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KR101736853B1 - method and Apparatus for Processing Substrate - Google Patents

method and Apparatus for Processing Substrate Download PDF

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Publication number
KR101736853B1
KR101736853B1 KR1020150083373A KR20150083373A KR101736853B1 KR 101736853 B1 KR101736853 B1 KR 101736853B1 KR 1020150083373 A KR1020150083373 A KR 1020150083373A KR 20150083373 A KR20150083373 A KR 20150083373A KR 101736853 B1 KR101736853 B1 KR 101736853B1
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KR
South Korea
Prior art keywords
spin head
cup
substrate
gas
supplying
Prior art date
Application number
KR1020150083373A
Other languages
Korean (ko)
Other versions
KR20160147164A (en
Inventor
박정영
이슬
김대민
Original Assignee
세메스 주식회사
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Priority to KR1020150083373A priority Critical patent/KR101736853B1/en
Publication of KR20160147164A publication Critical patent/KR20160147164A/en
Application granted granted Critical
Publication of KR101736853B1 publication Critical patent/KR101736853B1/en

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    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
    • H01L21/02041—Cleaning
    • H01L21/02043—Cleaning before device manufacture, i.e. Begin-Of-Line process
    • H01L21/02052—Wet cleaning only
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/67005—Apparatus not specifically provided for elsewhere
    • H01L21/67011—Apparatus for manufacture or treatment
    • H01L21/67017—Apparatus for fluid treatment
    • H01L21/67028—Apparatus for fluid treatment for cleaning followed by drying, rinsing, stripping, blasting or the like
    • H01L21/6704—Apparatus for fluid treatment for cleaning followed by drying, rinsing, stripping, blasting or the like for wet cleaning or washing
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/683—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping
    • H01L21/6835—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using temporarily an auxiliary support

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  • Engineering & Computer Science (AREA)
  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Manufacturing & Machinery (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Cleaning Or Drying Semiconductors (AREA)

Abstract

The present invention relates to a substrate processing method. A substrate processing method according to an embodiment of the present invention includes: a substrate processing step of processing a substrate by supplying a processing solution to the substrate while rotating a substrate placed on a spin head disposed in a cup having an open top; And a cup cleaning step of cleaning the cup by supplying a cleaning liquid to an upper surface of the spin head while rotating the spin head in a state where the substrate is removed from the spin head, wherein the rotation speed of the spin head in the cup cleaning step is And is faster than the rotation speed of the spin head in the substrate processing step.

Description

BACKGROUND OF THE INVENTION 1. Field of the Invention [0001] The present invention relates to a substrate processing apparatus,

The present invention relates to a substrate processing apparatus and method, and more particularly, to an apparatus and method for processing a substrate and cleaning a cup.

Contaminants such as particles, organic contaminants, and metallic contaminants on the surface of the substrate greatly affect the characteristics of semiconductor devices and the yield of production. Therefore, a cleaning process for removing various contaminants adhering to the surface of the substrate is very important in the semiconductor manufacturing process, and a process for cleaning the substrate is performed before and after each unit process for manufacturing a semiconductor. In general, cleaning of a substrate is performed by a chemical treatment process for removing metal foreign substances, organic substances, or particles remaining on the substrate by using a chemical, a rinsing process for removing chemicals remaining on the substrate by using pure water, And the like.

The cleaning process is performed by supplying the processing fluid to the substrate in the chamber. The chamber is provided with a cup having an open top, and the substrate is disposed within the cup. The cup is contaminated by the processing fluid as the cleaning process is performed. Which subsequently contaminate the substrate during the substrate processing process.

The present invention is to provide a substrate processing apparatus and method capable of processing a substrate and cleaning the contaminated cup.

The present invention is directed to a substrate processing apparatus and method capable of selectively cleaning an area of a cup.

The objects of the present invention are not limited thereto, and other objects not mentioned can be clearly understood by those skilled in the art from the following description.

The present invention provides a substrate processing method.

According to an embodiment of the present invention, there is provided a substrate processing apparatus comprising: a substrate processing step of processing a substrate by supplying a processing solution to the substrate while rotating a substrate placed on a spin head disposed in an upper opened cup; And a cup cleaning step of cleaning the cup by supplying a cleaning liquid to an upper surface of the spin head while rotating the spin head in a state where the substrate is removed from the spin head, wherein the rotation speed of the spin head in the cup cleaning step is And is faster than the rotation speed of the spin head in the substrate processing step.

According to an embodiment of the present invention, the cup cleaning step further includes a cup drying step of supplying the cleaning liquid to the upper surface of the spin head and then supplying gas to the upper surface of the spin head to dry the cup.

According to one embodiment, the gas is supplied to the center of the spin head.

According to one embodiment, in the cup cleaning step, the spin head rotates only in the first direction.

According to one embodiment, in the cup cleaning step, the relative height of the upper end of the cup to the upper surface of the spin head is adjusted while moving the cup up and down.

According to an embodiment, in the cup cleaning step, the height of the upper surface of the spin head and the height of the upper end of the cup are set to be the same.

According to an embodiment, in the cup cleaning step, the height of the top of the cup is set to be higher than the height of the top surface of the spin head.

The present invention provides a substrate processing apparatus.

According to an embodiment of the present invention, there is provided a substrate processing apparatus comprising: a cup providing a processing space for processing a substrate; a support unit supporting the substrate in the processing space and having a spin head rotating; A spray unit for supplying a treatment liquid to the upper surface of the substrate or supplying a cleaning liquid to the upper surface of the spin head; And a controller for controlling rotation of the spin head, wherein the controller controls the rotation speed of the spin head when the cleaning liquid is sprayed onto the upper surface of the spin head, So as to be faster than the rotation speed of the spin head.

According to an embodiment of the present invention, the apparatus further includes a gas injection member for injecting a gas onto the upper surface of the spin head, wherein the controller controls the rotation speed of the spin head when the gas is sprayed onto the upper surface of the spin head, So as to be faster than the rotation speed of the spin head when the process liquid is supplied to the upper surface of the spin head.

According to one embodiment, the gas injection member supplies the gas to the center of the spin head.

And controls the spin head such that the spin head rotates only in the first direction when supplying the cleaning liquid or the gas to the upper surface of the spin head.

According to one embodiment, the cup includes: a plurality of collection tubes vertically stacked; And an elevating unit for moving one or more of the plurality of recovery cylinders in the vertical direction.

According to an embodiment of the present invention, the controller controls the elevating unit, and when the cleaning liquid or the gas is supplied to the upper surface of the spin head, the height of the upper end of the collecting cylinder to be cleaned in the plurality of collecting tanks, And controls the elevation unit to be equal to the upper surface.

According to one embodiment, the controller controls the elevating unit,

The control unit controls the elevating unit such that the height of the upper end of the collecting cylinder to be cleaned in the plurality of collecting cylinders is higher than the height of the upper surface of the spin head when supplying the cleaning liquid or the gas to the upper surface of the spin head.

According to one embodiment of the present invention, contaminated cups can be cleaned after the substrate processing step.

Further, according to the embodiment of the present invention, the area of the cup can be selectively cleaned.

1 is a plan view schematically showing a substrate processing apparatus provided with a substrate processing apparatus according to an embodiment of the present invention.
2 is a cross-sectional view showing one embodiment of the substrate processing apparatus of FIG.
3 is a flowchart showing a substrate processing method according to an embodiment of the present invention.
4 is a view showing a substrate processing step according to an embodiment of the present invention.
5 is a view showing a cup cleaning step according to an embodiment of the present invention.
6 and 7 are views showing a cup drying step for generating airflow around the spin head.
8 to 10 are views illustrating a process of lifting and raising a cup in a vertical direction in a cup cleaning step according to a modification of the present invention.

Hereinafter, embodiments of the present invention will be described in detail with reference to the accompanying drawings. The embodiments of the present invention can be modified in various forms, and the scope of the present invention should not be construed as being limited to the following embodiments. This embodiment is provided to more fully describe the present invention to those skilled in the art. The shape of the elements in the figures is therefore exaggerated to emphasize a clearer description.

Hereinafter, an example of the present invention will be described in detail with reference to FIG. 1 to FIG.

1 is a plan view schematically showing a substrate processing apparatus 1 of the present invention.

Referring to FIG. 1, the substrate processing apparatus 1 includes an index module 100 and a process processing module 200. The index module 100 includes a load port 120 and a transfer frame 140. The load port 120, the transfer frame 140, and the process module 200 are sequentially arranged in a line. Hereinafter, the direction in which the load port 120, the transfer frame 140, and the processing module 200 are arranged is referred to as a first direction 12. A direction perpendicular to the first direction 12 is referred to as a second direction 14 and a direction perpendicular to the plane including the first direction 12 and the second direction 14 is referred to as a third direction (16).

The carrier 130 in which the substrate W is housed is placed in the load port 120. A plurality of load ports 120 are provided, and they are arranged in a line along the second direction 14. In FIG. 1, four load ports 120 are shown. However, the number of load ports 120 may increase or decrease depending on conditions such as process efficiency and footprint of the process processing module 200. A carrier (130) is provided with a slot (not shown) provided to support the edge of the substrate (W). A plurality of slots are provided in the third direction 16. The substrates W are positioned in the carrier 130 so as to be stacked in a state of being spaced from each other along the third direction 16. As the carrier 130, a front opening unified pod (FOUP) may be used.

The processing module 200 includes a buffer unit 220, a transfer chamber 240, and a process chamber 260. The transfer chamber 240 is disposed such that its longitudinal direction is parallel to the first direction 12. Process chambers 260 are disposed on one side and the other side of the transfer chamber 240 along the second direction 14, respectively. The process chambers 260 located at one side of the transfer chamber 240 and the process chambers 260 located at the other side of the transfer chamber 240 are provided to be symmetrical with respect to the transfer chamber 240. Some of the process chambers 260 are disposed along the longitudinal direction of the transfer chamber 240. In addition, some of the process chambers 260 are stacked together. That is, at one side of the transfer chamber 240, the process chambers 260 may be arranged in an array of A X B (where A and B are each at least one natural number). Where A is the number of process chambers 260 provided in a row along the first direction 12 and B is the number of process chambers 260 provided in a row along the third direction 16. When four or six process chambers 260 are provided on one side of the transfer chamber 240, the process chambers 260 may be arranged in an array of 2 X 2 or 3 X 2. The number of process chambers 260 may increase or decrease. Unlike the above, the process chamber 260 may be provided only on one side of the transfer chamber 240. Also, unlike the above, the process chamber 260 may be provided as a single layer on one side and on both sides of the transfer chamber 240.

The buffer unit 220 is disposed between the transfer frame 140 and the transfer chamber 240. The buffer unit 220 provides a space for the substrate W to stay before the transfer of the substrate W between the transfer chamber 240 and the transfer frame 140. [ The buffer unit 220 is provided with a slot (not shown) in which the substrate W is placed, and a plurality of slots (not shown) are provided to be spaced apart from each other in the third direction 16. The surface of the buffer unit 220 opposed to the transfer frame 140 and the surface of the transfer chamber 240 facing each other are opened.

The transfer frame 140 transfers the substrate W between the buffer unit 220 and the carrier 130 that is seated on the load port 120. The transfer frame 140 is provided with an index rail 142 and an index robot 144. The index rail 142 is provided so that its longitudinal direction is parallel to the second direction 14. The index robot 144 is installed on the index rail 142 and is linearly moved along the index rail 142 in the second direction 14. The index robot 144 has a base 144a, a body 144b, and an index arm 144c. The base 144a is installed so as to be movable along the index rail 142. The body 144b is coupled to the base 144a. The body 144b is provided to be movable along the third direction 16 on the base 144a. Also, the body 144b is provided to be rotatable on the base 144a. The index arm 144c is coupled to the body 144b and is provided to be movable forward and backward relative to the body 144b. A plurality of index arms 144c are provided and each is provided to be individually driven. The index arms 144c are stacked in a state of being spaced from each other along the third direction 16. Some index arms 144c are used to transfer the substrate W from the processing module 200 to the carrier 130 while others are used to transfer the substrate W from the carrier 130 to the processing module 200. [ As shown in Fig. This can prevent the particles generated from the substrate W before the process processing from adhering to the substrate W after the process processing in the process of loading and unloading the substrate W by the index robot 144. [

The transfer chamber 240 transfers the substrate W between the buffer unit 220 and the process chamber 260 and between the process chambers 260. The transfer chamber 240 is provided with a guide rail 242 and a main robot 244. The guide rails 242 are arranged so that their longitudinal directions are parallel to the first direction 12. The main robot 244 is installed on the guide rails 242 and is linearly moved along the first direction 12 on the guide rails 242. The main robot 244 has a base 244a, a body 244b, and a main arm 244c. The base 244a is installed so as to be movable along the guide rail 242. The body 244b is coupled to the base 244a. The body 244b is provided to be movable along the third direction 16 on the base 244a. The body 244b is also provided to be rotatable on the base 244a. The main arm 244c is coupled to the body 244b, which is provided to be movable forward and backward relative to the body 244b. A plurality of main arms 244c are provided and each is provided to be individually driven. The main arms 244c are stacked in a state of being spaced from each other along the third direction 16. A main arm 244c used when the substrate W is transferred from the buffer unit 220 to the process chamber 260 and a main arm 244b used when the substrate W is transferred from the process chamber 260 to the buffer unit 220 The main arms 244c may be different from each other.

In the process chamber 260, a substrate processing apparatus 300 for performing a cleaning process on the substrate W is provided. The substrate processing apparatus 300 provided in each process chamber 260 may have a different structure depending on the type of the cleaning process to be performed. Alternatively, the substrate processing apparatus 300 in each process chamber 260 may have the same structure. Optionally, the process chambers 260 are divided into a plurality of groups, and the substrate processing apparatuses 300 provided in the process chambers 260 belonging to the same group have the same structure and are provided in the process chambers 260 belonging to different groups The substrate processing apparatuses 300 may have different structures from each other. For example, if the process chambers 260 are divided into two groups, a first group of process chambers 260 is provided on one side of the transfer chamber 240 and a second group of process chambers 260 are provided on the other side of the transfer chamber 240 Process chambers 260 may be provided. Optionally, a first group of process chambers 260 may be provided on the lower layer and a second group of process chambers 260 may be provided on the upper and lower sides of the transfer chamber 240, respectively. The first group of process chambers 260 and the second group of process chambers 260 may be classified according to the type of the chemical used and the type of the cleaning method.

An example of the substrate processing apparatus 300 for processing the substrate W will be described below. 2 is a view showing an example of the substrate processing apparatus 300. As shown in FIG.

2, the substrate processing apparatus 300 has a cup 320, a support unit 340, an elevation unit 360, a jetting unit 380, a gas injection member 500, and a controller 1000 . The cup 320 provides a space in which the substrate processing process is performed, and the upper portion thereof is opened. The cup 320 has an inner recovery cylinder 322, an intermediate recovery cylinder 324, and an outer recovery cylinder 326. Each of the recovery cylinders 322, 324, and 326 recovers a different treatment fluid among the treatment fluids used in the process. The inner recovery bottle 322 is provided in an annular ring shape surrounding the support unit 340 and the intermediate recovery bottle 324 is provided in the shape of an annular ring surrounding the inner recovery bottle 322 and the outer recovery bottle 326 Is provided in the shape of an annular ring surrounding the intermediate recovery bottle 324. The inner space 322a of the inner recovery cylinder 322 and the space 324a between the inner recovery cylinder 322 and the intermediate recovery cylinder 324 and the space 324 between the intermediate recovery cylinder 324 and the outer recovery cylinder 326 326a function as an inlet through which the processing fluid flows into the inner recovery cylinder 322, the intermediate recovery cylinder 324, and the outer recovery cylinder 326, respectively. Recovery passages 322b, 324b, and 326b extending vertically downward from the bottom of the recovery passages 322, 324, and 326 are connected to the recovery passages 322, 324, and 326, respectively. Each of the recovery lines 322b, 324b, and 326b discharges the processing fluid introduced through each of the recovery cylinders 322, 324, and 326. [ The discharged process fluid can be reused through an external process fluid regeneration system (not shown).

The support unit 340 is disposed in the processing space of the cup 320. The support unit 340 supports the substrate and rotates the substrate during the process. The support unit 340 has a spin head 342, a support pin 344, a chuck pin 346, a drive shaft 348 and a drive unit 349. The spin head 342 has a top surface that is generally circular when viewed from the top. A drive shaft 348 rotatable by a driver 349 is fixedly coupled to the bottom surface of the spin head 342. The spin head 342 includes a support pin 344 and a chuck pin 346 to support the substrate. A plurality of support pins 344 are provided. The support pin 344 is spaced apart from the edge of the upper surface of the spin head 342 by a predetermined distance and protrudes upward from the spin head 342. The support pins 344 are arranged so as to have a generally annular ring shape in combination with each other. The support pin 344 supports the back edge of the substrate such that the substrate is spaced a distance from the top surface of the spin head 342. A plurality of the chuck pins 346 are provided. The chuck pin 346 is disposed farther away from the center of the spin head 342 than the support pin 344. The chuck pin 346 is provided to protrude upward from the spin head 342. The chuck pin 346 supports the side of the substrate such that the substrate is not laterally displaced in place when the support unit 340 is rotated. The chuck pin 346 is provided to be movable linearly between the standby position and the support position along the radial direction of the spin head 342. The standby position is a position far from the center of the spin head 342 as compared to the support position. When the substrate is loaded into or unloaded from the support unit 340, the chuck pin 346 is positioned in the standby position and the chuck pin 346 is positioned in the support position when the substrate is being processed. At the support position, the chuck pin 346 contacts the side of the substrate.

The lifting unit 360 moves the cup 320 in the vertical direction. As the cup 320 is moved up and down, the relative height of the cup 320 to the support unit 340 is changed. The lifting unit 360 has a bracket 362, a moving shaft 364, and a driver 366. The bracket 362 is fixed to the outer wall of the cup 320 and a moving shaft 364 which is moved up and down by a driver 366 is fixedly coupled to the bracket 362. The cup 320 is lowered so that the support unit 340 protrudes to the upper portion of the cup 320 when the substrate W is placed on the support unit 340 or is lifted from the support unit 340. In addition, the height of the cup 320 is adjusted so that the processing fluid may be introduced into the predetermined collection container 360 according to the type of the processing fluid supplied to the substrate W when the process is performed. For example, while the substrate is being processed with the first processing fluid, the substrate is located at a height corresponding to the inner space 322a of the inner recovery tube 322. During the processing of the substrate with the second processing fluid and the third processing fluid, the substrate is separated from the space 324a between the inner recovery cylinder 322 and the intermediate recovery cylinder 324, and between the intermediate recovery cylinder 324 and the outside And may be located at a height corresponding to the space 326a of the recovery cylinder 326. [ Unlike the above, the lifting unit 360 can move the supporting unit 340 in the vertical direction instead of the cup 320.

The jetting unit 380 supplies the treatment liquid to the substrate W or supplies the cleaning liquid to the upper surface of the spin head 342. [ The treatment liquid may be a chemical. The cleaning liquid may be ultra-pure water. For example, in the step of processing a substrate, a treatment liquid is supplied to an upper surface of the substrate. In the process of cleaning the cup 320, the cleaning liquid is supplied to the upper surface of the spin head 342 with the substrate removed. The injection unit 380 may be rotatable. The ejection unit 380 has a nozzle support 382, a nozzle 384, a support 386, and a driver 388. The support 386 is provided along its lengthwise direction in the third direction 16 and the drive 388 is coupled to the lower end of the support 386. The driving unit 388 rotates and lifts the support table 386. The nozzle support 382 is coupled perpendicular to the opposite end of the support 386 coupled with the drive 388. The nozzle 384 is installed at the bottom end of the nozzle support 382. The nozzle 384 is moved to the process position and the standby position by the driver 388. The process position is that the nozzle 384 is located at the vertical upper portion of the cup 320 and the standby position is the position at which the nozzle 384 is away from the vertical upper portion of the cup 320. One or a plurality of injection units 380 may be provided.

The gas injection member 500 injects gas. The gas may be a dry gas. The gas may be nitrogen gas. The gas dries the remaining cleaning liquid after spraying the cleaning liquid. The gas is sprayed on the upper surface of the spin head 342 to form a strong air flow around the spin head 342. The gas injection member 500 may include a fixed injection member 510 and a movable injection member 520. The fixed injection member 510 is fixed to the cup 320. The moving injection member 520 is provided so as to be rotatable. The moving injection member 520 can rotate about the uniaxial axis within a predetermined range so as to jet the drying gas onto the upper surface of the spin head 342.

The controller 1000 controls the spin head 342, the ejection unit 380, and the elevation unit 360.

The controller 1000 controls the rotational speed of the spin head 342. In the step of processing the substrate, the spin head 342 is rotated at the first rotation speed while supplying the treatment liquid to the upper surface of the substrate. In the step of cleaning the cup 320, the spin head 342 is rotated at the second rotation speed while supplying the cleaning liquid to the upper surface of the spin head 342. [ The second rotation speed is controlled to be faster than the first rotation speed. Further, in the step of spraying the gas onto the upper surface of the spin head 342 and drying the cup, the spin head 342 can be rotated at a third rotation speed faster than the first rotation speed and the second rotation speed.

The controller 1000 controls the direction of rotation of the spin head 342. When the cleaning liquid or gas is supplied to the upper surface of the spin head 342 to clean the cup 320, the spin head 342 may be rotated only in the first direction. The rotational direction of the spin head 342 does not change during the process. In one example, the first direction may be clockwise. While the cleaning liquid or gas is supplied to the upper surface of the spin head 342, the spin head 342 maintains the rotation in the clockwise direction. As another example, the first direction may be counterclockwise. While the cleaning liquid or gas is supplied to the upper surface of the spin head 342, the spin head 342 maintains the rotation in the counterclockwise direction.

The controller 1000 controls the lift unit 360. When the cleaning liquid or gas is supplied to the upper surface of the spin head 342 to clean the cup 320, the height of the cup 320 can be adjusted up and down. The height of the cup 320 with respect to the upper surface of the spin head 342 can be adjusted. The relative position of the height of the upper surface of the spin head 342 and the height of the upper end of the cup 320 can be adjusted. For example, the lifting unit 360 can be controlled so that the height of the upper end of the recovery cylinder to be cleaned among the plurality of recovery cylinders of the cup 320 is the same as the upper surface of the spin head 342. Or the elevation unit 360 can be controlled such that the height of the upper end of the recovery cylinder to be cleaned in the plurality of recovery cylinders is higher than the upper surface of the spin head 342. [

Below. A process of processing the substrate of the substrate processing apparatus 300 and a process of cleaning the cup 320 will be described.

4 is a view showing a substrate processing step (S100) for processing a substrate. Referring to Fig. 4, the process of processing the substrate will be briefly described. In the substrate processing step S100, the substrate is supported by the support pin 344 and the chuck pin 346, and is positioned on the top of the spin head 342. The substrate rotates while the spin head 342 rotates. For example, the substrate and spin head 342 may rotate at a first rotational speed. The treatment liquid is supplied to the upper surface of the substrate. The treatment liquid may be a chemical.

Figures 5 to 7 show cup cleaning steps for cleaning the cup. The cup cleaning step will be described with reference to Figs. In Fig. 5, the arrow of the drive shaft 348 is shown larger than the arrow in Fig. 4, which indicates that the rotation speed of the spin head in the cup cleaning step S200 is faster than the rotation speed of the spin head in the substrate processing step S100.

Referring to FIG. 5, after the substrate processing step S100, a cup cleaning step S200 for cleaning the cup 320 with the substrate removed is performed. In the cup cleaning step S200, the spin head 342 rotates. For example, the spin head 342 may rotate at a second rotational speed. And the second rotation speed is provided so as to be faster than the first rotation speed. The cleaning liquid is directly supplied from the jetting unit 380 to the upper surface of the spin head 342. [ The cleaning liquid may be ultra-pure water. The supplied cleaning liquid is scattered to the outside of the spin head 342 due to the rotation of the spin head 342. This causes the cup 320 provided outside the spin head 342 to be cleaned.

The cup cleaning step S200 may include a cup drying step S300. 6 and 7, a cup drying step (S300) for drying the cup 320 by supplying gas to the upper surface of the spin head 342 is performed. The cup drying step (S300) is performed after supplying the cleaning liquid to the upper surface of the spin head (342). In the cup drying step (S300), the cleaning liquid remaining on the inner wall of the cup 320 is dried. In the cup drying step (S300), the supply of the cleaning liquid is stopped, and the spin head 342 is rotated. When the spin head 342 rotates, a strong air current is generated around the spin head 342. This airflow reaches the cup 320 provided on the outside of the spin head 342. The airflow can dry the inner wall of the cup 320. The gas can be injected from the gas injection member 500 to the upper surface of the spin head 342 while rotating the spin head 342. For example, referring to FIG. 6, gas may be injected by the fixed injection member 510. Or with reference to Fig. 7, the gas can be injected by the moving injection member 520. Fig. Or the gas can be injected by the fixed injection member 510 and the movable injection member 520. [ According to one example, the gas may be injected at the center of the upper surface of the spin head 342. The injected gas generates strong airflow along with the rotation of the spin head 342.

In the cup cleaning step S200, the spin head 342 rotates only in the first direction. The first direction may be clockwise. Alternatively, the first direction may be counterclockwise. A large amount of cleaning liquid must be scattered or a strong airflow must reach the inner wall of the cup 320 for cleaning the cup 320. When the rotation direction of the spin head 342 is changed during the process in the cleaning step of the cup 320, the scattering effect of the cleaning liquid or the strength of the airflow is reduced. Accordingly, the controller 1000 controls the rotation direction of the spin head 342 so as to keep the direction of the spin head 342 constant in the cup 320 cleaning step.

8 to 10 are views showing a modified example of the cup cleaning step S200. 8 to 10, the shaded area schematically shows the area where the cup is cleaned according to the height of the cup. Hereinafter, a modified example of the cup cleaning step S200 will be described with reference to Figs. 8 to 10. Fig.

The height of the cup 320 can be adjusted by the lifting unit 360. The relative height of the upper end of the cup 320 with respect to the upper surface of the spin head 342 can be adjusted while moving the cup 320 up and down in the cup cleaning step S200. The area to be cleaned can be selected and cleaned in the cup 320. It is possible to adjust the height of the upper end of the collection container to be cleaned among the plurality of collection containers of the cup 320. For example, when the cleaning liquid or gas is supplied to the upper surface of the spin head 342, the height of the upper end of the recovery cylinder to be cleaned can be made equal to the height of the upper surface of the spin head 342. Accordingly, as shown in FIGS. 8 to 10, the area of the cup 320 can be selectively cleaned.

Further, the height of the upper end of the recovery cylinder to be cleaned can be set higher than the height of the upper surface of the spin head 342. Further, the height of the upper end of the recovery cylinder to be cleaned can be set lower than the height of the upper surface of the spin head 342. It is possible to select the area to be cleaned out of the area of the cup 320 so that the user can appropriately raise and lower the recovery tank. At this time, the inner wall or the outer wall of the other collection bins can be cleaned together.

Although the apparatus for cleaning the substrate is described as an example in the above example, the present invention is not limited to this, but may be applied to an apparatus provided with the same or similar constitution.

In the above-described example, the treatment liquid and the cleaning liquid are sprayed from one spray unit, but a plurality of spray units for spraying the treatment liquid and the cleaning liquid may be provided, respectively.

In the above-described example, the cup cleaning step is performed after the substrate processing step, but the order may be changed to one another, or either one of them may be omitted. Further, although it has been described that the cup drying step is performed after the cup washing step, the order may be changed from each other, or either one of them may be omitted.

In the above example, the gas is sprayed to the center of the upper surface of the spin head in the cup drying step, but it is not limited to the center of the spin head.

In the above-described example, the elevation unit is provided, but the elevation unit may be omitted.

In the above-described example, the cup is described as having a plurality of collection bins. However, the present invention can also be applied to a case where one or more collection bins are used instead of a plurality.

Although a single controller is described as being provided in the above example, a plurality of controllers can be provided. At this time, each of the controllers controls the spin head, the injection unit, the gas injection member and the lift unit, and the plurality of controllers can be provided to be connected to each other.

The foregoing detailed description is illustrative of the present invention. In addition, the foregoing is intended to illustrate and explain the preferred embodiments of the present invention, and the present invention may be used in various other combinations, modifications, and environments. That is, it is possible to make changes or modifications within the scope of the concept of the invention disclosed in this specification, within the scope of the disclosure, and / or within the skill and knowledge of the art. The above-described embodiments illustrate the best mode for carrying out the technical idea of the present invention, and various modifications required for specific application fields and uses of the present invention are also possible. Accordingly, the detailed description of the invention is not intended to limit the invention to the disclosed embodiments. It is also to be understood that the appended claims are intended to cover such other embodiments.

1: substrate processing equipment 10: index module
20: process processing module 120: load port
140: transfer frame 220: buffer unit
240: transfer chamber 260: process chamber
300: substrate processing apparatus 320: cup
340: support unit 342: spin head
380: injection unit 500: gas injection member
1000: controller

Claims (14)

A method of processing a substrate,
A substrate processing step of processing a substrate by supplying a processing solution to the substrate while rotating the substrate placed on the spin head disposed in the cup with the top opened;
And a cup cleaning step of cleaning the cup by supplying a cleaning liquid to an upper surface of the spin head while rotating the spin head in a state where the substrate is removed from the spin head,
Wherein the rotation speed of the spin head in the cup cleaning step is faster than the rotation speed of the spin head in the substrate processing step.
The method according to claim 1,
Wherein the cup cleaning step further comprises a cup drying step of supplying the cleaning liquid to the upper surface of the spin head and then supplying gas to the upper surface of the spin head to dry the cup.
3. The method of claim 2,
Wherein the gas is supplied to the center of the spin head. 4. The method according to any one of claims 1 to 3,
Wherein the spin head rotates only in a first direction in the cup cleaning step.
4. The method according to any one of claims 1 to 3,
Wherein the cup includes a plurality of collection bins stacked in a vertical direction,
Wherein in the cup cleaning step, the relative height of the upper end of the recovery cylinder to be cleaned in the plurality of recovery cylinders is adjusted with respect to the upper surface of the spin head while the plurality of recovery cylinders are moved up and down.
4. The method according to any one of claims 1 to 3,
Wherein the cup includes a plurality of collection bins stacked in a vertical direction,
Wherein the height of the upper surface of the spin head and the height of the upper end of the recovery cylinder to be cleaned in the plurality of recovery cylinders are set to be equal in the cup cleaning step.
4. The method according to any one of claims 1 to 3,
Wherein the cup includes a plurality of collection bins stacked in a vertical direction,
Wherein the height of the upper end of the recovery cylinder to be cleaned in the plurality of recovery cylinders is set to be higher than the height of the upper surface of the spin head in the cup cleaning step.
In the substrate processing apparatus,
A cup providing a processing space for processing the substrate;
A support unit supporting the substrate in the processing space and having a rotating spin head;
A spray unit that supplies a treatment liquid to an upper surface of the substrate and supplies a cleaning liquid to an upper surface of the spin head; And
And a controller for controlling rotation of the spin head,
The controller comprising:
Wherein the rotation speed of the spin head when supplying the cleaning liquid to the upper surface of the spin head is faster than the rotation speed of the spin head when supplying the processing liquid to the upper surface of the substrate.
9. The method of claim 8,
Further comprising a gas injection member for injecting a gas onto an upper surface of the spin head,
The controller comprising:
Wherein the rotation speed of the spin head at the time of spraying the gas onto the upper surface of the spin head is faster than the rotation speed of the spin head when supplying the processing solution to the upper surface of the substrate. 10. The method of claim 9,
Wherein the gas injection member supplies the gas to the center of the spin head.
11. The method according to any one of claims 9 to 10,
The controller comprising:
And controls the spin head such that the spin head rotates only in the first direction when supplying the cleaning liquid or the gas to the upper surface of the spin head.
11. The method according to any one of claims 9 to 10,
The cup,
A plurality of recovery cylinders stacked in the vertical direction; And
And an elevation unit that moves one or more of the plurality of recovery cylinders in the vertical direction.
13. The method of claim 12,
Wherein the controller controls the elevating unit,
And controls the elevating unit so that the height of the upper end of the recovery cylinder to be cleaned in the plurality of recovery cylinders becomes equal to the upper surface of the spin head when supplying the cleaning liquid or the gas to the upper surface of the spin head.
13. The method of claim 12,
Wherein the controller controls the elevating unit,
Wherein when the cleaning liquid or the gas is supplied to the upper surface of the spin head, the height of the upper end of the recovery cylinder to be cleaned in the plurality of recovery cylinders is higher than the height of the upper surface of the spin head.
KR1020150083373A 2015-06-12 2015-06-12 method and Apparatus for Processing Substrate KR101736853B1 (en)

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Publication number Priority date Publication date Assignee Title
JP2008153521A (en) 2006-12-19 2008-07-03 Dainippon Screen Mfg Co Ltd Recovery cup cleaning method, and substrate processing apparatus

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Publication number Priority date Publication date Assignee Title
JP2008153521A (en) 2006-12-19 2008-07-03 Dainippon Screen Mfg Co Ltd Recovery cup cleaning method, and substrate processing apparatus

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