KR101825696B1 - Chip component and method of manufacturing the same - Google Patents

Abstract

The present invention provides a chip component including a laminate and a surface modifying member formed on at least one region of the laminate, wherein the surface modifying member exposes at least a part of the surface of the laminate, and a manufacturing method thereof.

Description

TECHNICAL FIELD The present invention relates to a chip component and a manufacturing method thereof,

BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a chip component and a manufacturing method thereof, and more particularly to a chip component capable of controlling the shape of an external electrode and a manufacturing method thereof.

2. Description of the Related Art In recent years, various frequency bands have been used in accordance with multifunctionality of portable electronic devices, for example, smart phones. That is, a plurality of functions using different frequency bands such as wireless LAN (wireless LAN), bluetooth, and GPS are adopted in one smartphone. In addition, due to the high integration of electronic devices, the internal circuit density in a limited space is increased, thereby causing noise interference between internal circuits inevitably.

A plurality of chip components are used to suppress the noise of various frequencies of the portable electronic device and to suppress the noise between the internal circuits. For example, chip beads, a common mode filter, etc., which remove noise in different frequency bands, are used.

In addition, an ESD protection device such as a varistor or a suppressor is required to protect electronic devices from high voltage such as ESD applied from an external device to an electronic device. In order to reduce the area occupied by these chip parts, at least two or more of them having different characteristics can be stacked to produce a chip part. For example, a noise filter and an ESD protection device are stacked in one chip to implement a chip component.

In such a chip component, an external electrode is formed on the outside of a laminate having a predetermined structure formed therein, and is connected to an internal circuit of the electronic device through an external electrode. At this time, the external electrode may be formed by a plating process. That is, the chip component can be soldered on the PCB substrate of the electronic device, and the external electrode is formed by the plating process to improve the soldering characteristic.

However, the surface of the laminate has a non-uniform resistance state, and when the plating process is performed in this state, the plating layer is unevenly grown. That is, the plating layer is blurred, and thus the external electrode is formed in an undesired shape.

It is known to coat glass or the like on the surface of the laminate in order to prevent such plating blurring. That is, a coating layer is formed on the surface of the laminate by using glass. However, since the surface coating layer does not form a perfect bond with the laminate by coating a glass component on the surface of the laminate after the laminate is formed, problems such as failure to connect the conductor inside the laminate with the external electrode due to the coating layer occur .

Korean Patent No. 10-0876206 Korean Patent Publication No. 2002-0045782

The present invention provides a chip component that can easily control the shape of an external electrode and a method of manufacturing the same.

The present invention provides a chip component whose surface is modified to easily control the shape of the external electrode and a method of manufacturing the same.

A chip component according to an aspect of the present invention includes: a laminate; And a surface modifying member formed on at least one region of the laminate, wherein the surface modifying member is formed to expose at least a part of the surface of the laminate.

The laminate has a plurality of sheets laminated, and a material layer different from the sheet is formed in the laminate.

The heterogeneous material layer includes a conductive pattern of a predetermined shape and a layer of an overvoltage protection material.

The surface modifying member is distributed in an area of 5% to 90% of the surface area of the laminate.

The surface modifying member includes at least one of a crystalline state and an oxide of an amorphous state.

The oxide is _{Bi 2 O 3, BO 2,} B 2 O 3, ZnO, Co 3 O 4, SiO 2, Al 2 O 3, MnO, H 2 BO 3, Ca (CO 3) 2, Ca (NO 3) ₂ , and CaCO ₃ .

At least a part of the oxide is embedded in the surface of the laminate.

The oxide is aggregated or connected in at least one region with particles having at least one size.

The average size of the oxide particles is 0.1 탆 to 10 탆.

And a concave portion formed on at least a part of the surface of the laminate.

And a second surface modification member formed inside the laminate.

And the second surface modification member is formed on at least one sheet constituting the laminate.

A chip component according to another aspect of the present invention includes: a laminate in which a plurality of sheets are laminated; A heterogeneous material layer formed in the laminate and formed of a material different from the sheet; And an external electrode formed on at least one side of the laminate, wherein at least one surface of the laminate has two or more components.

And a surface modification member formed on at least one surface of the laminate to expose at least a part of the surface of the laminate.

The surface modifying member comprises an oxide.

The oxide is formed to a thickness of 0.01% to 10% of the thickness of the laminate.

According to another aspect of the present invention, there is provided a method of manufacturing a chip component, including: preparing a plurality of chip components; And forming a surface modification member on at least one surface of the plurality of chip components, wherein the surface modification member is formed such that at least a part of the surface of the chip component is exposed.

The surface modification member is formed by charging the plurality of chip components and the oxide powder into a container and rotating the same.

And a plurality of mediums are further charged together with the plurality of chip parts and the oxide powder.

The plurality of mediums are made of a material different from the chip component and the oxide powder.

The plurality of mediums having a total volume greater than a total volume of the oxide powder and less than a total volume of the plurality of stacks.

A step of pickling the surface modification member before forming the surface modification member, and a step of polishing the surface of the chip component after the surface modification member is formed.

The chip component according to the embodiments of the present invention can form the surface modification member on the surface of the laminate, thereby controlling the shape of the external electrode. That is, by modifying the surface of the laminate by forming the surface modifying member on the surface of the laminate, it is possible to prevent spreading and spreading of the external electrode formed by plating, and thus the shape of the external electrode can be easily controlled .

Further, the present invention can prevent the moisture penetration into the laminate by forming the surface modifying member, thereby improving the life and reliability of the chip component.

1 is a perspective view of a chip component according to an embodiment of the present invention;
2 is a schematic top view of a chip component according to an embodiment of the present invention;
3 to 5 are exploded perspective views of a chip component according to embodiments of the present invention.
6 is a flowchart of a method of manufacturing a chip component according to an embodiment of the present invention.
7 to 9 are photographs of the surface of the layered product in accordance with the amount of the oxide deposited.
10 and 11 are schematic views showing the shape of the surface modification member according to the size of the medium and the case where no medium is used, and a photograph of the surface of the layered body.
12 and 13 are photographs of the surface of the laminate after wet polishing and dry polishing.
Figs. 14 and 15 are photographs of external electrodes of a chip component according to the present invention in which the surface modifying member is formed and a conventional example in which the surface modifying member is not formed. Fig.

Hereinafter, embodiments of the present invention will be described in detail with reference to the accompanying drawings. It should be understood, however, that the invention is not limited to the disclosed embodiments, but is capable of other various forms of implementation, and that these embodiments are provided so that this disclosure will be thorough and complete, It is provided to let you know completely. In the drawings, the thickness is enlarged to clearly illustrate the various layers and regions, and the same reference numerals denote the same elements in the drawings.

1 is a perspective view of a chip component according to an embodiment of the present invention, and Fig. 2 is a schematic top view of a chip component.

1 and 2, a chip component according to an embodiment of the present invention includes a laminate 1000 in which a plurality of sheets are stacked, a surface modification member 2000 formed on at least one surface of the laminate 1000, And an external electrode 3000 formed on at least one surface of the layered body 1000.

The laminate

The stacked body 1000 has a predetermined length and width respectively in one direction (for example, the X direction) and the other direction orthogonal to the Y direction (for example, Y direction) As shown in Fig. That is, when the forming direction of the external electrode 3000 is the X direction, that is, the direction is perpendicular to the horizontal direction, the Y direction is the width and the vertical direction is the Z direction, that is, the thickness. Here, the length in the X direction may be equal to or greater than the width in the Y direction and the height in the Z direction, and the width in the Y direction may be equal to or different from the height in the Z direction. If the width (Y direction) and the height (Z direction) are different, the width may be larger or smaller than the height. For example, the ratio of length, width and height may be from 1: 5: 1: 0.5 to 2. That is, the length may be one to five times greater than the width based on the width, and the height may be 0.5 to 2 times the width. However, the size in the X, Y, and Z directions can be variously modified according to the internal structure of the electronic device to which the chip component is connected, the shape of the chip component, the function of the chip component, and the like. The stacked body 1000 may be formed by stacking a plurality of substantially sheet-like sheets having a predetermined size. That is, the sheet may have a substantially rectangular plate shape having a predetermined length and width in the X direction and the Y direction and having a predetermined thickness in the Z direction. A plurality of such sheets can be laminated to form a laminate 1000 of a substantially hexahedron. The plurality of sheets constituting the laminated body 1000 may be formed of a dielectric material powder such as MLCC or a mixture of at least one of BaTiO ₃ , BaCO ₃ , TiO ₂ , Nd ₂ O ₃ , Bi ₂ O ₃ , ZnO and Al ₂ O ₃ , ≪ / RTI > Therefore, the sheet may have a predetermined dielectric constant, for example, 5 to 20,000, preferably 7 to 5,000, and more preferably 200 to 3000 depending on the material. The plurality of sheets may be made of a varistor material. For example, a sheet may be formed by adding additives such as Bi ₂ O ₃ , Pr ₆ O ₁₁ , CoO, and MnO to ZnO powder. The plurality of sheets may be a non-magnetic sheet or a magnetic sheet. That is, it may be a nonmagnetic sheet formed of the above-described material and having a predetermined permittivity, or may be a magnetic sheet further comprising a magnetic material. Of course, the plurality of sheets may be formed of at least one magnetic sheet or a non-magnetic sheet in accordance with the use of the chip component. The plurality of sheets may be formed of a mixture of a metal powder and a polymer. As described above, the plurality of sheets may be formed of various materials depending on the use of the chip parts and the like. Further, the plurality of sheets may all be formed to have the same thickness, and at least one of them may be formed thicker or thinner than the others.

On the other hand, a plurality of sheets in the laminate 1000 may have various structures. That is, various types of conductive patterns may be formed in the layered structure 1000, and an ESD protection material or the like may be formed. In other words, at least one or more different kinds of material layers having different components from the sheet constituting the laminate 1000 may be formed in the laminate 1000. For example, a plurality of sheets in the stacked body 1000 can be selectively formed with a hole in which a coil pattern of a spiral shape, a conductive material is embedded, and thus an inductor or a noise filter can be implemented. In addition, a structure for protecting a high voltage such as a varistor and an ESD protection part may be implemented in the stacked body 1000. A plurality of internal electrodes may be formed on the plurality of sheets in the laminated body 1000 so as to be alternately connected to the external electrodes 3000, thereby forming capacitors by the adjacent internal electrodes and the sheet therebetween . In the stacked body 1000, a substrate having a coil pattern formed on at least one side thereof, and a sheet made of a metal powder and a polymer are stacked on the substrate, so that a power inductor can be formed. The inductor, the noise filter, the capacitor, the power inductor, the varistor, and the ESD protection part may be implemented in the stacked body 1000, or at least two of them may be combined. The stack 1000 may further include a lower cover layer (not shown) and an upper cover layer (not shown) formed on the lowermost layer and the uppermost layer. Of course, the lowermost sheet may function as the lower cover layer and the uppermost sheet may serve as the upper cover layer. The lower and upper cover layers may be formed by stacking a plurality of magnetic material sheets, and may have the same thickness. Here, a nonmagnetic sheet, for example, a sheet of glassy material, may be further formed on the outermost portions of the lower and upper cover layers, i.e., the lower and upper surfaces of the magnetic sheet. In addition, the lower and upper cover layers may be thicker than the inner sheets.

The surface modifying member

The surface modifying member 2000 may be formed on at least one surface of the laminate 1000. The surface modifying member 2000 may be formed by distributing an oxide, for example, on the surface of the layered body 1000 before the external electrode 3000 is formed. Here, the oxide may be dispersed and distributed on the surface of the laminate 1000 in a crystalline state or an amorphous state. The surface modifying member 2000 may be distributed on the surface of the layered body 1000 before the plating process when the external electrode 3000 is formed by a plating process. That is, the surface modification member 2000 may be distributed before the external electrode 3000 is formed by the printing process, or may be distributed before the plating process after the printing process. Of course, if the printing process is not carried out, the plating process can be performed after distributing the surface modifying member 2000. At this time, at least a part of the surface modification member 2000 distributed on the surface can be melted.

On the other hand, the surface modification member 2000 can be evenly distributed on the surface of the laminated body 1000 at least partially at the same size as shown in Fig. 2 (a) Likewise, at least some of them may be irregularly distributed in different sizes. In addition, as shown in Fig. 2 (c), a concave portion may be formed on at least a part of the surface of the laminate 1000. [ That is, at least a part of the region where the surface modifying member 2000 is formed and the convex portion is formed and the surface modifying member 2000 is not formed may be formed as a concave portion. At this time, at least a part of the surface modification member 2000 may be formed deeper than the surface of the layered body 1000. That is, the surface modifying member 2000 may be formed such that a predetermined thickness is stuck to a predetermined depth of the layered body 1000 and the remaining thickness thereof is higher than the surface of the layered body 1000. At this time, the thickness of the layered body 1000 may be 1/20 to 1 of the average diameter of the oxide particles. That is, the oxide particles may be embedded all within the laminate 1000 as shown in FIG. 2 (d), and at least a part thereof may be embedded. Of course, the oxide particles may be formed only on the surface of the laminate 1000 as shown in Fig. 2 (d). Therefore, the oxide particles may be formed hemispherically on the surface of the laminate 1000, or may be formed in a spherical shape. In addition, the surface modification member 2000 may be partially distributed on the surface of the layered body 1000 as described above, and may be distributed in a film form in at least one region. That is, as shown in FIGS. 2 (a) to 2 (d), the oxide particles are distributed in the form of islands on the surface of the layered body 1000 to form the surface modification member 2000. That is, oxides in a crystalline state or an amorphous state may be spaced apart from each other on the surface of the layered body 1000 so that at least a part of the surface of the layered body 1000 may be exposed. In addition, as shown in FIG. 2 (e), at least two of the surface modification members 2000 are connected to form an oxide in at least one region, and at least a portion of the oxide may be formed in an island shape. That is, at least two oxide particles may aggregate or adjacent oxide particles may be connected to form a film. However, even when the oxide exists in a particle state, or when two or more particles are aggregated or connected, at least a part of the surface of the laminate 1000 is exposed to the outside by the surface modification member 2000.

At this time, the total area of the surface modifying member 2000 may be, for example, 5% to 90% of the total surface area of the laminate 1000. If the surface modification member 2000 is formed too much, the conductive pattern inside the layered structure 1000 and the external electrode (not shown) 3000) may be difficult to contact. That is, when the surface modifying member 2000 is formed to be less than 5% of the surface area of the laminate 1000, it is difficult to control the plating blurring phenomenon. When the surface modifying member 2000 is formed in an amount exceeding 90% The electrode 3000 may not be in contact. Therefore, it is preferable that the surface modifying member 2000 is formed to have an area that can control the plating spreading phenomenon and contact the conductive pattern inside the laminate 1000 and the external electrode 3000. For this purpose, the surface modifying member 2000 may be formed to 10% to 90% of the surface area of the laminate 1000, preferably 30% to 70%, more preferably 40% 50%. ≪ / RTI > At this time, the surface area of the laminated body 1000 may be a surface area of one surface or a surface area of six surfaces of the laminated body 1000 which forms a hexahedron. On the other hand, the surface modification member 2000 may be formed to a thickness of 10% or less of the thickness of the laminated body 1000. That is, the surface modification member 2000 may be formed to a thickness of 0.01% to 10% of the thickness of the laminate 1000. For example, the surface modifying member 2000 may be present in a size of 0.1 to 50 m, whereby the surface modifying member 2000 may be formed to a thickness of 0.1 to 50 m from the surface of the laminate 1000 have. That is, the surface modifying member 2000 may be formed to a thickness of 0.1 占 퐉 to 50 占 퐉 from the surface of the layered body 1000 except for a region that is stuck to the surface of the layered body 1000. Therefore, when the thickness of the surface modification member 2000 is included in the laminated body 1000, the surface modification member 2000 may have a thickness greater than 0.1 占 퐉 to 50 占 퐉. When the surface modifying member 2000 is formed to a thickness less than 0.01% of the thickness of the laminate 1000, it is difficult to control the plating blurring phenomenon. When the surface modifying member 2000 is formed to a thickness exceeding 10% of the thickness of the laminate 1000, The outer conductive layer 3000 may not be in contact with the conductive pattern inside the conductive layer 1000. That is, the surface modifying member 2000 may have various thicknesses depending on the material characteristics (conductivity, semiconductivity, insulation, magnetic material, etc.) of the laminated body 1000 and may be various thicknesses depending on the size, Lt; / RTI >

By forming the surface modifying member 2000 on the surface of the layered body 1000, at least two regions having different components may exist on the surface of the layered body 1000. That is, different components can be detected in the region where the surface modifying member 2000 is formed and the region where the surface modifying member 2000 is not formed. For example, a region where the surface modifying member 2000 is formed may have a component according to the surface modifying member 2000, that is, an oxide, and a region where the surface is not formed may include a component according to the laminate 1000, Can exist. By thus distributing the surface modification member 2000 to the surface of the layered product 1000 before the plating process, the surface of the layered product 1000 can be modified by imparting roughness to the surface thereof. Therefore, the plating process can be uniformly performed, and thus the shape of the external electrode 3000 can be controlled. That is, the surface of the layered product 1000 may have a resistance different from that of the other region in at least one region. If the plating process is performed while the resistance is uneven, the growth of the plating layer may be uneven. In order to solve this problem, it is possible to modify the surface of the laminated body 1000 by forming the surface modifying member 2000 by dispersing the oxide in a particle state or a molten state on the surface of the laminated body 1000, Can be controlled.

Here, the oxides in the particle state or in the molten state for making the surface resistance of the layered body 1000 uniform are, for example, Bi ₂ O ₃ , BO ₂ , B ₂ O ₃ , ZnO, Co ₃ O ₄ , SiO ₂ , Al ₂ O ₃ , MnO, H ₂ BO ₃ , Ca (CO ₃ ) ₂ , Ca (NO ₃ ) ₂ and CaCO ₃ . On the other hand, the surface modification member 2000 may also be formed on at least one sheet in the laminate 1000. That is, the conductive patterns of various shapes on the sheet can be formed by a plating process. The shape of the conductive pattern can be controlled by forming the surface modification member 2000.

External electrode

The external electrodes 3100, 3200, and 3000 are provided on two opposing sides of the laminate 1000, and are selectively connected to the conductive patterns formed in the laminate 1000. That is, the external electrodes 3000 may be formed on two opposing sides, for example, on the first and second sides, respectively, or may be formed by two or more as shown in FIG. In addition, at least one external electrode may be further formed on at least one of the third and fourth sides orthogonal to the first and second sides. The external electrode 3000 may be formed of at least one layer. The external electrode 3000 may be formed of a metal layer such as Ag, and at least one plating layer may be formed on the metal layer. For example, the external electrode 3000 may be formed by laminating a copper layer, a Ni plating layer, and a Sn or Sn / Ag plating layer. The external electrode 3000 may be formed by mixing a multi-component glass frit containing Bi ₂ O ₃ or SiO ₂ as a main component with, for example, 0.5% to 20% of a metal powder. At this time, the mixture of the glass frit and the metal powder may be prepared in the form of a paste and applied to the two sides of the laminate 1000. Since the glass frit is included in the external electrode 3000 in this way, the adhesion between the external electrode 3000 and the layered body 1000 can be improved, and the contact between the conductive pattern inside the layered body 1000 and the external electrode 3000 Can be improved. In addition, after the conductive paste containing glass is applied, at least one plating layer may be formed on the conductive paste to form the external electrode 3000. That is, the outer electrode 3000 may be formed by forming a metal layer including glass and at least one plating layer on the metal layer. For example, the external electrode 3000 may be formed by sequentially forming a Ni plated layer and a Sn plated layer through electrolytic or electroless plating after forming a layer including at least one of glass frit, Ag and Cu. At this time, the Sn plating layer may be formed to have a thickness equal to or thicker than the Ni plating layer. Of course, the external electrode 3000 may be formed of at least one plating layer only. That is, at least one plating layer may be formed using at least one plating process without applying the paste to form the external electrode 3000. [ On the other hand, the external electrode 3000 may be formed to a thickness of 2 탆 to 100 탆, a Ni plating layer is formed to a thickness of 1 탆 to 10 탆, and a Sn or Sn / Ag plating layer is formed to a thickness of 2 탆 to 10 탆 .

The laminate  Internal structure example

On the other hand, the structure according to one embodiment in the laminate 1000 is shown in Figs. Figs. 3 to 5 are exploded perspective views of a laminated body 1000 according to an embodiment of the present invention, and are exploded perspective views of a noise filter including a spiral coil pattern. As described above, various kinds of chip components such as a capacitor, a varistor, an inductor, and a power inductor can be implemented in the laminated body 1000. The following embodiments will explain an example of a common mode noise filter.

Referring to FIG. 3, the laminate 1000 includes a plurality of sheets 110 to 150 stacked, and at least one coil pattern 310 to 340 is formed on at least one selected sheet 120 to 150 . When a plurality of coil patterns 310 to 340 are formed, at least two coil patterns 310 to 340 may be vertically connected through the holes 351, 352, 361, and 362 filled with the conductive material. For example, the first coil pattern 310 may be connected to the third coil pattern 330 through the holes 351 and 352 filled with the conductive material, and the second coil pattern 320 may be connected to the first coil pattern 330, And may be connected to the fourth coil pattern 340 through the holes 361 and 362. The lead-out electrodes 410 to 440 drawn out from the coil patterns 310 to 340 may be formed and connected to the external electrodes. On the other hand, an upper cover layer 1100 and a lower cover layer 1200 may be formed on the upper and lower sheet 150 of the uppermost sheet 110, respectively. The upper and lower cover layers 1100 and 1200 may be formed thicker than the respective thicknesses of the sheets 110 to 150.

As shown in FIG. 4, an ESD protection portion may further be formed in the stacked body 1000. That is, the common mode noise filter and the ESD protection portion can be stacked to form a composite device. The stacked body 1000 includes a plurality of sheets 110 to 180, coil patterns 310 to 340 formed on at least one of the selected sheets 120 to 150, coil patterns 310 to 340, Out electrodes 410 to 440 which are drawn out from the coil patterns 310 to 340 and are connected to the external electrodes and a plurality of outgoing electrodes 410 to 440 formed on the selected sheet 170. The holes 351, 352, 361, The ESD protection layers 531, 532, 533, and 534 embedded in the holes formed at the ends of the first discharge electrodes 511 to 514, and the first discharge electrodes 511, 512, 513, And a second discharge electrode 520 formed on the selected sheet 180 and connected to the ESD protection layers 531 to 534. At this time, the first discharge electrodes 511 to 514 are connected to the external electrodes together with the plurality of extraction electrodes 410 to 440, and the second discharge electrode 520 is connected to another external electrode. On the other hand, a sheet 160 may be provided therebetween to separate the common mode noise filter portion and the ESD protection portion.

As shown in FIG. 5, at least one capacitor electrode 610 may be further formed in the stacked body 1000. That is, the capacitor electrode 610 is provided between the two coil patterns 320 and 330, and may be formed on the sheet 190. The capacitor electrode 610 may include a lead-out electrode (not shown) extending outwardly from the capacitor electrode 610 610 may be formed. In addition, holes (353, 363) filled with a conductive material may be formed in the sheet 190 to connect the upper and lower coil patterns. A capacitor having a predetermined capacitance may be formed between the capacitor electrode 610 and the upper and lower coil patterns 320 and 330 with the sheets 130 and 190 therebetween.

As described above, the chip component according to the embodiment of the present invention can control the shape of the external electrode 3000 by forming the surface modification member 2000 on the surface of the layered body 1000. That is, by modifying the surface of the layered body 1000 by forming the surface modification member 2000 on the surface of the layered body 1000, it is possible to prevent the spreading and spreading of the external electrode 3000 formed by plating, The shape of the external electrode 3000 can be easily controlled. Further, the present invention can prevent moisture penetration into the laminated body 1000 by forming the surface modifying member 2000 having a component different from that of the laminated body 1000 on the surface of the laminated body 1000, Life and reliability can be improved. Humidity resistance can be confirmed by maintaining the chip component for a predetermined time in a high temperature and high humidity environment and then measuring the leakage current.

Manufacturing method of chip parts

A method of manufacturing a chip component according to an embodiment of the present invention will be described with reference to FIG. 6 is a flowchart illustrating a method of manufacturing a chip component according to an embodiment of the present invention.

First, a plurality of substantially rectangular shaped sheets having a predetermined thickness are provided (S110). At this time, the plurality of sheets may be larger than the size of the chip component. That is, a plurality of conductive patterns or the like may be formed on a plurality of sheets and then cut into chip component sizes. Further, the plurality of sheets may be a non-magnetic sheet or a magnetic sheet having a predetermined permittivity. That is, at least one of the plurality of sheets may be a non-magnetic sheet or a magnetic sheet. Of course, the plurality of sheets may be formed of a varistor material having a predetermined breakdown voltage.

Then, a conductive pattern or the like having a predetermined shape is formed on at least one sheet (S120). At this time, a plurality of insulating patterns can be formed on the conductive pattern. The conductive pattern may be formed in a square having a predetermined area, or may be formed in a spiral shape outward from the center area. The conductive pattern may be formed by a screen printing method using a conductive material such as Ag, Pt, Ni, Sn, or Cu, or may be formed by a plating method. At this time, the surface modification member 2000 may be formed on at least one surface of the sheet before the conductive pattern is formed by a plating method. That is, the surface modification member 2000 can be formed on the surface of the sheet in order to control the plating shape, thereby modifying the surface of the sheet. In addition, an ESD protection member for blocking high voltage such as ESD can be formed on at least one sheet. The ESD protection member may be formed between two conductive patterns spaced vertically or horizontally. For example, the ESD protection member may be formed to embed voids formed so as to penetrate the sheet, or may be formed so as to partially overlap with the two conductive patterns spaced on the sheet. Further, the ESD protection member may be a gap provided between the two conductive patterns. That is, it is also possible to use a gap between the two conductive patterns spaced vertically or horizontally without forming a separate material, and to maintain the gap therebetween as an ESD protection member.

Subsequently, a plurality of sheets having the conductive pattern and / or the ESD protection member formed thereon are laminated, cut, and fired to form a laminated body 1000 (S130). Thus, an inductor or a common mode noise filter in which a plurality of spiral-shaped coils are formed, or a capacitor in which two conductive patterns form capacitances can be formed with a sheet interposed therebetween. An ESD protection portion may also be formed. By forming the stacked body 1000 by stacking a plurality of sheets in this manner, chip parts for various purposes can be formed depending on the shape of the conductive pattern, the presence of the ESD protection portion, the material of the sheet, and the like.

Subsequently, the surface modification member 2000 is formed on the surface of the layered product 1000 (S140). The surface modifying member 2000 may be formed by distributing oxides on the surface of the layered body 1000. For example, Bi ₂ O ₃ , BO ₂ , B ₂ O ₃ , ZnO, Co ₃ O ₄ , SiO ₂ , Al ₂ O ₃ , MnO, H ₂ BO ₃ , Ca (CO ₃ ) ₂ , Ca (NO ₃ ) ₂ and CaCO ₃ . In order to form the surface modification member 2000 on the surface of the layered product 1000, the oxide and the layered product 1000 are introduced into a cylinder having a predetermined space therein, and then the cylinder is moved in the left and right direction and / So that the oxide can be dispersed on the surface of the layered product 1000. That is, it can be formed by milling. At this time, the cylinder can be made substantially cylindrical. Further, the surface modification member 2000 can be formed by carrying out such a process at least once. The distribution amount, size, and thickness of the surface of the layered body 1000 of the surface modification member 2000 can be changed depending on the input amount of the oxide, the amount of the layered body 1000, the processing time, and the like. That is, the amount of surface modification, that is, the surface area, size, and thickness of the surface modification member 2000 can be increased as the amount of the oxide and the process time are increased. As the amount of the deposition material 1000 is increased, , I.e. the surface area, size and thickness can be reduced. For example, when the amount of the laminated body 1000 is 20,000 to 600,000 and 2 to 15 g of oxide is put into it, it is possible to distribute oxides having a thickness of 0 mu m to 10 mu m on the surface of the laminated body 1000, 1000). ≪ / RTI > At this time, the rotation speed may be, for example, 50 to 100 rpm, and the volume of the cylinder may be 500 to 1000 cc. The process time can also be from 30 minutes to 2 hours. As an example, when 60,000 stacked bodies 1000 having a surface area of 9.92 mm 2 are put into a predetermined cylinder together with 4 g of oxide and rotated for a predetermined time, the oxide is formed to a thickness of 0 탆 to 4 탆, Mu] g / mm < 2 > so that the oxide is distributed in an amount of about 67 mu g per chip. A photograph of the surface at this time is shown in Fig. Further, when 60,000 stacked bodies 1000 having a surface area of 9.92 mm < 2 > are put in a predetermined container together with 8 g of the oxide and rotated for a predetermined time, the oxide is formed to a thickness of 1 m to 6 m, And the oxide is distributed in an amount of about 133 칩 per chip. A photograph of the surface at this time is shown in Fig. Then, 60000 stacked bodies 1000 having a surface area of 9.92 mm < 2 > were charged into a predetermined container together with 11 g of the oxide and then rotated for a predetermined time. The oxide was formed to a thickness of 2 m to 10 m, And the oxide is distributed in an amount of about 183 칩 per chip. A photograph of the surface at this time is shown in Fig.

On the other hand, the surface of the layered product 1000 may be subjected to a pickling process before the surface modification member 2000 is formed. The pickling process can perform uniformly pores on the surface of the layered product 1000 by weakly treating the layered product 1000 as a preliminary step for modifying the surface of the layered product 1000. By forming pores on the surface of the laminated body 1000, the surface modification member 2000 can further facilitate the formation of the laminated body 1000. Further, when forming the surface modifying member 2000, it is possible to further input a plurality of mediums together with the oxide. By injecting the medium, the oxides can be uniformly distributed. That is, when the medium is not charged, the amount of aggregation of the oxides may be increased if the oxides are unevenly distributed. However, when the medium is added, the oxides may be uniformly distributed and the amount of aggregation may be reduced. In this case, the medium may be made of a material different from the layered body 1000 and the surface modification member 2000, for example, stainless steel, ceramics, or the like may be used. In addition, various forms such as a spherical shape and a hexahedral shape can be used as the medium. Here, the plurality of mediums may utilize a volume that is greater than the total volume of the oxide powder and less than the total volume of the laminate 1000, for example the total volume of the medium may be less than 10% of the total volume of the laminate 1000, To 90%. The size and spacing of the oxide dispersed in the laminate 1000 can be controlled according to the size of the medium. The larger the size of the medium, the larger the size and spacing of the oxide, and the smaller the size of the medium, Lt; / RTI > That is, when the volume of the medium is less than 10% of the volume of the laminate 1000, the same distribution condition as when the medium is not used is shown. When the volume of the medium exceeds 90% of the volume of the laminate 1000, The amount may not increase and may not be applied to the surface of the laminate 1000. 10 (a) and 11 (a) are schematic cross-sectional views and plan views for explaining the distribution shape of the surface modifying member when the medium is not used. As shown in the figure, the surface modifying member 2000 is a laminate Irregularly distributed on the surface of the sieve body 1000, and the amount of agglomerated or connected increases to form a film shape in at least one region. 10 (b) and 11 (b), when the medium having a small size is used, the surface modification member 2000 is formed on the surface of the laminated body 1000 as shown in Figs. 10 (a) Are distributed more regularly than in the case shown in (a) of Fig. 11, and the amount of aggregation or connection decreases. 10 (c) and 11 (c), when the medium having a large size is used, the surface modification member 2000 is regularly distributed on the surface of the layered product 1000, is formed on the surface of the laminated body 1000 in a larger size than in the case of using the small medium shown in Figs. 11 (b) and 11 (b). By using the medium, the oxide adhered to the surface of the layered body 1000 is increased so that the oxide can be deposited to a predetermined depth from the surface of the layered body 1000.

 Subsequently, the surface of the layered product 1000 on which the surface modifying member 2000 is formed may be polished (S150). A part of the surface modification member 2000 can be polished according to the surface polishing so that the surface modification member 2000 can be formed in an island shape. The polishing process can be carried out by wet polishing or dry polishing. In the case of wet polishing, a plurality of stacked bodies 1000 having a surface modifying member 2000 formed therein, a pure water and an abrasive agent may be charged in a cylinder provided with a predetermined internal space, and then polished at a rotating speed of 50 to 100 rpm. In the case of dry polishing, a plurality of stacked bodies 1000 in which a surface modifying member 2000 is formed may be charged into a cylinder and the abradant may be polished at a rotating speed of 100 to 200 rpm. That is, dry polishing can be carried out at high speed without injecting pure water. At this time, alumina can be used as the abrasive. On the other hand, the polishing time may vary depending on the amount of the stacked body 1000, the amount of pure water and the amount of the abrasive, the roughness of the abrasive, the polishing rate, etc. The low speed and wet polishing are performed for 30 minutes or more, . For example, wet polishing can be performed for 30 minutes or longer and 24 hours or less, and dry polishing for 1 hour or longer and 24 hours or less. Figs. 12 and 13 are photographs of the surface of the laminate after the wet polishing and dry polishing, in which (a), (b) and (d) After the time polishing, (e) shows photographs after polishing for 24 hours, respectively. As shown in the figure, when the polishing process is performed, the size and distribution of the surface modification member 2000 of the laminated body 1000 can be adjusted.

Figs. 14 and 15 are photographs of the external electrode shape of the chip component according to the present invention in which the surface modifying member is formed, and the external electrode shape of the chip component according to the conventional example in which the surface modification member is not formed. As shown in FIG. 14 (b), the present invention in which the surface modifying member is formed as shown in FIG. 14 (a) is superior to the conventional method in which the surface modifying member is not formed, The plating can be prevented from being blurred, and the shape of the external electrode can be controlled. In addition, as shown in FIG. 15A, the present invention in which the surface modifying member is formed has a higher surface roughness than the conventional surface modifying member, as shown in FIG. 15B, And spreading phenomenon can be prevented when plating.

In order to confirm moisture resistance, a plurality of chip components having the surface modifying member according to the present invention and a plurality of chip components having no conventional surface modifying member formed thereon are placed in an environment maintaining a temperature of 85 캜 and a humidity of 85% For 12 hours, and a voltage of 5 V was applied to confirm the leakage current. At this time, the leakage current (cross IL) between the data line and the ground line and the leakage current between the data lines (IL) were measured. When the current exceeding 10 nA flowed, it was judged to be defective. The moisture resistance results according to the present invention and the conventional example are shown in [Table 1].

Exam conditions
Test result Invention Conventional example cross IL 85 ℃ / 85% / 12 hours / with 5V 0% 3% IL 85 ℃ / 85% / 12 hours / with 5V 0% 18%

As described above, in the case of the chip component formed with the surface modification member according to the present invention, the leakage current is not measured and no defect is generated at all. However, the conventional chip component without the surface modification member has a defect rate of 3% to 18% Lt; / RTI > That is, in the conventional case, about 3% of the leakage current occurs between the data line and the ground line, and it is determined that the data line is defective. Also, the leakage current of the chip component in which the failure occurred was measured from several tens nA to a short. Accordingly, the present invention can improve the moisture resistance of the chip component by forming the surface modifying member, thereby improving the life and reliability of the chip component.

Although the technical idea of the present invention has been specifically described according to the above embodiments, it should be noted that the above embodiments are for explanation purposes only and not for the purpose of limitation. It will be apparent to those skilled in the art that various modifications and variations can be made in the present invention without departing from the spirit and scope of the invention.

1000: laminate 2000: surface modification member
3000: external electrode

Claims (22)

A laminate;
A surface modification member formed in at least one region of the laminate; And
And an external electrode formed on a surface of the laminate,
Wherein the surface modification member is dispersed on at least a part of the surface of the layered body so as to expose at least a part of the surface of the layered body,
Wherein the surface modification member is formed on a surface of the laminate including the laminate and the external electrode.
The chip component according to claim 1, wherein the laminate has a plurality of sheets laminated, and a layer of a material different from the sheet is formed in the laminate.
3. The chip component of claim 2, wherein the different material layer comprises a conductive pattern and a layer of overvoltage protection material.
The chip component according to claim 1, wherein the surface modifying member is distributed in an area of 5% to 90% of the surface area of the laminate.
5. The chip component according to claim 4, wherein the surface modification member comprises at least one of a crystalline state and an oxide of an amorphous state.
6. The method of claim 5, wherein the oxide is selected from the group consisting of Bi ₂ O ₃ , BO ₂ , B ₂ O ₃ , ZnO, Co ₃ O ₄ , SiO ₂ , Al ₂ O ₃ , MnO, H ₂ BO ₃ , Ca (CO ₃ ) ₂ , Ca (NO ₃ ) ₂ , and CaCO ₃ .
7. The chip component according to claim 6, wherein at least a part of the oxide is embedded inside the surface of the laminate.
7. The chip component according to claim 6, wherein the oxide is aggregated or connected in at least one region.
7. The chip component according to claim 6, wherein the oxide has an average size of particles of 0.1 mu m to 10 mu m.
The chip component according to claim 1, further comprising a recess formed in at least a part of the surface of the laminate.
The chip component according to any one of claims 1 to 10, further comprising a second surface modification member formed inside the laminate.
12. The chip component according to claim 11, wherein the second surface modification member is formed on at least one sheet constituting the laminate.
A laminated body in which a plurality of sheets are laminated;
A heterogeneous material layer formed in the laminate and formed of a material different from the sheet;
An external electrode formed on at least one surface of the laminate; And
And a surface modification member formed on at least one side of the laminate so as to expose at least a part of the surface of the laminate,
Wherein the surface modification member is formed on a surface of the laminate including the laminate and the external electrode.
delete 14. The chip component according to claim 13, wherein the surface modification member comprises an oxide.
16. The chip component according to claim 15, wherein the oxide is formed to a thickness of 0.01% to 10% of the thickness of the laminate.
A process of preparing a plurality of chip parts;
Forming a surface modification member on at least one surface of the plurality of chip components; And
And forming an external electrode on at least one surface of the chip component on which the surface modification member is formed,
Wherein the surface modification member is formed on a surface of the chip component including the chip component and the external electrode,
And the surface modification member is formed so that at least a part of the surface of the chip component is exposed.
The method of manufacturing a chip component according to claim 17, wherein the surface modification member is formed by rotating the plurality of chip components and the oxide powder in a container. 19. The method according to claim 18, further comprising introducing a plurality of mediums together with the plurality of chip components and the oxide powder.
The method of manufacturing a chip component according to claim 19, wherein the plurality of mediums is made of a material different from that of the chip component and the oxide powder.
21. The method of claim 20, wherein the plurality of mediums have a total volume greater than a total volume of the oxide powder and less than a total volume of the plurality of stacks.
The method according to any one of claims 17 to 21, further comprising at least one of a pickling process before forming the surface modifying member and a surface polishing process of the chip component after forming the surface modifying member A method of manufacturing a component.

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