body 311. At this time, the shape of the array connector 315 is not limited to the embodiment, and may include any shape in which the array upper body 311 can slide without leaving the array lower body 312.

An array motor 316 may be provided in the array lower body 312 and provides power to slide the array upper body 311 forward or backward. At this time, the position of the array motor 316 is not limited to one embodiment, and it is included in one embodiment as long as it is capable of providing power to slide the array upper body 311 forward or backward.

The array grip bodies 313 are provided on the upper side of the array upper body 311 and the pair of array grip bodies 313 can be arranged to be spaced from each other.

The array tightening body 314 may be provided on one side of the array upper body 311, and the gap between the array grip bodies 313 may be narrowed or widened. That is, when the probe pin 10 is seated on the array grip body 313, the array tightening body 314 narrows the gap of the array grip body 313 so that the probe pin 10 contacts the array grip body 313, As shown in Fig. At this time, the array tightening body 314 can be adjusted so as to apply a stress to the probe pin 10 so as not to damage the probe pin 10, taking the thickness of the probe pin 10 into consideration.

The array vision module 320 is provided on the side of the array grip module 310 and can recognize the shape of the probe pin 10 viewed from the side. The array vision module 320 is interlocked with the array motor 316 so that the array motor 316 slides the array upper body 311 forward or backward.

The array unit 300 provided as described above can align the probe pins 10 fixed to the array grip body 313 by sliding the array upper body 311 forward or backward.

6 (a) is a view in which the array vision module 320 recognizes the state before aligning the probe pins 10, and FIG. 6 (b) 10) are aligned.

As shown in FIG. 6 (a), the probe pin 10 fixed to the array grip body 313 may be shaped to one side when recognized by the array vision module 320. Specifically, a predetermined horizontal line (H) is designated in the array vision module 320. The array vision module 320 recognizes whether the upper surface of the second pin body 12 is parallel to the horizontal line H when viewed from the side. When the upper surface of the second pin body 12 is not parallel to the horizontal line H, the upper surface of the second pin body 12 is aligned with the horizontal line H To slide the array upper body 311 forward or backward.

6 (b), when the upper surface of the second pin body 12 is aligned so as to be parallel to the horizontal line H assigned to the array vision module 320, the array upper body 311 is in a sliding state .

FIG. 7 is a perspective view showing a bonding grip module and a dipping unit having a bonding elastic member according to a first embodiment of the present invention, and FIG. 8 is a perspective view showing a linear measurement module of a bonding unit for a probe pin bonding apparatus, Fig.

9 is a side view showing a state in which the height of the probe pin of the probe pin bonding apparatus is measured, and FIG. 10 is a side view of the bonding pin module having the probe pin bonding apparatus according to the first embodiment of the present invention. Fig. 2 is a front view showing a state in which the card is bonded to the card.

7 through 10, the bonding unit 400 includes a bonding grip module 410, a bonding vision module 420, a linear measurement module 430, a laser module 440, and a monitoring vision module 450, And the probe pins 10 aligned in the array unit 300 can be transferred and bonded to the probe card P. [

First, the bonding grip module 410 according to the first embodiment will be described.

The bonding grip module 410 has a bonding grip body 411, a bonding grip slope surface 412, a bonding grip absorption surface 413, and a bonding elasticity 414.

The bonding grip body 411 forms the outer shape of the bonding grip module 410.

The bonding grip slope 412 is an inclined face formed on one side of the bonding grip body 411. The inclined face may be formed such that the area of the bonding grip body 411 gradually decreases as the side of the bonding grip body 411 goes down. The angle formed by the inclined surfaces of the bonding grip slopes 412 may be provided in consideration of the laser beam irradiation angle of the laser module 440. Details related to this will be described later.

The bonding grip absorption surface 413 is formed on one side of the bottom surface of the bonding grip body 411, and the side surface of the probe fin 10 can be vacuum-adsorbed. More specifically, the bonding grip absorbing surface 413 refers to a surface having a step formed inward of the bonding grip body 411, wherein the depth of the step is equal to or smaller than the thickness of the probe pin 10 .

The bonding vacuum 414 includes a bonding vacuum tube 415, a bonding vacuum hole 416 and a bonding vacuum buffer 417 and is provided on the bonding grip body 411.

Specifically, the bonding vacuum tube 415 is inserted through the back surface of the bonding grip body 411 to the front side. In addition, the interior of the bonding vacuum tube 415 may be provided to be selectively in a vacuum state.

The bonding vacuum hole 416 is provided on the bonding grip absorption surface 413 and communicates with the bonding vacuum tube 415. The inner diameter of the bonding vacuum hole 416 is provided such that the probe pin 10 can be attracted to the bonding vacuum hole 416.

The bonding vacuum buffer 417 is provided on the front side of the bonding grip body 411 and covers one side of the bonding vacuum tube 415 and the bonding vacuum hole 416. At this time, the bonding vacuum buffer 417 can communicate the bonding vacuum tube 415 with the bonding vacuum hole 416.

The bonding grip module 410 thus prepared can transfer the probe pins 10 aligned by the array unit 300 by vacuum suction.

7, first, the bonding grip module 410 transfers the probe pins 10 vacuum-adsorbed from the array unit 300 to the dipping unit 500.

The dipping unit 500 has a dipping body 510 forming an outer shape and a storage hole 515 provided inside the upper surface of the dipping body 510 and containing a solder paste 520 therein. Here, the solder paste 520 is an adhesive material for allowing the probe pin 10 to be bonded to the probe card P.

The bonding grip module 410 inserts the probe pin 10 into the storage hole 515 so that the lower side of the first pin body 11 is received in the solder paste 520. Then, it is possible to confirm whether the solder paste 520 is well applied to the first pin body 11 by using the array vision module 320 by removing the probe pin 10. If the array vision module 320 recognizes that the solder paste 520 is applied to the first pin body 11 less than a predetermined area, the bonding grip module 410 again contacts the probe pins 10 The paste 520 can be accommodated. Here, the area where the solder paste 520 is applied to the probe pin 10 is not limited to the embodiment, and the area to be bonded to the probe card P may be in a state in which the solder paste 520 is applied have.

Further, although not shown, the dipping unit 500 has a separate dipping vision module (not shown), and the dipping vision module can confirm the state where the solder paste 520 is applied to the probe pin 10.

When the solder paste 520 is applied to the probe card P or the probe pin 10 before the probe pin 10 is bonded to the probe card P, The step of passing through the unit 500 may be omitted. Specifically, when the solder paste 520 is previously applied to the probe card P or the probe pin 10, the solder paste 520 is transferred by the bonding vision module 420 to the probe card P or the probe pin 10, (Not shown) may be additionally provided. When the solder paste 520 is applied in advance to the probe card P, the bonding grip module 410 may transfer the probe pin 10 to the dipping unit 500 to omit the process of burying the solder paste 520 .

8, the linear measurement module 430 includes a linear body 431 and a linear meter reading 432. In the probe card P, the linear measurement module 430 includes a linear body 431 and a linear meter reading 432. In the probe card P, The elevation can be measured.

More specifically, the linear body 431 forms the outer shape of the linear measurement module 430, and the linear meter reading 432 extends to the lower portion of the linear body 431 and contacts the probe card P. At this time, the linear meter reading 432 can measure the elevation of the probe card P at the contact position.

However, the linear measurement module 430 is not limited to the embodiment, and an apparatus for measuring the elevation of the probe card P with a measurement device using a light-like wavelength is also included in one embodiment.

The linear measurement module 430 may calculate an error range and a correction value with respect to a preset reference value. The linear measurement module 430 may be interlocked with the bonding grip module 410 to automatically adjust the position of the probe pin 10 when the probe pin 10 is bonded to the probe card P. [

Next, as shown in Fig. 9, the bonding grip module 410 transfers the probe pin 10 to a position to be bonded. At this time, the bonding grip module 410 keeps the probe pin 10 separated from the probe card P at a predetermined interval.

The reason why the bonding grip module 410 separates the probe pins 10 from the probe card P by a predetermined distance is that the bonding grip module 410 disassembles the probe pins 10 from the upper surface of the probe card P The probe pin 10 may be damaged. Specifically, the upper surface of the probe card P is slightly different in height at each position. Therefore, when the bonding pin module 10 is brought into contact with the probe card P, the probe pin 10 is compressed by the bonding grip module 410 and the probe card P, Lt; / RTI > The bonding grip module 410 moves the probe pin 10 away from the probe card P by a predetermined distance and inserts the solder paste 520 into the fine gap between the probe pin 10 and the probe card P. [ So that they can be bonded.

The bonding grip module 410 calculates the elevation correction value of the probe card P transmitted from the linear measurement module 430 and keeps the probe pin 10 away from the probe card P by a predetermined interval .

The bonding vision module 420 may be positioned above the bonding grip module 410 and recognize the position and shape of the probe pin 10 carried by the bonding grip module 410. In addition, the probe pin 10 may be interlocked with the bonding grip module 410 so as to be maintained at a predetermined distance from the probe card P. [ The bonding vision module 420 interlocked with the bonding grip module 410 can control the probe pin 10 to be positioned at a predetermined position on the probe card P. [

Meanwhile, the bonding unit 400 may further include a monitoring vision module 450. The monitoring vision module 450 recognizes the inspection object 14 protruding from the right end of the second pin body 12, The height of the meter reading 13 is measured.

More specifically, it is physically difficult for the monitoring vision module 450 to be located at the same height as the meter reading 13. Therefore, the monitoring vision module 450 measures the height of the meter reading 13 at a position relatively higher than the meter reading 13. However, if the height of the meter probe 13 is measured at a position relatively higher than the meter probe 13, the light reaching the meter probe 13 is reflected, and it is difficult to measure the height of the meter probe 13 accurately.

On the other hand, the inspection object 14 is provided in a position and shape that can be recognized by the monitoring and vision module 450 more quickly in consideration of the position of the monitoring and vision module 450. Therefore, the inspection object 14 can be recognized by the monitoring vision module 450 more quickly than the inspection object 13. That is, the monitoring vision module 450 can measure the height of the inspection object 14 to quickly ascertain the height of the inspection object 13.

As described above, the monitoring vision module 450 can check the height of the probe 13 before bonding the probe pin 10 to the probe card P, and perform correction. In addition, the monitoring / vision module 450 can detect a defective probe pin 10, which is bonded to the probe card P, to the probe card 10 in advance, by discarding the probe pin 10 in advance, It is possible to remove the probe pin 10 from the probe card P and not to bond the new probe pin 10 to the probe card P. [

Particularly, when the probe pin 10 is found to be defective after the completion of the bonding operation, it takes a lot of time to correct it. For example, assuming that ten probe pins 10 are bonded to one row, if the third probe pin 10 is defective, the third to tenth probe pins 10 are all removed, Work should be done. Therefore, when the height of the probe 13 is corrected or the probe pin 10 which can not be corrected is skipped, it is possible to minimize the need for the above-described re-bonding operation.

10, the bonding grip module 410 applies the laser module 440 to the solder paste 520 in a state in which the probe pin 10 is separated from the probe card P by a predetermined interval So that the solder paste 520 can be cured. That is, the solder paste 520 is hardened by the laser beam so that the probe pin 10 and the probe card P are bonded.

The laser module 440 may be located at one side of the bonding grip module 410 and the bonding grip slope 412 may be positioned such that the laser module 440 applies a laser beam to the solder paste 520 applied to the probe pin 10 It may be in a state in which an inclined surface is formed so as to facilitate irradiation. When the laser module 440 irradiates the laser beam onto the solder paste 520, the bonding grip slope surface 412 preferably has a preferable angle formed by the laser beam of the probe card P and the laser module 440 is 50 to 60 The inclined surface can be provided. However, the laser beam irradiation angle of the bonding grip slope 412 and the laser module 440 is not limited thereto. That is, the laser beam irradiation angle of the laser module 440 may be included in one embodiment as long as the probe pin 10 can be bonded to the probe card P when the laser beam is irradiated to the solder paste 520 .

The bonding unit 400 provided as described above can freely adjust the pitch between the probe pins 10 bonded to the probe card P. [

Specifically, the bonding grip module 410 is provided with a bonding grip absorption surface 413 having a step formed on one side thereof, and conveys one side of the probe pin 10 in a vacuum adsorbed state. Therefore, when the probe pin 10 is moved from one side to the other and bonded to the probe card P, the bonding grip module 410 is not likely to contact the probe pin 10 which is adjacent to one side. That is, the interval between the probe pins 10 bonded to the probe card P can be freely adjusted.

FIG. 11 is a perspective view showing a bonding grip module according to a second embodiment of the present invention bonding a probe pin to a probe card, FIG. 12 is a perspective view showing a bonding grip module according to a second embodiment of the present invention, Fig. 2 is a front view showing a state in which the card is bonded to the card.

Hereinafter, the bonding grip module 460 according to the second embodiment will be described with reference to FIGS. 11 and 12. FIG.

The bonding grip module 460 according to the second embodiment includes a bonding gripper 461, a bonding slope surface 462, a bonding tip 463, and a bonding adjustment portion 464.

The bonding grippers 461 may be formed as a pair, and the pair of bonding grippers 461 may be spaced apart from each other by a predetermined gap.

The bonding slope 462 may be formed such that both side surfaces of the bonding gripper 461 become narrower toward the bottom. Specifically, when the laser module 440 irradiates the laser beam to the solder paste 520, the bonding angle of the bonding slope surface 462 is preferably in the range of 50 to 60 The inclined plane can be formed.

The bonding tip 463 may be provided to form a step on the lower end of the bonding gripper 461. Specifically, the pair of bonding tips 463 extend downward from the lower ends of the pair of bonding grippers 461, and the thickness of the bonding tips 463 is greater than the thickness of the lower ends of the bonding grippers 461 It can be made thin. The inner surface of the pair of bonding tips 463 facing each other may extend in the plane of the inner surface of the pair of bonding grippers 461. In this case, (10) can be sufficiently fixed. The bonding tip 463 thus provided can prevent touching the probe pin 10 positioned adjacent to the probe pin 10 when the probe pin 10 fixed to the bonding tip 463 is seated on the probe card P. have. That is, the bonding tip 463 can reduce the pitch between the probe pins 10 attached to the probe card P.

The bonding adjusting part 464 may extend rearward of the pair of bonding grippers 461 and may be provided in a pair, and the distance between the bonding tips 463 may be adjusted. Specifically, a bonding gripper 461 is provided at one end of the bonding control unit 464, and the other end of the bonding control unit 464 is bent and extended upward. Although not shown in detail, the other end of the bonding adjusting unit 464 is provided with an adjustment unit (not shown) that can be interlocked with the bonding-vision module 420 to adjust the interval of the pair of bonding adjusting units 464 .

As described above, the bonding grip module 460 according to the second embodiment is provided in a shape that minimizes the pitch between the probe pins 10 attached to the probe card P, so that the pitches corresponding to the intervals of the fine circuit patterns of the semiconductor elements The probe card 10 having the probe card 10 bonded thereto can be produced

It will be understood by those skilled in the art that the foregoing description of the present invention is for illustrative purposes only and that those of ordinary skill in the art can readily understand that various changes and modifications may be made without departing from the spirit or essential characteristics of the present invention. will be. It is therefore to be understood that the above-described embodiments are illustrative in all aspects and not restrictive. For example, each component described as a single entity may be distributed and implemented, and components described as being distributed may also be implemented in a combined form.

The scope of the present invention is defined by the appended claims, and all changes or modifications derived from the meaning and scope of the claims and their equivalents should be construed as being included within the scope of the present invention.

10: probe pin 11: first pin body
12: second pin body 13: meter reading
14: inspection body 100: pick-up unit
110 pick-up grip module 111 pick-up grip body
112: pick-up grip punching 113: pick-up grip vacuum body
114: pick-up grip vacuum hole 120: first pick-up vision module
130: pickup turn module 131: pick-up turn body
132: pick-up rotation axis 133: pick-up turnout
134: pickup turn vacuum body 135: pickup turn vacuum bar
140: second pick-up vision module 200: base unit
210: Base body 215: Porous chuck
220: Base motor 300: Array unit
310: Array Grip Module 311: Array upper body
312: array lower body 313: array grip body
314: Array tightening body 315: Array connector
316: Array motor 320: Array Vision module
400: bonding unit 410: bonding grip module
411: Bonding grip body 412: Bonding grip slope
413: bonding grip absorption surface 414:
415: bonding vacuum tube 416: bonding vacuum hole
417: Bonding vacuum buffer 420: Bonding vision module
430: Linear measuring module 431: Linear body
432: linear meter reading 440: laser module
450: Monitoring Vision Module 460: Bonding Grip Module
461: Bonding gripper 462: Bonding slope
463: bonding tip 464:
500: dipping unit 510: dipping body
515: Storage hole 520: Solder paste
1000: probe pin bonding device P: probe card
W: Wafer

Claims (8)

A bonding unit for a probe pin bonding apparatus for bonding a probe pin to a probe card,
A bonding grip module for transferring a probe pin to an upper portion of the probe card;
A bonding vision module for recognizing a position and a shape of the probe pin; And
And a laser module positioned at one side of the bonding grip module,
The bonding grip module includes:
A bonding grip body forming an outer shape;
A bonding grip slope formed on one side of the bonding grip body, the bonding grip slope being formed such that an area of one side of the bonding grip body decreases toward the bottom; And
And a bonding grip absorbing surface provided below the other side of the bonding grip body and having a step,
Wherein the inclination angle of the bonding grip slope is determined so as to correspond to the laser beam irradiation angle of the laser module. delete The method according to claim 1,
Wherein the bonding grip module further comprises a bonding vacuum for vacuum-bonding and transferring the probe pin. delete delete The method of claim 3,
Wherein the bonding vacuum section comprises:
A bonding vacuum tube inserted into the front surface of the bonding grip body from a rear surface thereof;
A bonding vacuum hole provided on the bonding grip absorption surface and communicating with the bonding vacuum tube; And
And a bonding vacuum buffer provided on a front surface of the bonding grip body and communicating the bonding vacuum tube with one side of the bonding vacuum hole. The method according to claim 1,
And a solder paste is applied to the probe card at a position where the probe pin is to be bonded. The method according to claim 1,
The bonding grip module includes:
A pair of bonding grippers spaced apart from each other by predetermined intervals;
A bonding sloping surface provided on both sides of the bonding gripper so as to be narrowed downward;
A bonding tip provided at a lower step of the bonding gripper and thinner than a thickness of a lower end of the bonding gripper; And
And a bonding control unit extending rearward of the pair of bonding gripers and adjusting the interval of the bonding tips.

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